CN112952343A

CN112952343A - Electronic device

Info

Publication number: CN112952343A
Application number: CN202110102781.5A
Authority: CN
Inventors: 张乾皓
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2021-01-25
Filing date: 2021-01-25
Publication date: 2021-06-11
Anticipated expiration: 2041-01-25
Also published as: CN112952343B

Abstract

The application provides an electronic device, which comprises a shell, an antenna assembly and a functional piece. The antenna assembly is at least partially arranged in the shell and comprises a radiating body and a radio frequency module, and the radiating body is electrically connected with the radio frequency module to receive and transmit electromagnetic wave signals. The functional part is arranged on the shell and is spaced from the radiator, and the functional part is used for reinforcing the strength of the shell and compensating the radiation efficiency of the radiator. The electronic equipment provided by the application can compensate the radiation efficiency of the radiator due to the functional piece, so that the overall system efficiency of the electronic equipment is improved.

Description

Electronic device

Technical Field

The application relates to the technical field of electronics, in particular to electronic equipment.

Background

With the rapid development of wireless communication technology, fifth generation (5G) wireless communication systems have been increasingly used commercially. However, since the space of the electronic device is limited, the antenna is limited, and thus, the radiation performance of the antenna cannot be guaranteed.

Disclosure of Invention

The application provides an electronic device capable of improving antenna radiation performance.

In one aspect, the present application provides an electronic device comprising:

a housing;

the antenna assembly is at least partially arranged in the shell and comprises a radiator and a radio frequency module, and the radiator is electrically connected with the radio frequency module to receive and transmit electromagnetic wave signals; and

the functional part, the functional part is located on the casing, and with irradiator looks interval, the functional part is used for increasing the intensity of casing reaches the functional part is used for right the radiant efficiency of irradiator compensates.

The application provides an electronic equipment is through setting up the antenna module in the casing to set up the function piece on the casing, make the function piece compensate the radiant efficiency of the irradiator of antenna module when strengthening casing intensity, thereby make the whole antenna radiation performance that has higher intensity and preferred of electronic equipment.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below.

Fig. 1 is a schematic plan view of an electronic device provided in an embodiment of the present application;

FIG. 2 is a schematic structural diagram of the electronic device of FIG. 1 including a housing, an antenna assembly, and functional components;

fig. 3 is a plan view of the antenna assembly of fig. 2 with the radiator integrated into the housing;

fig. 4 is a schematic plan view of the radiator of the antenna assembly of fig. 2 disposed within a housing;

fig. 5 is a schematic structural view of the radiator shown in fig. 4 supported on a motherboard by a bracket;

fig. 6 is an exploded view of the radiator of the antenna assembly of fig. 2 integrated into the housing;

FIG. 7 is a schematic side view of the antenna assembly of FIG. 2;

FIG. 8 is a schematic structural view of the functional element shown in FIG. 2 disposed in a housing;

FIG. 9 is a schematic view of the functional element of FIG. 2 disposed on an inner surface of a housing;

FIG. 10 is a schematic view of the functional element of FIG. 2 disposed on an outer surface of a housing;

FIG. 11 is a schematic plan view of the electronic device of FIG. 1 further including a metallic trim piece;

FIG. 12 is a schematic plan view of the electronic device of FIG. 11 with the functional element connected to a ground reference;

FIG. 13 is a plan view of the functional element of the electronic device of FIG. 12 with multiple grounding points;

FIG. 14 is a schematic plan view of a functional element of the electronic device of FIG. 11 coupled to a radio frequency module;

fig. 15 is a schematic plan view of the functional element of the electronic device shown in fig. 14 connected to the rf module through the radiator;

fig. 16 is a schematic plan view illustrating the functional element of the electronic device shown in fig. 14 connected to the rf module through the second conductive elastic piece.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The embodiments listed in the present application may be appropriately combined with each other.

With the rapid development of wireless communication technology, 5G wireless communication systems will be commercially used. The 5G wireless communication system mainly uses two different main frequency bands: a millimeter wave band of 6GHz or less and a millimeter wave band of 6GHz or more. Since the millimeter wave band below 6GHz has advantages of strong operability and mature technology, the 5G antenna system of the millimeter wave band below 6GHz will be preferentially used. In a fourth generation (4G) mobile communication system, antennas of 2 ﹡ 2, 4 ﹡ 4, etc. of Multiple Input Multiple Output (MIMO) have been widely studied and used in mobile devices. According to the prior research result, the peak rate of the 5G technology is increased by tens of times compared with the current 4G technology, so in order to meet the requirement of 5G transmission rate, multiple input multiple output 2 ﹡ 2, 4 ﹡ 4 antennas or more antennas are used to realize larger channel capacity and better communication quality. In addition, the MIMO antenna with multiple inputs and multiple outputs can well solve the problem of multipath fading and can improve the data throughput. When the 5G wireless communication system is applied to the electronic equipment, the number of antennas required to be arranged on the electronic equipment is multiplied, approximately from 3-6 traditional antennas to about 10 antennas, and therefore the difficulty in designing the antennas in the limited space of the electronic equipment is increased.

The antenna design is limited due to the increase in the number of antennas, and the related art option sacrifices the antenna performance, resulting in a narrower bandwidth of the antenna and a reduced antenna efficiency. Therefore, the application provides the electronic equipment, and mainly solves the problem of how to improve the performance of the antenna by using the structural part on the electronic equipment.

As shown in fig. 1, fig. 1 is a schematic plan view of an electronic device 100 provided in the present application. The electronic device 100 provided by the present application may be a mobile phone, a tablet computer, a desktop computer, a laptop computer, an e-reader, a handheld computer, a notebook computer, a netbook, a smart watch, a smart necklace, smart glasses, and the like. The embodiment of the application takes a mobile phone as an example. The electronic device 100 includes a housing 101, an antenna assembly 102, and a function 103.

The outer surface of the housing 101 forms an outer appearance surface of the electronic apparatus 100. The inner surface of the housing 101 forms the inner surface of the electronic device 100. The housing 101 may be a glass housing, a ceramic housing, a metal housing, an alloy housing, a plastic housing, a carbon fiber housing, or the like. Of course, the material of the casing 101 may also include two or more materials, that is, the casing 101 is a composite casing. For example: the material of the housing 101 may include both an insulating material and a conductive material. The insulating material may be glass, plastic, etc. The conductive material may be metal, alloy, carbon fiber, etc. In the embodiment of the present application, the housing 101 includes both the insulating portion and the metal portion.

Referring to fig. 1 and 2, the electronic device 100 further includes a display screen 104. The display screen 104 is connected to the housing 101. An inner cavity 105 forming the electronic device 100 is enclosed between the display screen 104 and the housing 101. The display screen 104 may be a hard screen, a flexible screen, or the like.

The antenna assembly 102 may include one or more of a wireless communication antenna (e.g., 2G, 3G, 4G, 5G, etc.), a GPS antenna, a Wi-Fi antenna, an NFC antenna, a bluetooth antenna, a wireless charging antenna, and the like.

The antenna assembly 102 is at least partially disposed within the housing 101. It is understood that the antenna assembly 102 is partially or fully disposed within the internal cavity 105 of the electronic device 100.

In one embodiment, as shown in fig. 3, the antenna assembly 102 is partially disposed in the internal cavity 105 of the electronic device 100, and is partially integrated with the housing 101 and connected to the display screen 104. The metal part on the housing 101 serves as part of the antenna assembly 102. In other words, the antenna assembly 102 is partially integrated with the housing 101. It is understood that in this embodiment, the antenna assembly 102 is partially exposed. By partially integrating the antenna assembly 102 on the housing 101, the space occupied by the antenna assembly 102 and the impact of metal inside the housing 101 or the electronic device 100 on the performance of the antenna assembly 102 may be reduced.

In another embodiment, as shown in FIG. 2, the antenna assembly 102 is disposed entirely within the interior cavity 105 of the electronic device 100. For example: the electronic device 100 further includes a main board 106, the main board 106 is disposed in the internal cavity 105 of the electronic device 100, and the antenna assembly 102 is disposed on the main board 106 and contacts or faces an inner surface of the housing 101. The insulating part of the housing 101 corresponds to the antenna assembly 102, and the insulating part of the housing 101 can reduce shielding or interference to the antenna assembly 102. Alternatively, the antenna assembly 102 may be a Flexible Printed Circuit (FPC) antenna, a Laser Direct Structuring (LDS) antenna, a Printed antenna, or the like. It is understood that, in the present embodiment, the antenna assembly 102 is an internal antenna assembly 102. By providing the antenna assembly 102 entirely within the interior cavity 105 of the electronic device 100, electrical connection between the antenna assembly 102 and the motherboard 106 is facilitated.

As shown in fig. 4, the antenna assembly 102 is used to implement wireless communication functions of the electronic device 100. The antenna assembly 102 includes a radiator 120 and a radio frequency module 121.

Referring to fig. 4 and 5, the radiator 120 is disposed in the inner cavity 105 of the electronic device 100, or the radiator 120 is disposed on the housing 101. The radiator 120 is used for transceiving electromagnetic wave signals. Specifically, the radiator 120 receives a radiation wave outside the electronic device 100 and converts the radiation wave into a guided wave to transmit to the rf module 121, or the radiator 120 receives the guided wave transmitted by the rf module 121 and converts the guided wave into an electromagnetic wave to radiate to the space.

In one embodiment, as shown in fig. 5, the radiator 120 is disposed on the board 106 of the electronic device 100. Optionally, the antenna assembly 102 further includes a bracket 122, and the radiator 120 is fixed to the board 106 of the electronic device 100 through the bracket 122. When the radiator 120 is disposed on the board 106, the radiator 120 receives the electromagnetic wave signal through the corresponding insulation portion of the housing 101 or the display screen 104, or the radiator 120 transmits the electromagnetic wave signal through the corresponding insulation portion of the housing 101 or the display screen 104.

In this embodiment, when the electronic device 100 has a plurality of antenna elements 102, the radiators 120 of the plurality of antenna elements 102 may be respectively disposed on the board 106 through the plurality of brackets 122, and of course, the radiators 120 of the plurality of antenna elements 102 may also be directly disposed on the board 106.

In another embodiment, as shown in fig. 6, the radiator 120 is disposed on the housing 101. Specifically, the radiator 120 is integrated on the housing 101, and forms an external appearance surface of the electronic device 100 together with an external surface of the housing 101. In other words, the radiator 120 is a metal portion of the case 101 or a metal portion of a part of the case 101. In this embodiment, by integrating the radiator 120 on the housing 101, the radiator 120 can directly receive the electromagnetic wave signal outside the electronic device 100, or directly convert the guided wave into the electromagnetic wave signal and radiate the electromagnetic wave signal outside the electronic device 100, so that the interference on the radiator 120 when receiving and transmitting the electromagnetic wave signal is reduced, and the loss is also reduced.

When the electronic device 100 has a plurality of antenna assemblies 102, the radiators 120 of the plurality of antenna assemblies 102 may be respectively integrated on the housing 101. That is, the metal part of the housing 101 forms a plurality of radiators 120 of different frequency bands, and the radiators 120 may be separated by an insulating part to prevent the radiators 120 from interfering with each other.

The electromagnetic wave signals transmitted and received by the radiator 120 may be ultra-long wave signals, medium wave signals, short wave signals, ultra-short wave signals, microwave signals, millimeter wave signals, and the like.

The radiator 120 is electrically connected to the rf module 121 to receive the guided wave from the rf module 121. Alternatively, the radiator 120 may be electrically connected to the rf module 121 through an overhead open wire, a coaxial wire, a hollow waveguide, or the like.

The rf module 121 is disposed in an inner cavity of the electronic device 100, for example: the rf module 121 is disposed on the main board 106 of the electronic device 100. The rf module 121 may be electrically connected to a main controller of the electronic device 100 to control the antenna to transmit and receive electromagnetic wave signals. The rf module 121 may include a transceiver, a power amplifier, an antenna switch module, a front end module, and the like. The transceiver is a core processing unit of the rf module 121, and mainly includes a receiving unit and a transmitting unit, where the receiving unit amplifies, filters, and down-converts a received signal to finally output a baseband signal. The transmitting unit completes up-conversion, filtering and amplification of the baseband signal. The power amplifier is used for amplifying the radio frequency signal output by the transceiver. The front-end module integrates an antenna switch module and a radio frequency filter, and completes the switching of antenna receiving and transmitting, frequency band selection and the filtering of receiving and transmitting radio frequency signals. Of course, the rf module 121 may further include a duplexer, a filter, a synthesizer, and the like, which is not described herein again in this embodiment.

Of course, as shown in fig. 7, the antenna assembly 102 may further include a grounding unit 123, and the grounding unit 123 is used for electrically connecting the reference ground 107. A sufficient gap is maintained between the ground unit 123 and the radiator 120 to ensure radiation performance of the radiator 120.

As shown in fig. 8, the function member 103 is provided on the housing 101. Alternatively, the functional element 103 is disposed on the housing 101 and faces the internal cavity 105 of the electronic device 100, or the functional element 103 is disposed on the housing 101 and faces the outside of the electronic device 100. In other words, the functional element 103 may be disposed on the inner surface of the casing 101, or the functional element 103 may be disposed on the outer surface of the casing 101, or the functional element 103 may be partially disposed between the inner surface of the casing 101 and the outer surface of the casing 101. Optionally, the functional element 103 may be embedded in the casing 101, adhered to the casing 101 by an adhesive, welded to the casing 101, snapped to the casing 101 by a snap, and the like. Of course, the functional element 103 may also be a coating, a printed layer, a protective element, a decorative element, or the like on the housing 101.

When the functional element 103 is disposed on the inner surface of the casing 101, the functional element 103 is hidden in the electronic device 100, which does not affect the appearance of the electronic device 100, and is beneficial to implementing the electronic device 100 with better appearance consistency and improving the integration of the electronic device 100. The surface of the functional element 103 and the outer surface of the casing 101 form an appearance surface of the electronic device 100, that is, the functional element 103 is disposed on the outer surface of the casing 101, or the functional element 103 is partially exposed outside the casing 101, or the functional element 103 and other structural members of the electronic device 100 can be combined to realize multiple functions of the functional element 103 when the outer surface of the functional element 103 is flush with the outer surface of the casing 101. For example: the functional component 103 can be combined with the camera module 109 of the electronic device 100 for carrying and supporting the camera module 109.

The functional element 103 is spaced apart from the radiator 120. For example: when the radiator 120 is disposed on the board 106 of the electronic device 100, the functional element 103 is disposed on the housing 101, and a gap is formed between the functional element and the radiator 120. When the radiator 120 is disposed on the housing 101, the functional element 103 is disposed on the housing 101, and the functional element 103 and the radiator 120 are disposed in different regions of the housing 101 so as to be spaced apart from each other. For example: the radiator 120 is disposed on the inner surface of the housing 101, and the function component 103 is disposed on the outer surface of the housing 101, or the radiator 120 is integrated in a partial region of the housing 101, and the function component 103 is disposed in another region of the housing 101. It is understood that the functional element 103 and the radiator 120 are disposed on the housing 101 in a staggered manner.

The functional member 103 is used to reinforce the strength of the housing 101 and the functional member 103 is used to compensate for the system efficiency of the electronic apparatus 100. Optionally, the functional element 103 covers an inner surface of the casing 101 or an outer surface of the casing 101 to support the casing 101, so as to enhance strength of the casing 101, or the functional element 103 is made of a material with higher strength, the casing 101 is made of a material with strength lower than that of the functional element 103, and the functional element 103 is disposed on the casing 101 to enhance strength of the whole casing 101. Optionally, the functional element 103 compensates for the system efficiency of the electronic device 100 by radiating the electromagnetic wave signal, or the functional element 103 compensates for the system efficiency of the electronic device 100 by reducing the interference received by the radiator 120, so as to improve the communication performance of the electronic device 100.

According to the electronic device 100 provided by the application, the antenna assembly 102 is arranged in the casing 101, and the functional element 103 is arranged on the casing 101, so that the radiation efficiency of the radiator 120 of the antenna assembly 102 is compensated while the strength of the casing 101 is enhanced by the functional element 103, and the electronic device 100 has high strength and good communication performance.

In the embodiment of the present application, as shown in fig. 9, the housing 101 includes a middle frame 110 and a back plate 112 connected to each other. The middle frame 110 and the back plate 112 enclose a receiving cavity, i.e. the inner cavity 105 of the electronic device 100. The middle frame 110 and the back plate 112 may be integrally connected or connected through a connector. The middle frame 110 is made of conductive material, such as: a metal. The back plate 112 is made of an insulating material, for example: and (3) glass. The rf module 121 is disposed in the internal cavity 105 of the electronic device 100, i.e., the rf module 121 is disposed on the main board 106 in the internal cavity of the electronic device 100. The radiator 120 is disposed on the middle frame 110, that is, at least a partial region of the middle frame 110 forms the radiator 120, and the radiator 120 is configured to transmit and receive electromagnetic wave signals. The functional member 103 is disposed on the back plate 112, and the strength of the functional member 103 is greater than that of the back plate 112. The feature 103 is used to increase the strength of the backplane 112 and compensate for the system efficiency of the electronic device 100.

As shown in fig. 10, the surface of the functional element 103 has a texture, and the functional element 103 is disposed on the outer surface of the back plate 112, that is, the functional element 103 is disposed on the side of the back plate 112 facing the outside of the electronic device 100. Since the surface of the functional member 103 has texture, when the functional member 103 is disposed on the outer surface of the back plate 112, it is advantageous to form a colored and textured appearance surface of the housing 101 by spraying, printing, or the like.

The functional element 103 is made of a conductive material. Optionally, the functional element 103 is made of a metal material or a carbon fiber material. In the embodiment of the present application, the functional element 103 is made of a carbon fiber material.

Further, as shown in fig. 11, in the embodiment of the present application, the electronic device 100 further includes a metal decoration 108 and a camera module 109. The metal decoration 108 is used for carrying the camera module 109. The metal decoration 108 is disposed on the back plate 112, and the functional element 103 surrounds the metal decoration 108.

In order to realize that the functional element 103 compensates the radiation efficiency of the radiator 120 of the antenna assembly 102 while enhancing the strength of the housing 101, the system efficiency of the electronic device 100 obtained by testing and calculating the electronic device 100 without the functional element 103 is shown in table 1.

Table 1: system efficiency of electronic device without functional element

Frequency band	Efficiency of the system
		B5	-7.56
B3	-6.89
		B1	-6.21
B40	-5.52
		B41	-4.22

Table 2 shows system efficiencies of the electronic device 100 obtained by testing and calculating the functional component 103 made of carbon fiber on the outer surface of the housing 101.

Table 2: system efficiency and efficiency difference of electronic device when setting function piece

Where Delta is an efficiency difference between the system efficiency of the electronic device 100 when the function 103 is set in table 2 and the system efficiency of the electronic device 100 when the function 103 is not set in table 1.

Comparing the data in table 1 and table 2, it can be seen that, after the functional element 103 made of carbon fiber is added to the electronic device 100, although the overall strength of the housing 101 is improved under the condition that the strength of the carbon fiber itself is higher, the system efficiency of the corresponding electronic device 100 is reduced. Wherein, the low frequency B5 is reduced by 1.0dB to 1.1dB, the intermediate frequency B3 is reduced by 1.1dB to 1.2dB, the intermediate frequency B1 is reduced by 1.4dB to 1.5dB, the high frequency B40 is reduced by 0.9dB to 1dB, and the high frequency B41 is reduced by 1dB to 1.1 dB.

The following is an improvement of the functional element 103, which is mainly to solve how to compensate the system efficiency of the electronic device 100 or increase the system efficiency of the electronic device 100 after the functional element 103 made of the carbon fiber material is disposed, based on the results of the above table 1 and table 2. The following is a modification of the function 103 by the skilled person.

Specifically, as shown in fig. 12, the electronic device 100 further includes a reference ground 107, and the functional element 103 is electrically connected to the reference ground 107. In other words, the improvement to the function 103 is: the carbon fiber-made functional member 103 is subjected to grounding treatment.

Referring to fig. 7 and 12, the functional component 103 and the ground 107 of the electronic device 100 may be electrically connected directly, or may be electrically connected through other structural conductive components in the electronic device 100. For example: the functional element 103 is electrically connected to the reference ground 107 of the electronic device 100 by connecting the grounding unit 123 of the antenna assembly 102. Specifically, the functional element 103 is electrically connected to the ground unit 123 of the antenna assembly 102, and the ground unit 123 of the antenna assembly 102 is electrically connected to the reference ground 107 of the electronic device 100.

Alternatively, as shown in fig. 13, one or more grounding points 131 on the functional element 103 are electrically connected with the reference ground 107 of the electronic device 100.

In one embodiment, the functional element 103 has a plurality of grounding points 131 arranged at intervals. The ground point 131 is electrically connected to the reference ground 107 of the electronic device 100. Optionally, each grounding point 131 abuts against the reference ground 107 of the electronic device 100 through a metal spring. The metal elastic sheet can be fixed on the inner surface of the back plate 112, or embedded in the back plate 112. The assembly difficulty can be simplified by fixing the metal elastic sheet on the inner surface of the back plate 112, and the strength of the back plate 112 can be ensured. The metal elastic sheet is embedded in the back plate 112, so that the accommodating space of the electronic device 100 can be increased, more structural members can be arranged, and the diversified functions of the electronic device 100 can be improved.

The number of grounding points 131 on the functional element 103 is not limited in this application. In the embodiment of the present application, five grounding points 131 are disposed on the functional element 103, and the five grounding points 131 are respectively abutted to the reference ground 107 of the electronic device 100 through a metal spring.

Of course, in other embodiments, referring to fig. 7 and 13, one or more grounding points 131 on the functional element 103 may be electrically connected to the grounding unit 123 of the antenna assembly 102, and the grounding unit 123 of the antenna assembly 102 is electrically connected to the reference ground 107 of the electronic device 100. Specifically, one or more grounding points 131 on the functional element 103 are respectively abutted to the grounding unit 123 of the antenna assembly 102 through metal elastic pieces, and the grounding unit 123 of the antenna assembly 102 is abutted to the reference ground 107 of the electronic device 100 through metal elastic pieces, so that a grounding circuit among the functional element 103, the grounding unit 123 and the reference ground 107 of the electronic device 100 is realized.

Optionally, at least part of the ground point 131 is located at the edge of the functional element 103 and near the radiator 120. In the embodiment of the present invention, the radiator 120 is disposed on the middle frame 110, the functional element 103 is disposed on the back plate 112, and the functional element 103 is disposed around the periphery of the camera module 109. The middle frame 110 includes a first frame 110a, a second frame 110b, a third frame 110c, and a fourth frame 110d, which are connected in sequence. The first frame 110a is disposed opposite to the third frame 110c, and the second frame 110b is disposed opposite to the fourth frame 110 d. The length of the first frame 110a is greater than the length of the second frame 110 b. The functional element 103 is substantially rectangular, and the functional element 103 includes a first outer edge 103a, a second outer edge 103b, a third outer edge 103c, and a fourth outer edge 103d, which are connected in sequence. The first outer edge 103a is disposed opposite the third outer edge 103c, and the second outer edge 103b is disposed opposite the fourth outer edge 103 d. The first outer edge 103a is close to the first frame 110a of the middle frame 110 relative to the third outer edge 103 c. The second outer edge 103b is adjacent to the second rim 110b of the middle frame 110 with respect to the fourth outer edge 103 d. The length of the first outer edge 103a is greater than the length of the second outer edge 103 b.

In this embodiment, three grounding points 131 are disposed on the first outer edge 103a, a first grounding point 131 of the three grounding points 131 is disposed at an end of the first outer edge 103a close to the second outer edge 103b, a second grounding point 131 is disposed at an end of the first outer edge 103a close to the fourth outer edge 103d, and the third grounding point 131 is disposed between the first grounding point 131 and the second grounding point 131. The second outer edge 103b is provided with a fourth grounding point 131, and is located at the connection position of the second outer edge 103b and the third outer edge 103 c. The end of the third outer edge 103c remote from the second outer edge 103b is provided with a fifth grounding point 131.

In this embodiment, the system efficiency of the electronic device 100 obtained by performing grounding processing, testing, and calculation on the functional component 103 disposed on the housing 101 by the skilled person is shown in table 3.

Table 3: system efficiency and efficiency difference of electronic equipment when functional part is grounded

Frequency band	Efficiency of the system	Delta1	Delta2
				B5	-8.04	0.53	-0.48
B3	-7.41	0.68	-0.52
				B1	-7.00	0.66	-0.79
B40	-6.35	0.72	-0.83
				B41	-4.62	0.88	-0.4

Delta1 in Table 3 is the difference in efficiency between the system efficiency of electronic device 100 when function 103 is grounded and the system efficiency of electronic device 100 when function 103 is set directly in Table 2.

As can be seen from comparing the data in table 3 and table 2, the radiation efficiency of the electronic device 100 is improved after the function element 103 is grounded. Wherein, the low frequency B5 has a 0.5 dB-0.6 dB increase, the intermediate frequency B3 has a 0.6 dB-0.7 dB increase, the intermediate frequency B1 has a 0.6 dB-0.7 dB increase, the high frequency B40 has a 0.7 dB-0.8 dB increase, and the high frequency B41 has a 0.8 dB-0.9 dB increase.

It can be understood that by electrically connecting the carbon fiber functional element 103 with the reference ground 107 of the electronic device 100, the influence of the carbon fiber functional element 103 on the radiation efficiency of the radiator 120 can be reduced. In other words, in the present embodiment, the interference of the carbon fiber function element 103 on the radiator 120 is reduced, so that the system efficiency of the electronic device 100 is compensated.

Further, the functional member 103 may be electrically connected to the metal decoration member 108. Optionally, the functional element 103 and the metal decoration 108 are fixedly connected and electrically connected through a conductive adhesive. By electrically connecting the functional element 103 and the metal decoration 108, the metal decoration 108 can be electrically connected to the reference ground 107 of the electronic device 100, so that interference of the metal decoration 108 to the radiator 120 is reduced, and system efficiency of the electronic device 100 is further improved.

Delta2 in Table 3 is the difference in efficiency between the system efficiency of electronic device 100 when feature 103 is grounded and the system efficiency of electronic device 100 when feature 103 is not provided in Table 1.

As can be seen by comparing the data in table 3 and table 1, the system efficiency of the electronic apparatus 100 is still reduced after the function element 103 is grounded. Wherein, the low frequency B5 is reduced by 0.4dB to 0.5dB, the intermediate frequency B3 is reduced by 0.5dB to 0.6dB, the intermediate frequency B1 is reduced by 0.7dB to 0.8dB, the high frequency B40 is reduced by 0.8dB to 0.9dB, and the high frequency B41 is reduced by 0.4dB to 0.5 dB.

It can be seen that the system efficiency of the electronic device 100 is compensated in the improved scheme, but the system efficiency of the electronic device 100 is still reduced compared to the system efficiency of the electronic device 100 without the function 103. Therefore, based on the results of the above table 3 and table 1, the skilled person can make further improvements on the functional element 103, and the further technical improvements mainly solve the problem of how to compensate the system efficiency of the electronic apparatus 100 or increase the system efficiency of the electronic apparatus 100 after the functional element 103 made of carbon fiber is disposed, so that the system efficiency of the electronic apparatus 100 is improved compared with the radiation efficiency when the functional element 103 is not disposed. Further modifications to the feature 103 made by those skilled in the art are shown below.

Specifically, as shown in fig. 14, the functional component 103 electrically couples the radio frequency module 121 of the antenna assembly 102. The functional element 103 is used for transceiving electromagnetic wave signals under excitation of the radio frequency module 121.

The functional element 103 may be used as an independent radiator 120 for transceiving electromagnetic wave signals or the functional element 103 may be used as an auxiliary radiation branch of the radiator 120 for transceiving electromagnetic wave signals.

In one embodiment, as shown in fig. 15, the functional element 103 is used as an auxiliary radiation branch of the radiator 120 for transceiving electromagnetic wave signals. It can be understood that, in the present embodiment, the functional element 103 is electrically connected to the radiator 120, and the radiator 120 is connected to the rf module 121.

In one embodiment, the functional element 103 is electrically coupled to the radiator 120 to transmit and receive electromagnetic wave signals. In another embodiment, the electronic device 100 further includes a first conductive elastic piece 132. The functional element 103 and the radiator 120 are electrically connected through the first conductive elastic piece 132.

In another embodiment, as shown in fig. 16, the functional element 103 is used as an independent radiating unit for transceiving electromagnetic wave signals. Optionally, the electronic device 100 further includes a second conductive elastic sheet 133, and the functional element 103 is electrically connected to the radio frequency module 121 through the second conductive elastic sheet 133.

In this embodiment, table 4 shows system efficiencies of the electronic device 100 obtained by testing and calculating the electronic device 100 when the functional element 103 is used as the radiator 120 by the skilled person.

Table 4: system efficiency and efficiency difference of electronic equipment when functional element is used as radiation unit

Frequency band	Efficiency of the system	Delta3
			B5	-7.46	0.1
B3	-6.68	0.21
			B1	-5.96	0.25
B40	-5.17	0.35
			B41	-3.90	0.32

The functional member 103 made of carbon fiber material radiates an electromagnetic wave signal, thereby compensating for the system efficiency of the electronic apparatus 100.

Delta3 in Table 4 is the difference in efficiency between the system efficiency of electronic device 100 when feature 103 is grounded and the system efficiency of electronic device 100 when feature 103 is not provided in Table 1.

As can be seen from comparing the data in table 4 and table 1, the system efficiency of the electronic device 100 is improved when the functional element 103 is used as the radiator 120. Wherein, the low frequency is improved by 0.1dB to 0.2dB, the intermediate frequency B3 is improved by 0.2dB to 0.3dB, the intermediate frequency B1 is improved by 0.2dB to 0.3dB, the high frequency B40 is improved by 0.3dB to 0.4dB, and the high frequency B41 is improved by 0.3dB to 0.4 dB.

In the embodiment of the present application, the functional element 103 is used for enhancing the strength of the casing 101 and increasing the appearance plasticity of the casing 101, and meanwhile, the functional element 103 is grounded to reduce the interference to the radiator 120, or the functional element 103 is used as a radiation unit of the electronic device 100 to radiate an electromagnetic wave signal, so that the radiation efficiency of the antenna is improved, and the wireless communication performance of the electronic device 100 is improved.

The foregoing is a partial description of the present application, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present application, and these modifications and decorations are also regarded as the protection scope of the present application.

Claims

1. An electronic device, comprising:

a housing;

the functional part, the functional part is located on the casing, and with irradiator looks interval, the functional part is used for strengthening the intensity of casing reaches the functional part is used for compensating the radiant efficiency of irradiator.

2. The electronic device of claim 1, wherein the functional element is made of a conductive material.

3. The electronic device of claim 2, further comprising a reference ground, the function being electrically connected to the reference ground.

4. The electronic device according to claim 3, wherein the functional member has a plurality of grounding points arranged at intervals, and the plurality of grounding points are electrically connected to the reference ground.

5. The electronic device of claim 4, wherein at least a portion of the ground point is located at an edge of the functional element and proximate to the radiator.

6. The electronic device of claim 2, wherein the functionality electrically couples the radio frequency module, the functionality for transceiving electromagnetic wave signals upon excitation by the radio frequency module.

7. The electronic device of claim 6, wherein the functional element is electrically coupled to the radiator.

8. The electronic device of claim 6, further comprising a first conductive dome, wherein the functional element is electrically connected to the radiator through the first conductive dome.

9. The electronic device of claim 6, further comprising a second conductive spring, wherein the functional element is electrically connected to the radio frequency module through the second conductive spring.

10. The electronic device according to any one of claims 3 to 5, further comprising a metal decoration, wherein the metal decoration is disposed on the housing, and the functional element is electrically connected to the metal decoration.

11. The electronic device according to claim 10, further comprising a camera module, wherein the metal decoration is used for carrying the camera module, and the functional member surrounds a periphery of the metal decoration.

12. The electronic device of claim 10, wherein the functional element is disposed on an inner surface of the housing.

13. The electronic device according to claim 10, wherein a surface of the functional member has a texture, and the surface of the functional member and an outer surface of the housing form an appearance surface of the electronic device.

14. The electronic device according to any one of claims 1 to 9 and 11 to 13, wherein the housing includes a middle frame and a back plate connected to each other, the back plate and the middle frame are enclosed to form an accommodation cavity, the rf module is disposed in the accommodation cavity, the radiator is disposed in the middle frame, the functional element is disposed on the back plate, and the functional element is configured to increase strength of the back plate.

15. The electronic device according to any one of claims 1 to 9 and 11 to 13, wherein the functional member is made of a carbon fiber material.