CN112924495A - Sensing device and manufacturing method thereof - Google Patents
Sensing device and manufacturing method thereof Download PDFInfo
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- CN112924495A CN112924495A CN202110126649.8A CN202110126649A CN112924495A CN 112924495 A CN112924495 A CN 112924495A CN 202110126649 A CN202110126649 A CN 202110126649A CN 112924495 A CN112924495 A CN 112924495A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000012237 artificial material Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 34
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 32
- 238000010586 diagram Methods 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 10
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 7
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 229910000846 In alloy Inorganic materials 0.000 claims description 4
- 239000008367 deionised water Substances 0.000 claims description 4
- 229910021641 deionized water Inorganic materials 0.000 claims description 4
- 229910052738 indium Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 210000001015 abdomen Anatomy 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 208000020764 Sensation disease Diseases 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/045—Circuits
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/1382—Detecting the live character of the finger, i.e. distinguishing from a fake or cadaver finger
Abstract
The embodiment of the invention provides a sensing device and a manufacturing method thereof, wherein the sensing device comprises: a circuit of loop type composed of conductive ink; the loop circuit comprises two first leads, at least three second leads and at least two third leads; the number of the third leads is one less than that of the second leads; the extending direction of the second leads is mutually crossed with the extending direction of the first leads and the extending direction of the third leads, the second leads and the third leads are alternately arranged, the first end of each third lead is connected with the first end of the second lead positioned on one side of the third lead, and the second end of each third lead is connected with the second end of the second lead positioned on the other side of the third lead; the first ends of the two first leads are respectively connected with the end part of the second lead which is not connected with the third lead; the paper clip circuit is applied to biological skin or artificial material simulating fingerprint. The scheme of the embodiment of the invention has simple structure and simple preparation process, and can be directly applied to biological skin or artificial material for simulating fingerprints.
Description
Technical Field
The invention relates to the field of sensing, in particular to a sensing device and a manufacturing method thereof.
Background
The mechanical touch sensor or the epidermal electronic touch sensor for identifying the surface texture mostly adopts a pressure sensitive element array, and the pressure or deformation of the sensor at different positions on the array is different through directly contacting a pressing surface to identify the height and the relief of the surface texture. At present, a machine touch sensor or a skin electronic touch sensor mostly realizes the identification of concave-convex textures on the surface of an object through a fine pressure sensor array. However, the pressure sensor-based sensory sensor is insufficient for the surface texture fluctuation, and the texture recognition of the surface of a soft object.
The surface texture recognition adopts a sliding touch-rubbing mode, and fine textures are sensed through continuous deformation and vibration of skin fingerprints under different surface shearing forces. For such texture recognition, continuous deformation of fingerprint and vibrotactile sensation generated by imitating the surface of human finger belly sliding touch material are needed for recognition. The material for realizing the sliding touch identification of the surface texture is mainly characterized in that a complex multilayer structure is designed, namely, a piezoelectric or piezoresistive material is arranged in the middle layer, a fine protrusion array is processed on the other layer of material in a fine processing mode, the layer of material is attached to a pressure sensitive material layer and then packaged, the surface of the packaging layer is etched to form a texture similar to a fingerprint, and the texture of the packaging layer slides with the surface of the texture to be identified to generate continuous fine deformation and vibration, so that the pressure sensitive material of the inner layer generates a voltage or resistance change waveform, and thus, the identification of different textures is realized.
Currently, the pressure sensor for recognizing the surface texture by sliding touch and friction is generally formed by a complicated multi-layer structure design or a plurality of electronic sensors integrated, the manufacturing process is very complicated and it is very difficult to apply to a specific scene such as the skin of a patient with sensory disorder.
Disclosure of Invention
The embodiment of the invention provides a sensing device and a manufacturing method thereof, which have simple structure and simple preparation process and can be directly applied to biological skin or artificial material for simulating fingerprints.
In a first aspect, an embodiment of the present invention provides a sensing apparatus, including: a circuit of loop type composed of conductive ink;
the clip circuit comprises two first leads, at least three second leads and at least two third leads;
the number of the third leads is one less than the number of the second leads;
the extending direction of the second lead wires is mutually crossed with the extending direction of the first lead wires and the extending direction of the third lead wires, the second lead wires and the third lead wires are alternately arranged, the first end of each third lead wire is connected with the first end of the second lead wire positioned on one side of the third lead wire, and the second end of each third lead wire is connected with the second end of the second lead wire positioned on the other side of the third lead wire;
first ends of the two first lead wires are respectively connected with the end part of the second lead wire which is not connected with the third lead wire;
the clip-shaped circuit is applied to biological skin or artificial material simulating fingerprint.
Optionally, the conductive ink includes liquid metal, a polyvinyl alcohol solution, and deionized water;
or the conductive ink comprises liquid metal, polyvinyl alcohol solution and dimethyl sulfoxide.
Optionally, the liquid metal is gallium-indium alloy or gallium metal or indium metal.
Optionally, the sensing device further includes: two copper wires;
the first ends of the two copper wires are respectively connected with the second ends of the two first leads;
the copper wire is used for conducting the electric signals in the loop circuit and transmitting power signals for the loop circuit.
Optionally, the sensing device further includes a processing module;
the processing module is connected with the second ends of the two copper wires;
the processing module is used for receiving the electric signals in the loop circuit, comparing the received electric signals with resistance change oscillograms of different materials and analyzing the material types corresponding to the electric signals in the loop circuit.
Optionally, the sensing device further includes a storage module;
the storage module is used for storing resistance change wave patterns of different materials.
Optionally, the sensing device further includes a display module;
the display module is used for displaying the material type identified by the loop-shaped circuit and the waveform diagram of the electric signal in the loop-shaped circuit.
Optionally, the sensing device further includes a power module;
the power module is used for supplying power to the clip circuit, the storage module, the display module and the processing module.
In a second aspect, an embodiment of the present invention further provides a method for manufacturing a sensing device, including:
drawing a pattern of the clip-shaped circuit on the sticker;
the clip circuit comprises two first leads, at least three second leads and at least two third leads; the number of the third leads is one less than the number of the second leads; the extending direction of the second lead wires is mutually crossed with the extending direction of the first lead wires and the extending direction of the third lead wires, the second lead wires and the third lead wires are alternately arranged, the first end of each third lead wire is connected with the first end of the second lead wire positioned on one side of the third lead wire, and the second end of each third lead wire is connected with the second end of the second lead wire positioned on the other side of the third lead wire; first ends of the two first lead wires are respectively connected with the end part of the second lead wire which is not connected with the third lead wire;
cutting a hollowed-out pattern with the same shape as the clip circuit on the sticker by a paper cutter;
sticking the paster on the biological skin or the artificial material for simulating the fingerprint;
spraying conductive ink in the hollow pattern of the sticker;
and (4) tearing off the paster pasted on the biological skin or the artificial material simulating the fingerprint.
Optionally, the conductive ink is sprayed in the hollow pattern of the sticker by using a pneumatic spray pen.
According to the sensing device provided by the embodiment of the invention, the loop circuit can be manufactured by directly spraying and painting the conductive ink on the biological skin and the simulated fingerprint artificial material, so that the sensing device provided by the embodiment of the invention has a simple preparation process, and the conductive ink has the characteristic of friction resistance, so that the conductive ink can be directly contacted with the material to be detected without arranging a protective layer and the like, the sensing device provided by the embodiment of the invention has a simple structure, and in addition, the conductive ink has the characteristics of light weight, good contact with the biological skin and the simulated fingerprint artificial material and the like, so that the loop circuit provided by the embodiment of the invention can be directly formed on the biological skin or the simulated fingerprint artificial material.
Drawings
Fig. 1 is a schematic structural diagram of a loop circuit according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of another loop circuit according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a sensing device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a sensing device provided in an embodiment of the present invention in practical application;
FIG. 5 is a schematic diagram of a waveform structure of a sensing device for detecting skin according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a waveform structure of a detection sponge of the sensing device according to the embodiment of the present invention;
fig. 7 is a schematic diagram of a waveform structure of a sensing device for detecting strip-shaped wallpaper according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a waveform structure of a sensing device for detecting glossy paper according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a waveform structure of a sensing device for detecting rough paper according to an embodiment of the present invention;
fig. 10 is a schematic flowchart of a method for manufacturing a sensing device according to an embodiment of the present invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of and not restrictive on the broad invention. It should be further noted that, for convenience of description, only some structures, not all structures, relating to the embodiments of the present invention are shown in the drawings.
Fig. 1 is a schematic structural diagram of a loop circuit according to an embodiment of the present invention, and a sensing device according to an embodiment of the present invention includes: a loop circuit 110 composed of conductive ink; the loop circuit 110 includes two first leads 10, at least three second leads 20, and at least two third leads 30; the number of the third leads 30 is one less than the number of the second leads 20; the extending direction of the second leads 20 and the extending direction of the first leads 10 and the third leads 30 are crossed with each other, the second leads 20 and the third leads 30 are alternately arranged, the first end of each third lead 30 is connected with the first end of the second lead 20 positioned at one side of the third lead, and the second end is connected with the second end of the second lead 20 positioned at the other side of the third lead; first ends of the two first leads 10 are respectively connected with the end part of the second lead 20 which is not connected with the third lead 30; the meander circuit 110 is applied to biological skin or to simulated fingerprint artificial material.
Specifically, fig. 1 exemplarily shows a loop circuit 110 composed of two first lead lines 10, five second lead lines 20, and four third lead lines 30. The meander circuit 110 provided by the embodiment of the invention has a relatively simple manufacturing process, and can be manufactured by directly spraying conductive ink on biological skin or artificial material simulating fingerprints. After the conductive ink is sprayed on the biological skin or the simulated fingerprint artificial material, the conductive ink can be very tightly embedded into a fingerprint gully and completely attached to the biological skin or the simulated fingerprint artificial material. Secondly, the conductive ink has the friction resistance, and the loop circuit 110 does not need to be packaged, so that the loop circuit 110 sprayed on the biological skin does not cause the problem of poor air permeability of the biological skin, and the thickness range of the conductive ink sprayed on the biological skin is 5-15 micrometers, so that the conductive ink is completely non-sensible, like nothing, and does not have any uncomfortable feeling after being sprayed on the biological skin.
According to the sensing device provided by the embodiment of the invention, the loop circuit can be manufactured by directly spraying and painting the conductive ink on the biological skin and the simulated fingerprint artificial material, so that the sensing device provided by the embodiment of the invention has a simple preparation process, and the conductive ink has the characteristic of friction resistance, so that the conductive ink can be directly contacted with the material to be detected without arranging a protective layer and the like, the sensing device provided by the embodiment of the invention has a simple structure, and in addition, the conductive ink has the characteristics of light weight, good contact with the biological skin and the simulated fingerprint artificial material and the like, so that the loop circuit provided by the embodiment of the invention can be directly formed on the biological skin or the simulated fingerprint artificial material.
Optionally, the conductive ink comprises liquid metal, polyvinyl alcohol solution and deionized water; or the conductive ink comprises liquid metal, polyvinyl alcohol solution and dimethyl sulfoxide.
Specifically, the preparation method of the conductive ink comprises the following steps: dissolving 5% polyvinyl alcohol solution in deionized water or dimethyl sulfoxide, recording the mixed solution as a first solution, mixing liquid metal and the first solution in a mass ratio of 3:2, recording the mixed solution as a second solution, putting the second solution into a centrifugal tube, putting the centrifugal tube into an ultrasonic crusher for mixing, wherein the working time of the ultrasonic crusher is a first set value, the first set value is not more than five minutes, and the second solution mixed by the ultrasonic crusher is conductive ink. Therefore, the preparation method of the conductive ink is simple and the preparation time is short. Because the polyvinyl alcohol medium exists in the conductive ink, the conductive ink can form hydrogen bonds with the horny layer of the skin after contacting the skin, the conductive ink is firmly adhered to the skin, and an encapsulation film layer is not needed to prevent the falling-off of the clip circuit, so that the biological skin has better air permeability.
Optionally, the liquid metal is gallium indium alloy or gallium metal or indium metal.
Specifically, gallium-indium alloy, gallium metal and indium metal are cheap and easily available in the market, so that the cost for manufacturing the conductive ink is reduced. For example, fig. 2 is a schematic structural diagram of another loop circuit provided in an embodiment of the present invention, and referring to fig. 2, the cost required for manufacturing the loop circuit 110 shown in fig. 2 is within 0.5 yuan when the loop circuit 110 is located on the finger belly of a finger, and compared with a conventional sensor, the sensing device provided in an embodiment of the present invention has a characteristic of low cost.
Optionally, fig. 3 is a schematic structural diagram of a sensing device according to an embodiment of the present invention, and referring to fig. 3, the sensing device according to the embodiment of the present invention further includes: two copper wires 120; the first ends of the two copper wires 120 are respectively connected with the second ends of the two first leads 10; copper wire 120 is used to conduct electrical signals out of loop circuit 110 and also to transmit power signals for loop circuit 100.
Specifically, the second end of the first lead 10 has a rectangular shape, and the rectangular shape is used for fixing and connecting the copper wire 120. For example, fig. 4 is a schematic structural diagram of a sensing device in practical application according to an embodiment of the present invention, and referring to fig. 4, a loop circuit is sprayed on a finger abdomen, and when a finger sprayed with the loop circuit moves left and right on a material to be identified, an electrical signal is generated. With continued reference to fig. 3, the clip circuit 110 generates different electrical signals when contacting different materials, the electrical signals generated by the clip circuit 110 are conducted out through the copper wire 120, and the clip circuit 110 also provides power signals to the clip circuit 110 through the copper wire 120 during operation.
Optionally, with continuing reference to fig. 3, the sensing apparatus provided in the embodiment of the present invention further includes a processing module 130; the processing module 130 is connected with the second ends of the two copper wires 120; the processing module 130 is configured to receive the electrical signal in the loopback circuit 110, compare the received electrical signal with resistance variation waveforms of different materials, and analyze a material type corresponding to the electrical signal in the loopback circuit 110.
Specifically, the resistance change waveform diagrams of different materials refer to standard waveform diagrams stored in a storage module in the sensing device. The electrical signal may include the resistance detected by the loop-back circuit 110, and the processing module 130 compares the resistance detected by the loop-back circuit 110 with the standard resistance R0After comparison, the comparison with the standard waveform chart is performed to analyze the type of the material detected by the loop-back circuit 110. Exemplarily, fig. 5 is a schematic diagram of a waveform structure of a sensing device for detecting skin according to an embodiment of the present invention, fig. 6 is a schematic diagram of a waveform structure of a sensing device for detecting sponge according to an embodiment of the present invention, fig. 7 is a schematic diagram of a waveform structure of a sensing device for detecting strip-shaped wallpaper according to an embodiment of the present invention, and fig. 8 is a schematic diagram of a waveform structure of a sensing device for detecting strip-shaped wallpaper according to an embodiment of the present inventionFig. 9 is a schematic diagram of a waveform structure of a sensing device for detecting rough paper according to an embodiment of the present invention, and referring to fig. 5 to 9, it can be seen that a clip circuit generates different waveform diagrams on different materials, and referring to fig. 8 and 9, for smooth paper and rough paper, the sensing device according to the embodiment of the present invention generates significantly different waveforms, and therefore, experiments prove that the sensing device according to the embodiment of the present invention has good sensitivity. In practical applications, when the loop-type circuit in the sensing device provided by the embodiment of the invention is in contact with an unknown material, the loop-type circuit sends a detected electric signal to the processing module, and the processing module compares the detected electric signal with the standard waveform stored in the storage module to analyze the type of the material detected by the loop-type circuit.
Optionally, the sensing device provided in the embodiment of the present invention further includes a storage module; the storage module is used for storing resistance change wave patterns of different materials.
Specifically, the storage module stores resistance change oscillograms corresponding to different materials, when the loop circuit identifies different materials, different electric signals can be generated, the electric signals are transmitted to the processing module through the copper wires, the processing module compares the electric signals transmitted by the loop circuit with the standard oscillogram stored in the storage module, and therefore the standard oscillogram with the highest waveform matching degree with the electric signals transmitted by the loop circuit is found out, and the type of the material detected by the loop circuit can be known.
Optionally, the sensing device provided in the embodiment of the present invention further includes a display module; the display module is used for displaying the material type identified by the loop-shaped circuit and a waveform diagram of an electric signal in the loop-shaped circuit.
Specifically, after the processing module analyzes the material type detected by the clip circuit, the processing module sends the material type detected by the clip circuit to the display module, a user can check the material type detected by the clip circuit through the display module, an electric signal detected by the clip circuit is processed by the processing module and then sent to the display module, and the user can also see a time-varying relation graph of the electric signal detected by the clip circuit through the display module. Illustratively, in practical applications, the waveform diagrams shown in fig. 5-9 can be seen in the display module.
Optionally, the sensing device provided in the embodiment of the present invention further includes a power module; the power module is used for supplying power to the loop circuit, the storage module, the display module and the processing module.
Specifically, the power module is connected with the storage module, the display module and the processing module and used for providing power for the power module.
Fig. 10 is a schematic flowchart of a method for manufacturing a sensing device according to an embodiment of the present invention, and referring to fig. 10, the method for manufacturing a sensing device according to an embodiment of the present invention includes the following steps:
210. drawing a pattern of the clip-shaped circuit on the sticker;
the loop circuit comprises two first leads, at least three second leads and at least two third leads; the number of the third leads is one less than that of the second leads; the extending direction of the second leads is mutually crossed with the extending direction of the first leads and the extending direction of the third leads, the second leads and the third leads are alternately arranged, the first end of each third lead is connected with the first end of the second lead positioned on one side of the third lead, and the second end of each third lead is connected with the second end of the second lead positioned on the other side of the third lead; the first ends of the two first leads are respectively connected with the end part of the second lead which is not connected with the third lead;
220. cutting a hollow pattern with the same shape as the clip circuit on the sticker by a paper cutter;
230. sticking the paster on the biological skin or the artificial material for simulating the fingerprint;
240. spraying conductive ink in the hollow pattern of the sticker;
250. and (4) tearing off the paster pasted on the biological skin or the artificial material simulating the fingerprint.
Specifically, the shape of the paper clip circuit shown in fig. 1 is drawn on the sticker, the drawn figure is subtracted by a paper cutter, a hollowed paper clip circuit shape is formed on the sticker, the sticker is fixed on biological skin or a fingerprint simulation artificial material, illustratively, the sticker can be attached to a first joint of a finger, after the sticker is fixed, conductive ink is uniformly sprayed on the hollowed part of the sticker, and after the ink is dried, the sticker is torn off, so that the paper clip circuit shown in fig. 2 is formed on the finger belly of the finger. The sticker in this embodiment has an adhesive, and may be, for example, PVC wallpaper or any stickable sticker.
Optionally, the conductive ink is sprayed in the hollowed-out pattern of the sticker by using a pneumatic spray pen.
Specifically, after the conductive ink is prepared, the conductive ink is filled into the pneumatic spray pen, an air pump in the pneumatic spray pen is started, and the conductive ink is sprayed on the hollowed-out sticker through the pneumatic spray pen, so that the conductive ink is sprayed on biological skin or a simulated fingerprint artificial material through the hollowed-out part, and a clip circuit is formed.
The manufacturing method of the sensing device provided by the embodiment of the invention and the sensing device provided by any embodiment of the invention belong to the same inventive concept, and have corresponding beneficial effects.
It should be noted that the foregoing is only a preferred embodiment of the present invention and the technical principles applied. Those skilled in the art will appreciate that the embodiments of the present invention are not limited to the specific embodiments described herein, and that various obvious changes, adaptations, and substitutions are possible, without departing from the scope of the embodiments of the present invention. Therefore, although the embodiments of the present invention have been described in more detail through the above embodiments, the embodiments of the present invention are not limited to the above embodiments, and many other equivalent embodiments may be included without departing from the concept of the embodiments of the present invention, and the scope of the embodiments of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A sensing device, comprising: a circuit of loop type composed of conductive ink;
the clip circuit comprises two first leads, at least three second leads and at least two third leads;
the number of the third leads is one less than the number of the second leads;
the extending direction of the second lead wires is mutually crossed with the extending direction of the first lead wires and the extending direction of the third lead wires, the second lead wires and the third lead wires are alternately arranged, the first end of each third lead wire is connected with the first end of the second lead wire positioned on one side of the third lead wire, and the second end of each third lead wire is connected with the second end of the second lead wire positioned on the other side of the third lead wire;
first ends of the two first lead wires are respectively connected with the end part of the second lead wire which is not connected with the third lead wire;
the clip-shaped circuit is applied to biological skin or artificial material simulating fingerprint.
2. The sensing device of claim 1, wherein the conductive ink comprises a liquid metal, a polyvinyl alcohol solution, and deionized water;
or the conductive ink comprises liquid metal, polyvinyl alcohol solution and dimethyl sulfoxide.
3. The sensing device of claim 2, wherein the liquid metal is gallium indium alloy or gallium metal or indium metal.
4. The sensing device of claim 1, further comprising: two copper wires;
the first ends of the two copper wires are respectively connected with the second ends of the two first leads;
the copper wire is used for conducting the electric signals in the loop circuit and transmitting power signals for the loop circuit.
5. The sensing device of claim 4, further comprising a processing module;
the processing module is connected with the second ends of the two copper wires;
the processing module is used for receiving the electric signals in the loop circuit, comparing the received electric signals with resistance change oscillograms of different materials and analyzing the material types corresponding to the electric signals in the loop circuit.
6. The sensing device of claim 5, further comprising a storage module;
the storage module is used for storing resistance change wave patterns of different materials.
7. The sensing device of claim 6, further comprising a display module;
the display module is used for displaying the material type identified by the loop-shaped circuit and the waveform diagram of the electric signal in the loop-shaped circuit.
8. The sensing device of claim 7, further comprising a power module;
the power module is used for supplying power to the clip circuit, the storage module, the display module and the processing module.
9. A method of making a sensing device, comprising:
drawing a pattern of the clip-shaped circuit on the sticker;
the clip circuit comprises two first leads, at least three second leads and at least two third leads; the number of the third leads is one less than the number of the second leads; the extending direction of the second lead wires is mutually crossed with the extending direction of the first lead wires and the extending direction of the third lead wires, the second lead wires and the third lead wires are alternately arranged, the first end of each third lead wire is connected with the first end of the second lead wire positioned on one side of the third lead wire, and the second end of each third lead wire is connected with the second end of the second lead wire positioned on the other side of the third lead wire; first ends of the two first lead wires are respectively connected with the end part of the second lead wire which is not connected with the third lead wire;
cutting a hollowed-out pattern with the same shape as the clip circuit on the sticker by a paper cutter;
sticking the paster on the biological skin or the artificial material for simulating the fingerprint;
spraying conductive ink in the hollow pattern of the sticker;
and (4) tearing off the paster pasted on the biological skin or the artificial material simulating the fingerprint.
10. The method of manufacturing according to claim 9, wherein:
and spraying the conductive ink in the hollow pattern of the sticker by using a pneumatic spray pen.
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| CN202110126649.8A CN112924495A (en) | 2021-01-29 | 2021-01-29 | Sensing device and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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