CN112952026B - Micro OLED display structure capable of improving adhesion between TFE layer and OC layer and preparation method thereof - Google Patents
Micro OLED display structure capable of improving adhesion between TFE layer and OC layer and preparation method thereof Download PDFInfo
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- CN112952026B CN112952026B CN202110403156.4A CN202110403156A CN112952026B CN 112952026 B CN112952026 B CN 112952026B CN 202110403156 A CN202110403156 A CN 202110403156A CN 112952026 B CN112952026 B CN 112952026B
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- 238000002360 preparation method Methods 0.000 title abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005538 encapsulation Methods 0.000 claims abstract description 9
- 238000007641 inkjet printing Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000009832 plasma treatment Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000000926 separation method Methods 0.000 abstract description 4
- 239000010409 thin film Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 74
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000004297 night vision Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a Micro OLED display structure for improving adhesion between a TFE layer and an OC layer and a preparation method thereof, wherein the Micro OLED display structure comprises an OLED luminescent layer, a first packaging layer is arranged on the OLED luminescent layer, and a second packaging layer is arranged on the first packaging layer; and a high-viscosity layer is arranged on the second packaging layer, and an OC layer is arranged on the high-viscosity layer. Compared with the prior art, the method selects a Thin Film Encapsulation (TFE) structure and a material in the Micro OLED display, and prints a high-viscosity columnar material between the TFE and the OC layer. On the premise of not influencing the light emission of the OLED, the adhesion force of TFE and OC can be increased, so that the technical problem of separation of TFE and OC is solved.
Description
Technical Field
The invention belongs to the field of Micro OLED display, and particularly relates to a Micro OLED display structure for improving adhesion between a TFE layer and an OC layer and a preparation method thereof.
Background
Micro OLED (Organic Light Emitting Display) is called black horse of next generation display technology, has been widely applied to military markets such as helmets, gun targets, night vision devices and the like, and with the application of new technologies such as AR/VR and autopilot, micro OLED Micro displays will grow in an explosive manner. Most of the existing terminal products in the market are head-mounted or wearable devices. In the manufacture of color screen, since the color film process uses multiple coating, exposing and developing functions, for protecting the film package (TFE), it is generally adopted to plate a layer of OC on the surface of the film package (TFE). However, the micro-display is placed in a severe environment (85 ℃/85%RH) and is less than 240H, so that the problem that OC and TFE are separated easily and product color spots are caused is solved.
Disclosure of Invention
The invention aims to provide a Micro OLED display structure for improving adhesion between a TFE layer and an OC layer, wherein a high-adhesion layer is arranged between the TFE layer and the OC layer, and the adhesion between the TFE layer and the OC layer can be increased on the premise of not influencing the light emission of the OLED, so that the technical problem of separation of the TFE layer and the OC layer is solved.
The invention further aims to provide a preparation method of the Micro OLED display structure for improving the adhesion between the TFE layer and the OC layer, which is simple and solves the problem of separation of TFE and OC.
The specific technical scheme of the invention is as follows:
a Micro OLED display structure for improving adhesion between a TFE layer and an OC layer comprises an OLED light-emitting layer, wherein a first packaging layer is arranged on the OLED light-emitting layer, and a second packaging layer is arranged on the first packaging layer; and a high-viscosity layer is arranged on the second packaging layer, and an OC layer is arranged on the high-viscosity layer.
Further, the first packaging layer is made of AlO or TiO;
the thickness of the first packaging layer is 20nm-50nm, preferably 30nm;
the second packaging layer is a SiN layer;
the thickness of the second encapsulation layer is 0.6-1.3 μm, preferably 1 μm.
The high-adhesion layer has a thickness of 0.5 to 2. Mu.m, preferably 1. Mu.m.
The high-viscosity layer is arranged at the edge of the second packaging layer and corresponds to the cathode ring area;
preferably, the high-viscosity layer is in a columnar structure at intervals, the columnar structure is distributed in the cathode ring area, and the interval is 100-300nm, preferably 200nm;
the diameter of the columnar structure is 50nm-150nm, preferably 100nm.
The preparation method of the Micro OLED display structure for improving the adhesion between the TFE layer and the OC layer comprises the following steps:
1) Preparing a first packaging layer on the light-emitting layer of the OLED device;
2) Preparing a second packaging layer;
3) Printing high-viscosity materials at intervals on the cathode ring area in an inkjet printing mode;
4) And then manufacturing the OC layer.
In the step 1), the preparation method of the light-emitting layer of the OLED device comprises the following steps: preparing a CMOS circuit on a silicon substrate; preparing an OLED anode structure on a CMOS circuit; and preparing the light-emitting layer of the OLED device.
The method for preparing the first packaging layer in the step 1) comprises the following steps: but are not limited to atomic layer deposition ALD methods, the preparation materials are alternatively but not limited to AlO or TiO; the thickness of the prepared first encapsulation layer is 20nm-50nm, preferably 30nm.
Step 2) preparing a second packaging layer by PECVD (plasma enhanced chemical vapor deposition) with SiN as a preparation material; the second encapsulation layer is prepared to a thickness of 0.6-1.3 μm, preferably 1 μm.
The thickness of the two packaging layers is controlled by the invention for the light emitting property of the product. Through the cooperation of the materials and the thickness of the two packaging layers, the film peeling phenomenon is avoided, and the deterioration of the WVTR (water oxygen barrier property) performance of the product is avoided.
Preferably, step 2) NH is performed after SiN preparation 3 Plasma treatment increases hydrophilicity.
In the step 3), printing columnar high-viscosity materials on the edge (cathode ring area) of the second packaging layer in an ink-jet printing mode;
in the step 3), the SiN prepared in the step 2) has better hydrophilicity, the water drop angle is less than or equal to 10 degrees, and the high-viscosity material has better leveling property on the surface. So that the columnar high-viscosity material can be printed at intervals in the cathode ring area behind the second packaging layer in an ink-jet printing mode, and the distance between the columns is 100-300 mu m, preferably 200 mu m; the columnar high-viscosity material is uniformly spaced, the diameter of the columnar is 50-150 μm, preferably 100 μm, and the height of the columnar is 0.5-2 μm, preferably 1 μm.
The high-viscosity material is preferably polyvinyl alcohol resin;
in the step 3), the liquid is printed drop by ink-jet printing, the liquid flows on the substrate to form a cylindrical liquid shape, the uniform interval of the cylindrical high-viscosity materials is controlled by ink-jet printing, the interval size is controlled, the cohesiveness is improved, and the materials are saved.
The thickness of the OC layer in step 4) is 0.9-1.1 μm.
And 4) after the OC layer is manufactured, preparing other color adhesive layers, dispensing and bonding a glass cover plate, and assembling the module to complete the whole manufacture of the display.
Compared with the prior art, the invention selects a Thin Film Encapsulation (TFE) structure and material in the Micro OLED display, and prints columnar high-viscosity material in a cathode ring area between the TFE and OC layers. On the premise of not influencing the light emission of the OLED, the adhesion force of TFE and OC can be increased, so that the technical problem of separation of TFE and OC is solved.
Drawings
FIG. 1 is a schematic top view of a Micro OLED display according to the present invention;
FIG. 2 is a schematic diagram of a Micro OLED display according to the present invention;
1 is a display area, 2 is a substrate, 3 is a high-viscosity columnar area, and 4 is a cathode sealing ring area; 5 is anode, 6 is OLED luminescent layer, 7 is first encapsulation layer, 8 is second encapsulation layer, 9 is high viscosity columnar layer, 10 is OC layer.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions in the embodiments of the present invention will be clearly and completely described in the following in conjunction with the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The test materials, reagents and the like used in the examples described below are commercially available unless otherwise specified.
Those of skill in the art, without any particular mention of the techniques or conditions, may follow the techniques or conditions described in the literature in this field or follow the product specifications.
Example 1
A method for preparing a Micro OLED display structure with improved adhesion of TFE layer and OC layer, comprising the steps of:
1) Preparing a CMOS circuit on a silicon substrate;
2) Preparing an OLED anode structure on a CMOS circuit;
3) Preparing a light-emitting layer of the OLED device;
4) Preparing a first packaging layer, adopting an atomic layer deposition ALD method, wherein the material is AlO, and the thickness is 30nm;
5) Preparing a second packaging layer, wherein the second packaging layer is prepared by adopting a plasma enhanced chemical vapor deposition PECVD method, the material is SiN, and the thickness is 1 mu m; NH is performed again on the SiN layer 3 Plasma treatment;
6) And uniformly printing high-viscosity columnar structures at intervals in the cathode ring area after the second packaging layer by an ink-jet printing mode, wherein the columnar spacing distance is 200 mu m, the columnar diameter is 100 mu m, the columnar height is 1 mu m, and the printing material is polyvinyl alcohol resin.
7) Preparing an OC layer with the thickness of 11 mu m, and preparing the rest color adhesive layers;
8) And (5) dispensing and bonding the glass cover plate, and assembling the module to complete the whole manufacture of the display.
The product prepared in example 1 has strong adhesion to OC and no anomaly after 600H when stored at 85 ℃/85% RH.
Comparative example 1
A Micro OLED display structure comprising the steps of:
the preparation of the light-emitting layer of the OLED device is the same as in example 1, and the encapsulation layer is prepared on the light-emitting layer, and then the OC layer and the rest of the color glue layer are directly prepared.
Comparative example 1 the product was stored at 85 c/85% rh and after 100h TFE separated from OC, forming a mottle phenomenon.
Claims (4)
1. The Micro OLED display structure is characterized by comprising an OLED luminescent layer, wherein a first packaging layer is arranged on the OLED luminescent layer, and a second packaging layer is arranged on the first packaging layer; a high-viscosity layer is arranged on the second packaging layer, and an OC layer is arranged on the high-viscosity layer;
the thickness of the first packaging layer is 20nm-50nm;
the thickness of the second packaging layer is 0.6-1.3 mu m; the second packaging layer is a SiN layer, and the water drop angle is less than or equal to 10 degrees; the high-viscosity layer is arranged in the cathode ring area;
the high-viscosity layer is of a columnar structure with a spacing distance of 100-300nm, and the diameter of the columnar structure is 50-150 nm;
the thickness of the high-viscosity layer is 0.5-2 mu m.
2. The Micro OLED display structure according to claim 1, wherein the first encapsulation layer material is AlO or TiO.
3. A method for preparing the Micro OLED display structure of claim 1 or 2, wherein the method comprises the steps of:
1) Preparing a first packaging layer on the light-emitting layer of the OLED device;
2) Preparing a second packaging layer;
3) Printing high-viscosity materials at intervals on the cathode ring area in an inkjet printing mode;
4) And then manufacturing the OC layer.
4. The method of claim 3, wherein step 2) NH is performed after SiN is prepared 3 Plasma treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110403156.4A CN112952026B (en) | 2021-04-15 | 2021-04-15 | Micro OLED display structure capable of improving adhesion between TFE layer and OC layer and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110403156.4A CN112952026B (en) | 2021-04-15 | 2021-04-15 | Micro OLED display structure capable of improving adhesion between TFE layer and OC layer and preparation method thereof |
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| Publication Number | Publication Date |
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| CN112952026A CN112952026A (en) | 2021-06-11 |
| CN112952026B true CN112952026B (en) | 2023-12-26 |
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| CN202110403156.4A Active CN112952026B (en) | 2021-04-15 | 2021-04-15 | Micro OLED display structure capable of improving adhesion between TFE layer and OC layer and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114360381B (en) * | 2022-01-07 | 2023-11-28 | 深圳市华星光电半导体显示技术有限公司 | Flexible display module and mobile terminal |
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