CN112930032A - Hole plugging method for flexible circuit board - Google Patents
Hole plugging method for flexible circuit board Download PDFInfo
- Publication number
- CN112930032A CN112930032A CN201911236216.7A CN201911236216A CN112930032A CN 112930032 A CN112930032 A CN 112930032A CN 201911236216 A CN201911236216 A CN 201911236216A CN 112930032 A CN112930032 A CN 112930032A
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- Prior art keywords
- hole
- holes
- content
- plugging
- printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention relates to a hole plugging method of a flexible circuit board, which comprises the steps of film covering, hole punching, film replacement, hole plugging and scraping. According to the hole plugging method of the flexible circuit board, the flexible protective film is covered and then the hole is punched, so that the base material is prevented from being polluted, the flexible protective film is replaced with a new one after the hole is punched, so that a printing machine table is prevented from being polluted, the conductive ink only stays in the content hole, the variability of a printing area and the flexible protective film which is not replaced greatly weaken the requirement on accurate sleeve position, and the conductive ink staying on the surface of the base material enters the content hole through the process of the scraper, so that the content hole is plugged.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a hole plugging method of a flexible circuit board.
Background
The traditional hole filling process of the flexible circuit board only requires conductive ink to be hung on a wall to realize the conduction of circuits on the front side and the back side, but the requirements of the design of content holes, the selection of the conductive ink (including the fineness, the fluidity and the like) and the printing positioning and the like in the hole filling process are very strict by the mode
For some process requirements that insulating oil is printed after the conductive circuit is overprinted on one surface of the content hole, a filled hole plugging process is very important in order to prevent the insulating oil on one surface from polluting the conductive circuit on the other surface, otherwise, the insulating oil can permeate to the other surface through the content hole which is not filled, and the pollution of the circuit is caused.
Domestic patent CN104333983A is through the accurate circuit of positive and negative printing on the PET substrate, let printing ink pour into the intercommunication of realization positive and negative circuit in the conducting hole by oneself when printing conductive silver-colored printing ink, its side focus lies in the problem that utilizes the cover position needle of printing machine and the locating hole on the PET substrate to solve the accuracy of positive and negative printing position, what this patent mainly involved is the intercommunication problem of the accurate circuit of the positive and negative of film, it is strict unusually to the requirement of cover position precision, if the pre-baking treatment of material or the mismatching of cover position needle, often can cause the dislocation of consent, thereby make the yield very low.
Disclosure of Invention
The invention aims to provide a hole plugging method of a flexible circuit board, which solves the problems that the hole plugging yield is low and the hole plugging process cannot be plugged due to the limitation of the sleeve position precision, the material and ink characteristics and the like in the traditional hole plugging process.
The technical scheme adopted by the invention for solving the technical problem is as follows: a hole plugging method of a flexible circuit board comprises the following steps:
A. film covering: respectively covering flexible protective films on the first surface and the second surface of the two sides of the pre-baked base material;
B. punching: punching a base material covered with a flexible protective film according to a preset position to form a plurality of content holes;
C. film changing: tearing off the flexible protective film on the first surface of the perforated base material, and covering a new flexible protective film on the first surface;
D. plugging a hole: completely covering the printing pattern on the screen printing plate with the content hole by positioning, and then printing conductive ink on the second surface;
E. scraping plate: and scraping the conductive ink in the printing area to enable the conductive ink to fill the content hole, and drying.
In the hole plugging method of the present invention, the shape of the content hole includes an elliptical hole and/or an irregularly shaped hole.
In the hole plugging method of the present invention, in step B, every 3-6 content holes are gathered together to form a gathering bundle, and the 3-6 content holes are arranged according to the vertices of an equilateral polygon.
In the hole plugging method of the present invention, the 3-6 content holes grouped together include elliptical holes and irregularly shaped holes, and the elliptical holes and the irregularly shaped holes are alternately arranged.
In the hole plugging method of the present invention, the length of the longest straight line connecting line among the straight line connecting lines in each of the content holes is 0.1mm to 1 mm.
In the hole plugging method of the present invention, in the step D, the mesh number of the screen plate is 20 to 200 mesh.
In the hole plugging method of the present invention, in the step B, the punching further includes punching a positioning hole in the base material according to a predetermined position; in the step D, the positioning is performed by matching a positioning pin on the printing machine with a positioning hole on the substrate.
In the hole plugging method of the present invention, in step E, the baking means baking in an oven at 60 ℃ to 130 ℃ for 15 to 30 min.
In the hole plugging method, the flexible protective film is a PET film or a silicon film; the conductive ink filled in the content hole is conductive carbon paste or conductive silver paste.
In the method for plugging holes of the present invention, step E is followed by step F of printing: and tearing off the flexible protective films on the first surface and the second surface, overprinting conductive ink at the inner holes of the first surface and the second surface, and realizing the electrical conduction of the circuit on the first surface and the circuit on the second surface.
The hole plugging method of the flexible circuit board has the following beneficial effects: according to the hole plugging method of the flexible circuit board, the flexible protective film is covered and then the hole is punched, so that the base material is prevented from being polluted, the flexible protective film is replaced with a new one after the hole is punched, so that a printing machine table is prevented from being polluted, the conductive ink only stays in the content hole, the variability of a printing area and the flexible protective film which is not replaced greatly weaken the requirement on accurate sleeve position, and the conductive ink staying on the surface of the base material enters the content hole through the process of the scraper, so that the content hole is plugged.
Drawings
FIG. 1 is a diagram showing an arrangement structure of content holes grouped into a collective bundle in a first embodiment of a method of plugging a flexible wiring board according to the present invention;
FIG. 2 is a diagram showing an arrangement structure of content holes grouped into a collective bundle in a second embodiment of the method of plugging a flexible wiring board of the present invention;
fig. 3 is a diagram showing an arrangement structure of content holes gathered into a gathered bundle in a third embodiment of the hole plugging method for a flexible wiring board of the present invention.
Detailed Description
The hole plugging method of the flexible circuit board of the present invention is further described with reference to the accompanying drawings and embodiments:
in the description of the present invention, it is to be understood that the terms "central", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device c or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
The invention provides a hole plugging method of a flexible circuit board, which comprises the following steps, which are specifically explained below.
S1, coating: respectively coating flexible protective films on the first surface and the second surface of the two sides of the base material pre-dried at the temperature of 100-150 ℃ for 40-70 min; the flexible protective film includes but is not limited to a PET film, a silicone film and the like; substrates include, but are not limited to, PET, PI, PDMS, and the like; it should be noted that the first surface and the second surface are only opposite side surfaces, and have no other meaning.
The film coating can prevent the material from yellowing and being polluted during laser drilling.
S2, punching: and punching the base material covered with the flexible protective film according to the design of the design drawing by using a laser cutting machine according to the preset design position to form a plurality of content holes 100 and positioning holes. Wherein every 3-6 content holes 100 are gathered together to form a gathering bundle 1, and the 3-6 content holes 100 are arranged according to the vertexes of an equilateral polygon. Wherein the number of focusing beams 1 is preferably 3-8.
S3, film changing: and tearing off the flexible protective film on the first surface of the perforated base material, and covering a new flexible protective film on the first surface.
This operation can prevent that the effect of induced drafting of the platform that induced drafts when the consent from leading to electrically conductive printing ink from the content hole 100 interior infiltration to induced draft the bench, more lead to the content hole 100 to fill not really when polluting the board.
S4, plugging the hole: the mesh number of the screen printing plate for plugging the holes is 20-200 meshes, screen printing patterns can be designed at will, as long as the printing patterns can completely cover the content holes 100, an inner positioning mode is adopted, namely the positioning pins on the printing machine are matched with the positioning holes on the base material, and the printing machine is adjusted to realize positioning, so that the printing patterns on the screen printing plate completely cover the content holes 100; since the content hole 100 of the first surface is sealed by the newly coated flexible protective film and the content hole 100 of the second surface is communicated with the outside, the conductive ink is printed on the second surface thereafter.
It should be noted that, as long as the print pattern can completely cover the content hole 100, it is not required that the print pattern completely corresponds to the cross-sectional size of the content hole 100, that is, the size of the print pattern passing through the content hole 100 may be greater than or equal to the size of the cross-section of the content hole 100. Because the flexible protective film on the printing surface can make the conductive ink only penetrate through the content hole 100, the strict requirement of complete consistency of printing positioning is avoided, and the mesh number of the screen plate of the plug hole can be controlled by controlling the size of the printing pattern area.
S5, scraper: and scraping the conductive ink in the printing area by using a printer with a scraper to enable the conductive ink to fill the content hole 100, and then baking in an oven at 60-130 ℃ for 15-30 min.
Due to the resistance and electrostatic effect of the content hole 100, the conductive ink can only be hung on the wall in the content hole 100 and cannot be filled, so that an external force such as a scraper is required to drive the printed conductive ink into the content hole 100, and further the content hole 100 is filled.
And S6, tearing off the flexible protective films on the first surface and the second surface, and overprinting conductive ink at the content holes 100 on the first surface and the second surface to realize the electrical conduction of the circuit on the first surface and the circuit on the second surface.
The conductive ink filled in the content hole 100 and the overprinted conductive ink include, but are not limited to, conductive carbon paste, conductive silver paste, and the like.
As shown in fig. 1, in some embodiments, the content hole 100 is circular in shape, and the diameter of the content hole 100 is preferably 0.1mm to 1 mm. Wherein every 3-6 content holes 100 are gathered together to form a gathering bundle 1, and the 3-6 content holes 100 are arranged according to the vertexes of an equilateral polygon. Wherein the number of focusing beams 1 is preferably 3-8.
Further, the content hole 100 is preferably a non-circular hole. Through many times of experimental contrast discovery, non-circular hole can be more easily tamped and more full than the circular port. In addition, the overall plugging effect of the non-single shaped content apertures 100 is again superior to the single shaped content apertures 100 in view of the fixed printing orientation.
In a further preferred embodiment, as shown in fig. 2, the content hole 100 is shaped as an elliptical hole having a longest line segment, i.e. a major axis, with a length of 0.1mm to 1 mm. Wherein every 3-6 content holes 100 are gathered together to form a gathering bundle 1, and the 3-6 content holes 100 are arranged according to the vertexes of an equilateral polygon. Wherein the number of focusing beams 1 is preferably 3-8. By changing the circular content hole 100 to the elliptical content hole 100, the tamping effect can be significantly improved.
As shown in fig. 3, the optimized embodiment may further include that the content hole 100 includes an elliptical hole and an irregular-shaped hole, and preferably, the irregular-shaped hole is formed by splicing a plurality of elliptical holes. The longest line segment of the elliptical hole, i.e., the length of the major axis, is 0.1mm to 1 mm. Wherein every 3-6 content holes 100 are gathered together to form a gathering bundle 1, and the 3-6 content holes 100 are arranged according to the vertexes of an equilateral polygon. Preferably, the elliptical holes and the irregularly shaped holes are alternately arranged. Wherein the number of focusing beams 1 is preferably 3-8. The problem of filling holes in a fixed direction, which is caused by fixing the printing direction, is not good can be solved by alternately arranging the content holes 100 having an elliptical shape and the content holes 100 having an irregular shape.
It will be appreciated that modifications and variations are possible to those skilled in the art in light of the above teachings and are within the purview of the appended claims.
Claims (10)
1. A hole plugging method of a flexible circuit board is characterized by comprising the following steps:
A. film covering: respectively covering flexible protective films on the first surface and the second surface of the two sides of the pre-baked base material;
B. punching: punching a base material covered with a flexible protective film according to a preset position to form a plurality of content holes;
C. film changing: tearing off the flexible protective film on the first surface of the perforated base material, and covering a new flexible protective film on the first surface;
D. plugging a hole: completely covering the printing pattern on the screen printing plate with the content hole by positioning, and then printing conductive ink on the second surface;
E. scraping plate: and scraping the conductive ink in the printing area to enable the conductive ink to fill the content hole, and drying.
2. The method of plugging according to claim 1 wherein the shape of said content hole comprises an elliptical hole and/or an irregularly shaped hole.
3. The method for plugging a hole of claim 1, wherein in step B, every 3-6 content holes are grouped together to form a cluster, and the 3-6 content holes are arranged according to the vertices of an equilateral polygon.
4. The method of plugging according to claim 3, wherein said 3-6 content holes grouped together comprise elliptical holes and irregular shaped holes, and said elliptical holes and irregular shaped holes are alternately arranged.
5. The method for plugging a hole according to claim 1, wherein the longest straight line connecting line among straight line connecting lines in each of said inside containing holes has a length of 0.1mm to 1 mm.
6. The method for plugging holes of claim 1, wherein in step D, the mesh number of the screen plate is 20-200 mesh.
7. The method for plugging a hole of claim 1 wherein in step B, punching further comprises punching a pilot hole in the substrate at a predetermined location; in the step D, the positioning is performed by matching a positioning pin on the printing machine with a positioning hole on the substrate.
8. The method for plugging holes of claim 1, wherein in step E, said drying is baking in an oven at 60-130 ℃ for 15-30 min.
9. The method for plugging holes according to claim 1, wherein said flexible protective film is a PET film or a silicone film; the conductive ink filled in the content hole is conductive carbon paste or conductive silver paste.
10. The method for plugging according to claim 1 further comprising step F printing after step E: and tearing off the flexible protective films on the first surface and the second surface, overprinting conductive ink at the inner holes of the first surface and the second surface, and realizing the electrical conduction of the circuit on the first surface and the circuit on the second surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911236216.7A CN112930032A (en) | 2019-12-05 | 2019-12-05 | Hole plugging method for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911236216.7A CN112930032A (en) | 2019-12-05 | 2019-12-05 | Hole plugging method for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112930032A true CN112930032A (en) | 2021-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911236216.7A Pending CN112930032A (en) | 2019-12-05 | 2019-12-05 | Hole plugging method for flexible circuit board |
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| Country | Link |
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| CN (1) | CN112930032A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556887A (en) * | 2021-07-22 | 2021-10-26 | 杭州鹏润电子有限公司 | Through hole plating equipment and through hole plating method for double-sided circuit board |
| CN117896918A (en) * | 2024-03-13 | 2024-04-16 | 江门市和美精艺电子有限公司 | Manufacturing method of four-layer HDI packaging substrate |
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|---|---|---|---|---|
| TW200601925A (en) * | 2004-06-30 | 2006-01-01 | Unitech Printed Circuit Board Corp | Manufacturing method of modulization circuit board |
| CN102595809A (en) * | 2012-03-14 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Method for manufacturing high-density interconnection printed circuit board |
| TW201315317A (en) * | 2011-09-30 | 2013-04-01 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board and method for manufacturing same |
| CN103415164A (en) * | 2013-08-30 | 2013-11-27 | 武汉七零九印制板科技有限公司 | Method for plugging through hole, of which hole diameter is larger than 1.0mm, of PCB (Printed Circuit Board) by using printing ink |
| CN104333983A (en) * | 2014-09-23 | 2015-02-04 | 苏州明浩电子有限公司 | Grouting printing technology of film switch |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
-
2019
- 2019-12-05 CN CN201911236216.7A patent/CN112930032A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200601925A (en) * | 2004-06-30 | 2006-01-01 | Unitech Printed Circuit Board Corp | Manufacturing method of modulization circuit board |
| TW201315317A (en) * | 2011-09-30 | 2013-04-01 | Zhen Ding Technology Co Ltd | Multilayer printed circuit board and method for manufacturing same |
| CN102595809A (en) * | 2012-03-14 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Method for manufacturing high-density interconnection printed circuit board |
| CN103415164A (en) * | 2013-08-30 | 2013-11-27 | 武汉七零九印制板科技有限公司 | Method for plugging through hole, of which hole diameter is larger than 1.0mm, of PCB (Printed Circuit Board) by using printing ink |
| CN104333983A (en) * | 2014-09-23 | 2015-02-04 | 苏州明浩电子有限公司 | Grouting printing technology of film switch |
| CN109121301A (en) * | 2018-09-28 | 2019-01-01 | 广州兴森快捷电路科技有限公司 | Wiring board and its selective resin jack designs method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113556887A (en) * | 2021-07-22 | 2021-10-26 | 杭州鹏润电子有限公司 | Through hole plating equipment and through hole plating method for double-sided circuit board |
| CN117896918A (en) * | 2024-03-13 | 2024-04-16 | 江门市和美精艺电子有限公司 | Manufacturing method of four-layer HDI packaging substrate |
| CN117896918B (en) * | 2024-03-13 | 2024-06-11 | 江门市和美精艺电子有限公司 | Manufacturing method of four-layer HDI packaging substrate |
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Application publication date: 20210608 |
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| RJ01 | Rejection of invention patent application after publication |