CN112921385A - Modular electroplating system, modular electroplating method and application thereof - Google Patents
Modular electroplating system, modular electroplating method and application thereof Download PDFInfo
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- CN112921385A CN112921385A CN202110404779.3A CN202110404779A CN112921385A CN 112921385 A CN112921385 A CN 112921385A CN 202110404779 A CN202110404779 A CN 202110404779A CN 112921385 A CN112921385 A CN 112921385A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a modular electroplating system, a modular electroplating method and application thereof. The electroplating bath is internally provided with a circuit board and an anode plate positioned on at least one side of the circuit board, a local area on the surface of the circuit board forms a dense hole area, and the anode plate comprises at least two module anode plates. The module anode plate is in driving connection with the transmission assembly, the control system is used for driving the transmission assembly, and the module anode plate corresponding to the dense hole region moves towards the direction close to the circuit board under the driving of the transmission assembly. The invention eliminates the range of the dense hole area of the circuit board, solves the problem of difficult electroplating in the through hole of the circuit board, and improves the power line distribution of the specific area in the electroplating process by reducing the distance between the circuit board and the anode plate in the specific area.
Description
Technical Field
The invention belongs to the technical field of electroplating, relates to an electroplating device of a circuit board, and particularly relates to a modular electroplating system, a modular electroplating method and application thereof.
Background
With the development of the 5G project, the base station construction continuously promotes the improvement of the circuit board manufacturing process; for a base station board, the requirement of a high-frequency board is continuously improved, the thickness of a circuit board is increased, the aperture of a via hole is reduced, and a high-aspect-ratio board is formed. The circuit board has the advantages of large unit area, large plate thickness, small aperture, large hole density, small bonding pad diameter, small wiring width, small line spacing and more layers.
The through hole area of the circuit board in the traditional electroplating process has the phenomena of unequal current distribution height and great range difference, the uniform copper thickness of the inner hole and the surface of the electroplated circuit board can not be ensured, the phenomena of thick copper at two ends and thin copper in the middle of the hole occur, and the copper thickness is thin, namely the TP value is low. Even if a low current density (0.5-0.8A/dm) is adopted2) And the through hole copper plating is carried out for an ultra-long electroplating time (5-6 hours), so that the hole opening copper thickness is too large, the hole middle copper thickness is too small, and the hole copper fracture in the welding process or the good heat dissipation effect cannot be achieved easily due to the fact that the hole middle copper plating is too thin.
CN208857381U discloses electroplating device with honeycomb baffle for electroplate the board and electroplate, including electroplating jar, positive pole, spray tube and honeycomb baffle, electroplate the board the positive pole the spray tube reaches the honeycomb baffle is all located along vertical direction in the electroplating jar, the spray tube is located electroplate the board both sides, every be equipped with a plurality of nozzle on the spray tube, the nozzle from top to bottom evenly distributed in on the spray tube, and both sides the nozzle blowout end is respectively perpendicular just to corresponding electroplate board both sides face, the positive pole is located electroplate the board both sides, the honeycomb baffle is located electroplate board and one of them between the positive pole.
CN208038574U provides an electroplating apparatus with a movable functional spray rod, comprising an electroplating bath, two anodes, a cathode, an electroplating solution spray system and a power device, wherein the electroplating bath comprises an electroplating component and is prepared with an electroplating solution therein, and the two anodes are relatively arranged close to two side walls of the electroplating bath; the power device comprises a turbine, a turbine rod and a motor, wherein the turbine rod is vertically fixed in the middle of a jet flow main rod arranged at the top end of the jet flow main rod, and a rotating shaft of the turbine is connected with the motor; each jet flow general rod arranged at the top end of the jet flow rod is vertically fixed with a turbine rod, each turbine rod is meshed with a turbine, and a rotating shaft of each turbine is connected with a motor; the power device is used for pushing the four jet flow main rods to move up and down so as to drive the nozzles on the jet flow main rods to move up and down.
CN105063709A discloses an electroplating device for a printed circuit board, which comprises an electroplating bath for a printed circuit board to pass through, an anode plate disposed on any one side or both sides of the printed circuit board, and a nozzle disposed in the electroplating bath and having an opening facing the printed circuit board, wherein the anode plate is provided with a through hole penetrating along the thickness direction of the anode plate, the nozzle is fixedly disposed on the anode plate, and the opening of the nozzle is matched with the through hole. The number of the nozzles is multiple, the anode plate is provided with a plurality of through holes, and the nozzles are matched in the through holes in a one-to-one correspondence manner; the plurality of nozzles on the anode plate are sequentially communicated through spray pipes, and the spray pipes are positioned on the back side of the anode plate, which faces away from the printed circuit board.
The electroplating device reported above cannot effectively solve the problem that electroplating is difficult in a through hole of a circuit board due to uneven current distribution in the electroplating process, and the phenomenon that a plating layer in the middle of the hole is too thin can occur, so that a good heat dissipation effect cannot be achieved.
Therefore, if the through holes of the circuit board are reduced to have uniform plating in the through holes, the circuit board has a good heat dissipation effect, which is a problem to be solved.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a modular electroplating system, a modular electroplating method and application thereof, which can solve the problem of uneven electroplating of through holes of a circuit board.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides a modular electroplating system, which includes an electroplating bath, a transmission assembly disposed in the electroplating bath, and a control system electrically connected to the transmission assembly.
The electroplating bath is internally provided with a circuit board and an anode plate positioned on at least one side of the circuit board, a local area on the surface of the circuit board forms a dense hole area, and the anode plate comprises at least two module anode plates.
The module anode plate is in driving connection with the transmission assembly, the control system is used for driving the transmission assembly, and the module anode plate corresponding to the dense hole region moves towards the direction close to the circuit board under the driving of the transmission assembly.
The modular electroplating system provided by the invention can be used for controlling the anode plate by setting up a programmed control mode, and shortening the distance between the circuit board and the anode plate in a specific area, so that the current distribution in the dense hole area is uniform, the range problem of the through hole area is eliminated, and the uniform electroplating in the dense hole area of the circuit board is realized.
As a preferred technical scheme of the invention, the module anode plates are arranged in a rectangular shape to form the anode plates.
Preferably, the anode plate is of a square or rectangular structure.
Preferably, the anode plate has a length of 500 to 850mm, for example, 500mm, 520mm, 540mm, 550mm, 560mm, 580mm, 590mm, 600mm, 620mm, 640mm, 650mm, 680mm, 690mm, 700mm, 710mm, 720mm, 730mm, 740mm, 750mm, 760mm, 780mm, 800mm, 820mm, 830mm, 840mm and 850mm, but not limited to the values listed, and other values not listed in this range of values are equally applicable.
Preferably, the distance between the anode plate and the circuit board is 50-300 mm, such as 50mm, 60mm, 70mm, 90mm, 100mm, 110mm, 120mm, 140mm, 150mm, 160mm, 180mm, 200mm, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm and 300mm, but not limited to the values listed, and other values not listed in the range of values are equally applicable.
Preferably, the material of the modular anode plate is an insoluble anode material.
Preferably, the modular anode plate is of a square or rectangular structure.
Preferably, the length of the modular anode plate is 10-100 mm, for example, 10mm, 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm, 50mm, 55mm, 60mm, 65mm, 70mm, 75mm, 80mm, 85mm, 90mm, 95mm and 100mm, but is not limited to the recited values, and other values not recited in the range of values are also applicable.
As a preferable technical scheme of the invention, the module anode plate is provided with a through hole penetrating through the module anode plate.
Preferably, the perforations have a diameter of 3 to 30mm, and may be, for example, 3mm, 4mm, 5mm, 6mm, 8mm, 10mm, 12mm, 14mm, 15mm, 16mm, 18mm, 20mm, 22mm, 24mm, 25mm, 26mm, 28mm and 30mm, but are not limited to the recited values, and other values not recited within the range of values are also applicable.
As a preferred technical scheme, the transmission assembly comprises a fixing plate and at least two transmission rods vertically arranged on the fixing plate, the fixing plate and the anode plate are parallel to each other and are arranged on one side, away from the circuit board, of the anode plate, each module anode plate is correspondingly connected with one transmission rod, and the transmission rods are used for driving the module anode plates to move.
Preferably, the fixing plate is made of a conductive material.
Preferably, the transmission rod is a conductive transmission rod.
Preferably, the conductive transmission rod is a telescopic conductive transmission rod.
Preferably, the transmission rod is of a hollow structure inside.
And the transmission rod corresponding to the dense hole area stretches under the control of the control system, so that the module anode plate is driven to reciprocate.
As a preferred technical solution of the present invention, a nozzle is disposed at one end of the transmission rod away from the fixing plate, a nozzle of the nozzle extends from the through hole of the module anode plate and faces the circuit board, one end of the transmission rod away from the nozzle is independently connected to the jet flow main pipes, and the electrolyte flows in from the jet flow main pipes, is distributed to each transmission rod, and is sprayed out from the nozzle.
Preferably, the nozzle orifice matches the perforation.
In a preferred embodiment of the present invention, the distance between the dense hole region of the circuit board and the module anode plate is 10 to 30mm, for example, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm, 20mm, 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm, 28mm, 29mm and 30mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the side length of the porous region is 5-90 mm, 5mm, 6mm, 8mm, 10mm, 15mm, 20mm, 25mm, 30mm, 35mm, 40mm, 45mm, 50mm, 55mm, 60mm, 65mm, 70mm, 75mm, 80mm, 85mm and 90mm, but is not limited to the recited values, and other values not recited in the range of values are also applicable.
Preferably, a through hole is formed in the dense hole area.
Preferably, the aperture of the through hole is 0.2 to 0.5mm, for example, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm and 0.5mm, but not limited to the values listed, and other values not listed in the range of the values are also applicable.
Preferably, the area of the porous area is smaller than or equal to the area of the module anode plate.
Preferably, the hole pitch of two adjacent through holes is 0.5mm to 1.5mm, and may be, for example, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm and 1.5mm, but is not limited to the values listed, and other values not listed in the range of the values are also applicable.
In a second aspect, the present invention provides a modular electroplating method for electroplating using the modular electroplating system of the first aspect, the modular electroplating method comprising:
the control system drives the corresponding transmission assembly according to the position of the dense hole area on the circuit board, so that the corresponding module anode plate is pushed to move towards the direction close to the circuit board, and electroplating is started after the distance between the circuit board and the module anode plate reaches a preset distance.
The modular electroplating method provided by the invention solves the problem of difficult electroplating in the through hole of the circuit board caused by uneven current distribution by constructing the programmed control anode plate, and eliminates the range problem of the through hole area by reducing the distance between the circuit board and the anode plate in the specific area.
As a preferred technical scheme of the invention, in the electroplating process, the circuit board is fixed, the module anode plate corresponding to the position of the dense hole region is close to the dense hole region of the circuit board under the pushing of the transmission component, the rest module anode plates are kept unchanged, and after the electroplating is finished, the moved module anode plate is restored to the original position.
Preferably, the distance between the moving modular anode plate and the dense hole region is 10-30 mm, such as 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm, 20mm, 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm, 28mm, 29mm and 30mm, but is not limited to the values listed, and other values not listed in the range of values are equally applicable.
Preferably, the distance between the rest of the module anode plates and the circuit board is 50-300 mm, such as 50mm, 60mm, 70mm, 90mm, 100mm, 110mm, 120mm, 140mm, 150mm, 160mm, 180mm, 200mm, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm and 300mm, but is not limited to the values listed, and other values not listed in the range of values are equally applicable.
As a preferred technical scheme of the invention, in the electroplating process, the circuit board moves, the module anode plates corresponding to the position of the moving route of the dense hole area of the circuit board are pushed by the transmission component to be close to the dense hole area of the circuit board one by one along the moving direction of the circuit board, the moving module anode plates gradually leave the dense hole area along with the continuous movement of the circuit board, the current module anode plate is restored to the original position, the next module anode plate is immediately moved to be close to the dense hole area, and the steps are circulated until the moving module anode plates are all restored to the original position after the electroplating is finished.
Preferably, the distance between the moving modular anode plate and the dense hole region is 10-30 mm, such as 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, 16mm, 17mm, 18mm, 19mm, 20mm, 21mm, 22mm, 23mm, 24mm, 25mm, 26mm, 27mm, 28mm, 29mm and 30mm, but is not limited to the values listed, and other values not listed in the range of values are equally applicable.
Preferably, the distance between the rest of the module anode plates and the circuit board is 50-300 mm, such as 50mm, 60mm, 70mm, 90mm, 100mm, 110mm, 120mm, 140mm, 150mm, 160mm, 180mm, 200mm, 220mm, 230mm, 240mm, 250mm, 260mm, 270mm, 280mm, 290mm and 300mm, but is not limited to the values listed, and other values not listed in the range of values are equally applicable.
The modular electroplating system is applied to the electroplating process, and is applied to gantry electroplating, vertical continuous electroplating or horizontal electroplating.
It should be noted that, when the modular electroplating system provided by the invention is applied to gantry electroplating, the circuit board is fixed, the module anode plate corresponding to the dense hole region is pushed by the transmission component to be close to the dense hole region of the circuit board, the rest module anode plates are kept unchanged, and after the electroplating is finished, the movable module anode plate is restored to the original position. The circuit board moves in the electroplating process applied to the vertical continuous electroplating or horizontal electroplating process, the module anode plates corresponding to the moving route positions of the dense hole areas of the circuit board are pushed by the transmission assembly to be close to the dense hole areas of the circuit board one by one along the moving direction of the circuit board, the moving module anode plates gradually leave the dense hole areas along with the continuous movement of the circuit board, the current module anode plate returns to the original position, the next module anode plate immediately moves to be close to the dense hole areas, and the steps are repeated until the moving module anode plates are all returned to the original position after the electroplating is finished.
Compared with the prior art, the invention has the beneficial effects that:
according to the modular electroplating system, the modular electroplating method and the application thereof, the problem of difficult electroplating in through holes of a dense hole area of a circuit board caused by uneven current distribution is solved by constructing the anode plate in a programmed control mode, the range difference problem of the through hole area is eliminated by reducing the distance between the circuit board and the anode plate in a specific area, and uniform electroplating in the through holes of the circuit board is realized.
Drawings
FIG. 1 is a schematic diagram of the structure of a circuit board and an anode plate in a modular electroplating system according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a modular electroplating system according to an embodiment of the present invention.
1-a circuit board; 2-module anode plate; 3, perforating; 4, fixing a plate; 5-a transmission rod; 6-a pore-dense region; 7-control system.
Detailed Description
It is to be understood that in the description of the present invention, the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be taken as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "disposed," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.
In one embodiment, the present invention provides a modular electroplating system, which includes an electroplating bath, a transmission assembly disposed in the electroplating bath, and a control system 7 electrically connected to the transmission assembly. The electroplating bath is internally provided with a circuit board 1 and an anode plate positioned on at least one side of the circuit board 1, a dense hole area 6 is formed in a local area of the surface of the circuit board 1, the side length of the dense hole area 6 is 5-90 mm, the area of the dense hole area 6 is smaller than that of the module anode plate 2, and the hole distance between two adjacent through holes is 0.5-1.5 mm.
The distance between the anode plate and the circuit board 1 is 50-300 mm, the length of the anode plate is 500-850 mm, the anode plate comprises at least two module anode plates 2, and the module anode plates 2 are arranged in a rectangular shape to form the anode plate and can be of a square or rectangular structure. The material of module anode plate 2 is insoluble anode material, and module anode plate 2 is square or rectangle structure, and length is 10 ~ 100mm, sets up the perforation 3 that runs through module anode plate 2 on the module anode plate 2, and the aperture of perforation 3 is 3 ~ 30 mm.
The module anode plate 2 is connected with the transmission component in a driving way, and the control system 7 is used for driving the transmission component. The transmission assembly comprises a fixing plate 4 and at least two transmission rods 5 vertically arranged on the fixing plate 4, the fixing plate 4 is parallel to the anode plate and is arranged on one side of the anode plate far away from the circuit board 1, each module anode plate 2 is correspondingly connected with one transmission rod 5, and the transmission rods 5 are used for driving the module anode plates 2 to move. The distance between the moved module anode plate and the dense hole area 6 of the circuit board 1 is 10-30 mm. Wherein, the fixed plate 4 adopts conductive material, and the transmission rod 5 is the telescopic conductive transmission rod 5, and the inside is hollow structure. The transmission rod 5 corresponding to the dense hole area 6 stretches under the control of the control system 7, so as to drive the module anode plate 2 to reciprocate.
And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle.
In one embodiment, the present invention provides a modular electroplating method for electroplating using the modular electroplating system provided in one embodiment, comprising:
in the electroplating process, the circuit board 1 is fixed, and the control system 7 drives the corresponding transmission assembly according to the position of the dense hole area 6 on the circuit board 1, so that the corresponding module anode plate 2 is pushed. The module anode plate 2 corresponding to the dense hole area 6 is pushed by the transmission assembly to be close to the circuit board 1 until the distance between the module anode plate 2 and the dense hole area 6 is shortened to 10-30 mm. The rest module anode plates 2 are kept unchanged, and the distance between the rest module anode plates 2 and the circuit board 1 is 50-300 mm. After the electroplating is finished, the movable module anode plate 2 is restored to the original position.
In another embodiment, the present invention provides a modular electroplating method for electroplating using the modular electroplating system of one embodiment, comprising:
the circuit board 1 moves horizontally in the electroplating bath, and the control system 7 drives the corresponding transmission component to push the module anode plate 2 according to the position of the dense hole area 6 on the circuit board 1. Along with the movement of the dense hole area 6 on the circuit board 1, the module anode plates 2 corresponding to the movement route position are pushed by the transmission component to approach the circuit board 1 one by one along the movement direction of the circuit board 1. The distance between the movable module anode plate 2 and the dense hole area 6 is 10-30 mm, and the distance between the rest module anode plates 2 and the circuit board 1 is 50-300 mm. With the continuous movement of the circuit board 1, the moving module anode plate 2 gradually gets away from the circuit board 1, the current module anode plate 2 is restored to the original position, and the next module anode plate 2 immediately moves close to the dense hole area 6, and the process is circulated until the moving module anode plates 2 are all restored to the original position after the electroplating is finished.
Example 1
The embodiment provides a modular electroplating system, which comprises an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system 7 electrically connected with the transmission assembly. A circuit board 1 and an anode plate positioned on one side of the circuit board 1 are arranged in the electroplating bath, three dense hole areas 6 in different positions are formed on the surface of the circuit board 1, and the side lengths of the three dense hole areas 6 are all of a 90mm square structure. A plurality of through holes with the aperture of 0.5mm are formed in the dense hole area 6, and the hole distance between every two adjacent through holes is 1.5 mm.
The module anode plate 2 adopting the square structure with the length of 100mm is arranged in a rectangular shape to form an anode plate, the distance between the anode plate and the circuit board 1 is 300mm, the length of the anode plate is 850mm, the material of the module anode plate 2 is insoluble anode material, and each module anode plate 2 is provided with a through hole 3 which penetrates through the module anode plate 2 and has the aperture of 30 mm.
A fixing plate 4 is arranged on one side, away from the circuit board 1, of the anode plate in parallel, a plurality of transmission rods 5 are vertically arranged on the fixing plate 4, and each module anode plate 2 is correspondingly connected with one transmission rod 5. The transmission rod 5 is a telescopic conductive transmission rod 5, and the interior of the transmission rod is of a hollow structure. And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle. Wherein, the three transmission rods 5 respectively corresponding to the three dense hole areas 6 are extended and contracted under the control of the control system 7, thereby driving the module anode plate 2 to move to the position with the distance of 30mm from the dense hole areas 6 for electroplating.
Example 2
The embodiment provides a modular electroplating system, which comprises an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system 7 electrically connected with the transmission assembly. A circuit board 1 and an anode plate positioned on one side of the circuit board 1 are arranged in the electroplating bath, four dense hole areas 6 in different positions are formed on the surface of the circuit board 1, and the side lengths of the four dense hole areas 6 are all of a 80mm square structure. A plurality of through holes with the aperture of 0.45mm are arranged in the dense hole area 6, and the hole distance between two adjacent through holes is 1.3 mm.
The module anode plate 2 adopting the square structure with the length of 80mm is arranged in a rectangular shape to form an anode plate, the distance between the anode plate and the circuit board 1 is 280mm, the length of the anode plate is 730mm, the material of the module anode plate 2 is insoluble anode material, and a perforation 3 penetrating through the module anode plate 2 with the aperture of 26mm is arranged on each module anode plate 2.
A fixing plate 4 is arranged on one side, away from the circuit board 1, of the anode plate in parallel, a plurality of transmission rods 5 are vertically arranged on the fixing plate 4, and each module anode plate 2 is correspondingly connected with one transmission rod 5. The transmission rod 5 is a telescopic conductive transmission rod 5, and the interior of the transmission rod is of a hollow structure. And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle. Wherein, four transmission rods 5 respectively corresponding to the four dense hole areas 6 are extended and contracted under the control of the control system 7, thereby driving the module anode plate 2 to move to the position with the distance of 28mm from the dense hole areas 6 for electroplating.
Example 3
The embodiment provides a modular electroplating system, which comprises an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system 7 electrically connected with the transmission assembly. A circuit board 1 and anode plates positioned on two sides of the circuit board 1 are arranged in the electroplating bath, four dense hole areas 6 in different positions are formed on the surface of the circuit board 1, and the side lengths of the four dense hole areas 6 are all of a square structure with the length of 50 mm. A plurality of through holes with the aperture of 0.4mm are arranged in the dense hole area 6, and the hole distance between two adjacent through holes is 1.0 mm.
The module anode plate 2 adopting the square structure with the length of 60mm is arranged in a rectangular shape to form an anode plate, the distance between the anode plate and the circuit board 1 is 180mm, the length of the anode plate is 620mm, the material of the module anode plate 2 is insoluble anode material, and a perforation 3 penetrating through the module anode plate 2 with the aperture of 20mm is arranged on each module anode plate 2.
A fixing plate 4 is arranged on one side, away from the circuit board 1, of the anode plate in parallel, a plurality of transmission rods 5 are vertically arranged on the fixing plate 4, and each module anode plate 2 is correspondingly connected with one transmission rod 5. The transmission rod 5 is a telescopic conductive transmission rod 5, and the interior of the transmission rod is of a hollow structure. And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle. Wherein, four transmission rods 5 respectively corresponding to the four dense hole areas 6 are extended and contracted under the control of the control system 7, thereby driving the module anode plate 2 to move to the position 20mm away from the dense hole areas 6 for electroplating.
Example 4
The embodiment provides a modular electroplating system, which comprises an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system 7 electrically connected with the transmission assembly. A circuit board 1 and anode plates positioned at two sides of the circuit board 1 are arranged in the electroplating bath, five dense hole areas 6 at different positions are formed on the surface of the circuit board 1, and the side lengths of the five dense hole areas 6 are of a square structure with the length of 30 mm. A plurality of through holes with the aperture of 0.35mm are arranged in the dense hole area 6, and the hole distance between two adjacent through holes is 0.9 mm.
The module anode plate 2 adopting a square structure with the length of 50mm is arranged in a rectangular shape to form an anode plate, the distance between the anode plate and the circuit board 1 is 150mm, the length of the anode plate is 600mm, the material of the module anode plate 2 is insoluble anode material, and a perforation 3 penetrating through the module anode plate 2 and having the aperture of 15mm is arranged on each module anode plate 2.
A fixing plate 4 is arranged on one side, away from the circuit board 1, of the anode plate in parallel, a plurality of transmission rods 5 are vertically arranged on the fixing plate 4, and each module anode plate 2 is correspondingly connected with one transmission rod 5. The transmission rod 5 is a telescopic conductive transmission rod 5, and the interior of the transmission rod is of a hollow structure. And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle. Five transmission rods 5 respectively corresponding to the five dense hole areas 6 stretch under the control of a control system 7, so that the module anode plate 2 is driven to move to a position 18mm away from the dense hole areas 6 for electroplating.
Example 5
The embodiment provides a modular electroplating system, which comprises an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system 7 electrically connected with the transmission assembly. The electroplating bath is internally provided with a circuit board 1 and anode plates positioned at two sides of the circuit board 1, two dense hole areas 6 at different positions are formed on the surface of the circuit board 1, and the side lengths of the two dense hole areas 6 are both of a square structure with the length of 10 mm. A plurality of through holes with the aperture of 0.25mm are arranged in the dense hole area 6, and the hole distance between two adjacent through holes is 0.6 mm.
The module anode plate 2 adopting the square structure with the length of 20mm is arranged in a rectangular shape to form an anode plate, the distance between the anode plate and the circuit board 1 is 100mm, the length of the anode plate is 520mm, the material of the module anode plate 2 is insoluble anode material, and a perforation 3 penetrating through the module anode plate 2 with the aperture of 10mm is arranged on each module anode plate 2.
A fixing plate 4 is arranged on one side, away from the circuit board 1, of the anode plate in parallel, a plurality of transmission rods 5 are vertically arranged on the fixing plate 4, and each module anode plate 2 is correspondingly connected with one transmission rod 5. The transmission rod 5 is a telescopic conductive transmission rod 5, and the interior of the transmission rod is of a hollow structure. And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle. Wherein, the two transmission rods 5 respectively corresponding to the two dense hole areas 6 stretch out and draw back under the control of the control system 7, thereby driving the module anode plate 2 to move to the position 12mm away from the dense hole areas 6 for electroplating.
Example 6
The embodiment provides a modular electroplating system, which comprises an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system 7 electrically connected with the transmission assembly. The electroplating bath is internally provided with a circuit board 1 and anode plates positioned at two sides of the circuit board 1, two dense hole areas 6 at different positions are formed on the surface of the circuit board 1, and the two dense hole areas 6 are of rectangular structures with the length of 10mm and the width of 5 mm. A plurality of through holes with the aperture of 0.2mm are arranged in the dense hole area 6, and the hole distance between two adjacent through holes is 0.5 mm.
The module anode plate 2 adopting the square structure with the length of 10mm is arranged in a rectangular shape to form an anode plate, the distance between the anode plate and the circuit board 1 is 70mm, the length of the anode plate is 500mm, the material of the module anode plate 2 is insoluble anode material, and a perforation 3 with the aperture of 3mm penetrating through the module anode plate 2 is arranged on each module anode plate 2.
A fixing plate 4 is arranged on one side, away from the circuit board 1, of the anode plate in parallel, a plurality of transmission rods 5 are vertically arranged on the fixing plate 4, and each module anode plate 2 is correspondingly connected with one transmission rod 5. The transmission rod 5 is a telescopic conductive transmission rod 5, and the interior of the transmission rod is of a hollow structure. And a nozzle is arranged at one end of the transmission rod 5, which is far away from the fixed plate 4, the nozzle of the nozzle extends out from the through hole 3 of the module anode plate 2 and faces the circuit board 1, one end of the transmission rod 5, which is far away from the nozzle, is independently connected into the jet flow main pipe respectively, and the electrolyte flows in from the jet flow main pipe, is distributed into each transmission rod 5 and is sprayed out from the nozzle. Wherein, the two transmission rods 5 respectively corresponding to the two dense hole areas 6 stretch out and draw back under the control of the control system 7, thereby driving the module anode plate 2 to move to the position with the distance of 10mm from the dense hole areas 6 for electroplating.
Example 7
The embodiment provides a modular electroplating method, which comprises the following steps:
the circuit board 1 is fixed, and the control system 7 drives the corresponding transmission assembly according to the position of the dense hole area 6 on the circuit board 1, so as to push the corresponding module anode plate 2. The module anode plate 2 corresponding to the position of the dense hole area 6 is pushed by the transmission assembly to be close to the circuit board 1 until the distance between the module anode plate 2 and the dense hole area 6 is shortened to 10 mm. The positions of the rest module anode plates 2 are kept unchanged, and the distance between the rest module anode plates and the circuit board 1 is 100 mm. After the electroplating is finished, the movable module anode plate 2 is restored to the original position.
Example 8
The embodiment provides a modular electroplating method, which comprises the following steps:
the circuit board 1 moves in the electroplating bath, and the control system 7 drives the corresponding transmission component to push the corresponding module anode plate 2 according to the position of the dense hole area 6 on the circuit board 1. Along with the movement of the dense hole area 6 on the circuit board 1, the module anode plates 2 corresponding to the movement route position of the circuit board 1 are pushed by the transmission component to approach the circuit board 1 one by one along the movement direction of the circuit board 1 until the distance between the moving module anode plates 2 and the dense hole area 6 is 20 mm. The distance between the rest module anode plates 2 and the circuit board 1 is 100 mm. With the continuous movement of the circuit board 1, the moving module anode plate 2 gradually gets away from the circuit board 1, the current module anode plate 2 is restored to the original position, and the next module anode plate 2 immediately moves close to the dense hole area 6, and the process is circulated until the moving module anode plates 2 are all restored to the original position after the electroplating is finished.
Comparative example 1
This comparative example provides an electroplating system, which differs from example 1 in that: the anode plate is a fixed structure, the anode plate does not move in the whole electroplating process, and the rest structure is the same as that of the embodiment 1.
At a current density of 3A/dm2Under the conditions (1), the plating systems described in examples 1 to 8 and comparative example 1 were used to perform copper plating for 45min, the thickness of the circuit board 1 was 3.0mm, the pattern of the through hole in the circuit board 1 was taken off, and the hole section analysis was performed by the IPC method, and the results are shown in table 1:
TABLE 1
Wherein the TP value (%) shows the throwing power, it can be seen from Table 1 that, compared with comparative example 1, the modular plating system provided in example 1 has uniform copper thickness in the holes and on the plate surface after plating and no thin plating layer in the middle of the holes under the same current density. Embodiments 1 to 8 effectively solve the problem of difficult plating in the through hole of the circuit board 1 due to uneven current distribution, and the distance between the circuit board 1 and the anode plate in the specific region is reduced, thereby eliminating the problem of extreme difference in the through hole region.
The applicant declares that the above is only a specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and it should be understood by those skilled in the art that any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are within the scope and disclosure of the present invention.
Claims (10)
1. A modular electroplating system is characterized by comprising an electroplating bath, a transmission assembly arranged in the electroplating bath and a control system electrically connected with the transmission assembly;
a circuit board and an anode plate positioned on at least one side of the circuit board are arranged in the electroplating bath, a dense hole area is formed in a local area of the surface of the circuit board, and the anode plate comprises at least two module anode plates;
the module anode plate is in driving connection with the transmission assembly, the control system is used for driving the transmission assembly, and the module anode plate corresponding to the dense hole region moves towards the direction close to the circuit board under the driving of the transmission assembly.
2. The modular plating system of claim 1 wherein the modular anode plates are arranged in a rectangular pattern to form an anode plate;
preferably, the anode plate is of a square or rectangular structure;
preferably, the length of the anode plate is 500-850 mm;
preferably, the distance between the anode plate and the circuit board is 50-300 mm;
preferably, the material of the modular anode plate is an insoluble anode material;
preferably, the module anode plate is of a square or rectangular structure;
preferably, the length of the module anode plate is 10-100 mm.
3. The modular electroplating system according to claim 1 or 2, wherein the modular anode plate is provided with a through hole penetrating through the modular anode plate;
preferably, the aperture of the perforation is 3-30 mm.
4. The modular electroplating system according to claim 1, wherein the transmission assembly comprises a fixed plate and at least two transmission rods vertically arranged on the fixed plate, the fixed plate and the anode plate are parallel to each other and arranged on one side of the anode plate away from the circuit board, each modular anode plate is correspondingly connected with one transmission rod, and the transmission rods are used for driving the modular anode plates to move;
preferably, the fixing plate is made of a conductive material;
preferably, the transmission rod is a conductive transmission rod;
preferably, the conductive transmission rod is a telescopic conductive transmission rod;
preferably, the interior of the transmission rod is of a hollow structure;
preferably, the transmission rod corresponding to the position of the dense hole area stretches under the control of the control system, so as to drive the module anode plate to reciprocate.
5. The modular plating system as recited in claim 4, wherein a nozzle is disposed at an end of the transmission rod away from the fixed plate, a nozzle opening of the nozzle extends from the through hole of the modular anode plate and faces the circuit board, and ends of the transmission rod away from the nozzle are respectively and independently connected to a jet flow header pipe, and the electrolyte flows in from the jet flow header pipe, is distributed into each transmission rod and is sprayed out from the nozzle;
preferably, the nozzle orifice matches the perforation.
6. The modular plating system of claim 1, wherein the distance between the dense area of the circuit board and the modular anode plate close to the circuit board is 10-30 mm;
preferably, the side length of the porous area is 5-90 mm;
preferably, a through hole is formed in the dense hole area;
preferably, the aperture of the through hole is 0.2-0.5 mm;
preferably, the area of the porous area is smaller than or equal to the area of the module anode plate;
preferably, the hole distance between two adjacent through holes is 0.5 mm-1.5 mm.
7. A modular plating method for plating using the modular plating system of any of claims 1 to 6, the modular plating method comprising:
the control system drives the corresponding transmission assembly according to the position of the dense hole area on the circuit board, so that the corresponding module anode plate is pushed to move towards the direction close to the circuit board, and electroplating is started after the distance between the circuit board and the module anode plate reaches a preset distance.
8. The modular electroplating method as claimed in claim 7, wherein during the electroplating process, the circuit board is fixed, the modular anode plate corresponding to the dense hole region is pushed by the transmission assembly to be close to the dense hole region of the circuit board, the rest modular anode plates are kept unchanged, and after the electroplating is finished, the movable modular anode plate is restored to the original position;
preferably, the distance between the movable module anode plate and the dense hole region is 10-30 mm;
preferably, the distance between the other module anode plates and the circuit board is 50-300 mm.
9. The modular electroplating method as claimed in claim 7, wherein during the electroplating process, the circuit board moves, the module anode plates corresponding to the moving route of the dense hole region of the circuit board are pushed by the transmission assembly to approach the dense hole region of the circuit board one by one along the moving direction of the circuit board, the rest module anode plates are kept unchanged, the moving module anode plates gradually leave the dense hole region along with the continuous movement of the circuit board, the current module anode plate is restored to the original position, and the next module anode plate is immediately moved to approach the dense hole region, and the above steps are repeated until the moving module anode plates are all restored to the original position after the electroplating is finished;
preferably, the distance between the movable module anode plate and the dense hole region is 10-30 mm;
preferably, the distance between the other module anode plates and the circuit board is 50-300 mm.
10. Use of a modular plating system according to any of claims 1 to 6 in a gantry plating, vertical continuous plating or horizontal plating process.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113355721A (en) * | 2021-06-29 | 2021-09-07 | 上海天承化学有限公司 | Electroplating jet system |
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2021
- 2021-04-15 CN CN202110404779.3A patent/CN112921385A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113355721A (en) * | 2021-06-29 | 2021-09-07 | 上海天承化学有限公司 | Electroplating jet system |
| CN113355721B (en) * | 2021-06-29 | 2022-06-17 | 上海天承化学有限公司 | Electroplating jet system |
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