CN112980023B - Preparation process of low-solvent photocuring prepreg for copper-clad plate - Google Patents

Preparation process of low-solvent photocuring prepreg for copper-clad plate Download PDF

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CN112980023B
CN112980023B CN202110191405.8A CN202110191405A CN112980023B CN 112980023 B CN112980023 B CN 112980023B CN 202110191405 A CN202110191405 A CN 202110191405A CN 112980023 B CN112980023 B CN 112980023B
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polymerization
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central control
reaction kettle
delta
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CN112980023A (en
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张志勤
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Kingboard Laminates Shenzhen Ltd
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Kingboard Laminates Shenzhen Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2425/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
    • C08J2425/02Homopolymers or copolymers of hydrocarbons
    • C08J2425/04Homopolymers or copolymers of styrene
    • C08J2425/14Homopolymers or copolymers of styrene with unsaturated esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2467/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2467/06Unsaturated polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/2224Magnesium hydroxide
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/16Solid spheres
    • C08K7/18Solid spheres inorganic

Abstract

The invention relates to a preparation process of a low-solvent photocuring prepreg for a copper-clad plate, which is characterized by comprising the following steps of: preparing a styrene-acrylate copolymer; preparing a gum dipping solution; outputting the impregnation liquid to an impregnation tank and impregnating the glass fiber cloth into the impregnation liquid in the impregnation tank; conveying the glass fiber cloth to a curing unit to perform primary curing on the glass fiber cloth to prepare a prepreg; and conveying the prepregs to a supplementary curing box to eliminate the internal stress of the prepregs. According to the invention, the concentration variation of the styrene-acrylate copolymer is detected in real time by using the intermediate control unit, the reaction rate of the polymerization raw materials is rapidly obtained, whether implosion occurs in the polymerization raw materials is accurately judged, the reaction rate of the polymerization raw materials can be gradually reduced to a preset interval by adjusting the addition amount of the polymerization inhibitor or the heating temperature of the polymerization reaction kettle in real time, and the efficiency of preparing the semi-cured plate by the process can be effectively improved while the reaction safety of the polymerization raw materials is ensured.

Description

Preparation process of low-solvent photocuring prepreg for copper-clad plate
Technical Field
The invention relates to the technical field of prepreg preparation, in particular to a preparation process of a low-solvent photocuring prepreg for a copper-clad plate.
Background
The copper-clad plate is mainly used for manufacturing printed circuit boards and is widely applied to the fields of mobile phones, computers, televisions and the like. The preparation of the resin glue solution needs to use a large amount of solvents with low flash point, high volatility, toxicity and carcinogenicity, such as acetone, butanone, cyclohexanone, dimethylformamide, ethylene glycol monomethyl ether and the like, and the solvent accounts for 30-50 percent. The use of a large amount of solvent is not friendly to the aspects of environment, personnel, safety and the like, and the problems of high cost, low efficiency and the like exist in the treatment process.
In the prior art, a process for preparing a resin glue solution by using a small amount of solvent exists, however, sudden polymerization can be generated in the process of preparing the resin glue solution by using the method, so that potential safety hazards exist in a system, the existing method for preventing sudden polymerization in the reaction process comprises adding a polymerization inhibitor and reducing the reaction temperature, however, the prior art cannot effectively adjust the addition amount of the polymerization inhibitor and the reaction temperature in the system according to actual conditions, so that the potential safety hazards exist in the process of preparing the resin glue solution, and the preparation efficiency of prepregs is reduced.
Disclosure of Invention
Therefore, the invention provides a preparation process of a low-solvent photocuring prepreg for a copper-clad plate, which is used for solving the problem of low preparation efficiency of the prepreg caused by incapability of pertinently adjusting the addition amount and temperature of a polymerization inhibitor in the preparation process of resin glue solution in the prior art.
In order to achieve the purpose, the invention provides a preparation process of a low-solvent photocuring prepreg for a copper-clad plate, which comprises the following steps:
step a, adding a solvent into a polymerization reaction kettle, selecting a specified weight part of copolymerization raw material, dissolving the copolymerization raw material into the solvent, adding a corresponding amount of an initiator into the solvent mixed with the copolymerization raw material, and heating the solution mixed with the initiator and the copolymerization raw material to a preset temperature by the polymerization reaction kettle after the addition is finished so as to prepare a styrene-acrylate copolymer;
b, outputting the prepared styrene-acrylate copolymer to a stirring kettle by using a polymerization reaction kettle, sequentially adding a gum dipping raw material, an inorganic filler and a photoinitiator into the stirring kettle, uniformly stirring the raw material by using the stirring kettle to prepare a gum dipping solution, continuously stirring the gum dipping solution when the preparation is finished so as to cure the gum dipping solution, and adjusting the viscosity of the gum dipping solution to a specified value by continuously stirring;
step c, outputting the cured impregnation liquid in the stirring kettle to an impregnation tank and impregnating the glass fiber cloth into the impregnation liquid in the impregnation tank;
d, when the glass fiber cloth is completely soaked, conveying the glass fiber cloth to a curing unit, scraping redundant soaking solution on the glass fiber cloth by using a pair roller, and irradiating the glass fiber cloth by using an LED lamp to preliminarily cure the glass fiber cloth to prepare a prepreg;
step e, conveying the prepreg to a supplementary curing box to eliminate the internal stress of the prepreg;
in the step a, the central control unit detects the concentration of the styrene-acrylate copolymer in the polymerization reaction kettle through a concentration detector in the polymerization reaction kettle, calculates the polymerization rate V of the copolymerization raw material in the polymerization reaction kettle according to the concentration variation of the styrene-acrylate copolymer in the polymerization reaction kettle in unit time, controls a polymerization inhibitor storage tank to add a corresponding amount of polymerization inhibitor into the polymerization reaction kettle to reduce the polymerization rate of the raw material in the polymerization reaction kettle if the polymerization rate V is higher than a preset critical polymerization rate V0 according to the difference value delta V between the polymerization rate V of the copolymerization raw material in the polymerization reaction kettle and the preset critical polymerization rate V0, controls the concentration detector to detect the polymerization rate V ' of the copolymerization raw material again when a single polymerization inhibitor adding operation is completed, and controls the polymerization inhibitor storage tank to add a corresponding amount of polymerization inhibitor into the polymerization reaction kettle again according to the difference value delta V ' between V ' and V0 until the polymerization inhibitor is added into the polymerization reaction kettle again until the polymerization reaction kettle is added until the polymerization rate V ' is up to V ' > V0 The polymerization rate of the polymerization raw materials added with the polymerization inhibitor is lower than the preset critical polymerization rate V0;
the central control unit is internally provided with a preset maximum polymerization inhibitor adding frequency N0 and a preset maximum polymerization inhibitor adding amount M0, when the central control unit controls the polymerization inhibitor storage tank to add polymerization inhibitor into the polymerization reaction kettle, the central control unit records the polymerization inhibitor adding frequency N of the polymerization inhibitor storage tank and the total amount M of the added polymerization inhibitor in real time, and when N is more than N0 or M is more than M0 and the polymerization rate V ' of a polymer in the polymerization reaction kettle after the polymerization inhibitor is added is more than V0, the central control unit reduces the reaction temperature of the polymerization reaction kettle to a specified value according to the difference delta V ' between V ' and V0.
Further, a first preset polymerization rate difference delta V1, a second preset polymerization rate difference delta V2, a first preset polymerization inhibitor adding amount M1 and a second polymerization inhibitor adding amount M2 are arranged in the central control unit, wherein 0 & ltdelta V1 & ltdelta V2, and M1 & ltM 2;
when the central processor determines that the polymerization rate V of the polymerization raw materials in the polymerization reaction kettle is more than V0, the central control processor calculates the polymerization rate difference delta V, sets the delta V as V-V0, after the calculation is finished, comparing the delta V with a first preset polymerization rate difference delta V1 and a second preset polymerization rate difference delta V2 in sequence by a central control unit, if the delta V is less than or equal to the delta V1, setting the amount of a polymerization inhibitor added into the polymerization reaction kettle from a polymerization inhibitor storage tank to be M1 by the central control unit, if the delta V1 is less than the delta V and less than or equal to the delta V2, setting the amount of the polymerization inhibitor added into the polymerization reaction kettle from the polymerization inhibitor storage tank to be M2 by the central control unit, and if the delta V is greater than the delta V2, judging that the polymerization rate of the polymerization raw materials in the polymerization reaction kettle cannot be adjusted by the polymerization inhibitor and reducing the heating temperature in the polymerization reaction kettle to a corresponding value so as to reduce the polymerization rate of the polymerization raw materials; when the polymerization inhibitor storage tank adds a corresponding amount of polymerization inhibitor into the polymerization reaction kettle, the central control unit detects the polymerization rate V' of the polymerization raw materials in the polymerization reaction kettle again when the preset time ta is reached after the polymerization inhibitor is added.
Further, the central control unit is further provided with a preset heating temperature T0 and a preset heating temperature minimum value Tmin, when the central control unit controls the polymerization reaction kettle to heat the polymerization raw material inside the polymerization reaction kettle, the central control unit sets the heating temperature of the polymerization reaction kettle to be T0, when the polymerization rate difference Δ V is higher than the second preset polymerization rate difference Δ V2, the central control unit adjusts the heating temperature of the polymerization reaction kettle to Tmin, after the adjustment is completed, the central control unit detects the reaction rate V of the polymerization raw material in real time, and when V is smaller than V0, the central control unit gradually increases the temperature of the polymerization reaction kettle until V is V0 or the heating temperature T of the polymerization reaction kettle is T0.
Further, a first preset heating temperature adjusting amount delta T1, a second preset heating temperature adjusting amount delta T2 and a third preset heating temperature adjusting amount delta T3 are further arranged in the central control unit, wherein delta T1 is smaller than delta T2 and smaller than delta T3; when the number N of times of adding the polymerization inhibitor in the polymerization inhibitor storage tank is more than N0 or the total amount M of the polymerization inhibitor added in the polymerization inhibitor storage tank is more than M0 and the polymerization rate V 'of the polymer in the polymerization reaction kettle after adding the polymerization inhibitor is more than V0, the central control unit calculates the polymerization rate V' of the polymerization raw materials in the polymerization reaction kettle after adding the polymerization inhibitor and the difference value delta V between the preset critical polymerization rate V0, sets the delta V '-V0, after the calculation is finished, the central control unit compares the delta V' with the first preset polymerization rate difference value delta V1 and the second preset polymerization rate difference value delta V2 in sequence, if the delta V 'is less than or equal to V1, the central control unit reduces the temperature of the polymerization reaction kettle and sets the reduction amount of the temperature to delta T1, if the delta V1 is less than the delta V' -2, the central control unit reduces the temperature of the polymerization reaction kettle and sets the reduction amount of the temperature to delta T2, if Δ V ">. DELTA.V 2, the central control unit lowers the temperature of the polymerization reactor and sets the amount of temperature lowering to Δ T3; when the central control module finishes adjusting the heating temperature of the polymerization reaction kettle, the central control unit detects and detects the polymerization rate of the polymerization raw materials in the polymerization reaction kettle again in a preset time tb after the temperature is adjusted, if the polymerization rate of the polymerization raw materials is still higher than the preset critical polymerization rate V0, the central control unit recalculates the difference value between the adjusted polymerization rate and the preset critical polymerization rate V0, compares the difference value with delta V1 and delta V2 in sequence, and readjusts the heating temperature of the polymerization reaction kettle according to the comparison result until the polymerization rate after the temperature is adjusted is lower than the preset critical polymerization rate V0.
Further, when the central control unit adjusts the heating temperature of the polymerization reaction kettle according to the relation between the Δ V ″ and the first preset polymerization rate difference Δ V1 and the second preset polymerization rate difference Δ V2, if the adjusted heating temperature T' of the polymerization reaction kettle is less than Tmin, the central control unit sets the adjusted temperature to Tmin and does not lower the reaction temperature of the polymerization reaction kettle.
Further, a preset maximum ultraviolet absorption peak Z0, a first preset irradiation wavelength C1 and a second preset irradiation wavelength C2 are arranged in the central control unit, wherein C1 is less than C2; when the LED lamp is used for irradiating the prepreg, the central control unit determines the irradiation wavelength of the LED lamp according to the maximum ultraviolet absorption peak Z of the dipping solution in the prepreg, if Z is less than or equal to Z0, the central control unit sets the irradiation wavelength of the LED lamp to be C1, and if Z is more than Z0, the central control unit sets the irradiation wavelength of the LED lamp to be C2.
Further, a first preset viscosity Q1, a second preset viscosity Q2 and a preset irradiation distance D0 are further arranged in the central control unit, wherein Q1 is less than Q2; when the LED lamp is used for irradiating the prepreg, the central control unit adjusts the vertical distance between the LED lamp and the prepreg to D0 and adjusts the vertical distance between the LED lamp and the prepreg according to the viscosity of a dipping solution in the prepreg, if Q1 is not less than Q2, the central control unit does not adjust the vertical distance between the LED lamp and the prepreg, if Q is less than Q1, the central control unit adjusts the vertical position of the LED lamp to reduce the vertical distance between the LED lamp and the prepreg, and if Q is more than Q2, the central control unit adjusts the vertical position of the LED lamp to increase the vertical distance between the LED lamp and the prepreg.
Further, the central control unit calculates the irradiation energy of the LED lamp to the semi-cured sheet according to the irradiation wavelength of the LED lamp and the vertical distance between the LED lamp and the semi-cured sheet, and calculates the irradiation time of the LED lamp to the semi-cured sheet according to the irradiation energy.
Further, the copolymerization raw materials comprise styrene, acrylate, benzene and methanol, the initiator is azobisisobutyronitrile, the solvent is a monomer reactive diluent and comprises one or more of acetone, butanone, benzene, methanol and low-functionality acrylate; the acrylate comprises one or more of hydroxyethyl methacrylate, isocyanate acrylate and methacrylate.
Further, the gum dipping raw materials comprise bisphenol A phenolic resin, unsaturated polyester and imidazole; the photoinitiator is one or more of TPO, 184, 1173, 1577, 907, MBF and 754; the inorganic filler is one or more of spherical silica micropowder, talcum powder, aluminum hydroxide and magnesium hydroxide.
Compared with the prior art, the method has the beneficial effects that the concentration variation of the styrene-acrylate copolymer in the polymerization reaction kettle in unit time is detected in real time by using the intermediate control unit, so that the reaction rate of the polymerization raw materials in the polymerization reaction kettle is rapidly calculated out, whether the polymerization raw materials are subjected to sudden polymerization or not is accurately judged, the addition amount of the polymerization inhibitor or the heating temperature of the polymerization reaction kettle is adjusted in real time according to the actual reaction rate of the polymerization raw materials, the reaction rate of the polymerization raw materials can be gradually reduced to a preset interval by adding the polymerization inhibitor gradually, and the efficiency of preparing the semi-cured plate by the process can be effectively improved while the reaction safety of the polymerization raw materials is ensured.
Furthermore, the central control unit is provided with a preset maximum polymerization inhibitor adding frequency N0 and a preset maximum polymerization inhibitor adding amount M0, when the central control unit controls the polymerization inhibitor storage tank to add the polymerization inhibitor into the polymerization reaction kettle, the central control unit records the times N of adding the polymerization inhibitor into the polymerization inhibitor storage tank and the total amount M of the added polymerization inhibitor in real time, when the polymerization rate V' of the polymer in the polymerization reaction kettle is more than V0 after N is more than N0 or M is more than M0 and the polymerization inhibitor is added, the central control unit reduces the reaction temperature of the polymerization reaction kettle to a specified value according to the difference delta V between V' and V0, the temperature of the polymerization reaction kettle is directly regulated when the total adding amount or adding times of the polymerization inhibitor reaches a preset value, so that the occurrence of the condition of sudden polymerization can be prevented to the maximum extent, therefore, the reaction safety of the polymerization raw materials is further improved, and the efficiency of preparing the semi-solidified plate by the process is further improved.
Furthermore, a first preset polymerization rate difference delta V1, a second preset polymerization rate difference delta V2, a first preset polymerization inhibitor adding amount M1 and a second polymerization inhibitor adding amount M2 are arranged in the central control unit, when the central processor determines that the polymerization rate V of the polymerization raw materials in the polymerization reaction kettle is more than V0, the central control processor calculates a polymerization rate difference value delta V, compares the delta V with a first preset polymerization rate difference value delta V1 and a second preset polymerization rate difference value delta V2 in sequence, adds a corresponding amount of polymerization inhibitor according to the comparison result, adds the corresponding amount of polymerization inhibitor according to the actual reaction rate of the polymerization raw materials, can effectively reduce the reaction rate of the polymerization raw materials to a preset interval while avoiding resource waste, therefore, the reaction safety of the polymerization raw materials is further improved, and the efficiency of preparing the semi-solidified plate by the process is further improved.
Further, the central control unit is further provided with a preset heating temperature T0 and a preset heating temperature minimum value Tmin, when the central control unit controls the polymerization reaction kettle to heat the polymerization raw material inside the polymerization reaction kettle, the central control unit sets the heating temperature of the polymerization reaction kettle to be T0, when the polymerization rate difference Δ V is higher than the second preset polymerization rate difference Δ V2, the central control unit adjusts the heating temperature of the polymerization reaction kettle to Tmin and gradually increases the temperature of the polymerization reaction kettle until V is V0 or the heating temperature of the polymerization reaction kettle T is T0 when the reaction rate V of the polymerization raw material is less than V0, and by directly decreasing the reaction temperature when the reaction rate of the polymerization raw material is too high, the reaction rate of the polymerization raw material can be rapidly decreased, thereby avoiding the explosion of the polymerization reaction kettle, and while further improving the reaction safety of the polymerization raw material, the efficiency of preparing the prepreg by the process is further improved.
Further, a first preset heating temperature regulating quantity delta T1, a second preset heating temperature regulating quantity delta T2 and a third preset heating temperature regulating quantity delta T3 are further arranged in the central control unit, when the number of times N that the polymerization inhibitor is added into the polymerization inhibitor storage tank is more than N0 or the total amount M of the polymerization inhibitor added into the polymerization inhibitor storage tank is more than M0 and the polymerization rate V ' of the polymer in the polymerization reaction kettle after the polymerization inhibitor is added is more than V0, the central control unit calculates the difference delta V between the polymerization rate V ' of the polymerization raw materials in the polymerization reaction kettle after the polymerization inhibitor is added and the preset critical polymerization rate V0, compares the delta V ' with the first preset polymerization rate difference delta V1 and the second preset polymerization rate difference delta V2 in sequence and adjusts the reaction temperature of the polymerization reaction kettle according to the comparison result, and selects the corresponding temperature regulating quantity according to the actual reaction rate of the polymerization raw materials, the condition that the reaction rate of the polymerization raw materials is reduced too high or too low after the temperature is adjusted can be effectively avoided, the preparation efficiency of the gum dipping solution is ensured, and the efficiency of the process for preparing the semi-solidified plate is further improved.
Further, if the heating temperature T' of the polymerization reaction kettle after adjustment is less than Tmin, the central control unit sets the temperature after adjustment to Tmin and does not reduce the reaction temperature of the polymerization reaction kettle any more, and by setting the preset lowest heating temperature value Tmin, the situation that polymerization raw materials do not react due to too low temperature after adjustment in the temperature adjustment process can be avoided, and the efficiency of preparing the prepreg by the process is further improved while the preparation efficiency of the gum dipping solution is further improved.
Furthermore, the supplement curing box is used for supplement curing of the prepreg type subjected to preliminary curing, so that the situation that the prepreg is fragile and easy to fall off due to overlarge stress caused by solidification of the gum dipping solution can be effectively eliminated, the quality of the prepared prepreg is improved, and meanwhile, the efficiency of preparing the prepreg by the process is further improved.
Drawings
FIG. 1 is a schematic structural diagram of a system for preparing a low-solvent photocuring prepreg for a copper-clad plate according to the invention.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described below with reference to examples; it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and do not limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Fig. 1 is a schematic structural diagram of a system for preparing a low-solvent photocuring prepreg for a copper-clad plate according to the present invention. The system for preparing the low-solvent photocuring prepreg for the copper-clad plate comprises a polymerization reaction kettle 1, a stirring kettle 2, a glue dipping pool 3, a curing unit 4, a supplementary curing box 5 and a central control unit (not shown in the figure). The polymerization reactor 1 is used for loading polymerization raw materials and heating the polymerization raw materials to perform polymerization reaction to generate styrene-acrylate copolymer, a concentration detector 11 is arranged in the polymerization reactor 1 and used for detecting the concentration of the styrene-acrylate copolymer in the polymerization reactor 1, and a polymerization inhibitor storage tank 12 is also arranged on the polymerization reactor 1 and used for storing polymerization inhibitor; the stirring kettle 2 is connected with the polymerization reaction kettle 1 and is used for receiving the polymerized styrene-acrylate copolymer output by the polymerization reaction kettle 1 and uniformly stirring the styrene-acrylate copolymer, a gum dipping raw material, an inorganic filler and a photoinitiator to prepare a gum dipping solution; the dipping glue tank 3 is connected with the stirring kettle 2 and is used for receiving and storing the dipping glue output by the stirring kettle 2; the curing unit 4 is connected with the glue dipping tank 3 and is used for primarily curing the dipped glass fiber cloth output by the glue dipping tank 3, and the curing unit 4 comprises a pair roller 41 for removing redundant glue dipping solution on the surface of the glass fiber plate and an LED lamp 42 for primarily curing the glue dipping solution; the supplementary curing box 5 is connected with the curing unit 4 and is used for supplementary curing of the prepregs which are output by the curing unit 4 and are subjected to primary curing; the central control unit is a central control computer, which is respectively connected with the polymerization reaction kettle 1, the concentration detector 11, the polymerization inhibitor storage tank 12, the stirring kettle 2 and the LED lamp 42, and is used for adjusting the operation parameters of the components according to the actual conditions in the process of preparing the prepreg.
Referring to fig. 1, the process for preparing prepreg using the system of the present invention includes the following steps:
step a, adding a solvent into a polymerization reaction kettle 1, selecting a specified weight part of copolymerization raw material, dissolving the copolymerization raw material in the solvent, adding a corresponding amount of an initiator into the solvent mixed with the copolymerization raw material, and heating the solution mixed with the initiator and the copolymerization raw material to a preset temperature by the polymerization reaction kettle 1 after the addition is finished so as to prepare a styrene-acrylate copolymer;
b, outputting the prepared styrene-acrylate copolymer to a stirring kettle 2 by a polymerization reaction kettle 1, sequentially adding a gum dipping raw material, an inorganic filler and a photoinitiator into the stirring kettle 2, uniformly stirring the raw material by the stirring kettle 2 to prepare a gum dipping solution, continuously stirring the gum dipping solution when the preparation is finished so as to cure the gum dipping solution, and adjusting the viscosity of the gum dipping solution to a specified value by continuous stirring;
step c, outputting the cured impregnation liquid in the stirring kettle 2 to an impregnation tank 3 and impregnating the glass fiber cloth into the impregnation liquid in the impregnation tank 3;
d, when the glass fiber cloth is completely soaked, conveying the glass fiber cloth to a curing unit 4, scraping redundant gum dipping liquid on the glass fiber cloth by using a pair roller 41, and irradiating the glass fiber cloth by using an LED lamp 42 to preliminarily cure the glass fiber cloth to prepare a prepreg;
step e, conveying the prepregs to a supplementary curing box 5 to eliminate the internal stress of the prepregs;
it can be understood that the supplementary curing box can be a far infrared illumination furnace, a hot air type oven or other equipment, as long as the requirement that the supplementary curing box can effectively eliminate the internal stress of the prepreg is met.
Specifically, in the step a, the central control unit detects the concentration of the styrene-acrylate copolymer in the polymerization reactor 1 through the concentration detector 11 in the polymerization reactor 1 and calculates the polymerization rate V of the copolymerization raw material in the polymerization reactor according to the concentration variation of the styrene-acrylate copolymer in the polymerization reactor 1 in unit time, if the polymerization rate V is higher than the preset critical polymerization rate V0, the central control unit controls the polymerization inhibitor storage tank 12 to add a corresponding amount of polymerization inhibitor into the polymerization reactor 1 according to the difference Δ V between the polymerization rate V of the copolymerization raw material in the polymerization reactor and the preset critical polymerization rate V0 to reduce the polymerization rate of the raw material in the polymerization reactor 1, and when the single polymerization inhibitor adding operation is completed, the central control unit controls the concentration detector 11 to detect the polymerization rate V ' of the copolymerization raw material again, and if V ' > V0, the central control unit controls the polymerization inhibitor storage tank 12 to add polymerization inhibitor into the polymerization reactor 1 according to the difference Δ V between V ' and V0 Adding the polymerization inhibitor again in a corresponding amount until the polymerization rate of the polymerization raw materials after the polymerization inhibitor is added is lower than the preset critical polymerization rate V0;
the central control unit is internally provided with a preset maximum polymerization inhibitor adding frequency N0 and a preset maximum polymerization inhibitor adding amount M0, when the central control unit controls the polymerization inhibitor storage tank 12 to add polymerization inhibitor into the polymerization reaction kettle 1, the central control unit records the polymerization inhibitor adding frequency N of the polymerization inhibitor storage tank 12 and the total amount M of the added polymerization inhibitor in real time, and when N is more than N0 or M is more than M0 and the polymerization rate V 'of polymers in the polymerization reaction kettle 1 after the polymerization inhibitor is added is more than V0, the central control unit reduces the reaction temperature of the polymerization reaction kettle 1 to a specified value according to the difference delta V between V' and V0.
Specifically, a first preset polymerization rate difference delta V1, a second preset polymerization rate difference delta V2, a first preset polymerization inhibitor adding amount M1 and a second polymerization inhibitor adding amount M2 are arranged in the central control unit, wherein 0 & ltdelta V1 & ltdelta V2, and M1 & ltM 2;
when the central processor determines that the polymerization rate V of the polymerization raw materials in the polymerization reaction kettle 1 is more than V0, the central control processor calculates the polymerization rate difference delta V, sets the delta V as V-V0, after the calculation is finished, comparing the delta V with the first preset polymerization rate difference delta V1 and the second preset polymerization rate difference delta V2 in sequence by the central control unit, if the delta V is less than or equal to delta V1, setting the amount of the polymerization inhibitor added to the polymerization reaction kettle 1 by the polymerization inhibitor storage tank 12 to be M1 by the central control unit, if the delta V1 is less than the delta V which is less than or equal to delta V2, setting the amount of the polymerization inhibitor added to the polymerization reaction kettle 1 by the polymerization inhibitor storage tank 12 to be M2 by the central control unit, and if the delta V is greater than the delta V2, judging that the polymerization rate of the polymerization raw materials in the polymerization reaction kettle 1 cannot be adjusted by the polymerization inhibitor by the central control processor and reducing the heating temperature in the polymerization reaction kettle 1 to a corresponding value so as to reduce the polymerization rate of the polymerization raw materials; when the polymerization inhibitor storage tank 12 adds a corresponding amount of polymerization inhibitor into the polymerization reaction kettle 1, the central control unit re-detects the polymerization rate V' of the polymerization raw material in the polymerization reaction kettle 1 at a preset time ta after the polymerization inhibitor is added.
Specifically, the central control unit of the present invention further includes a preset heating temperature T0 and a preset heating temperature minimum value Tmin, when the central control unit controls the polymerization reactor 1 to heat the polymerization raw material inside the polymerization reactor 1, the central control unit sets the heating temperature of the polymerization reactor 1 to T0, when the polymerization rate difference Δ V is higher than the second preset polymerization rate difference Δ V2, the central control unit adjusts the heating temperature of the polymerization reactor 1 to Tmin, after the adjustment is completed, the central control unit detects the reaction rate V of the polymerization raw material in real time, and when V is smaller than V0, the central control unit gradually increases the temperature of the polymerization reactor 1 until V0 or the heating temperature T of the polymerization reactor 1 becomes T0.
Specifically, the central control unit is further provided with a first preset heating temperature adjustment quantity delta T1, a second preset heating temperature adjustment quantity delta T2 and a third preset heating temperature adjustment quantity delta T3, wherein delta T1 is smaller than delta T2 and smaller than delta T3; when the number of times N of adding the polymerization inhibitor in the polymerization inhibitor storage tank 12 is more than N0 or the total amount M of the polymerization inhibitor added in the polymerization inhibitor storage tank 12 is more than M0 and the polymerization rate V 'of the polymer in the polymerization reaction kettle 1 after adding the polymerization inhibitor is more than V0, the central control unit calculates the difference value delta V' between the polymerization rate V 'of the polymerization raw materials in the polymerization reaction kettle 1 after adding the polymerization inhibitor and the preset critical polymerization rate V0, sets delta V' -V0, after the calculation, the central control unit compares the delta V 'with the first preset polymerization rate difference delta V1 and the second preset polymerization rate difference delta V2 in turn, if the delta V' is less than or equal to delta V1, the central control unit reduces the temperature of the polymerization reaction kettle 1 and sets the reduction amount of the temperature to delta T1, if the delta V1 is less than or equal to delta V2, the central control unit reduces the temperature of the polymerization reaction kettle 1 and sets the reduction amount of the temperature of the delta T2, if Δ V ">. DELTA.V 2, the central control unit lowers the temperature of the polymerization reactor 1 and sets the amount of lowering of the temperature to Δ T3; when the central control module finishes adjusting the heating temperature of the polymerization reactor 1, the central control unit detects the polymerization rate of the polymerization raw materials in the polymerization reactor 1 again at a preset time tb after the temperature is adjusted, if the polymerization rate of the polymerization raw materials is still higher than the preset critical polymerization rate V0, the central control unit recalculates the difference between the adjusted polymerization rate and the preset critical polymerization rate V0, compares the difference with the delta V1 and the delta V2 in sequence, and readjusts the heating temperature of the polymerization reactor 1 according to the comparison result until the polymerization rate after the temperature adjustment is lower than the preset critical polymerization rate V0.
Specifically, when the central control unit according to the present invention adjusts the heating temperature of the polymerization reaction vessel 1 according to the relationship between Δ V ″ and the first and second preset polymerization rate differences Δ V1 and Δ V2, if the adjusted heating temperature T' of the polymerization reaction vessel 1 is less than Tmin, the central control unit sets the adjusted temperature to Tmin and does not lower the reaction temperature of the polymerization reaction vessel 1 any more.
Specifically, the central control unit is provided with a preset maximum ultraviolet absorption peak Z0, a first preset irradiation wavelength C1 and a second preset irradiation wavelength C2, wherein C1 is more than C2; when the LED lamp 42 is used for irradiating the prepreg, the central control unit determines the irradiation wavelength of the LED lamp 42 according to the maximum ultraviolet absorption peak Z of the dipping solution in the prepreg, if Z is less than or equal to Z0, the central control unit sets the irradiation wavelength of the LED lamp 42 to be C1, and if Z is more than Z0, the central control unit sets the irradiation wavelength of the LED lamp 42 to be C2.
Specifically, the central control unit is also provided with a first preset viscosity Q1, a second preset viscosity Q2 and a preset irradiation distance D0, wherein Q1 is less than Q2; when the LED lamp 42 is used for irradiating the prepreg, the central control unit adjusts the vertical distance between the LED lamp 42 and the prepreg to D0 and adjusts the vertical distance between the LED lamp 42 and the prepreg according to the viscosity of the dipping solution in the prepreg, if Q1 is not less than Q2, the central control unit does not adjust the vertical distance between the LED lamp 42 and the prepreg, if Q is less than Q1, the central control unit adjusts the vertical position of the LED lamp 42 to reduce the vertical distance between the LED lamp 42 and the prepreg, and if Q is greater than Q2, the central control unit adjusts the vertical position of the LED lamp 42 to increase the vertical distance between the LED lamp 42 and the prepreg.
Specifically, the central control unit calculates the irradiation energy of the LED lamp 42 to the prepreg according to the irradiation wavelength of the LED lamp 42 and the vertical distance between the LED lamp 42 and the prepreg, and calculates the irradiation time of the LED lamp 42 to the prepreg according to the irradiation energy.
Specifically, the copolymerization raw material comprises 30-70 parts of styrene, 30-70 parts of acrylate, 80 parts of benzene and 20 parts of methanol, the initiator is azobisisobutyronitrile, and the solvent is a monomer reactive diluent and comprises one or more of acetone, butanone, benzene, methanol and low-functionality acrylate; the acrylate comprises one or more of hydroxyethyl methacrylate, isocyanate acrylate and methacrylate.
As a preferred embodiment of the present invention, the copolymerization raw material of the present invention is selected from 50 parts of styrene, 50 parts of acrylate, 80 parts of benzene and 20 parts of methanol, and the polymerization reaction is performed at 50 ℃ to generate the styrene-acrylate copolymer.
Specifically, the gum dipping raw materials comprise bisphenol A phenolic resin, unsaturated polyester and imidazole; the photoinitiator is one or more of TPO, 184, 1173, 1577, 907, MBF and 754; the inorganic filler is one or more of spherical silica micropowder, talcum powder, aluminum hydroxide and magnesium hydroxide.
Specifically, 80-120 parts of styrene-acrylate copolymer, 150 parts of bisphenol A phenolic resin, 0-100 parts of unsaturated polyester, 50-150 parts of inorganic filler, 0-3 parts of imidazole and 6 parts of photoinitiator are selected when the dipping solution is prepared; as a preferred embodiment of the invention, when the dip solution of the invention is prepared, 100 parts of styrene-acrylate copolymer, 120 parts of bisphenol A phenolic resin, 60 parts of unsaturated polyester, 120 parts of inorganic filler, 1 part of imidazole and 6 parts of photoinitiator are selected, wherein the photoinitiator comprises 3 parts of TPO and 3 parts of 184.
The proposal provided by the invention can reduce or eliminate the solvent dosage in the manufacturing process of the prepreg for the copper-clad plate, thereby reducing or eliminating the problem of exhaust emission of the prepreg in production. In addition, the LED photocuring mode can save more than 70% of heat energy in the production process of the prepreg.
The prepreg prepared by the invention has better performance in the aspect of thermal performance after being pressed into a copper-clad plate, wherein the glass transition temperature Tg is more than or equal to 180 ℃, the float welding is more than or equal to 250s, and the dip welding is more than or equal to 180 s. Other properties can meet the requirements, the peel resistance (1 Anshi copper foil) is more than or equal to 1.5N/mm, the interlayer bonding force is more than or equal to 1.0N/mm, and the dielectric constant Dk is less than or equal to 4.5.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention; various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. A preparation process of a low-solvent photocuring prepreg for a copper-clad plate is characterized by comprising the following steps of:
step a, adding a solvent into a polymerization reaction kettle, selecting a specified weight part of copolymerization raw material, dissolving the copolymerization raw material into the solvent, adding a corresponding amount of an initiator into the solvent mixed with the copolymerization raw material, and heating the solution mixed with the initiator and the copolymerization raw material to a preset temperature by the polymerization reaction kettle after the addition is finished so as to prepare a styrene-acrylate copolymer;
b, outputting the styrene-acrylate copolymer prepared by the polymerization reaction kettle to a stirring kettle, sequentially adding a gum dipping raw material, an inorganic filler and a photoinitiator into the stirring kettle, uniformly stirring the raw material by the stirring kettle to prepare a gum dipping solution, continuously stirring the gum dipping solution when the preparation is finished so as to cure the gum dipping solution, and adjusting the viscosity of the gum dipping solution to a specified value by continuous stirring;
step c, outputting the cured impregnation liquid in the stirring kettle to an impregnation tank and impregnating the glass fiber cloth into the impregnation liquid in the impregnation tank;
d, when the glass fiber cloth is completely soaked, conveying the glass fiber cloth to a curing unit, scraping redundant soaking solution on the glass fiber cloth by using a pair roller, and irradiating the glass fiber cloth by using an LED lamp to preliminarily cure the glass fiber cloth to prepare a prepreg;
step e, conveying the prepreg to a supplementary curing box to eliminate the internal stress of the prepreg;
in the step a, the central control unit detects the concentration of the styrene-acrylate copolymer in the polymerization reaction kettle through a concentration detector in the polymerization reaction kettle, calculates the polymerization rate V of the copolymerization raw material in the polymerization reaction kettle according to the concentration variation of the styrene-acrylate copolymer in the polymerization reaction kettle in unit time, controls a polymerization inhibitor storage tank to add a corresponding amount of polymerization inhibitor into the polymerization reaction kettle to reduce the polymerization rate of the raw material in the polymerization reaction kettle if the polymerization rate V is higher than a preset critical polymerization rate V0 according to the difference value delta V between the polymerization rate V of the copolymerization raw material in the polymerization reaction kettle and the preset critical polymerization rate V0, controls the concentration detector to detect the polymerization rate V ' of the copolymerization raw material again when a single polymerization inhibitor adding operation is completed, and controls the polymerization inhibitor storage tank to add a corresponding amount of polymerization inhibitor into the polymerization reaction kettle again according to the difference value delta V ' between V ' and V0 until the polymerization inhibitor is added into the polymerization reaction kettle again until the polymerization reaction kettle is added until the polymerization rate V ' is up to V ' > V0 The polymerization rate of the polymerization raw materials added with the polymerization inhibitor is lower than the preset critical polymerization rate V0;
the central control unit is internally provided with a preset maximum polymerization inhibitor adding frequency N0 and a preset maximum polymerization inhibitor adding amount M0, when the central control unit controls the polymerization inhibitor storage tank to add polymerization inhibitor into the polymerization reaction kettle, the central control unit records the polymerization inhibitor adding frequency N of the polymerization inhibitor storage tank and the total amount M of the added polymerization inhibitor in real time, and when N is more than N0 or M is more than M0 and the polymerization rate V ' of a polymer in the polymerization reaction kettle after the polymerization inhibitor is added is more than V0, the central control unit reduces the reaction temperature of the polymerization reaction kettle to a specified value according to the difference delta V ' between V ' and V0;
the central control unit is internally provided with a first preset polymerization rate difference delta V1, a second preset polymerization rate difference delta V2, a first preset polymerization inhibitor adding amount M1 and a second polymerization inhibitor adding amount M2, wherein the delta V1 is more than 0 and less than delta V2, and the M1 is more than M2;
when the central control unit judges that the polymerization rate V of the polymerization raw materials in the polymerization reaction kettle is more than V0, the central control unit calculates the polymerization rate difference delta V, sets delta V = V-V0, and after the calculation is finished, comparing the delta V with a first preset polymerization rate difference delta V1 and a second preset polymerization rate difference delta V2 in sequence by a central control unit, if the delta V is less than or equal to the delta V1, setting the amount of a polymerization inhibitor added into the polymerization reaction kettle from a polymerization inhibitor storage tank to be M1 by the central control unit, if the delta V1 is less than the delta V and less than or equal to the delta V2, setting the amount of the polymerization inhibitor added into the polymerization reaction kettle from the polymerization inhibitor storage tank to be M2 by the central control unit, and if the delta V is greater than the delta V2, judging that the polymerization rate of the polymerization raw materials in the polymerization reaction kettle cannot be adjusted by the polymerization inhibitor and reducing the heating temperature in the polymerization reaction kettle to a corresponding value so as to reduce the polymerization rate of the polymerization raw materials; when the polymerization inhibitor storage tank adds a corresponding amount of polymerization inhibitor into the polymerization reaction kettle, the central control unit detects the polymerization rate V' of the polymerization raw materials in the polymerization reaction kettle again when the preset time ta is reached after the polymerization inhibitor is added;
the central control unit is also provided with a preset heating temperature T0 and a preset heating temperature minimum value Tmin, when the central control unit controls the polymerization reaction kettle to heat the polymerization raw materials in the polymerization reaction kettle, the central control unit sets the heating temperature of the polymerization reaction kettle to be T0, when the polymerization rate difference DeltaV is higher than the second preset polymerization rate difference DeltaV 2, the central control unit adjusts the heating temperature of the polymerization reaction kettle to Tmin, after the adjustment is completed, the central control unit detects the reaction rate V of the polymerization raw materials in real time, and when V is smaller than V0, the central control unit gradually increases the temperature of the polymerization reaction kettle until V = V0 or the heating temperature T = T0 of the polymerization reaction kettle;
the central control unit is internally provided with a preset maximum ultraviolet absorption peak Z0, a first preset irradiation wavelength C1 and a second preset irradiation wavelength C2, wherein C1 is more than C2; when the LED lamp is used for irradiating the prepreg, the central control unit determines the irradiation wavelength of the LED lamp according to the maximum ultraviolet absorption peak Z of the dipping solution in the prepreg, if Z is less than or equal to Z0, the central control unit sets the irradiation wavelength of the LED lamp to be C1, and if Z is more than Z0, the central control unit sets the irradiation wavelength of the LED lamp to be C2;
the central control unit is also provided with a first preset viscosity Q1, a second preset viscosity Q2 and a preset irradiation distance D0, wherein Q1 is less than Q2; when the LED lamp is used for irradiating the prepreg, the central control unit adjusts the vertical distance between the LED lamp and the prepreg to D0 and adjusts the vertical distance between the LED lamp and the prepreg according to the viscosity of a dipping solution in the prepreg, if Q1 is not less than Q2, the central control unit does not adjust the vertical distance between the LED lamp and the prepreg, if Q is less than Q1, the central control unit adjusts the vertical position of the LED lamp to reduce the vertical distance between the LED lamp and the prepreg, and if Q is more than Q2, the central control unit adjusts the vertical position of the LED lamp to increase the vertical distance between the LED lamp and the prepreg;
and the central control unit calculates the irradiation energy of the LED lamp to the semi-solidified sheet according to the irradiation wavelength of the LED lamp and the vertical distance between the LED lamp and the semi-solidified sheet and calculates the irradiation time of the LED lamp to the semi-solidified sheet according to the irradiation energy.
2. The process for preparing the low-solvent photocuring prepreg for the copper-clad plate according to claim 1, wherein the central control unit is further provided with a first preset heating temperature adjustment quantity DeltaT 1, a second preset heating temperature adjustment quantity DeltaT 2 and a third preset heating temperature adjustment quantity DeltaT 3, wherein DeltaT 1 is less than DeltaT 2 is less than DeltaT 3; when the number N of times of adding the polymerization inhibitor in the polymerization inhibitor storage tank is more than N0 or the total amount M of the polymerization inhibitor added in the polymerization inhibitor storage tank is more than M0 and the polymerization rate V 'of the polymer in the polymerization reaction kettle after adding the polymerization inhibitor is more than V0, the central control unit calculates the difference value delta V' between the polymerization rate V 'of the polymerization raw materials in the polymerization reaction kettle after adding the polymerization inhibitor and the preset critical polymerization rate V0, sets delta V' = V '-V0, after the calculation is completed, the central control unit compares the delta V' with the first preset polymerization rate difference value delta V1 and the second preset polymerization rate difference value delta V2 in sequence, if the delta V 'is less than or equal to V1, the central control unit reduces the temperature of the polymerization reaction kettle and sets the reduction amount of the temperature to delta T1, if the delta V1 is less than the delta V' -V2, the central control unit reduces the temperature of the polymerization reaction kettle and sets the reduction amount of the temperature to delta T2, if Δ V ">. DELTA.V 2, the central control unit lowers the temperature of the polymerization reactor and sets the amount of temperature lowering to Δ T3; when the central control unit finishes adjusting the heating temperature of the polymerization reaction kettle, the central control unit detects the polymerization rate of the polymerization raw materials in the polymerization reaction kettle again in a preset time tb after the temperature is adjusted, if the polymerization rate of the polymerization raw materials is still higher than the preset critical polymerization rate V0, the central control unit recalculates the difference value between the adjusted polymerization rate and the preset critical polymerization rate V0, compares the difference value with delta V1 and delta V2 in sequence, and readjusts the heating temperature of the polymerization reaction kettle according to the comparison result until the polymerization rate after the temperature is adjusted is lower than the preset critical polymerization rate V0.
3. The process for preparing the low-solvent photocuring prepreg for the copper-clad plate according to claim 2, wherein when the central control unit adjusts the heating temperature of the polymerization reaction kettle according to the relationship between Δ V "and the first and second preset polymerization rate differences Δ V1 and Δ V2, if the adjusted heating temperature T' < Tmin of the polymerization reaction kettle, the central control unit sets the adjusted temperature to Tmin and does not reduce the reaction temperature of the polymerization reaction kettle.
4. The preparation process of the low-solvent photocuring prepreg for the copper-clad plate according to claim 1, wherein the copolymerization raw material comprises styrene, acrylate, benzene and methanol, the initiator is azobisisobutyronitrile, and the solvent is a monomer reactive diluent comprising one or more of acetone, butanone, benzene, methanol and low-functionality acrylate; the acrylate comprises one or more of acrylic acid isocyanate and methacrylate.
5. The preparation process of the low-solvent photocuring prepreg for the copper-clad plate according to claim 1, wherein the dipping raw materials comprise bisphenol A phenolic resin, unsaturated polyester and imidazole; the photoinitiator is one or more of TPO, 184, 1173, 1577, 907, MBF and 754; the inorganic filler is one or more of spherical silica micropowder, talcum powder, aluminum hydroxide and magnesium hydroxide.
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CN111605269A (en) * 2020-05-20 2020-09-01 山东金宝电子股份有限公司 FR4 copper-clad plate with high relative tracking index and high heat resistance and preparation method thereof

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US8104148B2 (en) * 2008-05-22 2012-01-31 Iteq (Dongguan) Corporation Kind of prepolymer and its product-thermosetting resins composite
CN101643565B (en) * 2009-08-24 2010-07-21 广东生益科技股份有限公司 Composite material, high frequency circuit board prepared from same and preparation method thereof

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CN108004772A (en) * 2017-11-23 2018-05-08 陕西生益科技有限公司 A kind of copper-clad plate prepreg and its application
CN111605269A (en) * 2020-05-20 2020-09-01 山东金宝电子股份有限公司 FR4 copper-clad plate with high relative tracking index and high heat resistance and preparation method thereof
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