CN112928150B

CN112928150B - Display substrate, preparation method thereof and display device

Info

Publication number: CN112928150B
Application number: CN202110385288.9A
Authority: CN
Inventors: 许名宏
Original assignee: BOE Technology Group Co Ltd; Hefei BOE Zhuoyin Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Hefei BOE Zhuoyin Technology Co Ltd
Priority date: 2021-04-09
Filing date: 2021-04-09
Publication date: 2023-06-06
Anticipated expiration: 2041-04-09
Also published as: CN112928150A

Abstract

The embodiment of the disclosure provides a display substrate, a preparation method thereof and a display device. The display substrate includes: a substrate base; an organic light emitting diode pixel located at one side of the substrate; a first common electrode located at one side of the substrate facing the organic light emitting diode pixel; the first passivation layer is positioned on one side of the organic light-emitting diode pixel, which is away from the substrate, and the orthographic projection of the organic light-emitting diode pixel on the substrate is positioned in the orthographic projection range of the first passivation layer on the substrate, and the orthographic projection of the first common electrode on the substrate is at least partially positioned outside the orthographic projection range of the first passivation layer on the substrate; the first auxiliary electrode is positioned on one side of the first passivation layer, which is away from the substrate base plate, and the first auxiliary electrode is connected with the first common electrode. According to the technical scheme, the design requirement of IR pressure drop is met, and the aperture opening ratio and the yield of the display substrate are not affected.

Description

Display substrate, preparation method thereof and display device

Technical Field

The disclosure relates to the technical field of display, in particular to a display substrate, a preparation method thereof and a display device.

Background

The Printed organic light Emitting Diode (Printed Organic Light-Emitting Diode) has the characteristics of high material utilization rate, high efficiency and the like, and the Printed organic light Emitting Diode is applied to a display device without using a Fine Metal Mask (FMM) or other complex patterning processes, so that the Printed organic light Emitting Diode has the advantages of easy large-area preparation, full color display and the like, has wide application prospect, is widely focused by people, and is particularly suitable for application of large-size display devices.

The adoption of the structure of the top-emitting OLED device can increase the aperture ratio and prolong the service life of the display device, however, the OLED device is driven by current, and a larger voltage Drop is caused in the working process, namely the so-called IR voltage Drop (IR-Drop). How to reduce the IR drop becomes a problem that has to be overcome to print OLEDs.

Disclosure of Invention

The embodiment of the disclosure provides a display substrate, a preparation method thereof and a display device, which are used for solving or relieving one or more technical problems in the prior art.

As a first aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display substrate including:

a substrate base;

an organic light emitting diode pixel located at one side of the substrate;

A first common electrode located at one side of the substrate facing the organic light emitting diode pixel;

the first passivation layer is positioned on one side of the organic light-emitting diode pixel, which is away from the substrate, and the orthographic projection of the organic light-emitting diode pixel on the substrate is positioned in the orthographic projection range of the first passivation layer on the substrate, and the orthographic projection of the first common electrode on the substrate is at least partially positioned outside the orthographic projection range of the first passivation layer on the substrate;

the first auxiliary electrode is positioned on one side of the first passivation layer, which is away from the substrate base plate, and the first auxiliary electrode is connected with the first common electrode.

In some possible implementations, the organic light emitting diode pixel includes a first electrode, a light emitting structure layer, and a second electrode sequentially stacked on the substrate, the display substrate further includes a second common electrode and a second auxiliary electrode, the second common electrode is located on a side of the substrate facing the organic light emitting diode pixel, the second electrode is connected to the second common electrode, the second auxiliary electrode is located between the second electrode and the first passivation layer, and the second auxiliary electrode is connected to the second electrode in a contact manner.

In some possible implementations, the orthographic projections of the second electrode, the second common electrode, and the second auxiliary electrode on the substrate are all within an orthographic projection range of the first passivation layer on the substrate.

In some possible implementations, there is no overlap between the front projection of the first auxiliary electrode on the substrate and the front projection of the organic light emitting diode pixel on the substrate.

In some possible implementations, the display substrate includes a display area and a frame area located at a periphery of the display area, one side of the display substrate is used for being connected with the printed circuit board, the frame area includes a proximal frame area close to the printed circuit board and a distal frame area far away from the printed circuit board, the number of the first common electrodes is a plurality, a part of the plurality of first common electrodes is located in the proximal frame area, a part of the plurality of first common electrodes is located in the distal frame area, the first auxiliary electrode includes a first strip-shaped sub-electrode, the first strip-shaped sub-electrode extends from the proximal frame area to the distal frame area across the display area, the first auxiliary electrode is connected with a first common electrode in the proximal frame area, and the first auxiliary electrode is connected with a first common electrode in the distal frame area.

In some possible implementations, the first auxiliary electrode further includes a second strip-shaped sub-electrode, and an extending direction of the second strip-shaped sub-electrode is perpendicular to an extending direction of the first strip-shaped sub-electrode.

In some possible implementations, the organic light emitting diode pixel includes a first electrode, a light emitting structure layer, and a second electrode sequentially stacked on the substrate, the display substrate further includes a second auxiliary electrode, the second auxiliary electrode is located between the second electrode and the first passivation layer, the second auxiliary electrode is in contact with the second electrode, and an overlapping area does not exist between an orthographic projection of the second auxiliary electrode on the substrate and an orthographic projection of the organic light emitting diode pixel on the substrate.

In some possible implementations, there is no overlapping area between the orthographic projection of the second auxiliary electrode on the substrate and the orthographic projection of the first auxiliary electrode on the substrate along the same extension direction.

In some possible implementations, the organic light emitting diode pixel includes a first electrode, a light emitting structure layer, and a second electrode sequentially stacked on a substrate, the light emitting structure layer including an organic light emitting layer and an injection modifying layer, the injection modifying layer being located between the organic light emitting layer and the second electrode.

As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a method for manufacturing a display substrate, including:

providing a substrate, wherein a first common electrode is arranged on one side of the substrate;

Forming an organic light emitting diode pixel on a side of the substrate facing the first common electrode;

forming a first passivation layer on one side of the organic light emitting diode pixel, which is far away from the substrate, wherein the orthographic projection of the organic light emitting diode pixel on the substrate is positioned in the orthographic projection range of the first passivation layer on the substrate, and the orthographic projection of the first common electrode on the substrate is at least partially positioned outside the orthographic projection range of the first passivation layer on the substrate;

and forming a first auxiliary electrode on one side of the first passivation layer, which is far away from the substrate, wherein the first auxiliary electrode is connected with the first common electrode.

In some possible implementations, forming the first auxiliary electrode on a side of the first passivation layer facing away from the substrate includes:

forming a first auxiliary electrode solution on one side of the first passivation layer, which is far away from the substrate by adopting an ink-jet printing mode;

and curing the first auxiliary electrode solution to form the first auxiliary electrode.

In some possible implementations, the organic light emitting diode pixel includes a first electrode, a light emitting structure layer, and a second electrode sequentially stacked on a substrate, and before forming the first passivation layer, the method further includes:

Forming a second auxiliary electrode solution on one side of the second electrode, which is far away from the substrate by adopting an ink-jet printing mode;

and solidifying the second auxiliary electrode solution to form a second auxiliary electrode, wherein the second auxiliary electrode is in contact connection with the second electrode.

As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a display device including the display substrate in any one of the embodiments of the present disclosure.

According to the display substrate disclosed by the embodiment of the disclosure, the first passivation layer and the first auxiliary electrode are arranged, so that the connection between the first auxiliary electrode and the first common electrode is realized, and therefore, the thickness and the width of the first metal wiring in the substrate can be prevented from being increased, the design requirement of IR voltage drop can be met, and the aperture opening ratio and the yield of the display substrate can not be influenced.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not to be considered limiting of its scope.

FIG. 1 is a schematic diagram of a display substrate according to an embodiment of the disclosure;

FIG. 2 is a schematic plan view of a display substrate according to an embodiment of the disclosure;

FIG. 3 is a schematic diagram of a method for manufacturing a display substrate according to an embodiment of the disclosure;

FIG. 4 is a schematic diagram of an embodiment of the display substrate after forming an OLED pixel;

FIG. 5 is a schematic diagram of a display substrate with a second auxiliary electrode formed thereon according to an embodiment of the disclosure;

FIG. 6 is a schematic diagram of a display substrate after a first passivation layer is formed in the substrate according to an embodiment of the disclosure;

FIG. 7 is a schematic diagram of a display substrate with a first auxiliary electrode formed thereon according to an embodiment of the disclosure;

fig. 8 is a schematic structural diagram of a display device according to an embodiment of the disclosure.

Reference numerals illustrate:

10. a substrate base; 101. a substrate; 102. a control structure layer; 11. a first common electrode; 12. a first passivation layer; 13. a first auxiliary electrode; 131. a first strip-shaped sub-electrode; 132. a second strip-shaped sub-electrode; 14. a pixel defining layer; 15. a second common electrode; 16. a second auxiliary electrode; 17. a second passivation layer; 20. an organic light emitting diode pixel; 200. a cover plate; 201. a proximal rim region; 202. a distal rim region; 21. a first electrode; 221. an organic light emitting layer; 222. injecting a modification layer; 23. a second electrode; 300. transparent adhesive material; 51. a chip on film; 52. and a printed wiring board.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

The inventors of the present disclosure have found that it is difficult for top-emitting OLED device structures to employ thick metals as the top electrode (typically the cathode), resulting in a relatively large top electrode resistance. During operation, a current flowing through the top electrode with a high resistance at the common cathode potential (ELVSS) will cause a high voltage Drop, the so-called IR Drop. One solution is to print or otherwise form a metal mesh or wire on the fabricated top electrode to aid in the conduction of the top electrode. On the other hand, as the size of the display device becomes larger and the operation current increases, a common VDD potential (ELVDD) metal line or metal mesh fabricated on the substrate base plate also passes a large current. In order to meet the IR drop, the thickness and width of the common VDD potential (ELVDD) metal line or metal mesh are required to be larger and larger, which not only increases the difficulty of fabrication but also reduces the aperture ratio. For developing ultra-large-sized high-resolution OLED display devices, solving the IR drop of ELVDD and ELVSS at the same time is a technical problem to be solved.

Fig. 1 is a schematic structural diagram of a display substrate according to an embodiment of the disclosure. As shown in fig. 1, the display substrate includes a base substrate 10, an organic light emitting diode pixel (OLED pixel) 20, a first common electrode 11, a first passivation layer 12, and a first auxiliary electrode 13.

The substrate base 10 may include a base and a control structure layer 102 disposed at one side of the base 101. The control structure layer 102 may include a thin film transistor, a gate line, a data line, etc. in order to control the operation of the display substrate. The organic light emitting diode pixel 20 is located on a side of the substrate base 10, and the organic light emitting diode pixel 20 is located on a side of the control structure layer 102 facing away from the base 101, for example. The number of the organic light emitting diode pixels 20 may be plural, and the plural organic light emitting diode pixels 20 may be arranged in an array.

The first common electrode 11 is located on the side of the substrate 10 facing the organic light emitting diode pixel 20. Illustratively, the display substrate may include a display region and a bezel region located at a periphery of the display region. The plurality of organic light emitting diode pixels 20 are located in the display area, and the first common electrode 11 may be located in the frame area. The number of the first common electrodes 11 may be plural, and the plurality of first common electrodes 11 may be sequentially arranged in the frame region. A first metal trace may be disposed in the substrate 10, and the first common electrode 11 may be connected to the first metal trace.

The first passivation layer 12 is located on a side of the organic light emitting diode pixel 20 facing away from the substrate 10, and as shown in fig. 1, the front projection of the OLED pixel 20 on the substrate 10 is located within the front projection range of the first passivation layer 12 on the substrate 10. The orthographic projection of the first common electrode 11 on the substrate 10 is at least partially outside the orthographic projection range of the first passivation layer 12 on the substrate 10. Thus, the first passivation layer 12 can completely cover the OLED pixels 20 to isolate moisture, and prevent the OLED pixels from being degraded due to reaction with water and oxygen. And, the first common electrode 11 is at least partially exposed outside the first passivation layer 12.

The first auxiliary electrode 13 is located at a side of the first passivation layer 12 facing away from the substrate base plate 10, and the first auxiliary electrode 13 is connected to the first common electrode 11.

It will be appreciated that the OLED pixel 20 is a current driven device, and that as the size of the display device increases and the operating current increases, a large current will flow through the first common electrode 11 and the first metal trace. In order to meet the design requirement of the IR drop, the thickness and width of the first metal trace in the substrate 10 may be increased, but this may reduce the aperture ratio of the display device, increase the manufacturing difficulty, and reduce the product yield.

According to the display substrate disclosed by the embodiment of the disclosure, the first passivation layer 12 and the first auxiliary electrode 13 are arranged, so that the first auxiliary electrode 13 is connected with the first common electrode 11, and therefore, the thickness and the width of the first metal wiring in the substrate 10 can be prevented from being increased, the design requirement of IR voltage drop can be met, and the aperture opening ratio and the yield of the display substrate can not be influenced.

The thickness of the first auxiliary electrode 13 may be set as needed.

Illustratively, a first metal trace may be disposed in the substrate base 10, and the first common electrode 11 may be connected to the first metal trace. The first metal wire may be in a grid shape or a linear shape. The first metal trace may be disposed in the same layer as the gate electrode of the thin film transistor in the substrate, or the first metal trace may be disposed in the same layer as the source electrode or the drain electrode of the thin film transistor in the substrate. The first common electrode 11 may be an electrode exposed at the upper side of the substrate 10, or the first common electrode 11 may be a first Pad (Pad) located at the upper side of the substrate 10, and the first Pad is connected to the first metal trace through a via hole. It will be appreciated by those skilled in the art that the specific position and structure of the first common electrode 11 may be set as required, so long as the first common electrode 11 is connected with the first metal trace, and the first auxiliary electrode 13 may be connected with the first common electrode 11 in a subsequent process, so as to achieve connection of the first auxiliary electrode and the first metal trace.

In one embodiment, as shown in fig. 1, the OLED pixel 20 may include a first electrode 21, a light emitting structure layer 22, and a second electrode 23 sequentially stacked on the substrate base 10. Illustratively, one of the first electrode 21 and the second electrode 23 may be an anode and the other may be a cathode. For example, the first electrode 21 may be an anode, and the second electrode 23 may be a cathode. The display substrate may further comprise a pixel defining layer 14, the pixel defining layer 14 being located on a side of the first electrode 21 facing away from the substrate 10, the pixel defining layer 14 being provided with a plurality of openings, each opening defining an area in which an OLED pixel 20 is located. The first electrode 21 is exposed through the opening. The light emitting structure layer 22 is located in the opening and on the side of the first electrode 21 facing away from the substrate 10, and the second electrode 23 is located on the side of the light emitting structure layer 22 facing away from the substrate 10.

As shown in fig. 1, the display substrate may further include a second common electrode 15, and the second common electrode 15 is located at a side of the substrate 10 facing the OLED pixel 20. The second common electrode 15 may be located at a frame region of the display substrate, for example. The second electrode 23 is connected to the second common electrode 15. The orthographic projection of the second common electrode 15 on the substrate 10 is located within the orthographic projection range of the first passivation layer 12 on the substrate 10, so that the second electrode 23 can be overlapped with the second common electrode 15, and the second electrode 23 and the second common electrode 15 can be prevented from being contacted with water and oxygen. The second metal trace may be disposed in the same layer as the gate electrode of the thin film transistor in the substrate, or the second metal trace may be disposed in the same layer as the source electrode or the drain electrode of the thin film transistor in the substrate. The second common electrode 15 is connected to the second metal wiring. The second common electrode 15 may be an electrode exposed at the upper side of the substrate 10, or the second common electrode 15 may be a second Pad (Pad) located at the upper side of the substrate 10, and the second Pad is connected to the second metal trace through a via hole. It will be appreciated by those skilled in the art that the specific location and structure of the second common electrode 15 may be set as required, as long as the second common electrode 15 is connected to the second metal trace, and that the connection between the second electrode 23 and the second common electrode 15 may be achieved in a subsequent process.

In one embodiment, the substrate base 10 may include a second metal trace, and the second common electrode 15 may be connected to the second metal trace. The second metal wire may be in a grid shape or a wire shape. The second metal trace may be disposed in the same layer as the gate electrode of the thin film transistor in the substrate, or the second metal trace may be disposed in the same layer as the source electrode or the drain electrode of the thin film transistor in the substrate. The second common electrode 15 is connected to the second metal wiring. The second common electrode 15 may be an electrode exposed at the upper side of the substrate 10, or the second common electrode 15 may be a second Pad (Pad) located at the upper side of the substrate 10, and the second Pad is connected to the second metal trace through a via hole. It will be appreciated by those skilled in the art that the specific location and structure of the second common electrode 15 may be set as required, as long as the second common electrode 15 is connected to the second metal trace, and that the connection between the second electrode 23 and the second common electrode 15 may be achieved in a subsequent process.

In one embodiment, as shown in fig. 1, the display substrate may further include a second auxiliary electrode 16, the second auxiliary electrode 16 being located between the second electrode 23 and the first passivation layer 12, the second auxiliary electrode 16 being in contact with the second electrode 23. The thickness of the second auxiliary electrode 16 may be set as desired. By providing the second auxiliary electrode 16, the impedance of the second electrode 23 can be reduced, reducing the IR drop.

In one embodiment, the orthographic projections of the second electrode 23, the second common electrode 15 and the second auxiliary electrode 16 on the substrate 10 are all within the orthographic projection range of the first passivation layer 12 on the substrate 10. Thereby, the second electrode 23, the second common electrode 15 and the second auxiliary electrode 16 are isolated from the water oxygen, and the OLED pixel is protected.

In one embodiment, the first common electrode 11 may be connected to a VDD potential (ELVDD) in the substrate 10, and the second common electrode 15 may be connected to a VSS potential (ELVSS) in the substrate 10.

In one embodiment, as shown in fig. 1, the light emitting structure layer 22 may include an organic light emitting layer 221 and an injection modifying layer 222, and the injection modifying layer 222 may be located between the organic light emitting layer 221 and the second electrode 23. The thickness of implant modification layer 222 may range from 10nm to 20nm (inclusive). Illustratively, the thickness of the implant modification layer 222 may be any of 10nm, 12nm, 14nm, 16nm, 18nm, 20 nm. The injection modification layer 222 can have better injection characteristics with the second electrode 23, so as to improve the performance of the OLED pixel.

In one embodiment, the light emitting structure layer 22 may further include a Hole Injection Layer (HIL) and a Hole Transport Layer (HTL) (the hole injection layer and the hole transport layer are not shown in fig. 1) between the first electrode 21 and the organic light emitting layer 221, wherein the hole injection layer is adjacent to the first electrode 21 and the hole transport layer is between the hole injection layer and the organic light emitting layer 221.

In one embodiment, the material of the second electrode 23 may include a transparent oxide, for example, the material of the second electrode 23 may include at least one of Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), and the like. The thickness of the second electrode 23 may range from 70nm to 300nm (inclusive).

In one embodiment, as shown in fig. 1, the display substrate may further include a second passivation layer 17, the second passivation layer 17 being located at a side of the first auxiliary electrode 13 facing away from the substrate 10. The front projection of the first auxiliary electrode 13 onto the substrate 10 is located within the front projection of the second passivation layer 17 onto the substrate 10. The orthographic projection of the first common electrode 11 onto the substrate 10 is located within the orthographic projection range of the second passivation layer 17 onto the substrate 10.

Fig. 2 is a schematic plan view of a display substrate according to an embodiment of the disclosure. The display substrate may include a display area and a bezel area located at the periphery of the display area, and a boundary 100 between the display area and the bezel area is shown in fig. 2. The number of the first common electrodes 11 may be plural, and the plurality of first common electrodes 11 may be disposed in the frame regions on the opposite sides. For example, as shown in fig. 2, a plurality of first common electrodes 11 are provided in a frame region on the upper side of the display region, a plurality of first common electrodes 11 are provided in a frame region on the lower side of the display region, and the number of first common electrodes 11 in the frame regions on the opposite sides may be the same. The first auxiliary electrode 13 may be located in the display region and the bezel region. As shown in fig. 1 and 2, there is no overlapping area between the front projection of the first auxiliary electrode 13 on the substrate 10 and the front projection of the organic light emitting diode pixel on the substrate 10. Thus, in the display area, the front projection of the first auxiliary electrode 13 onto the substrate 10 is located between the front projections of the adjacent two columns or rows of OLED pixels onto the substrate 10, that is to say, the front projection of the first auxiliary electrode 13 onto the substrate 10 is located outside the front projection of the OLED pixels onto the substrate 10, or, the front projection of the first auxiliary electrode 13 onto the substrate 10 is located within the front projection range of the pixel defining layer 14 onto the substrate 10. The first auxiliary electrode 13 with the structure not only increases the area of the first auxiliary electrode 13 and effectively reduces the IR drop, but also the first auxiliary electrode 13 does not affect the aperture ratio of the display substrate.

In one embodiment, as shown in fig. 2, one side of the display substrate is used to connect with a printed wiring board (PCB) 52 through a Chip On Film (COF) 51. The border area of the display substrate includes a proximal border area 201 proximate to the printed wiring board 52 and a distal border area 202 distal to the printed wiring board 52. The number of the first common electrodes 11 may be plural, and a part of the plurality of first common electrodes 11 is located in the proximal frame region 201, and a part of the plurality of first common electrodes 11 is located in the distal frame region 202. The first auxiliary electrode 13 may include a first stripe-shaped sub-electrode 131, the first stripe-shaped sub-electrode 131 extending from the proximal border region 201 across the display region to the distal border region 202, the first auxiliary electrode 13 being connected to a first common electrode in the proximal border region 201, the first auxiliary electrode 13 being connected to a first common electrode in the distal border region 202. It will be appreciated that in the absence of the first auxiliary electrode 13, the ELVDD current would flow from the proximal end to the distal end only through the first metal trace, resulting in a large voltage drop at the distal end. In the embodiment of the present disclosure, when the current of ELVDD flows from the proximal end to the distal end, the current may pass through the first metal trace and the first auxiliary electrode 13 at the same time, that is, a portion of the current flows to the distal end through the first auxiliary electrode 13, so that the IR drop may be improved, which is advantageous for solving the IR drop problem of the large-sized OLED at high operation current.

In one embodiment, as shown in fig. 2, the first auxiliary electrode 13 may further include a second stripe-shaped sub-electrode 132, and an extension direction of the second stripe-shaped sub-electrode 132 may be perpendicular to an extension direction of the first stripe-shaped sub-electrode 131. Thus, the first auxiliary electrode 13 has a first mesh structure.

In one embodiment, as shown in fig. 1 and 2, the second auxiliary electrode 16 may have a second mesh structure. There is no overlap between the front projection of the second auxiliary electrode 16 onto the substrate 10 and the front projection of the OLED pixels onto the substrate 10, that is to say that the front projection of the second auxiliary electrode 16 onto the substrate 10 is located between the front projections of two adjacent columns or rows of OLED pixels onto the substrate 10, or that the front projection of the second auxiliary electrode 16 onto the substrate 10 is located outside the front projection of the OLED pixels onto the substrate 10, or that the front projection of the second auxiliary electrode 16 onto the substrate 10 is located within the front projection of the pixel defining layer 14 onto the substrate 10. The second auxiliary electrode 16 with the structure not only increases the area of the second electrode 13 and effectively reduces the IR drop, but also does not affect the aperture ratio of the display substrate.

It is understood that the second auxiliary electrode 16 is not limited to the second mesh structure in fig. 2, and the second auxiliary electrode 16 may be a bar-shaped electrode, for example, the second auxiliary electrode 16 may be a bar-shaped electrode extending in a horizontal direction, or the second auxiliary electrode 16 may be a bar-shaped electrode extending in a vertical direction, and the specific shape of the second auxiliary electrode 16 may be set as required.

In one embodiment, as shown in fig. 2, there is no overlapping area between the orthographic projection of the second auxiliary electrode 16 on the substrate 10 and the orthographic projection of the first auxiliary electrode 13 on the substrate 10 in the same direction. For example, in the horizontal direction, there is no overlapping area between the orthographic projection of the second auxiliary electrode 16 on the substrate base plate 10 and the orthographic projection of the first auxiliary electrode 13 on the substrate base plate 10; in the vertical direction, there is no overlapping area between the orthographic projection of the second auxiliary electrode 16 on the substrate base plate 10 and the orthographic projection of the first auxiliary electrode 13 on the substrate base plate 10. Thereby, the overlapping area of the second auxiliary electrode 16 and the first auxiliary electrode 13 can be reduced to the maximum extent, avoiding the risk of short-circuiting.

Fig. 3 is a schematic diagram of a method for manufacturing a display substrate according to an embodiment of the disclosure. As shown in fig. 3, the method for manufacturing the display substrate may include:

S11, providing a substrate, wherein a first common electrode is arranged on one side of the substrate;

s12, forming an organic light emitting diode pixel on one side of the substrate towards the first common electrode;

s13, forming a first passivation layer on one side of the organic light-emitting diode pixel, which is far away from the substrate, wherein the orthographic projection of the organic light-emitting diode pixel on the substrate is positioned in the orthographic projection range of the first passivation layer on the substrate, and the orthographic projection of the first common electrode on the substrate is at least partially positioned outside the orthographic projection range of the first passivation layer on the substrate;

s14, forming a first auxiliary electrode on one side of the first passivation layer, which is far away from the substrate, and connecting the first auxiliary electrode with the first common electrode.

In one embodiment, forming the first auxiliary electrode on a side of the first passivation layer facing away from the substrate base plate may include: forming a first auxiliary electrode solution on one side of the first passivation layer, which is far away from the substrate by adopting an ink-jet printing mode; and curing the first auxiliary electrode solution to form the first auxiliary electrode.

In one embodiment, the organic light emitting diode pixel includes a first electrode, a light emitting structure layer, and a second electrode sequentially stacked on a substrate, and the method of manufacturing a display substrate may further include, before forming the first passivation layer: forming a second auxiliary electrode solution on one side of the second electrode, which is far away from the substrate by adopting an ink-jet printing mode; and solidifying the second auxiliary electrode solution to form a second auxiliary electrode, wherein the second auxiliary electrode is in contact connection with the second electrode.

The technical scheme of the embodiment of the disclosure is further described below through a preparation process of the display substrate in the embodiment of the disclosure. It should be understood that, as used herein, the term "patterning" includes processes such as photoresist coating, mask exposure, development, etching, photoresist stripping, etc. when the patterned material is inorganic or metal, and processes such as mask exposure, development, etc. when the patterned material is organic, evaporation, deposition, coating, etc. are all well-known processes in the related art.

The preparation process of the display substrate may include:

s11, providing a substrate 10, and providing a first common electrode 11 on one side of the substrate 10.

It will be appreciated that the base substrate 10 may include a base 101 and a control structure layer 102 on one side of the base 101. The control structure layer 102 may include a thin film transistor, a gate line, a data line, and the like. Illustratively, the control structure layer 102 may further include a first metal trace, which may be disposed in the same layer as the gate electrode of the thin film transistor in the substrate, or the first metal trace may be disposed in the same layer as the source electrode or the drain electrode of the thin film transistor in the substrate. The first common electrode 11 is connected to the first metal trace. The first common electrode 11 may be an electrode exposed at the upper side of the substrate 10, or the first common electrode 11 may be a first Pad (Pad) located at the upper side of the substrate 10, and the first Pad is connected to the first metal trace through a via hole. It will be appreciated by those skilled in the art that the specific position and structure of the first common electrode 11 may be set as required, so long as the first common electrode 11 is connected with the first metal trace, and the first auxiliary electrode 13 may be connected with the first common electrode 11 in a subsequent process, so as to achieve connection of the first auxiliary electrode and the first metal trace.

Illustratively, one side of the base substrate 10 is also provided with a second common electrode 15. The control structure layer 102 may further include a second metal trace, which may be disposed in the same layer as the gate electrode of the thin film transistor in the substrate, or the second metal trace may be disposed in the same layer as the source electrode or the drain electrode of the thin film transistor in the substrate. The second common electrode 15 is connected to the second metal wiring. The second common electrode 15 may be an electrode exposed at the upper side of the substrate 10, or the second common electrode 15 may be a second Pad (Pad) located at the upper side of the substrate 10, and the second Pad is connected to the second metal trace through a via hole. It will be appreciated by those skilled in the art that the specific location and structure of the second common electrode 15 may be set as required, as long as the second common electrode 15 is connected to the second metal trace, and that the connection between the second electrode 23 and the second common electrode 15 may be achieved in a subsequent process.

The preparation process of the substrate 10 is a conventional technology in the art, and will not be described herein.

S12, an organic light emitting diode pixel 20 is formed on a side of the substrate 10 facing the first common electrode 11, as shown in fig. 4, and fig. 4 is a schematic diagram of the display substrate after the organic light emitting diode pixel is formed in the display substrate according to an embodiment of the disclosure. Illustratively, this step may include:

The first electrodes 21 are formed on a side of the substrate 10 facing the first common electrode 11, the number of the first electrodes 21 may be plural, the first electrodes 21 may be located in the display area, and the plurality of first electrodes 21 may be arranged in an array. Illustratively, the first electrode 21 may be formed using patterning process by depositing a first electrode thin film on a side of the substrate base 10 facing the first common electrode 11. The material of the first electrode 21 may include Indium Tin Oxide (ITO). It will be appreciated that the first electrode 21 is connected to a corresponding thin film transistor in the substrate base 10.

A pixel defining layer 14 is formed on a side of the first electrode 21 facing away from the substrate 10, the pixel defining layer 14 being provided with a plurality of openings, each opening defining a region in which an OLED pixel 20 is located, the first electrode 21 being exposed through the corresponding opening. The pixel defining layer 14 may be formed using conventional techniques in the art and will not be described in detail herein.

An organic light emitting layer 221 is formed on a side of the pixel defining layer 14 facing away from the substrate 10, the organic light emitting layer 221 being located within an opening defined by the pixel defining layer 14. For example, the organic light emitting layer 221 may be formed by printing an organic light emitting material in the opening using an inkjet printing process and drying the film. The specific material of the organic light emitting layer 221 may be set as required. The OLED pixel 20 may be a red pixel, a green pixel, or a blue pixel, and correspondingly, the organic light emitting layer may be a red light emitting layer, a green light emitting layer, or a blue light emitting layer. The ink jet printed device of choice may be SBS architecture.

The injection modifying layer 222 is formed on a side of the organic light emitting layer 221 facing away from the substrate 10, and the injection modifying layer 222 may be located in an opening defined by the pixel defining layer, or the injection modifying layers 222 of the OLED pixels 20 may be connected to each other as an integral structure. For example, the injection modifying layer 222 may be formed on a side of the organic light emitting layer 221 facing away from the substrate base plate 10 using a thermal evaporation process. The thickness of implant modification layer 222 may range from 10nm to 20nm (inclusive).

The second electrode 23 is formed on the side of the injection modifying layer 222 facing away from the substrate 10, the second electrodes 23 of the OLED pixels 20 are connected as an integral structure, and the second electrodes 23 are connected to the second common electrode 15, as shown in fig. 4. Illustratively, the second electrode 23 may be formed by forming a second electrode film on the side of the implantation modification layer 222 facing away from the substrate 10 by sputtering, and patterning the second electrode film. The material of the second electrode 23 may include at least one of Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), and the like. The thickness of the second electrode 23 may range from 70nm to 300nm (inclusive). For example, a metal film may be formed on a side of the injection modification layer 222 facing away from the substrate 10 by thermal evaporation, and the metal film may be made of magnesium, silver, or a magnesium-silver alloy, and a transparent semiconductor or a transparent conductor may be plated on the metal film according to requirements, so as to form a second electrode, where the second electrode includes a metal film and a semiconductor (or conductor) film that are stacked.

It is understood that the preparation methods of the organic light emitting layer 221, the injection modifying layer 222 and the second electrode 23 are not limited to the above-listed methods, and the organic light emitting layer 221, the injection modifying layer 222 and the second electrode 23 may be formed by methods known in the art, such as thermal evaporation, respectively.

In one embodiment, before forming the organic light emitting layer 221, a hole injection layer and a hole transport layer may be sequentially formed at a side of the pixel defining layer 14 facing away from the substrate 10, the hole injection layers of the respective OLED pixels may be connected as a unitary structure, and the hole transport layers of the respective OLED pixels may be connected as a unitary structure.

Fig. 5 is a schematic diagram of a display substrate after forming a second auxiliary electrode according to an embodiment of the disclosure. In one embodiment, the method for manufacturing a display substrate may further include S15: forming a second auxiliary electrode solution on the side of the second electrode 23 facing away from the substrate base plate 10 by adopting an ink-jet printing mode; the second auxiliary electrode solution is solidified to form a second auxiliary electrode 16, and the second auxiliary electrode 16 is in contact with the second motor 23, as shown in fig. 5. It will be appreciated that ink jet printing is one type of solution process, and that other means of solution process may be employed in forming the second auxiliary electrode 16. For example, one of lithographic, relief, intaglio, etc. printing processes may be used, and the second auxiliary electrode solution may be formed on the side of the second electrode 23 facing away from the substrate 10 by using a transfer method, so as to form the second auxiliary electrode 16. The solution process material may be silver particle sintered or reduced and needs some heating temperature to cure and form conductive metal. Illustratively, the curing temperature may range from 80 ℃ to 130 ℃ (inclusive). Wherein the second auxiliary electrode solution may include at least one of the following: the second auxiliary electrode solution may further include a mixture of organic molecules such as diluents, dispersants, curing reactants, and the like.

S13, forming the first passivation layer 12 on a side of the organic light emitting diode pixel 20 facing away from the substrate 10, where the front projection of the organic light emitting diode pixel 20 on the substrate 10 is located within the front projection range of the first passivation layer 12 on the substrate 10, and the front projection of the first common electrode 11 on the substrate 10 is at least partially located outside the front projection range of the first passivation layer 12 on the substrate 10, as shown in fig. 6, fig. 6 is a schematic diagram of the display substrate according to an embodiment of the disclosure after the first passivation layer is formed. Illustratively, a first passivation film may be deposited on a side of the second auxiliary electrode 16 facing away from the substrate base plate 10, and the first passivation film may be patterned to form the first passivation layer 12. The material of the first passivation layer 12 may include at least one of silicon nitride (SiNx) and silicon oxide (SiOx).

S14, a first auxiliary electrode 13 is formed on a side of the first passivation layer 12 facing away from the substrate 10, and the first auxiliary electrode 13 is connected to the first common electrode 11, as shown in fig. 7, fig. 7 is a schematic diagram of a substrate according to an embodiment of the disclosure after the first auxiliary electrode is formed. Illustratively, the first auxiliary electrode solution may be formed on the side of the first passivation layer 12 facing away from the substrate base plate 10 by means of inkjet printing; the first auxiliary electrode solution is solidified to form a first auxiliary electrode 13, and the first auxiliary electrode 13 is connected to the first common electrode 11. It will be appreciated that the ink jet printing is one of the solution processes, and that other means of solution processes may be used in forming the first auxiliary electrode 13. For example, one of lithographic, relief, intaglio, etc. printing processes may be used, and the first auxiliary electrode solution may be formed on the side of the first passivation layer 12 facing away from the substrate 10 by using a transfer method, so as to form the first auxiliary electrode 13. The solution process material may be silver particle sintered or reduced to form conductive metal. Illustratively, the curing temperature may range from 80 ℃ to 130 ℃ (inclusive). Wherein the first auxiliary electrode solution may include at least one of the following: the first auxiliary electrode solution may further include a mixture of organic molecules such as diluents, dispersants, curing reactants, and the like.

In one embodiment, the method for manufacturing a display substrate may further include S16: a second passivation layer 17 is formed on the side of the first auxiliary electrode 13 facing away from the substrate 10, and the orthographic projections of the first common electrode 11 and the first auxiliary electrode 13 on the substrate 10 are both located within the orthographic projection range of the second passivation layer 17 on the substrate 10, as shown in fig. 1. For example, a second passivation film may be deposited on a side of the first auxiliary electrode 13 facing away from the substrate base plate 10, and the second passivation film may be subjected to a patterning process to form the second passivation layer 17. The material of the second passivation layer 17 may include at least one of silicon nitride (SiNx) and silicon oxide (SiOx).

Fig. 8 is a schematic structural diagram of a display device according to an embodiment of the disclosure. Based on the inventive concept of the foregoing embodiments, the present disclosure also provides a display device, as shown in fig. 8, including a display substrate adopting the foregoing embodiments, and the display device may further include a cover plate 200 disposed opposite to the display substrate, the cover plate 200 being located at a side of the display substrate facing the OLED pixels 20. The display device may further include a transparent adhesive (Filler) 300 filled between the cover plate 200 and the display substrate. The display device may be: any product or component with display function such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the disclosure. The components and arrangements of specific examples are described above in order to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present disclosure. Furthermore, the present disclosure may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The above is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the disclosure, which should be covered in the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A display substrate, comprising:

a substrate base;

an organic light emitting diode pixel located at one side of the substrate;

a first common electrode located at one side of the substrate base plate facing the organic light emitting diode pixel;

The first passivation layer is positioned on one side of the organic light emitting diode pixel, which is away from the substrate, and the orthographic projection of the organic light emitting diode pixel on the substrate is positioned in the orthographic projection range of the first passivation layer on the substrate, and the orthographic projection of the first common electrode on the substrate is at least partially positioned outside the orthographic projection range of the first passivation layer on the substrate;

the first auxiliary electrode is positioned on one side of the first passivation layer, which is away from the substrate base plate, and is connected with the first common electrode;

the organic light-emitting diode pixel comprises a first electrode, a light-emitting structure layer and a second electrode which are sequentially stacked on the substrate, the display substrate further comprises a second common electrode and a second auxiliary electrode, the second common electrode is positioned on one side of the substrate facing the organic light-emitting diode pixel, the second electrode is connected with the second common electrode, the second auxiliary electrode is positioned between the second electrode and the first passivation layer, and the second auxiliary electrode is in contact connection with the second electrode;

in the same extending direction, there is no overlapping area between the orthographic projection of the second auxiliary electrode on the substrate and the orthographic projection of the first auxiliary electrode on the substrate.

2. The display substrate of claim 1, wherein orthographic projections of the second electrode, the second common electrode, and the second auxiliary electrode on the substrate are all within an orthographic projection range of the first passivation layer on the substrate.

3. The display substrate of claim 1, wherein there is no overlap area between the front projection of the first auxiliary electrode on the substrate and the front projection of the organic light emitting diode pixel on the substrate.

4. A display substrate according to claim 3, wherein the display substrate comprises a display area and a frame area located at the periphery of the display area, one side of the display substrate is used for being connected with a printed circuit board, the frame area comprises a near-end frame area close to the printed circuit board and a far-end frame area far away from the printed circuit board, the number of the first common electrodes is a plurality, a part of the first common electrodes is located in the near-end frame area, a part of the first common electrodes is located in the far-end frame area, the first auxiliary electrodes comprise first strip-shaped sub-electrodes, the first strip-shaped sub-electrodes extend from the near-end frame area to the far-end frame area across the display area, the first auxiliary electrodes are connected with first common electrodes in the near-end frame area, and the first auxiliary electrodes are connected with first common electrodes in the far-end frame area.

5. The display substrate according to claim 4, wherein the first auxiliary electrode further comprises a second stripe-shaped sub-electrode, and an extending direction of the second stripe-shaped sub-electrode is perpendicular to an extending direction of the first stripe-shaped sub-electrode.

6. The display substrate according to any one of claims 3 to 5, wherein the organic light emitting diode pixel comprises a first electrode, a light emitting structure layer and a second electrode sequentially stacked on the substrate, the display substrate further comprises a second auxiliary electrode, the second auxiliary electrode is located between the second electrode and the first passivation layer, the second auxiliary electrode is in contact connection with the second electrode, and an overlapping area does not exist between the front projection of the second auxiliary electrode on the substrate and the front projection of the organic light emitting diode pixel on the substrate.

7. The display substrate according to claim 1, wherein the organic light emitting diode pixel includes a first electrode, a light emitting structure layer, and a second electrode sequentially stacked on the substrate, the light emitting structure layer including an organic light emitting layer and an injection modifying layer, the injection modifying layer being located between the organic light emitting layer and the second electrode.

8. A method for manufacturing a display substrate, comprising:

forming a first electrode on one side of the substrate facing the first common electrode, forming a pixel defining layer on one side of the first electrode facing away from the substrate, wherein the pixel defining layer is provided with a plurality of openings, the first electrode is exposed through the corresponding openings, and forming an organic light emitting layer on one side of the pixel defining layer facing away from the substrate, wherein the organic light emitting layer is positioned in the opening defined by the pixel defining layer; a second common electrode is further arranged on one side of the substrate, an injection modification layer is formed on one side of the organic light-emitting layer, which is away from the substrate, and a second electrode is formed on one side of the injection modification layer, which is away from the substrate, and is connected with the second common electrode; forming a second auxiliary electrode solution on one side of the second electrode, which is far away from the substrate by adopting an ink-jet printing mode; solidifying the second auxiliary electrode solution to form a second auxiliary electrode, wherein the second auxiliary electrode is in contact connection with the second electrode;

Forming a first passivation layer on one side of an organic light emitting diode pixel, which is far away from the substrate, wherein the orthographic projection of the organic light emitting diode pixel on the substrate is positioned in the orthographic projection range of the first passivation layer on the substrate, and the orthographic projection of the first common electrode on the substrate is at least partially positioned outside the orthographic projection range of the first passivation layer on the substrate;

9. The method of manufacturing according to claim 8, wherein forming a first auxiliary electrode on a side of the first passivation layer facing away from the substrate base plate comprises:

and solidifying the first auxiliary electrode solution to form a first auxiliary electrode.

10. A display device comprising the display substrate according to any one of claims 1 to 7.