CN112909112A - Photovoltaic module for improving photoelectric conversion efficiency and preparation method thereof - Google Patents
Photovoltaic module for improving photoelectric conversion efficiency and preparation method thereof Download PDFInfo
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- CN112909112A CN112909112A CN202110061978.9A CN202110061978A CN112909112A CN 112909112 A CN112909112 A CN 112909112A CN 202110061978 A CN202110061978 A CN 202110061978A CN 112909112 A CN112909112 A CN 112909112A
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 32
- 238000002360 preparation method Methods 0.000 title description 7
- 239000012790 adhesive layer Substances 0.000 claims abstract description 90
- 239000010410 layer Substances 0.000 claims abstract description 79
- 238000004806 packaging method and process Methods 0.000 claims abstract description 65
- 239000005341 toughened glass Substances 0.000 claims abstract description 23
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims description 35
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 29
- 229910052709 silver Inorganic materials 0.000 claims description 29
- 239000004332 silver Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 29
- 238000010521 absorption reaction Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 16
- 230000031700 light absorption Effects 0.000 claims description 15
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 15
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 12
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 238000003475 lamination Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- KZUNJOHGWZRPMI-UHFFFAOYSA-N samarium atom Chemical compound [Sm] KZUNJOHGWZRPMI-UHFFFAOYSA-N 0.000 claims description 8
- 241000446313 Lamella Species 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- TWBYWOBDOCUKOW-UHFFFAOYSA-N isonicotinic acid Chemical group OC(=O)C1=CC=NC=C1 TWBYWOBDOCUKOW-UHFFFAOYSA-N 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- JAONJTDQXUSBGG-UHFFFAOYSA-N dialuminum;dizinc;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Al+3].[Al+3].[Zn+2].[Zn+2] JAONJTDQXUSBGG-UHFFFAOYSA-N 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011230 binding agent Substances 0.000 claims description 3
- 239000007822 coupling agent Substances 0.000 claims description 3
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- 239000003292 glue Substances 0.000 claims description 3
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- 238000005245 sintering Methods 0.000 claims description 3
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- 239000007888 film coating Substances 0.000 claims description 2
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- 238000005477 sputtering target Methods 0.000 claims description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 abstract 6
- 239000005038 ethylene vinyl acetate Substances 0.000 abstract 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 abstract 6
- 239000007789 gas Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 8
- 229910052761 rare earth metal Inorganic materials 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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- 238000009776 industrial production Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a photovoltaic module for improving photoelectric conversion efficiency, which comprises a back plate, a first EVA (ethylene vinyl acetate) packaging adhesive layer, a heat conduction packaging adhesive layer, a photovoltaic cell sheet layer, a heat insulation packaging adhesive layer, a second EVA packaging adhesive layer and a toughened glass cover plate, wherein the back plate, the first EVA packaging adhesive layer, the heat conduction packaging adhesive layer, the photovoltaic cell sheet layer, the heat insulation packaging adhesive layer, the second EVA packaging adhesive layer and the toughened glass cover plate are sequentially arranged from bottom to top, a plurality of convex blocks are uniformly arranged at intervals at the upper end of the back plate, the upper ends of the convex blocks penetrate through the first EVA packaging adhesive layer and are embedded in the heat conduction packaging adhesive layer, one end of each convex block, which is positioned in the heat conduction packaging adhesive layer, is. The photovoltaic module can effectively reduce the heat generated by the photovoltaic cell piece absorbing ultraviolet light and infrared light, so that the photovoltaic cell piece can work at low temperature and high power, and the photoelectric conversion efficiency of the photovoltaic module is improved.
Description
Technical Field
The invention relates to the technical field of photovoltaic modules, in particular to a photovoltaic module capable of improving photoelectric conversion efficiency and a preparation method thereof.
Background
The photovoltaic module is a device that converts solar energy into electric energy by using a photovoltaic effect, and may be called a solar panel, and is widely used in daily life and industrial production, for example, in the fields of solar power supply for users, traffic, photovoltaic power station, communication, and the like. In the traditional photovoltaic module, because the current and the voltage of the single solar cell are very small, the single solar cell is generally connected in series to obtain high voltage, then connected in parallel to obtain high current, the high current is output through a diode (for preventing current feedback), the single solar cell and the diode are packaged on a stainless steel frame, an aluminum frame or other non-metal frames, the front packaging glass and the back panel are mounted, and nitrogen is filled for sealing.
In order to improve the photoelectric conversion efficiency of the solar photovoltaic module, people generally adopt the toughened glass with high visible light transmittance as the cover plate, but the reflectivity of the existing toughened glass cover plate with high visible light transmittance to ultraviolet rays and infrared rays is lower, the ultraviolet rays and the infrared rays not only can damage the photovoltaic cell piece, but also the photovoltaic cell piece absorbs the ultraviolet rays and the infrared rays and then is converted into more heat, so that the temperature of the photovoltaic cell piece is higher, the power is reduced, and the photoelectric conversion efficiency of the photovoltaic cell piece is reduced.
Disclosure of Invention
The invention aims to provide a photovoltaic module for improving photoelectric conversion efficiency and a preparation method thereof, so as to solve the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: the utility model provides an improve photovoltaic module of photoelectric conversion efficiency, photovoltaic module includes backplate, first EVA packaging adhesive layer, heat conduction packaging adhesive layer, photovoltaic cell lamella, thermal-insulated packaging adhesive layer, second EVA packaging adhesive layer and the toughened glass apron that sets gradually from bottom to top, the even a plurality of lug that is provided with in backplate upper end interval, the upper end of lug runs through first EVA packaging adhesive layer to the embedding sets up in heat conduction packaging adhesive layer, the lug is located the fixed heat absorption dish that is provided with of the inside one end of heat conduction packaging adhesive layer, the toughened glass apron is including the glass base plate, ultraviolet light absorption layer, niobium pentoxide layer, AZO layer and silver layer have set gradually on the glass base plate.
In a preferred embodiment, the back plate is a metal back plate, the material of the metal back plate is one of aluminum, copper, stainless steel or silver, and the thickness of the back plate is 700 and 1500 μm.
In a preferred embodiment, the thicknesses of the first EVA encapsulating adhesive layer and the second EVA encapsulating adhesive layer are both 200-400 microns, and the thicknesses of the heat conducting encapsulating adhesive layer and the heat insulating encapsulating adhesive layer are 100-300 microns.
In a preferred embodiment, the bumps and the heat absorbing discs are both arranged in a cylindrical shape, the diameter of each cylindrical bump is 200-400 microns, the diameter of each heat absorbing disc is 400-600 microns, the distance between every two adjacent bumps is 1000-1500 microns, and the top ends of the bumps are embedded in the middle of the heat conducting encapsulation adhesive layer.
In a preferred embodiment, the thickness of the glass substrate is 500-1200 microns, the thickness of the niobium pentoxide is 80-120 nm, the thickness of the AZO layer is 80-120 nm, the thickness of the silver layer is 40-80 nm, and the thickness of the ultraviolet light absorption layer is 60-150 nm.
The invention also provides a preparation method of the photovoltaic module for improving the photoelectric conversion efficiency, which comprises the following steps:
a) selecting a glass substrate with high visible light transmittance, cutting according to a preset size, cleaning and drying by using a cleaning machine after cutting, then weighing nano zinc oxide powder and samarium powder, uniformly mixing, putting the mixed powder into a binder and a stabilizer, uniformly mixing to obtain an ultraviolet light absorbing solution, coating the ultraviolet light absorbing solution on the surface of the glass substrate, and then drying, curing and sintering to form an ultraviolet light absorbing layer on the surface of the glass substrate;
b) putting the glass substrate with the ultraviolet light absorption layer into a coating chamber, sequentially carrying out magnetron sputtering on a niobium target, an aluminum zinc oxide target and silver, and sequentially coating a niobium pentoxide layer, an AZO layer and a silver layer on the glass substrate to obtain a toughened glass cover plate;
c) welding a plurality of lugs at the upper end of the back plate at equal intervals, welding heat absorption discs at the upper ends of the lugs, and then sequentially laying a first EVA packaging adhesive layer, a heat conduction packaging adhesive layer, a photovoltaic cell sheet layer, a heat insulation packaging adhesive layer, a second EVA packaging adhesive layer and a toughened glass cover plate on the upper surface of the back plate to obtain a laminated piece;
d) and carrying out lamination treatment on the obtained laminated piece, so that the upper end part of the lug at the upper end of the back plate and the heat absorption disc are embedded into the heat conduction packaging adhesive layer, and the photovoltaic module with high photoelectric conversion efficiency is obtained.
In a preferred embodiment, the mass ratio of the nano zinc oxide powder to the samarium powder added in the step a) is 4-6:1, the adhesive adopts a silane coupling agent or a titanate coupling agent, and the stabilizer is isonicotinic acid.
In a preferred embodiment, the step b) employs an ac power source, Ar and O for magnetron sputtering the niobium target2As a shielding gas, Ar and O2The gas flow of the gas is 400SCCM to 800SCCM, an alternating current power supply, Ar and O are adopted when the aluminum zinc oxide target is subjected to magnetron sputtering2As a shielding gas, Ar and O2The gas flow of the silver sputtering target is 1000SCCM to 40SCCM, a direct current power supply is adopted when silver is sputtered by magnetron sputtering, Ar is used as protective gas, and the Ar gas flow is 500SCCM to 550 SCCM.
In a preferred embodiment, in the step c), the photovoltaic cell sheet layer is formed by welding a plurality of photovoltaic cell sheets, and the EL test is performed after the welding of the photovoltaic cell sheets is completed.
In a preferred embodiment, the laminate in step d) is subjected to a lamination process and then to a taping process using a sealing compound.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the glass with high visible light transmittance as the substrate, and the outer side of the glass substrate is provided with the ultraviolet light absorption layer, the niobium pentoxide layer, the AZO layer and the silver layer, wherein the ultraviolet light absorption layer is formed by mixing nano zinc oxide powder and rare earth element samarium powder, the nano zinc oxide powder doped with rare earth elements can convert ultraviolet rays into visible rays, thereby not only reducing the heat generated after the ultraviolet rays are absorbed by the photovoltaic cell piece, but also improving the absorption of the photovoltaic cell piece on the visible rays and effectively improving the light conversion efficiency of the photovoltaic module, the niobium pentoxide layer can improve the refractive index of the glass substrate so as to improve the light transmittance of the glass substrate, the silver layer can reflect the infrared rays, the AZO layer can assist the silver layer, so that the transmittance of the infrared rays is lower, and the heat generated after the infrared rays are absorbed by the photovoltaic cell piece can be reduced, the photovoltaic module can effectively reduce the heat generated by the photovoltaic cell piece absorbing ultraviolet light and infrared light, so that the photovoltaic cell piece can work at low temperature and high power, and the photoelectric conversion efficiency of the photovoltaic module is improved;
2. according to the invention, the heat-conducting packaging adhesive layer, the heat-insulating packaging adhesive layer, the bump and the heat absorption disc are arranged, the heat-insulating packaging adhesive layer is arranged between the back plate and the photovoltaic cell sheet layer, heat generated in the photovoltaic cell sheet layer can be quickly transferred to the back plate through the heat-conducting packaging adhesive layer, the heat absorption disc and the bump, the contact area between the heat absorption disc and the heat-conducting packaging adhesive layer can be increased, the heat-conducting performance of the heat absorption disc and the bump is better, the heat-radiating efficiency of the photovoltaic cell sheet layer can be effectively improved, the photovoltaic cell sheet layer can work at a low temperature, the power of the photovoltaic cell sheet layer is improved, the photoelectric conversion efficiency of the photovoltaic cell sheet layer is improved, the heat generated by the photovoltaic cell.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic overall cross-sectional configuration of the present invention;
FIG. 2 is a schematic view of the structure of the tempered glass cover plate of the present invention;
in the figure: 1a back plate; 2, a first EVA packaging adhesive layer; 3, a heat conduction packaging adhesive layer; 4 a photovoltaic cell sheet; 5, a heat insulation packaging glue layer; 6 second EVA packaging glue layer; 7, tempering the glass cover plate; 8, a bump; 9 a glass substrate; 10 niobium pentoxide; 11AZO layer; 12 a silver layer; 13 a heat absorption plate; 14 ultraviolet light absorbing layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1-2, the invention provides a photovoltaic module for improving photoelectric conversion efficiency, which comprises a back plate 1, a first EVA encapsulating adhesive layer 2, a heat-conducting encapsulating adhesive layer 3, a photovoltaic cell sheet layer 4, a heat-insulating encapsulating adhesive layer 5, a second EVA encapsulating adhesive layer 6 and a toughened glass cover plate 7, which are sequentially arranged from bottom to top, wherein a plurality of bumps 8 are uniformly arranged at intervals at the upper end of the back plate 1, the upper ends of the bumps 8 penetrate through the first EVA encapsulating adhesive layer 2 and are embedded in the heat-conducting encapsulating adhesive layer 3, a heat-absorbing disc 13 is fixedly arranged at one end of the bumps 3 positioned in the heat-conducting encapsulating adhesive layer 3, the toughened glass cover plate 7 comprises a glass substrate 9, and an ultraviolet light-absorbing layer 14, a niobium pentoxide layer 10, an AZO layer 11 and a silver layer 12 are sequentially arranged on the glass substrate 9.
In a preferred embodiment, the back plate 1 is a metal back plate, the material of the metal back plate is one of aluminum, copper, stainless steel or silver, and the thickness of the back plate 1 is 1300 μm.
In a preferred embodiment, the thicknesses of the first EVA encapsulating adhesive layer 2 and the second EVA encapsulating adhesive layer 2 are both 300 microns, and the thicknesses of the heat conducting encapsulating adhesive layer 3 and the heat insulating encapsulating adhesive layer 5 are 200 microns.
In a preferred embodiment, the bumps 8 and the heat absorbing discs 13 are both arranged in a cylindrical shape, the diameter of each cylindrical bump 8 is 300 micrometers, the diameter of each heat absorbing disc 13 is 500 micrometers, the distance between every two adjacent bumps 8 is 1300 micrometers, and the top ends of the bumps 8 are embedded in the middle of the heat conductive packaging adhesive layer 3.
In a preferred embodiment, the thickness of the glass substrate 9 is 800 micrometers, the thickness of the niobium pentoxide 10 is 80 nanometers, the thickness of the AZO layer 11 is 80 nanometers, the thickness of the silver layer 12 is 40 nanometers, and the thickness of the ultraviolet light absorption layer 14 is 60 nanometers.
The invention also provides a preparation method of the photovoltaic module for improving the photoelectric conversion efficiency, which comprises the following steps:
a) selecting a glass substrate 9 with high visible light transmittance, cutting according to a preset size, cleaning and drying by using a cleaning machine after cutting, then weighing nano zinc oxide powder and samarium powder, uniformly mixing, putting the mixed powder into a binder and a stabilizer, uniformly mixing to obtain an ultraviolet light absorbing solution, coating the ultraviolet light absorbing solution on the surface of the glass substrate 9, and then drying, curing and sintering to form an ultraviolet light absorbing layer 14 on the surface of the glass substrate 9;
b) putting the glass substrate 9 with the ultraviolet light absorption layer 14 into a film coating chamber, sequentially carrying out magnetron sputtering on a niobium target, an aluminum zinc oxide target and silver, and sequentially plating a niobium pentoxide layer 10, an AZO layer 11 and a silver layer 12 on the glass substrate 9 to obtain a toughened glass cover plate;
c) welding a plurality of bumps 8 at equal intervals at the upper end of the back plate 1, welding heat absorption discs 13 at the upper ends of the bumps 8, and then sequentially laying a first EVA packaging adhesive layer 2, a heat conduction packaging adhesive layer 3, a photovoltaic cell sheet layer 4, a heat insulation packaging adhesive layer 5, a second EVA packaging adhesive layer 6 and a toughened glass cover plate 7 on the upper surface of the back plate 1 to obtain a laminated piece;
d) the obtained laminated member is subjected to lamination processing so that the upper end portions of the bumps 8 and the heat absorbing discs 13 at the upper end of the back plate 1 are embedded into the heat conductive encapsulating adhesive layer 3, and the photovoltaic module with high photoelectric conversion efficiency is obtained.
In a preferred embodiment, the mass ratio of the nano zinc oxide powder to the samarium powder added in the step a) is 5:1, the adhesive is a silane coupling agent or a titanate coupling agent, and the stabilizer is isonicotinic acid.
In a preferred embodiment, the step b) employs an ac power source, Ar and O for magnetron sputtering the niobium target2As a shielding gas, Ar and O2Gas flow of 400SCCM to 800SCCM, magnetron sputtering aluminum oxideWhen melting zinc target, it uses AC power supply, Ar and O2As a shielding gas, Ar and O2The gas flow of (1) is 1000SCCM and 40SCCM, a direct current power supply is adopted when the silver is subjected to magnetron sputtering, Ar is used as protective gas, and the Ar gas flow is 525 SCCM.
In a preferred embodiment, in the step c), the photovoltaic cell sheet layer 4 is formed by welding a plurality of photovoltaic cell sheets, and the photovoltaic cell sheets are subjected to an EL test after the welding is completed.
In a preferred embodiment, the laminate in step d) is subjected to a lamination process and then to a taping process using a sealing compound.
Example 2:
different from the embodiment 2, the thickness of the glass substrate 9 is 800 micrometers, the thickness of the niobium pentoxide 10 is 100 nanometers, the thickness of the AZO layer 11 is 100 nanometers, the thickness of the silver layer 12 is 60 nanometers, and the thickness of the ultraviolet light absorption layer 14 is 90 nanometers.
Example 3:
different from the embodiment 1-2, the thickness of the glass substrate 9 is 800 micrometers, the thickness of the niobium pentoxide 10 is 120 nanometers, the thickness of the AZO layer 11 is 120 nanometers, the thickness of the silver layer 12 is 80 nanometers, and the thickness of the ultraviolet light absorption layer 14 is 150 nanometers.
The tempered glass cover plates of the photovoltaic modules produced in the embodiments 1, 2 and 3 are respectively selected as an experimental group 1, an experimental group 2 and an experimental group 3, the tempered glass cover plate of the traditional photovoltaic module is selected as a control group, the transmittance and the reflectivity of each group of photovoltaic modules to visible light, ultraviolet light and infrared light are respectively measured, and the measurement results are shown in a table I:
watch 1
Through a plurality of experiments, the photovoltaic module toughened glass cover plate produced by the embodiment shown in the table I has high light transmittance to visible light and high reflectivity to ultraviolet light and infrared light, the ultraviolet light absorption layer is formed by mixing nano zinc oxide powder and rare earth element samarium powder, the nano zinc oxide powder doped with rare earth elements can convert ultraviolet light into visible light, heat generated after the photovoltaic cell absorbs the ultraviolet light can be reduced, the absorption of the photovoltaic cell to the visible light can be improved, the light conversion efficiency of the photovoltaic module can be effectively improved, the refractive index of the glass substrate can be improved by the niobium pentoxide layer, the light transmittance of the glass substrate is improved, the silver layer can reflect the infrared light, the AZO layer can assist the silver layer, the transmittance of the infrared light is low, and heat generated after the photovoltaic cell absorbs the infrared light can be reduced, the photovoltaic module can effectively reduce the heat generated by the photovoltaic cell piece absorbing ultraviolet light and infrared light, so that the photovoltaic cell piece can work at low temperature and high power, and the photoelectric conversion efficiency of the photovoltaic module is improved.
Example 4:
referring to fig. 1, the present invention provides a photovoltaic module for improving photoelectric conversion efficiency, the photovoltaic module includes a back plate 1, a first EVA encapsulating adhesive layer 2, a heat conducting encapsulating adhesive layer 3, a photovoltaic cell sheet layer 4, a heat insulating encapsulating adhesive layer 5, a second EVA encapsulating adhesive layer 6 and a tempered glass cover plate 7, which are sequentially disposed from bottom to top, a plurality of bumps 8 are uniformly disposed at an upper end of the back plate 1 at intervals, upper ends of the bumps 8 penetrate through the first EVA encapsulating adhesive layer 2 and are embedded in the heat conducting encapsulating adhesive layer 3, and a heat absorbing plate 13 is fixedly disposed at one end of the bumps 3 located inside the heat conducting encapsulating adhesive layer 3.
In a preferred embodiment, the back plate 1 is a metal back plate, the material of the metal back plate is one of aluminum, copper, stainless steel or silver, and the thickness of the back plate 1 is 1300 μm.
In a preferred embodiment, the thicknesses of the first EVA encapsulating adhesive layer 2 and the second EVA encapsulating adhesive layer 2 are both 300 microns, and the thicknesses of the heat conducting encapsulating adhesive layer 3 and the heat insulating encapsulating adhesive layer 5 are 200 microns.
In a preferred embodiment, the bumps 8 and the heat absorbing discs 13 are both arranged in a cylindrical shape, the diameter of each cylindrical bump 8 is 300 micrometers, the diameter of each heat absorbing disc 13 is 500 micrometers, the distance between every two adjacent bumps 8 is 1300 micrometers, and the top ends of the bumps 8 are embedded in the middle of the heat conductive packaging adhesive layer 3.
The invention also provides a preparation method of the photovoltaic module for improving the photoelectric conversion efficiency, which comprises the following steps:
a) welding a plurality of bumps 8 at equal intervals at the upper end of the back plate 1, welding heat absorption discs 13 at the upper ends of the bumps 8, and then sequentially laying a first EVA packaging adhesive layer 2, a heat conduction packaging adhesive layer 3, a photovoltaic cell sheet layer 4, a heat insulation packaging adhesive layer 5, a second EVA packaging adhesive layer 6 and a toughened glass cover plate 7 on the upper surface of the back plate 1 to obtain a laminated piece;
b) the obtained laminated member is subjected to lamination processing so that the upper end portions of the bumps 8 and the heat absorbing discs 13 at the upper end of the back plate 1 are embedded into the heat conductive encapsulating adhesive layer 3, and the photovoltaic module with high photoelectric conversion efficiency is obtained.
In a preferred embodiment, in the step a), the photovoltaic cell sheet layer 4 is formed by welding a plurality of photovoltaic cell sheets, and the photovoltaic cell sheets are subjected to an EL test after the welding is completed.
In a preferred embodiment, the laminated member in the step b) is subjected to a lamination process and then to a taping process using a sealing adhesive.
The photovoltaic modules produced in the embodiment 2 and the embodiment 4 are selected as an experiment group 1 and an experiment group 2 respectively, the traditional photovoltaic module is selected as a control group, 60 photovoltaic cells are adopted in the photovoltaic cell sheets in the selected photovoltaic module, the photoelectric conversion efficiency of the photovoltaic module is measured respectively, and the measurement results are shown in the table II:
watch two
It can be known from table two, embodiment 4 adds heat conduction packaging adhesive layer, the lug, heat absorption dish and thermal-insulated packaging adhesive layer in traditional photovoltaic module, the heat that produces in the photovoltaic cell lamella can pass through heat conduction packaging adhesive layer, heat absorption dish and lug transmit for the backplate fast, the heat absorption dish can increase the area of contact with heat conduction packaging adhesive layer, make the heat conductivility of heat absorption dish and lug better, can effectively improve the radiating efficiency of photovoltaic cell lamella, make the photovoltaic cell lamella keep low temperature work, improve the power of photovoltaic cell lamella, thereby improve its photoelectric conversion efficiency, and embodiment 2 adopts purpose-built toughened glass apron, can effectively improve photovoltaic module's photoelectric conversion efficiency.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an improve photovoltaic module of photoelectric conversion efficiency which characterized in that: photovoltaic module includes backplate (1), first EVA packaging adhesive layer (2), heat conduction packaging adhesive layer (3), photovoltaic cell lamella (4), thermal-insulated packaging adhesive layer (5), second EVA packaging adhesive layer (6) and toughened glass apron (7) that set gradually from bottom to top, backplate (1) upper end interval is even is provided with a plurality of lug (8), first EVA packaging adhesive layer (2) is run through to the upper end of lug (8) to the embedding sets up in heat conduction packaging adhesive layer (3), lug (3) are located the fixed heat absorption dish (13) that is provided with of the inside one end of heat conduction packaging adhesive layer (3), toughened glass apron (7) are including glass base plate (9), ultraviolet absorption layer (14), niobium pentoxide layer (10), AZO layer (11) and silver layer (12) have set gradually on glass base plate (9).
2. The photovoltaic module according to claim 1, wherein: the back plate (1) is a metal back plate, the material of the metal back plate is one of aluminum, copper, stainless steel or silver, and the thickness of the back plate (1) is 700-1500 microns.
3. The photovoltaic module according to claim 1, wherein: the thicknesses of the first EVA packaging adhesive layer (2) and the second EVA packaging adhesive layer (2) are both 200-400 microns, and the thicknesses of the heat conduction packaging adhesive layer (3) and the heat insulation packaging adhesive layer (5) are both 100-300 microns.
4. The photovoltaic module according to claim 1, wherein: the bumps (8) and the heat absorbing discs (13) are arranged in a cylindrical shape, the diameter of each cylindrical bump (8) is 400 microns, the diameter of each heat absorbing disc (13) is 600 microns, the distance between every two adjacent bumps (8) is 1500 microns, and the top ends of the bumps (8) are embedded into the middle of the heat conducting packaging adhesive layer (3).
5. The photovoltaic module according to claim 1, wherein: the thickness of the glass substrate (9) is 500-1200 microns, the thickness of the niobium pentoxide (10) is 80-120 nanometers, the thickness of the AZO layer (11) is 80-120 nanometers, the thickness of the silver layer (12) is 40-80 nanometers, and the thickness of the ultraviolet light absorption layer (14) is 60-150 nanometers.
6. The method for preparing a photovoltaic module for improving photoelectric conversion efficiency according to any one of claims 1 to 5, wherein: the method comprises the following steps:
a) selecting a glass substrate (9) with high visible light transmittance, cutting according to a preset size, cleaning and drying by using a cleaning machine after cutting, then weighing nano zinc oxide powder and samarium powder, uniformly mixing, putting the mixed powder into a binder and a stabilizer, uniformly mixing to obtain an ultraviolet light absorption solution, coating the ultraviolet light absorption solution on the surface of the glass substrate (9), and then drying, curing and sintering to form an ultraviolet light absorption layer (14) on the surface of the glass substrate (9);
b) putting a glass substrate (9) with an ultraviolet light absorption layer (14) into a film coating chamber, sequentially carrying out magnetron sputtering on a niobium target, an aluminum zinc oxide target and silver, and sequentially coating a niobium pentoxide layer (10), an AZO layer (11) and a silver layer (12) on the glass substrate (9) to obtain a toughened glass cover plate;
c) welding a plurality of lugs (8) at equal intervals at the upper end of a back plate (1), welding heat absorption discs (13) at the upper ends of the lugs (8), and then sequentially laying a first EVA packaging adhesive layer (2), a heat conduction packaging adhesive layer (3), a photovoltaic cell sheet layer (4), a heat insulation packaging adhesive layer (5), a second EVA packaging adhesive layer (6) and a toughened glass cover plate (7) on the upper surface of the back plate (1) to obtain a laminated piece;
d) and (3) carrying out lamination treatment on the obtained laminated piece, so that the upper end part of the lug (8) at the upper end of the back plate (1) and the heat absorption plate (13) are embedded into the heat conduction packaging adhesive layer (3), and obtaining the photovoltaic module with high photoelectric conversion efficiency.
7. The method for preparing a photovoltaic module for improving photoelectric conversion efficiency according to claim 6, wherein: the mass ratio of the added nano zinc oxide powder to the added samarium powder in the step a) is 4-6:1, the adhesive adopts a silane coupling agent or a titanate coupling agent, and the stabilizer is isonicotinic acid.
8. The method for preparing a photovoltaic module for improving photoelectric conversion efficiency according to claim 6, wherein: the step b) adopts an alternating current power supply Ar and O when the niobium target is subjected to magnetron sputtering2As a shielding gas, Ar and O2The gas flow of the gas is 400SCCM to 800SCCM, an alternating current power supply, Ar and O are adopted when the aluminum zinc oxide target is subjected to magnetron sputtering2As a shielding gas, Ar and O2The gas flow of the silver sputtering target is 1000SCCM to 40SCCM, a direct current power supply is adopted when silver is sputtered by magnetron sputtering, Ar is used as protective gas, and the Ar gas flow is 500SCCM to 550 SCCM.
9. The method for preparing a photovoltaic module for improving photoelectric conversion efficiency according to claim 6, wherein: in the step c), the photovoltaic cell sheet layer (4) is formed by welding a plurality of photovoltaic cell sheets, and the photovoltaic cell sheets are subjected to EL test after being welded.
10. The method for preparing a photovoltaic module for improving photoelectric conversion efficiency according to claim 6, wherein: and d), performing edge covering treatment by using packaging glue after the lamination treatment of the laminated piece in the step d).
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