CN112962138A - Plating solution cleaning device in plating bath - Google Patents

Plating solution cleaning device in plating bath Download PDF

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Publication number
CN112962138A
CN112962138A CN202110144963.9A CN202110144963A CN112962138A CN 112962138 A CN112962138 A CN 112962138A CN 202110144963 A CN202110144963 A CN 202110144963A CN 112962138 A CN112962138 A CN 112962138A
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CN
China
Prior art keywords
movably connected
plate
ball
electroplating
arc
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CN202110144963.9A
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Chinese (zh)
Inventor
万廷刚
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Individual
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Individual
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Priority to CN202110144963.9A priority Critical patent/CN112962138A/en
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/16Regeneration of process solutions
    • C25D21/18Regeneration of process solutions of electrolytes
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/06Filtering particles other than ions

Abstract

The invention discloses a plating solution cleaning device in a plating bath, which comprises an arc base plate, wherein a telescopic cylinder is movably connected at the middle position of the top of the arc base plate, a cleaning mechanism is movably connected at the bottom of the inner surface of an electroplating box, electroplating polar plates are fixedly connected to two sides of the top of the electroplating box, an electroplating installation jack is arranged at the middle position of the top of each electroplating polar plate, the cleaning mechanism comprises a sealing plate, the top of the sealing plate is movably connected with a filtering mechanism, the bottom of the filtering mechanism penetrates through the sealing plate and extends to the bottom of the sealing plate, the bottom of the filtering mechanism is movably connected with a force dispersing mechanism, and one side of the force dispersing mechanism, which is far away from the filtering mechanism, is movably. The filtering mechanism is directly arranged inside the electroplating box, the electroplating liquid can be cleaned without stopping the equipment, the intermediate down time is avoided to be too long, the electroplating sustainability is ensured to be processed, and the processing efficiency of the equipment is improved.

Description

Plating solution cleaning device in plating bath
Technical Field
The invention relates to the technical field of electroplating, in particular to a cleaning device for electroplating solution in an electroplating bath.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis so as to play roles of preventing metal oxidation, improving wear resistance, conductivity, light reflection, corrosion resistance, enhancing appearance and the like.
According to chinese patent CN112176391A, the first stirring rake under the lifter plate rotates around the stirring shaft and moves up and down, which improves the stirring effect, and helps the filter plate to filter the impurities in the electroplating solution, thereby preventing the filter plate from blocking the filter holes and improving the filtering efficiency. Electric telescopic handle can adjust the pressure of cleaning brush to the filter, helps more thoroughly with the impurity clearance on filter plate surface, and first servo motor can drive cleaning brush and move on one side along third screw rod axial direction and push the impurity on filter plate surface to the slag discharging hole, has realized automatic discharging's function, has improved work efficiency. In the use process, the impurities are separated from the electroplating solution by the internal gouge, the electroplating solution needs to be added again in a backflow mode, the time of the middle interval is prolonged, and the working efficiency is reduced.
The existing electroplating solution cleaning device in the electroplating bath separates impurities from the electroplating solution in the using process, the electroplating solution needs to be added again in a backflow mode, the time of an intermediate interval is prolonged, and the working efficiency is reduced.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a plating solution cleaning device in a plating bath, which solves the problems that impurities and plating solution are separated by internal components in the using process of the plating solution cleaning device in the prior plating bath, the plating solution needs to be added again in a backflow mode, the time of an intermediate interval is prolonged, and the working efficiency is reduced.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a cleaning device for electroplating solution in an electroplating bath comprises an arc base plate, wherein a telescopic cylinder is movably connected at the middle position of the top of the arc base plate, electroplating boxes are movably connected at the two sides of the top of the arc base plate, which are positioned on the telescopic cylinder, cleaning mechanisms are movably connected at the bottom of the inner surface of each electroplating box, electroplating polar plates are fixedly connected at the two sides of the top of each electroplating box, and electroplating installation jacks are formed at the middle position of the top of each electroplating polar plate; utilize the arc design of self arc bed plate, the weight of cooperation telescopic cylinder self forms the base of tumbler formula, avoids whole equipment to produce the slope and leads to inside plating solution to reveal, ensures the whole safety of internals, simultaneously through rocking of self, drives the back and forth movement formation impact of inside plating solution, and the impurity that will deposit is bloated, promotes the effect of clearance.
The cleaning mechanism comprises a sealing plate, the top of the sealing plate is movably connected with a filtering mechanism, the bottom of the filtering mechanism penetrates through the sealing plate and extends to the bottom of the sealing plate, the bottom of the filtering mechanism is movably connected with a force dissipating mechanism, and one side, far away from the filtering mechanism, of the force dissipating mechanism is movably connected with an impact hard plate. The filtering mechanism is directly arranged inside the electroplating box, the electroplating liquid can be cleaned without stopping the equipment, the intermediate down time is avoided to be too long, the electroplating sustainability is ensured to be processed, and the processing efficiency of the equipment is improved.
Preferably, the filtering mechanism comprises a packaging ring plate, a ball panel is fixedly connected to the top of the packaging ring plate, a supporting rod is fixedly connected to the inner surface of the ball panel, a filter element ball is movably connected to one end, away from the ball panel, of the supporting rod, a water feeding hole is formed in the top of the outer surface of the filter element ball, an anti-backflow arc plate is movably connected to the outer surface of the filter element ball below the supporting rod, and a flexible ball bag is fixedly connected to the bottom of the packaging ring plate. Utilize the deformation of self flexible air bag, extrude the filtering to inside plating solution, through the vibrations that produce when the globular design of self and equipment self motion, impurity in the plating solution can drop because of self weight, prevents to produce the blocking to filtering mechanism, and the while self prevents that the impurity after the filtration from flowing back can be avoided to the arc board against current, ensures filtration quality.
Preferably, the outer surface of the packaging ring plate is movably connected with the sealing plate, one side of the anti-reflux arc plate, which is far away from the filter element ball, is movably connected with the flexible ball bag, and the inner surface of the flexible ball bag is movably connected with the filter element ball.
Preferably, the power dissipation mechanism includes end ball piece, end ball piece top intermediate position swing joint has the kicking block, end ball piece top is located kicking block both sides swing joint and has spacing sleeve, spacing sleeve internal surface swing joint has the location arc board, spacing sleeve surface swing joint has the fender beam, spacing sleeve's one end swing joint is kept away from to the fender beam has supplementary arc pole, kicking block top swing joint has balanced touch panel. The impact force to the bottom disperses the balance, avoids the stress concentration that the bottom impact force produced, prevents that the internals from destroying, ensures the security of inside use and the life of component, carries out effectual balanced dispersion with the impact force, ensures that the inside motion degree is the same, clears up the processing comprehensively, avoids producing the hourglass.
Preferably, bottom ball piece bottom and striking hardboard swing joint, balanced touch panel top and filter mechanism swing joint, spacing telescopic one side and kicking block swing joint are kept away from to the location arc board, supplementary arc pole bottom and top respectively with bottom ball piece and balanced touch panel swing joint.
Preferably, the guard bar includes the butt rod, butt rod internal surface swing joint has the elastomer, butt rod internal surface is located elastomer top swing joint has bulb spare, one side swing joint that the butt rod was kept away from to the bulb spare has the bulb mounting panel. The stress generated by the auxiliary arc rod is buffered and offset through the internal elastic body, the supporting effect and the safety of the self component are ensured, the internal space is effectively changed and adjusted, the change degree of the internal air flow is promoted, the internal temperature is balanced, the thermal fatigue is avoided, and the working aging of the component is prolonged.
Preferably, the bottom of the outer surface of the butt rod is movably connected with the auxiliary arc rod, one side, far away from the butt rod, of the ball head mounting plate is movably connected with the limiting sleeve, and the top of the elastic body is movably connected with the ball head piece.
Preferably, the outer surface of the sealing plate is fixedly connected with the electroplating box, the outer surface of the force dispersing mechanism is movably connected with the electroplating box, and the outer surface of the impact hard plate is movably connected with the electroplating box.
Preferably, the top of the telescopic cylinder is movably connected with the cleaning mechanism, and the outer surface of the telescopic cylinder is movably connected with the electroplating box.
(III) advantageous effects
The invention provides a cleaning device for electroplating solution in an electroplating bath. The method has the following beneficial effects:
(one), this plating solution cleaning device in plating bath through the arc design that utilizes self arc bed plate, cooperates telescopic cylinder self weight, forms the base of tumbler formula, avoids whole equipment to produce the slope and leads to inside plating solution to reveal, ensures the whole safety of internals, simultaneously through rocking of self, drives the back and forth movement formation of inside plating solution and strikes, and the impurity that will deposit is drunken, promotes the effect of clearance.
(II), this plating solution cleaning device in plating bath directly sets up inside the electroplating tank through filtering mechanism, need not to stop equipment and can clear up the plating solution, avoids middle down time overlength, ensures to electroplate sustainability and processes, promotes the machining efficiency of equipment self.
(III), this plating solution cleaning device in plating bath through the deformation that utilizes self flexible air bag, extrudees the filtration to inside plating solution, through the vibrations that produce during the globular design of self and equipment self motion, impurity in the plating solution can drop because of self weight, prevents to produce the jam to filtering mechanism, and the anti-reflux arc board of self can avoid the impurity backward flow after the filtration simultaneously, ensures filtration quality.
(IV), this plating solution cleaning device in plating bath disperses the balance through the impact force to the bottom, avoids the stress concentration that the bottom impact force produced, prevents that the internals from destroying, ensures the security of inside use and the life of component, carries out effectual balanced dispersion with the impact force, ensures that the inside motion degree is the same, clears up the processing comprehensively, avoids producing the lack of leakage.
(V), this plating solution cleaning device in plating bath cushions through the stress that inside elastomer produced supplementary arc pole and offsets, ensures the supporting effect and the security of self component, carries out effectual change to the inner space and adjusts, promotes the change degree of inside air current, balances internal temperature, avoids producing thermal fatigue, extension component work ageing.
Drawings
FIG. 1 is a schematic structural view of the present invention as a whole;
FIG. 2 is a schematic structural view of the cleaning mechanism of the present invention;
FIG. 3 is a schematic view of the filter mechanism of the present invention;
FIG. 4 is a schematic structural diagram of the force spreading mechanism of the present invention;
FIG. 5 is a schematic view of the construction of the protection bar of the present invention;
in the figure: the device comprises an arc base plate 1, a telescopic cylinder 2, an electroplating box 3, a cleaning mechanism 4, a sealing plate 41, a filtering mechanism 42, a packaging ring plate 421, a ball panel 422, a supporting rod 423, a filter element ball 424, a water supply hole 425, an anti-backflow arc plate 426, a flexible balloon 427, a force dispersing mechanism 43, a ball block 431, a top block 432, a limiting sleeve 433, a positioning arc plate 434, a protective rod 435, a pair of rods 1, an elastomer a2, a3 ball head piece, a4 ball head mounting plate 436 auxiliary arc rod, a 437 balance touch plate, a 44 impact hard plate, a 5 electroplating polar plate and a 6 electroplating mounting jack.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a cleaning device for electroplating solution in an electroplating bath comprises an arc base plate 1, wherein a telescopic cylinder 2 is movably connected at the middle position of the top of the arc base plate 1, electroplating boxes 3 are movably connected at the two sides of the telescopic cylinder 2 at the top of the arc base plate 1, a cleaning mechanism 4 is movably connected at the bottom of the inner surface of each electroplating box 3, electroplating polar plates 5 are fixedly connected at the two sides of the top of each electroplating box 3, and electroplating installation jacks 6 are formed in the middle position of the top of each electroplating polar plate 5;
the cleaning mechanism 4 comprises a sealing plate 41, a filtering mechanism 42 is movably connected to the top of the sealing plate 41, the bottom of the filtering mechanism 42 penetrates through the sealing plate 41 and extends to the bottom of the sealing plate 41, a force dispersing mechanism 43 is movably connected to the bottom of the filtering mechanism 42, and an impact hard plate 44 is movably connected to one side, far away from the filtering mechanism 42, of the force dispersing mechanism 43.
Filtering mechanism 42 includes encapsulation crown plate 421, encapsulation crown plate 421 top fixedly connected with ball panel 422, the internal fixed surface of sphere panel 422 is connected with bracing piece 423, the one end swing joint that ball panel 422 was kept away from to bracing piece 423 has filter core ball 424, water feed hole 425 has been seted up at filter core ball 424 surface top, filter core ball 424 surface is located bracing piece 423 below swing joint and prevents arc board 426 against current, encapsulation crown plate 421 bottom fixedly connected with flexible sacculus 427.
The outer surface of the packaging ring plate 421 is movably connected with the sealing plate 41, one side of the backflow-preventing arc plate 426 far away from the filter element ball 424 is movably connected with the flexible balloon 427, and the inner surface of the flexible balloon 427 is movably connected with the filter element ball 424.
The force dispersing mechanism 43 comprises a bottom ball block 431, a top block 432 is movably connected to the middle position of the top of the bottom ball block 431, the top of the bottom ball block 431 is located on two sides of the top block 432 and is movably connected with a limiting sleeve 433, a positioning arc plate 434 is movably connected to the inner surface of the limiting sleeve 433, a protective rod 435 is movably connected to the outer surface of the limiting sleeve 433, an auxiliary arc rod 436 is movably connected to one end, away from the limiting sleeve 433, of the protective rod 435, and a balance touch plate 437 is movably connected to the top of the top block 432.
The bottom of the bottom ball block 431 is movably connected with the impact hard plate 44, the top of the balance touch plate 437 is movably connected with the filter mechanism 42, one side of the positioning arc plate 434, which is far away from the limiting sleeve 433, is movably connected with the top block 432, and the bottom and the top of the auxiliary arc rod 436 are respectively movably connected with the bottom ball block 431 and the balance touch plate 437.
The protective rod 435 comprises a pair rod a1, an elastic body a2 is movably connected to the inner surface of the pair rod a1, a ball head piece a3 is movably connected to the inner surface of the pair rod a1 above the elastic body a2, and a ball head mounting plate a4 is movably connected to one side, away from the pair rod a1, of the ball head piece a 3.
The bottom of the outer surface of the opposite rod a1 is movably connected with the auxiliary arc rod 436, one side of the ball head mounting plate a4, which is far away from the opposite rod a1, is movably connected with the limiting sleeve 433, and the top of the elastic body a2 is movably connected with the ball head piece a 3.
The outer surface of the sealing plate 41 is fixedly connected with the electroplating box 3, the outer surface of the force dispersing mechanism 43 is movably connected with the electroplating box 3, and the outer surface of the impact hard plate 44 is movably connected with the electroplating box 3.
The top of the telescopic cylinder 2 is movably connected with the cleaning mechanism 4, and the outer surface of the telescopic cylinder 2 is movably connected with the electroplating box 3.
When in use, the electroplating solution is injected into the electroplating box 3, the electroplating workpiece is placed in the electroplating installation jack 6 for fixing, and the external power supply is started for electroplating processing;
starting the telescopic cylinder 2, driving the whole equipment by utilizing the vibration generated by the telescopic cylinder 2, forming a tumbler-type base by the arc design of an arc base plate in cooperation with the self weight of the telescopic cylinder, shaking the electroplating solution in the electroplating box 3, forming impact by the back-and-forth movement of the electroplating solution, and agitating the precipitated impurities to enable the impurities to float in the electroplating solution so as to avoid precipitation;
the up-and-down reciprocating motion of the telescopic cylinder 2 drives the up-and-down reciprocating motion of the impact hard plate 44, the impact is generated on the force dispersion mechanism 43 through mutual contact, the impact force is dispersed through the bottom ball block 431 and the auxiliary arc rod 436, the damage to internal components is prevented, the impact force is effectively and uniformly dispersed, the same degree of internal motion is ensured, and the cleaning and processing are comprehensively carried out;
the elastic body a2 in the inner part buffers and offsets the stress generated by the auxiliary arc rod, ensures the supporting effect and the safety of the self component, effectively changes and adjusts the inner space, promotes the change degree of the inner air flow, and balances the inner temperature;
the force dispersing mechanism 43 extrudes the flexible saccule 427 to enable the electroplating solution in the flexible saccule 427 to be sprayed out through the water supply holes 425 on the filter element ball 424, the filter element ball 424 is used for filtering, then the flexible saccule 427 is reset, and the electroplating solution at the periphery is infused through the gap between the ball panel 422 and the filter element ball 424, so that subsequent filtering treatment is convenient;
the anti-backflow arc plate 426 can prevent the filtered impurities from flowing back until the processing is completed.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The term "comprising", without further limitation, means that the element so defined is not excluded from the group consisting of additional identical elements in the process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (9)

1. The utility model provides an electroplate liquid cleaning device in plating bath, includes arc bed plate (1), its characterized in that: the middle position of the top of the arc base plate (1) is movably connected with a telescopic cylinder (2), the top of the arc base plate (1) is positioned at two sides of the telescopic cylinder (2) and is movably connected with an electroplating box (3), the bottom of the inner surface of the electroplating box (3) is movably connected with a cleaning mechanism (4), two sides of the top of the electroplating box (3) are fixedly connected with electroplating polar plates (5), and the middle position of the top of the electroplating polar plates (5) is provided with an electroplating installation jack (6);
clearance mechanism (4) include closing plate (41), closing plate (41) top swing joint has filtering mechanism (42), filtering mechanism (42) bottom runs through closing plate (41) and extends to closing plate (41) bottom, filtering mechanism (42) bottom swing joint has power dissipation mechanism (43), one side swing joint that filtering mechanism (42) were kept away from in power dissipation mechanism (43) has striking hardboard (44).
2. The plating solution cleaning apparatus as claimed in claim 1, wherein: filtering mechanism (42) is including encapsulation crown plate (421), encapsulation crown plate (421) top fixedly connected with ball panel (422), fixed surface is connected with bracing piece (423) in ball panel (422), the one end swing joint that ball panel (422) were kept away from in bracing piece (423) has filter core ball (424), water feed hole (425) have been seted up at filter core ball (424) surface top, filter core ball (424) surface is located bracing piece (423) below swing joint has anti-reflux arc board (426), encapsulation crown plate (421) bottom fixedly connected with flexible sacculus (427).
3. The plating solution cleaning apparatus as claimed in claim 2, wherein: the outer surface of the packaging ring plate (421) is movably connected with the sealing plate (41), one side of the anti-backflow arc plate (426) far away from the filter element ball (424) is movably connected with the flexible balloon (427), and the inner surface of the flexible balloon (427) is movably connected with the filter element ball (424).
4. The plating solution cleaning apparatus as claimed in claim 1, wherein: the gravity dispersion mechanism (43) comprises a bottom ball block (431), a top block (432) is movably connected to the middle position of the top of the bottom ball block (431), a limit sleeve (433) is movably connected to the two sides of the top block (432) at the top of the bottom ball block (431), a positioning arc plate (434) is movably connected to the inner surface of the limit sleeve (433), a protection rod (435) is movably connected to the outer surface of the limit sleeve (433), an auxiliary arc rod (436) is movably connected to one end, away from the limit sleeve (433), of the protection rod (435), and a balance touch plate (437) is movably connected to the top of the top block (432).
5. The plating solution cleaning apparatus as claimed in claim 4, wherein: bottom ball piece (431) bottom and striking hardboard (44) swing joint, balanced touch panel (437) top and filtering mechanism (42) swing joint, one side and top piece (432) swing joint that spacing sleeve (433) were kept away from to location arc board (434), supplementary arc pole (436) bottom and top respectively with bottom ball piece (431) and balanced touch panel (437) swing joint.
6. The plating solution cleaning apparatus as claimed in claim 5, wherein: the protective rod (435) comprises a pair rod (a1), an elastic body (a2) is movably connected to the inner surface of the pair rod (a1), a ball head piece (a3) is movably connected to the inner surface of the pair rod (a1) above the elastic body (a2), and a ball head mounting plate (a4) is movably connected to one side, away from the pair rod (a1), of the ball head piece (a 3).
7. The plating solution cleaning apparatus as claimed in claim 6, wherein: the bottom of the outer surface of the counter rod (a1) is movably connected with the auxiliary arc rod (436), one side of the ball head mounting plate (a4), which is far away from the counter rod (a1), is movably connected with the limiting sleeve (433), and the top of the elastic body (a2) is movably connected with the ball head piece (a 3).
8. The plating solution cleaning apparatus as claimed in claim 1, wherein: the outer surface of the sealing plate (41) is fixedly connected with the electroplating box (3), the outer surface of the force dispersing mechanism (43) is movably connected with the electroplating box (3), and the outer surface of the impact hard plate (44) is movably connected with the electroplating box (3).
9. The plating solution cleaning apparatus as claimed in claim 1, wherein: the top of the telescopic cylinder (2) is movably connected with the cleaning mechanism (4), and the outer surface of the telescopic cylinder (2) is movably connected with the electroplating box (3).
CN202110144963.9A 2021-02-02 2021-02-02 Plating solution cleaning device in plating bath Pending CN112962138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110144963.9A CN112962138A (en) 2021-02-02 2021-02-02 Plating solution cleaning device in plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110144963.9A CN112962138A (en) 2021-02-02 2021-02-02 Plating solution cleaning device in plating bath

Publications (1)

Publication Number Publication Date
CN112962138A true CN112962138A (en) 2021-06-15

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Application Number Title Priority Date Filing Date
CN202110144963.9A Pending CN112962138A (en) 2021-02-02 2021-02-02 Plating solution cleaning device in plating bath

Country Status (1)

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CN (1) CN112962138A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114032605A (en) * 2021-10-29 2022-02-11 太仓市金鹿电镀有限公司 Clean electroplating equipment capable of reducing environmental pollution and working method thereof
CN114409128A (en) * 2021-12-29 2022-04-29 南通文凯化纤有限公司 A treatment facility for chemical fibre weaving waste water

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114032605A (en) * 2021-10-29 2022-02-11 太仓市金鹿电镀有限公司 Clean electroplating equipment capable of reducing environmental pollution and working method thereof
CN114032605B (en) * 2021-10-29 2024-02-09 太仓市金鹿电镀有限公司 Clean electroplating equipment capable of reducing environmental pollution and working method thereof
CN114409128A (en) * 2021-12-29 2022-04-29 南通文凯化纤有限公司 A treatment facility for chemical fibre weaving waste water

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