CN112958479A - Flexible circuit board pad detection sorting device and using method thereof - Google Patents
Flexible circuit board pad detection sorting device and using method thereof Download PDFInfo
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- CN112958479A CN112958479A CN202110173679.4A CN202110173679A CN112958479A CN 112958479 A CN112958479 A CN 112958479A CN 202110173679 A CN202110173679 A CN 202110173679A CN 112958479 A CN112958479 A CN 112958479A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/3416—Sorting according to other particular properties according to radiation transmissivity, e.g. for light, x-rays, particle radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
Abstract
The invention provides a flexible circuit board pad detecting and sorting device which comprises a to-be-detected product conveying device, an infrared detecting device and a controller, wherein the conveying device is used for conveying a to-be-detected product; the controller is electrically connected with the infrared detection device; the infrared detection device detects a flexible circuit board to be detected on the product conveying device to be detected, and the controller controls the infrared detection device to sort the flexible circuit board to be detected according to the infrared spectrum detected by the infrared detection device. The device's detection efficiency is high, can not cause any damage to the product, washs through detecting the back, can reduce the product defective rate, shortens long time of production.
Description
Technical Field
The invention relates to a flexible circuit board pad detecting and sorting device and a using method thereof, belonging to the technical field of flexible circuit board preparation.
Background
A Flexible Printed Circuit (FPC) is a highly reliable and excellent Flexible Printed Circuit board made of polyimide or polyester film as a base material. The high-density light-weight LED lamp has the characteristics of high wiring density, light weight, thin thickness and good bending property. With the rapid development of electronics and communications industries, the demand and the date of flat panel displays such as liquid crystal and plasma have increased dramatically. In recent years, 3C electronic products are light, thin, small and small, which requires a new generation of electronic packaging technology with high density, small volume, and free mounting and dismounting to meet the above requirements. The flexible circuit board has obvious superiority in the application of electronic and communication industries. The flexible circuit board requires that the product pad can be completely welded with solder when electronic packaging is carried out, and the surface of the pad is inevitably stained with some pollutants in the production process, so that the solderability of the pad is influenced. At present, generally adopt plasma belt cleaning device to wash, but plasma belt cleaning device's cleaning efficiency is low, and it is long to consume the worker time, is not suitable for once only wasing whole product pads, so need with the product pad through detecting the letter sorting back, with the pad have the product letter sorting of pollutant come out, make it have the practicality again after carrying out plasma cleaning again, then can improve production efficiency on the basis of guaranteeing the qualification rate.
At present, the detection technology of the flexible circuit board bonding pad comprises appearance inspection, X-ray test, microsection analysis, SEM analysis and X-ray energy spectrum analysis. However, these detection techniques can only detect what kind of elements the contaminants on the surface of the flexible circuit board pad contain, and have high uncertainty, and these techniques are all tested on the basis of sample destruction, and the sample cannot be used continuously after the test.
Disclosure of Invention
The invention provides a flexible circuit board pad detecting and sorting device and a using method thereof, which can effectively solve the problems.
The invention is realized by the following steps:
a flexible circuit board pad detection sorting device comprises a to-be-detected product conveying device, an infrared detection device and a controller; the controller is electrically connected with the infrared detection device; the infrared detection device comprises an interferometer; the infrared detection device detects a flexible circuit board to be detected on the product conveying device to be detected, and the controller controls the infrared detection device to sort the flexible circuit board to be detected according to the infrared spectrum detected by the infrared detection device.
As a further improvement, the to-be-tested product conveying device comprises a to-be-tested product placing platform, a product detection platform, a pollution-free product placing platform and a to-be-cleaned product placing platform; the product placing platform that awaits measuring with connect through the conveyer belt between the product testing platform, product testing platform with connect through the conveyer belt between the pollution-free product placing platform, product testing platform with wait to wash and connect through the conveyer belt between the product placing platform.
As a further improvement, the infrared detection device comprises an infrared light source, a detector and a shifting sheet; the infrared light source emits infrared rays to irradiate and transmit the infrared rays to a bonding pad of the flexible circuit board to be detected on the product detection platform, and the detector detects the infrared spectrum of the bonding pad of the flexible circuit board; the controller judges whether the bonding pad of the flexible circuit board to be detected is polluted or not according to the infrared spectrum of the bonding pad of the flexible circuit board detected by the detector; if the flexible circuit board is polluted, the controller controls the shifting piece to act, and the polluted flexible circuit board is shifted to the product to be cleaned; if no pollution exists, the controller controls the shifting piece not to act, and the pollution-free flexible circuit board is conveyed to the pollution-free product placing platform along with the conveying belt.
As a further improvement, a cleaning device is arranged at the downstream of the product placement platform to be cleaned.
As a further improvement, the cleaning device is a plasma cleaning device.
As a further improvement, the interferometer includes a fixed mirror, a beam splitter, and a movable mirror.
A flexible circuit board pad detection sorting method is characterized in that the flexible circuit board pad detection sorting device is used for placing a flexible circuit board to be detected on a product conveying device to be detected, and an infrared detection device is used for detecting a pad of the flexible circuit board to be detected; and the controller controls the infrared detection device to sort the flexible circuit board to be detected according to the infrared spectrum detected by the infrared detection device.
As a further improvement, the conveying speed of the conveying device for the product to be detected is 0.8m/min-2 m/min.
As a further improvement, the distance between the infrared ray emitting point of the infrared detection device and the bonding pad of the flexible circuit board is 3cm-5 cm.
As a further improvement, the infrared spectrum radical frequency range collected by the infrared detection device is 670cm-1-4000cm-1。
The invention has the beneficial effects that:
according to the flexible circuit board pad detecting and sorting device, products with pollutants on the pads are sorted out through infrared detection and analysis, so that the time consumption for cleaning all the products with plasma is not required, and the production efficiency is improved.
The flexible circuit board pad detecting and sorting device disclosed by the invention utilizes the principle of infrared spectrum, does not cause any damage to products, and can still be used after detection is finished.
The flexible circuit board pad detecting and sorting device disclosed by the invention can reduce the reject ratio of products and shorten the production time by cleaning after detection.
The flexible circuit board pad detection sorting device is further provided with the interferometer, after the infrared light is converted into two beams of light through the interferometer, the two beams of light interfere with the flexible circuit board pad to be detected, and then the flexible circuit board is detected.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a flexible circuit board pad inspection and sorting apparatus according to an embodiment of the present invention.
FIG. 2 is a comparative infrared spectrum of a standard non-contaminating pad flexible circuit board.
Reference numerals:
the device comprises a light source 1, a fixed mirror 2, a beam splitter 3, a movable mirror 4, a shifting piece 5, a flexible circuit board 6, a conveyor belt 7, a detector 8 and a controller 9.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1
Referring to fig. 1, an embodiment of the present invention provides a flexible circuit board pad detecting and sorting apparatus, which includes a to-be-detected product conveying apparatus, an infrared detecting apparatus, and a controller 9. The product conveying device to be detected comprises a product placing platform to be detected, a product detection platform, a pollution-free product placing platform and a product placing platform to be cleaned. The product placing platform that awaits measuring with connect through the conveyer belt between the product testing platform, product testing platform with connect through the conveyer belt between the pollution-free product placing platform, product testing platform with wait to wash and connect through the conveyer belt between the product placing platform. The controller 9 is electrically connected with the infrared detection device. The infrared detection device comprises an infrared light source 1, a detector 8 and a shifting piece 5. The infrared detection device further comprises an interferometer. The infrared light source 1 emits infrared rays to irradiate a bonding pad of the flexible circuit board to be detected, and the detector 8 detects the infrared spectrum of the bonding pad of the flexible circuit board. The controller 9 judges whether the pad of the flexible circuit board to be detected is polluted according to the infrared spectrum of the pad of the flexible circuit board detected by the detector 8; if the flexible circuit board is polluted, the controller 9 controls the shifting piece to act, and the polluted flexible circuit board is shifted to the product to be cleaned; if no pollution exists, the controller 9 controls the poking sheet 5 not to act, and the pollution-free flexible circuit board is conveyed to the pollution-free product placing platform along with the conveying belt.
As a further improvement, a cleaning device is arranged at the downstream of the product placement platform to be cleaned.
As a further improvement, the cleaning device is a plasma cleaning device, and can perform plasma cleaning on the product to be cleaned. The cleaned flexible circuit board can be used continuously.
As a further improvement, the interferometer comprises a fixed mirror 2, a beam splitter 3 and a movable mirror 4. The infrared light needs to be converted into interference light through an interferometer. After the infrared light is converted into two beams of light by the interferometer, the infrared light interferes with a bonding pad of the flexible circuit board to be detected, and then the flexible circuit board is detected.
As a further improvement, the light source is a continuous infrared radiation source emitted by a Nernst lamp or a silicon carbide rod. The Nernst lamp emits infrared light with continuously changing frequency after being heated. The continuous infrared light energy ensures that the flexible circuit board is continuously detected without missing detection.
The principle that the flexible circuit board pad detecting and sorting device detects by using infrared light is as follows:
the Nernst lamp sends frequency continuous variation's infrared light through heating back, and the infrared light changes two bundles of light backs through the interferometer, through the continuous movement of moving the mirror, takes place the interference phenomenon with the flexible circuit board pad that awaits measuring: 1) when the optical path difference of the two beams of light is even multiple of half wavelength, the coherent light collected by the detector is mutually superposed to generate a bright line, and the coherent light intensity has a maximum value; 2) when the optical path difference of the two beams of light is odd times of the half wavelength, the coherent light collected by the detector is mutually counteracted to generate a dark line, and the coherent light intensity has a minimum value. When a molecule absorbs radiation of certain frequencies and a net change in dipole moment is induced by its vibrational or rotational motion, a transition in molecular vibrational and rotational energy levels from the ground state to the excited state is produced, resulting in a reduction in the intensity of transmitted light corresponding to these absorption regions. And recording the relation curve of the transmittance of the infrared light and the wave number to obtain the infrared spectrum of the flexible circuit board. Carrying out a large amount of detection on the pollution-free flexible circuit board to obtain an infrared spectrum as a reference spectrum; when the bonding pad is polluted, the detector obtains an infrared spectrogram which is not completely consistent with the reference spectrum, the controller responds to the infrared spectrogram, and the shifting piece is controlled to shift the flexible circuit board polluted by the bonding pad to the conveying belt of the product to be cleaned, so that the effect of sorting the product is achieved.
In the prior art at present, whether the flexible circuit board has pollution or not is not detected by independently adopting infrared rays, because: on one hand, the test board of the existing infrared spectrometer has limited space, and if the flexible circuit board needs to be detected, a sample needs to be cut to a proper size for testing, so that time is consumed and the flexible circuit board is damaged; on the other hand, the pollutants on the flexible circuit board are usually only trace and widely dispersed on the surface of the flexible circuit board, but the existing infrared spectrometer has a large measurement area and is difficult to accurately detect the pollutants on the surface of the bonding pad of the flexible circuit board. According to the invention, infrared light with continuously changed frequency is emitted after being heated by the Nernst lamp, after the infrared light is converted into two beams of light by the interferometer, the interference phenomenon is generated between the infrared light and the bonding pad of the flexible circuit board to be detected through the continuous movement of the movable mirror, and then the flexible circuit board is detected, so that the infrared detection method has small energy loss of the infrared light, can be used for detecting trace organic matters on the bonding pad of the flexible circuit board, and has short test time.
The infrared spectrum of the flexible circuit board is the reflection of the molecular structure of the flexible circuit board, and the absorption peaks in the spectrum correspond to the vibration forms of all groups in the molecules. The surface of the flexible circuit board pad is metal, and the infrared spectrum mainly detects covalent bonds, so the radical frequency of the substrate PI is generally measured. The radical frequencies as the reference spectrum of the flexible circuit board pad, i.e. the infrared spectrum of the normal pad, are: 3342cm-1(Primary amine N-H stretching vibration) 2928cm-1And 2859cm-1(C-H stretching vibration of aldehydes) 1714cm-1And 1688cm-1(aldehyde C ═ O stretching vibration) 1606cm-1(Secondary amine N-H in-plane bend) 1507cm-1And 1461cm-1(benzene ring skeleton) 1361cm-1(alkyl-C (CH)3 in-plane bending vibration), 1234cm-1(Cyclic acid anhydride C-O stretching vibration) 1181cm-1(phenol C-0 stretching vibration) of 1105cm-1(benzene ring C-H in-plane curvature), 1039cm-1(C-H telescopic vibration of alcohols) 828cm-1(benzene ring 1, 2, 3, 4 tetra-substituted C-H in-plane bending) 633cm-1(acetylenic C-H out-of-plane curvature). These characteristic radical frequencies are recorded by the controller as radical frequencies of the control spectrum. If the position and shape of each absorption peak of the two spectra are identical and the relative intensities of the peaks are the same, the sample can be considered as the standard. If the two spectra are different or the peak positions are not consistent, the two spectra are not the same compound or the sample has impurities. When the detector collects other wave crests of the flexible circuit board with the polluted bonding pad, wherein the wave crests are different from the wave numbers of the radical frequencies, the controller identifies and controls the poking sheet to poke the flexible circuit board with the polluted bonding pad to a conveying belt flowing to a to-be-cleaned placing area, and unqualified products are sorted out.
A flexible circuit board pad detection sorting method comprises the steps that the flexible circuit board 6 to be detected is placed on a product placing platform to be detected by using the flexible circuit board pad detection sorting device, the flexible circuit board to be detected is conveyed to the product detection platform through a conveying belt, and the pad of the flexible circuit board to be detected is detected by the infrared detection device; if the pollution is detected, the controller controls the poking sheet to act, and the flexible circuit board with the pollution is poked to the product to be cleaned; if no pollution is detected, the controller controls the shifting piece not to act, and the pollution-free flexible circuit board is conveyed to the pollution-free product placing platform along with the conveying belt. The method can efficiently detect whether the bonding pad can not reject welding in subsequent electronic packaging, and ensures the qualified rate of the finished flexible circuit board.
As a further improvement, the conveying speed of the conveyor belt is 0.8m/min-2 m/min. By using the infrared spectrum principle, the detection speed is extremely high, and an infrared spectrogram of a circuit board bonding pad can be obtained within one second, so that the speed of a conveyor belt on the device is matched with the detection time required by the bonding pad.
As a further improvement, the distance between the infrared ray emitting point and the bonding pad of the flexible circuit board is 3cm-5 cm. The infrared light only tests the pad area, so the distance between the interference beam and the pad to be tested is controlled in a reasonable range to ensure that the beam is not dispersed, and the detection accuracy and the capability of detecting trace pollutants are improved. The general size of the bonding pad is 0.5mm2-2mm2The distance between the bonding pad and the emitting point of the interference light beam can be controlled to be 3cm-5 cm; the resolution of the infrared light can reach 2cm-1-0.005cm-1。
As a further improvement, the detector of the infrared detection device collects infrared spectrum radical frequency range of 670cm-1-4000cm-1. In this frequency range, the flexible circuit board with contamination and the flexible circuit board without contamination can be accurately distinguished, and beyond this range, the detection accuracy is reduced.
As a further improvement, the flexible circuit board can be a double-sided board or a single-sided board; double-sided boards are then tested once on the device on both sides.
After the bonding pad is subjected to the nickel-gold melting process, the bonding pad is required to pass the solderability test and the dip solderability test. Before the gold melting process and the product shipment, the circuit board also needs to be subjected to main processes such as silk-screen printing, reinforcement, punching and the like. These processes have some substances in contact with the pads due to product requirements, including coverlay film, TPX, release film, matte film, low-tack film, screen printing ink. The above substances may leave compounds on the bonding pad to cause solder failure of the bonding pad. The detection sensitivity of the flexible circuit board pad detection sorting device is extremely high, and the trace amount of pollutants can still be detected from different peak shapes of standard maps. The infrared light detection does not cause damage and pollution to the bonding pad to any degree, and the circuit board can still be normally used after the test is finished. The method can greatly reduce the possibility of solder refusal.
The detector may be a high vacuum thermocouple, a pyroelectric detector, or a mercury cadmium telluride detector.
The cleaning method of the plasma cleaning device is characterized in that gas such as oxygen, argon and the like is excited into an ionic state under the excitation of a radio frequency power supply and is subjected to physical reaction or chemical reaction with the surface of a substance to be cleaned, so that the dirt is cleaned. The bonding pad with the pollutants is detected by using plasma cleaning, the pollutants on the surface of the bonding pad can be effectively removed, and the infrared test can be smoothly passed when the bonding pad is detected again.
In one embodiment, the plasma cleaning apparatus uses nitrogen, oxygen, carbon tetrafluoride as a working gas, and the processing temperature is 40 ℃. The cleaning effect is good by using nitrogen, oxygen and carbon tetrafluoride as working gas, and pollutants on the surface of the welding-resistant welding pad can be effectively removed, so that the welding pad has weldability again.
The following embodiments 2 to 8 all use the flexible circuit board pad inspection and sorting apparatus described in the present embodiment.
Example 2
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried pollution-free pad flexible circuit board finished product on a to-be-tested product placing platform; and the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, the peak shape of each group of the infrared spectrum detected by the detector is consistent with the peak shape of the standard spectrum, and the controller controls the shifting sheet to be fixed; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
And S4, the pollution-free pad flexible circuit board is transmitted to a pollution-free product placing platform through testing.
The position and the shape of each absorption peak of the normal pad infrared spectrogram and the standard spectrogram are completely the same, and the relative intensities of the peaks are the same, so that the sample can be considered as a flexible circuit board without pollution on the pad.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds. And the 22 pollution-free welding disc flexible circuit boards are all transmitted to a pollution-free product placing platform, so that the test precision is high.
Example 3
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried flexible circuit board finished product with the bonding pad polluted by the covering film on a placing platform of a product to be detected, wherein the pollution amount is 0.05mg/mm2. And the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, detecting that the peak shape of each group of the infrared spectrum of the sample is inconsistent with the peak shape of the standard spectrum by the detector, and identifying and controlling the shifting sheet to shift the sample to a product placement platform to be cleaned by the controller; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
S4, putting the product into a plasma cleaning device for cleaning; wherein, the working gas of the plasma cleaning device is nitrogen, oxygen and carbon tetrafluoride; the treatment temperature was 40 ℃.
The infrared spectrum peak shape detected by the flexible circuit board with the polluted bonding pad is 1775cm-1(chain acid anhydride C ═ 0 symmetric stretching vibration), 1166cm-1(chain acid anhydride C-0 symmetric stretching vibration) 1497cm-1(alkanes C-H in-plane bending) 809cm-1The (in-plane bending of olefins C-H) and the like peaks were detected to be different from the standard spectrum, and thus were recognized and sorted by the controller, followed by the cleaning treatment in the plasma cleaning apparatus.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds;
and the 22 polluted flexible circuit boards are all sorted to a product placing platform to be cleaned, and the testing precision is high.
Example 4
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried flexible circuit board finished product with the bonding pad polluted by TPX on a product placing platform to be tested, wherein the pollution amount is 0.05mg/mm2. And the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, detecting that the peak shape of each group of the infrared spectrum of the sample is inconsistent with the peak shape of the standard spectrum by the detector, and identifying and controlling the shifting sheet to shift the sample to a product placement platform to be cleaned by the controller; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
S4, putting the product into a plasma cleaning device for cleaning; wherein, the working gas of the plasma cleaning device is nitrogen, oxygen and carbon tetrafluoride; the treatment temperature was 40 ℃.
2951cm in infrared spectrum peak shape detected by the flexible circuit board with contaminated bonding pad-1(methyl C-H stretching vibration) 1772cm-1(chain acid anhydride C ═ 0 symmetric stretching vibration), 1167cm-1(tertiary alcohol C-O stretching vibration) 918cm-1(alicyclic ether C-O stretching vibration) etc. peak shapes were detected to be different from the standard spectrum, and thus were recognized and sorted by the controller, followed by the cleaning treatment in the plasma cleaning apparatus.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds; 21 of the 22 polluted flexible circuit boards are sorted to a product placing platform to be cleaned, and the testing precision is high.
Example 5
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried flexible circuit board finished product with the bonding pad polluted by the release film on a product placing platform to be tested, wherein the pollution amount is 0.05mg/mm2. And the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, detecting that the peak shape of each group of the infrared spectrum of the sample is inconsistent with the peak shape of the standard spectrum by the detector, and identifying and controlling the shifting sheet to shift the sample to a product placement platform to be cleaned by the controller; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
S4, putting the product into a plasma cleaning device for cleaning; wherein, the working gas of the plasma cleaning device is nitrogen, oxygen and carbon tetrafluoride; the treatment temperature was 40 ℃.
The infrared spectrum peak shape detected by the flexible circuit board with the polluted bonding pad is 1789cm-1(chain acid anhydride C ═ 0 symmetric stretching vibration), 1324cm-1(olefins C-H in-plane bending) 1030cm-1(Primary alcohol C-O stretching vibration) 984cm-1(four-membered ring alicyclic ether C-O stretching vibration) etc. are detected to be different from the standard spectrum, and thus recognized and sorted by the controller, followed by the cleaning treatment in the plasma cleaning apparatus.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds;
and the 22 polluted flexible circuit boards are all sorted to a product placing platform to be cleaned, and the testing precision is high.
Example 6
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried flexible circuit board finished product with the bonding pad polluted by the matte silicon-free film on a product placing platform to be tested, wherein the pollution amount is 0.05mg/mm2And the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, detecting that the peak shape of each group of the infrared spectrum of the sample is inconsistent with the peak shape of the standard spectrum by the detector, and identifying and controlling the shifting sheet to shift the sample to a product placement platform to be cleaned by the controller; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
S4, putting the product into a plasma cleaning device for cleaning; wherein, the working gas of the plasma cleaning device is nitrogen, oxygen and carbon tetrafluoride; the treatment temperature was 40 ℃.
The infrared spectrum peak shape detected by the flexible circuit board with the polluted bonding pad is 1772cm-1(chain acid anhydride C ═ 0 symmetric stretching vibration) 1540cm-1(vibration of benzene ring skeleton), 1162cm-1(tertiary alcohol C-O stretching vibration) 749cm-1The (C — H out-of-plane curvature of the benzene ring) and the like peak shapes were detected to be different from the standard spectrum, and thus were recognized and sorted by the controller, followed by the cleaning treatment in the plasma cleaning apparatus.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds; and the 22 polluted flexible circuit boards are all sorted to a product placing platform to be cleaned, and the testing precision is high.
Example 7
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried flexible circuit board finished product with the bonding pad polluted by the low-viscosity film on a product placing platform to be tested, wherein the pollution amount is 0.05mg/mm2. And the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, detecting that the peak shape of each group of infrared spectrum of the sample is inconsistent with the peak shape of the standard spectrum by the detector, identifying and controlling the shifting sheet by the controller to shift the sample to a product to be cleaned and place the productOn the platform; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
S4, putting the product into a plasma cleaning device for cleaning; wherein, the working gas of the plasma cleaning device is nitrogen, oxygen and carbon tetrafluoride; the treatment temperature was 40 ℃.
The infrared spectrum peak shape detected by the flexible circuit board with the polluted bonding pad is 1698cm-1(aldehyde C-0 symmetric stretching vibration) 1278cm-1(aromatic aldehyde C ═ O vibration) 1135cm-1(chain acid anhydride C-O stretching vibration) 707cm-1The (out-of-plane bending of alcohols) etc. peak shapes were detected as different from the standard spectra and were therefore identified and sorted by the controller and subsequently subjected to the cleaning process in the plasma cleaning apparatus.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds;
and the 22 polluted flexible circuit boards are all sorted to a product placing platform to be cleaned, and the testing precision is high.
Example 8
S1, turning on an infrared light source Nernst lamp in advance for preheating, and starting testing after stable infrared radiation is emitted;
s2, placing the dried flexible circuit board finished product with the bonding pad polluted by the silk-screen printing ink on a product placing platform to be tested, wherein the pollution amount is 0.05mg/mm2And the product is conveyed to a product detection platform through a conveyor belt, and the conveying speed is 1 m/min.
S3, detecting that the peak shape of each group of the infrared spectrum of the sample is inconsistent with the peak shape of the standard spectrum by the detector, and identifying and controlling the shifting sheet to shift the sample to a product placement platform to be cleaned by the controller; the distance between the bonding pad and the emitting point of the interference light beam is controlled to be 4 cm; the infrared spectrum radical frequency range collected by the detector of the infrared detection device is 670cm-1-4000cm-1。
S4, putting the product into a plasma cleaning device for cleaning; wherein, the working gas of the plasma cleaning device is nitrogen, oxygen and carbon tetrafluoride; the treatment temperature was 40 ℃.
1712cm in infrared spectrum peak shape detected by the flexible circuit board with contaminated bonding pad-1(aldehyde C-0 symmetric stretching vibration) 1243cm-1(aromatic aldehyde C ═ O vibration), 1096cm-1(chain acid anhydride C-O stretching vibration) 723cm-1The (primary amine N-H out-of-plane curvature) isocpeaked shape was detected as different from the standard spectrum and was therefore identified and sorted by the controller and subsequently subjected to cleaning treatment in the plasma cleaning apparatus.
Each pad only needs to be tested for 1 second, and the testing time of 22 pads in the embodiment is 22 seconds;
21 of the 22 polluted flexible circuit boards are sorted to a product placing platform to be cleaned, and the testing precision is high.
Comparative example 1
The distance between the pad and the point from which the interference light beam is emitted was controlled to 2cm, and the other operations were the same as in example 3.
Only 18 of the 22 contaminated flexible circuit boards were sorted to the product placement platform to be cleaned.
Comparative example 2
The distance between the pad and the point from which the interference light beam is emitted is controlled to 5cm, and the other operations are the same as those of embodiment 3.
Only 17 of the 22 contaminated flexible circuit boards were sorted to the product placement platform to be cleaned.
Comparative example 3
The transfer speed was 0.6m/min, and the other operations were the same as in example 3.
Only 19 of the 22 contaminated flexible circuit boards were sorted to the product placement platform to be cleaned.
Comparative example 4
The conveying speed was 2.5m/min, and the other operations were the same as in example 3.
Only 16 of the 22 contaminated flexible circuit boards were sorted to the product placement platform to be cleaned.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A flexible circuit board pad detection sorting device is characterized by comprising a to-be-detected product conveying device, an infrared detection device and a controller; the infrared detection device comprises an interferometer; the controller is electrically connected with the infrared detection device; the infrared detection device detects a flexible circuit board to be detected on the product conveying device to be detected, and the controller controls the infrared detection device to sort the flexible circuit board to be detected according to the infrared spectrum detected by the infrared detection device.
2. The flexible circuit board pad detecting and sorting device according to claim 1, wherein the product to be tested conveying device comprises a product placing platform to be tested, a product detecting platform, a pollution-free product placing platform and a product to be cleaned placing platform; the product placing platform that awaits measuring with connect through the conveyer belt between the product testing platform, product testing platform with connect through the conveyer belt between the pollution-free product placing platform, product testing platform with wait to wash and connect through the conveyer belt between the product placing platform.
3. The flexible circuit board pad detecting and sorting device according to claim 2, wherein the infrared detecting device comprises an infrared light source, a detector and a pick; the infrared light source emits infrared rays to irradiate and transmit the infrared rays to a bonding pad of the flexible circuit board to be detected on the product detection platform, and the detector detects the infrared spectrum of the bonding pad of the flexible circuit board; the controller judges whether the bonding pad of the flexible circuit board to be detected is polluted or not according to the infrared spectrum of the bonding pad of the flexible circuit board detected by the detector; if the flexible circuit board is polluted, the controller controls the shifting piece to act, and the polluted flexible circuit board is shifted to the product to be cleaned; if no pollution exists, the controller controls the shifting piece not to act, and the pollution-free flexible circuit board is conveyed to the pollution-free product placing platform along with the conveying belt.
4. The flexible circuit board pad inspection and sorting apparatus of claim 2, wherein a cleaning device is further provided downstream of the product placement platform to be cleaned.
5. The flexible circuit board pad inspection and sorting apparatus of claim 3, wherein the cleaning device is a plasma cleaning device.
6. The flexible circuit board pad inspection and sorting apparatus of claim 1, wherein the interferometer includes a fixed mirror, a beam splitter and a movable mirror.
7. A method for detecting and sorting flexible circuit board pads is characterized in that the flexible circuit board pads to be detected are placed on a product conveying device to be detected by using the flexible circuit board pad detecting and sorting device of any one of claims 1 to 6, and the infrared detection device detects the pads of the flexible circuit board to be detected; and the controller controls the infrared detection device to sort the flexible circuit board to be detected according to the infrared spectrum detected by the infrared detection device.
8. The method for inspecting and sorting the bonding pads of the flexible circuit board according to claim 7, wherein the conveying speed of the conveying device for the products to be tested is 0.8m/min to 2 m/min.
9. The method for detecting and sorting the bonding pads of the flexible circuit board according to claim 7, wherein the distance between the infrared ray emitting point of the infrared detection device and the bonding pads of the flexible circuit board is 3cm-5 cm.
10. The method for detecting and sorting the bonding pads of the flexible circuit board as claimed in claim 7, wherein the infrared spectrum group frequency range collected by the infrared detection device is 670cm-1-4000cm-1。
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