CN112975138A - High-speed laser marking machine for performing on-line or off-line butt joint on AGV (automatic guided vehicle) after PCB (printed circuit board) resistance welding - Google Patents
High-speed laser marking machine for performing on-line or off-line butt joint on AGV (automatic guided vehicle) after PCB (printed circuit board) resistance welding Download PDFInfo
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- CN112975138A CN112975138A CN202110116503.5A CN202110116503A CN112975138A CN 112975138 A CN112975138 A CN 112975138A CN 202110116503 A CN202110116503 A CN 202110116503A CN 112975138 A CN112975138 A CN 112975138A
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- 238000010330 laser marking Methods 0.000 title claims abstract description 42
- 210000001503 joint Anatomy 0.000 title claims abstract description 17
- 238000003466 welding Methods 0.000 title claims description 6
- 238000001179 sorption measurement Methods 0.000 claims abstract description 46
- 238000007599 discharging Methods 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims description 65
- 210000000078 claw Anatomy 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000010009 beating Methods 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 abstract description 3
- 230000026058 directional locomotion Effects 0.000 abstract description 2
- UFNIBRDIUNVOMX-UHFFFAOYSA-N 2,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1Cl UFNIBRDIUNVOMX-UHFFFAOYSA-N 0.000 description 24
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 239000004566 building material Substances 0.000 description 1
- 230000009194 climbing Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a high-speed laser marking machine for an AGV (automatic guided vehicle) in on-line or off-line butt joint after PCB (printed circuit board) solder mask, which comprises an adsorption platform, wherein the adsorption platform comprises two stations for placing a PCB (printed circuit board), a double-station marking manipulator is arranged above the adsorption platform correspondingly, the double-station marking manipulator can adsorb the PCB placed on the adsorption platform, and a marking machine is also arranged above the adsorption platform; the left side of the adsorption platform is connected with a roller rail type plate feeding machine, the right side of the adsorption platform is provided with a roller rail type plate discharging machine, and the roller rail type plate feeding machine and the roller rail type plate discharging machine are respectively in butt joint with two stations of the adsorption platform. The invention uses one marking machine to match with the adsorption platform, thereby realizing dual purposes of one machine and greatly improving the productivity of the equipment. In addition, the laser marking machine with the structure can also reduce the space occupation of equipment to the field, can ensure the directional movement of the PCB and can realize quick code marking and code reading.
Description
Technical Field
The invention relates to the field of laser marking machines, in particular to a high-speed laser marking machine for an AGV (automatic guided vehicle) in on-line or off-line butt joint after PCB (printed circuit board) solder welding.
Background
Laser marking machines (laser marking machines) use a laser beam to permanently mark the surface of various materials. The marking effect is to expose deep layer material by the evaporation of surface layer material, thereby carving exquisite patterns, trademarks and characters. For example, laser marking devices are used for laser marking of surfaces of electronic components, Integrated Circuits (ICs), electrical appliances, mobile phone communications, hardware, tool accessories, precision instruments, glasses, clocks, jewelry, automobile accessories, plastic keys, building materials and PVC pipes.
However, the traditional laser marking machine has the disadvantages that one marking machine corresponds to one marking platform, and the marking efficiency is low. Especially, when the PCB of the integrated circuit is subjected to marking, the PCB is very troublesome to move, and the operation efficiency is low.
Therefore, the prior art is still in need of further development.
Disclosure of Invention
Aiming at the technical problem, the embodiment of the invention provides a high-speed laser marking machine for AGV (automatic guided vehicle) online or offline butt joint after PCB (printed circuit board) solder mask.
The embodiment of the invention provides a high-speed laser marking machine for an AGV (automatic guided vehicle) in on-line or off-line butt joint after PCB (printed circuit board) solder mask, which comprises an adsorption platform, wherein the adsorption platform comprises two stations for placing a PCB (printed circuit board), a double-station marking manipulator is arranged above the adsorption platform correspondingly, the marking manipulator can adsorb the PCB placed on the adsorption platform, and a marking machine is also arranged above the adsorption platform; the left side of the adsorption platform is connected with a roller rail type plate feeding machine, the right side of the adsorption platform is provided with a roller rail type plate discharging machine, and the roller rail type plate feeding machine and the roller rail type plate discharging machine are respectively in butt joint with two stations of the adsorption platform.
Optionally, the roller rail type board feeding machine comprises a first conveying roller and a first jacking mechanism, and the first jacking mechanism is used for jacking up the PCB board.
Optionally, the roller rail type board feeding machine further includes a first clapper width adjusting mechanism disposed on two sides of the first conveying roller, and the first clapper width adjusting mechanism cooperates with the first jacking mechanism to position and convey the PCB board.
Optionally, the double-station marking manipulator comprises a first manipulator claw and a second manipulator claw, and a double-rotor linear motor for driving the first manipulator claw and the second manipulator claw, wherein the first manipulator claw is used for transmitting a PCB on the roller rail type plate feeding machine to the adsorption platform, and the second manipulator claw can transmit the PCB from the adsorption platform to the roller rail type plate discharging machine.
Optionally, the marking machine includes a marking head and a first marking screw, and the first marking screw can drive the marking head to move linearly.
Optionally, the card reading device further comprises a code reading mechanism arranged on the roller track type card discharging machine, the first code reading mechanism can move along an X axis, the second code reading mechanism can move along a Y axis, and the X axis is perpendicular to the Y axis.
Optionally, the roller track type plate discharging machine comprises a second conveying roller, a second code reading mechanism is arranged on the side portion of the second conveying roller, and a first code reading mechanism is arranged on the upper portion of the second conveying roller.
Optionally, the roller rail type board discharging machine further includes a second jacking mechanism and second clapper width adjusting mechanisms disposed on two sides of the second conveying roller, and the second jacking mechanism cooperates with the second beating mechanism to position and transmit the PCB board.
Optionally, the laser marking machine during off-line production further comprises a trolley type upper plate machine for loading and a trolley type lower plate machine for unloading, the trolley type upper plate machine is in butt joint with the roller rail type plate inlet machine, and the trolley type lower plate machine is in rail type plate outlet machine;
the trolley type plate loading machine for loading and the trolley type plate unloading machine for unloading are not included in the online production of the high-speed laser marking machine.
Optionally, when the high-speed laser marking machine is used for off-line production, the trolley type upper plate machine and the trolley type lower plate machine are arranged, and the trolley type upper plate machine and the trolley type lower plate machine can be in butt joint with an automatic AGV loading and unloading machine or a cart type loading and unloading machine.
Optionally, the cart-type board loading machine and the cart-type board unloading machine are identical in structure and are provided with manipulators for adsorbing the PCB.
The invention uses one marking machine to match with the adsorption platform, thereby realizing dual purposes of one machine and greatly improving the productivity of the equipment. In addition, the laser marking machine with the structure can also reduce the space occupation of equipment to the field, can ensure the directional movement of the PCB and can realize quick code marking and code reading.
In addition, the separation treatment of marking and code reading can improve the production beat and further improve the productivity.
Drawings
FIG. 1 is a schematic diagram of a high-speed laser marking machine for performing online or offline AGV docking after solder-welding of a PCB according to an embodiment of the present invention.
FIG. 2 is a schematic view of a roller track type plate feeding machine according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of a dual station marking robot in an embodiment of the present invention.
FIG. 4 is a schematic diagram of a marking machine according to an embodiment of the present invention.
FIG. 5 is a schematic view of a roller track type plate discharging machine according to an embodiment of the present invention.
FIG. 6 is a schematic view of a cart-type trigger loader according to an embodiment of the present invention.
An adsorption platform 1; a double-station marking manipulator 2; a marking machine 3; a roller rail type plate feeding machine 4; a roller rail type plate discharging machine 5; a trolley type board loading machine 6; a trolley type plate discharging machine 7; a PCB board 8; a first jacking mechanism 41; the first conveying roller 42; a first clapper width adjusting mechanism 43; a first gripper 21; the second gripper jaw 22; a double-mover linear motor 23; marking a head 31; a first marking screw 32; a second jacking mechanism 51; a second conveying roller 52; a second clapper width adjusting mechanism 55; a first code reading mechanism 53; a second reading mechanism 54; and a robot arm 71.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "first," "second," "third," and "fourth," if any, in the description and claims of the invention and in the above-described figures are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
As shown in fig. 1, the high-speed laser marking machine 3 for performing on-line or off-line AGV docking after PCB solder mask provided by the invention comprises an adsorption platform 1, and a double-station marking manipulator 2 and a marking machine 3 are arranged above the adsorption platform 1. The manipulator of the marking machine 3 can adsorb the PCB 8 placed on the adsorption platform 1, the left side of the adsorption platform 1 is connected with a roller rail type plate inlet machine 4, and the right side of the adsorption platform is provided with a roller rail type plate outlet machine 5.
The adsorption platform 1 can be a double-adsorption platform or a single-adsorption platform, the adsorption platform 1 shown in fig. 1 is a double-adsorption platform and comprises two stations for placing the PCB 8, and the two stations can adsorb the PCB 8 so as to fix the PCB 8 and provide a movable marking machine 3 for marking.
In order to facilitate loading, unloading and transferring of the PCB 8, the roller rail type plate feeding machine 4 and the roller rail type plate discharging machine 5 are respectively in butt joint with two stations of the adsorption platform 1. The roller rail type plate feeding machine 4 is similar to the roller rail type plate discharging machine 5 in structure and is specific:
the roller rail type board feeding machine 4 comprises a first conveying roller 42 and a first jacking mechanism 41, wherein the first jacking mechanism 41 is used for jacking up the PCB 8. In the embodiment of the present invention, the first conveying rollers 42 are driven by a motor, as shown in fig. 2, a plurality of first conveying rollers 42 are arranged side by side on the roller track type board feeding machine 4, and the rotation of the first conveying rollers 42 realizes the displacement power for pushing the PCB to perform the conveying of the PCB 8. A plurality of the first conveying rollers 42 are disposed on the bracket, and the first jacking mechanism 41 can jack up the bracket, thereby pushing the plurality of first conveying rollers 42 to ascend, thereby realizing the effect of jacking up the PCB.
Because the length and width of the PCB board 8 are different, the movement on the plane of the large roller rail type board feeding machine 4 can generate the non-uniformity of the whole PCB board 8, the inclined state occurs, and when the PCB board 8 is marked, the marking position can generate errors. Therefore, it is necessary to ensure the displacement consistency, i.e., positioning transmission, during the transfer of the PCB board 8.
For the above reasons, the roller rail type board feeding machine 4 further includes first clapper width adjusting mechanisms 43 disposed at two sides of the first conveying roller 42, and the first clapper width adjusting mechanisms are matched with the first jacking mechanisms 41 to position and convey the PCB 8.
In the figure, the clapper width adjusting mechanism is sleeved on the first conveying roller 42, can move and is fixed in position; the PCB 8 can be placed in the space between the two clapper width adjusting mechanisms, and the PCB 8 is transmitted after being limited by the two clapper width adjusting mechanisms.
Further, as shown in fig. 3, the two-station marking robot 2 includes a first gripper 21 and a second gripper, and a double-mover linear motor 23 for driving the two. The first gripper 21 is used for transferring the PCB 8 on the roller track type board feeding machine 4 to the adsorption platform 1, and the second gripper 22 is used for transferring the PCB 8 from the adsorption platform 1 to the roller track type board discharging machine 5.
The first mechanical gripper 21, the second mechanical gripper 22 and the dual-rotor linear motor 23 are all arranged on a platform, and the platform is arranged opposite to the marking machine 3 and is located at the same height for fixing. The first mechanical claw 21 and the second mechanical claw 22 have opposite moving directions and respectively correspond to the roller track type plate feeding machine 4 and the roller track type plate discharging machine 5. By adopting the double-station marking machine 3, the grabbing of the PCB 8 can be quickly responded by adopting the double-rotor linear motor 23, and the productivity of the equipment is improved.
The double-station marking manipulator 2 corresponds to the marking device, the marking machine 3 needs to cooperate with the double-station marking manipulator 2, the marking machine 3 also needs to be moved, and the moving distance is equal to the length of the adsorption platform 1. Specifically, as shown in fig. 4, the marking machine 3 includes a marking head 31 and a first marking screw 32, the first marking screw 32 can drive the marking head 31 to move linearly, and the first marking screw 32 is driven by a motor; like this marking machine 3 can realize a tractor serves two-purpose, and marking machine 3 can be used in two marking platforms promptly, compares a marking machine 3 and corresponds a marking platform, has that occupation space is few, beats the advantage that mark is efficient, also can practice thrift equipment cost.
Further, as shown in fig. 5, the plate discharging device further includes a code reading mechanism disposed on the roller track type plate discharging device 5, the first code reading mechanism 53 is movable along an X axis, and the second code reading mechanism 54 is movable along a Y axis, where the X axis is perpendicular to the Y axis. The code reading mechanism is arranged on the roller track type plate discharging machine 5, so that the code printing machine and the code reading mechanism are separated, codes can be printed and read at the same time, and the production rhythm is improved.
Specifically, the roller rail type plate discharging machine 5 includes a second conveying roller 52, a second code reading mechanism 54 is disposed on a side portion of the second conveying roller 52, and a first code reading mechanism 53 is disposed on an upper portion of the second conveying roller 52. The roller rail type board discharging machine 5 further comprises a second jacking mechanism 51 and second clapper width adjusting mechanisms 55 arranged on two sides of the second conveying roller 52, and the second jacking mechanism 51 is matched with the second beating mechanisms to position and transmit the PCB 8.
In the embodiment of the present invention, the second conveying rollers 52 are driven by a motor, as shown in fig. 5, a plurality of second conveying rollers 52 are arranged side by side on the roller track type board feeding machine 4, and the rotation of the second conveying rollers 52 realizes the displacement power for pushing the PCB to perform the conveying of the PCB 8. The second conveying rollers 52 are disposed on the bracket, and the second jacking mechanism 51 can jack the bracket, so as to push the second conveying rollers 52 to ascend, thereby realizing the effect of jacking the PCB.
In order to solve the problem of inconsistent movement of the length and the width of the PCB 8 and realize positioning transmission, a second clapper width adjusting mechanism 55 is arranged. In the figure, the clapper width adjusting mechanism is sleeved on the second conveying roller 52, can move and is fixed in position; the PCB 8 can be placed in the space between the two clapper width adjusting mechanisms, and the PCB 8 is transmitted after being limited by the two clapper width adjusting mechanisms.
In the above embodiment, the operation process of the laser marking machine 3 is as follows:
the PCB 8 gets into gyro wheel rail mounted and goes out trigger 5, and 8 clappers location after jacking of PCB are advanced to the climbing mechanism of trigger 4 to the gyro wheel rail mounted, and duplex position marking manipulator 2 transmits the PCB board to the adsorption platform of 3 marking of marking machine, and marking machine 3 is half to the PCB marking. After the codes are printed, the PCB 8 is transmitted to the roller rail type plate discharging machine 5 by the double-station marking manipulator 2, the PCB 8 is lifted by the jacking mechanism of the roller rail type plate discharging machine 5 and then is clapped for positioning, the codes are read by the code reading mechanism for the PCB 8, and then the PCB 8 is discharged.
In the above embodiment, the on-line track laser marking machine 3 is adopted, and the off-line laser marking machine 3 needs a proportioning feeding mechanism.
Referring to fig. 1 and 6, the high-speed laser marking machine provided by the present invention includes two working machine types, one is an off-line laser marking machine 3 and the other is an on-line laser marking machine. The off-line laser marking machine further comprises a trolley type upper trigger 6 used for feeding and a trolley type lower trigger 7 used for blanking, the trolley type upper trigger 6 is in butt joint with the roller rail type plate feeding machine 4, and the trolley type lower trigger 7 is in butt joint with the roller rail type plate discharging machine 5. The trolley type board loading machine 6 and the trolley type board unloading machine 7 are identical in structure, are provided with manipulators 71 and are used for adsorbing the PCB 8, and the PCBs 8 can be adsorbed, moved and placed through the manipulators.
The other is the online laser marking machine of the high-speed laser marking machine, which does not comprise the trolley type upper trigger 6 and the trolley type lower trigger 7. In one embodiment, the automatic loading and unloading machine of the AGV can be directly used for loading and unloading. The on-line high-speed laser marking machine can be used without a trolley type upper trigger 6 and a trolley type lower trigger 7 on the basis of the structure shown in figure 1.
In summary, the laser marking machine provided by the invention has the following advantages:
firstly, the equipment has a compact structure, and the occupation of the equipment on the field space is reduced;
secondly, the equipment adopts a jacking mechanism, a clapper width adjusting mechanism and a double-station marking manipulator to transmit the PCB, so that the PCB can be quickly transmitted, and the working efficiency is improved;
thirdly, the equipment marks the linear motor module of the host machine, so that the stability of the equipment is improved;
fourthly, the code reading assembly of the equipment is arranged on the roller rail type plate discharging machine, so that the code printing time can be saved, and the productivity can be improved;
fifthly, the marking machine has two purposes, and the production efficiency is improved.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The high-speed laser marking machine is characterized by comprising an adsorption platform, wherein the adsorption platform comprises two stations for placing PCBs, and a double-station marking manipulator is arranged above the adsorption platform and can adsorb the PCBs placed on the adsorption platform and a marking machine is also arranged above the adsorption platform; the left side of the adsorption platform is connected with a roller rail type plate feeding machine, the right side of the adsorption platform is provided with a roller rail type plate discharging machine, and the roller rail type plate feeding machine and the roller rail type plate discharging machine are respectively in butt joint with two stations of the adsorption platform.
2. The high-speed laser marking machine for the AGV after the PCB solder mask in the online or offline mode according to claim 1, wherein the roller rail type board feeding machine comprises a first conveying roller and a first jacking mechanism, and the first jacking mechanism is used for jacking up the PCB.
3. The high-speed laser marking machine for the AGV after the PCB solder mask in the online or offline manner according to claim 2, wherein the roller rail type board feeding machine further comprises a first clapper widening mechanism arranged on two sides of the first conveying roller, and the first clapper widening mechanism cooperates with the first jacking mechanism to position and convey the PCB.
4. The high-speed laser marking machine for the AGV after solder welding of the PCB according to claim 1, wherein the double-station marking manipulator comprises a first manipulator claw and a second manipulator claw, and a double-rotor linear motor for driving the first manipulator claw and the second manipulator claw, the first manipulator claw is used for transferring the PCB on the roller track type board feeding machine to the adsorption platform, and the second manipulator claw is used for transferring the PCB from the adsorption platform to the roller track type board discharging machine.
5. The high-speed laser marking machine for AGV after PCB solder-welding according to claim 1, wherein said marking machine comprises a marking head and a first marking screw rod, said first marking screw rod can drive said marking head to move linearly.
6. The high-speed laser marking machine for the AGV after solder mask on the PCB according to claim 5, further comprising a code reading mechanism arranged on the roller track type board discharging machine, wherein the first code reading mechanism can move along an X axis, the second code reading mechanism can move along a Y axis, and the X axis is perpendicular to the Y axis.
7. The high-speed laser marking machine for the AGV after the PCB solder mask is subjected to online or offline butt joint according to claim 1, wherein the roller rail type board discharging machine comprises a second conveying roller, a second code reading mechanism is arranged on the side portion of the second conveying roller, and a first code reading mechanism is arranged on the upper portion of the second conveying roller.
8. The high-speed laser marking machine for the AGV after solder resist of the PCB according to claim 7, wherein the roller track type plate discharging machine further comprises a second jacking mechanism and second plate beating and width adjusting mechanisms arranged on two sides of the second conveying roller, and the second jacking mechanism is matched with the second beating mechanism to position and convey the PCB.
9. The high-speed laser marking machine for AGV after solder resist of PCB of claim 1, further comprising a cart-type board loading machine for loading and a cart-type board unloading machine for unloading during off-line production, wherein the cart-type board loading machine is in butt joint with the roller rail-type board inlet machine, and the cart-type board unloading machine is in butt joint with the roller rail-type board outlet machine;
the trolley type plate loading machine for loading and the trolley type plate unloading machine for unloading are not included in the online production of the high-speed laser marking machine.
10. The high-speed laser marking machine for the AGV after the solder mask of the PCB according to claim 9, wherein the cart-type upper plate machine and the cart-type lower plate machine are arranged during off-line production of the high-speed laser marking machine, and the cart-type upper plate machine and the cart-type lower plate machine can be butted with the AGV for automatically loading and unloading the material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110116503.5A CN112975138A (en) | 2021-01-28 | 2021-01-28 | High-speed laser marking machine for performing on-line or off-line butt joint on AGV (automatic guided vehicle) after PCB (printed circuit board) resistance welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110116503.5A CN112975138A (en) | 2021-01-28 | 2021-01-28 | High-speed laser marking machine for performing on-line or off-line butt joint on AGV (automatic guided vehicle) after PCB (printed circuit board) resistance welding |
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| Publication Number | Publication Date |
|---|---|
| CN112975138A true CN112975138A (en) | 2021-06-18 |
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| CN202110116503.5A Pending CN112975138A (en) | 2021-01-28 | 2021-01-28 | High-speed laser marking machine for performing on-line or off-line butt joint on AGV (automatic guided vehicle) after PCB (printed circuit board) resistance welding |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114313993A (en) * | 2022-02-11 | 2022-04-12 | 东莞科耀机电设备有限公司 | Double-sided LDI exposure automatic production system of hard board PCB |
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Application publication date: 20210618 |