CN112935532A - Double-end laser marking machine - Google Patents

Double-end laser marking machine Download PDF

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Publication number
CN112935532A
CN112935532A CN202110164529.7A CN202110164529A CN112935532A CN 112935532 A CN112935532 A CN 112935532A CN 202110164529 A CN202110164529 A CN 202110164529A CN 112935532 A CN112935532 A CN 112935532A
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CN
China
Prior art keywords
light
assembly
laser
component
splitting
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Pending
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CN202110164529.7A
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Chinese (zh)
Inventor
刘亮
曹洪涛
吕启涛
高云峰
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Han s Laser Technology Industry Group Co Ltd
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Han s Laser Technology Industry Group Co Ltd
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Application filed by Han s Laser Technology Industry Group Co Ltd filed Critical Han s Laser Technology Industry Group Co Ltd
Priority to CN202110164529.7A priority Critical patent/CN112935532A/en
Publication of CN112935532A publication Critical patent/CN112935532A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/362Laser etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Abstract

The invention belongs to the technical field of laser processing, and relates to a double-head laser marking machine which comprises a lower cabinet body, a working platform, a laser, an outer light path light splitting device and a marking device, wherein the working platform is arranged on the top of the lower cabinet body; the target beam that the laser instrument launched incides to outer light path beam splitting device, divide into from the first laser beam of first light-emitting end outgoing and from the second laser beam of second light-emitting end outgoing by outer light path beam splitting device, first laser beam and second laser beam are parallel to each other with the target beam, and are vertical arranging to do benefit to the length of stretching forward of the interior light path of reduction outer light path beam splitting device, this double-end laser marking machine compact structure, occupation space is little, does benefit to and saves the cost.

Description

Double-end laser marking machine
Technical Field
The invention relates to the technical field of laser processing, in particular to a double-head laser marking machine.
Background
Laser marking is a process of leaving a permanent mark on the surface of a material by evaporation or photo-induced physicochemical changes of the material surface layer using the high peak power density of a focused laser beam. At present, more and more part character marks need to be realized through laser marking, along with people's requirement to product precision is higher and higher, the effect of marking is also more and more harsh, it becomes trend to adopt the picosecond laser to carry out laser marking, however, the price of picosecond laser is generally higher, in order to improve production efficiency as far as possible, adopt double-end to mark among the current laser marking machine, for example, adopt two lasers to correspond the mode of a marking head respectively, or, adopt a laser to divide two bundles of laser through beam splitting technique, in order to follow two marking heads respectively and go out and mark, however, these laser marking machines still have the problem that occupy bulky, the cost is still higher.
Disclosure of Invention
The embodiment of the invention aims to provide a double-head laser marking machine, which is used for solving the technical problems of larger occupied volume and higher production cost of the existing laser marking machine.
In order to solve the technical problems, the following technical scheme is adopted:
the double-head laser marking machine comprises a machine cabinet, a working platform, a laser, an outer light path light splitting device and a marking device, wherein the machine cabinet comprises a lower cabinet body;
the working platform is arranged on the top of the lower cabinet body;
the laser is arranged on the working platform;
the outer light path light splitting device is arranged on the working platform and is positioned at the light emitting end of the laser; the outer light path light splitting device is provided with a first light outlet end and a second light outlet end which are parallel to each other in the light outlet direction of the laser, and the first light outlet end and the second light outlet end are positioned below the laser;
the marking device comprises a first marking head and a second marking head, the first marking head is arranged at the light outlet of the first light outlet end, and the second marking head is arranged at the light outlet of the second light outlet end;
the target light beam emitted by the laser device is incident to the outer light path light splitting device, the outer light path light splitting device is split into a first laser beam and a second laser beam, and the first laser beam is emitted from the first light emitting end and can vertically emit to a workpiece to be processed through the first marking head; and after the second laser beam is emitted from the second light emitting end, the second laser beam can vertically shoot to another workpiece to be processed after passing through the second marking head.
In some embodiments, the external optical path splitting device includes a mounting box and an optical path device, the mounting box is disposed on the working platform, and the optical path device is disposed in the mounting box; the optical path device comprises a first optical path adjusting component, a first light splitting component, a second optical path adjusting component and a third optical path adjusting component, wherein the first optical path adjusting component is positioned at the top of the first light splitting component, the first light splitting component and the second light splitting component are arranged side by side, and the second optical path adjusting component and the third optical path adjusting component are respectively positioned at the bottoms of the first light splitting component and the second light splitting component;
the target light beam emitted by the laser device is deflected by the first light path adjusting component and then enters the first light splitting component, and then the first light splitting component splits two light beams, wherein one light beam is deflected by the second light path adjusting component to form the first laser beam, and the other light beam is deflected by the second light splitting component and the third light path adjusting component to form the second laser beam.
In some embodiments, the first optical path adjustment assembly comprises a first mirror assembly and a second mirror assembly which are oppositely arranged, the first beam splitting assembly comprises a first wave plate assembly and a first beam splitting mirror assembly, the second beam splitting assembly comprises a second wave plate assembly and a second beam splitting mirror assembly, the second optical path adjustment assembly comprises a third mirror assembly and a fourth mirror assembly which are oppositely arranged, and the third optical path adjustment assembly comprises a fifth mirror assembly and a sixth mirror assembly which are oppositely arranged; the second reflector assembly, the first wave plate assembly, the first spectroscope assembly and the third reflector assembly are sequentially arranged up and down on a light path of the target light beam incident to the first spectroscope assembly; on the light path of one of the light beams split by the first beam splitter component, the second wave plate component and the second beam splitter component are sequentially arranged; the fifth reflecting mirror assembly is positioned right below the second beam splitter assembly;
the target light beam emitted by the laser device is divided into two light beams by the first beam splitter component after sequentially passing through the first reflector component, the second reflector component, the first wave plate component and the first beam splitter component, wherein one light beam sequentially passes through the third reflector component and the fourth reflector component to form the first laser beam, and the other light beam sequentially passes through the second wave plate component, the second beam splitter component, the fifth reflector component and the sixth reflector component to form the second laser beam.
In some embodiments, the third mirror assembly, the fourth mirror assembly, the fifth mirror assembly and the sixth mirror assembly are located on the same straight line, and are parallel to the optical path of the other light beam split by the first beam splitter assembly.
In some embodiments, the optical path device further includes a first beam expander and a second beam expander, the first beam expander and the second beam expander being disposed along the light-emitting direction of the laser; the first laser beam emitted by the second light path adjusting component is collimated by the first beam expanding lens and then enters the first marking head, and the second laser beam emitted by the third light path adjusting component is collimated by the second beam expanding lens and then enters the second marking head.
In some embodiments, the mounting case includes a case body and a protective cover, the case body being disposed on the work platform; in the light emitting direction of the laser, two protective covers communicated with the box body are arranged on the outer wall of the box body;
the box body is internally provided with the first light path adjusting component, the first light splitting component, the second light path adjusting component and the third light path adjusting component; and the first beam expander and the second beam expander are respectively arranged in the two protective covers.
In some embodiments, the box body is provided with a first avoiding hole at a position corresponding to the first light path adjusting assembly, the first light splitting assembly, the second light path adjusting assembly and the third light path adjusting assembly, the box body is further provided with a plurality of first sealing covers, and each first sealing cover is detachably arranged at the corresponding first avoiding hole;
the protective cover is provided with a second avoiding hole and a second sealing cover, and the second avoiding hole corresponds to the second sealing cover in a detachable mode.
In some embodiments, the double-headed laser marking machine further comprises a lifting device disposed on the lower cabinet; the lifting device is used for driving the workpiece to be processed to move up and down.
In some embodiments, the double-headed laser marking machine further comprises a visual positioning device arranged on the lower cabinet body on one side close to the outer light path light splitting device; the visual positioning device comprises two visual positioning components which are opposite and arranged at intervals; after the first laser beam is emitted from the first light emitting end, the first laser beam is deflected by the first marking head and the corresponding visual positioning assembly in sequence to vertically shoot to a workpiece to be processed; and after the second laser beam is emitted from the second light emitting end, the second laser beam sequentially passes through the second marking head and the corresponding visual positioning assembly to vertically shoot to another workpiece to be processed.
In some embodiments, the visual positioning assembly comprises a mounting frame arranged on the working platform, and a visual assembly and a 45-degree mirror assembly arranged on the mounting frame, wherein the visual assembly, the 45-degree mirror assembly and the corresponding workpiece to be processed are sequentially arranged from top to bottom;
the vision assembly is used for positioning the position of the corresponding workpiece to be processed through the 45-degree reflector assembly; the first laser beam emitted by the first marking head is vertically emitted to a workpiece to be machined after being reflected by the 45-degree reflecting mirror assembly; and a second laser beam emitted by the second marking head is vertically emitted to another workpiece to be processed after being reflected by the 45-degree reflector assembly.
Compared with the prior art, the double-head laser marking machine provided by the embodiment of the invention mainly has the following beneficial effects:
this double-end laser marking machine sets up in the light-emitting end department of laser instrument through outer light path beam splitting device, outer light path beam splitting device's first light-emitting end and second light-emitting end are parallel to each other and are located the below of laser instrument in the light-emitting direction of laser instrument, first laser beam and the second laser beam that outer light path beam splitting device shunts are jeted out from first light-emitting end and second light-emitting end respectively, with this first laser beam and second laser beam are parallel to each other with the target beam, and be vertical arranging, therefore, under the prerequisite of guaranteeing production efficiency, do benefit to and reduce the length that stretches out of outer light path beam splitting device inner light path, it is compacter to ensure overall structure, whole occupation space is little, do benefit to the manufacturing and the design etc. cost of saving double-end laser marking machine.
Drawings
In order to illustrate the solution of the invention more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without inventive effort. Wherein:
fig. 1 is a schematic perspective structural view of a double-headed laser marking machine according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal structure of a dual-head laser marking machine according to an embodiment of the present invention;
FIG. 3 is a schematic view of the internal structure of a double-headed laser marking machine according to a second embodiment of the present invention;
fig. 4 is a schematic perspective view of an optical path component of the external optical path splitting apparatus in fig. 2 and 3;
fig. 5 is a schematic perspective view of a mounting box of the external optical path splitting apparatus in fig. 2 and 3;
FIG. 6 is a schematic perspective view of the mounting box of FIG. 5 at another angle;
FIG. 7 is a schematic perspective view of the visual positioning device of FIG. 3, wherein the view further illustrates the optical path relationship between the visual positioning device and the marking device;
fig. 8 is a schematic perspective view of the lifting device of fig. 2 and 3.
The reference numbers in the drawings are as follows:
100. a double-headed laser marking machine; 200. a target beam; 300. a first laser beam; 400. a second laser beam; 500. a workpiece to be processed;
1. a cabinet; 11. a lower cabinet body; 111. a support frame; 112. a base plate; 113. a dust collection bracket;
12. an upper cabinet body; 13. an operation panel; 14. a sliding door; 141. a perspective window; 15. a display component; 16. a smoke purifier; 17; a water chiller;
2. a working platform; 3. a laser;
4. an external optical path light splitting device; 41. a first light-emitting end; 42. a second light-emitting end; 43. installing a box; 431. a tank body; 4311. a first cover plate; 4312. a second cover plate; 4313. a third cover plate; 4314. a fourth cover plate; 4315. a fifth cover plate; 4316. a sixth cover plate; 4317. a light splitting optical path cover plate; 432. a protective cover; 4322. a second cover;
44. an optical path device; 441. a first optical path adjustment component; 4411. a first mirror assembly; 44111. a first mounting seat; 44112. a first mirror plate; 4412. a second mirror assembly; 44121. a second mounting seat; 44122; a second mirror;
442. a first light splitting component; 4421. a first wave plate assembly; 4422. a first beam splitter assembly; 443. a second light splitting assembly; 4431. a second wave plate assembly; 4432. a second beam splitter assembly;
444. a second optical path adjusting element; 4441. a third mirror assembly; 44411. a third mounting seat; 44412. a third mirror plate; 4442. a fourth mirror assembly; 44421. a fourth mounting seat; 44422. a fourth mirror plate;
445. a third optical path adjusting element; 4451. a fifth mirror assembly; 44511. a fifth mounting seat; 44512. a fifth mirror plate; 4452. a sixth mirror assembly; 44521. a sixth mounting seat; 44522. a sixth mirror plate;
446. a first beam expander; 447. a second beam expander; 448. aligning the light hole;
5. a marking device; 51. a first header printing head; 52. second marking head; 53. a galvanometer; 54. a lens;
6. a visual positioning device; 61. a visual positioning assembly; 611. a mounting frame; 6111. a camera support; 6112. an adapter plate; 612. a visual component; 6121. a camera; 61211. a camera lens; 6122. a camera mounting plate; 6123. an adjusting plate; 613. a 45 degree mirror assembly; 6131. a mounting frame; 6132. a 45 degree mirror plate; 614. a light source assembly; 6141. a light source element; 6142. a light source mounting plate;
7. a lifting device; 71. a lifting base; 72. a lifting assembly; 73. a jig mounting base.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, e.g., the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., refer to an orientation or position based on that shown in the drawings, are for convenience of description only and are not to be construed as limiting of the present disclosure.
The terms "including" and "having," and any variations thereof, in the description and claims of this invention and the description of the above figures are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential order. The meaning of "plurality" is two or more unless specifically limited otherwise.
In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Embodiment one of the double-headed laser marking machine 100 of the invention
It should be noted that the double-headed laser marking machine 100 can be applied to marking various materials such as semitransparent materials, and is particularly applicable to scenes such as sapphire products and stainless steel products which need to remove PVD coatings on the surfaces.
An embodiment of the present invention provides a double-headed laser marking machine 100, as shown in fig. 1 and 2, the double-headed laser marking machine 100 includes a cabinet 1, a working platform 2, a laser 3, an outer light path splitting device 4, and a marking device 5, wherein the cabinet 1 includes an upper cabinet 12 and a lower cabinet 11, and for safety, the upper cabinet 12 is disposed on the lower cabinet 11 and is used for covering the working platform 2, the laser 3, the outer light path splitting device 4, the marking device 5, and the like. In this embodiment, the laser 3 may be a picosecond laser, and preferably, may also be an infrared picosecond laser. Of course, in practice, other suitable types of lasers are also possible.
It should be noted that, in the present embodiment, as shown in fig. 1, in order to conveniently remove the smoke generated during marking, a smoke purifier 16 is disposed outside the cabinet 1; in addition, as shown in fig. 2, a dust suction bracket 113 is provided on the lower cabinet 11 to facilitate installation of a dust suction head (not shown) of the soot cleaner 16. As shown in fig. 1, a water cooler 17 is further disposed outside the cabinet 1 to facilitate cooling during calibration. In addition, marking instructions and the like are conveniently input, and the upper cabinet body 12 is provided with an operation panel 13; in order to display information such as marking conditions, a display assembly 15 is arranged outside the upper cabinet body 12. Still be provided with push-and-pull door 14 on the upper cabinet body 12, still be provided with perspective window 141 on push-and-pull door 14, like this, conveniently maintain the spare part in the rack 1 to and beat the mark condition and observe etc. in good time. Of course, in practice, the structural arrangement of the components on and around the upper cabinet 12 and the lower cabinet 11 may also adopt other suitable structures.
As shown in fig. 2, the working platform 2 is arranged on the top of the lower cabinet body 11, the laser 3 and the outer light path light splitting device 4 are both arranged on the working platform 2, wherein the outer light path light splitting device 4 is positioned at the light emitting end of the laser 3, so that the stability and compactness of the whole structure are ensured, and the adjustment of the laser light path is convenient. Of course, in practice, the external optical path splitting device 4 may also be directly disposed on the cabinet 1. Particularly in the present embodiment, preferably, the working platform 2 is a marble platform.
It should be noted that, in this embodiment, as shown in fig. 2, in order to conveniently adjust the laser focus to drive the workpiece 500 to be processed to move up and down, the dual-head laser marking machine 100 further includes a lifting device 7, wherein the lifting device 7 is disposed on the lower cabinet 11 and located at the bottom of the marking device 5. Specifically, as shown in fig. 2 and 8, a bottom plate 112 is disposed at the top of the lower cabinet 11 at a position corresponding to the marking device 5; the lifting device 7 comprises a lifting base 71, a lifting assembly 72 and a jig mounting seat 73, wherein the lifting base 71 is arranged on the bottom plate 112, the lifting assembly 72 is vertically arranged on the lifting base 71, the jig mounting seat 73 is slidably arranged on the lifting assembly 72 along the extending direction of the lifting assembly 72, and the jig mounting seat 73 is used for mounting a jig for placing a workpiece 500 to be processed. It can be understood that the jig mounting seat 73 can drive the workpiece 500 to be processed to move up and down when sliding along the lifting assembly 72, so that the laser focus on the workpiece 500 to be processed can be adjusted through vertical movement.
In the present embodiment, in order to provide a space for adjusting the vertical movement of the workpiece 500 to be processed and to conveniently arrange the external optical path splitting device 4 in a compact space, the top of the lower cabinet 11 is provided with a support frame 111, wherein the working platform 2 is supported by the support frame 111.
In this embodiment, as shown in fig. 2, the outer optical path splitting device 4 has a first light-emitting end 41 and a second light-emitting end 42, where the first light-emitting end 41 and the second light-emitting end 42 are parallel to each other in the light-emitting direction of the laser 3, which is beneficial to ensure that two laser beams finally coming out after the target light beam 200 emitted from the laser 3 is split can be parallel to each other and parallel to the target light beam 200 emitted from the laser 3. Taking the target beam 200 as a horizontal beam, that is, one horizontal beam may be split into two horizontal beams.
In addition, the first light-emitting end 41 and the second light-emitting end 42 are located below the laser 3, that is, the first light-emitting end 41 and the second light-emitting end 42 are located on one side of the outer optical path splitting device 4 close to the lower cabinet 11. It can be understood that, the height that the target beam 200 of the laser 3 is located when inciding into the outer light path beam splitting device 4 is higher than the first light-emitting end 41 and the second light-emitting end 42, thus, the target beam 200 still is perpendicular to the two bundles of laser beams that divide the way out, so as to be favorable to making the front length of the light path in the outer light path beam splitting device 4, and then be favorable to rationally spatially arranging, reduce holistic occupation space, make and adopt standard cabinet 1 can satisfy the operation requirement, be favorable to reducing the manufacturing cost and the design cost of double-end laser marking machine 100.
In this embodiment, as shown in fig. 2, in order to improve the marking efficiency and reduce the production cost, the marking device 5 includes a first marking head 51 and a second marking head 52, wherein the first marking head 51 is disposed at the light exit of the first light exit end 41 of the outer light path splitting device 4, and the second marking head 52 is disposed at the light exit of the second light exit end 42 of the outer light path splitting device 4. Specifically, in the present embodiment, each of the first marking head 51 and the second marking head 52 includes a galvanometer (not shown) and a lens (not shown) disposed on a light emitting end of the galvanometer, wherein the galvanometer of the first marking head 51 is vertically disposed and perpendicular to the first light emitting end 41 of the external optical path splitting device 4; correspondingly, the galvanometer of the second marking head 52 is vertically arranged and is perpendicular to the second light-emitting end 42 of the external optical path splitting device 4.
In this embodiment, the target beam 200 emitted by the laser 3 enters the external optical path splitting device 4, and is split into a first laser beam 300 and a second laser beam 400 by the external optical path splitting device 4, wherein the first laser beam 300 is emitted from the first light emitting end 41 of the external optical path splitting device 4, and then passes through the first marking head 51 to be vertically emitted to a workpiece 500 to be processed; the second laser beam 400 is emitted from the second light-emitting end 42 of the outer optical path splitting device 4, and then passes through the second marking head 52 and is vertically emitted to another workpiece 500 to be processed.
In summary, compared with the prior art, the double-head laser marking machine 100 at least has the following beneficial effects: this double-end laser marking machine 100 is through setting up outer light path beam splitting device 4 in the light-emitting end department of laser instrument 3, first light-emitting end 41 and the second light-emitting end 42 of outer light path beam splitting device 4 are parallel to each other and are located the below of laser instrument 3 on the light-emitting direction of laser instrument 3, first laser beam 300 and the second laser beam 400 that outer light path beam splitting device 4 shunted out jet out from first light-emitting end 41 and second light-emitting end 42 respectively, with this first laser beam 300 and second laser beam 400 are parallel to each other with target beam 200, and be vertical arranging, and like this, under the prerequisite of guaranteeing production efficiency, do benefit to reducing the length that stretches out of outer light path beam splitting device 4 inner light path, ensure that overall structure is compacter, whole occupation space is little, do benefit to sparingly cost such as manufacturing and the design of double-end laser marking machine 100.
In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to fig. 2, 4 to 6.
In some embodiments of the present embodiment, as shown in fig. 2, 4 and 5, the external optical path splitting device 4 includes a mounting box 43 and an optical path device 44, wherein the mounting box 43 is disposed on the work platform 2, and the optical path device 44 is disposed in the mounting box 43. Specifically, as shown in fig. 4, the optical path device 44 includes a first optical path adjustment member 441, a first light splitting member 442, a second light splitting member 443, a second optical path adjustment member 444, and a third optical path adjustment member 445. To split the target beam 200 emitted from the laser 3 into the first laser beam 300 and the second laser beam 400, as shown in fig. 4, the first optical path adjustment assembly 441 is located at the top of the first optical splitting assembly 442, the first optical splitting assembly 442 and the second optical splitting assembly 443 are arranged side by side, and the second optical path adjustment assembly 444 and the third optical path adjustment assembly 445 are located at the bottom of the first optical splitting assembly 442 and the second optical splitting assembly 443, respectively.
The target light beam 200 (specifically, horizontal light) emitted by the laser 3 is deflected by the first light path adjusting element 441 and then enters the first light splitting element 442, and is split into two light beams by the first light splitting element 442, wherein one light beam (specifically, vertical light) is deflected by the second light path adjusting element 444 to form a first laser beam 300 (specifically, horizontal light), and the other light beam (specifically, horizontal light) is deflected by the second light splitting element 443 and the third light path adjusting element 445 in sequence to form a second laser beam 400 (specifically, horizontal light).
Specifically, in the present embodiment, as shown in fig. 4, the first optical path adjusting assembly 441 can deflect the horizontal eye beam emitted by the laser 3 into the vertical target beam 200 to be incident on the first light splitting assembly 442; the second optical path adjustment assembly 444 may deflect the split vertical beam into a horizontal first laser beam 300 that is below the target beam 200; the second beam splitting assembly 443 can deflect the split horizontal beam into a vertically downward beam; the third optical path adjustment assembly 445 may deflect the vertically downward beam into a horizontal second laser beam 400 that is positioned below the target beam 200.
In some embodiments of this embodiment, as shown in fig. 4, in order to collimate the first laser beam 300 and the second laser beam 400, the optical path device 44 further includes a first beam expander 446 and a second beam expander 447, wherein the first beam expander 446 and the second beam expander 447 are disposed along the light emitting direction of the laser 3. Specifically, in this embodiment, in order to achieve light path collimation, the two ends of the first beam expander 446 and the second beam expander 447 are both provided with a pair of optical holes 448, wherein the centers of the two pair of optical holes 448 are located on the same straight line and are parallel to the light emitting direction of the laser 3. In this embodiment, the first laser beam 300 emitted from the second optical path adjustment assembly 444 is collimated by the collimating aperture 448 of the first beam expander 446 and then enters the first marking head 51, and similarly, the second laser beam 400 emitted from the third optical path adjustment assembly 445 is collimated by the collimating aperture 448 of the second beam expander 447 and then enters the second marking head 52. In practice, however, the optical path device 44 may adopt other suitable structures for optical path collimation.
In some embodiments of the present embodiment, as shown in fig. 2, 5 and 6, in order to make the overall structure more compact, the installation box 43 includes a box body 431 and a protection cover 432, and the box body 431 is disposed on the work platform 2; in the light emitting direction of the laser 3, two protective covers 432 communicated with the box body 431 are arranged on the outer wall of the box body 431. The box body 431 is provided therein with a first light path adjusting element 441, a first beam splitting element 442, a second beam splitting element 443, a second light path adjusting element 444, and a third light path adjusting element 445 in the light path device 44. A first expander 446 and a second expander 447 are provided in the two protective covers 432, respectively.
It is understood that, in this embodiment, two protection covers 432 actually correspond to the first light-exiting end 41 and the second light-exiting end 42 of the outer optical path splitting device 4, respectively.
In some embodiments of the present embodiment, as shown in fig. 4 to 6, in order to further ensure the splitting of the target beam 200 emitted from the laser 3 into the first laser beam 300 and the second laser beam 400, the first optical path adjusting assembly 441 includes a first mirror assembly 4411 and a second mirror assembly 4412 which are oppositely arranged. In this embodiment, the first mirror assembly 4411 comprises a first mounting seat 44111 and a first mirror plate 44112 disposed on the first mounting seat 44111; the second mirror assembly 4412 comprises a second mounting 44121 and a second mirror 44122 disposed on the second mounting 44121. The first mounting seat 44111 is disposed on the front side of the box body 431, the second mounting seat 44121 is disposed on the top end of the box body 431, and the first reflective mirror 44112 and the second reflective mirror 44122 are disposed opposite to each other.
As shown in fig. 4, the first light splitting assembly 442 includes a first wave plate assembly 4421 and a first beam splitter assembly 4422, and the second light splitting assembly 443 includes a second wave plate assembly 4431 and a second beam splitter assembly 4432. The second optical path adjusting assembly 444 includes a third mirror assembly 4441 and a fourth mirror assembly 4442 which are oppositely disposed. In the present embodiment in particular, as shown in fig. 4 to 6, the third mirror assembly 4441 includes a third mounting seat 44411 and a third mirror plate 44412 disposed on the third mounting seat 44411; the fourth mirror assembly 4442 includes a fourth mounting 44421 and a fourth mirror plate 44422 disposed on the fourth mounting 44421. The third mounting seat 44411 is disposed on the bottom end of the box body 431, the fourth mounting seat 44421 is disposed on one side of the box body 431, and the third reflector 44412 and the fourth reflector 44422 are disposed oppositely.
As further shown in fig. 4 to 6, the third optical path adjustment assembly 445 includes a fifth mirror assembly 4451 and a sixth mirror assembly 4452 which are oppositely disposed. In this embodiment in particular, the fifth mirror assembly 4451 comprises a fifth mounting block 44511 and a fifth mirror plate 44512 disposed on a fifth mounting block 44511; the sixth mirror assembly 4452 includes a sixth mount 44521 and a sixth mirror plate 44522 disposed on a sixth mount 44521. The fifth mounting seat 44511 is disposed on the bottom end of the box body 431, the sixth mounting seat 44521 is disposed on the other side of the box body 431, and the fifth reflector 44512 and the sixth reflector 44522 are disposed oppositely.
In this embodiment, as shown in fig. 4, the second mirror assembly 4412, the first wave plate assembly 4421, the first beam splitter assembly 4422 and the third mirror assembly 4441 are sequentially arranged up and down on the optical path of the object beam 200 incident on the first beam splitter assembly 442. Specifically, the second mirror 44122 faces the first wave plate assembly 4421, the first wave plate assembly 4421 is horizontally disposed, the first beam splitter assembly 4422 is disposed at an angle to the first wave plate assembly 4421 and faces the second wave plate assembly 4431, and the third mirror 44412 faces the first beam splitter assembly 4422, although the arrangement of these optical devices is not limited to this arrangement.
As shown in fig. 4, the first beam splitter 4422, the second wave plate 4431 and the second beam splitter 4432 are sequentially arranged on the optical path of one of the beams (specifically, the horizontal beam) split by the first beam splitter 442. Specifically, the second wave plate assembly 4431 is vertically disposed, the second spectroscope assembly 4432 and the first spectroscope assembly 4422 are disposed parallel and in the same direction, and the fifth mirror assembly 4451 is located directly below the second spectroscope assembly 4432. Of course, these optical devices are not limited to this layout arrangement.
Obviously, as shown in fig. 4, the target light beam 200 emitted by the laser 3 passes through the first mirror assembly 4411 (specifically, the first mirror 44112), the second mirror assembly 4412 (specifically, the second mirror 44122), the first wave plate assembly 4421 and the first beam splitter assembly 4422 in sequence, and then is split into two light beams by the first beam splitter assembly 4422, wherein one light beam passes through the third mirror assembly 4441 (specifically, the third mirror 44412) and the fourth mirror assembly 4442 (specifically, the fourth mirror 44422) in sequence to form the first laser beam 300, and the other light beam passes through the second wave plate assembly 4431, the second beam splitter assembly 4432, the fifth mirror assembly 4451 (specifically, the fifth mirror 44512) and the sixth mirror assembly 4452 (specifically, the sixth mirror 44522) in sequence to form the second laser beam 400.
In an embodiment, as shown in fig. 4, in order to make the structure of the optical path device 44 more compact, the third mirror assembly 4441, the fourth mirror assembly 4442, the fifth mirror assembly 4451 and the sixth mirror assembly 4452 are located on the same straight line and parallel to the optical path of the other light beam split by the first beam splitter assembly 4422. That is, the third mirror assembly 4441, the fourth mirror assembly 4442, the fifth mirror assembly 4451 and the sixth mirror assembly 4452 are on the same horizontal straight line.
Preferably, as shown in fig. 4, the third mirror assembly 4441 (specifically the third mirror plate 44412) and the fifth mirror assembly 4451 (specifically the fifth mirror plate 44512) are disposed opposite each other. It will be appreciated that the third and fifth mirror assemblies 4441 and 4451 are located between the fourth and sixth mirror assemblies 4442 and 4452 and that the light beam exiting the third mirror assembly 4441 and the light beam exiting the fifth mirror assembly 4451 are not only co-linear but are just in opposite directions. In this way, it is possible to further ensure a more compact structure of the optical path device 44.
In some embodiments of this embodiment, as shown in fig. 4 to 6, in order to conveniently adjust the optical path, reduce the debugging difficulty, and reduce the debugging time and the debugging cost, a first avoiding hole (not shown) is formed in a corresponding position of the first optical path adjusting element 441, the first light splitting element 442, the second light splitting element 443, the second optical path adjusting element 444, and the third optical path adjusting element 445, the box body 431 is further provided with a plurality of first sealing covers (specifically, a first cover plate 4311, a second cover plate 4312, a third cover plate 4313, a fourth cover plate 4314, a fifth cover plate 4315, a sixth cover plate 4316, and a light splitting optical path cover plate 4317 are further provided on the box body 431, and each first sealing cover is detachably covered on the corresponding first avoiding hole.
Specifically, in the present embodiment, as shown in fig. 5 and 6, the box body 431 is detachably provided with a first cover plate 4311, a second cover plate 4312, a third cover plate 4313, a fourth cover plate 4314, a fifth cover plate 4315, a sixth cover plate 4316, and a light splitting path cover plate 4317. As shown in fig. 4 to 6, the first cover plate 4311 is detachably disposed at the front side of the box body 431 and located at a position corresponding to the first mounting seat 44111, for covering the first mounting seat 44111; the second cover plate 4312 is disposed on the top end of the box body 431 and located at a position corresponding to the second mounting seat 44121, and is used for covering the second mounting seat 44121; a third cover plate 4313 is disposed on the bottom end of the box body 431 and located at a position corresponding to the third mounting seat 44411 for covering the third mounting seat 44411; the fourth cover plate 4314 is disposed on one side (e.g., right side) of the case body 431 and at a position corresponding to the fourth mounting seat 44421, and is used for covering the fourth mounting seat 44421; the fifth cover plate 4315 is disposed on the bottom end of the box body 431 and located at a position corresponding to the fifth mounting seat 44511, and is used for covering the fifth mounting seat 44511; a sixth cover 4316 is disposed on the other side (e.g., left side) of the case body 431 at a position corresponding to the sixth mount 44521 for covering the sixth mount 44521. The spectroscopic optical path cover plate 4317 is provided on the front side of the case body 431 at a position corresponding to the first and second spectroscopic assemblies 442 and 443 for covering the first and second spectroscopic assemblies 442 and 443.
As shown in fig. 5 and 6, in order to adjust the optical path conveniently, reduce the debugging difficulty, and reduce the debugging time and the debugging cost, similarly, a second avoiding hole (not shown) is formed in the protection cover 432, a second sealing cover 4322 is further disposed on the protection cover 432, and the second sealing cover 4322 is detachably covered on the corresponding second avoiding hole.
Second embodiment of the double-headed laser marking machine 100 of the present invention
As shown in fig. 3 and 7, the main technical features of the present embodiment are substantially the same as those of the first embodiment, and the main differences from the first embodiment are as follows:
in this embodiment, as shown in fig. 3, the double-headed laser marking machine 100 further includes a visual positioning device 6, wherein the visual positioning device 6 is disposed on the lower cabinet 11 (specifically, the working platform 2 of the lower cabinet) and is also covered by the upper cabinet 12. Specifically, the visual positioning device 6 is located on one side of the working platform 2 close to the outer light path splitting device 4, and understandably, the outer light path splitting device 4 and the visual positioning device 6 are located on the same side of the working platform 2 (specifically, the light emitting end of the laser 3), so that the stability and the compactness of the whole structure are favorably ensured, and the adjustment and alignment of the laser light path are facilitated.
In the present embodiment, as shown in fig. 3, the lifting device 7 is located at the bottom of the visual positioning device 6. Specifically, as shown in fig. 3 and 8, a bottom plate 112 is disposed on the top of the lower cabinet 11 at a position corresponding to the visual positioning device 6, and the lifting base 71 of the lifting device 7 is disposed on the bottom plate 112.
Specifically, in the present embodiment, as shown in fig. 7, each of the first marking head 51 and the second marking head 52 includes a galvanometer 53 and a lens 54, wherein, as shown in fig. 3 and 7, the galvanometer 53 of the first marking head 51 is transversely disposed and perpendicular to the first light-emitting end 41 of the external optical path splitting device 4; correspondingly, the galvanometer 53 of the second marking head 52 is transversely arranged and is perpendicular to the second light-emitting end 42 of the external optical path splitting device 4.
In this embodiment, as shown in fig. 3, the visual positioning device 6 includes two visual positioning assemblies 61, wherein the two visual positioning assemblies 61 correspond to the first marking head 51 and the second marking head 52 one by one, and the lifting devices 7 correspond to the lower portions of the two visual positioning assemblies 61 respectively. As further shown in fig. 3, preferably, in order to make the overall structure more compact, the two vision positioning assemblies 61 are disposed opposite to each other and spaced apart from each other, and the first marking head 51 and the second marking head 52 are located between the two vision positioning assemblies 61. In the present embodiment, the visual positioning components 61 are located on both sides of the outer optical path splitting device 4. Of course, in practice, the first marking head 51, the second marking head 52 and the two visual positioning assemblies 61 may also be arranged in other ways.
In the present embodiment, after exiting from the first light exit end 41 of the external optical path splitting device 4, the first laser beam 300 is deflected by the first marking head 51 and the corresponding visual positioning assembly 61 in sequence to vertically emit to a workpiece to be processed (not shown); after exiting from the second light-exiting end 42 of the external optical path splitter 4, the second laser beam 400 is deflected by the second marking head 52 and the corresponding visual positioning assembly 61 in sequence to be vertically emitted to another workpiece (not shown).
In some embodiments of the present embodiment, as shown in fig. 3 and 7, in order to achieve precise positioning of the visual positioning assembly 61 and ensure the compact structure, the visual positioning assembly 61 includes a mounting frame 611 disposed on the work platform 2, and a visual assembly 612 and a 45-degree mirror assembly 613 disposed on the mounting frame 611, wherein the visual assembly 612, the 45-degree mirror assembly 613 and the corresponding workpiece to be processed (not shown) are sequentially arranged from top to bottom.
In this embodiment, the vision assembly 612 is mainly used to position the corresponding workpiece to be processed through the 45-degree mirror assembly 613. The first laser beam 300 emitted from the first laser head 51 is reflected by a 45-degree mirror assembly 613 and then vertically emitted to a workpiece to be processed; correspondingly, the second laser beam 400 emitted from the second marking head 52 is reflected by the 45-degree mirror assembly 613 and then emitted perpendicularly to another workpiece to be processed. It is understood that the first laser beam 300 emitted from the first marking head 51 is reflected by the 45-degree mirror assembly 613 and then is coaxial with the light source for the vision assembly 612 to shoot the workpiece to be processed, and similarly, the second laser beam 400 emitted from the second marking head 52 is reflected by the 45-degree mirror assembly 613 and then is coaxial with the light source for the vision assembly 612 to shoot the workpiece to be processed.
Specifically, in this embodiment, as shown in fig. 7, the mounting bracket 611 includes an adapter plate 6112 and a camera support frame 6111, where the adapter plate 6112 is transversely disposed on the working platform 2, and the camera support frame 6111 is vertically disposed on the adapter plate 6112. The vision assembly 612 includes an adjusting plate 6123, a camera mounting plate 6122, a camera 6121 and a camera lens 61211, wherein the adjusting plate 6123 is disposed on the camera support frame 6111 along the light emitting direction of the laser 3, and the camera mounting plate 6122 is slidably disposed on the adjusting plate 6123 along the light emitting direction of the laser 3 and is perpendicular to the adjusting plate 6123; the camera 6121 is disposed on a side of the camera mounting plate 6122 close to the laser 3, and the camera lens 61211 is disposed below the camera 6121. As shown in fig. 7, the 45-degree mirror assembly 613 includes a mounting frame 6131 and a 45-degree mirror 6132, in which the mounting frame 6131 is disposed on a side of the adapter plate 6112 away from the laser 3, and the 45-degree mirror 6132 is disposed on the mounting frame 6131 toward the corresponding first marking head 51 or second marking head 52 (specifically, the lens 54 of the marking device 5) and forms a 45-degree angle with the light beam emitted from the marking device 5.
As shown in fig. 7, in order to further ensure the accuracy of the photographing positioning, the visual positioning assembly 61 further includes a light source assembly 614, where the light source assembly 614 includes a light source mounting plate 6142 and a light source element 6141, the light source mounting plate 6142 is disposed at the bottom of the adapter plate 6112 or the camera support frame 6111, and the light source element 6141 is disposed at the bottom of the light source mounting plate 6142 and is located right above the jig mounting seat 73 of the lifting device 7. Overall, with this arrangement, the visual positioning device 6 is simple and compact in structure and high in positioning accuracy.
Generally, the double-head laser marking machine is simple and compact in structure, small in occupied space, beneficial to reducing cost, convenient for light path adjustment and focusing, beneficial to improving marking accuracy, light path maintenance and the like.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (10)

1. A double-head laser marking machine is characterized by comprising a machine cabinet, a working platform, a laser, an outer light path light splitting device and a marking device, wherein the machine cabinet comprises a lower cabinet body;
the working platform is arranged on the top of the lower cabinet body;
the laser is arranged on the working platform;
the outer light path light splitting device is arranged on the working platform and is positioned at the light emitting end of the laser; the outer light path light splitting device is provided with a first light outlet end and a second light outlet end which are parallel to each other in the light outlet direction of the laser, and the first light outlet end and the second light outlet end are positioned below the laser;
the marking device comprises a first marking head and a second marking head, the first marking head is arranged at the light outlet of the first light outlet end, and the second marking head is arranged at the light outlet of the second light outlet end;
the target light beam emitted by the laser device is incident to the outer light path light splitting device, the outer light path light splitting device is split into a first laser beam and a second laser beam, and the first laser beam can vertically shoot to a workpiece to be processed after being emitted from the first light emitting end and passing through the first marking head; and after the second laser beam is emitted from the second light emitting end, the second laser beam can vertically shoot to another workpiece to be processed after passing through the second marking head.
2. The double-headed laser marking machine according to claim 1, wherein the outer light path beam splitting device comprises a mounting box and a light path device, the mounting box is arranged on the working platform, and the light path device is arranged in the mounting box; the optical path device comprises a first optical path adjusting component, a first light splitting component, a second optical path adjusting component and a third optical path adjusting component, wherein the first optical path adjusting component is positioned at the top of the first light splitting component, the first light splitting component and the second light splitting component are arranged side by side, and the second optical path adjusting component and the third optical path adjusting component are respectively positioned at the bottoms of the first light splitting component and the second light splitting component;
the target light beam emitted by the laser device is deflected by the first light path adjusting component and then enters the first light splitting component, and then the first light splitting component splits two light beams, wherein one light beam is deflected by the second light path adjusting component to form the first laser beam, and the other light beam is deflected by the second light splitting component and the third light path adjusting component to form the second laser beam.
3. The double-headed laser marking machine according to claim 2, wherein the first optical path adjusting assembly comprises a first mirror assembly and a second mirror assembly which are oppositely arranged, the first beam splitting assembly comprises a first wave plate assembly and a first beam splitting mirror assembly, the second beam splitting assembly comprises a second wave plate assembly and a second beam splitting mirror assembly, the second optical path adjusting assembly comprises a third mirror assembly and a fourth mirror assembly which are oppositely arranged, and the third optical path adjusting assembly comprises a fifth mirror assembly and a sixth mirror assembly which are oppositely arranged; the second reflector assembly, the first wave plate assembly, the first spectroscope assembly and the third reflector assembly are sequentially arranged up and down on a light path of the target light beam incident to the first spectroscope assembly; on the light path of one of the light beams split by the first beam splitter component, the second wave plate component and the second beam splitter component are sequentially arranged; the fifth reflecting mirror assembly is positioned right below the second beam splitter assembly;
the target light beam emitted by the laser device is divided into two light beams by the first beam splitter component after sequentially passing through the first reflector component, the second reflector component, the first wave plate component and the first beam splitter component, wherein one light beam sequentially passes through the third reflector component and the fourth reflector component to form the first laser beam, and the other light beam sequentially passes through the second wave plate component, the second beam splitter component, the fifth reflector component and the sixth reflector component to form the second laser beam.
4. The double-headed laser marking machine according to claim 3, wherein the third mirror assembly, the fourth mirror assembly, the fifth mirror assembly and the sixth mirror assembly are positioned on the same straight line and are parallel to the optical path of the other light beam split by the first beam splitter assembly.
5. The double-headed laser marking machine according to claim 2, wherein the optical path device further comprises a first beam expander and a second beam expander, the first beam expander and the second beam expander being arranged along the light exit direction of the laser; the first laser beam emitted by the second light path adjusting component is collimated by the first beam expanding lens and then enters the first marking head, and the second laser beam emitted by the third light path adjusting component is collimated by the second beam expanding lens and then enters the second marking head.
6. The double-headed laser marking machine of claim 5 wherein the mounting box comprises a box body and a protective cover, the box body being disposed on the work platform; in the light emitting direction of the laser, two protective covers communicated with the box body are arranged on the outer wall of the box body;
the box body is internally provided with the first light path adjusting component, the first light splitting component, the second light path adjusting component and the third light path adjusting component; and the first beam expander and the second beam expander are respectively arranged in the two protective covers.
7. The double-headed laser marking machine according to claim 6, wherein the box body is provided with a first avoidance hole at a position corresponding to the first light path adjusting assembly, the first light splitting assembly, the second light path adjusting assembly and the third light path adjusting assembly, the box body is further provided with a plurality of first seal covers, and each first seal cover is detachably covered on the corresponding first avoidance hole;
the protective cover is provided with a second avoiding hole and a second sealing cover, and the second avoiding hole corresponds to the second sealing cover in a detachable mode.
8. The double-headed laser marking machine according to claim 1, further comprising a lifting device, wherein the lifting device is arranged on the lower cabinet body, and the lifting device is used for driving a workpiece to be processed to move up and down.
9. The double-headed laser marking machine according to any one of claims 1 to 8, further comprising a visual positioning device on a side near the outer light path beam splitting device, the visual positioning device being disposed on the lower cabinet; the visual positioning device comprises two visual positioning components which are opposite and arranged at intervals; after the first laser beam is emitted from the first light emitting end, the first laser beam is deflected by the first marking head and the corresponding visual positioning assembly in sequence to vertically shoot to a workpiece to be processed; and after the second laser beam is emitted from the second light emitting end, the second laser beam sequentially passes through the second marking head and the corresponding visual positioning assembly to vertically shoot to another workpiece to be processed.
10. The double-headed laser marking machine according to claim 9, wherein the visual positioning assembly comprises a mounting frame arranged on the working platform, and a visual assembly and a 45-degree mirror assembly arranged on the mounting frame, wherein the visual assembly, the 45-degree mirror assembly and the corresponding workpiece to be machined are sequentially arranged from top to bottom;
the vision assembly is used for positioning the position of the corresponding workpiece to be processed through the 45-degree reflector assembly; the first laser beam emitted by the first marking head is vertically emitted to a workpiece to be machined after being reflected by the 45-degree reflecting mirror assembly; and a second laser beam emitted by the second marking head is vertically emitted to another workpiece to be processed after being reflected by the 45-degree reflector assembly.
CN202110164529.7A 2021-02-05 2021-02-05 Double-end laser marking machine Pending CN112935532A (en)

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CN201997852U (en) * 2010-11-09 2011-10-05 武汉高盛光电科技有限公司 Laser scribing device for crystalline silicon solar cell
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