CN112916314A - Low-strain plate feeding device and method for thin plate elements - Google Patents
Low-strain plate feeding device and method for thin plate elements Download PDFInfo
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- CN112916314A CN112916314A CN202110083443.1A CN202110083443A CN112916314A CN 112916314 A CN112916314 A CN 112916314A CN 202110083443 A CN202110083443 A CN 202110083443A CN 112916314 A CN112916314 A CN 112916314A
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- guide rail
- glue
- back plate
- low
- outlet valve
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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Abstract
The invention provides a low-strain plate feeding device and a low-strain plate feeding method for thin plate elements. The low-strain tray loading device for the thin plate elements comprises a movable slide carriage, a glue outlet valve, a third motor, a fourth guide rail, a third guide rail, a second motor, a third guide rail and a second guide rail, wherein the movable slide carriage is arranged on a screw rod of the fourth guide rail, the glue outlet valve is arranged on the movable slide carriage, the third motor drives the screw rod to rotate so that the movable slide carriage can move in the Z direction along the fourth guide rail, the fourth guide rail is also arranged on a screw rod of the third guide rail, the second motor drives the screw rod to rotate so that the fourth guide rail can move in the Y. According to the invention, a semi-rigid system integrating the elements, the glue points and the back plate is constructed through multi-point flexible support, the polishing of the weak-rigid thin plate element is converted into the processing of the rigid element, the clamping deformation in the element processing process can be effectively inhibited, and the surface shape precision is improved while the processing efficiency is ensured.
Description
Technical Field
The invention relates to the technical field of optical processing, in particular to a low-strain disk loading device for a large-diameter thin plate element and a photomask substrate and a low-stress flexible disk loading method thereof.
Background
The quartz thin plate element is widely applied to the high-power laser device and semiconductor industry, and because the thin plate element has the problems of large size and high diameter-thickness ratio, the element has inherent instability in structure, large clamping stress and easy deformation during processing, and the processing precision and efficiency of the element can be greatly influenced by the processing deformation generated in the polishing process.
The single-side polishing is carried out by adopting the traditional single-shaft machine asphalt disk, and due to the problems of the precision of the bonding disk and the stress introduced by the disk feeding mode, the surface shapes of the elements before and after the upper disk and the lower disk change greatly, and the higher wave front precision is difficult to achieve; the problems of difficult surface shape control and low precision exist in double-sided polishing; compared with full-caliber polishing, the novel small-tool numerical control polishing and magnetorheological polishing technology has lower processing efficiency and poorer processing economy.
Disclosure of Invention
The invention aims to provide a low-strain plate loading device of a thin plate element and a method thereof.
The technical scheme adopted by the invention for solving the technical problem is as follows: the low-strain disc loading device of the thin plate element comprises a first guide rail and a second guide rail which are parallel to each other and arranged along the X direction, a third guide rail is arranged along the Y direction, a fourth guide rail is arranged along the Z direction, a moving slide carriage is arranged on a screw rod of the fourth guide rail, a glue outlet valve is arranged on the moving slide carriage, the screw rod is driven to rotate by a third motor so that the moving slide carriage moves up and down along the fourth guide rail in the vertical direction Z, meanwhile, the fourth guide rail is also arranged on the screw rod of the third guide rail, the screw rod is driven to rotate by a second motor so that the fourth guide rail moves along the third guide rail in the Y direction, the third guide rail is also arranged on the screw rod of the first guide rail and the second guide rail, the screw rod is driven to rotate by the first motor so that the third guide rail moves along the first guide rail and the second guide rail in the X direction, and the first guide rail and the second guide rail, the back plate is arranged on the platform.
Further, the glue outlet valve can move in three dimensions in the XYZ direction, and is used for opening and closing, size and form control of glue.
Furthermore, a positioning point is arranged on the platform and used for initializing and positioning the glue outlet valve.
Furthermore, through holes which are uniformly distributed and used for reducing weight and enhancing heat convection are formed in the back plate. The back plate adopts diamond fly cutting to ensure that the surface flatness is better than 3 mu m.
Method for low strain disc loading of a lamella element, the method comprising the steps of:
1) clamping and fixing the back plate on the platform, and returning the glue outlet valve to the positioning point;
2) the glue outlet valve moves in three dimensions in the XYZ direction according to a preset track, is driven by a third motor to approach the surface of the back plate after the glue outlet valve moves to a preset position, completes glue dispensing on the back plate, then is driven by the third motor to lift up, and continues to move to the next preset position for glue dispensing until all glue dispensing on the surface of the back plate is completed;
3) pasting a protective adhesive tape on the back surface of the element, then lightly placing the back surface of the element on the adhesive point of the back plate, and aligning the element and the back plate; placing the integral structure formed by the element, the glue dots and the back plate into a constant-temperature electric oven for annealing, and slowly cooling to room temperature after annealing is completed, so that the element is connected to the back plate through the uniformly distributed glue dots, and the low-strain disc loading of the element is completed;
4) the element, the glue point and the back plate are integrally placed on a plane polishing machine for processing, the temperature field state of the whole-flow processing of the element is kept consistent through precise temperature control of a polishing solution circulating system, and the surface shape distribution of the heated lower disc of the element is kept consistent with the upper disc state;
5) and after the element is processed, putting the whole element into an oven for heating, and taking down the element after the glue point is softened.
Further, the size of the diameter of the glue spot is controlled to be less than 3mm in the step 1) by adjusting the temperature of the glue outlet nozzle of the glue outlet valve (1) and the glue supply time. And 2) the number of the glue points on the back plate is the same as that of the through holes, the glue points are uniformly distributed on the surface of the back plate, and the pressure born by each glue point is less than the limit value of 8 Pa. The temperature of the annealing in the step 3) is according to the formula T ═ k × Tsoft+ σ is calculated, where TsoftK is the temperature coefficient constant 0.7787, and σ is the constant-9.14, for the softening temperature of the glue-supplying material. And 3) the polishing solution circulating system has a precise water cooling function, so that the temperature of element processing and detection is kept consistent, and the precision of temperature control is superior to 0.1 ℃.
The invention has the beneficial effects that: by a multi-point flexible supporting method, a three-in-one semi-rigid system of 'element-glue point-back plate' is constructed, polishing of a weak-rigid thin plate element can be converted into machining of a rigid element, clamping deformation in the element machining process can be effectively inhibited, the problem of low-strain clamping of the thin plate element is solved, full-caliber polishing precision of the thin plate element is greatly improved, large-batch high-precision machining of the thin plate element is facilitated, surface shape precision is improved while machining efficiency is guaranteed, and the method has great application value in machining of elements such as large-caliber thin plate elements and photomask substrates.
Drawings
Fig. 1 is a front view of the device of the present invention.
Fig. 2 is a perspective view of the device of the present invention.
Fig. 3 is a schematic diagram illustrating distribution of dispensing dots on a backplane according to an embodiment of the present invention.
FIG. 4 is an initial surface shape of the device before dispensing and hanging on the tray according to the embodiment of the present invention.
FIG. 5 is a diagram showing a surface shape of a dispensed upper tray of a device according to an embodiment of the present invention.
Fig. 6 is a top view of a disk after processing of a component according to an embodiment of the invention.
Fig. 7 is a machined disk underside of a component of an embodiment of the invention.
Detailed Description
As shown in fig. 1-2, the low strain pan dispensing apparatus for thin plate elements of the present invention comprises a glue outlet valve 1, a positioning point 2, a back plate 3, a first guide rail 4, a first motor 5, a second guide rail 6, a support 7, a third guide rail 8, a fourth guide rail 9, a second motor 10, a third motor 11, a platform 12 and a moving slide 13, wherein the first guide rail 4 and the second guide rail 6 are parallel to each other and arranged along an X direction, the third guide rail 8 is arranged along a Y direction, the fourth guide rail 9 is arranged along a Z direction, the moving slide 13 is arranged on a lead screw of the fourth guide rail 9, the glue outlet valve 1 is mounted on the moving slide 13, the third motor 11 drives a lead screw of the fourth guide rail 9 to rotate so as to enable the moving slide 13 to move up and down along a vertical direction Z of the fourth guide rail 9, and the fourth guide rail 9 is also arranged on a lead screw of the third guide rail 8, and the second motor 10 drives a lead screw of the third guide rail 8 to rotate so as to enable the fourth guide rail 9 to move up and down along The rail 8 moves in the Y direction, the third guide rail 8 is further arranged on the screw rod of the first guide rail 4 and the second guide rail 6, and the first motor 5 drives the screw rod of the first guide rail 4 to rotate, so that the third guide rail 8 moves in the X direction along the first guide rail 4 and the second guide rail 6, and therefore three-dimensional movement of the glue valve 1 in the XYZ direction is achieved, and the glue outlet form is controlled. The first guide rail 4 and the second guide rail 6 are arranged on the platform 12 by means of the abutment 7.
The glue outlet valve 1 is used for controlling the opening and closing, size and shape of glue. The platform 12 is provided with a positioning point 2 for initial positioning of the glue outlet valve 1, namely completing zero returning action of a workpiece coordinate system. Backplate 3 card is on platform 12, is provided with right angle limit mark on platform 12, and it has the through-hole of equipartition to open on backplate 3, and this through-hole is used for subtracting heavy and reinforcing heat convection. The back plate 3 is made of aluminum, and high flatness is achieved by adopting diamond fly-cutting.
When the device works, firstly, the back plate 3 is clamped and fixed on the platform 12, the glue outlet valve 1 returns to the position of the positioning point 2, and zero return of a workpiece coordinate system is realized; then the glue outlet valve 1 moves in three dimensions in the XYZ direction according to a preset track, the glue outlet valve 1 adopts an intermittent glue supply mode, after the glue outlet valve 1 moves to a preset position, the glue outlet valve 1 is driven by a third motor 11 to approach the surface of the back plate 3 and complete glue dispensing on the back plate 3, then the glue outlet valve is driven by the third motor 11 to lift up, and the glue outlet valve continues to move to the next preset position for glue dispensing until all glue dispensing on the surface of the back plate 3 is completed; in order to protect the surface of the element and facilitate the neatness of the element after being placed, a protective adhesive tape is pasted on the back surface of the element, then the back surface of the element is lightly placed on the adhesive point of the back plate 3, and the element and the back plate 3 are aligned; finally, the integral structure formed by the element, the glue points and the back plate is placed into a constant-temperature electric oven for annealing, and the annealing temperature is determined according to an empirical formula T ═ k T-soft+ σ is calculated, where TsoftK is a temperature coefficient constant 0.7787, and sigma is a constant of-9.14; and after the integral annealing is finished, slowly cooling to room temperature and processing the element.
In order to improve the stress uniformity of the elements after being loaded on the disc, the number of the glue dots on the back plate 3 is the same as that of the through holes, and the glue dots are uniformly distributed on the surface of the back plate 3. In order to reduce the strain to the maximum extent, the glue dot distribution should adopt the principle of minimum area ratio, namely: the contact surface of the glue point and the element is small, and the size of the glue point is small. The size of the diameter of the glue spot is controlled below 3mm by adjusting the temperature of the glue nozzle of the glue outlet valve 1 and the glue supply time. The quantity of the glue points is small, surface shape control during processing is facilitated, but the pressure born by each glue point cannot be larger than the limit value of 8Pa, otherwise serious deformation can occur in the annealing process, and therefore the quantity of the glue points needs to be calculated optimally according to the weight and the size of the element.
In the processing process, the processing environment needs to be controlled at constant temperature, and the polishing solution circulating system has a precise water cooling function, so that the processing and detection temperatures of elements are kept consistent, the stress of glue spots is reduced to the maximum extent, and the surface shape of the elements is kept. After the element is processed, the whole element can be placed into an oven to be heated, the glue point is softened, and the element is taken down.
Example (b):
the element size of the embodiment is 152mm × 152mm × 6.35mm, the diameter-thickness ratio reaches 33, and large processing deformation is generated during normal processing, which greatly affects the processing efficiency and the processing precision of the element. And the numerical control and magnetorheological polishing of small tools have low direct polishing efficiency or need high entrance precision. Therefore, the low-strain flexible disk feeding method is adopted, firstly a metal aluminum plate with the thickness of 152mm multiplied by 25mm is prepared, and two large-surface diamond fly-cutting or precision grinding methods are used for processing, so that the surface flatness is better than 3 mu m; then, the low-strain upper disc glue dispensing device is utilized to heat the solid glue and uniformly dispense the glue on the aluminum back plate, as shown in figure 3, the diameter of the glue dispensing is about 3mm, and the sizes of all the glue dispensing are kept consistent. A layer of tape is applied to the back (non-process) of the component and the back of the component is brought into contact with the tape, in which process it is ensured that the component is flush with the back. And then the element and the back plate are integrally placed in a constant-temperature oven for annealing, the annealing temperature is set according to the empirical formula, and the annealing time is 60 min. And after the annealing is finished, slowly cooling to room temperature at a cooling rate of not more than 0.5 ℃/h, so that the element is connected to the back surface through uniformly distributed glue dots, and the low-strain disc feeding of the element is finished. After the element is hung on the disk, the element is tightly connected with the back surface, the whole body has higher mechanical strength, the reflective surface shape PV of the element in front of the hanging disk is 1.06 lambda (lambda is 632.8nm), as shown in figure 4, the surface shape PV value of the element in back of the low-strain hanging disk is 1.05 lambda, as shown in figure 5, and the surface shape distribution of the element is kept consistent. Then, the 'element-glue point-back plate' is integrally placed on a plane polishing machine for processing, the temperature control precision is superior to 0.1 ℃ through the precise temperature control of a polishing solution circulating system, so that the temperature field states of the element in the whole-flow processing are kept consistent, and the processing result of the element in the full-caliber polishing stage is 0.29 lambda. The surface shape distribution of the heated lower disc of the element is consistent with the on-disc state, the PV value of the surface shape of the heated lower disc of the element is 0.26 lambda, and the surface shape value is changed within 10 percent, as shown in figures 6-7, the requirement of full-caliber batch high-precision processing of the element can be met.
Claims (10)
1. Low strain disc mounting device for thin plate elements, characterized in that: the first guide rail (4) and the second guide rail (6) are parallel to each other and arranged along the X direction, the third guide rail (8) is arranged along the Y direction, the fourth guide rail (9) is arranged along the Z direction, the movable slide carriage (13) is arranged on a screw rod of the fourth guide rail (9), the glue outlet valve (1) is installed on the movable slide carriage (13), the screw rod is driven to rotate through a third motor (11) so that the movable slide carriage (13) can move up and down along the Z direction along the fourth guide rail (9), the fourth guide rail (9) is arranged on the screw rod of the third guide rail (8), the second motor (10) drives the screw rod to rotate so that the fourth guide rail (9) can move along the Y direction along the third guide rail (8), the third guide rail (8) is arranged on the screw rod of the first guide rail (4) and the second guide rail (6), and the first motor (5) drives the screw rod to rotate so that the third guide rail (8) can move along the X direction along the first guide rail (4) and the second guide rail (6) And the first guide rail (4) and the second guide rail (6) are arranged on the platform (12) through the support (7), and the back plate (3) is arranged on the platform (12).
2. The low-strain disc set of sheet members of claim 1, wherein: the glue outlet valve (1) can move in three dimensions in the XYZ direction, and the glue outlet valve (1) is used for controlling the opening and closing, the size and the shape of glue.
3. The low-strain disc set of sheet members of claim 1, wherein: the platform (12) is provided with a positioning point (2) for initial positioning of the glue outlet valve (1).
4. The low-strain disc set of sheet members of claim 1, wherein: through holes which are uniformly distributed and used for reducing weight and enhancing heat convection are formed in the back plate (3).
5. The low-strain disc set of sheet members of claim 1, wherein: the back plate (3) adopts diamond fly cutting to ensure that the surface flatness is better than 3 mu m.
6. Method for low strain disc loading of a lamella element, characterized in that the method comprises the steps of:
1) clamping and fixing the back plate (3) on the platform (12), and returning the glue outlet valve (1) to the position of the positioning point (2);
2) the glue outlet valve (1) moves in three dimensions in the XYZ direction according to a preset track, when the glue outlet valve (1) moves to a preset position, the glue outlet valve (1) is driven by a third motor (11) to be close to the surface of the back plate (3) and finish glue dispensing on the back plate (3), then the glue outlet valve is driven by the third motor (11) to rise, and the glue outlet valve continues to move to the next preset position for glue dispensing until all glue dispensing on the surface of the back plate (3) is finished;
3) pasting a protective adhesive tape on the back surface of the element, then lightly placing the back surface of the element on the adhesive point of the back plate (3), and aligning the element and the back plate (3); placing the integral structure formed by the element, the glue dots and the back plate into a constant-temperature electric oven for annealing, and slowly cooling to room temperature after annealing is completed, so that the element is connected to the back plate through the uniformly distributed glue dots, and the low-strain disc loading of the element is completed;
4) the element, the glue point and the back plate are integrally placed on a plane polishing machine for processing, the temperature field state of the whole-flow processing of the element is kept consistent through precise temperature control of a polishing solution circulating system, and the surface shape distribution of the heated lower disc of the element is kept consistent with the upper disc state;
5) and after the element is processed, putting the whole element into an oven for heating, and taking down the element after the glue point is softened.
7. Method for low-strain hanging of thin plate elements according to claim 1, characterized in that step 1) controls the size of the glue spot diameter to be below 3mm by adjusting the temperature of the glue nozzle of the glue outlet valve (1) and the glue supply time.
8. Method for low-strain disc loading of thin-plate elements according to claim 1, characterised in that step 2) the number of glue sites on the back plate (3) is the same as the number of through holes and are evenly distributed on the surface of the back plate (3), each glue site being subjected to a pressure below the limit value of 8 Pa.
9. Method for low-strain coiling of a sheet element according to claim 1, characterised in that the annealing temperature in step 3) is according to the formula T ═ k × Tsoft+ σ is calculated, where TsoftK is the temperature coefficient constant 0.7787, and σ is the constant-9.14, for the softening temperature of the glue-supplying material.
10. The method for low-strain disc loading of thin plate elements as claimed in claim 1, wherein the polishing liquid circulating system in step 3) has a precise water cooling function, so that the temperature for processing and detecting elements is kept consistent, and the temperature control precision is better than 0.1 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110083443.1A CN112916314B (en) | 2021-01-21 | 2021-01-21 | Low-strain disc loading device of thin plate element and method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110083443.1A CN112916314B (en) | 2021-01-21 | 2021-01-21 | Low-strain disc loading device of thin plate element and method thereof |
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| Publication Number | Publication Date |
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| CN112916314A true CN112916314A (en) | 2021-06-08 |
| CN112916314B CN112916314B (en) | 2022-05-10 |
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| TW558752B (en) * | 2001-07-25 | 2003-10-21 | Hitachi Int Electric Inc | Substrate processing apparatus and method for manufacturing semiconductor device |
| KR20100019190A (en) * | 2008-08-08 | 2010-02-18 | 주식회사 탑 엔지니어링 | Dispenser with device reducing stress of gantry |
| CN105537062A (en) * | 2015-12-07 | 2016-05-04 | 上海现代先进超精密制造中心有限公司 | Adjustable glue pot type precise glue point blocking method |
| CN107597504A (en) * | 2017-10-27 | 2018-01-19 | 中国科学院上海光学精密机械研究所 | Optical element original position automatic dispensing device and dispensing method |
| CN108097541A (en) * | 2018-02-12 | 2018-06-01 | 业成科技（成都）有限公司 | Point glue equipment and dispensing method |
| CN207887470U (en) * | 2018-01-29 | 2018-09-21 | 北京京东方显示技术有限公司 | A kind of automatic double surface gluer |
| CN210527819U (en) * | 2019-05-31 | 2020-05-15 | 惠州市德立电子有限公司 | High accuracy point gum machine feed mechanism |
| CN111156235A (en) * | 2020-02-17 | 2020-05-15 | 中国工程物理研究院激光聚变研究中心 | Device and method for dispensing and mounting ultrathin optical element on spot gluing machine in weak deformation mode |
-
2021
- 2021-01-21 CN CN202110083443.1A patent/CN112916314B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW558752B (en) * | 2001-07-25 | 2003-10-21 | Hitachi Int Electric Inc | Substrate processing apparatus and method for manufacturing semiconductor device |
| KR20100019190A (en) * | 2008-08-08 | 2010-02-18 | 주식회사 탑 엔지니어링 | Dispenser with device reducing stress of gantry |
| CN105537062A (en) * | 2015-12-07 | 2016-05-04 | 上海现代先进超精密制造中心有限公司 | Adjustable glue pot type precise glue point blocking method |
| CN107597504A (en) * | 2017-10-27 | 2018-01-19 | 中国科学院上海光学精密机械研究所 | Optical element original position automatic dispensing device and dispensing method |
| CN207887470U (en) * | 2018-01-29 | 2018-09-21 | 北京京东方显示技术有限公司 | A kind of automatic double surface gluer |
| CN108097541A (en) * | 2018-02-12 | 2018-06-01 | 业成科技（成都）有限公司 | Point glue equipment and dispensing method |
| CN210527819U (en) * | 2019-05-31 | 2020-05-15 | 惠州市德立电子有限公司 | High accuracy point gum machine feed mechanism |
| CN111156235A (en) * | 2020-02-17 | 2020-05-15 | 中国工程物理研究院激光聚变研究中心 | Device and method for dispensing and mounting ultrathin optical element on spot gluing machine in weak deformation mode |
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