CN102534710A - Black coarsening treatment process for surface of very-low-profile copper foil - Google Patents
Black coarsening treatment process for surface of very-low-profile copper foil Download PDFInfo
- Publication number
- CN102534710A CN102534710A CN2012100620170A CN201210062017A CN102534710A CN 102534710 A CN102534710 A CN 102534710A CN 2012100620170 A CN2012100620170 A CN 2012100620170A CN 201210062017 A CN201210062017 A CN 201210062017A CN 102534710 A CN102534710 A CN 102534710A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- temperature
- treatment time
- coupling agent
- silane coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention relates to a black coarsening treatment process for the surface of a very-low-profile copper foil, belonging to the technical field of high-precision electrolytic copper foil production technology. After the surface of the very-low-profile copper foil is subjected to the treatments of coarsening, blackening, antioxidation, silane coupling agent spraying, and drying, the roughness of the surface is less than 2.5 microns, is of a black color, has good corrosion and etching resistance and excellent oxidation resistance to normal temperature and high temperature, so that the very-low-profile copper foil is particularly applicable to flexible copper clad laminates and high-frequency circuit boards.
Description
Technical field
The present invention relates to a kind of black roughening treatment technology of ultralow profile copper foil surface, belong to the high-precision electrolytic copper foil technical field of producing.
Background technology
Flexible print wiring board (FPC); Be called for short soft board; Have advantages such as softness, light, thin and deflection, fast under light, thin, short, the little trend of trend, be widely used in products such as notebook computer, digital camera, mobile phone, pick up camera, liquid-crystal display at the information electronic product.China is printed circuit board big export country; Degree of integration increase along with printed circuit board; Electronic circuit trends towards high meticulous and high-density; Signal transmission frequencies is increasingly high, and this Copper Foil that require to use must have excellent etching, oxidation-resistance, unit elongation, ultralow characteristics such as surface profile.At present; The production technology of domestic high-grade electrolytic copper foil is compared with the U.S., Japan and is had big gap; Caused situation, particularly FPC that high-grade Copper Foil mainly relies on import with ultralow profile (VLP) paper tinsel, most from external import; Domestic FPC is also not high with Copper Foil manufacturer's state of the art, and output is also very little.
Electrolytic copper foil is one of main raw material of producing of PCB, and its manufacture craft has two kinds of rolling process and electrolytic process, and rolled copper foil has bigger advantage in performances such as unit elongation, anti-bendings, makes former FPC manufacturer only use rolled copper foil.In recent years, along with the raising of electrolytic copper foil production technology, Japanese part Copper Foil producer had developed and had satisfied the electrolytic copper foil that FPC requires.Because the lifting of electrolytic copper foil manufacturing technology and advantage in price, the increasing FPC that is applied to of electrolytic copper foil, and the trend of the rolled copper foil of alternative same specification is arranged.
FPC uses electrolytic copper foil, and its main characteristic is low profile, high-elongation and high-tensile, and this all helps improving anti-bending (MIT) performance.The surfaceness of Copper Foil is low more, and the mechanical thickness of processing FPC can reduce, and MIT property can significantly improve.Higher unit elongation, the copper in the time of can effectively solving the FPC bending splits problem.High-tensile then can improve the Copper Foil fatigue property.In general, high-end FPC is with ultralow profile electrolytic copper foil, and surfaceness Rz is below 2.5 μ m, and thickness is also many at 9-12 μ m.The technological difficulties of producing are the electrolysis hair paper tinsel and the fine coarsening technique of surface-treated of high uniformity.In addition, because the long-term dependence on import of FPC Copper Foil, formed a kind of appearance of black requirement of custom in FCCL and FPC industry.
Summary of the invention
The object of the present invention is to provide a kind of black roughening treatment technology of ultralow profile copper foil surface.The VLP Copper Foil of art breading of the present invention, surfaceness are less than 2.5 μ m, and surperficial black in color has good anti-corrosion and etching, have excellent anti-normal temperature, high temperature oxidation resistance, are particularly suitable for FPC and make.Owing to have ultralow surface profile, can effectively solve electromagnetic signal and in transmission course, get " skin effect " problem, so also be applicable to high-frequency circuit board.
The present invention adopts following technical scheme:
The black roughening treatment technology of a kind of ultralow profile copper foil surface of the present invention, special character is that its technical process is: adopt ultralow profile Copper Foil through the step of alligatoring-melanism-anti-oxidation-silane coupling agent-oven dry Copper Foil to be handled; Wherein alligatoring is adopted and is electroplated the copper-nickel alloy processing, and melanism adopts electro-coppering-cobalt-iron alloy, and anti-oxidation employing electro-galvanizing-Chrome metal powder is handled, and silane coupling agent is selected epoxy group(ing) or amino silicane coupling agent for use, and oven dry adopts electrothermal tube to heat.
Concrete technical process is following:
1, alligatoring: after copper sulfate, single nickel salt dissolved respectively, mix, add sulfuric acid, pump into the alligatoring groove after mixing and electroplate; Cu wherein
2+16-25g/L, Ni
2+10-16g/L, H
2SO
480-220g/L, temperature 20-35 ℃, current density 20-50A/dm
2, treatment time 5-15s.
The purpose of alligatoring is to improve the peel strength of Copper Foil in copper-clad plate.
2, melanism: after copper sulfate, rose vitriol, ferrous sulfate dissolved respectively, mix, add sulfuric acid and additive, pump into the melanism groove after stirring and electroplate; Cu wherein
2+5-10g/L, Co
2+0.2-2.5g/L, Fe
2+0.3-3.0g/L, H
2SO
480-150g/L, additive 0.3-25g/L, temperature 20-45 ℃, current density 3.5-15A/dm
2, treatment time 2-15s.
Described additive is selected from a kind of in sodium arseniate, sodium metaarsenate, antimonypotassium tartrate, ammonium sulfate, ammonium citrate, ammonium acetate, ammonium thiocyanide, Rhocya, an ammonium nitrate.
Melanism is to electroplate the copper-cobalt-iron alloy of one deck black, and main purpose is to improve the erosion resistance of Copper Foil.
3, anti-oxidation: as potassiumchromate, zinc sulfate, potassium pyrophosphate to be dissolved respectively, zinc sulfate is slowly added in the potassium pyrophosphate, and stir fast, mix the back and add potassiumchromate, electroplate with pumping into anti-oxidation groove behind sulfuric acid or the Pottasium Hydroxide adjusting pH value; Cr wherein
6+1.5-15g/L, Zn
2+0.2-8 g/L, K
4P
2O
780-220 g/L, PH 9-12, temperature is 25-50 ℃, current density is 2.0-10 A/dm
2Treatment time 0.5-5s.
Anti-oxidation step is to electroplate one deck zinc-Chrome metal powder, mainly is anti-normal temperature, the high temperature oxidation resistance that improves Copper Foil.
4, silane coupling agent: silane coupling agent is added in the entry, be sprayed at copper foil surface after stirring, silane coupling agent 0.5-10g/L wherein, temperature 25-30 ℃, treatment time 2-3s.
The main purpose of spraying silane coupling agent is in order to improve the peel strength of Copper Foil in copper-clad plate.
5, oven dry: temperature 100-300 ℃, treatment time 3-8s.
The purpose of oven dry is to remove the moisture content of copper foil surface, as long as can make Copper Foil dry.
The black roughening treatment technology of a kind of ultralow profile copper foil surface of the present invention, the VLP Copper Foil roughness of processing is less than 2.5 μ m, surperficial black in color.Have good anti-corrosion and etching, have excellent anti-normal temperature, high temperature oxidation resistance, be particularly suitable for FPC and make, can effectively solve electromagnetic signal and in transmission course, get " skin effect " problem, so also be applicable to high-frequency circuit board.
Description of drawings
The black roughening treatment process flow sheet of a kind of ultralow profile copper foil surface of Fig. 1 the present invention.
The ultra-thin VLP Copper Foil of 12 μ m SEM photo before Fig. 2 art breading of the present invention.
12 μ m black Copper Foil SEM photos after Fig. 3 art breading of the present invention.
Embodiment
Provide embodiment of the present invention below, further specify technical solution of the present invention, but embodiment of the present invention is not limited to following embodiment.
Embodiment 1
A kind of black roughening treatment technology of ultralow profile copper foil surface, concrete treatment condition are following:
(1) alligatoring Cu
2+16g/L, Ni
2+12g/L, H
2SO
4100g/L, 25 ℃ of temperature, current density 35A/dm
2, treatment time 7s.
(2) melanism: Cu
2+6g/L, Co
2+0.8g/L, Fe
2+1.0g/L, H
2SO
4150g/L, additive 1.0g/L, 20 ℃ of temperature, current density 6A/dm
2, treatment time 10s.
(3) anti-oxidation: Cr
6+5.8g/L, Zn
2+2 .5g/L, K
4P
2O
7150 g/L, PH 11, and temperature is 40 ℃, and current density is 5.8 A/dm
2Treatment time 2.6s.
(4) silane coupling agent: 2g/L, 30 ℃ of temperature, treatment time 2s.
(5) oven dry: 200 ℃ of temperature, treatment time 4s.
Embodiment 2
(1) alligatoring Cu
2+25g/L, Ni
2+10g/L, H
2SO
480g/L, 20 ℃ of temperature, current density 50A/dm
2, treatment time 5s.
(2) melanism: Cu
2+10g/L, Co
2+0.2g/L, Fe
2+0.5g/L, H
2SO
480g/L, additive 25g/L, 35 ℃ of temperature, current density 8.5A/dm
2, treatment time 8s.
(3) anti-oxidation: Cr
6+15g/L, Zn
2+5 g/L, K
4P
2O
7220 g/L, PH 9.5, and temperature is 45 ℃, and current density is 10 A/dm
2Treatment time 0.5s.
(4) silane coupling agent: 10g/L, 30 ℃ of temperature, treatment time 3s.
(5) oven dry: 300 ℃ of temperature, treatment time 3s.
Embodiment 3
(1) alligatoring Cu
2+20g/L, Ni
2+16g/L, H
2SO
4220g/L, 35 ℃ of temperature, current density 20A/dm
2, treatment time 15s.
(2) melanism: Cu
2+5g/L, Co
2+2.5g/L, Fe
2+0.3g/L, H
2SO
4100g/L, additive 0.3g/L, 45 ℃ of temperature, current density 4.5A/dm
2, treatment time 15s.
(3) anti-oxidation: Cr
6+1.5g/L, Zn
2+0.2g/L, K
4P
2O
780 g/L, PH 12, and temperature is 50 ℃, and current density is 10A/dm
2Treatment time 5s.
(4) silane coupling agent: 0.5g/L, 25 ℃ of temperature, treatment time 3s.
(5) oven dry: 100 ℃ of temperature, treatment time 8s.
Embodiment 4
(1) alligatoring Cu
2+18g/L, Ni
2+13g/L, H
2SO
4160g/L, 30 ℃ of temperature, current density 25A/dm
2, treatment time 12s.
(2) melanism: Cu
2+7.5g/L, Co
2+1.5g/L, Fe
2+0.5g/L, H
2SO
4120g/L, additive 5g/L, 35 ℃ of temperature, current density 10A/dm
2, treatment time 8.5s.
(3) anti-oxidation: Cr
6+5.5g/L, Zn
2+2.4 g/L, K
4P
2O
7140 g/L, PH 11.5, and temperature is 35 ℃, and current density is 2.5 A/dm
2Treatment time 4.5s.
(4) silane coupling agent: 2.5g/L, 25 ℃ of temperature, treatment time 2s.
(5) oven dry: 260 ℃ of temperature, treatment time 4s.
Embodiment 5
(1) alligatoring Cu
2+22g/L, Ni
2+13g/L, H
2SO
4110g/L, 29 ℃ of temperature, current density 32A/dm
2, treatment time 7s.
(2) melanism: Cu
2+6.5g/L, Co
2+2.5g/L, Fe
2+3.0g/L, H
2SO
4120g/L, additive 1.5 g/L, 25 ℃ of temperature, current density 12.5A/dm
2, treatment time 8s.
(3) anti-oxidation: Cr
6+8g/L, Zn
2+8 g/L, K
4P
2O
7180 g/L, PH 10.5, and temperature is 25 ℃, and current density is 2.0 A/dm
2Treatment time 5s.
(4) silane coupling agent: 0.5g/L, 27 ℃ of temperature, treatment time 2s.
(5) oven dry: 300 ℃ of temperature, treatment time 3s.
Above embodiment has following characteristics:
1,12 μ m VLP Copper Foils of art breading of the present invention, roughness is less than 2.5 μ m, surperficial black in color.
2, the Copper Foil of art breading of the present invention has good anti-corrosion and etching, has excellent anti-normal temperature, high temperature oxidation resistance, is particularly suitable for FPC and makes.
3, the Copper Foil of art breading of the present invention has ultralow surface profile, can effectively solve electromagnetic signal and in transmission course, get " skin effect " problem, so also be applicable to high-frequency circuit board.
Claims (5)
1. the black roughening treatment technology of a ultralow profile copper foil surface is characterized in that technical process is:
Alligatoring-melanism-anti-oxidation-silane coupling agent-oven dry.
2. a kind of according to claim 1 black roughening treatment technology of ultralow profile copper foil surface is characterized in that concrete process step is:
1), alligatoring: after copper sulfate, single nickel salt dissolved respectively, mix, add sulfuric acid, pump into the alligatoring groove after mixing and electroplate;
2), melanism: after copper sulfate, rose vitriol, ferrous sulfate dissolved respectively, mix, add sulfuric acid and additive, pump into the melanism groove after stirring and electroplate;
Said additive is a kind of in sodium arseniate, sodium metaarsenate, antimonypotassium tartrate, ammonium sulfate, ammonium citrate, ammonium acetate, ammonium thiocyanide, Rhocya, an ammonium nitrate;
3), anti-oxidation: as potassiumchromate, zinc sulfate, potassium pyrophosphate to be dissolved respectively, zinc sulfate is slowly added in the potassium pyrophosphate, and stir fast, mix the back and add potassiumchromate, electroplate with pumping into anti-oxidation groove behind sulfuric acid or the Pottasium Hydroxide adjusting pH value;
4), silane coupling agent: silane coupling agent is added in the entry, be sprayed at copper foil surface after stirring;
5), oven dry.
3. like the black roughening treatment technology of the said a kind of ultralow profile copper foil surface of claim 2, it is characterized in that processing condition involved in each step are:
1), alligatoring: Cu
2+16-25g/L, Ni
2+10-16g/L, H
2SO
480-220g/L, temperature 20-35 ℃, current density 20-50A/dm
2, treatment time 5-15s;
2), melanism: Cu
2+5-10g/L, Co
2+0.2-2.5g/L, Fe
2+0.3-3.0g/L, H
2SO
480-150g/L, additive 0.3-25g/L, temperature 20-45 ℃, current density 3.5-15A/dm
2, treatment time 2-15s;
3), anti-oxidation: Cr
6+1.5-15g/L, Zn
2+0.2-8 g/L, K
4P
2O
780-220 g/L, PH 9-12, temperature is 25-50 ℃, current density is 2.0-10 A/dm
2Treatment time 0.5-5s;
4), silane coupling agent: silane coupling agent 0.5-10g/L, temperature 25-30 ℃, treatment time 2-3s;
5), the oven dry: temperature 100-300 ℃, treatment time 3-8s.
4. the ultralow profile Copper Foil that obtains through the said treatment process of the arbitrary claim of claim 1-3, its surfaceness is less than 2.5 μ m, surperficial black in color.
5. the ultralow profile Copper Foil that obtains through the said treatment process of the arbitrary claim of claim 1-3 is applied to flexibility coat copper plate or high-frequency circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100620170A CN102534710A (en) | 2012-03-12 | 2012-03-12 | Black coarsening treatment process for surface of very-low-profile copper foil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2012100620170A CN102534710A (en) | 2012-03-12 | 2012-03-12 | Black coarsening treatment process for surface of very-low-profile copper foil |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102534710A true CN102534710A (en) | 2012-07-04 |
Family
ID=46342695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012100620170A Pending CN102534710A (en) | 2012-03-12 | 2012-03-12 | Black coarsening treatment process for surface of very-low-profile copper foil |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102534710A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103469267A (en) * | 2013-08-07 | 2013-12-25 | 江西铜业股份有限公司 | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same |
CN104694939A (en) * | 2015-04-07 | 2015-06-10 | 河南红日铜箔科技有限公司 | Surface treatment technology for ultralow-surface-roughness copper foil |
CN105002530A (en) * | 2015-08-10 | 2015-10-28 | 灵宝华鑫铜箔有限责任公司 | Surface treatment process for improving copper foil high-temperature anti-oxidation performance |
CN106757245A (en) * | 2016-11-16 | 2017-05-31 | 山东金宝电子股份有限公司 | A kind of process of surface treatment of melanism Copper Foil |
CN110029391A (en) * | 2019-03-28 | 2019-07-19 | 中国恩菲工程技术有限公司 | Modified copper foil in surface and preparation method thereof |
CN110952117A (en) * | 2018-09-27 | 2020-04-03 | 金居开发股份有限公司 | Micro-rough electrolytic copper foil and copper foil substrate |
CN112941587A (en) * | 2021-01-27 | 2021-06-11 | 山西北铜新材料科技有限公司 | Surface treatment method for high-corrosion-resistance rolled copper foil |
US11053602B2 (en) | 2018-09-17 | 2021-07-06 | Co-Tech Development Corp. | Micro-roughened electrodeposited copper foil and copper foil substrate |
CN113549965A (en) * | 2021-07-30 | 2021-10-26 | 江苏铭丰电子材料科技有限公司 | Electroplating blackening process for ultra-low profile copper foil |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1441046A1 (en) * | 2001-10-30 | 2004-07-28 | Nikko Materials Company, Limited | SURFACE−TREATED COPPER FOIL |
CN101906630A (en) * | 2010-08-03 | 2010-12-08 | 山东金宝电子股份有限公司 | Black surface treatment process of electrolytic copper foil |
CN102168292A (en) * | 2011-03-25 | 2011-08-31 | 梅县金象铜箔有限公司 | High-ductility electrolytic copper foil surface reddening method |
TW201137188A (en) * | 2010-04-22 | 2011-11-01 | Nanya Plastics Corp | Ultra-thin copper foil using very low profile copper foil as carrier and manufacturing method thereof |
-
2012
- 2012-03-12 CN CN2012100620170A patent/CN102534710A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1441046A1 (en) * | 2001-10-30 | 2004-07-28 | Nikko Materials Company, Limited | SURFACE−TREATED COPPER FOIL |
CN1545570A (en) * | 2001-10-30 | 2004-11-10 | 株式会社日矿材料 | Surface-treated copper foil |
TW201137188A (en) * | 2010-04-22 | 2011-11-01 | Nanya Plastics Corp | Ultra-thin copper foil using very low profile copper foil as carrier and manufacturing method thereof |
CN101906630A (en) * | 2010-08-03 | 2010-12-08 | 山东金宝电子股份有限公司 | Black surface treatment process of electrolytic copper foil |
CN102168292A (en) * | 2011-03-25 | 2011-08-31 | 梅县金象铜箔有限公司 | High-ductility electrolytic copper foil surface reddening method |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103469267A (en) * | 2013-08-07 | 2013-12-25 | 江西铜业股份有限公司 | Process method for carrying out surface treatment on electrolysis copper foil, and cooper foil treated by using the same |
CN103469267B (en) * | 2013-08-07 | 2015-11-25 | 江西省江铜-耶兹铜箔有限公司 | A kind of processing method of surface-treated electro-deposited copper foil and the Copper Foil of process thereof |
CN104694939A (en) * | 2015-04-07 | 2015-06-10 | 河南红日铜箔科技有限公司 | Surface treatment technology for ultralow-surface-roughness copper foil |
CN105002530A (en) * | 2015-08-10 | 2015-10-28 | 灵宝华鑫铜箔有限责任公司 | Surface treatment process for improving copper foil high-temperature anti-oxidation performance |
CN106757245A (en) * | 2016-11-16 | 2017-05-31 | 山东金宝电子股份有限公司 | A kind of process of surface treatment of melanism Copper Foil |
CN106757245B (en) * | 2016-11-16 | 2019-05-21 | 山东金宝电子股份有限公司 | A kind of process of surface treatment of melanism copper foil |
US11053602B2 (en) | 2018-09-17 | 2021-07-06 | Co-Tech Development Corp. | Micro-roughened electrodeposited copper foil and copper foil substrate |
CN110952117A (en) * | 2018-09-27 | 2020-04-03 | 金居开发股份有限公司 | Micro-rough electrolytic copper foil and copper foil substrate |
CN110952117B (en) * | 2018-09-27 | 2021-03-12 | 金居开发股份有限公司 | Micro-rough electrolytic copper foil and copper foil substrate |
CN110029391A (en) * | 2019-03-28 | 2019-07-19 | 中国恩菲工程技术有限公司 | Modified copper foil in surface and preparation method thereof |
CN112941587A (en) * | 2021-01-27 | 2021-06-11 | 山西北铜新材料科技有限公司 | Surface treatment method for high-corrosion-resistance rolled copper foil |
CN113549965A (en) * | 2021-07-30 | 2021-10-26 | 江苏铭丰电子材料科技有限公司 | Electroplating blackening process for ultra-low profile copper foil |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102534710A (en) | Black coarsening treatment process for surface of very-low-profile copper foil | |
CN106757245B (en) | A kind of process of surface treatment of melanism copper foil | |
CN101906630B (en) | Black surface treatment process of electrolytic copper foil | |
CN102586831B (en) | Surface treatment process for reducing roughness of electrolytic copper foil | |
CN101935856B (en) | Back face treatment process of electrolytic copper foil | |
CN104962965B (en) | The environment-friendly type ashing handling process of rolled copper foil | |
CN102618902B (en) | Surface treatment process of copper foil for flexible copper-clad plate | |
TWI645759B (en) | Surface-treated copper foil for printed wiring board, copper-clad laminated board for printed wiring board, and printed wiring board | |
JP5871426B2 (en) | Surface treated copper foil for high frequency transmission, laminated plate for high frequency transmission and printed wiring board for high frequency transmission | |
KR20170094134A (en) | Free grounding film and manufacturing method therefor, and shielding circuit board including free grounding film and grounding method | |
JP6149066B2 (en) | Surface treated copper foil | |
CN106011965A (en) | Fine roughing treatment technology for surface of electrolytic copper foil | |
CN106191980A (en) | The surface Darkening process method of rolled copper foil | |
CN110453252B (en) | Manufacturing method of HVLP copper foil for high-frequency high-speed copper-clad plate | |
JP2015013474A (en) | Copper clad laminate for high-frequency substrate and surface-treated copper foil | |
CN112853408B (en) | Preparation method of ultrathin carrier-attached copper foil easy to peel and pure in interface | |
CN102383148A (en) | Mixed additive for electrolytic copper foil, preparation method for mixed additive, and method for preparing ultralow-profile electrolytic copper foil | |
CN113293417A (en) | Preparation method of bright high-conductivity graphene/copper composite material | |
CN102233699B (en) | Extremely thin copper foil using ultralow ridge copper foil as carrier and manufacturing method of extremely thin copper foil | |
CN107645852B (en) | Double-sided copper foil surface treatment process for high-frequency printed circuit board | |
CN105200479A (en) | Additive, electroplating liquid and method for roughening rolled copper foil | |
CN108060443A (en) | A kind of preparation method of the melanism composite bed on extruded metal paper tinsel surface | |
CN114016098A (en) | Copper-clad plate electroplating Ni-Co-Ce film plating solution for PCB and film preparation method | |
CN206042523U (en) | FPC metal reinforcement board with black SUS board | |
TW200938014A (en) | Composite material for electrical/electronic component, electrical/electronic component, and method for producing composite material for electrical/electronic component |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120704 |