CN112909207B - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN112909207B CN112909207B CN202110227396.3A CN202110227396A CN112909207B CN 112909207 B CN112909207 B CN 112909207B CN 202110227396 A CN202110227396 A CN 202110227396A CN 112909207 B CN112909207 B CN 112909207B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a display panel and a preparation method thereof, wherein the display panel comprises a substrate, the substrate comprises a display area, an opening and a peripheral isolation area, and the display panel also comprises: the bulge is arranged on one side of the substrate and is positioned in an adjacent area between the display area and the peripheral isolation area; the packaging layer covers the display area, the peripheral isolation area and the surface of one side of the bulge away from the substrate of the substrate, and the bulge and the packaging layer covering the bulge form an isolation structure; filling an optical adhesive layer in the peripheral isolation region enclosed by the isolation structure; the first protective layer covers the surface of one side, far away from the packaging layer, of the optical adhesive layer; the edge of the first protection layer protrudes out of the edge of the optical adhesive layer of the inverted trapezoidal structure so as to completely cover the optical adhesive.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.
Background
Among the existing display technologies, an Organic Light-Emitting Diode (OLED) display has many excellent characteristics such as being Light and thin, Emitting Light actively, having a fast response speed, a large viewing angle, a wide color gamut, high brightness, low power consumption, and being capable of manufacturing a flexible screen, and has attracted great interest in the scientific research and industrial fields, and has gradually become a third generation display technology following a Liquid Crystal Display (LCD).
With the increasing requirements of users on screen ratio, the design of a 'full screen' becomes the mainstream of the display industry. The under-screen camera shooting technology is widely used in smart phones, wearable displays and portable tablet computers as one of the schemes for realizing 'full screen'. At present, an O-shaped cutting (O-Cut) screen design is generally adopted in an under-screen camera shooting technology, namely an O-shaped groove is Cut in a display screen (Panel) and used for placing a camera.
However, after the organic thin film packaging process, the O-Cut designed display screen, particularly the O-Cut designed OLED display screen, needs to fill the light-transmitting adhesive layer to the portion of the OLED display screen body corresponding to the O-Cut region, so that the OLED display screen can continue the on-cell process after being flush with other regions of the OLED display screen. Because the corrosion resistance of the light-transmitting adhesive layer is low, after chemical agents (etching solution, stripping solution and the like) adopted in the subsequent on cell manufacturing process contact the light-transmitting adhesive layer, the light-transmitting adhesive layer is corroded to be stripped in an O-Cut area, the stability of the subsequent on cell manufacturing process is influenced, and the reliability of the OLED display screen is further influenced.
Disclosure of Invention
The invention aims to provide a display panel and a preparation method thereof, and aims to solve the problems that in the existing full-screen technology, a light-transmitting adhesive layer filled in a preset cutting area is low in tolerance to a subsequent on-cell process and is easy to corrode.
In order to achieve one of the above objects, an embodiment of the present invention provides a display panel, the display panel includes a substrate, the substrate includes a display region, an opening, and a peripheral isolation region, the peripheral isolation region is adjacent to the opening, the display region is adjacent to the peripheral isolation region, and the display panel further includes: the bulge is arranged on one side of the substrate and is positioned in an adjacent area between the display area and the peripheral isolation area; the packaging layer covers the display area and the peripheral isolation area of the substrate and the surface of one side, away from the substrate, of the bulge, and the bulge and the packaging layer covering the bulge form an isolation structure; the optical adhesive layer is filled in the peripheral isolation region enclosed by the isolation structure; the first protective layer covers the surface of one side, far away from the packaging layer, of the optical adhesive layer; the edge of the first protective layer protrudes out of the edge of the optical adhesive layer so as to completely cover the optical adhesive layer; the edge of the first protection layer protrudes out of the edge of the optical adhesive layer of the inverted trapezoidal structure so as to completely cover the optical adhesive layer.
As an optional technical solution, the material of the first protection layer is at least one selected from a metal, a composite metal, a metal oxide, or an organic polymer.
As an optional technical solution, the optical film further includes a second protective layer, and the second protective layer is disposed between the optical adhesive layer and the first protective layer; the edge of the second protective layer protrudes out of the edge of the optical adhesive layer so as to completely cover the optical adhesive layer; the material of the second protective layer is at least one selected from silicon oxide, silicon oxynitride and silicon nitride.
As an optional technical solution, a surface of the optical adhesive layer on a side away from the substrate is flush with or protrudes from a surface of the encapsulation layer on a side away from the substrate.
As an optional technical solution, a plurality of grooves are disposed on the substrate, and the plurality of grooves are located in the peripheral isolation region, and the plurality of grooves partition the encapsulation layer in the peripheral isolation region.
As an optional technical solution, the first protection layer further includes a hollow pattern, the hollow pattern is a plurality of openings formed by removing a part of the first protection layer, and the openings are opposite to the grooves.
As an optional technical solution, the display device further includes a touch electrode layer disposed on a surface of the package layer on a side away from the substrate, and the touch electrode layer is located in the display region and the peripheral isolation region.
The invention also provides a preparation method of the display panel, which comprises the following steps:
s1, providing a substrate, and forming a protrusion on one side surface of the substrate, wherein the protrusion is located in an abutting region between a display region of the substrate and a peripheral isolation region of the substrate;
s2, forming an encapsulation layer on the display area, the peripheral isolation area, the preset cutting area of the display panel and the surface of the protrusion far away from the substrate, wherein the protrusion and the encapsulation layer covering the protrusion form an isolation structure;
s3, coating optical cement to the surface of one side, far away from the substrate, of the packaging layer, so that the peripheral isolation region and the preset cutting region surrounded by the isolation structure are filled with the optical cement;
s4, curing and removing the optical adhesive in the display area to obtain the optical adhesive layer filled in the peripheral isolation area and the preset cutting area; and
s5, forming a first protective layer on the surface of the optical adhesive layer far away from the packaging layer;
the edge of the first protection layer protrudes out of the edge of the optical adhesive layer of the inverted trapezoidal structure so as to completely cover the optical adhesive layer.
As an optional technical solution, the material of the first protection layer is at least one selected from a metal, a composite metal, a metal oxide, or an organic polymer.
As an optional technical solution, before forming the first protective layer in S5, the method further includes:
forming a second protective layer on the surface of one side of the optical adhesive layer, which is far away from the packaging layer, wherein the edge of the second protective layer protrudes out of the edge of the optical adhesive layer so as to completely cover the optical adhesive layer;
the material of the second protective layer is at least one selected from silicon oxide, silicon oxynitride and silicon nitride.
As an optional technical solution, the method further comprises: and S6, cutting the preset cutting area to form holes penetrating through the upper surface and the lower surface of the display panel.
Compared with the prior art, the display panel and the preparation method thereof provided by the invention have the advantages that the corrosion-resistant first protective layer is covered on the optical adhesive layer of the inverted trapezoidal structure filled in the peripheral isolation region enclosed by the isolation structure, so that the first protective layer can prevent the optical adhesive layer in the prior full-face screen technology from being easily corroded by chemical agents such as etching solution, stripping solution and the like in the subsequent on-cell processing procedure, the problem of stripping from the packaging layer caused by corrosion of the chemical agents is solved, and the reliability of the display panel is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic diagram of a display panel according to an embodiment of the invention.
Fig. 2 is a partial cross-sectional view of the display panel of fig. 1.
Fig. 3 to 8 are schematic views illustrating a process of manufacturing the display panel shown in fig. 2.
Fig. 9 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
The present invention will be described in detail below with reference to specific embodiments shown in the accompanying drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.
It should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
As shown in fig. 1 to 2, a display panel 100 provided by the present invention includes a substrate 10, the substrate 10 includes a display region 11 and a peripheral isolation region 12, the peripheral isolation region 12 is adjacent to the display region 11; the display panel 100 further includes: a protrusion 30, wherein the protrusion 30 is disposed on one side of the substrate 10, and the protrusion is located in the adjacent region 14 between the display region 11 and the peripheral isolation region 12; the packaging layer 40, the packaging layer 40 covers the display area 11, the peripheral isolation area 12 and the surface of the side of the protrusion 30 far away from the substrate 10 of the substrate 10, and the protrusion 30 and the packaging layer 40 covering the protrusion 30 form an isolation structure 90; the optical adhesive layer 50 is filled in the peripheral isolation region 12 surrounded by the isolation structure 90; the first protective layer covers the surface of one side, far away from the packaging layer 40, of the optical adhesive layer; the edge of the first protection layer protrudes from the edge of the optical adhesive layer 50 with the inverted trapezoid structure to completely cover the optical adhesive layer 50.
In a preferred embodiment, the edge of the first protection layer protrudes beyond the edge of the optical adhesive layer 50 with the inverted trapezoid structure to completely cover the optical adhesive layer 50, which means that the edge of the first protection layer closely fits the edge of the optical adhesive layer 50 with the inverted trapezoid structure without any gap or cavity.
In a preferred embodiment, the material of the first protection layer is at least one selected from a metal, a composite metal, a metal oxide, or an organic polymer.
In a preferred embodiment, the first protection layer is, for example, a molybdenum metal film, a Ti/Al/Ti metal film, an aluminum oxide film, a polyimide polymer film, or the like.
In a preferred embodiment, the first passivation layer is formed on the surface of the optical adhesive layer 50 away from the encapsulation layer 40 by, for example, chemical vapor deposition, sputtering, or the like.
Preferably, the surface of the optical adhesive layer 50 away from the encapsulation layer 40 is covered with a first protection layer formed by at least one of metal, composite metal, metal oxide, or organic polymer, and the edge of the first protection layer protrudes beyond the edge of the optical adhesive layer 50 so as to completely cover the optical adhesive layer 50, so that the optical adhesive layer 50 is prevented from being corroded by chemical agents such as etching solution and stripping solution in a subsequent on-cell process, the problem of stripping from the encapsulation layer due to corrosion of the chemical agents is overcome, and the reliability of the display panel 100 is improved.
In an embodiment of the invention, when the encapsulation layer is only covered with the first protection layer, the whole surface of the first protection layer may be formed on a surface of the encapsulation layer on a side away from the functional layer.
As shown in fig. 1 to fig. 5, a functional layer 20 is further disposed on one side surface of the substrate 10, and the encapsulation layer 40 covers, for example, one side surface of the functional layer 20 away from the substrate 10.
In a preferred embodiment, the display panel 100 is, for example, an OLED display panel, and the functional layer 20 includes, for example, an array layer (not shown) and an OLED device layer (not shown) stacked one on top of the other, the array layer is disposed near a surface of one side of the substrate 10, and the OLED device layer is stacked above the array layer.
The array layer comprises a plurality of inorganic insulating layers, a plurality of organic layers arranged on the plurality of inorganic insulating layers, a plurality of metal layers arranged between the organic layers and the inorganic insulating layers, a semiconductor layer arranged between the plurality of inorganic insulating layers and a pixel electrode layer arranged between the plurality of organic layers. The multi-layer inorganic insulating layer includes, for example, a buffer layer, a gate insulating layer, and an interlayer insulating layer; the multi-layer organic layer comprises a flat layer, a pixel definition layer and a spacer layer; the multilayer metal layer comprises a grid metal layer and a source drain metal layer; the multiple metal layers and the semiconductor layer jointly form multiple TFT devices and metal wirings, and the multiple TFT devices and metal wirings are formed while avoiding the preset cutting region 13 and the peripheral isolation region 12. Wherein, the peripheral isolation region 12 is adjacent to the predetermined cutting region 13, and the peripheral isolation region 12 surrounds the predetermined cutting region 13.
As shown in fig. 2 and 3, the predetermined cutting region 13 is cut to form an opening 80, for example, the opening 80 belongs to an "O" shaped via. In this embodiment, the number of the preset cutting areas 13 is two, and the two correspondingly formed openings 80 are symmetrically arranged.
The TFT devices and the metal wires are manufactured and formed by avoiding the preset cutting area 13 and the peripheral isolation area 12; therefore, the film thickness of the array layer (or the functional layer 20) in the preset cutting region 13 and the peripheral isolation region 12 is lower than that of the array layer (or the functional layer 20) in the display region 11, that is, the array layer (or the functional layer 20) forms a concave portion at the preset cutting region 13 and the peripheral isolation region 12. The recess causes the package layer 40 to be recessed in the predetermined scribe region 13 and the peripheral isolation region 12.
In addition, the pixel electrode layer is arranged on the flat layer, and the pixel definition layer is arranged on the pixel electrode layer and the flat layer and encloses a plurality of pixel openings on the pixel electrode layer. The spacer layer is arranged on the pixel definition layer and used for supporting the mask plate when the OLED device layer is formed through evaporation. The OLED device layer comprises a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer and a cathode layer.
In a preferred embodiment, the protrusion 30 is formed with a spacer layer on the pixel definition layer, for example.
As shown in fig. 2, the protrusion 30 is, for example, a ring structure, but not limited thereto. In other embodiments of the present invention, the convex portion may also be rectangular, circular, oval, or other shapes.
In a preferred embodiment, the encapsulation layer 40 is, for example, a thin film encapsulation layer, and includes a first inorganic barrier layer 41, an organic buffer layer 42, and a second inorganic barrier layer 43 stacked on top of each other.
In a preferred embodiment, the substrate 10 may be a rigid substrate or a flexible substrate.
As shown in fig. 6, the optical adhesive layer 50 is filled in the predetermined cutting region 13 and the peripheral isolation region 12 surrounded by the isolation structure 90, and a surface of the optical adhesive layer 50 on a side away from the encapsulation layer 40 is flush with or protrudes (or is higher) than a surface of the encapsulation layer 40 on a side away from the functional layer 20. Preferably, the vertical distance (or height) H between the surface of the optical adhesive layer 50 away from the encapsulation layer 40 and the surface of the encapsulation layer 40 away from the functional layer 20 is 2-6 μm.
The optical adhesive layer 50 is filled in the preset cutting region 13 and the peripheral isolation region 12 surrounded by the isolation structure 90, on one hand, the film thickness is made to be equal to that in the display region 11, which is mainly convenient for the subsequent on-cell process (such as touch electrode preparation) to be performed on a relatively flat surface, thereby improving the process reliability; on the other hand, since the encapsulation layer 40 is isolated by the plurality of grooves 121 on the substrate 10 in the preset cutting region 13 and the peripheral isolation region 12, it can be used to prevent the isolated encapsulation layer 40 from being corroded by water vapor when exposed to the environment, and ensure a good encapsulation effect of the encapsulation layer 40.
In this embodiment, the plurality of grooves 121 are formed in the preset cutting region 13 and the peripheral isolation region 12 of the substrate 10, the functional layer 20 is partitioned by the plurality of grooves 121 in the preset cutting region 13 and the peripheral isolation region 12, and in the process of subsequently cutting the preset cutting region 13 by laser to form the opening 80 (as shown in fig. 2) penetrating through the upper surface and the lower surface of the display panel 10, since the grooves 121 partition inorganic layers and the like in the functional layer 20, the cutting stress is not conducted toward the display region 11, and the damage of the cutting stress to the array control layer in the display region 11 is avoided.
In addition, when the packaging layer 40 covers the preset cutting area 13 and the peripheral isolation area 12, the packaging layer is a continuous film layer, and is cut off by laser to form a plurality of discontinuous partitions, and the plurality of discontinuous partitions can effectively prevent water vapor from being transmitted from the preset cutting area 13 and the peripheral isolation area 12 to the display area 11, so that the packaging effect of the packaging layer 40 cannot be influenced by the subsequent cutting and opening process.
In addition, since the functional layer 20 is already isolated by the plurality of grooves 121, the stress generated by laser cutting off the encapsulation layer 40 in the preset cutting region 13 and the peripheral isolation region 12 is not conducted to the display region 11 of the substrate 10 through the functional layer 20 below the encapsulation layer 40, and further damage of the cutting stress to the array control layer in the display region 11 is avoided.
In a preferred embodiment, the optical adhesive is coated on the surface of the side of the packaging layer 40 away from the functional layer 20, flows towards the predetermined cutting region 13 and the peripheral isolation region 12 enclosed by the isolation structure 90, and fills the predetermined cutting region 13 and the peripheral isolation region 12 enclosed by the isolation structure 90, and after the optical adhesive is leveled, the whole surface of the optical adhesive covers the surface of the side of the packaging layer 40 away from the functional layer 20. After curing the optical adhesive, the optical adhesive in the display region 11 is removed by patterning process, and only the optical adhesive layer 50 in the predetermined cutting region 13 and the peripheral isolation region 12 is remained. The orthographic projection of the optical adhesive layer 50 on the substrate 10 at least covers the orthographic projection of the convex portion 30 on the substrate 10, that is, the edge of the optical adhesive layer 50 slightly protrudes out of the edge of the peripheral isolation region 12 to cover part of the isolation structure 90. The optical adhesive layer 50 is filled in the isolation structure 90 to form a pattern with an inverted trapezoid structure (as shown in fig. 5).
As shown in fig. 6 to 8, the display panel 100 further includes a second passivation layer 70, the second passivation layer 70 is formed before the first passivation layer 60, that is, the second passivation layer 70 covers the surface of the optical adhesive layer 50 away from the substrate, and the first passivation layer 60 covers the surface of the second passivation layer 70 away from the optical adhesive layer 50. Wherein, the edge of the second protective layer 70 protrudes beyond the edge of the optical adhesive layer 50, so that the optical adhesive layer 50 is completely covered.
In a preferred embodiment, the material of the second protection layer 70 is at least one selected from silicon oxide, silicon oxynitride, and silicon nitride.
In a preferred embodiment, the second passivation layer 70 is deposited on the optical adhesive layer 50 by chemical vapor deposition.
In this embodiment, the protective layer made of two different materials is selected to cover the optical adhesive layer 50, so as to overcome the adverse effect of the chemical agent penetrating through the single protective layer to the optical adhesive layer 50 in the subsequent on-cell process, which is caused by the fact that the edge portion of the optical adhesive layer cannot be completely covered due to the material characteristics of the single protective layer.
As shown in fig. 6, the second protection layer 70 includes a laterally extending film layer 72 covering the optical glue layer 50 and a vertically extending film layer 71 covering the edge of the optical glue layer 50, wherein a thickness T1 of the laterally extending film layer 72 is 2000-; thickness T2 of vertically extending film layer 71 is 500 a 1000 a.
As shown in fig. 7 and 8, the first protection film layer 60 is patterned to form a patterned protection layer 61 and a hollow pattern 62, wherein the patterned protection layer 61 and the hollow pattern 62 together form the first protection layer. The patterned protective layer 61 comprises a first laterally extending film layer and a second laterally extending film layer, the second protective layer 70 has a step portion, the step portion comprises a vertically extending film layer 71, a laterally extending film layer 72 located at an upper end of the vertically extending film layer 71, and a laterally extending film layer 73 located at a lower end of the vertically extending film layer 71, the first laterally extending film layer covers the laterally extending film layer 73, and the width W1 of the first laterally extending film layer is greater than or equal to 1.8 μm; the second laterally extending film layer covers the laterally extending film layer 72 and has a width W2 of 1.8 μm or more.
In the embodiment, the first patterned protection film layer 60 has the hollow structure 62 formed thereon, and the stress generated by the cutting presetting 13 is also blocked by the hollow structure 62, i.e. the subsequent cutting process is not affected.
The hollow structure 62 is formed by removing a portion of the first protection film layer 60 by photolithography, for example, to form a plurality of openings, and the shape of the openings includes, but is not limited to, a rectangle, a circle, and the like. Wherein the preferred locations of the plurality of openings are opposite to the locations of the plurality of grooves 121.
In addition, the material of the first protection film layer 60 may be the same as the material of the touch electrode on the surface of the encapsulation layer 40 away from the functional layer 20, and is preferably a Ti/Al/Ti composite metal film. After the first protective film 60 is patterned to obtain the hollow pattern 62, the capacitance delay phenomenon of the touch electrode is reduced.
As shown in fig. 9, the present invention further provides a method for manufacturing a display panel. The method 200 for manufacturing the display panel shown in fig. 9 will be described in detail below with reference to the display panel 100 shown in fig. 1 to 8.
The method 200 for manufacturing a display panel includes:
s1, providing a substrate 10, forming a protrusion 30 on one side surface of the substrate 10, wherein the protrusion 30 is located in the adjacent region 14 between the display region 11 of the substrate 10 and the peripheral isolation region 12 of the substrate 10;
s2, forming on the surface of the encapsulation layer 40 on the display area 11, the peripheral isolation area 12, the predetermined cutting area 13 and the side of the protrusion 30 away from the substrate 10 of the display panel 100, wherein the protrusion 30 and the encapsulation layer 40 covering the protrusion 30 form an isolation structure 90;
s3, coating an optical adhesive on a surface of the package layer 40 away from the substrate 10, so that the optical adhesive fills the peripheral isolation region 12 and the predetermined cutting region 13 surrounded by the isolation structure 90;
s4, curing and removing the optical adhesive in the display area 11 to obtain the optical adhesive layer 50 filled in the peripheral isolation area 12 and the preset cutting area 13; and
s5, forming a first protection layer on the surface of the optical adhesive layer 50 away from the encapsulant layer 40.
In this embodiment, the edge of the first protection layer protrudes from the edge of the optical adhesive layer 50 with the inverted trapezoid structure, so that the first protection layer completely covers the optical adhesive layer 50.
In a preferred embodiment, the material of the first protection layer in S5 is at least one selected from a metal, a composite metal, a metal oxide, or an organic polymer.
In a preferred embodiment, before forming the first passivation layer 60 in S5, the method further includes:
the second protection layer 70 is formed on the surface of the optical adhesive layer 50 away from the package layer 40, and the edge of the second protection layer 70 protrudes from the edge of the optical adhesive layer 50 to completely cover the optical adhesive layer 50.
In this embodiment, the material of the second protection layer 70 is at least one selected from silicon oxide, silicon oxynitride, and silicon nitride.
In a preferred embodiment, the method 200 for manufacturing a display panel further includes:
s6, cutting the predetermined cutting area 13 to form an opening 80 penetrating the upper and lower surfaces of the display panel 100.
In summary, the present invention provides a display panel and a method for manufacturing the same, in which a corrosion-resistant first protection layer is covered on an optical adhesive layer of an inverted trapezoid structure filled in a peripheral isolation region surrounded by an isolation structure, so that the first protection layer can prevent the optical adhesive layer in the existing full-face screen technology from being easily corroded by chemical agents such as etching solution and stripping solution in a subsequent on-cell process, thereby overcoming a stripping problem between the optical adhesive layer and a packaging layer caused by corrosion of the chemical agents and improving reliability of the display panel.
It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.
The above-listed detailed description is merely a detailed description of possible embodiments of the present invention, and it is not intended to limit the scope of the invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A display panel, the display panel includes the base plate, the base plate includes display region, trompil and peripheral isolation region, peripheral isolation region with the trompil is adjacent, the display region with peripheral isolation region is adjacent, its characterized in that, the display panel still includes:
the protrusion is arranged on one side of the substrate and is positioned in an abutting region between the display region and the peripheral isolation region;
the packaging layer covers the display area and the peripheral isolation area of the substrate and the surface of the protrusion, which is far away from one side of the substrate, and the protrusion and the packaging layer covering the protrusion form an isolation structure;
the optical adhesive layer is filled in the peripheral isolation region enclosed by the isolation structure and has an inverted trapezoidal structure; and
the first protective layer covers the surface of one side, far away from the packaging layer, of the optical adhesive layer;
the edge of the first protective layer protrudes out of the edge of the optical adhesive layer of the inverted trapezoidal structure so as to completely cover the optical adhesive layer;
the substrate is provided with a plurality of grooves, the grooves are located in the peripheral isolation area, the packaging layer is isolated in the peripheral isolation area through the grooves, the first protection layer further comprises a plurality of openings, and the openings are opposite to the grooves.
2. The display panel according to claim 1, wherein a material of the first protective layer is at least one selected from a metal, a composite metal, a metal oxide, and an organic polymer.
3. The display panel according to claim 1, further comprising a second protective layer disposed between the optical adhesive layer and the first protective layer; the edge of the second protective layer protrudes out of the edge of the optical adhesive layer so as to completely cover the optical adhesive layer; the material of the second protective layer is at least one selected from silicon oxide, silicon oxynitride and silicon nitride.
4. The display panel according to claim 1, wherein a surface of the optical adhesive layer on a side away from the substrate is flush with or protrudes from a surface of the encapsulation layer on a side away from the substrate.
5. The display panel of claim 1, further comprising a touch electrode layer disposed on a surface of the encapsulation layer on a side away from the substrate, the touch electrode layer being located in the display region and the peripheral isolation region.
6. A method for manufacturing a display panel is characterized in that,
the preparation method of the display panel comprises the following steps:
s1, providing a substrate, and forming a protrusion and a plurality of grooves on one side surface of the substrate, wherein the protrusion is located in an adjacent region between a display region of the substrate and a peripheral isolation region of the substrate, and the grooves are located in the peripheral isolation region;
s2, forming an encapsulation layer on the display area, the peripheral isolation area and the preset cutting area of the display panel and the surface of the protrusion far away from the substrate, wherein the protrusion and the encapsulation layer covering the protrusion form an isolation structure, and the plurality of grooves enable the encapsulation layer to be isolated in the peripheral isolation area;
s3, coating optical cement to the surface of one side, far away from the substrate, of the packaging layer, so that the peripheral isolation region and the preset cutting region surrounded by the isolation structure are filled with the optical cement;
s4, curing and removing the optical adhesive in the display area to obtain the optical adhesive layer filled in the peripheral isolation area and the preset cutting area; and
s5, forming a first protective layer on the surface of the optical adhesive layer far away from the packaging layer, patterning the first protective layer to form a plurality of openings, wherein the openings are opposite to the grooves;
the edge of the first protection layer protrudes out of the edge of the optical adhesive layer of the inverted trapezoidal structure so as to completely cover the optical adhesive layer.
7. The method for manufacturing a display panel according to claim 6,
the material of the first protective layer in S5 is at least one selected from a metal, a composite metal, a metal oxide, or an organic polymer.
8. The method for manufacturing a display panel according to claim 6,
before forming the first protection layer in S5, the method further includes:
forming a second protective layer on the surface of one side of the optical adhesive layer, which is far away from the packaging layer, wherein the edge of the second protective layer protrudes out of the edge of the optical adhesive layer so as to completely cover the optical adhesive layer;
the material of the second protective layer is at least one selected from silicon oxide, silicon oxynitride and silicon nitride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110227396.3A CN112909207B (en) | 2021-03-02 | 2021-03-02 | Display panel and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110227396.3A CN112909207B (en) | 2021-03-02 | 2021-03-02 | Display panel and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112909207A CN112909207A (en) | 2021-06-04 |
| CN112909207B true CN112909207B (en) | 2022-08-09 |
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| CN109616506A (en) * | 2018-12-18 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | It is displayed in full screen panel and preparation method thereof |
| CN211719594U (en) * | 2020-02-21 | 2020-10-20 | 京东方科技集团股份有限公司 | Display panel and display device |
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| KR102326069B1 (en) * | 2015-07-29 | 2021-11-12 | 엘지디스플레이 주식회사 | Organic light emitting display device |
| CN107180923B (en) * | 2017-07-20 | 2018-09-18 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof and display device |
| KR102448325B1 (en) * | 2017-11-16 | 2022-09-30 | 삼성디스플레이 주식회사 | Display panel and electronic device having the same |
| US10541380B1 (en) * | 2018-08-30 | 2020-01-21 | Samsung Display Co., Ltd. | Display device with substrate comprising an opening and adjacent grooves |
| KR20200060594A (en) * | 2018-11-21 | 2020-06-01 | 삼성디스플레이 주식회사 | Display panel |
| US10840313B2 (en) * | 2018-11-27 | 2020-11-17 | Samsung Display Co., Ltd. | Display device |
| KR20210020203A (en) * | 2019-08-13 | 2021-02-24 | 삼성디스플레이 주식회사 | display apparatus and method manufacturing the same |
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| CN109616506A (en) * | 2018-12-18 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | It is displayed in full screen panel and preparation method thereof |
| CN211719594U (en) * | 2020-02-21 | 2020-10-20 | 京东方科技集团股份有限公司 | Display panel and display device |
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