CN112969295A - Cutting and splicing method for improving utilization rate of substrate - Google Patents
Cutting and splicing method for improving utilization rate of substrate Download PDFInfo
- Publication number
- CN112969295A CN112969295A CN202110300012.6A CN202110300012A CN112969295A CN 112969295 A CN112969295 A CN 112969295A CN 202110300012 A CN202110300012 A CN 202110300012A CN 112969295 A CN112969295 A CN 112969295A
- Authority
- CN
- China
- Prior art keywords
- size
- area
- cutting
- multiplied
- pnl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 54
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 33
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 12
- 239000010432 diamond Substances 0.000 claims abstract description 12
- 238000009966 trimming Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
Abstract
A cutting and splicing method for improving the utilization rate of a substrate comprises the following steps; firstly, adopting a substrate with the size of 2184X 1245mm, and adopting a thin diamond cutting knife to divide the substrate with the size of 2184X 1245mm into two rows and three columns of six areas A with the size of 726X 621mm for cutting; secondly, cutting an area A with the size of 726 multiplied by 621mm into an area B1 with the size of 726 multiplied by 251.375mm and an area B2 with the size of 726 multiplied by 368.425mm by a gong knife V after cutting, and printing carbon oil on the area B1 with the size of 726 multiplied by 251.375mm and the area B2 with the size of 726 multiplied by 368.425mm after cutting; thirdly, routing the B1 area with the size of 726 multiplied by 251.375mm into two rows of three columns of six PNL plates with the size of 115.85 multiplied by 236mm through a routing knife and trimming; fourthly, routing the B2 area with the size of 726 multiplied by 368.425mm into nine PNL plates with the size of 115.85 multiplied by 236mm in three rows and three columns through a routing knife and trimming, so that the overall efficiency and the plate utilization rate of the process are higher than those of the existing cutting process.
Description
Technical Field
The invention belongs to the technical field of circuit board production, and particularly relates to a cutting and splicing method for improving the utilization rate of a substrate.
Background
In the production process of the circuit board, the main factors influencing the cost are as follows: 1. the cost of the sheet material; 2. drilling cost; 3. the cost of the manufacturing process; 4. the management cost of artificial water and electricity and the like. Among the factors, the board cost accounts for 60-80% of the cost of the circuit board of the production line, so how to better utilize the board in the production line and improve the utilization rate of the board to the highest point determines the trend of the price of the circuit board; the price also determines the amount of orders, and the use of good board materials is important in the production of circuit boards.
Generally, the design data provided by customers are single unit boards or connected boards, because the size is too small, in order to achieve better production, circuit board manufacturers generally rearrange the data provided by the customers, design a plurality of unit boards on a large substrate according to the requirement of processing convenience, and then cut the substrate to produce circuit board products meeting the size required by the customers. The production mode greatly improves the production efficiency, but inevitably causes the waste of raw materials of the substrate, thereby not only wasting resources, but also increasing the production cost.
Secondly, because the base plate is the carbon oil board, carbon oil printing process is inconvenient because of the big production of single PNL area, and has the bad and off normal hidden danger scheduling problem of oily down.
Therefore, the research on the cutting and makeup process capable of improving the utilization rate of the plate has important significance for reducing the production cost and improving the market competitiveness.
Disclosure of Invention
The invention aims to provide a PNL board cutting and splicing process for improving the utilization rate of a substrate aiming at the defects of the prior art. The process can effectively improve the utilization rate of the plates, reduce the production cost of the PNL plate, improve the production efficiency of the PNL plate, and solve the problems that the production is inconvenient due to the large area of the single PNL, the oil is poor, the potential deviation hazard exists and the like in the carbon oil printing process.
The purpose of the invention is realized by the following technical scheme.
7. A cutting and splicing method for improving the utilization rate of a substrate is characterized by comprising the following steps: comprises the following steps;
(5) adopting a base plate with the size of 2184X 1245mm, and adopting a thin diamond cutting knife to divide the base plate with the size of 2184X 1245mm into two rows and three columns of six areas A with the size of 726X 621mm for cutting;
(6) cutting an A area with the size of 726 multiplied by 621mm into a B1 area with the size of 726 multiplied by 251.375mm and a B2 area with the size of 726 multiplied by 368.425mm by a gong knife V after cutting, and printing carbon oil on a B1 area with the size of 726 multiplied by 251.375mm and a B2 area with the size of 726 multiplied by 368.425mm after cutting;
(7) routing a B1 area with the size of 726 mm × 251.375mm into two rows and three columns of six PNL boards with the size of 115.85mm × 236mm through a routing knife and trimming;
(8) the B2 area of 726 × 368.425mm in size was gong and trimmed by a gong knife into three rows and three columns of nine PNL panels of 115.85 × 236mm in size.
In one embodiment, the diamond cutting blade has a blade width of 3 mm.
In one embodiment, the width of the gong-knife is 1.5 mm.
In one embodiment, the dimension between the two regions a of dimensions 2184 × 1245mm is 3 mm.
In one embodiment, the dimension between the B1 area of dimension 621 x 236mm and the B2 area of dimension 726 x 368.425mm is 1.2 mm.
In one embodiment, the dimension between the two PNL plates in the B1 area of dimension 621 × 236mm and the B2 area of dimension 726 × 368.425mm is 1.2 mm.
Compared with the prior art, the invention has the following advantages and beneficial effects:
compared with the existing cutting process, the process has higher overall efficiency and plate utilization rate, and due to the size of the PNL plate, the production cost is reduced while the requirements of products and customers are met, the production efficiency is improved, the market competitiveness is comprehensively improved, the resource waste is reduced, the requirements of clean production and environmental protection are met, and the problems that the production is inconvenient due to the large area of a single PNL, the oil feeding is poor, the potential deviation hazard exists and the like in the carbon oil printing process are solved.
Drawings
FIG. 1 is a schematic diagram of a prior art process for cutting a substrate.
Fig. 2 is a schematic diagram of a PNL board after a substrate is cut by a conventional process.
FIG. 3 is a schematic diagram of cutting a substrate according to the present invention.
FIG. 4 is a schematic diagram of a PNL board after cutting a substrate according to the present invention.
Detailed Description
In order to make the technical problems, technical solutions and advantages of the present invention more apparent, the following detailed description is given with reference to the accompanying drawings and specific embodiments. In the following description, characteristic details such as specific configurations and components are provided only to help the embodiments of the present invention be fully understood. Thus, it will be apparent to those skilled in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the invention. In addition, descriptions of well-known functions and constructions are omitted for clarity and conciseness.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In various embodiments of the present invention, it should be understood that the sequence numbers of the following processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.
It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
In the embodiments provided herein, it should be understood that "B corresponding to a" means that B is associated with a from which B can be determined. It should also be understood that determining B from a does not mean determining B from a alone, but may be determined from a and/or other information.
Comparative examples
As shown in fig. 1-2, the size of a substrate to be cut in the prior art is 2082 × 1245mm, and the substrate is divided into four rows and two columns by using a thin diamond cutting knife to perform a material cutting and cutting operation on eight a areas 621 × 518mm in size, wherein the diamond cutting knife uses a diamond cutting knife with a knife width of 3mm to cut the substrate with the size 2082 × 1245mm into four rows and two columns of eight a areas 621 × 518mm in size, specifically, the size between two a areas 621 × 518mm in size is 3mm, and then the substrate with the size 2082 × 1245mm is just cut into four rows and two columns of eight a areas 621 × 518mm in size by using the diamond cutting knife with a knife width of 3mm, and the cut eight a areas 621 × 518mm in size are printed with carbon oil.
Because the substrate of the invention is a carbon oil plate, the carbon oil printing process is inconvenient to produce due to the large area of the area A with the single size of 621 multiplied by 518mm, and the hidden troubles of oil poor discharge and deviation exist.
Further, taking an area A with the size of 621 × 518mm as an example, the area A with the size of 621 × 518mm is subjected to makeup, the area A with the size of 621 × 518mm is divided into five rows and two columns of ten PNL boards with the size of 236 × 115.85mm, and the PNL boards are subjected to routing breaking and trimming through a routing knife with the size and width of 1.5 mm.
As further shown in fig. 2, the five rows of PNL plates with the size of 236 × 115.85mm and the area a with the size of 621 × 518mm both have the size of 14.265mm, and the two rows of PNL plates with the size of 236 × 115.85mm and the area a with the size of 621 × 518mm both have the size of 22.2mm between the left end and the right end; wherein, five rows and two columns are arranged in ten PNL boards with the size of 236 multiplied by 115.85 mm; the dimension between two juxtaposed PNL panels of 236 x 115.85mm is 1.6mm and the dimension between two rows of PNL panels of 236 x 115.85mm is 3.305 mm.
From the above, the open material utilization rate of the substrate with the size of 2082 × 1245mm is (236 × 115.85 × 10 × 8)/(2085 × 1245) ≈ 84.38%.
The area a of dimensions 621 x 518mm has a PNL net area of 0.236 x 0.11585 x 10 x 0.2734 square meters per PNL.
In the comparative example, the cutting method of computer diamond cutting adopted in the invention has high efficiency, high dimensional precision and smooth and burr-free plate edges.
Example 1
As shown in fig. 3-4, in the PNL plate cutting and splicing process for improving the substrate utilization rate of the present invention, the substrate size is 2184 × 1245mm, and a diamond cutting knife with a knife width of 3mm is used to divide the substrate size of 2184 × 1245mm into two rows and three columns of six areas a with the size of 726 × 621mm for cutting and cutting; specifically, the dimension between the two a areas of 726 × 621mm is 3mm, and then a substrate of 2184 × 1245mm in size is just cut into two rows of three columns of six a areas of 726 × 621mm by a diamond cutting knife of 3mm width.
Further taking an area A with the size of 726 × 621mm as an example, performing makeup on the area A with the size of 726 × 621mm, specifically, cutting the area A with the size of 726 × 621mm into an area B1 with the size of 726 × 251.375mm and an area B2 with the size of 726 × 368.425mm by a gong knife V with the knife width of 1.5mm, and printing carbon oil on the area B1 with the size of 726 × 251.375mm and the area B2 with the size of 726 × 368.425mm after cutting; therefore, the problems that the carbon oil printing process is inconvenient to produce due to the fact that the substrate is a carbon oil plate and the single size area is large, oil is poor and potential deviation hazards exist in the carbon oil printing process are solved, and the PNL net area is increased.
Further, the size between the B1 area with the size of 726 × 236mm and the B2 area with the size of 726 × 368.425mm is 1.2mm, and a B1 area with the size of 726 × 251.375mm and a B2 area with the size of 726 × 368.425mm are obtained after the gong knife is gonged and trimmed.
As further shown in fig. 4, according to the requirement of the customer, the B1 area with the size of 726 × 236mm may be divided into two rows and three columns of six PNL boards with the size of 115.850 × 236.000mm, specifically, the B1 area with the size of 726 × 236mm may be gonged by a gong knife into two rows and three columns of six PNL boards with the size of 115.850 × 236.000 mm; the B2 area of 726 × 368.425mm in size was divided into three rows and three columns of six PNL boards of 115.850 × 236.000mm in size, and specifically, the B2 area of 726 × 368.425mm in size was gong-milled by a gong-mill into three rows and three columns of six PNL boards of 115.850 × 236.000mm in size.
Specifically, as shown, the dimension between the two PNL plates in the B1 area having a dimension of 726 × 236mm and the B2 area having a dimension of 726 × 368.425mm is 1.2 mm.
Further, the size between the side of the PNL plate having a side by side size of 115.850 × 236.000mm and the side of the a region having a size of 726 × 621mm in the region of B1 having a size of 726 × 236mm and the region of B2 having a size of 726 × 368.425mm is 7.800 mm; the size between the upper and lower ends of a PNL plate with the juxtaposition size of 115.850 × 236.000mm in a B1 area with the size of 726 × 236mm and a B2 area with the size of 726 × 368.425mm and the upper and lower ends of an A area with the size of 726 × 621mm is 18.475 mm; wherein the dimension between two PNL boards with the dimension of 115.850X 236.000mm is 1.2 mm.
From the above, the open material utilization of the substrate with the size of 2184 × 1245mm was (115.850 × 236 × 15 × 6)/(2184 × 1245) ≈ 90.5%.
The net area of PNL for area a of 726 x 621mm in size is 0.11580 x 0.236 x 15 ≈ 0.4101 square meter/PNL.
| Size of substrate | Utilization rate of cutting material | Net area of PNL | |
| Comparative examples | 2082×1245mm | 84.38％ | 0.2734㎡/PNL |
| Examples | 2184×1245mm | 90.5％ | 0.4101㎡/PNL |
Watch 1
Therefore, as shown in the first table, compared with the cutting process of the present invention, the present invention optimizes the substrate size by optimizing the existing substrate size of 2082 × 1245mm to 2184 × 1245 mm; compared with the conventional substrate size of 1041 × 1245mm, the substrate size of 2184 × 1245mm has the material cutting utilization rate increased from 84.38% to 90.5%, and then the net area of the PNL board is increased from 0.2734 square meters/PNL to 0.4101 square meters/PNL, specifically, the square meter order of 100 is taken as an example, 366PNL board needs to be thrown in the original material cutting mode, and only 244PNL boards need to be thrown in the material cutting and plate splicing mode, so that the production efficiency can be effectively improved, and the production cost is reduced.
Secondly, the existing substrate size can be divided into ten PNL plates with the block size of 115.85 × 236mm, while the substrate size of the invention can be divided into fifteen PNL plates with the block size of 115.85 × 236mm, compared with the existing substrate size, the substrate size of the invention has higher utilization rate, and the production cost is correspondingly reduced.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the technical solutions of the present invention have been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that the technical solutions described in the foregoing embodiments can be modified or some technical features can be replaced equally; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. A cutting and splicing method for improving the utilization rate of a substrate is characterized by comprising the following steps: comprises the following steps;
(1) adopting a base plate with the size of 2184X 1245mm, and adopting a thin diamond cutting knife to divide the base plate with the size of 2184X 1245mm into two rows and three columns of six areas A with the size of 726X 621mm for cutting;
(2) cutting an A area with the size of 726 multiplied by 621mm into a B1 area with the size of 726 multiplied by 251.375mm and a B2 area with the size of 726 multiplied by 368.425mm by a gong knife V after cutting, and printing carbon oil on a B1 area with the size of 726 multiplied by 251.375mm and a B2 area with the size of 726 multiplied by 368.425mm after cutting;
(3) routing a B1 area with the size of 726 mm × 251.375mm into two rows and three columns of six PNL boards with the size of 115.85mm × 236mm through a routing knife and trimming;
(4) the B2 area of 726 × 368.425mm in size was gong and trimmed by a gong knife into three rows and three columns of nine PNL panels of 115.85 × 236mm in size.
2. The PNL board cutting and splicing process for improving the utilization rate of the base plate as recited in claim 1, wherein: the width of the diamond cutter is 3 mm.
3. The material cutting and splicing method for improving the utilization rate of the base plate as claimed in claim 1, wherein the method comprises the following steps: the width of the gong knife is 1.5 mm.
4. The material cutting and splicing method for improving the utilization rate of the base plate as claimed in claim 3, wherein the method comprises the following steps: the dimension between the two areas a, whose dimensions are 2184 × 1245mm, is 3 mm.
5. The material cutting and splicing method for improving the utilization rate of the base plate as claimed in claim 4, wherein the method comprises the following steps: the dimension between the B1 area of dimension 621 x 236mm and the B2 area of dimension 726 x 368.425mm is 1.2 mm.
6. The material cutting and splicing method for improving the utilization rate of the base plate as claimed in claim 5, wherein the method comprises the following steps: the dimension between the two PNL plates in the B1 area of dimension 621 x 236mm and the B2 area of dimension 726 x 368.425mm is 1.2 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110300012.6A CN112969295A (en) | 2021-03-22 | 2021-03-22 | Cutting and splicing method for improving utilization rate of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110300012.6A CN112969295A (en) | 2021-03-22 | 2021-03-22 | Cutting and splicing method for improving utilization rate of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112969295A true CN112969295A (en) | 2021-06-15 |
Family
ID=76277971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110300012.6A Pending CN112969295A (en) | 2021-03-22 | 2021-03-22 | Cutting and splicing method for improving utilization rate of substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112969295A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597119A (en) * | 2021-09-30 | 2021-11-02 | 杭州捷配信息科技有限公司 | Waste treatment method and device suitable for PCB production process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025067A (en) * | 2012-12-30 | 2013-04-03 | 胜宏科技（惠州）有限公司 | Method for increasing board utilization rate during manufacture of PCB (printed circuit board) |
| CN103152988A (en) * | 2013-02-22 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Method for improving board utilization ratio during fabrication of PCB (Printed Circuit Board) |
| CN107493662A (en) * | 2017-08-11 | 2017-12-19 | 珠海精毅电路有限公司 | Low resistance, the method for thickness >=25um carbon oils are made on a printed-wiring board |
| CN108668445A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production sawing sheet techniques improving availability ratio of the armor plate |
| CN111031678A (en) * | 2019-11-25 | 2020-04-17 | 清远市富盈电子有限公司 | PCB intelligent board splicing method |
-
2021
- 2021-03-22 CN CN202110300012.6A patent/CN112969295A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025067A (en) * | 2012-12-30 | 2013-04-03 | 胜宏科技（惠州）有限公司 | Method for increasing board utilization rate during manufacture of PCB (printed circuit board) |
| CN103152988A (en) * | 2013-02-22 | 2013-06-12 | 胜宏科技（惠州）股份有限公司 | Method for improving board utilization ratio during fabrication of PCB (Printed Circuit Board) |
| CN107493662A (en) * | 2017-08-11 | 2017-12-19 | 珠海精毅电路有限公司 | Low resistance, the method for thickness >=25um carbon oils are made on a printed-wiring board |
| CN108668445A (en) * | 2018-06-29 | 2018-10-16 | 奥士康精密电路（惠州）有限公司 | A kind of PCB production sawing sheet techniques improving availability ratio of the armor plate |
| CN111031678A (en) * | 2019-11-25 | 2020-04-17 | 清远市富盈电子有限公司 | PCB intelligent board splicing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113597119A (en) * | 2021-09-30 | 2021-11-02 | 杭州捷配信息科技有限公司 | Waste treatment method and device suitable for PCB production process |
| CN113597119B (en) * | 2021-09-30 | 2021-12-10 | 杭州捷配信息科技有限公司 | Waste treatment method and device suitable for PCB production process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2800697Y (en) | Typesetting structure of non-distance flexible circuit board | |
| CN112969295A (en) | Cutting and splicing method for improving utilization rate of substrate | |
| CN108668445B (en) | PCB production cutting process for improving utilization rate of plates | |
| CN101986772A (en) | Method for manufacturing flexible circuit board | |
| CN106034380A (en) | Manufacturing method of printed circuit board | |
| CN102284733A (en) | Gong plate method of printed circuit board (PCB) | |
| CN112969294A (en) | PNL board cutting and splicing process for improving utilization rate of substrate | |
| CN101670594A (en) | Method for processing contour of flexible circuit board | |
| CN110238906B (en) | Flat plate cutter-dismantling die-cutting process | |
| CN112701169A (en) | Solar cell for enhancing welding strength after cutting and cutting method thereof | |
| CN107567188A (en) | Processing method, equipment and the printed circuit board of printed circuit board | |
| CN202439067U (en) | Backlight module cutting die | |
| CN103970330A (en) | Touchpad manufacturing method | |
| CN210589710U (en) | Special-shaped cutting die | |
| CN204632008U (en) | A kind of Financial Information publicity terminal | |
| CN205622977U (en) | V cuts PCB board in flakes | |
| CN212786046U (en) | Multi-piece integrated circuit board | |
| CN207166875U (en) | A kind of circuit board VCP's accompanies plating plate | |
| CN212259424U (en) | Combined typesetting structure of whole flexible circuit board and flexible circuit board | |
| CN202385396U (en) | Transplanting structure of multigang printed circuit board | |
| CN115070348B (en) | Material arranging and distributing method and system for digital small assembly production line | |
| CN201769246U (en) | Cutting die assistant tool for dividing a FPC page composition | |
| CN209072786U (en) | A kind of novel plug class half-pore plate | |
| CN202143293U (en) | Print circuit board convenient for die punching | |
| CN220428641U (en) | Asynchronous die cutting production line of computer casing insulating sheet assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210615 |