CN112951482A - Electronic component slurry and processing technology - Google Patents
Electronic component slurry and processing technology Download PDFInfo
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- CN112951482A CN112951482A CN202110216113.5A CN202110216113A CN112951482A CN 112951482 A CN112951482 A CN 112951482A CN 202110216113 A CN202110216113 A CN 202110216113A CN 112951482 A CN112951482 A CN 112951482A
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- paste
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- 238000005516 engineering process Methods 0.000 title claims abstract description 10
- 239000002002 slurry Substances 0.000 title claims description 23
- 239000000203 mixture Substances 0.000 claims abstract description 39
- 238000002156 mixing Methods 0.000 claims abstract description 33
- 239000000843 powder Substances 0.000 claims abstract description 28
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 claims abstract description 25
- 235000019281 tert-butylhydroquinone Nutrition 0.000 claims abstract description 25
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000004250 tert-Butylhydroquinone Substances 0.000 claims abstract description 24
- 239000003822 epoxy resin Substances 0.000 claims abstract description 23
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 23
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 claims abstract description 21
- 239000012975 dibutyltin dilaurate Substances 0.000 claims abstract description 21
- ODJQKYXPKWQWNK-UHFFFAOYSA-N 3,3'-Thiobispropanoic acid Chemical compound OC(=O)CCSCCC(O)=O ODJQKYXPKWQWNK-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000003490 Thiodipropionic acid Substances 0.000 claims abstract description 19
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 235000019303 thiodipropionic acid Nutrition 0.000 claims abstract description 19
- XWKBMOUUGHARTI-UHFFFAOYSA-N tricalcium;diphosphite Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])[O-].[O-]P([O-])[O-] XWKBMOUUGHARTI-UHFFFAOYSA-N 0.000 claims abstract description 19
- 229910000010 zinc carbonate Inorganic materials 0.000 claims abstract description 19
- 235000004416 zinc carbonate Nutrition 0.000 claims abstract description 19
- 239000011667 zinc carbonate Substances 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 18
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 claims abstract description 18
- 239000008116 calcium stearate Substances 0.000 claims abstract description 18
- 235000013539 calcium stearate Nutrition 0.000 claims abstract description 18
- YJOMWQQKPKLUBO-UHFFFAOYSA-L lead(2+);phthalate Chemical compound [Pb+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O YJOMWQQKPKLUBO-UHFFFAOYSA-L 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 10
- 238000000227 grinding Methods 0.000 claims description 10
- 238000001914 filtration Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 abstract description 7
- 238000007254 oxidation reaction Methods 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 229910002710 Au-Pd Inorganic materials 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000004597 plastic additive Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
The invention belongs to the field of electronic paste, in particular to electronic component paste and a processing technology thereof, and provides the following scheme aiming at the problems of poor oxidation resistance and poor thermal stability of the existing conductive paste, wherein the electronic component paste comprises the following raw materials in parts by weight: 10-15 parts of silver powder, 5-10 parts of adhesive, 1-5 parts of glass powder, 1-5 parts of epoxy resin, 2-7 parts of thiodipropionic acid, 1-5 parts of tert-butyl hydroquinone, 3-8 parts of dibutyltin dilaurate, 1-3 parts of calcium phosphite and 5-10 parts of zinc carbonate, and the processing technology comprises the following steps: s1: mixing silver powder, adhesive, glass powder and epoxy resin to prepare a mixture A; s2: mixing thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate to obtain a mixture B; the invention has excellent oxidation resistance and thermal stability, and the preparation method is simple.
Description
Technical Field
The invention relates to the field of electronic paste, in particular to electronic component paste and a processing technology.
Background
The conductive paste is also called conductive adhesive, and is a mixture of noble metal powder, base metal powder, glass powder and synthetic resin. Wherein the solvent is added to make the material or graphite-like material. The metal powder has a particle size of about 1 to 2 μm, and a slurry of ultrafine powder having a particle size of several tens of nm is being developed. Practical slurry materials comprise Ag (30% -85% of Ag, the balance being epoxy resin and glass powder), Au (60% -85% of Au, the balance being epoxy resin and glass powder), Au-Pd (50% -70% of Au, 10% -20% of Pd, the balance being epoxy resin and glass powder), Cu (70% -80% of Cu, the balance being epoxy resin and glass powder), Ni (80% -90% of Ni, the balance being epoxy resin and glass powder) and the like. The paste is applied to a desired portion of a substrate by screen printing or other methods, and then fired at a temperature of 400 to 1000 ℃ to form an electrical conductor. The method is mainly used for wiring of thick film integrated circuits, electrodes of ceramic capacitors and the like, and leads of hybrid integrated circuits.
The existing conductive paste has poor oxidation resistance and thermal stability, so that an electronic component paste and a processing technology are provided for solving the problems.
Disclosure of Invention
The invention aims to solve the defects of poor oxidation resistance and thermal stability of conductive paste in the prior art, and provides electronic component paste and a processing technology thereof.
The invention provides electronic component slurry which comprises the following raw materials in parts by weight: 10-15 parts of silver powder, 5-10 parts of adhesive, 1-5 parts of glass powder, 1-5 parts of epoxy resin, 2-7 parts of thiodipropionic acid, 1-5 parts of tert-butyl hydroquinone, 3-8 parts of dibutyltin dilaurate, 1-3 parts of calcium phosphite, 5-10 parts of zinc carbonate, 3-9 parts of dibasic lead phthalate and 1-5 parts of calcium stearate.
Preferably, the feed comprises the following raw materials in parts by weight: 11-14 parts of silver powder, 6-9 parts of adhesive, 2-4 parts of glass powder, 2-4 parts of epoxy resin, 3-6 parts of thiodipropionic acid, 2-4 parts of tert-butyl hydroquinone, 4-7 parts of dibutyltin dilaurate, 1.5-2.5 parts of calcium phosphite, 6-9 parts of zinc carbonate, 4-8 parts of dibasic lead phthalate and 2-4 parts of calcium stearate.
Preferably, the feed comprises the following raw materials in parts by weight: 12 parts of silver powder, 7 parts of adhesive, 3 parts of glass powder, 3 parts of epoxy resin, 4 parts of thiodipropionic acid, 3 parts of tert-butyl hydroquinone, 5 parts of dibutyltin dilaurate, 2 parts of calcium phosphite, 7 parts of zinc carbonate, 5 parts of dibasic lead phthalate and 3 parts of calcium stearate.
The invention also provides a processing technology of the electronic component slurry, which comprises the following steps:
s1: mixing silver powder, adhesive, glass powder and epoxy resin to prepare a mixture A;
s2: mixing thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate to obtain a mixture B;
s3: mixing the mixture A with the mixture B to obtain a mixture C;
s4: and grinding and dispersing the mixture C by a three-roll mill, grinding into homogeneous slurry, and finally filtering to obtain the electronic component slurry.
Preferably, in S1, the silver powder, the adhesive, the glass powder and the epoxy resin are mixed for 20-40min at a mixing speed of 600-700 r/min.
Preferably, in S2, thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate are mixed for 30-45min at a mixing speed of 500-550 r/min.
Preferably, in S3, the mixture A and the mixture B are mixed for 30-60min at a mixing speed of 650-750 r/min.
Preferably, in S4, the mixture C is ground and dispersed by a three-roll mill, ground into a homogeneous slurry, and finally filtered through a 500-mesh screen to obtain the electronic component slurry.
Tert-butylhydroquinone, also known as tert-butylhydroquinone, abbreviated as TBHQ, has a molecular formula of C10H14O2 and a relative molecular mass of 166.22. The tert-butyl hydroquinone is white powdery crystal and has special smell, the melting point is 126.5-128.5, and the boiling point is 300 ℃. Is easily soluble in ethanol and ether, soluble in oil and insoluble in water. The product is stable to heat, does not form colored substances when meeting iron and copper ions, but can be pink under the condition of visible light or alkalinity, and the tert-butyl hydroquinone has stronger oxidation resistance;
dibutyltin dilaurate is an organic tin additive, can be dissolved in organic solvents such as benzene, toluene, carbon tetrachloride, ethyl acetate, chloroform, acetone, petroleum ether and the like and all industrial plasticizers, and is insoluble in water. The multipurpose high boiling point organotin catalyst dibutyltin dilaurate in the market is usually liquefied specially, is light yellow or colorless oily liquid at normal temperature, is white crystal at low temperature, can be used for polyvinyl chloride plastic additives, and has excellent lubricating property, transparency and weather resistance. The sulfide pollution resistance is better. The product can be used as a stabilizer in a soft transparent product, as an efficient lubricant in a hard transparent product, as a catalyst for the cross-linking reaction of acrylate rubber and carboxyl rubber, the synthesis of polyurethane foam and the synthesis of polyester, and as a catalyst for room-temperature vulcanized silicone rubber, and has excellent light stability and transparency;
the invention has the beneficial effects that:
the antioxidant performance can be improved by matching the thiodipropionic acid and the tert-butyl hydroquinone;
the thermal stability can be improved by matching dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate;
the invention has excellent oxidation resistance and thermal stability, and the preparation method is simple.
Detailed Description
The present invention will be further illustrated with reference to the following specific examples.
Example one
The invention provides electronic component slurry which comprises the following raw materials in parts by weight: 10 parts of silver powder, 5 parts of adhesive, 1 part of glass powder, 1 part of epoxy resin, 2 parts of thiodipropionic acid, 1 part of tert-butyl hydroquinone, 3 parts of dibutyltin dilaurate, 1 part of calcium phosphite, 5 parts of zinc carbonate, 3 parts of dibasic lead phthalate and 1 part of calcium stearate;
the preparation method comprises the following steps:
s1: mixing silver powder, adhesive, glass powder and epoxy resin for 20min at a mixing speed of 600r/min to obtain a mixture A;
s2: mixing thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate for 30min at a mixing speed of 500r/min to obtain a mixture B;
s3: mixing the mixture A and the mixture B for 30min at a mixing speed of 650r/min to obtain a mixture C;
s4: grinding and dispersing the mixture C by a three-roll mill, grinding into homogeneous slurry, and finally filtering by a 500-mesh screen to obtain the electronic component slurry.
Example two
The invention provides electronic component slurry which comprises the following raw materials in parts by weight: 12 parts of silver powder, 7 parts of adhesive, 3 parts of glass powder, 3 parts of epoxy resin, 5 parts of thiodipropionic acid, 3 parts of tert-butyl hydroquinone, 5 parts of dibutyltin dilaurate, 2 parts of calcium phosphite, 7 parts of zinc carbonate, 5 parts of dibasic lead phthalate and 3 parts of calcium stearate;
the preparation method comprises the following steps:
s1: mixing silver powder, adhesive, glass powder and epoxy resin for 30min at a mixing speed of 650r/min to obtain a mixture A;
s2: mixing thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate for 35min at a mixing speed of 520r/min to obtain a mixture B;
s3: mixing the mixture A and the mixture B for 45min at the mixing speed of 700r/min to obtain a mixture C;
s4: grinding and dispersing the mixture C by a three-roll mill, grinding into homogeneous slurry, and finally filtering by a 500-mesh screen to obtain the electronic component slurry.
EXAMPLE III
The invention provides electronic component slurry which comprises the following raw materials in parts by weight: 15 parts of silver powder, 10 parts of adhesive, 5 parts of glass powder, 5 parts of epoxy resin, 7 parts of thiodipropionic acid, 5 parts of tert-butyl hydroquinone, 8 parts of dibutyltin dilaurate, 3 parts of calcium phosphite, 10 parts of zinc carbonate, 9 parts of dibasic lead phthalate and 5 parts of calcium stearate;
the preparation method comprises the following steps:
s1: mixing silver powder, adhesive, glass powder and epoxy resin for 40min at the mixing speed of 700r/min to obtain a mixture A;
s2: mixing thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate for 45min at a mixing speed of 550r/min to obtain a mixture B;
s3: mixing the mixture A and the mixture B for 60min at a mixing speed of 750r/min to obtain a mixture C;
s4: grinding and dispersing the mixture C by a three-roll mill, grinding into homogeneous slurry, and finally filtering by a 500-mesh screen to obtain the electronic component slurry.
For the electronic component pastes prepared in the first to third examples, compared with the conventional electronic component paste, the experimental data are shown in the following table:
from the above table, it can be seen that the electronic component paste provided by the present invention has significantly improved oxidation resistance and thermal stability, and the second embodiment is the best embodiment.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The electronic component slurry is characterized by comprising the following raw materials in parts by weight: 10-15 parts of silver powder, 5-10 parts of adhesive, 1-5 parts of glass powder, 1-5 parts of epoxy resin, 2-7 parts of thiodipropionic acid, 1-5 parts of tert-butyl hydroquinone, 3-8 parts of dibutyltin dilaurate, 1-3 parts of calcium phosphite, 5-10 parts of zinc carbonate, 3-9 parts of dibasic lead phthalate and 1-5 parts of calcium stearate.
2. The electronic component paste as claimed in claim 1, comprising the following raw materials in parts by weight: 11-14 parts of silver powder, 6-9 parts of adhesive, 2-4 parts of glass powder, 2-4 parts of epoxy resin, 3-6 parts of thiodipropionic acid, 2-4 parts of tert-butyl hydroquinone, 4-7 parts of dibutyltin dilaurate, 1.5-2.5 parts of calcium phosphite, 6-9 parts of zinc carbonate, 4-8 parts of dibasic lead phthalate and 2-4 parts of calcium stearate.
3. The electronic component paste as claimed in claim 1, comprising the following raw materials in parts by weight: 12 parts of silver powder, 7 parts of adhesive, 3 parts of glass powder, 3 parts of epoxy resin, 4 parts of thiodipropionic acid, 3 parts of tert-butyl hydroquinone, 5 parts of dibutyltin dilaurate, 2 parts of calcium phosphite, 7 parts of zinc carbonate, 5 parts of dibasic lead phthalate and 3 parts of calcium stearate.
4. The processing technology of the electronic component slurry is characterized by comprising the following steps of:
s1: mixing silver powder, adhesive, glass powder and epoxy resin to prepare a mixture A;
s2: mixing thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate to obtain a mixture B;
s3: mixing the mixture A with the mixture B to obtain a mixture C;
s4: and grinding and dispersing the mixture C by a three-roll mill, grinding into homogeneous slurry, and finally filtering to obtain the electronic component slurry.
5. The process for processing electronic component paste according to claim 4, wherein in S1, the silver powder, the adhesive, the glass powder and the epoxy resin are mixed for 20-40min at a mixing speed of 600-700 r/min.
6. The process for processing electronic component paste according to claim 4, wherein in S2, thiodipropionic acid, tert-butyl hydroquinone, dibutyltin dilaurate, calcium phosphite, zinc carbonate, dibasic lead phthalate and calcium stearate are mixed, the mixing time is 30-45min, and the mixing speed is 500-550 r/min.
7. The processing technology of electronic component paste according to claim 4, wherein in S3, the mixture A and the mixture B are mixed for 30-60min at a mixing speed of 650-750 r/min.
8. The process for processing the paste for electronic components according to claim 4, wherein in the step S4, the mixture C is ground and dispersed by a three-high mill, ground into homogeneous paste, and finally filtered by a 500-mesh screen to obtain the paste for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110216113.5A CN112951482B (en) | 2021-02-26 | 2021-02-26 | Electronic component slurry and processing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110216113.5A CN112951482B (en) | 2021-02-26 | 2021-02-26 | Electronic component slurry and processing technology |
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| CN112951482A true CN112951482A (en) | 2021-06-11 |
| CN112951482B CN112951482B (en) | 2022-05-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114307743A (en) * | 2022-01-04 | 2022-04-12 | 淮安市宝鼎科技有限公司 | Electronic component slurry and processing technology thereof |
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| CN114307743A (en) * | 2022-01-04 | 2022-04-12 | 淮安市宝鼎科技有限公司 | Electronic component slurry and processing technology thereof |
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