CN112908825A

CN112908825A - Roll-to-roll plasma processing system

Info

Publication number: CN112908825A
Application number: CN202110287662.1A
Authority: CN
Inventors: 谭健
Original assignee: Shenzhen Shenzhou Tianzhu Technology Co ltd
Current assignee: Shenzhen Shenzhou Tianzhu Technology Co ltd
Priority date: 2021-03-17
Filing date: 2021-03-17
Publication date: 2021-06-04

Abstract

The invention belongs to the field of machining, and provides a roll-to-roll plasma processing system. The cleaning machine comprises a machine body, a discharging and receiving cavity, an isoionic cleaning cavity and a copper pipe embedded type polar plate, wherein the discharging and receiving cavity and the isoionic cleaning cavity are positioned in the machine body, and the copper pipe embedded type polar plate is positioned in the isoionic cleaning cavity. The discharging bin and the receiving bin are integrated into one cavity, so that the volume of the vacuum cavity is reduced. By using the copper tube embedded type polar plate, the problem of easy water leakage caused by welding is avoided.

Description

Roll-to-roll plasma processing system

Technical Field

The invention belongs to the field of machining, and particularly relates to a roll-to-roll plasma processing system.

Background

With the development of production technology, the production mode of the flexible circuit board industry is gradually upgraded from a sheet-to-sheet production mode to a roll-to-roll production mode; in the production process flow of the traditional flexible circuit board, the discharging bin and the receiving bin are two bin bodies generally, so that the equipment is large in size and inconvenient to transport or maintain. In addition, the commonly used electrode plate is an aluminum square tube for welding, water is introduced for cooling, water is easy to leak from a welding interface due to process reasons, and the cooling mode easily causes low vacuum degree in the cavity and poor cleaning effect. Therefore, it is necessary to develop a new processing system to solve the above problems.

Disclosure of Invention

The embodiment of the invention aims to provide a roll-to-roll plasma processing system, and aims to solve the problems that equipment is large in size, welding interfaces are prone to water leakage, the cleaning effect is poor and the like in the existing production process.

The embodiment of the invention is realized in such a way that a roll-to-roll plasma processing system comprises a machine body, a material discharging and receiving cavity, a plasma cleaning cavity and a copper pipe embedded type polar plate, wherein the material discharging and receiving cavity and the plasma cleaning cavity are positioned in the machine body, and the copper pipe embedded type polar plate is positioned in the plasma cleaning cavity.

Furthermore, blowing and receiving the material chamber including blowing storehouse and receiving the material storehouse, the blowing storehouse with receive the material storehouse and be located same cavity.

Further, the discharge bin is located below the collecting bin, and the discharge bin and the collecting bin are separated through a partition plate.

Further, a sliding rail is installed above the partition plate, and the material receiving bin is connected with the sliding rail in a sliding mode.

Furthermore, the copper tube embedded type polar plate comprises a polar plate and a copper tube, and the polar plate is provided with a through hole array consisting of at least one array unit.

Further, the array unit of the through-hole array includes one through-hole and four elongated circular holes.

Furthermore, the copper tubes are arranged on one side of the polar plate in an S shape.

Furthermore, the number of the copper pipe embedded type polar plates is not less than one, and the copper pipe embedded type polar plates are arranged in the plasma cleaning cavity in parallel.

Further, the intelligent alarm device also comprises a touch screen, an alarm lamp and a loose-leaf door.

Further, the invention also provides a plasma processing method of the flexible circuit board, which comprises the following steps:

s1, arranging a circuit board: arranging the copper foil in the discharging mechanism, penetrating the copper foil through the strip holes below the partition plate, sequentially bypassing the support shaft, and penetrating the copper foil into the receiving bin 22 and the receiving mechanism in the receiving bin 22 from the strip holes above the partition plate;

s2 plasma cleaning: the plasma cleaning cavity 3 is vacuumized to 20-30Pa, industrial gas is filled in the cavity, ionization is started, ionized ions penetrate through the through holes of the copper pipe embedded type polar plate and hit the surface of the copper foil to be treated, impurities on the surface of the copper foil are removed, meanwhile, the copper pipe starts to run water, and heat generated during ionization is taken away.

The invention has the following beneficial effects in terms of equipment volume:

1. the material discharging bin and the material receiving bin are integrated in the cavity, so that the volume of the vacuum cavity is reduced, the processing difficulty is reduced, the matching of a vacuum pump set is reduced, the equipment volume is reduced, and the production cost is greatly reduced.

2. In the prior art, the discharging bin and the receiving bin are divided into two parts, the cavity on the left side is the discharging bin, and the discharging bin and the receiving bin enter the receiving bin of the cavity on the right side after plasma of the vacuum cavity.

In the aspect of the cooling process:

1. the air holes are formed in the whole plate, and the copper pipe is embedded for cooling, so that the plasma cavity is distributed more uniformly, and the integral uniformity is improved. In addition, the whole copper pipe is directly installed, so that the problem of easy water leakage caused by welding is avoided.

2. The copper pipe has the advantages of high corrosion resistance, high conductivity, high heat absorption speed, uniform electric field and the like, so that the equipment is stable in performance and better in cleaning effect.

Drawings

FIG. 1 is a schematic diagram of a roll-to-roll plasma processing system according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a roll-to-roll plasma processing system according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of the interior of a roll-to-roll plasma processing system according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of the interior of a roll-to-roll plasma processing system according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a discharging and feeding chamber and a plasma cleaning chamber of a roll-to-roll plasma processing system according to an embodiment of the present invention;

FIG. 6 is a schematic diagram of a plasma cleaning chamber and operation of a roll-to-roll plasma processing system according to an embodiment of the present invention;

FIG. 7 is a schematic diagram of a copper tube embedded plate structure of a roll-to-roll ion processing system;

FIG. 8 is another perspective view of FIG. 7;

fig. 9 is another perspective view of fig. 5.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The invention provides a roll-to-roll plasma processing system, which is used for roll-to-roll processing of FPC (flexible printed circuit) of a circuit board, surface activation and glue removal of a roll material, and is mainly applied to the fields of flexible circuit boards, roll plastic and roll cloth. As shown in fig. 1 and 2, the plasma processing system comprises a machine body 1, a feeding and receiving cavity 2, a plasma cleaning cavity 3, a copper pipe embedded polar plate 31, a touch screen 4 and an alarm lamp 5. Wherein, blowing and receiving chamber 2 and plasma cleaning chamber 3 are located organism 1 inside, and touch-sensitive screen 4 and alarm lamp 5 are located organism 1 surface, and the embedded polar plate 31 of copper pipe is located plasma cleaning chamber 3.

Further, organism 1 shape is the rectangle, and the material is aluminum alloy or iron, and inside is provided with two main cavitys, is blowing and receives material chamber 2 and plasma cleaning chamber 3 respectively, and alarm lamp 5 sets up in the organism top, and touch-sensitive screen 4 and control button set up on the other surface of organism 1 in plasma cleaning chamber 3, and control button is located touch-sensitive screen 4 below. The bottom of the machine body 1 is also provided with a plurality of supporting frames and universal wheels.

Further, a plurality of baffles 11 are arranged below the machine body 1, the baffles 11 are connected with the machine body through screws and used for sealing a storage bin (not shown in the figure) below the plasma cleaning chamber 3 and the material discharging and receiving chamber 2, the storage bin is used for storing electric elements and is in a locking state at ordinary times, and the electric elements can be unlocked for checking when the built-in electric elements need to be maintained or checked. In addition, the storage bin is not communicated with the plasma cleaning cavity 3 and the discharging and receiving cavity 2.

Further, the plasma cleaning cavity 3 and the material discharging and receiving cavity 2 are covered by the loose-leaf door 6, the loose-leaf door 6 is connected with the machine body 1 through a loose-leaf binder, the plasma cleaning cavity 3 is provided with one loose-leaf door 6, and the material discharging and receiving cavity 2 is provided with two loose-leaf doors 6. The user can open or close the flap door 6 by a handle provided on the flap door 6.

Further, the material of the loose-leaf door 6 is 6061 aluminum.

Further, the surface of the hinge door 6 is provided with two or more observation windows, the observation window is preferably circular in shape, or can be in other polygons, the material is preferably glass, in order to ensure the sealing performance of the cavity, the joint of the observation window and the hinge door 6 is hermetically welded, through the arrangement of the observation window, a user can observe whether the equipment is in an abnormal state or not when in operation, for example, whether the two sides of the winding drum are asynchronous or unbalanced when the winding board is observed through the observation window positioned in the material discharging and receiving cavity 2, if the two sides of the winding drum are asynchronous or unbalanced, the equipment can be stopped immediately, and the loss is reduced.

Further, as shown in fig. 3 and 4, the receiving bin 21 and the discharging bin 22 are arranged in the discharging and receiving cavity 2, the receiving bin 21 is located at the upper part of the discharging bin 22, the receiving bin 21 and the discharging bin 22 are separated by a partition plate, and the receiving bin 21 and the discharging bin 22 are arranged in the same cavity, so that the size of the equipment can be reduced, and the production cost of the equipment can be reduced.

Furthermore, a slide rail is arranged on the partition board at the top of the discharging bin 22, and the whole receiving bin 21 is connected with the slide rail, so that the receiving bin 21 can be pulled out or put in along the length direction of the receiving bin 21. By arranging the slide rail, the receiving bin 21 can be conveniently put in or taken out.

Further, as shown in fig. 4 and 5, a receiving mechanism 211 is arranged in the receiving bin 21, the receiving mechanism 211 is in a circular shaft shape, the circular shaft can rotate around the central shaft, one end of the circular shaft is fixed on the side plate, the other end of the circular shaft is connected with the bottom plate of the receiving bin 21 through a support, one end of the circular shaft fixed on the side plate is connected with a motor outside the side plate, the motor rotates to drive the receiving mechanism 211 to rotate, and then the processed copper foil is pulled out of the plasma cleaning cavity 3 and is recovered to the receiving mechanism 211.

Further, a discharging mechanism 221 is arranged in the discharging bin 22, the discharging mechanism 221 includes a discharging circular shaft the same as the receiving mechanism 211, and a buffer flat plate is located above the discharging circular shaft, and the buffer flat plate is used for buffering the copper foil to be processed discharged from the discharging circular shaft, so as to prevent the copper foil from being unbalanced and asymmetrical when being conveyed to the plasma cleaning chamber 3.

Further, as shown in fig. 6, the plasma cleaning chamber 3 includes a plurality of copper tube embedded plates 31 arranged in parallel and separated from each other, a mounting bracket 32, a supporting shaft 33, and a plate mounting structure 34.

Further, as shown in fig. 7 and 8, the copper tube embedded plate 31 includes a plate 311 and a copper tube 312, the plate 311 is substantially sheet-shaped, the upper and lower ends of one side extend to form a mounting block with a mounting hole, and is matched with the plate mounting structure 34, a through hole array is processed on the plate 311, and the through hole array may be circular or elongated, or may be a combination of the two or other shapes. In this embodiment, each array unit includes one through round hole and four continuous through elongated round holes, the array units are horizontally arranged, and the through round holes are located at the head or the tail of the array unit. By processing the through hole array on the copper tube embedded polar plate 31, copper foil ions positioned in front of and behind the copper tube embedded polar plate 31 can be fully impacted, impurities can be removed, and the cleaning effect can be enhanced. The copper pipe 312 is embedded on the surface of one side of the polar plate 311 and has an S-shaped trend, and the copper pipe 312 flows in and out from the same side without passing through the through hole. By arranging the copper pipe 312 and introducing water or other cooling agents, heat generated in the plasma cleaning chamber 3 during cleaning can be taken away, and overheating of the equipment can be prevented. In addition, the copper pipe 312 is used for replacing the common aluminum square pipe in the market, so that the water leakage problem can be avoided.

Further, the copper pipe embedded type pole plate 31 is connected with the inner wall of the plasma cleaning chamber 3 through a pole plate mounting structure 34.

Further, the mounting bracket 32 is frame-shaped, through holes for mounting the supporting shafts 33 are formed in the upper edge of the frame and the lower edge of the frame, the supporting shafts 33 are round shafts and can rotate along the central axis of the supporting shafts 33, the number of the supporting shafts 33 is not less than one, and the supporting shafts 33 are arranged to play a role in conveying copper foils.

Further, the number of the copper pipe embedded type polar plates 31 is not less than one, and the copper pipe embedded type polar plates are vertically arranged in the plasma cleaning cavity 3 in parallel side by side.

Further, as shown in FIG. 9, the copper pipe 312 is connected to the other parts in the apparatus after leaving the plasma cleaning chamber 3.

Further, the user may select a corresponding cleaning mode through the touch screen 4.

Further, the warning lamp 5 has three color light sources, red light, yellow light, and green light, respectively. When the equipment runs abnormally, the alarm lamp 5 emits red light and gives an alarm sound; when the equipment normally operates, the alarm lamp 5 emits green light; when the device is in a standby state, the warning lamp emits yellow light.

The equipment operation flow is as follows:

the loose-leaf door 6 is opened, the copper foil 9 is arranged in the discharging mechanism 211 in the discharging bin 21, passes through the copper foil 9 through the strip hole below the partition plate 8, sequentially bypasses the supporting shaft 33, and then passes through the strip hole above the partition plate 8 into the receiving bin 22 and the receiving mechanism 221 in the receiving bin 22, as shown in fig. 6, at this time, the arrangement of the copper foil 9 is completed. And closing the loose-leaf door 6, selecting a proper mode on the touch screen 4, calling parameters, starting a switch, and starting the operation of the equipment. After starting, the plasma cleaning chamber 3 is firstly vacuumized, when the pressure in the plasma cleaning chamber 3 is reduced to 20-30Pa, corresponding industrial gas is filled, ionization is started, ionized ions penetrate through the through holes of the copper tube embedded polar plate 31 and hit the surface of the copper foil 9 to be treated, impurities on the surface of the copper foil 9 are removed, and meanwhile, the copper tube 312 begins to run water to take away heat generated during ionization.

The embodiment of the invention also provides a plasma processing method of the flexible circuit board, which comprises the following steps:

s1, arranging a circuit board: arranging the copper foil 9 in the discharging mechanism 211, penetrating the copper foil 9 through the strip hole below the partition plate 8, sequentially bypassing the support shaft 33, and penetrating the copper foil into the receiving bin 22 and the receiving mechanism 221 in the receiving bin 22 from the strip hole above the partition plate 8;

s2 plasma cleaning: the plasma cleaning cavity 3 is vacuumized to 20-30Pa, industrial gas is filled in the plasma cleaning cavity, ionization is started, ionized ions penetrate through the through holes of the copper tube embedded type polar plate 31 and hit the surface of the copper foil 9 to be treated, impurities on the surface of the copper foil 9 are removed, meanwhile, the copper tube 312 starts to run water, and heat generated during ionization is taken away.

The invention has the following beneficial effects in terms of equipment volume: the material discharging bin and the material receiving bin are integrated in one cavity, so that the volume of the vacuum cavity is reduced, the processing difficulty is reduced, the matching of a vacuum pump set is reduced, the equipment volume is further reduced, and the production cost is greatly reduced; in the prior art, the discharging bin and the receiving bin are divided into two parts, the cavity on the left side is the discharging bin, and the discharging bin and the receiving bin enter the receiving bin of the cavity on the right side after plasma of the vacuum cavity.

In the aspect of the cooling process: the air holes are formed in the whole plate, and the copper pipe is embedded for cooling, so that the plasma cavity is distributed more uniformly, and the integral uniformity is improved. In addition, the whole copper pipe is directly installed, so that the problem of easy water leakage caused by welding is avoided; the copper pipe has the advantages of high corrosion resistance, high conductivity, high heat absorption speed, uniform electric field and the like, so that the equipment is stable in performance and better in cleaning effect.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A roll-to-roll plasma processing system is characterized by comprising a machine body, a discharging and receiving cavity, an equal-ion cleaning cavity and a copper tube embedded type polar plate, wherein the discharging and receiving cavity and the equal-ion cleaning cavity are located in the machine body, and the copper tube embedded type polar plate is located in the equal-ion cleaning cavity.

2. The roll-to-roll plasma processing system of claim 1 wherein the discharge and receive chamber comprises a discharge bin and a receive bin, the discharge bin and the receive bin being located within the same chamber.

3. The roll-to-roll plasma processing system of claim 1 wherein the discharge bin is positioned below the take-up bin, the discharge bin and the take-up bin being separated by a partition.

4. The roll-to-roll plasma processing system of claim 3 wherein a slide rail is mounted above the partition, the take-up bin being slidably connected to the slide rail.

5. The roll-to-roll plasma processing system according to claim 1, wherein the copper tube embedded plate comprises a plate and a copper tube, and the plate is provided with a through hole array consisting of at least one array unit.

6. The roll-to-roll plasma processing system of claim 5 wherein the array unit of the through-hole array comprises one through-hole and four elongated circular holes.

7. The roll-to-roll plasma processing system as recited in claim 5, wherein the copper tubes are arranged in an S-shape on one side of the plate.

8. The roll-to-roll plasma processing system of claim 1 wherein the number of copper tube embedded plates is no less than one, the copper tube embedded plates being arranged in parallel within the plasma cleaning chamber.

9. A roll-to-roll plasma processing system as recited in any of claims 1-8, further comprising a touch screen, a warning light, and a hinged door.

10. A plasma processing method of a flexible circuit board comprises the following steps:

s1, arranging a circuit board: arranging a copper foil in a discharging mechanism, penetrating the copper foil through a strip hole below a partition plate, sequentially bypassing a support shaft, and penetrating the copper foil into a receiving bin and a receiving mechanism in the receiving bin from the strip hole above the partition plate;

s2 plasma cleaning: and vacuumizing the plasma cleaning cavity to 20-30Pa, filling industrial gas, starting ionization, punching ionized ions on the surface of the copper foil to be treated through the through holes of the copper tube embedded type polar plate, removing impurities on the surface of the copper foil, and simultaneously, leading the copper tube to run water to take away heat generated during ionization.