CN112985618B

CN112985618B - Thermal imaging image attenuation device, control module and thermal imaging equipment

Info

Publication number: CN112985618B
Application number: CN201911293154.3A
Authority: CN
Inventors: 徐伟
Original assignee: Hangzhou Hikmicro Sensing Technology Co Ltd
Current assignee: Hangzhou Hikmicro Sensing Technology Co Ltd
Priority date: 2019-12-16
Filing date: 2019-12-16
Publication date: 2022-05-31
Anticipated expiration: 2039-12-16
Also published as: CN112985618A

Abstract

The application provides a thermal imaging image attenuation device, a control module and a thermal imaging device. The thermal imaging image attenuation device comprises a base, a driving part, a cantilever assembly and an attenuation sheet, wherein the driving part is arranged on the base, the cantilever assembly is movably connected to the base, the attenuation sheet is arranged on the cantilever assembly, the attenuation sheet is positioned outside the base, the driving part is in driving connection with the cantilever assembly, and the cantilever assembly moves relative to the base under the driving of the driving part so as to adjust the working position of the attenuation sheet. The attenuation sheet is arranged on the cantilever assembly and moves along with the cantilever assembly, the working position of the attenuation sheet can be changed by adjusting the relative position between the cantilever assembly and the base, and the position adjustment is convenient.

Description

Thermal imaging image attenuation device, control module and thermal imaging equipment

Technical Field

The application belongs to the technical field of infrared imaging and relates to a thermal imaging image attenuation device, a control module and thermal imaging equipment.

Background

The thermal imager receives infrared radiation energy of a detected target by using an infrared detector and an optical imaging objective lens, and reflects an energy distribution pattern to a photosensitive element of the infrared detector so as to obtain an infrared thermal image, wherein the thermal image corresponds to a thermal distribution field on the surface of an object.

When the measured object collected by the thermal imager is a high-temperature object with the temperature exceeding 550 ℃, the thermal imager cannot directly receive the infrared radiation energy of the measured object. In the related art, the thermal imager needs to be equipped with a corresponding attenuation device to increase the temperature measurement range of the thermal imager. However, the existing attenuation device is large in size and high in cost, and the working position of an attenuation sheet of the attenuation device is fixed, so that the accuracy of a thermal image of a measured high-temperature target is low.

Disclosure of Invention

In view of the above, the present application provides a thermal imaging image attenuation apparatus, a control module and a thermal imaging device.

Specifically, the method is realized through the following technical scheme:

the application provides a first aspect, discloses a thermal imaging image attenuating device includes the base, install in the driver part of base, swing joint in the cantilever assembly of base and install in the decay piece of cantilever assembly, the decay piece is located outside the base, the driver part with cantilever assembly drive connection, the cantilever assembly is in driver part's drive down for the base removes, in order to adjust the operating position of decay piece.

In one embodiment, the cantilever assembly swings relative to the base.

In one embodiment, the cantilever assembly comprises a mandrel assembled on the base and a swing arm frame assembled on the mandrel, the swing arm frame rotates relative to the base under the driving part, the swing arm frame is provided with a yielding hole, and the attenuation sheet is installed on the swing arm frame and covers the yielding hole.

In one embodiment, the drive member is in magnetic inductive drive connection with the cantilever assembly.

In an embodiment, the driving component includes a coil component assembled on the base, the cantilever component is provided with a magnetic component, the magnetic component is located in a magnetic field range of the coil component, and the coil component is magnetically and inductively connected with the magnetic component to drive the cantilever component to rotate.

In one embodiment, the coil assembly is wound on the base, and the magnetic member is located in a space surrounded by the coil assembly.

In one embodiment, the drive component further comprises at least one magnetically permeable member mounted to the coil assembly.

In one embodiment, the driving member further includes a protector covering at least a part of a surface of the coil block.

In one embodiment, the base includes a frame portion and a support portion fixed to the frame portion, the suspension arm assembly and the driving member are mounted to the support portion, and the suspension arm assembly is driven by the driving member to swing with respect to the support portion.

In one embodiment, the base further includes at least two conductive members fixedly attached to the frame portion, and the driving member is electrically connected to the at least two conductive members.

In one embodiment, the base further includes a cover plate detachably mounted on the support portion, the support portion and the cover plate surround to form a tubular space, and one end of a part of the cantilever assembly is movably connected to the support portion and located in the tubular space.

In one embodiment, the frame part is provided with a limiting part, the other end of the cantilever assembly penetrates out of the frame part along the limiting part, and the limiting part limits the moving range of the cantilever assembly.

In an embodiment, the base further includes at least one positioning column protruding from a surface of the frame portion.

In a second aspect, a control module is disclosed, which comprises a PCB board and the thermal imaging image attenuation device as described above, wherein the base is fixedly connected with the PCB board.

In a third aspect provided by the present application, a thermal imaging apparatus is disclosed, comprising an apparatus main body and a thermal imaging image attenuation device as above, wherein the base is fixedly connected to the apparatus main body.

The technical scheme provided by the embodiment of the application can have the following beneficial effects:

the attenuation piece is installed in the cantilever subassembly and swings along with the cantilever subassembly, and the working position of the attenuation piece can be changed by adjusting the relative position between the cantilever subassembly and the base, so that the position adjustment is convenient.

Drawings

Fig. 1 is a schematic top view perspective view of a thermal imaging image attenuation apparatus according to an exemplary embodiment of the present application.

Fig. 2 is a schematic bottom view diagram of a thermal imaging image attenuation apparatus according to an exemplary embodiment of the present application.

Fig. 3 is an exploded view of a thermal imaging image attenuation apparatus according to an exemplary embodiment of the present application.

Fig. 4 is an enlarged schematic view of a cross section a-a in fig. 1.

In the figure, a base 10; a frame portion 11; a bracket portion 12; a conductive member 13; a stopper portion 14; a positioning post 15; a cover plate 16; a boom assembly 20; a swing arm frame 21; a relief hole 211; a cantilever portion 212; a mounting portion 213; a pivoting portion 214; a mandrel 22; a magnetic member 23; an attenuation sheet 30; a drive member 40; a coil block 41; a magnetically permeable member 42; and a protective member 43.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

It is to be understood that although the terms first, second, third, etc. may be used herein to describe various information, such information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. The word "if" as used herein may be interpreted as "at … …" or "when … …" or "in response to a determination", depending on the context.

As shown in fig. 1 and 2, a thermal image attenuation apparatus is disclosed, which comprises a base 10, a driving part 40 mounted on the base 10, a cantilever assembly 20 movably connected to the base 10, and an attenuation plate 30 mounted on the cantilever assembly 20, wherein the attenuation plate 30 is located outside the base 10. The driving part 40 is in driving connection with the cantilever assembly 20, and the cantilever assembly 20 moves relative to the base under the driving of the driving part 40 to adjust the working position of the damping sheet 30.

The boom assembly 20 is movably mounted to the base 10 to allow the boom assembly 20 to move relative to the base 10, and the damping plate 30 is mounted to the boom assembly 20 and moves synchronously with the boom assembly 20. For example, the boom assembly 20 is linearly telescopically moved relative to the base 10 to adjust the lateral working position of the attenuation sheet 30; alternatively, the cantilever assembly 20 is oscillated about an axis relative to the base 10 to adjust the circumferential operating position of the damping plate 30; alternatively, the cantilever assembly 20 is moved parallel relative to the base 10 to adjust the longitudinal operating position of the attenuation sheet 30.

The damping plate 30 is mounted on the cantilever assembly 20 and moves with the cantilever assembly 20, and the working position of the damping plate 30 can be changed by adjusting the relative position between the cantilever assembly 20 and the base 10. The driving part 40 can drive the cantilever assembly 20 to move, so that the thermal imaging image attenuation device can adjust the working position of the attenuation sheet 30 according to a built-in program or a user instruction, and the adjustment controllability is good. For example, the user can control the cantilever assembly 20 to rotate clockwise 5 degrees from the current angle through the operation interface. Optionally, the thermal imaging image attenuation device is applied to a thermal imaging apparatus, so that the target object directly opposite to the thermal imaging apparatus is different, the working position of the attenuation sheet 30 is correspondingly adjusted, and then the center of the attenuation sheet 30 is adjusted to directly face the middle area of the target object. In an alternative embodiment, the cantilever assembly 20 can be swung relative to the base 10 under the driving of the driving member 40 to move the damping sheet 30 in a plane and adjust the working position. The cantilever assembly 20 swings relative to the base 10, so that the damping sheet 30 swings within a certain range, and the central position of the damping sheet 30 is conveniently adjusted with the functional part of the applied device.

The cantilever assembly 20 is assembled to the base 10 and has a cantilever-like structure, one end of which is installed in the base 10, and the other end of which penetrates out of the base 10. The suspension arm assembly 20 can swing relative to the base 10 under the driving of the driving member 40 to adjust the working position of the damping sheet 30. In one embodiment, the cantilever assembly 20 includes a spindle 22 mounted on the base 10 and a swing arm frame 21 mounted on the spindle 22, and the swing arm frame 21 rotates relative to the base 10 under the driving force of the driving part 40 to make the damping sheet 30 in the corresponding working position. The swing arm frame 21 is provided with a yielding hole 211, and the attenuation sheet 30 is mounted on the swing arm frame 21 and covers the yielding hole 211.

The cantilever assembly 20 can be swung about the centerline of the mandrel 22 to adjust the operating position of the attenuator 30. In an alternative embodiment, the spindle 22 is fixed to the base 10, and the swing arm frame 21 is rotatably connected to the spindle 22, so that the swing arm frame 21 rotates relative to the base 10. In another alternative embodiment, the spindle 22 is fixed to the swing arm frame 21, the spindle 22 is pivotally connected to the base 10, and the swing arm frame 21 rotates relative to the base 10. The free end of the swing arm frame 21 penetrates out of the base 10 and is used for installing the attenuation sheet 30.

The abdicating hole 211 penetrates through the free end of the swing arm frame 21 to form a through hole structure, and the attenuation sheet 30 is fixed on the swing arm frame 21 and shields the abdicating hole 211. The center of the abdicating hole 211 and the rotation axis of the mandrel 22 are the swing radius of the attenuation sheet 30, and the swing position of the attenuation sheet 30 is controllable. Optionally, the cantilever assembly 20 and the base 10 are connected in a limited manner by friction, for example, the cantilever assembly 20 includes an elastic member sleeved on the core shaft 22, and the elastic member pushes the swing arm frame 21 to elastically abut against the base 10 to form a damping structure, so as to lock the swing position of the cantilever assembly 20.

Optionally, the boom assembly 20 is in driving connection with the driving member 40, and the swing position of the swing arm frame 21 is defined by the driving member 40. For example, the driving member 40 may be provided as a motor assembly, a solenoid valve assembly, and other power members to define the swing position of the swing arm frame 21.

With continued reference to fig. 2 and 3, in an embodiment, the swing arm frame 21 includes a pivot portion 214, a cantilever portion 212 protruding from the pivot portion 214, and a mounting portion 213 disposed on the cantilever portion 212, wherein the pivot portion 214 is mounted on the core shaft 22, and the relief hole 211 penetrates through the mounting portion 213. The pivot 214 is located in the base 10 and is assembled with the spindle 22, so that the pivot 214 is located in cooperation with the base 10 to limit the displacement of the swing arm frame 21 in the axial direction of the spindle 22. The size of the cross section of the cantilever part 212 is smaller than that of the pivot part 214, the size of the cross section of the cantilever part 212 is smaller than that of the mounting part 213, and the cantilever part 212 penetrates through the base 10 to increase the swing range of the swing arm frame 21. The mounting portion 213 serves to fix and mount the damping plate 30 to define the position of the damping plate 30. Alternatively, the relief hole 211 is a stepped hole, and the damping sheet 30 is attached to the stepped portion of the relief hole 211, so that the assembly accuracy is high.

The driving member 40 is used to drive the cantilever assembly 20 to move so as to adjust the working position of the damping plate 30. In one embodiment, the driving member 40 drives the cantilever assembly 20 to swing within a predetermined range to adjust the working position of the damping plate 30. Alternatively, the base 10 includes a frame portion 11 and a bracket portion 12 fixed to the frame portion 11, the suspension assembly 20 and the driving member 40 are mounted on the bracket portion 12, and the suspension assembly 20 is driven by the driving member 40 to swing with respect to the bracket portion 12.

The frame part 11 is positioned outside the bracket part 12, the driving member 40 and the boom assembly 20 are mounted on the bracket part 12 and positioned inside the frame part 11, and the driving connection part of the driving member 40 and the boom assembly 20 is positioned inside the frame part 11, so that the stability of driving connection can be improved. Alternatively, the frame portion 11 is a frame-shaped structure, and the bracket portions 12 are protruded from the side walls of the frame portion 11 and located in the surrounding space of the frame portion 11. Specifically, the spindle 22 is pivotally connected to the frame portion 12, and the driving member 40 is mounted on the frame portion 12 and drives the swing arm frame 21 to rotate.

As shown in fig. 3 and 4, the drive connection of the drive member 40 to the boom assembly 20 may be provided as a direct drive connection and an indirect drive connection. For example, the driving component 40 is a motor component, a solenoid valve component, or other power components directly connected to the swing arm frame 21, and the motion trajectory controllability is good. In one embodiment, the driving member 40 is magnetically inductively and drivingly coupled to the suspension assembly 20 to achieve an indirect driving connection, which provides a high space utilization and reduces the overall size of the thermal imaging image attenuation apparatus.

In an alternative embodiment, the driving part 40 includes a coil assembly 41 mounted to the base 10, the suspension assembly 20 is provided with the magnetic member 23 and the magnetic member 23 is located within the magnetic field of the coil assembly 41. The coil assembly 41 is magnetically connected to the magnetic member 23 for rotating the cantilever assembly 20.

The coil assembly 41 forms an electromagnetic field when energized, which is fitted to the leg portion 12 of the base 10, the leg portion 12 being located within a corresponding range of the electromagnetic field. The suspension arm assembly 20 is rotatably connected to the bracket portion 12, and the magnetic member 23 is fixed to the suspension arm assembly 20 and located within the electromagnetic field of the coil assembly 41. The magnetic member 23 is magnetically induced with the electromagnetic field of the coil assembly 41, so that the magnetic member 23 is driven to rotate by the electromagnetic field of the coil assembly 41, and the suspension arm assembly 20 is swung. The magnetic part 23 is made of magnetic materials such as a permanent magnet and a magnet, the magnetic part 23 is fixed on the swing arm frame 21, so that magnetic acting force applied to the magnetic part 23 is transmitted to the swing arm frame 21, and the swing arm frame 21 rotates relative to the base 10, and driving is convenient. The magnetic part 23 is connected with the coil assembly 41 in a matched magnetic induction mode, so that the installation space of the base 10 can be reduced, the size of the base 10 is reduced, and the whole size is small. Alternatively, the length of the coil assembly 41 is defined by a resistance value, for example, the resistance value range of the coil assembly 41 is set to 20 Ω ± 5 Ω.

In one embodiment, the base 10 further includes a cover plate 16 detachably mounted to the frame portion 12, the frame portion 12 and the cover plate 16 enclose a tubular space, and one end of the cantilever assembly 20 is movably connected to the frame portion 12 and located in the tubular space.

The bracket portion 12 is provided with a groove-shaped space, and the mandrel 22 is inserted into the bracket portion 12, so that the cantilever assembly 20 is installed on the bracket portion 12 and the connection portion is located in the groove-shaped space. The cover plate 16 covers the notch of the bracket portion 12, a tubular space is formed between the bracket portion 12 and the cover plate 16, the other end of the core shaft 22 is connected to the cover plate 16 in an inserting manner, and the magnetic member 23 is sleeved on the core shaft 22 and limited between the cover plate 16 and the bracket portion 12. Optionally, the frame part 11 is provided with a limiting part 14, the other end of the cantilever assembly 20 penetrates out of the frame part 11 along the limiting part 14, and the limiting part 14 limits the moving range of the cantilever assembly 20. The position-limiting part 14 is communicated with the tubular space, and the cantilever assembly 20 penetrates out of the frame part 11 from the tubular space and the position-limiting part 14. Alternatively, the magnetic member 23 is configured as a circular tube, and the core shaft 22 is inserted into the magnetic member 23. Alternatively, the limiting portion 14 is a notch or hole structure provided in the frame portion 11, and a wall surface of the limiting portion 14 defines a movable range of the cantilever assembly 20.

The connecting part of the cantilever assembly 20 and the bracket part 12 is positioned in the tubular space, and the moving range of the connecting part is controllable. In an alternative embodiment, the coil assembly 41 is wound around the base 10, and the magnetic member 23 is located in the space surrounded by the coil assembly 41. The coil assembly 41 is wound around the outer peripheral walls of the holder portion 12 and the cover 16, and the holder portion 12 and the cover 16 support the coil assembly 41 to define the position of the coil assembly 41. The magnetic member 23 is located in the tubular space, i.e., the magnetic member 23 is located in the surrounding space of the coil block 41. Alternatively, the direction of the line connecting the positive electrode and the negative electrode of the magnetic member 23 is perpendicular to the center line of the winding center of the coil block 41.

Alternatively, a fitting space is formed between the inner wall surface of the frame portion 11 and the outer surface of the holder portion 12, the coil assembly 41 is wound around the outer surface of the holder portion 12 and is located in the fitting space, and the frame portion 11 protects the surface of the coil assembly 41. In an alternative embodiment, the frame portion 11 includes a supporting wall, two bent walls oppositely disposed on the supporting wall, and the bracket portion 12 is protruded from the supporting plate and located between the two bent walls. The limit portion 14 is a notch formed in the support wall, the cantilever assembly 20 passes through the limit portion 14, and the range of motion of the cantilever assembly 20 is limited by two side walls of the limit portion 14, so that the controllability of the limit position is good.

As shown in fig. 2 and 3, in one embodiment, the driving part 40 further includes at least one magnetic conductive member 42 mounted to the coil assembly 41, and the magnetic conductive member 42 is used for increasing the strength of the electromagnetic field formed by the coil assembly 41. For example, the magnetic conductive member 42 is provided as a metal block fixed to the coil block 41. Alternatively, two magnetic conduction members 42 may be provided, and two magnetic conduction members 42 are closed at the end of the bracket portion 12.

The coil unit 41 is wound around the outside of the holder portion 12, and the frame portion 11 can shield and protect part of the coil unit 41. In one embodiment, the driving member 40 further includes a protection member 43 covering at least a portion of the surface of the coil assembly 41 for protecting the surface of the coil assembly 41 from foreign materials falling into the coil assembly 41. For example, the protection member 43 is a film attached to the surface of the coil block 41, and the protection member 43 is attached to the surface of the exposed portion of the coil block 41. For example, the frame portion 11 shields the opposite surfaces of the coil by two bent walls, and the protector 43 shields the other two opposite surfaces of the coil assembly 41.

The entire volume of the thermal imaging image attenuation apparatus is miniaturized to reduce the required installation space and improve the convenience of assembly. In one embodiment, the base 10 further includes at least two conductive members 13 secured to the frame portion 11, and the driving member 40 is electrically connected to the at least two conductive members 13. At least two conductive members 13 are fixed to the frame portion 11 and electrically connected to the driving member 40, so that the driving member 40 can be electrically connected to the power circuit through the conductive members 13 to obtain corresponding electric energy. For example. The coil assembly 41, when energized, creates an electromagnetic field that in turn controls the movement of the cantilever assembly 20. The terminals of the coil block 41 are connected to the two conductive members 13, respectively, to guide the flow of current, and the conductive connection is convenient. The conductive member 13 fixes the frame portion 11 to make the thermal imaging image attenuation apparatus in a modular structure, and the overall mounting size is reduced.

In one embodiment, the base 10 further includes at least one positioning post 15 protruding from the surface of the frame portion 11 to improve the positioning accuracy of the thermal imaging image attenuation apparatus. Optionally, the positioning column 15 is inserted and connected with the installation base part of the thermal imaging image attenuation device to position the installation position of the thermal imaging image attenuation device, and the assembly efficiency is high. For example, two positioning posts 15 and two conductive members 13 are disposed on the frame portion 11, the two positioning posts 15 and the two conductive members 13 are disposed at four corners of a quadrilateral, and the two conductive members 13 are disposed at diagonal positions. The thermal imaging image attenuation device is connected in a positioning mode through two positioning columns 15 and then connected in a conducting mode through conducting pieces 13, and the assembling angle is high.

The thermal imaging image attenuation device disclosed in the above embodiment is applied to the control module, so that the control module can detect and measure the temperature parameter of the target object. In one embodiment, the control module comprises a PCB board and the thermal imaging image attenuation apparatus as disclosed in the above embodiments, and the base 10 is fixedly connected to the PCB board. The positioning column 15 is inserted into the PCB for positioning, and the two conductive pieces 13 are electrically connected to the PCB, so as to improve the convenience and accuracy of the installation of the thermal imaging image attenuation device.

The thermal imaging image attenuation device disclosed by the embodiment is applied to the thermal imaging equipment, so that the measured target collected by the thermal imager is a high-temperature target with the temperature exceeding 550 ℃, and the overall size of the thermal imaging equipment is small. In one embodiment, the thermal imaging apparatus includes an apparatus body to which the base 10 is attached and a thermal imaging image attenuation device as disclosed in the above embodiments. The thermal imaging device utilizes the infrared radiation energy of the measured target of the thermal imaging image attenuation device to obtain an infrared thermography, and the thermography of the measured high-temperature target is high in precision.

The present invention is not intended to be limited to the particular embodiments shown and described, but is to be accorded the widest scope consistent with the principles and novel features herein disclosed.

Claims

1. A thermal imaging image attenuation device is characterized by comprising a base, a driving part arranged on the base, a cantilever assembly movably connected to the base and an attenuation sheet arranged on the cantilever assembly, wherein the attenuation sheet is positioned outside the base, the driving part is in driving connection with the cantilever assembly, and the cantilever assembly moves relative to the base under the driving of the driving part so as to adjust the working position of the attenuation sheet; the driving part comprises a coil assembly assembled on the base and at least one magnetic conduction piece assembled on the coil assembly.

2. The thermal imaging image attenuation apparatus of claim 1, wherein the cantilever assembly swings relative to the base.

3. The thermal imaging image attenuation apparatus of claim 2, wherein the cantilever assembly comprises a mandrel assembled to the base and a swing arm frame assembled to the mandrel, the swing arm frame rotates relative to the base under the driving component, the swing arm frame is provided with a yielding hole, and the attenuation sheet is installed on the swing arm frame and covers the yielding hole.

4. The thermal imaging image attenuation apparatus of claim 1, wherein the drive member is in magnetic induction drive connection with the cantilever assembly.

5. The thermal image attenuation apparatus of claim 4, wherein the cantilever assembly is provided with a magnetic member and the magnetic member is located within a magnetic field of the coil assembly, and the coil assembly is magnetically and inductively coupled to the magnetic member to rotate the cantilever assembly.

6. The thermal image attenuation apparatus of claim 5, wherein the coil assembly is wound around the base, and the magnetic member is located in a space surrounded by the coil assembly.

7. The thermal imaging image attenuation apparatus of claim 5, wherein the drive member further comprises a protective member covering at least a portion of a surface of the coil assembly.

8. The thermal image attenuation apparatus of claim 1, wherein the base comprises a frame portion and a support portion secured to the frame portion, the cantilever assembly and the drive member being mounted to the support portion, the cantilever assembly being driven by the drive member to oscillate relative to the support portion.

9. The thermal image attenuation device of claim 8, wherein the base further comprises at least two electrically conductive members secured to the frame portion, the drive member being electrically connected to the at least two electrically conductive members.

10. The thermal image attenuation apparatus of claim 8, wherein the base further comprises a cover plate detachably mounted to the frame portion, the frame portion and the cover plate enclose a tubular space, and one end of the cantilever assembly is movably connected to the frame portion and located in the tubular space.

11. The thermal imaging image attenuation device of claim 8, wherein the frame portion is provided with a stop portion along which the other end of the cantilever assembly passes out of the frame portion, the stop portion defining a range of motion of the cantilever assembly.

12. The thermal image attenuation apparatus of claim 8, wherein the base further comprises at least one positioning post protruding from a surface of the frame portion.

13. A control module comprising a PCB board and the thermographic image attenuation apparatus of any of claims 1-12, the base being fixedly connected to the PCB board.

14. A thermal imaging apparatus comprising an apparatus body and a thermal image attenuation device according to any one of claims 1 to 12, said base being attached to said apparatus body.