CN112961493A - High-thermal-conductivity TPU material and preparation method thereof - Google Patents
High-thermal-conductivity TPU material and preparation method thereof Download PDFInfo
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- 239000000463 material Substances 0.000 title claims abstract description 76
- 238000002360 preparation method Methods 0.000 title claims abstract description 34
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 67
- 239000004594 Masterbatch (MB) Substances 0.000 claims abstract description 29
- 238000002156 mixing Methods 0.000 claims abstract description 22
- 239000002994 raw material Substances 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 19
- 239000004611 light stabiliser Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000001125 extrusion Methods 0.000 claims abstract description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 52
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 48
- 238000005859 coupling reaction Methods 0.000 claims description 42
- 230000008878 coupling Effects 0.000 claims description 41
- 238000010168 coupling process Methods 0.000 claims description 41
- 239000002245 particle Substances 0.000 claims description 25
- 239000000243 solution Substances 0.000 claims description 16
- 229910021389 graphene Inorganic materials 0.000 claims description 14
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 11
- 239000005751 Copper oxide Substances 0.000 claims description 11
- 229910000431 copper oxide Inorganic materials 0.000 claims description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000005406 washing Methods 0.000 claims description 5
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 238000005303 weighing Methods 0.000 claims description 2
- 230000000844 anti-bacterial effect Effects 0.000 abstract description 10
- 238000005469 granulation Methods 0.000 abstract 1
- 230000003179 granulation Effects 0.000 abstract 1
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 63
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 63
- 239000011259 mixed solution Substances 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 238000005119 centrifugation Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 5
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920005862 polyol Polymers 0.000 description 4
- 150000003077 polyols Chemical class 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 238000006011 modification reaction Methods 0.000 description 3
- 238000009210 therapy by ultrasound Methods 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000588724 Escherichia coli Species 0.000 description 1
- 241000191967 Staphylococcus aureus Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
- C08L75/08—Polyurethanes from polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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Abstract
The application relates to the technical field of TPU materials, and particularly discloses a high-thermal-conductivity TPU material and a preparation method thereof, wherein the high-thermal-conductivity TPU material comprises the following raw materials in parts by weight: 800 parts of TPU master batch, 200 parts of PVC master batch, 10-20 parts of modified graphene oxide and 10-30 parts of light stabilizer; the preparation method comprises three steps of master batch drying, melt blending and extrusion granulation, and the high thermal conductivity TPU material prepared by the method improves the thermal conductivity and antibacterial property of the TPU material.
Description
Technical Field
The application relates to the technical field of TPU materials, in particular to a high-thermal-conductivity TPU material and a preparation method thereof.
Background
The TPU refers to thermoplastic polyurethane elastomer rubber, has good mechanical properties and good processing properties, and is widely applied to the fields of mobile phones, flat plates, household appliances, automobiles, medical treatment and health care and the like.
The molecular structure of the TPU comprises a rigid block and a flexible block, wherein the rigid block is obtained by reacting diphenylmethane diisocyanate (MDI) or Toluene Diisocyanate (TDI) with micromolecular polyol; the flexible blocks are obtained by reacting diphenylmethane diisocyanate (MDI) or Toluene Diisocyanate (TDI) with a macromolecular polyol, and the rigid blocks and the flexible blocks are alternately formed into the TPU. The rigid block and flexible block structure of the TPU enables the TPU to have good resilience, so that the TPU is often used for preparing protective cases of mobile phones, flat plates, household appliances and the like to protect internal devices from being damaged by external action.
With respect to the related art among the above, the inventors consider that the following drawbacks exist: because the thermal conductivity of TPU is lower, the protective housing of TPU preparation is unfavorable for the heat dissipation of the device in the protective housing, influences user's experience and feels.
Disclosure of Invention
In order to solve the problem of low thermal conductivity of TPU, the application provides a high thermal conductivity TPU material and a preparation method thereof.
In a first aspect, the present application provides a high thermal conductivity TPU material that employs the following technical scheme:
the high-thermal-conductivity TPU material is prepared from the following raw materials in parts by weight: 800 parts of TPU master batch, 200 parts of PVC master batch, 10-20 parts of coupling modified graphene oxide and 10-30 parts of light stabilizer.
By adopting the technical scheme, the impact strength of the TPU can be improved by mixing the PVC and the TPU, internal devices can be protected when the material is made into a protective shell, and the internal devices are not easily damaged by impact; the light stabilizer can improve the anti-aging performance of the material and prolong the service time of the material; the compatibility of the graphene oxide and a high-molecular system can be improved through coupling modification treatment of the coupling modified graphene oxide, the coupling modified graphene oxide and the TPU material are blended to form a protective shell, and heat dissipated by running of an electronic device in the shell can be conducted through the coupling modified graphene oxide in the material, so that the heat conductivity of the TPU material is improved; the high thermal conductivity material is characterized in that the tensile strength is 69.3-72.5MPa, the impact strength is 0.39-0.47J/m, the rebound resilience is 82.3-85.6%, the thermal conductivity is 4.54-9.13W/(m.K), the antibacterial rate is 25-60%, and the thermal conductivity of general polymers is more than 4.
Preferably, the raw material also comprises silicon carbide with a granular structure, and the weight ratio of the silicon carbide to the coupling modified graphene oxide is 1: 1-3.
By adopting the technical scheme, the silicon carbide has higher thermal conductivity, and the introduction of the silicon carbide can increase the thermal conductivity of the high-thermal-conductivity TPU material; simultaneously, the carborundum of granular structure can play the bridging effect between the piece of coupling modified graphene oxide and piece, makes the more closely knit that the heat conduction filler of different dimensions filled in TPU, helps the heat transfer of material, and carborundum and coupling modified graphene oxide synergism have further promoted the heat conductivity of material.
Preferably, the weight ratio of the silicon carbide to the coupling modified graphene oxide is 1: 2.
By adopting the technical scheme, when the weight ratio of the silicon carbide to the coupling modified graphene oxide is 1:2, the thermal conductivity of the material is better, and the thermal conductivity of the TPU can be further improved.
Preferably, the high thermal conductivity TPU material also comprises silicon carbide with a granular structure, the average particle size of the silicon carbide is 1.5-10 μm, and the average particle size of the coupling modified graphene oxide is 5-10 μm.
By adopting the technical scheme, the silicon carbide with the average particle size of 1.5-10 mu m can more easily play a bridging role between the coupled modified graphene oxide with the average particle size of 5-10 mu m, and the heat conduction effect of the material can be improved.
Preferably, the average particle size of the silicon carbide is 1.5 μm, and the average particle size of the coupled modified graphene oxide is 8 μm.
By adopting the technical scheme, the thermal conductivity of the TPU can be further improved when the average particle size of the silicon carbide is 1.5 mu m and the average particle size of the coupling modified graphene oxide is 8 mu m.
Preferably, the high thermal conductivity TPU material also comprises 5-10 parts of nano copper oxide.
By adopting the technical scheme, the metal ions have good thermal conductivity, and the thermal conductivity of the TPU can be improved; meanwhile, the nano copper oxide also has an antibacterial effect, and the safety of the material is improved.
In a second aspect, the application provides a preparation method of a high thermal conductivity TPU material, which adopts the following technical scheme:
a preparation method of a high-thermal-conductivity TPU material is characterized by comprising the following steps:
drying the master batch: drying the TPU master batch and the PVC master batch at the temperature of 60-70 ℃ for 10-12h to obtain dried TPU master batch and dried PVC master batch;
melt blending: weighing the raw materials, and melting and blending the raw materials for 10-15min at the melting temperature of 150-160 ℃ to obtain a blend; and (3) extruding and granulating: and crushing the blend, and then extruding and granulating to obtain the high-thermal-conductivity TPU material, wherein the extrusion temperature is 140-160 ℃.
By adopting the technical scheme, the raw materials can be uniformly mixed, so that the effect of the raw materials is more easily exerted; meanwhile, the prepared product has the comprehensive properties of heat conductivity, antibacterial property and rebound resilience; in order to ensure that the drying effect is better, the drying temperature of the master batch can be 60 ℃, 65 ℃ and 70 ℃, and the drying time can be 10h, 11h and 12 h; the melt blending time can be 10min, 11min, 12min, 13min, 14min and 15min, the temperature can be 150 ℃, 155 ℃ and 160 ℃, and the TPU master batch and the PVC master batch can be uniformly and efficiently mixed.
Preferably, the preparation process of the coupled modified graphene oxide comprises the following steps: adding a graphene oxide aqueous solution into a silane coupling agent ethanol solution, uniformly mixing, adding a hydrochloric acid solution to adjust the pH to 5-6, heating to 50-60 ℃, reacting for 1-2h, filtering, washing and drying to obtain the coupling modified graphene oxide, wherein the weight ratio of the graphene oxide to the silane coupling agent is 5: 1.
by adopting the technical scheme, the graphene oxide subjected to coupling modification and the TPU can have better compatibility, and the heat conduction effect of the graphene oxide can be better exerted; in order to provide the coupling reaction conditions, the pH value can be 5 or 6, the heating temperature can be 50 ℃, 55 ℃ and 60 ℃, and the reaction time can be 1h, 1.5h and 2 h.
Preferably, in the melt blending step, granular silicon carbide with the weight ratio of 1:1-3 to the coupled and modified graphene oxide is further added.
By adopting the technical scheme, the silicon carbide and the raw materials can be uniformly mixed, and the effect of the silicon carbide can be better exerted.
Preferably, in the step of melt blending, 5-10 parts by weight of copper oxide with the average particle size of 500-800nm is also added.
By adopting the technical scheme, the copper oxide and the raw materials can be uniformly mixed, and the effect of the copper oxide can be better exerted.
In summary, the present application has the following beneficial effects:
1. the impact strength of the TPU can be improved by mixing the PVC and the TPU, internal devices can be protected when the material is made into a protective shell, and the internal devices are not easily damaged by impact; the light stabilizer can improve the anti-aging performance of the material and prolong the service time of the material; the compatibility of the graphene oxide and a high-molecular system can be improved through coupling modification treatment of the coupling modified graphene oxide, the coupling modified graphene oxide and the TPU material are blended to form a protective shell, and heat dissipated by running of an electronic device in the shell can be conducted through the coupling modified graphene oxide in the material, so that the heat conductivity of the TPU material is improved;
2. the silicon carbide is added in the application, the silicon carbide has high thermal conductivity, and the introduction of the silicon carbide can increase the thermal conductivity of the high-thermal-conductivity TPU material; simultaneously, the carborundum of granular structure can play the bridging effect between the piece of coupling modified graphene oxide and piece, makes the filler of different dimensions more closely knit in TPU fills, helps the heat transfer of material, and carborundum and coupling modified graphene oxide synergism have further promoted the heat conductivity of material.
Detailed Description
At present, most of used TPU materials are prepared by copolymerizing polyether polyol or polyester polyol, diphenylmethane diisocyanate or toluene diisocyanate and micromolecular polyol, the prepared TPU has good rebound resilience, but the thermal conductivity of the TPU material is low and is only 0.035W/(m.K), and after the TPU material is prepared into a protective shell, the heat dissipation of products in the protective shell is not facilitated; the inventor finds in research that the thermal conductivity of the TPU material can be effectively improved by adding the graphene with high thermal conductivity into the TPU material; simultaneously, the addition of the silicon carbide and the graphene can play a synergistic effect together, and the heat conductivity of the TPU material is further improved.
The present application will be described in further detail with reference to examples.
The raw materials used in the method are all commercial products, the TPU master batch is polyether type TPU master batch, and the molecular weight is 30000-33000; the PVC master batch has the model of SG-5 and the molecular weight of 50000-60000; graphene oxide with average particle sizes of 5 μm, 8 μm, 10 μm; the average grain size of the silicon carbide is 1.5 mu m, 5 mu m and 10 mu m; the particle size of the nano copper oxide is 500-800 nm; the light stabilizer is UV-944 light stabilizer.
Examples of preparation of raw materials
Preparation example 1
Preparation of a coupling agent solution: uniformly mixing 150g of graphene oxide with the average particle size of 5 mu m and 7500g of deionized water to obtain a mixed solution A; 30g of gamma-aminopropyltriethoxysilane was weighed out and mixed with 150g of absolute ethanol and dissolved by stirring to give solution B.
Coupling modification reaction: adding the solution B into the solution A to obtain a mixed solution C, carrying out ultrasonic treatment on the mixed solution C for 1 hour, stirring for 20 minutes, then adjusting the pH value of the mixed solution C to 5 by using 3mol/L hydrochloric acid to obtain a mixed solution D, reacting the mixed solution D in a water bath at 60 ℃ for 2 hours, cooling to room temperature, carrying out centrifugation for 3 times at a centrifugation rotation speed of 8000rmp/min, washing for 3 times, drying at 70 ℃ for 3 hours, and drying to obtain the coupling modified graphene oxide.
Preparation example 2
Preparation of a coupling agent solution: uniformly mixing 20g of graphene oxide with the average particle size of 10 mu m and 1000g of deionized water to obtain a mixed solution A; 4g of gamma-aminopropyltriethoxysilane was weighed out and mixed with 20g of absolute ethanol and dissolved by stirring to give solution B.
Coupling modification reaction: adding the solution B into the solution A to obtain a mixed solution C, carrying out ultrasonic treatment on the mixed solution C for 0.5h, then stirring for 10 minutes, then adjusting the pH value of the mixed solution C to 5 by using 3mol/L hydrochloric acid to obtain a mixed solution D, reacting the mixed solution D in a water bath at 60 ℃ for 1h, cooling to room temperature, carrying out 3-time centrifugation at a centrifugation speed of 8000rmp/min, washing for 3 times, drying at 70 ℃ for 3 hours, and drying to obtain the coupled modified graphene oxide.
Preparation example 3
Preparation of a coupling agent solution: uniformly mixing 70g of graphene oxide with the average particle size of 8 mu m and 3500g of deionized water to obtain a mixed solution A; 14g of gamma-aminopropyltriethoxysilane was weighed out and mixed with 70g of absolute ethanol and dissolved by stirring to give solution B.
Coupling modification reaction: adding the solution B into the solution A to obtain a mixed solution C, carrying out ultrasonic treatment on the mixed solution C for 1 hour, stirring for 15 minutes, then adjusting the pH value of the mixed solution C to 5 by using 3mol/L hydrochloric acid to obtain a mixed solution D, reacting the mixed solution D in a water bath at 60 ℃ for 1.5 hours, cooling to room temperature, carrying out 3-time centrifugation at a centrifugation speed of 8000rmp/min, washing for 3 times, drying at 70 ℃ for 3 hours, and drying to obtain the coupling modified graphene oxide.
Examples
Examples 1 to 5
Taking the example 1 as an example, the preparation method of the high thermal conductivity TPU material comprises the following steps:
drying the master batch: and drying the TPU master batch and the PVC master batch at 70 ℃ for 10h to obtain the dried TPU master batch and the dried PVC master batch.
Melt blending: the raw materials were weighed according to table 1 and melt blended for 15min at a melting temperature of 160 ℃ to obtain a blend.
And (3) extruding and granulating: and crushing the blend, putting the crushed blend into an extruder for melt extrusion, and then cutting and granulating to obtain the TPU material with the particle size of 3-5mm, wherein 4 intervals are arranged between a feed inlet and a discharge outlet of the extruder, the temperature of each interval is 140 ℃, 155 ℃, 160 ℃ and 160 ℃, the temperature of the interval close to the feed inlet is properly reduced to prevent agglomeration from blocking the feed inlet, is 140 ℃, and the temperature of the interval at the discharge outlet is 160 ℃, so that the TPU material with high thermal conductivity is obtained.
Table 1 shows the raw materials of the high thermal conductive TPU materials of the embodiments, wherein the coupling modified graphene oxide used is provided in preparation example 1.
TABLE 1
Examples 6 to 10
As shown in table 2, compared with example 5, the high thermal conductive TPU materials of examples 6 to 10 are mainly different in that silicon carbide is added to the raw material, and the average particle size of the silicon carbide is 10 μm in examples 6 to 8, and the coupling modified graphene oxide used is provided by preparation example 1; the average particle size of the silicon carbide in example 9 was 5 μm, and the coupling-modified graphene oxide used was provided by preparation example 2; the particle size of the silicon carbide in example 10 was 1.5 μm, and the coupling-modified graphene oxide used was provided by preparation example 3.
The preparation method of example 6 is different from the preparation method of example 5 in that silicon carbide is added in a weight ratio of 1:1 of silicon carbide to the coupled modified graphene oxide in the melt mixing process; the preparation method of example 7 is different from the preparation method of example 5 in that silicon carbide is added in a weight ratio of 1:2 of silicon carbide to the coupled modified graphene oxide during melt mixing; the preparation method of example 8 is different from the preparation method of example 5 in that silicon carbide is added in a weight ratio of 1:3 of silicon carbide to the coupled modified graphene oxide during melt mixing; the preparation of examples 9-10 was carried out in the same manner as in example 7.
TABLE 2
Examples 11 to 13
As shown in Table 3, compared with example 10, the high thermal conductive TPU materials of examples 11-13 are mainly different in that nano copper oxide with the particle size of 500-800nm is added in the raw material.
Taking example 11 as an example, the preparation method is different from the preparation method in example 10 in that nano copper oxide is added in the mass according to the table 3 in the process of melt mixing.
TABLE 3
Comparative example
Comparative example 1
Compared with example 1, the main difference of the high thermal conductivity TPU material is that no coupling modified graphene oxide is added in the raw materials.
Comparative example 2
Compared with example 6, the main difference of the high thermal conductivity TPU material of comparative example 2 is that the addition amount of the coupling modified graphene oxide in the raw material is 30g, and no silicon carbide is added.
Comparative example 3
Compared with example 6, the main difference of the high thermal conductivity TPU material in comparative example 3 is that the addition amount of silicon carbide in the raw material is 30g, and coupling modified graphene oxide is not added.
Performance test
The detection method comprises the following steps:
each test sample strip is molded by the prepared master batch through a press vulcanizer, the molding temperature is 160 ℃, the molding time is 600s, and the pressure is 10 nPa.
And (3) testing tensile property: according to GB/T13022-91, the sample strips are dumbbell-shaped, the stretching speed is 50mm/min, the average number of 5 sample strips in each group is taken, and the sample size is 150 multiplied by 20 multiplied by 3mm3。
And (3) impact performance test: notched Izod impact testing was carried out using an impact tester according to GB/T1843-2008, 5 specimens per group were taken as the average, the sample size was 100X 10X 4mm3。
And (3) resilience testing: measured according to GB6670, the steel ball diameter is 16mm, the ball drop height is 460mm, and the sample size is 50X 30mm3。
And (3) testing the thermal conductivity: the test was carried out according to GB/T22588, the sample size being a disc of 12.7mm diameter and 1.5mm thickness.
And (3) antibacterial testing: test according to GB T31402, staphylococcus aureus, strain number DSM 346; escherichia coli with strain number DSM 1576; sample size 50X 5mm3。
And (3) testing the ageing resistance: drying samples of various models in a forced air drying oven at the temperature of 70 ℃ for 500h, and irradiating the samples by using an ultraviolet lamp with the power of 30W; and then, carrying out mechanical property test and resilience test on each sample.
The results of the above mechanical properties, rebound resilience, thermal conductivity and antibacterial properties are shown in table 4.
TABLE 4
As can be seen by combining examples 1-5 with Table 4, the material of example 5 has the highest thermal conductivity, and the tensile strength, impact strength and resilience of examples 1-5 are not very different; it can be seen from the combination of examples 5 and 6 that the thermal conductivity of the material is significantly improved after the silicon carbide is added, which indicates that the thermal conductivity of the TPU material can be improved by adding the silicon carbide. The highest thermal conductivity of example 7, seen in conjunction with examples 6-8, indicates that the material has the best thermal conductivity when the weight ratio of silicon carbide to coupled modified graphene oxide is 1: 2. The best thermal conductivity of example 10 can be seen in combination with example 7 and examples 9-10, which shows that when the particle size of the silicon carbide is 1.5 and the particle size of the coupled modified graphene oxide is 8, the best thermal conductivity of the material is obtained. It can be seen from the combination of example 10 and example 11 that the thermal conductivity of example 11 is higher than that of example 10, and the antibacterial performance of example 11 is greatly improved, which shows that the addition of silicon carbide can improve the thermal conductivity and antibacterial performance of the material. It can be seen from the combination of examples 12-13 that the thermal conductivity and antibacterial property of examples 12 and 13 are close, which shows that the thermal conductivity and antibacterial property of the material tend to be stable with the increase of the nano copper oxide.
Combining example 1 and comparative example 1, it can be seen that the thermal conductivity of example 1 is much higher than that of comparative example 1, which shows that the thermal conductivity of the material can be greatly improved by adding the coupling modified graphene oxide. As can be seen by combining example 6 with comparative examples 2 to 3, example 6 has a higher thermal conductivity than comparative examples 2 and 3, this shows that the thermal conductivity of the silicon carbide and the coupling modified graphene oxide added with the same mass is better than that of the coupling modified graphene oxide added alone or the silicon carbide added alone, this shows that the silicon carbide and the coupling modified graphene oxide can generate a synergistic effect to improve the heat conductivity of the material, the reason is probably that the coupled modified graphene oxide and the silicon carbide have good heat conducting performance, the coupled modified graphene oxide is of a two-dimensional lamellar structure, the silicon carbide is of a zero-dimensional granular structure, the granular silicon carbide is dispersed among the coupled modified graphene oxide, the bridging effect is achieved between the coupled modified graphene oxide, substances between different dimensions are inserted to enable the structure to be more compact, and the heat conducting performance of the TPU material is improved.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (10)
1. The high-thermal-conductivity TPU material is characterized by being prepared from the following raw materials in parts by weight: 800 parts of TPU master batch, 200 parts of PVC master batch, 10-20 parts of coupling modified graphene oxide and 10-30 parts of light stabilizer.
2. A highly thermally conductive TPU material as set forth in claim 1 wherein: the raw material also comprises silicon carbide with a granular structure, and the weight ratio of the silicon carbide to the coupling modified graphene oxide is 1: 1-3.
3. A highly thermally conductive TPU material as set forth in claim 2 wherein: the weight ratio of the silicon carbide to the coupling modified graphene oxide is 1: 2.
4. A highly thermally conductive TPU material as set forth in claim 3 wherein: the average particle size of the silicon carbide is 1.5-20 mu m, and the average particle size of the coupling modified graphene oxide is 5-10 mu m.
5. A highly thermally conductive TPU material as set forth in claim 4 wherein: the average particle size of the silicon carbide is 1.5 mu m, and the average particle size of the coupling modified graphene oxide is 8 mu m.
6. A highly thermally conductive TPU material as set forth in claim 5 wherein: the high-thermal-conductivity TPU material also comprises 5-10 parts of nano copper oxide.
7. A method for preparing a highly thermally conductive TPU material as set forth in claim 1 including the steps of:
drying the master batch: drying the TPU master batch and the PVC master batch at the temperature of 60-70 ℃ for 10-12h to obtain dried TPU master batch and dried PVC master batch;
melt blending: weighing the raw materials, and melting and blending the raw materials for 10-15min at the melting temperature of 150-160 ℃ to obtain a blend;
and (3) extruding and granulating: and crushing the blend, and then extruding and granulating to obtain the high-thermal-conductivity TPU material, wherein the extrusion temperature is 140-160 ℃.
8. The preparation method of the high thermal conductivity TPU material of claim 7, wherein the preparation process of the coupling modified graphene oxide is as follows: adding a graphene oxide aqueous solution into a silane coupling agent ethanol solution, uniformly mixing, adding a hydrochloric acid solution to adjust the pH to 5-6, heating to 50-60 ℃, reacting for 1-2h, filtering, washing and drying to obtain the coupling modified graphene oxide, wherein the weight ratio of the graphene oxide to the silane coupling agent is 5: 1.
9. the preparation method of the high thermal conductivity TPU material of claim 8, wherein in the step of melt blending, granular silicon carbide with the weight ratio of 1:1-3 to the coupled and modified graphene oxide is further added.
10. The method for preparing the TPU material with high thermal conductivity of claim 9, wherein the step of melt blending further comprises adding 5 to 10 parts by weight of nano copper oxide.
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