CN112984896A

CN112984896A - Refrigerator with a door

Info

Publication number: CN112984896A
Application number: CN202011440872.1A
Authority: CN
Inventors: 金山在勇
Original assignee: Sharp Corp
Current assignee: Sharp Corp
Priority date: 2019-12-16
Filing date: 2020-12-08
Publication date: 2021-06-18
Also published as: JP2021096020A; JP7441639B2

Abstract

The refrigerator has a heat-insulated cabinet. An equipment room is arranged below the heat insulation box body. A compressor and a substrate unit are disposed in the equipment room. A control board is disposed in the board unit. The control substrate is longitudinally arranged beside the compressor.

Description

Refrigerator with a door

Technical Field

One aspect of the present invention relates to a refrigerator having an equipment room.

Background

The refrigerator is provided with a heat insulation box to cover the outer circumference of the storage space in order to insulate heat from the surroundings. An equipment chamber is provided below the rear surface side of the heat insulating box, and a compressor and the like constituting a refrigeration cycle are disposed in the equipment chamber.

In addition, the refrigerator includes a control board for controlling electrical components such as a compressor. For example, japanese patent laid-open No. 2001-91138 discloses a refrigerator provided with an apparatus chamber formed at the rear of a refrigerator main body and a control board provided in the vicinity of the apparatus chamber.

An electronic control component for controlling the electric components of the refrigerator is arranged on the control substrate. The control board is behind the lower part of the refrigerator main body and is embedded in a hole formed in the heat insulating wall above the equipment room.

Disclosure of Invention

However, in the structure disclosed in japanese patent application laid-open No. 2001-91138, a hole is formed by digging out a part of the heat insulating wall, and the control board is disposed inside the hole, so that the heat insulating wall in the region where the control board is disposed becomes thin, and there is a possibility that the heat insulating performance is lowered.

Accordingly, in one aspect of the present invention, it is an object to provide a refrigerator in which a control board can be disposed in the vicinity of a compressor without digging a heat-insulating box.

A refrigerator according to an aspect of the present invention includes a heat insulating box, an equipment room provided below the heat insulating box, a compressor disposed in the equipment room, and a control board disposed vertically beside the compressor.

According to the refrigerator of one aspect of the present invention, the control board can be disposed in the vicinity of the compressor without digging the heat insulating box.

Drawings

Fig. 1 is a plan view showing a structure of a back surface portion of a refrigerator according to an embodiment of the present invention.

Fig. 2 is a schematic sectional view showing an internal structure of the refrigerator shown in fig. 1.

Fig. 3 is a plan view showing a state in which the base plate unit in the equipment room is removed from the refrigerator shown in fig. 1.

Fig. 4 is a schematic diagram showing the arrangement of units in the equipment room of the refrigerator shown in fig. 1.

Fig. 5 is a plan view showing a state in which the exterior member of the substrate unit is mounted in the equipment room in the state shown in fig. 3.

Fig. 6 is a plan view showing a state in which a resin case is mounted in the equipment room in the state shown in fig. 5.

Fig. 7 is a perspective view showing an external appearance of a substrate unit provided in the refrigerator shown in fig. 1.

Fig. 8 is a perspective view showing an external appearance of a base plate unit provided in the refrigerator shown in fig. 1.

Fig. 9 is an exploded perspective view showing the substrate unit shown in fig. 7 in an exploded state.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. In the following description, the same components are given the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

< first embodiment >

(integral constitution of refrigerator)

First, the overall structure of the refrigerator 1 according to the first embodiment will be described. Fig. 1 shows a structure of a rear surface side of the refrigerator 1. In addition, fig. 2 shows an internal structure of the refrigerator 1. In fig. 2, components in the equipment room 30 other than the compressor 31 are not shown.

As shown in fig. 2, refrigerator 1 includes first refrigerating room 11 in an upper stage, freezing room 12 in a middle stage, second refrigerating room 13 in a lower stage, and the like. A refrigerating chamber door 11a is provided on the first refrigerating chamber 11. A freezing chamber door 12a is provided on the freezing chamber 12. A refrigerating chamber door 13a is provided on the second refrigerating chamber 13.

As described above, the refrigerator 1 according to the present embodiment is divided into the upper layer portion, the middle layer portion, and the lower layer portion, and each storage space is provided. A partition 59 is provided between the storage spaces. However, the arrangement position of each storage space is not limited thereto.

In the present embodiment, the surface on which the door is provided is referred to as the front surface or front surface of the refrigerator. The respective surfaces of the refrigerator 1 are an upper surface, a side surface, a rear surface, and a bottom surface based on the front surface and positions where the refrigerator 1 is installed in a normal state.

The interior of the refrigerator 1 is provided with a freezing cycle 40. The refrigeration cycle 40 is configured by connecting a compressor 31, a condenser (not shown), an expander (not shown), and a cooler (evaporator) 32 via a refrigerant pipe (refrigerant flow passage) through which a refrigerant flows.

As shown in fig. 2, the compressor 31 is disposed in the equipment room 30 provided on the rear surface side of the bottom of the refrigerator 1. The cooler 32 is disposed in a cooling chamber 35 provided on the rear surface side of the refrigerator 1. The cooling chamber 35 is provided with a cooling fan 33 and the like in addition to the cooler 32. The cooling fan 33 is provided to circulate air between the cooling chamber 35 and each storage space.

In addition, a control unit is provided inside the refrigerator 1. The control unit is disposed on a control board 21 described later, for example. The control unit controls the operation of the refrigeration cycle 40. That is, the control unit starts the operation of the refrigeration cycle by driving the compressor 31, and causes the refrigerant to flow through the cycle.

Specifically, the high-temperature and high-pressure refrigerant compressed by the compressor 31 is condensed while radiating heat in the condenser. The high-pressure refrigerant is expanded in the expander to have a low temperature and a low pressure, and is sent to the cooler 32 serving as an evaporator. The refrigerant flowing into the cooler 32 exchanges heat with the cold air flowing through the cooling chamber 35, evaporates while absorbing heat, and is a low-temperature gas refrigerant, which is sent to the compressor 31. In this way, the refrigeration cycle is operated by the refrigerant cycle, and cold air is generated by the air flow that has exchanged heat with the cooler 32.

(construction of Heat insulation Box)

In the refrigerator 1, a heat insulating box 50 is provided as a heat insulating structure for insulating each storage space from the surroundings. The heat-insulated box 50 is provided to cover the outer circumference of the refrigerator 1. As shown in fig. 2, the heat insulating box 50 mainly includes an outer box 61, an inner box 62, a vacuum heat insulating material 51, and a foam heat insulating material 56.

The outer box 61 forms the outer peripheral surface of the heat insulating box 50. The outer box 61 is mainly composed of an upper surface portion 50a, a side surface portion 50b, a back surface portion 50c, and a bottom surface portion 50 d. The inner case 62 forms the inner peripheral surface of the heat insulating case 50. In addition, the inner case 62 forms a boundary of the storage space (e.g., the first refrigerating compartment 11, the freezing compartment 12, the second refrigerating compartment 13) and the cooling compartment 35.

A space for disposing the equipment room 30 is formed on the rear surface side of the bottom of the heat insulating box 50. That is, the equipment room 30 is disposed outside the heat insulating box 50. This is because the temperature in the equipment room 30 rises as the compressor 31 operates.

The vacuum heat insulator 51 and the foam heat insulator 56 are provided in the space between the outer box 61 and the inner box 62. The vacuum heat insulating material 51 is a sheet-like or plate-like heat insulating material. The vacuum heat insulating material 51 is disposed on, for example, a side surface, an upper surface, a bottom surface, a back surface, and the like of the refrigerator 1. For example, the foamed heat insulating material 56 may be formed of foamed polyurethane (also referred to as rigid polyurethane foam) or the like.

(construction of the interior of the Equipment Room)

Next, a more detailed structure of the equipment room 30 provided below the rear surface side of the heat insulating box 50 will be described with reference to fig. 1 and the like. Fig. 1 shows a rear surface portion of the heat insulating box 50 with a rear surface cover covering a rear surface of the equipment room 30 removed. Fig. 3 shows a state in which the substrate unit 20 disposed in the equipment room 30 is removed from the refrigerator 1 shown in fig. 1. Fig. 4 schematically shows the positional relationship of the respective constituent components (i.e., the compressor 31, the substrate unit 20, and the evaporation pan 70) arranged in the equipment room 30.

The rear surface portion 50c of the heat insulating box 50 is mainly constituted by the back plate of the outer box 61. The device chamber 30 is located below the back surface portion 50 c. The equipment room 30 is mainly defined by a bottom plate 63 forming a bottom surface portion 50d of the heat insulating box 50. As shown in fig. 2 and the like, a rear portion of the bottom plate 63 protrudes upward. The rearmost side of the bottom plate 63 has a substantially flat shape in the horizontal direction, and this portion forms a ceiling portion 63a of the equipment room 30.

The floor 63 has a ceiling portion 63a and a raised portion 63c as regions for defining the facility room 30 (see fig. 2). The ceiling portion 63a forms an upper surface (ceiling) of the equipment room 30. The rising portion 63c forms the front face of the apparatus chamber 30. The side surface of the equipment room 30 is formed by the side surface portion 50b of the outer box 61.

The compressor 31, the substrate unit 20, the evaporation pan 70, and the like are mainly disposed in the equipment room 30. The compressor 31 is disposed slightly to the right (left when viewed from the front) in the equipment room 30 as viewed from the rear. The substrate unit 20 is disposed beside the compressor 31. In the example shown in fig. 1, the substrate unit 20 is disposed on the left side of the compressor 31 (the right side of the compressor 31 when viewed from the front). However, in another example, the substrate unit 20 may be disposed on the right side of the compressor 31 (the left side of the compressor 31 when viewed from the front).

In the substrate unit 20, a control substrate 21 is disposed. As shown in fig. 4, the control board 21 is arranged in a vertical direction (a direction orthogonal to a horizontal plane). More specifically, the control board 21 is disposed substantially parallel to a side surface portion 50b of the heat insulating box 50 forming a side wall of the equipment chamber 30.

In the equipment room 30, a harness 38 (see fig. 3) including various wirings is disposed on the front side of the space 20A in which the substrate unit 20 is disposed. The wire harness 38 is connected to various electric components in the heat insulating box 50, various electric components in the equipment room 30 such as the compressor 31, the control board 21, the power supply unit (not shown), and the like.

The evaporating dish 70 is located above the compressor 31. The evaporating dish 70 discharges the condensed water generated in the cooling chamber 35. The condensed water generated in the cooling chamber 35 includes, for example, defrosting water generated when the cooler 32 is defrosted. As shown in fig. 4, a recess 71 curved upward is formed in the bottom surface portion 70d of the evaporation pan 70. The recess 71 is shaped to follow the shape of the upper portion (head) of the compressor 31.

The evaporation pan 70 has a substantially rectangular box shape. The outer shape of evaporation pan 70 is mainly constituted by a front surface portion (not shown), a side surface portion 70b, a back surface portion 70c, and a bottom surface portion 70 d. The name of each face is defined according to the position of the evaporation pan 70 after being attached to the refrigerator 1. By having these respective face portions, condensed water discharged from a drain pipe (not shown) disposed above can be stored.

The evaporating dish 70 is provided with a heat-discharging groove 72 for discharging heat generated by the compressor 31 on the outer surface side. The groove 72 is formed from the bottom surface portion 70d to the back surface portion 70 c.

Rear surface portion 70c of evaporation pan 70 is provided with support portion 73 extending upward. The number of support portions 73 is not particularly limited, but in the present embodiment, two support portions 73 are provided. As shown in fig. 3, the upper end of support portion 73 is supported and fixed to rear surface 50c of heat-insulating box 50.

(constitution of substrate Unit)

Next, the detailed structure of the substrate unit 20 will be described. Fig. 5 and 6 show an enlarged state of the inside of the device chamber 30. Fig. 5 shows a state in which the exterior members (i.e., the housing 22 and the holding member 23) constituting the substrate unit 20 are mounted.

Fig. 7 and 8 show the appearance of the substrate unit 20. In fig. 7, an appearance when the substrate unit 20 is viewed from the cover 25 side is shown. Fig. 8 shows an external appearance of the substrate unit 20 when viewed from the housing 22 side. Fig. 9 shows an exploded state of each member constituting the substrate unit 20.

The main structure of the board unit 20 includes a control board 21, a case (heat transfer plate) 22, a holding member 23, a resin case 24, and a cover 25.

The control board 21 includes various electronic components such as an electronic circuit and a coil. The control board 21 has a substantially flat plate shape. As described later, the control board 21 is disposed in the box-shaped resin case 24. The control substrate 21 is arranged in a longitudinal direction (i.e., a direction orthogonal to a horizontal plane). More specifically, as shown in fig. 4, the control board 21 having a substantially flat plate shape is disposed substantially parallel to the side surface portion 50b of the heat-insulating box 50 forming the side wall of the equipment room 30.

The housing 22 is formed by molding a plate (e.g., a metal plate) made of a material having high thermal conductivity into a predetermined shape. The housing 22 accommodates a resin case 24 on which the control board 21 is mounted. The enclosure 22 is mainly constituted by a first side wall 22a, a second side wall 22b, a third side wall 22c, an upper surface portion 22d, a lower surface portion 22e, and the like.

The first side wall 22a is provided at a position adjacent to the compressor 31 and the evaporation pan 70 in a state where the substrate unit 20 is mounted in the equipment room 30. That is, the first side wall 22a is disposed between the compressor 31 and the control board 21 (see fig. 4).

The second side wall 22b is provided at a position opposite to the first side wall 22a, and has a face portion substantially parallel to the first side wall 22 a. In addition, the second side wall 22b has a curved shape, thereby forming a space 22S. The space 22S is located on the front side of the equipment chamber 30 when the substrate unit 20 is mounted in the equipment chamber 30. Therefore, the space 22S can be used as a space for arranging the wire harness 38 (refer to fig. 3).

As shown in fig. 8, a hole 22g for passing a wiring connected to the control board 21 is formed in the second side wall 22 b. The plurality of wires in the wire harness 38 are branched in the space 22S, and a part thereof is arranged from the hole 22g into the substrate unit 20.

The third side wall 22c is located on the front surface side of the apparatus chamber 30 in a state where the substrate unit 20 is mounted in the apparatus chamber 30. The upper surface portion 22d is located on the upper surface side of the equipment chamber 30 in a state where the substrate unit 20 is mounted in the equipment chamber 30. The lower surface portion 22e is located on the bottom surface side of the equipment chamber 30 in a state where the substrate unit 20 is mounted in the equipment chamber 30.

The third side wall 22c, the upper surface portion 22d, and the lower surface portion 22e connect the first side wall 22a and the second side wall 22 b. Since the thermal conductivity of these portions is high, the thermal conduction between the first side wall 22a and the second side wall 22b is promoted. Therefore, for example, the heat of the compressor 31 transferred to the first sidewall 22a close to the compressor 31 can be efficiently transferred to the second sidewall 22b via any one of the third sidewall 22c, the upper surface portion 22d, and the lower surface portion 22 e.

In a state where the substrate unit 20 is mounted in the equipment room 30, no side wall is provided on the back surface side of the enclosure 22, and the enclosure is opened. That is, the housing 22 has an opening 22F, and the opening 22F opens on the back side of the device chamber 30.

The resin case 24 has a substantially rectangular parallelepiped box shape opened in a side surface. The resin case 24 has an opening 24F. The opening 24F faces the opposite side to the side facing the compressor 31 in the state where the resin case 24 is mounted in the equipment room 30 (see fig. 6). In the present embodiment, the resin case 24 is formed of a material having lower thermal conductivity (i.e., higher thermal insulation) than metal. The resin case 24 is made of a material having high electrical insulation properties. Examples of the material of the resin case 24 include polypropylene, polyethylene, and silicon.

Since the resin case 24 is formed of a material having relatively low thermal conductivity, the resin case 24 functions as a heat insulating member. Accordingly, the resin case 24 having high heat insulation performance is disposed between the control board 21 and the casing 22 (specifically, the first side wall 22a) on the side of the control board 21 facing the compressor 31, and the heat generated by the compressor 31 can be made difficult to be transmitted to the control board 21.

Further, since the resin case 24 is formed of a material having high electrical insulation, an insulation distance can be secured by the resin case 24. In the present embodiment, the housing 22 accommodating the resin case 24 therein is formed of a metal plate, but the insulating distance between the control board 21 and the housing 22 can be secured by accommodating the control board 21 in the resin case 24.

The holding member 23 is attached so as to cover the opening 22F of the housing 22. Thereby, the housing 22 is held by the holding member 23. The holding member 23 is positioned on the back surface side of the housing 22 in a state where the substrate unit 20 is mounted in the device chamber 30. The holding member 23 is positioned on the back side of the space 22S in a state where the substrate unit 20 is mounted in the device chamber 30.

The holding member 23 is formed of, for example, a resin material. The holding member 23 is provided with a substantially rectangular opening 23F. Thereby, a part of the opening 22F of the housing 22 is opened on the rear surface side through the opening 23F (see fig. 5).

The cover 25 is attached so as to cover the back surface side of the holding member 23. The material of the cover 25 is not particularly limited, and may be formed of a material having relatively high thermal conductivity (for example, a metal material). In one example, the cover 25 may be formed by molding the same metal plate as that forming the enclosure 22. The cover 25 is located on the back side of the device chamber 30 in a state where the substrate unit 20 is mounted in the device chamber 30.

As described above, the outer shape of the substrate unit 20 is formed by the housing 22, the holding member 23, and the cover 25. The control board 21 and the resin case 24 are disposed in a closed space formed by these members.

When the board unit 20 is mounted in the equipment room 30, first, an assembly of the housing 22 and the holding member 23 is provided in the space 20A (see fig. 3) in the equipment room 30. Fig. 5 shows the structure in the apparatus chamber 30 at this time. The resin case 24 with the control board 21 mounted thereon is inserted into the housing 22 through the

openings

23F and 22F.

Fig. 6 shows the substrate unit 20 in a state where the resin case 24 is mounted. Since the resin case 24 has the opening 24F on the side opposite to the compressor 31, the heat generated by the control board 21 can be released in the direction of the arrow in the figure. The heat generated by the control board 21 is transferred to the second side wall 22b of the housing 22 or the metal cover 25 covering the rear surface, and is discharged to the outside of the board unit 20.

The substrate unit 20 has a shape in which the letter "L" is inverted right and left in a plan view, and a space 22S is provided in front of the holding member 23 on a side adjacent to a side wall in the equipment chamber 30. That is, the space 22S is provided between the second side wall 22b and the side wall of the apparatus chamber 30. This space 22S can be used as a space for arranging the wiring harness 38. Further, by providing the space 22S, the area of the third side wall 22c of the enclosure 22 located on the front surface side of the equipment room 30 can be reduced. This makes it possible to reduce the area of the enclosure 22 facing the raised portion 63c of the bottom plate 63 forming the front surface of the equipment room 30, and to suppress heat transfer from the enclosure 22 to the inside of the heat insulating box 50.

On the other hand, since the area of the cover 25 positioned on the back side of the device chamber 30 can be increased, heat can be sufficiently dissipated from the housing 22 to the back side of the device chamber 30 through the cover 25.

In the board unit 20 of the present embodiment, as described above, the resin case 24 to which the control board 21 is attached to the housing 22 so as to be insertable and detachable. Therefore, in the manufacturing process of the refrigerator 1, the resin case 24 to which the control board 21 is attached can be attached to the casing 22 in the final process of the assembly of the refrigerator 1 without attaching the resin case 24 to which the control board 21 is attached to the casing 22 in the assembly stage or the formation stage of the heat insulating box. Thus, in the manufacturing process in which heat or vibration is likely to occur, since the resin case 24 on which the control board 21 is mounted is removed, it is possible to prevent a precision component such as a microprocessor mounted on the control board 21 from malfunctioning during the manufacturing process. Further, when the control board 21 needs to be inspected or replaced during use of the refrigerator 1, the control board 21 can be easily removed together with the resin case 24 by removing the cover 25, and therefore maintenance can be easily performed without damaging the control board 21.

(summary of the first embodiment)

As described above, the refrigerator 1 according to the present embodiment includes the heat insulating box 50. An equipment room 30 is provided below the heat insulation box 50. A compressor 31 and a substrate unit 20 are disposed in the equipment room 30. A control board 21 is disposed in the board unit 20. The control board 21 is disposed beside the compressor 31 in the vertical direction (direction orthogonal to the horizontal plane).

According to this configuration, by disposing the control board 21 beside the compressor 31 in the equipment room 30, the control board 21 can be disposed in the vicinity of the compressor 31 without digging the heat-insulating box 50. This can prevent a part of the heat insulating box from being thinned, and can suppress a reduction in heat insulating performance. Further, by arranging the control board 21 vertically, the control board 21 can be arranged in an empty area near the compressor 31 in the equipment room 30.

In the present embodiment, the configuration around the control board 21 (i.e., the configuration of the board unit 20) is devised, and thus, in the configuration in which the control board 21 is disposed in the equipment room 30, the influence of the heat generated by the compressor 31 on the control board 21 is reduced.

Specifically, the periphery of the control board 21 is covered with a metal housing 22. The casing 22 includes a first side wall 22a, a second side wall 22b, a third side wall 22c, an upper surface portion 22d, a lower surface portion 22e, and the like, and transfers heat transferred from the compressor 31 to the first side wall 22a to the second side wall 22b located on the opposite side of the first side wall 22a with the control board 21 interposed therebetween. That is, the casing 22 having the first side wall 22a and the second side wall 22b, the third side wall 22c connecting these, the upper surface portion 22d, and the lower surface portion 22e functions as a heat conduction plate that extends to the opposite side of the compressor 31 with the control board 21 interposed therebetween.

The control board 21 is disposed in the resin case 24. A part of the resin case 24 is disposed between the control board 21 and the first side wall 22a of the housing 22, and functions as a heat insulating member.

With this configuration, the heat of the compressor 31 transferred to the casing 22 can be released toward the side wall of the equipment room 30 while suppressing the heat generated by the compressor 31 from being transferred to the control board 21.

Further, if a circuit or a coil for converting ac to dc, a switching element for converting dc to ac, or the like is mounted on the control board 21, the control board 21 is also likely to generate heat. Therefore, the resin case 24 has an opening 24F opened on the side wall side in the device chamber 30. Thereby, for example, as shown by an arrow in fig. 6, the heat generated by the control board 21 can be released toward the side wall of the device chamber 30.

< second embodiment >

Next, a second embodiment of the present invention will be explained. In the second embodiment, the configuration of the substrate unit is different from that of the first embodiment. The other configurations may be the same as those of the first embodiment. Therefore, the second embodiment will be described mainly focusing on differences from the first embodiment.

In the first embodiment, the casing 22 functions as a heat conduction plate that sandwiches the control board 21 and extends from a side adjacent to the compressor 31 to an opposite side thereof. However, in another embodiment, the heat conduction plate may not have the shape of a box.

In the refrigerator 1 according to the present embodiment, the control board 21 is sandwiched by a plurality of metal plates, and a heat conduction plate is formed to extend from a side adjacent to the compressor 31 to an opposite side. These metal plates are supported by the holding member 23.

Further, the control board 21 is disposed in the resin case 24, as in the first embodiment. Thus, the resin case 24 functions as a heat insulating member provided between the control board 21 and the metal plate.

According to this configuration, while heat generated by the compressor 31 is prevented from being directly transmitted to the control board 21, heat generated by the compressor 31 can be transmitted to the side wall direction of the equipment room 30 via the plurality of metal plates. This enables the heat generated by the compressor 31 to be efficiently released toward the side wall.

< third embodiment >

Next, a third embodiment of the present invention will be explained. In the third embodiment, the structure of the substrate unit is different from the first and second embodiments. The other configurations may be the same as those of the first embodiment or the second embodiment. Therefore, the third embodiment will be described mainly focusing on differences from the first embodiment.

In the first embodiment, the resin case 24 functions as a heat insulating member disposed between the heat conduction plate (specifically, the first side wall 22a) adjacent to the compressor 31 and the control board 21. However, the heat insulating member is not limited to a box-like member such as the resin case 24.

In the refrigerator 1 according to the present embodiment, a plate-shaped heat insulating member is disposed between the heat conduction plate (specifically, the first side wall 22a) adjacent to the compressor 31 and the control board 21. As the material of the plate-like heat insulating member, conventionally known heat insulating materials such as a foamed plastic heat insulating material made of a foamable resin material and a fiber heat insulating material such as glass wool can be used. Further, the heat insulating member may be formed of a material such as polypropylene, polyethylene, or silicon, as in the case of the resin case 24.

According to this structure, it is possible to avoid direct transmission of heat generated by the compressor 31 to the control substrate 21. Therefore, in the configuration in which the control board 21 is disposed in the equipment room 30, the influence of the heat generated by the compressor 31 on the control board 21 can be reduced.

(conclusion)

A refrigerator (for example, refrigerator 1) according to an aspect of the present invention includes a heat insulating box (for example, heat insulating box 50), an equipment chamber (for example, equipment chamber 30) provided below the heat insulating box, a compressor (for example, compressor 31) disposed in the equipment chamber, and a control board (for example, control board 21) disposed vertically beside the compressor.

In the refrigerator (for example, refrigerator 1) according to the one aspect of the present invention, a heat conduction plate (for example, casing 22) may be disposed between the control board (for example, control board 21) and the compressor (for example, compressor 31) so as to extend to the opposite side of the compressor with the control board interposed therebetween.

In the refrigerator (for example, the refrigerator 1) according to the one aspect of the present invention, a heat insulating member (for example, the resin case 24) may be disposed between the control board (for example, the control board 21) and the heat conductive plate (for example, the first side wall 22a of the casing 22) on a side facing the compressor (for example, the compressor 31).

In the refrigerator (for example, the refrigerator 1) according to the one aspect of the present invention, the heat insulating member may be a case (for example, the resin case 24) that houses the control board (for example, the control board 21).

In the refrigerator (for example, refrigerator 1) according to the aspect of the present invention described above, the side of the casing (for example, resin casing 24) opposite to the side facing the compressor (for example, compressor 31) may also be open. For example, the resin case 24 described in the first embodiment has the opening 24F.

In the refrigerator (for example, refrigerator 1) according to one aspect of the present invention, a space (for example, space 22S) may be provided between the heat conduction plate (for example, second side wall 22b of casing 22) and the side wall (for example, side wall 50b) of the heat insulation box (for example, heat insulation box 50) in the equipment room (for example, equipment room 30).

In the refrigerator (for example, refrigerator 1) according to the one aspect of the present invention, a holding member (for example, holding member 23) for holding the heat conductive plate (for example, casing 22) may be provided on the back side of the space (for example, space 22S) in the equipment room (for example, equipment room 30).

The embodiments disclosed herein are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is indicated by the description of the claims, rather than the description above, and all changes that come within the meaning and range of equivalency of the claims are intended to be embraced therein. In addition, a structure obtained by combining the constitutions of the different embodiments described herein with each other is also included in the scope of the present invention.

Claims

1. A refrigerator is characterized by comprising:

a heat insulation box body;

an equipment chamber arranged below the heat insulation box body;

a compressor disposed within the equipment compartment; and

and a control substrate vertically arranged beside the compressor.

2. The refrigerator according to claim 1,

a heat conduction plate is disposed between the control substrate and the compressor,

the heat transfer plate sandwiches the control substrate and extends to an opposite side of the compressor.

3. The refrigerator according to claim 2, wherein a heat insulating member is disposed between the control substrate and the heat conduction plate on a side of the control substrate facing the compressor.

4. The refrigerator according to claim 3, wherein the heat insulating member is a case accommodating the control substrate.

5. The refrigerator of claim 4, wherein a side of the case opposite to a side facing the compressor is opened.

6. The refrigerator according to any one of claims 2 to 5, wherein a space is provided between the heat conduction plate and a side wall of the heat insulation box in the equipment room.

7. The refrigerator according to claim 6, wherein a holding member that holds the heat conduction plate is provided on a back surface side of the space in the equipment room.