CN112921367A - Copper plating process for electroplating through hole of circuit board with high density ratio and aperture - Google Patents
Copper plating process for electroplating through hole of circuit board with high density ratio and aperture Download PDFInfo
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- CN112921367A CN112921367A CN202110085989.0A CN202110085989A CN112921367A CN 112921367 A CN112921367 A CN 112921367A CN 202110085989 A CN202110085989 A CN 202110085989A CN 112921367 A CN112921367 A CN 112921367A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/08—Rinsing
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
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- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention relates to a copper plating process for electroplating a through hole of a high-density specific-aperture circuit board, which comprises the following steps: removing dust and oil; the dust and oil removal is used for cleaning the electroplating bath and the circuit board; acid pickling and phosphorizing; adding an acid cleaner into the electroplating bath, and carrying out acid cleaning operation on the through hole of the circuit board to increase the activity of the through hole; electroplating copper; pouring electroplating solution and brightener into the electroplating bath, simultaneously putting the circuit board into the electroplating bath to enable the electroplating solution to submerge the circuit board, putting metal copper into the electroplating bath to enable the circuit board to serve as an anode and the circuit board to serve as a cathode, and connecting the electroplating solution into a direct current power supply to electroplate the workpiece circuit board; washing and drying; and after the copper electroplating process is finished, washing the circuit board workpiece with water and drying the circuit board workpiece. The invention has novel structure and simple and convenient operation, removes oil stains attached to the surface by using a degreaser before the copper electroplating operation, and cleans the surface of the circuit board workpiece by using an acoustic wave dust removal technology, thereby being beneficial to fully reacting the workpiece in the electroplating process.
Description
Technical Field
The invention relates to the technical field of electro-coppering, in particular to a copper plating process for electroplating through holes of a circuit board with a high density ratio and a high aperture ratio.
Background
With the miniaturization development of multilayer circuit boards, non-conductive through holes are required to be designed in more multilayer circuit boards. The non-conductive through hole means that the middle area of the inner side wall of the through hole is not provided with a copper layer, and the two end areas of the inner side wall of the through hole are respectively paved with a conductive layer, so that the non-conductive through hole cannot realize that the middle area of the inner side wall of the through hole is conducted to the two end areas of the inner side wall of the through hole.
The copper plating layer is mainly used for plating copper on the through hole of the circuit board with the high density specific aperture, the copper plating layer is an important constituent of a protective and decorative plating layer copper/nickel/chromium system, and the copper plating layer with flexibility and low porosity plays an important role in improving the bonding force and corrosion resistance between the plating layers. The copper plating is also used for local anti-carburizing, printing plate hole metallization and as a surface layer of the printing roller. The color copper layer after chemical treatment is coated with an organic film and can also be used for decoration. The most used copper plating solutions at present are cyanide plating solutions, sulfate plating solutions and pyrophosphate plating solutions.
Many plating solutions on the market are not suitable for direct current plating method and insoluble anode production at present, and the electroplating copper particle does not have bright, the crystallization is fine and close, ductility and homogeneity's characteristics simultaneously, and what present electroplating copper layer mostly adopted is sulfuric acid type electroplating copper technology, need constantly supply sulfuric acid in the production process, will have the incident hidden danger, simultaneously because the through-hole distribution of different aperture ratio, the plating solution can't evenly get into in the through-hole and cause the middle copper facing of through-hole too thin when electroplating, thereby arouse the hole copper fracture among the welding process easily, or form the water film at the through-hole port department, cause the plating solution can't get into the through-hole and accomplish the copper facing operation.
Disclosure of Invention
In order to solve the technical problems, the copper plating process for electroplating the through holes of the circuit board with the high density ratio aperture is provided, and the technical scheme solves the problem of potential safety hazard in the traditional copper electroplating process.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: a copper plating process for electroplating through holes of a high-density specific-aperture circuit board comprises the following steps:
1) removing dust and oil; the dedusting and deoiling process is used for cleaning the electroplating bath and the circuit board, wherein the specific method comprises the steps of removing dust in the electroplating bath and the through hole of the circuit board by using an acoustic wave technology and clear water, adding a deoiling agent and then adding deionized water for cleaning;
2) acid pickling and phosphorizing; adding an acid cleaner into the electroplating bath, and carrying out acid cleaning operation on the through hole of the circuit board to increase the activity of the through hole;
3) electroplating copper; pouring electroplating solution and brightener into the electroplating bath, simultaneously putting the circuit board into the electroplating bath to enable the electroplating solution to submerge the circuit board, putting metal copper into the electroplating bath to enable the circuit board to serve as an anode and the circuit board to serve as a cathode, and connecting the electroplating solution into a direct current power supply to electroplate the workpiece circuit board;
4) washing and drying; and after the copper electroplating process is finished, washing the circuit board workpiece with water and drying the circuit board workpiece.
Preferably, the circuit board is provided with dense through holes with different aperture ratios, electroplating solution is required to uniformly enter the through holes during copper electroplating, an end cover matched with the electroplating bath is arranged at the upper end of the electroplating bath in the step (1), a pressure pump is arranged above the end cover, a stirring rod is transversely arranged at the position, close to the bottom end, on the inner side of the electroplating bath, the pressure pump is used for enabling pressure difference between the through holes with different apertures to be optimal and the outside to be formed in the electroplating process, the electroplating bath in the step (1) is made of PVC, PP plastic or rubber steel-coated grooves, mechanical stirring, spray pipes or air-entrapping stirring is used during continuous stirring, no oil gas is contained in air, and meanwhile deionized water is used for circularly cleaning the electroplating bath until clear water in the electroplating bath is drained.
Preferably, the acid washing agent in the step (2) is potassium pyrophosphate, and the solubility of the acid washing agent is 300-380 g/L.
Preferably, the method for preparing the plating solution in the step (3) is: firstly, adding copper sulfate into a container, adding hot water to accelerate dissolution to form a copper sulfate solution, slowly adding a mixed solution of sulfuric acid and sulfamic acid and quantitative water and conductive salt while stirring after cooling, adding zinc powder and activated carbon for treatment after fully mixing, stirring, filtering, adding an additive, and uniformly stirring.
Preferably, the addition amount of the copper sulfate is 150-250 g/L, the addition amount of the sulfuric acid is 25-50 g/L, the addition amount of the sulfamic acid is 100-200 g/L, the conductive salt is sodium chloride and is 0.15-0.25 g/L, the addition amount of the zinc powder is 0.5g/L, the addition amount of the activated carbon is 1-2 g/L, and the addition amount of the clear water is 1L.
Preferably, the additive is a brightening agent, the brightening agent is selected from two of alkyl sulfonic acid mercaptan or derivatives thereof, and the brightening agent specifically adopts sodium polydithio-dipropyl sulfonate and N, N-dimethyl dithio-formamide propane sulfonate, wherein the addition amount of the sodium polydithio-dipropyl sulfonate is 0.2-12 g/L, and the addition amount of the N, N-dimethyl dithio-formamide propane sulfonate is 0.2-12 g/L.
Preferably, the specific parameters of the copper electroplating process are lA/dm 2-3A/dm 2 of the current density of the cathode, the electroplating temperature is 20-50 degrees, and the electroplating time is 30-50 min.
Preferably, the washing and drying operation in the step (4) is to repeatedly wash the electroplated circuit board workpiece with clean water at room temperature for 3-5 min, and simultaneously dry the circuit board workpiece by using a hair dryer or other heating equipment.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention has novel structure and simple and convenient operation, removes oil stains attached to the surface by using a degreaser before the copper electroplating operation, and cleans the surface of the circuit board workpiece by using an acoustic wave dust removal technology, thereby being beneficial to fully reacting the workpiece in the electroplating process;
2. the electroplating solution combining the sulfamic acid with a large dose and the sulfuric acid with a small dose is adopted, the safety coefficient of the sulfamic acid is higher than that of the sulfuric acid in the use process, and personnel are prevented from being corroded and injured due to improper operation;
3. the electroplating solution prepared by the invention ensures that the electroplated copper particles have brightness, fine crystallization, good ductility and excellent uniformity, and can directly adopt a direct current electroplating method;
4. the invention forms pressure difference inside and outside the through hole and simultaneously combines the stirring rod to enable the electroplating solution to flow rapidly, thereby realizing that the electroplating solution uniformly enters the through holes with different aperture ratios to complete copper plating operation and avoiding the hole copper fracture phenomenon in the welding process due to over-thin middle copper plating.
Drawings
FIG. 1 is a flow chart of the present invention;
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, dust and oil are removed; the specific method comprises the steps of removing dust in the electroplating bath and the through hole of the circuit board by using a sound wave technology and clear water, adding a deoiling agent, adding deionized water for cleaning, wherein the electroplating bath is made of PVC, PP plastic or rubber steel-coated tank, mechanical stirring is used during continuous stirring, a spray pipe or gas-filled stirring is used, no oil gas source is contained in air, the electroplating bath is circularly cleaned by the deionized water until clear water in the electroplating bath is discharged, the surface of a circuit board workpiece is deeply cleaned before the electroplating of copper, the circuit board workpiece is favorably and fully reacted with the electroplating solution during electroplating, the reactivity of the circuit board workpiece reaction is increased by an acid pickling and phosphorization operation procedure, the electroplating bath is made of PVC, the material is corrosion-resistant and high-temperature-resistant, is suitable for a reaction container of the electroplating, and the pickling agent is potassium pyrophosphate, the concentration is 300-380 g/L;
pouring electroplating solution and brightener into an electroplating bath, simultaneously putting a circuit board into the electroplating bath to enable the electroplating solution to submerge the circuit board, then putting metallic copper into the electroplating bath to enable the metallic copper to serve as an anode and the circuit board to serve as a cathode, and connecting the electroplating solution into a direct-current power supply to electroplate a workpiece circuit board, wherein the electroplating solution is prepared by adding hot clear water into the electroplating bath to dissolve the metallic copper, stirring the electroplating bath to enable the metallic copper to be dissolved at an accelerated speed, then stirring the sulfamic acid and the sulfuric acid added into the electroplating bath at the same time, adding conductive salt after all the sulfamic acid and the sulfuric acid are dissolved, in the embodiment, selecting sodium chloride as the conductive salt, adding zinc powder and activated carbon at;
pouring the prepared electroplating solution into an electroplating bath, putting metal copper to be used as an anode, putting a circuit board workpiece to be used as a cathode, and adding a brightening agent, wherein the brightening agent is sodium polydithio-dipropyl sulfonate and N, N-dimethyl-dithio-formamide propane sodium sulfonate in the embodiment, after all the preparation is finished, pressurizing the electroplating bath by a pressurizing pump to ensure that a certain pressure difference is formed between the inside of a through hole and the outside of the through hole, simultaneously slightly stirring the electroplating solution by a stirring rod to enable the electroplating solution to flow, uniformly entering the through holes with different apertures under the action of air pressure, finally introducing a direct current power supply to perform an electroplating reaction on the workpiece, taking the workpiece out to wait for flushing after the electroplating is finished, and pouring the residual electroplating solution wastewater and waste residues into a preset container;
repeatedly washing the electroplated copper workpiece with clear water at room temperature to remove electroplating solution residues on the surface, and drying the workpiece with a hair drier.
Example 1: the electroplating solution of the invention is prepared from the following components:
150g of copper sulfate, 25g of sulfuric acid, 100g of sulfamic acid, 0.15g of sodium chloride, 0.5g of zinc powder, 1g of activated carbon and 1L of clear water;
the material of the electroplating bath is PP plastic, wherein the concentration of a pickling agent potassium pyrophosphate is 300g/L, the concentration of a brightening agent is 0.2g, the electrifying electroplating time is 30min, the current density is 1A/dm2, and the electroplating temperature is set to be 20 degrees in the electroplating process;
after the electroplating is finished under the electroplating solution and conditions, the circuit board workpiece is cooled and the integral shape of the circuit board workpiece is observed, the copper plating layer is flat and bright, pockmarked and pocked slightly, the pit phenomenon occurs, the color of the electroplating layer is bright, the copper plating layer does not bubble or fall off, and the bonding strength of the copper layer and the matrix is qualified.
Example 2: the electroplating solution of the invention is prepared from the following components:
200g of copper sulfate, 25g of sulfuric acid, 120g of sulfamic acid, 0.20g of sodium chloride, 0.5g of zinc powder, 1.5g of activated carbon and 1L of clear water;
the material of the electroplating bath is PP plastic, wherein the concentration of a pickling agent potassium pyrophosphate is 300g/L, the concentration of a brightening agent is 2g, the electrifying electroplating time is 40min, the current density is 1A/dm2, and the electroplating temperature is set to be 30 degrees in the electroplating process;
after the electroplating is finished under the electroplating solution and conditions, the circuit board workpiece is cooled and the integral shape of the circuit board workpiece is observed, the copper plating layer is flat and bright, no pockmark and pockmark or pit phenomenon exists, the color of the electroplating layer is bright, and the copper plating layer does not bubble or fall off, so that the bonding strength of the copper layer and the matrix is qualified.
Example 3: the electroplating solution of the invention is prepared from the following components:
150g of copper sulfate, 25g of sulfuric acid, 150g of sulfamic acid, 0.15g of sodium chloride, 0.5g of zinc powder, 1g of activated carbon and 1L of clear water;
the material of the electroplating bath is PP plastic, wherein the concentration of a pickling agent potassium pyrophosphate is 300g/L, the concentration of a brightening agent is 5g, the electrifying electroplating time is 50min, the current density is 2A/dm2, and the electroplating temperature is set to be 35 degrees in the electroplating process;
after the electroplating is finished under the electroplating solution and conditions, the circuit board workpiece is cooled and the integral shape of the circuit board workpiece is observed, the copper plating layer is flat and bright, no pockmark and pockmark exist, the pit phenomenon exists, the color of the electroplating layer is bright, the copper plating layer is slightly bubbled but does not fall off, and the bonding strength of the copper layer and the matrix is qualified.
Example 4: the electroplating solution of the invention is prepared from the following components:
150g of copper sulfate, 25g of sulfuric acid, 200g of sulfamic acid, 0.15g of sodium chloride, 0.5g of zinc powder, 2g of activated carbon and 1L of clear water;
the material of the electroplating bath is PP plastic, wherein the concentration of a pickling agent potassium pyrophosphate is 300g/L, the concentration of a brightening agent is 10g, the electrifying electroplating time is 40min, the current density is 3A/dm2, and the electroplating temperature is set to be 40 degrees in the electroplating process;
after the electroplating is finished under the electroplating solution and conditions, the circuit board workpiece is cooled and the integral shape of the circuit board workpiece is observed, the copper plating layer is very flat and bright, no pockmark or pockmark exists, the electroplating layer is particularly bright in color, and the copper plating layer does not bubble or fall off, so that the bonding strength of the copper layer and the matrix is qualified.
Example 5: the electroplating solution of the invention is prepared from the following components:
150g of copper sulfate, 25g of sulfuric acid, 200g of sulfamic acid, 0.15g of sodium chloride, 0.5g of zinc powder, 2g of activated carbon and 1L of clear water;
the material of the electroplating bath is PP plastic, wherein the concentration of a pickling agent potassium pyrophosphate is 300g/L, the concentration of a brightening agent is 10g, the electrifying electroplating time is 35min, the current density is 2A/dm2, and the electroplating temperature is set to be 45 degrees in the electroplating process;
after the electroplating is finished under the electroplating solution and conditions, the circuit board workpiece is cooled and the integral shape of the circuit board workpiece is observed, the copper plating layer is very flat and bright, no pockmark or pockmark exists, the pit phenomenon exists, the color of the electroplating layer is particularly bright, the copper plating layer does not bubble or fall off, and the bonding strength of the copper layer and the matrix is qualified
The specific embodiment shows that the electroplating solution and the electroplating operation method provided by the invention are very suitable for the copper electroplating process for the through holes of the circuit board with the high density ratio, the addition amount of the brightener can be adjusted according to specific requirements, and the phenomenon that the copper plating layer bubbles and even falls off due to overlong electroplating time is avoided.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A copper plating process for electroplating a through hole of a circuit board with a high density ratio and a specific aperture is characterized by comprising the following steps:
1) removing dust and oil; the dedusting and deoiling process is used for cleaning the electroplating bath and the circuit board, wherein the specific method comprises the steps of removing dust in the electroplating bath and the through hole of the circuit board by using an acoustic wave technology and clear water, adding a deoiling agent and then adding deionized water for cleaning;
2) acid pickling and phosphorizing; adding an acid cleaner into the electroplating bath, and carrying out acid cleaning operation on the through hole of the circuit board to increase the activity of the through hole;
3) electroplating copper; pouring electroplating solution and brightener into the electroplating bath, simultaneously putting the circuit board into the electroplating bath to enable the electroplating solution to submerge the circuit board, putting metal copper into the electroplating bath to enable the circuit board to serve as an anode and the circuit board to serve as a cathode, and connecting the electroplating solution into a direct current power supply to electroplate the workpiece circuit board;
4) washing and drying; and after the copper electroplating process is finished, washing the circuit board workpiece with water and drying the circuit board workpiece.
2. The copper plating process for through hole electroplating of high density ratio aperture circuit board as claimed in claim 1, wherein the circuit board is provided with dense through holes with different aperture ratios, the electroplating solution is required to enter the through holes uniformly during the copper electroplating, the upper end of the electroplating bath in step (1) is provided with an end cover matched with the electroplating bath, a pressure pump is arranged above the end cover, meanwhile, a stirring rod is transversely arranged at the inner side of the electroplating bath near the bottom end, and the pressure pump is used for forming pressure difference between the through holes with different aperture ratios and the outside during the electroplating process.
3. The copper plating process for through hole electroplating of high density ratio aperture circuit board as claimed in claim 1, wherein the plating bath material in step (1) is made of PVC, PP plastic or rubber steel-clad tank, while continuous stirring is performed by using mechanical stirring, spray pipe or air-entrained stirring, the air contains no oil gas, and the plating bath is circularly cleaned by deionized water until the clean water in the plating bath is drained.
4. The copper plating process for through hole electroplating of the circuit board with the high density ratio and the aperture as claimed in claim 1, wherein the pickling agent in the step (2) is potassium pyrophosphate, and the solubility of the pickling agent is 300-380 g/L.
5. The copper plating process for through hole plating of high density ratio aperture circuit boards as claimed in claim 1, wherein the plating solution in step (3) is prepared by the following steps: firstly, adding copper sulfate into a container, adding hot water to accelerate dissolution to form a copper sulfate solution, slowly adding a mixed solution of sulfuric acid and sulfamic acid and quantitative water and conductive salt while stirring after cooling, adding zinc powder and activated carbon for treatment after fully mixing, stirring, filtering, adding an additive, and uniformly stirring.
6. The copper plating process for electroplating the through hole of the circuit board with the high density-to-aperture ratio as claimed in claim 4, wherein the addition amount of the copper sulfate is 150-250 g/L, the addition amount of the sulfuric acid is 25-50 g/L, the addition amount of the sulfamic acid is 100-200 g/L, the conductive salt is sodium chloride and the addition amount thereof is 0.15-0.25 g/L, the addition amount of the zinc powder is 0.5g/L, the addition amount of the activated carbon is 1-2 g/L, and the addition amount of the clear water is 1L.
7. The copper plating process for electroplating the through holes of the circuit board with the high density-to-aperture ratio as claimed in claim 4, wherein the additive is a brightening agent, the brightening agent is two selected from alkyl sulfonic acid thiol or derivatives thereof, the invention specifically adopts sodium polydithio-dipropyl sulfonate and sodium N, N-dimethyl dithioformamide propane sulfonate, wherein the addition amount of the sodium polydithio-dipropyl sulfonate is 0.2-12 g/L, and the addition amount of the sodium N, N-dimethyl dithioformamide propane sulfonate is 0.2-12 g/L.
8. The copper plating process for through hole electroplating of high density and aperture ratio circuit board as claimed in claim 1, wherein the specific parameters of the copper electroplating process are current density of lA/dm 2-3A/dm 2 of cathode, electroplating temperature is 20-50 ° and electroplating time is 30-50 min.
9. The copper plating process for electroplating the through holes of the circuit board with the high density-to-aperture ratio as claimed in claim 1, wherein the washing and drying operation in the step (4) is to repeatedly wash the electroplated circuit board workpiece with clean water at room temperature for 3-5 min, and simultaneously dry the circuit board workpiece with a hair dryer or other heating equipment.
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| CN202110085989.0A CN112921367A (en) | 2021-01-22 | 2021-01-22 | Copper plating process for electroplating through hole of circuit board with high density ratio and aperture |
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| CN202110085989.0A CN112921367A (en) | 2021-01-22 | 2021-01-22 | Copper plating process for electroplating through hole of circuit board with high density ratio and aperture |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114214682A (en) * | 2021-12-22 | 2022-03-22 | 东莞市金瑞五金股份有限公司 | Electroplating process for copper plating of workpiece and electroplating equipment thereof |
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