CN112911796B

CN112911796B - Printed circuit board assembly

Info

Publication number: CN112911796B
Application number: CN201911136670.5A
Authority: CN
Inventors: 李金城
Original assignee: Inventec Pudong Technology Corp; Inventec Corp
Current assignee: Inventec Pudong Technology Corp; Inventec Corp
Priority date: 2019-11-19
Filing date: 2019-11-19
Publication date: 2022-07-05
Anticipated expiration: 2039-11-19
Also published as: CN112911796A

Abstract

The invention provides a printed circuit board assembly, which comprises a printed circuit board and an electronic element. The printed circuit board is provided with a first round hole, a second round hole and a virtual circle. The center of the first round hole and the center of the second round hole are both positioned on the circumference of the virtual circle. The electronic element is arranged on the printed circuit board. The electronic component includes a cylinder and a post. The cylinder is inserted into the first circular hole. The convex column is inserted into the second round hole. The projection area of the convex column on the printed circuit board is smaller than the area of the second round hole. The total distance between the two opposite sides of the convex column in the tangential direction of the virtual circle and the inner wall surface of the second round hole is larger than the total distance between the two opposite sides of the convex column in the radial direction of the virtual circle and the inner wall surface of the second round hole.

Description

Printed circuit board assembly

Technical Field

The present invention relates to a printed circuit board assembly, and more particularly, to a printed circuit board assembly having an adjustable mounting angle for electronic components mounted on the printed circuit board.

Background

Printed circuit boards and electronic components mounted thereon are widely used components in various electronic products. Therefore, printed circuit boards and electronic components are often produced in large quantities by a production line for good production efficiency.

However, mass-produced printed circuit boards and electronic components are limited by the precision of the manufacturing tool, and even if the printed circuit boards or electronic components are produced in the same batch, the printed circuit boards and electronic components still have tolerance therebetween. Therefore, in some electronic components requiring a high precision in assembly angle, how to minimize the assembly tolerance while mounting the same batch of electronic components on the printed circuit board is a problem to be solved in the art.

Disclosure of Invention

The present invention provides a printed circuit board assembly, which can adjust the installation angle of the electronic component installed on the printed circuit board relative to the printed circuit board without affecting the configuration of the components on the printed circuit board.

The printed circuit board assembly disclosed by the embodiment of the invention comprises a printed circuit board and an electronic element. The printed circuit board is provided with a first round hole, a second round hole and a virtual circle. The center of the first round hole and the center of the second round hole are both positioned on the circumference of the virtual circle. The electronic element is arranged on the printed circuit board. The electronic component includes a cylinder and a post. The cylinder is inserted into the first circular hole. The convex column is inserted into the second round hole. The projection area of the convex column on the printed circuit board is smaller than the area of the second round hole. The total distance between the two opposite sides of the convex column in the tangential direction of the virtual circle and the inner wall surface of the second round hole is larger than the total distance between the two opposite sides of the convex column in the radial direction of the virtual circle and the inner wall surface of the second round hole.

According to the printed circuit board assembly disclosed by the embodiment, by virtue of the appearance design of the convex columns, the installation angle of the electronic element relative to the printed circuit board can be adjusted by taking the cylinders as the rotation centers on the premise that the printed circuit board is not provided with too wide holes. Therefore, the electronic element can be adjusted to a proper position to exert expected effects; in addition, the gap between the convex column and the inner wall surface of the second round hole is not too large, so that other elements on the printed circuit board can be tightly arranged with the electronic elements, and the using area of the printed circuit board is saved.

The above description of the present disclosure and the following description of the embodiments are provided to illustrate and explain the principles of the present disclosure and to provide further explanation of the invention as claimed in the claims.

Drawings

Fig. 1 is a perspective view of a printed circuit board assembly according to an embodiment of the present invention.

Fig. 2 is an exploded schematic view of the printed circuit board assembly of fig. 1.

Fig. 3 is a top view of the printed circuit board assembly of fig. 1.

Fig. 4 is a partially enlarged view of a stud of the printed circuit board of fig. 3.

Wherein, the reference numbers:

10 printed circuit board assembly

100 printed circuit board

110 first circular hole

111 center of a circle

120 second round hole

121 center of circle

130 virtual circle

131 center of circle

200 electronic component

210 cylinder

220 convex column

D1 first direction

D2 second direction

Angle A

Direction of T tangent

R radial direction

Distances L1, L2, L3, L4

Detailed Description

An embodiment of the present invention will be described with reference to fig. 1 to 4. Fig. 1 is a perspective view of a printed circuit board assembly 10 according to an embodiment of the present invention. Fig. 2 is an exploded schematic view of the printed circuit board assembly 10 of fig. 1. Fig. 3 is a top view of the printed circuit board assembly 10 of fig. 1. Fig. 4 is a partially enlarged view of the boss 220 of the printed circuit board assembly 10 of fig. 3.

The printed circuit board assembly 10 of the present embodiment includes a printed circuit board 100 and an electronic component 200. The electronic component 200 is a component that is mounted on the printed circuit board 100 and that needs to be precisely mounted on the printed circuit board 100, and particularly the mounting angle of the electronic component 200 with respect to the printed circuit board 100 is critical to whether the electronic component 200 can exhibit the intended effect. How to adjust the mounting angle of the electronic component 200 with respect to the printed circuit board 100 will be described below.

The printed circuit board 100 has a first circular hole 110, a second circular hole 120 and a virtual circle 130. The first circular aperture 110 is, for example, 0.1 inches in diameter. The diameter of the second circular aperture 120 is, for example, 0.07 inches. The virtual circle 130 is an imaginary circle that is located on the printed circuit board 100 and has a diameter of, for example, 1.2 inches, and does not actually exist. As shown in fig. 1, the center 111 of the first circular hole 110 and the center 121 of the second circular hole 120 are both located on the circumference of the virtual circle 130. In addition, in consideration of the size and the mounting position of the electronic component 200, an included angle a between a first direction D1 from the center 111 of the first circular hole 110 to the center 131 of the virtual circle 130 and a second direction D2 from the center 121 of the second circular hole 120 to the center 131 of the virtual circle 130 is, for example, 60 degrees.

The electronic component 200 includes a cylinder 210 and a post 220. The cylinder 210 is inserted into the first circular hole 110, thereby completing the mounting of the electronic component 200 on the printed circuit board 100. The convex column 220 is inserted into the second circular hole 120, and the convex column 220 can move in the second circular hole 120 with the cylinder 210 as a rotation center; specifically, the projection area of the protruding pillar 220 on the printed circuit board 100 is smaller than the cross-sectional area of the second circular hole 120. Thereby, as shown in fig. 4, the stud 220 can be disposed in the second circular hole 120 without physically contacting with an inner wall surface of the second circular hole 120, for example, and the stud 220 can move in both sides in a rotation direction with the cylinder 210 as a rotation center to adjust a mounting angle of the electronic component 200 with respect to the printed circuit board 100.

In addition, the total distance between the two opposite sides of the convex pillar 220 in the tangential direction T of the virtual circle 130 and the inner wall surface of the second circular hole 120 (as shown in fig. 4, the distance L1 plus the distance L2) is greater than the total distance between the two opposite sides of the convex pillar 220 in the radial direction R of the virtual circle 130 and the inner wall surface of the second circular hole 120 (as shown in fig. 4, the distance L3 plus the distance L4); specifically, in the present embodiment and some embodiments of the present invention, the convex pillar 220 is an elliptic cylinder, that is, the cross section of the convex pillar 220 is an elliptic shape. Accordingly, the convex column 220 can move a large distance on both sides in the rotation direction with the cylinder 210 as the rotation center. It should be noted that the shape of the protruding pillar 220 is not intended to limit the present invention. In some embodiments, the projection pattern of the convex column on the printed circuit board is an oval, that is, the convex column is a cylindrical body with an oval cross-sectional area.

In the present embodiment, by the above design of the protruding pillar 220, the mounting angle of the electronic component 200 relative to the printed circuit board 100 can be adjusted by using the cylinder 210 as the rotation center of the electronic component 200 on the premise that the printed circuit board 100 is not provided with an excessively wide hole. Therefore, the electronic component 200 can be adjusted to a suitable position to exert a desired effect; moreover, the gap between the protruding pillar 220 and the inner wall of the second circular hole 120 is not too large, so that other components (not shown) on the printed circuit board 100 can be closely arranged with the electronic component 200, thereby saving the use area of the printed circuit board 100.

In this embodiment and some embodiments of the present invention, the cross-sectional area of the first circular hole 110 is larger than the cross-sectional area of the second circular hole 120. Since the electronic component 200 is disposed on the printed circuit board 100 by inserting the cylinder 210 into the first circular hole 110, the cylinder 210 and the first circular hole 110 are not designed to be too small, so as to ensure sufficient structural strength for mounting the electronic component 200 on the printed circuit board 100. In addition, the convex pillar 220 is inserted into the second circular hole 120 for adjusting the mounting position of the electronic component 200, so the convex pillar 220 and the second circular hole 120 should not be designed to be too large, thereby ensuring that the printed circuit board 100 has a sufficient mounting area for mounting other components.

In this embodiment and some embodiments of the present invention, the protruding height of the cylinder 210 is less than or equal to the thickness of the printed circuit board 100, and the protruding height of the convex pillar 220 is less than or equal to the thickness of the printed circuit board 100. Therefore, the surface of the printed circuit board 100 without the electronic component 200 can be kept flat, which is beneficial to the subsequent soldering process.

According to the printed circuit board assembly of the embodiment, by means of the shape design of the convex columns, the installation angle of the electronic element relative to the printed circuit board can be adjusted by taking the cylinder as the rotation center on the premise that the printed circuit board is not provided with an excessively wide hole. Therefore, the electronic element can be adjusted to a proper position to exert expected effects; in addition, the gap between the convex column and the inner wall surface of the second round hole is not too large, so that other elements on the printed circuit board can be tightly arranged with the electronic elements, and the using area of the printed circuit board is saved.

Claims

1. A printed circuit board assembly, comprising:

the printed circuit board is provided with a first round hole, a second round hole and a virtual circle, wherein the circle center of the first round hole and the circle center of the second round hole are both positioned on the circumference of the virtual circle; and

an electronic component disposed on the printed circuit board, wherein the electronic component comprises a cylinder and a protruding column, the cylinder is inserted into the first circular hole, and the protruding column is inserted into the second circular hole;

the projection area of the convex column on the printed circuit board is smaller than the area of the second round hole, the total distance between the two opposite sides of the convex column in the tangential direction of the virtual circle and the inner wall surface of the second round hole is larger than the total distance between the two opposite sides of the convex column in the radial direction of the virtual circle and the inner wall surface of the second round hole, and the convex column can move in the second round hole by taking the cylinder as a rotation center.

2. The printed circuit board assembly of claim 1, wherein the first circular hole has an area greater than an area of the second circular hole.

3. The printed circuit board assembly of claim 1, wherein the post is an elliptical post.

4. The printed circuit board assembly of claim 1, wherein the projection pattern of the posts on the printed circuit board is oblong.

5. The printed circuit board assembly of claim 1, wherein the height of the cylinder is less than or equal to the thickness of the printed circuit board.

6. The printed circuit board assembly of claim 1, wherein the height of the post is less than or equal to the thickness of the printed circuit board.

7. The printed circuit board assembly of claim 1, wherein the diameter of the virtual circle is 1.2 inches.

8. The printed circuit board assembly of claim 1, wherein the first circular hole has a diameter of 0.1 inches.

9. The printed circuit board assembly of claim 1, wherein the second circular hole has a diameter of 0.07 inches.

10. The printed circuit board assembly of claim 1, wherein a first direction from the center of the first circular hole to the center of the virtual circle and a second direction from the center of the second circular hole to the center of the virtual circle form an angle of 60 degrees.