CN112941587A - Surface treatment method for high-corrosion-resistance rolled copper foil - Google Patents
Surface treatment method for high-corrosion-resistance rolled copper foil Download PDFInfo
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- CN112941587A CN112941587A CN202110122156.7A CN202110122156A CN112941587A CN 112941587 A CN112941587 A CN 112941587A CN 202110122156 A CN202110122156 A CN 202110122156A CN 112941587 A CN112941587 A CN 112941587A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
- C25F1/04—Pickling; Descaling in solution
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Abstract
The invention discloses a surface treatment method of a high-corrosion-resistance rolled copper foil, belonging to the technical field of surface treatment of rolled copper foils. Comprises the following steps: 1) pretreatment: soaking the rolled copper foil and the titanium iridium-coated anode plate in a pretreatment solution, and performing electrolytic degreasing on the two surfaces of the rolled copper foil and the titanium iridium-coated anode plate; 2) activation treatment: soaking the treated rolled copper foil in an activating solution; 3) electrodeposition of nickel: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 2) in an electrodeposition nickel solution, and performing electrodeposition of a metal nickel layer on two sides of the copper foil and the titanium iridium-coated anode plate; 4) passivation: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 3) in a passivation solution for passivation; 5) washing and drying: and (3) washing the rolled copper foil treated in the step 4) with pure water, and drying in a high-temperature oven. The invention carries out surface treatment on the rolled copper foil, and the uniform corrosion-resistant plating layer can be quickly formed on the surface of the rolled copper foil. The requirements of low profile, high electric conductivity, heat conduction and high corrosion resistance of the surface of the rolled copper foil are met.
Description
Technical Field
The invention belongs to the technical field of surface treatment of rolled copper foil, and particularly relates to a surface treatment method of high-corrosion-resistance rolled copper foil.
Background
The copper has excellent electric and heat conductivity, and becomes an essential material for electronic products. With the development of light weight and miniaturization of electronic products, copper foil is widely used in electronic products. Copper foils are classified into two main types, electrolytic copper foils and rolled copper foils, depending on the production method. Compared with electrolytic copper foil, the rolled copper foil has the characteristics of high copper purity, smooth and flat surface, compact crystallization and the like, and has obviously superior conductive and heat dissipation performance, so that the rolled copper foil becomes a preferred product of a conductive and heat dissipation substrate of a high-end electronic product. With the progress of electronic products, the electronic market has put new demands on rolled copper foil. In recent two years, in part of domestic and foreign customers, particularly in coastal area markets, rolled copper foil is used as a heat dissipation material and an electromagnetic shielding material, and higher requirements are put forward for the environmental corrosion resistance of the surface of the rolled copper foil, such as acid resistance, alkali resistance, salt resistance and the like.
The rolled copper foil is easy to generate chemical and electrochemical reactions in humid air to generate copper oxide or a copper discoloration product, and if the copper foil is subjected to rapid corrosion and discoloration in an environment with electrolyte solutions such as acid, alkali, salt and the like, the chemical and electrochemical reactions of the copper foil are accelerated, so that the copper foil is unacceptable for high-end customers with certain special requirements, and the current production technology of the rolled copper foil is blank in the high-end heat dissipation shielding market.
Disclosure of Invention
The invention aims to provide a surface treatment method of a high-corrosion-resistance rolled copper foil.
In order to solve the technical problems, the invention adopts the following technical scheme:
a surface treatment method of a high corrosion-resistant rolled copper foil comprises the following steps:
1) pretreatment: soaking the rolled copper foil and the titanium iridium-coated anode plate in a treatment tank filled with a pretreatment solution, switching on a rectifier power supply, using the rolled copper foil as a cathode, and performing electrolytic degreasing on the two surfaces of the rolled copper foil for 10-30 s;
2) activation treatment: soaking the rolled copper foil treated in the step 1) in a treatment tank filled with an activation solution for 5-20 s;
3) electrodeposition of nickel: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 2) in a treatment tank filled with an electrodeposited nickel solution, switching on a rectifier power supply, taking the rolled copper foil as a cathode, and electrodepositing a metal nickel layer on two surfaces of the rolled copper foil for 30-60 s;
4) passivation: soaking the rolled copper foil and the titanium iridium-coated anode plate treated in the step 3) in a treatment tank filled with a passivation solution, switching on a rectifier power supply, and passivating two surfaces of the rectifier power supply for 10-20 s;
5) washing and drying: washing the rolled copper foil treated in the step 4) with pure water, and drying in a high-temperature oven at the temperature of 100-300 ℃ for 30-120 s.
In a further preferable mode of the above technical scheme, in the step 1), the pretreatment solution is a mixed solution of sodium hydroxide and sodium carbonate, the concentration of the sodium hydroxide is 30-60 g/L, the concentration of the sodium carbonate is 20-50 g/L, and the temperature of the pretreatment solution is 40-60 ℃.
In a further preferable mode of the above technical scheme, in the step 2), the activating solution is a dilute sulfuric acid solution, the concentration is 80-200 g/L, and the temperature of the activating solution is 20-40 ℃.
In a further preferred mode of the above technical solution, in the step 3), the nickel deposition solution is a mixed aqueous solution containing nickel metal salt and organic acid, the concentration of the nickel metal salt is 50-100 g/L, the concentration of the organic acid is 10-50 g/L, the temperature of the nickel electrodeposition solution is 30-40 ℃, and the pH value is 2.5-4.5.
In a further preferable mode of the technical scheme, in the step 4), the passivation solution is a mixed solution of zinc sulfate, chromium trioxide and a complexing agent, the concentration of the zinc sulfate is 5-10 g/L, the concentration of the chromium trioxide is 3-6 g/L, and the concentration of the complexing agent is 30-100/L; the temperature of the passivation solution is 30-40 ℃, and the pH value is 10-12.
In a further preferred mode of the above technical solution, the nickel-containing metal salt is one or a mixture of two of nickel sulfate and nickel chloride.
In a further preferred mode of the above technical solution, the organic acid is one or a mixture of two of acetic acid, tartaric acid, glycine and citric acid.
The invention carries out surface treatment on the rolled copper foil, and adopts an electrodeposition system taking low-concentration nickel sulfate as a main salt to quickly form a uniform corrosion-resistant coating on the surface of the rolled copper foil. The method meets the requirements of customers on low profile, high electric conductivity, heat conductivity and high corrosion resistance of the surface of the rolled copper foil, has the characteristics of simple process technology, low operation cost, small wastewater treatment pressure and the like, and belongs to an environment-friendly process.
Compared with the prior art, the invention has the following advantages:
(1) the low-concentration nickel sulfate-organic acid electrodeposition system is adopted, no additive is used, and the electrodeposition solution has single component and has the characteristics of difficult deposition of electroplating solution, low operability, low solution control difficulty, low production and operation cost and the like.
(2) The electro-deposition thickness and the particle size are strictly controlled, and the low-profile morphology characteristics of the surface of the rolled copper foil are kept.
(3) The treated rolled copper foil does not generate corrosion discoloration and nickel layer shedding in 15 days under the condition of a medium salt spray test; under the high temperature condition of 180 ℃ and 2h, no oxidation discoloration occurs, and the requirements of downstream application are met.
(4) In the invention, a hard rolled copper foil is selected as a substrate, and an electrodeposition process with low cost and low concentration of nickel sulfate as main salt is adopted to obtain a metal nickel layer with lower stress; by controlling the drying temperature and the drying time, the internal stress of a copper-nickel interface is reduced, and the problem that the product is scrapped due to edge warping caused by the internal metal stress of the ultrathin high-corrosion-resistance rolled copper foil is solved.
Drawings
FIG. 1 is an SEM image of a rolled copper surface after a corrosion resistance treatment.
Detailed Description
The invention is further illustrated with reference to specific examples, but the scope of the invention is not limited thereto.
Example 1
The surface treatment method of the high corrosion resistance rolled copper foil in the embodiment comprises the following steps:
1) pretreatment: soaking the rolled copper foil and the titanium iridium-coated anode plate in a treatment tank filled with a pretreatment solution, switching on a rectifier power supply, using the rolled copper foil as a cathode, and performing electrolytic degreasing on the two surfaces of the rolled copper foil for 30 s;
2) activation treatment: soaking the rolled copper foil treated in the step 1) in a treatment tank filled with an activation solution for 20 s;
3) electrodeposition of nickel: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 2) in a treatment tank filled with an electrodeposited nickel solution, switching on a rectifier power supply, taking the rolled copper foil as a cathode, and electrodepositing a metal nickel layer on two sides of the rolled copper foil for 60 s;
4) passivation: soaking the rolled copper foil and the titanium iridium-coated anode plate treated in the step 3) in a treatment tank filled with passivation solution, switching on a rectifier power supply, and passivating two surfaces of the rectifier power supply for 20 s;
5) washing and drying: washing the rolled copper foil treated in the step 4) with pure water, and drying in a high-temperature oven at 100 ℃ for 120 s.
The pretreatment solution in the step 1) is a mixed solution of sodium hydroxide and sodium carbonate, the concentration of the sodium hydroxide is 30g/L, the concentration of the sodium carbonate is 50g/L, and the temperature of the pretreatment solution is 60 ℃.
In the step 2), the activating solution is a dilute sulfuric acid solution, the concentration is 80g/L, and the temperature of the activating solution is 40 ℃.
The nickel deposition solution in the step 3) is a mixed aqueous solution containing nickel sulfate, nickel chloride, acetic acid and glycine, the nickel sulfate is 50g/L, the nickel chloride is 20g/L, the acetic acid is 40g/L, the glycine is 10g/L, the temperature of the nickel electrodeposition solution is 40 ℃, and the pH value is 2.5.
The passivation solution in the step 4) is a mixed solution of zinc sulfate, chromium trioxide and potassium pyrophosphate, wherein the concentration of the zinc sulfate is 5g/L, the concentration of the chromium trioxide is 3g/L, and the concentration of the potassium pyrophosphate is 30 g/L; the temperature of the passivation solution was 40 ℃ and the pH was 10.
Example 2
The surface treatment method of the high corrosion resistance rolled copper foil in the embodiment comprises the following steps:
1) pretreatment: soaking the rolled copper foil and the titanium iridium-coated anode plate in a treatment tank filled with a pretreatment solution, switching on a rectifier power supply, using the rolled copper foil as a cathode, and performing electrolytic degreasing on the two surfaces of the rolled copper foil for 10 s;
2) activation treatment: soaking the rolled copper foil treated in the step 1) in a treatment tank filled with an activation solution for 5 s;
3) electrodeposition of nickel: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 2) in a treatment tank filled with an electrodeposited nickel solution, switching on a rectifier power supply, taking the rolled copper foil as a cathode, and electrodepositing a metal nickel layer on two sides of the rolled copper foil for 30 s;
4) passivation: soaking the rolled copper foil and the titanium iridium-coated anode plate treated in the step 3) in a treatment tank filled with passivation solution, switching on a rectifier power supply, and passivating two surfaces of the rectifier power supply for 10 s;
5) washing and drying: washing the rolled copper foil treated in the step 4) with pure water, and drying in a high-temperature oven at the temperature of 300 ℃ for 30 s.
The pretreatment solution in the step 1) is a mixed solution of sodium hydroxide and sodium carbonate, the concentration of the sodium hydroxide is 60g/L, the concentration of the sodium carbonate is 20g/L, and the temperature of the pretreatment solution is 40 ℃.
In the step 2), the activating solution is a dilute sulfuric acid solution, the concentration is 200g/L, and the temperature of the activating solution is 20 ℃.
The nickel deposition solution in the step 3) is a mixed aqueous solution containing nickel sulfate, tartaric acid and glycine, the concentration of the nickel sulfate is 100g/L, the concentration of the tartaric acid is 20g/L, the concentration of the glycine is 20g/L, the temperature of the nickel electrodeposition solution is 30 ℃, and the pH value is 4.5.
The passivation solution in the step 4) is a mixed solution of zinc sulfate, chromium trioxide and potassium pyrophosphate, the concentration of the zinc sulfate is 10g/L, the concentration of the chromium trioxide is 6g/L, and the concentration of the potassium pyrophosphate is 100/L; the temperature of the passivation solution was 30 ℃ and the pH was 12.
Example 3
The surface treatment method of the high corrosion resistance rolled copper foil in the embodiment comprises the following steps:
1) pretreatment: soaking the rolled copper foil and the titanium iridium-coated anode plate in a treatment tank filled with a pretreatment solution, switching on a rectifier power supply, using the rolled copper foil as a cathode, and performing electrolytic degreasing on the two surfaces of the rolled copper foil for 20 s;
2) activation treatment: soaking the rolled copper foil treated in the step 1) in a treatment tank filled with an activation solution for 15 s;
3) electrodeposition of nickel: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 2) in a treatment tank filled with an electrodeposited nickel solution, switching on a rectifier power supply, taking the rolled copper foil as a cathode, and electrodepositing a metal nickel layer on two sides of the rolled copper foil for 45 s;
4) passivation: soaking the rolled copper foil and the titanium iridium-coated anode plate treated in the step 3) in a treatment tank filled with passivation solution, switching on a rectifier power supply, and passivating two surfaces of the rectifier power supply for 15 s;
5) washing and drying: washing the rolled copper foil treated in the step 4) with pure water, and drying in a high-temperature oven at the temperature of 200 ℃ for 80 s.
The pretreatment solution in the step 1) is a mixed solution of sodium hydroxide and sodium carbonate, the concentration of the sodium hydroxide is 45g/L, the concentration of the sodium carbonate is 35g/L, and the temperature of the pretreatment solution is 50 ℃.
In the step 2), the activating solution is a dilute sulfuric acid solution, the concentration is 150g/L, and the temperature of the activating solution is 30 ℃.
The nickel deposition solution in the step 3) is a mixed aqueous solution containing nickel sulfate, nickel chloride, acetic acid and citric acid, the concentration of the nickel sulfate is 80g/L, the concentration of the nickel chloride is 20g/L, the concentration of the acetic acid is 20g/L, the concentration of the citric acid is 30g/L, the temperature of the nickel electrodeposition solution is 35 ℃, and the pH value is 4.
The passivation solution in the step 4) is a mixed solution of zinc sulfate, chromium trioxide and potassium pyrophosphate, the concentration of the zinc sulfate is 8g/L, the concentration of the chromium trioxide is 4.5g/L, and the concentration of the potassium pyrophosphate is 80/L; the temperature of the passivation solution was 35 ℃ and the pH was 11.
To demonstrate the surface properties of the rolled copper foil treated by the method of the present invention, it is shown in Table 1.
Example 4 is a rolled copper foil which has not been treated by the process of the present invention.
TABLE 1
| Roughness Ra (mum) | Neutral salt spray test, 15 days | 180℃，2h | Warp of | |
| Example 1 | 0.095 | Non-corrosive nickel layer does not fall off | Does not oxidize | Without warping |
| Example 2 | 0.098 | Non-corrosive nickel layer does not fall off | Does not oxidize | Without warping |
| Example 3 | 0.098 | Non-corrosive nickel layer does not fall off | Does not oxidize | Without warping |
| Example 4 | 0.093 | Severe corrosion and discoloration | Oxidation by oxygen | Without warping |
To illustrate the appearance of the treated copper foil according to the method of the present invention, a scanning electron micrograph of the corrosion resistant treated rolled copper foil is provided as shown in FIG. 1.
Claims (7)
1. A surface treatment method of a high corrosion-resistant rolled copper foil is characterized by comprising the following steps:
1) pretreatment: soaking the rolled copper foil and the titanium iridium-coated anode plate in a treatment tank filled with a pretreatment solution, switching on a rectifier power supply, using the rolled copper foil as a cathode, and performing electrolytic degreasing on the two surfaces of the rolled copper foil for 10-30 s;
2) activation treatment: soaking the rolled copper foil treated in the step 1) in a treatment tank filled with an activation solution for 5-20 s;
3) electrodeposition of nickel: immersing the rolled copper foil and the titanium iridium-coated anode plate treated in the step 2) in a treatment tank filled with an electrodeposited nickel solution, switching on a rectifier power supply, taking the rolled copper foil as a cathode, and electrodepositing a metal nickel layer on two surfaces of the rolled copper foil for 30-60 s;
4) passivation: soaking the rolled copper foil and the titanium iridium-coated anode plate treated in the step 3) in a treatment tank filled with a passivation solution, switching on a rectifier power supply, and passivating two surfaces of the rectifier power supply for 10-20 s;
5) washing and drying: washing the rolled copper foil treated in the step 4) with pure water, and drying in a high-temperature oven at the temperature of 100-300 ℃ for 30-120 s.
2. The method for surface treatment of highly corrosion-resistant rolled copper foil according to claim 1, wherein the pretreatment solution in step 1) is a mixed solution of sodium hydroxide and sodium carbonate, the concentration of sodium hydroxide is 30 to 60g/L, the concentration of sodium carbonate is 20 to 50g/L, and the temperature of the pretreatment solution is 40 to 60 ℃.
3. The method for surface treatment of highly corrosion-resistant rolled copper foil according to claim 1, wherein the activating solution in step 2) is a dilute sulfuric acid solution with a concentration of 80-200 g/L and the temperature of the activating solution is 20-40 ℃.
4. The method for surface treatment of highly corrosion-resistant rolled copper foil according to claim 1, wherein the nickel deposition solution in step 3) is a mixed aqueous solution of nickel-containing metal salt and organic acid, the nickel metal salt has a concentration of 50-100 g/L and the organic acid has a concentration of 10-50 g/L, the temperature of the nickel electrodeposition solution is 30-40 ℃, and the pH value is 2.5-4.5.
5. The surface treatment method of the highly corrosion-resistant rolled copper foil according to claim 1, wherein the passivation solution in step 4) is a mixed solution of zinc sulfate, chromium trioxide and a complexing agent, the concentration of the zinc sulfate is 5-10 g/L, the concentration of the chromium trioxide is 3-6 g/L, and the concentration of the complexing agent is 30-100/L; the temperature of the passivation solution is 30-40 ℃, and the pH value is 10-12.
6. The method for surface treatment of highly corrosion-resistant rolled copper foil according to claim 4, wherein the nickel-containing metal salt is one or a mixture of nickel sulfate and nickel chloride.
7. The method for surface treatment of rolled copper foil with high corrosion resistance according to claim 4, wherein the organic acid is one or a mixture of two of acetic acid, tartaric acid, glycine and citric acid.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113463140A (en) * | 2021-06-23 | 2021-10-01 | 灵宝金源朝辉铜业有限公司 | Nickel plating solution and high-corrosion-resistance double-sided thick nickel plating rolled copper foil process |
| CN115248224A (en) * | 2022-07-29 | 2022-10-28 | 武汉钢铁有限公司 | Observation and analysis method for hot-dip zinc-based multi-element alloy coating inhibition layer |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940145A (en) * | 2005-09-27 | 2007-04-04 | 日立电线株式会社 | Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| CN102534710A (en) * | 2012-03-12 | 2012-07-04 | 山东金宝电子股份有限公司 | Black coarsening treatment process for surface of very-low-profile copper foil |
| CN104962965A (en) * | 2015-05-29 | 2015-10-07 | 灵宝金源朝辉铜业有限公司 | Environmental protection ashing treatment process of calendaring copper foil |
-
2021
- 2021-01-27 CN CN202110122156.7A patent/CN112941587A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1940145A (en) * | 2005-09-27 | 2007-04-04 | 日立电线株式会社 | Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil |
| CN102534710A (en) * | 2012-03-12 | 2012-07-04 | 山东金宝电子股份有限公司 | Black coarsening treatment process for surface of very-low-profile copper foil |
| CN104962965A (en) * | 2015-05-29 | 2015-10-07 | 灵宝金源朝辉铜业有限公司 | Environmental protection ashing treatment process of calendaring copper foil |
Non-Patent Citations (1)
| Title |
|---|
| 刘仁志: "影响镀镍层内应力的因素及排除方法", 《印制电路信息》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113463140A (en) * | 2021-06-23 | 2021-10-01 | 灵宝金源朝辉铜业有限公司 | Nickel plating solution and high-corrosion-resistance double-sided thick nickel plating rolled copper foil process |
| CN115248224A (en) * | 2022-07-29 | 2022-10-28 | 武汉钢铁有限公司 | Observation and analysis method for hot-dip zinc-based multi-element alloy coating inhibition layer |
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Application publication date: 20210611 |