CN112905050B - Display panel, manufacturing method thereof and display device - Google Patents

Display panel, manufacturing method thereof and display device Download PDF

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Publication number
CN112905050B
CN112905050B CN202110186823.8A CN202110186823A CN112905050B CN 112905050 B CN112905050 B CN 112905050B CN 202110186823 A CN202110186823 A CN 202110186823A CN 112905050 B CN112905050 B CN 112905050B
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China
Prior art keywords
substrate
touch
layer
projection
boundary
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CN112905050A (en
Inventor
张则瑞
李仁佑
樊浩原
王子峰
朴叙俊
胡勇
李大利
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The embodiment of the application discloses a display panel, a manufacturing method thereof and a display device. In one embodiment, the display panel includes a substrate on which a display area and a non-display area are formed, the non-display area is provided with a sensing line, and an overlap portion connected to the sensing line is formed at an edge of the substrate; the substrate is also provided with a touch control structure layer comprising a touch control insulating layer and a touch control packaging layer; the projection of the boundary of the touch insulating layer on the substrate is positioned between the projection of the boundary of the lap joint part on the substrate and the projection of the boundary of the touch packaging layer on the substrate. According to the embodiment, the short circuit of the detection line at the position of the lap joint part can be effectively avoided, and the normal implementation of the panel crack detection function is ensured.

Description

Display panel, manufacturing method thereof and display device
Technical Field
The application relates to the technical field of display. And more particularly, to a display panel, a method of manufacturing the same, and a display device.
Background
In the manufacturing process of the display panel, it is common at present to divide the large panel into desired display panels by laser along a cutting path of the display panel after performing a related manufacturing process in the form of the large panel. Because the cut surface film layer structure in the display panel is an SiN x inorganic layer, the SiN x inorganic film layer is easy to crack in the laser cutting process, cracks appear, and the cracks can extend to the inside of the display panel so as to cause adverse phenomena of continuous growth of black spots (Growing Black Spots, GDS) on the display panel, and the like, thereby seriously affecting the image quality and the yield of the display panel.
In the prior art, film cracks were monitored by disposing PCD structures (PANEL CRACK Deterctor, panel detection structures) within the display panel. For example, the PCD structure may comprise a first detection line 100 for detecting image quality and a second detection line 110 for detecting cracks. Currently, in the conventional manufacturing process of the TSP (Touch SCREEN PANEL, touch screen) packaging structure, the etching process of the Touch insulating layer 120 is easy to form a gully 130 at the boundary of the Touch insulating layer 120, so that the materials of the first detection line 100 and the second detection line 110 formed later remain in the gully 130, as shown in fig. 1-2, and further an electrical connection is formed between the first detection line 100 and the second detection line 110 to cause a short circuit, so that the PCD structure is damaged, and the monitoring of the cracks of the display panel cannot be realized.
Disclosure of Invention
The application aims to provide a display panel, a manufacturing method thereof and a display device, which are used for solving at least one of the problems existing in the prior art.
In order to achieve the above purpose, the application adopts the following technical scheme:
the first aspect of the application provides a display panel, comprising a substrate, wherein a display area and a non-display area are formed on the substrate, a detection line is arranged in the non-display area, and a lap joint part connected with the detection line is formed at the edge of the substrate; a touch control structure layer comprising a touch control insulating layer and a touch control packaging layer is formed on the substrate;
the projection of the boundary of the touch insulating layer on the substrate is positioned between the projection of the boundary of the lap joint part on the substrate and the projection of the boundary of the touch packaging layer on the substrate.
According to the display panel provided by the first aspect of the application, the projection of the boundary of the touch insulating layer on the substrate exceeds the projection of the detection line and the projection of the boundary of the lap joint part on the substrate, so that the phenomenon that the etching process of the touch insulating layer is over-etched to form a gully can be prevented, the problem of detection line short circuit caused by the fact that detection line materials remain in the gully can be further solved, the reliability of a Panel Crack Detection (PCD) structure is ensured, and the normal implementation of the panel crack detection function is ensured.
In one possible implementation manner, a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch packaging layer on the substrate is smaller than a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the overlap portion on the substrate.
According to the implementation mode, the distance between the projection of the boundary of the touch insulating layer and the projection of the boundary of the touch packaging layer on the substrate is shortened, so that the crack detection range of the display panel is enlarged and the accuracy and the comprehensiveness of crack detection of the display panel are improved on the premise of ensuring that the risks of short circuit caused by the interconnection between detection lines are avoided.
In one possible implementation manner, a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch packaging layer on the substrate is 40-60 μm.
In one possible implementation, a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch packaging layer on the substrate is 50 μm.
In one possible implementation manner, the touch structure layer further comprises a touch electrode layer, and the detection line and the touch electrode layer are arranged on the same layer.
According to the implementation mode, the touch electrode layer and the detection line are arranged on the same layer, namely, the original film layer material in the display panel and the preparation process are utilized to prepare the detection line, no additional new film layer material is needed, the existing film layer material is utilized to the maximum extent, no influence is caused on the preparation process of the existing display panel, the complexity of the process is not increased, the improvement cost caused by process improvement is not increased, meanwhile, the whole thickness of the display panel is not increased while the detection function is realized, the integration level of the touch display panel is effectively improved, and the light and thin display panel is facilitated.
In one possible implementation, the touch packaging layer is an optical adhesive layer.
According to the implementation mode, the optical adhesive layer is adopted as the touch packaging layer, so that a planarization effect is achieved, meanwhile, the touch insulating layer and the detection line in the touch structural layer are coated and packaged, the touch insulating layer and the detection line are protected, and the film layer in the touch structural layer is prevented from being damaged due to the fact that external moisture and oxygen enter the touch structural layer.
In one possible implementation manner, the display panel further includes a detection chip, and the detection chip leads out a signal line, and the signal line is connected with the detection line through a lap joint portion.
In one possible implementation, the display area of the substrate includes a driving circuit layer including a data line, and the signal line is disposed in the same layer as the data line.
The realization mode is that the data line and the signal line are arranged on the same layer, namely, the original data line layer material and the preparation process in the display panel are utilized to prepare the signal line, a new film layer material is not required to be added, the preparation process of the existing display panel is not influenced, the complexity of the process is not increased, and the modification cost caused by the process modification is not increased; meanwhile, the signal line arranged on the same layer as the data line is connected with the detection line, so that the detection line can be prevented from being bent, and the reliability of the detection line is ensured.
A second aspect of the present application provides a display device comprising a display panel as provided in the first aspect of the present application.
A third aspect of the present application provides a method for manufacturing a display panel, including:
forming a touch insulating layer on a substrate;
Forming a lap joint part at the edge of the substrate and forming a detection line connected with the lap joint part in a non-display area of the substrate, wherein the projection of the boundary of the lap joint part on the substrate is positioned at the inner side of the projection of the boundary of the touch insulating layer on the substrate;
And forming a touch packaging layer, wherein the projection of the boundary of the touch packaging layer on the substrate is positioned at the outer side of the projection of the boundary of the touch insulating layer on the substrate.
The beneficial effects of the application are as follows:
The application provides a display panel, a manufacturing method thereof and a display device, aiming at the technical problems existing in the prior art, wherein the projection of the boundary of a touch insulating layer on a substrate exceeds the projection of a detection line and the boundary of a lap joint part on the substrate in the display panel, so that the problems that a gully is formed due to over etching and other phenomena in the etching process of the touch insulating layer, and detection line materials remain in the gully can be prevented, the detection line short circuit at the lap joint part can be effectively avoided, the reliability of a Panel Crack Detection (PCD) structure is ensured, and the normal implementation of the panel crack detection function is ensured.
Drawings
The following describes the embodiments of the present application in further detail with reference to the drawings.
Fig. 1 is a top view showing a part of the structure of a display panel in the related art.
Fig. 2 is a sectional view showing a part of the structure of a display panel in the related art.
Fig. 3 shows a structural top view of a display panel in an embodiment of the application.
Fig. 4 shows an enlarged view at a in fig. 3.
Fig. 5 shows a structural cross-section at AA' in fig. 4.
Fig. 6 shows a structural cross-section at BB' in fig. 4.
Fig. 7 is a flowchart showing a method for manufacturing a display panel according to an embodiment of the present application.
Fig. 8 to 9 are cross-sectional views of structures corresponding to main steps of a method for manufacturing a display panel according to an embodiment of the present application.
Detailed Description
In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present application and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present application. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
It is further noted that in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The terms "on … …", "formed on … …" and "disposed on … …" as used herein may mean that one layer is formed directly on or disposed on another layer, or that one layer is formed indirectly on or disposed on another layer, i.e., that other layers are present between the two layers.
It should be noted that although the terms "first," "second," etc. may be used herein to describe various elements, components, elements, regions, layers and/or sections, these elements, components, elements, regions, layers and/or sections should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer and/or section from another. Thus, for example, a first component, a first member, a first element, a first region, a first layer, and/or a first portion discussed below could be termed a second component, a second member, a second element, a second region, a second layer, and/or a second portion without departing from the teachings of the present application.
In the present application, unless otherwise indicated, the term "co-layer arrangement" is used to mean that two layers, components, members, elements or portions may be formed by the same manufacturing process (e.g., patterning process, etc.), and that the two layers, components, members, elements or portions are generally formed of the same material. For example, the two or more functional layers are arranged in the same layer, meaning that the functional layers arranged in the same layer may be formed using the same material layer and the same manufacturing process, so that the manufacturing process of the display substrate may be simplified.
In a specific example, the first detection line of the PCD structure for detecting the image quality may be electrically connected to the data line in the display region of the display panel, and when detecting whether or not the display panel has a crack, a detection signal may be applied to the data line through the first detection line, and whether or not the display panel displays a vertical bright line may be detected. It should be noted that, if the display panel has a crack, the first detection line will also break, and then the detection signal of the detection line cannot be transmitted to the data line connected with the first detection line, and at this time, the position of the data line will display a vertical bright line. Therefore, whether the display panel has cracks can be judged by detecting whether the display panel can display vertical bright lines.
In another specific example, the detection of the crack may be achieved by a resistance on the second detection line. For example, when the display panel is cracked, after the second detection line is cracked, the resistance on the second detection line is increased, and once the resistance on the second detection line is detected to be higher than a preset resistance value, the current second detection line is determined to be cracked, so that the display panel is determined to be cracked.
In addition, the black dot (Growing dark spot, GDS) failure becomes the first killer of the product back-end process. The root cause of GDS is the occurrence of film cracks (Crack) that lead to the rupture of the encapsulating film. In the panel electrical (Cell ET) detection stage, if only a slight film crack exists, the TFE film may not have obvious cracks, that is, obvious defects do not exist in the lighting stage, but cracks are worsened in long-term use or high-temperature reliability test, so that the material of an EL layer (electroluminescent layer) is disabled at a later stage, and the risk of scrapping the display panel is caused. If the products with film cracks cannot be screened out in time, the stage consumable materials of the display panel are wasted, and the customer sample delivery is influenced, and the company and the product reputation are influenced.
In the prior art, the manufacturing process of the TSP (Touch screen) package structure is generally that a planarization layer 150 is formed on a substrate 140, then an opening for forming a lap joint 160 is formed on the planarization layer 150, a Touch insulation layer 120 is formed on the planarization layer 150, then the lap joint 160 and a first detection line 100 or a second detection line 110 connected with the lap joint 160 are formed, and finally a Touch packaging layer 170 is formed, as shown in fig. 1-2, a projection of a lower boundary of the Touch insulation layer 120 on the substrate 140 is located on a projection of a boundary of the lap joint 160 on the substrate 140, wherein, as shown in fig. 1, a dotted line area is a projection of the Touch insulation layer 120 on the substrate, and a diagonal line area is a projection of the Touch packaging layer 170 on the substrate. The planarization layer 150 under the touch insulating layer 120 is easily over-etched in the etching process of the touch insulating layer 120 to form a ravines 130 along edges of the touch insulating layer 120, so that materials of the first and second sensing lines 100 and 110 formed later remain in the ravines 130 to cause an electrical connection between the first and second sensing lines 100 and 110 to cause a short circuit.
In view of the existing technical problems, an embodiment of the present application provides a display panel 200, as shown in fig. 3-6, where the display panel 200 includes a substrate 210, a display area and a non-display area are formed on the substrate 210, the display area is a dotted line area in fig. 3, the display area is also called an effective display area (ACTIVE AREA, AA), and a data line 220 is disposed in the display area; the non-display area may be located at the periphery of the display area, which may be used to route various leads, bond driver chips and/or sense chips, and to effect sealing of the display panel 200.
In this embodiment, the non-display area is provided with a detection line 230, and in a specific example, the detection line 230 includes a first detection line 231 and a second detection line 232, where the first detection line 231 and the second detection line 232 are located in the non-display area and are disposed around the display area, and the first detection line 231 is electrically connected with a plurality of data lines 220 in the display area of the display panel 200, when the display panel 200 breaks, the first detection line 231 correspondingly breaks, and at this time, a detection signal cannot be applied to the data lines 220 through the first detection line 231, and at this time, a vertical bright line is displayed at the position of the data lines 220 to prompt that the display panel 200 has a crack; in addition, the crack of the display panel 200 may be displayed by detecting the resistance of the second detection line 232.
In one particular example, the first detection line 231 and the second detection line 232 include serpentine structures (e.g., S-shaped, W-shaped, or Z-shaped traces, etc.). In another specific example, the projection of the first detection line 231 on the substrate 210 may be located outside the projection of the second detection line 232 on the substrate 210, for example, the first detection line 231 may be located at a side of the second detection line 232 away from the display region.
In addition, the edge of the substrate 210 in this embodiment is formed with a lap portion 240 connected to the inspection line 230; in a specific example, as shown in fig. 3, the non-display area on one side of the display panel 200 further includes a bonding area, which may be used for bonding of a flexible circuit board pad, a detection chip, or a driving chip, for example. The lap joint part 240 is formed outside one side of the bonding area close to the display area, and the detection line 230 is electrically connected with the detection chip 250 located in the bonding area through the lap joint part 240 so as to realize transmission of detection signals.
In this embodiment, a touch structure layer including a touch insulating layer 260 and a touch packaging layer 270 is further formed on the substrate 210; the touch insulating layer 260 is used for insulating the plurality of touch electrodes from each other, and the touch packaging layer 270 is used for packaging and protecting the touch insulating layer 260 and the touch electrode layer. The projection of the boundary of the touch insulating layer 260 on the substrate 210 is located between the projection of the boundary of the lap portion 240 on the substrate 210 and the projection of the boundary of the touch packaging layer 270 on the substrate 210. In a specific example, as shown in fig. 3-5, the projection of the lower boundary of the touch insulating layer 260 on the substrate 210 is located between the projection of the lower boundary of the lap joint 240 on the substrate 210 and the projection of the lower boundary of the touch packaging layer 270 on the substrate 210, wherein, as shown by the dotted line area in fig. 4, the projection of the touch insulating layer 260 on the substrate 210 is shown by the diagonal line area in fig. 4, that is, the projection of the touch packaging layer 270 on the substrate 210 covers the projection of the lap joint 240 on the substrate 210, so that, during the manufacturing process of the display panel, when the etching process is performed on the touch insulating layer, no gaps are formed between the openings of the corresponding lap joints in the planarization layer, and no materials of the first detection line and the second detection line remain in the gaps in the subsequent process of forming the first detection line and the second detection line.
It should be noted that the substrate 210 in fig. 2, 5 and 6 of the present application actually refers to a display substrate that completes the front-end process of the back-plane (BP), that is, includes a substrate and other film layers that need to be fabricated before the planarization layer is fabricated, for example, may include a plurality of organic layers, inorganic layers, and the like, and may also include driving circuit structures such as a Thin Film Transistor (TFT), which are not shown in the drawings for the sake of convenience of viewing.
In one specific example, the Touch insulating layer 260 (Touch INTERLAYER DIELECTRIC, TLD) may include an inorganic material such as silicon oxide (SiO x), silicon nitride (SiN x), and/or silicon oxynitride (SiON), and may be formed as a multi-layer or a single layer. Of course, the touch insulating layer 260 may also be made of an organic material. In another specific example, the touch packaging layer 270 is an optical adhesive layer, for example, an optical adhesive with stable and transparent properties such as OC adhesive may be selected. The specific example adopts an optical adhesive layer as the touch packaging layer 270, thereby playing a role in flattening the touch insulating layer 260, the touch electrode layer and the detection line 230, and meanwhile, the touch insulating layer 260, the touch electrode layer and the detection line 230 in the touch structure layer are coated and packaged, so that the touch insulating layer 260, the touch electrode layer and the detection line 230 are protected, and the film layer in the touch structure layer is prevented from being damaged due to the entering of external moisture and oxygen.
The projection of the boundary of the touch insulating layer 260 on the substrate 210 in the display panel 200 provided in this embodiment exceeds the projection of the boundary of the detection line 230 and the overlap portion 240 on the substrate 210, so that the problem that the detection line 230 material remains in the ravines due to the formation of ravines caused by over etching and other phenomena in the etching process of the touch insulating layer 260 can be prevented, the short circuit of the detection line 230 at the position of the overlap portion 240 can be effectively avoided, the reliability of the Panel Crack Detection (PCD) structure is ensured, and the normal implementation of the panel crack detection function is ensured.
In a specific embodiment, the distance between the projection of the boundary of the touch insulating layer 260 on the substrate 210 and the projection of the boundary of the touch packaging layer 270 on the substrate 210 is smaller than the distance between the projection of the boundary of the touch insulating layer 260 on the substrate 210 and the projection of the boundary of the lap portion 240 on the substrate 210, that is, the lower boundary of the touch insulating layer 260 is closer to the boundary of the touch packaging layer 270 than the boundary of the lap portion 240, that is, the coverage area of the touch insulating layer 260 is further enlarged, so that the crack detection range of the display panel 200 is enlarged and the accuracy and the comprehensiveness of the crack detection of the display panel 200 are improved on the premise of ensuring that the risk of the detection lines 230 being connected with each other and causing a short circuit is avoided. In another embodiment, the distance between the projection of the boundary of the touch insulating layer 260 on the substrate 210 and the projection of the boundary of the touch packaging layer 270 on the substrate 210 is 40-60 μm. In yet another specific example, the spacing between the projection of the boundary of the touch insulating layer 260 on the substrate 210 and the projection of the boundary of the touch packaging layer 270 on the substrate 210 is 50 μm.
In a specific embodiment, the touch structure layer further includes a touch electrode layer (not shown) on the touch insulation layer 260, where the touch electrode layer (TSP Metal B, TMB) is used for sensing a touch signal to implement a touch operation; the material of the touch electrode layer may be molybdenum or aluminum, for example. The detection line 230 and the touch electrode layer are disposed on the same layer, that is, the detection line 230 and the touch electrode layer may be manufactured by the same film forming process, or even formed by the same patterning process; it should be noted that the two patterns are located on the same film layer, and the vertical distance between the two patterns and the substrate is not limited to be the same, or the thicknesses of the two patterns must be completely consistent. In a specific example, the material of the detection line 230 is the same as the material of the touch electrode layer, and is a metal or a metal alloy, and specifically, the metal or the metal alloy may be selected from any one or more of molybdenum or aluminum.
In this embodiment, the touch electrode layer and the detection line 230 are arranged on the same layer, that is, the original film layer material and the preparation process in the display panel 200 are used to prepare the detection line 230, no additional new film layer material is needed, the existing film layer material is utilized to the maximum extent, no influence is caused on the preparation process of the existing display panel 200, the complexity of the process is not increased, the modification cost caused by the modification of the process is not increased, the whole thickness of the display panel 200 is not increased while the crack detection function is realized, the integration level of the display panel 200 is effectively improved, and the light and thin display panel 200 is facilitated.
In a specific embodiment, the display panel 200 further includes a detection chip 250, and in one example, the detection chip 250 is located in the bonding area, the detection chip 250 draws a signal line 280, and the signal line 280 is connected to the detection line 230 through the lap portion 240, that is, connected to the detection line 230 through the signal line 280 and the detection line 230, so that the detection chip 250 outputs a detection signal to the detection line 230 to perform crack detection on the display panel 200.
In a specific embodiment, the display region of the substrate 210 includes a driving circuit layer, and in a specific example, the driving circuit layer includes an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, and a source drain metal layer, and a data line 220 disposed in the same layer as the source drain metal layer, wherein the signal line 280 and the data line 220 (or the source drain metal layer) are disposed in the same layer, that is, the signal line 280 and the data line 220 (or the source drain metal layer) may be formed by the same film forming process, or even the same patterning process; in a specific example, the material of the signal line 280 is the same as the material of the data line 220, and is a metal or a metal alloy, and in particular, the metal or the metal alloy may be selected from any one or more of Al, cu, mo, ti.
In this embodiment, the data line 220 and the signal line 280 are arranged in the same layer, that is, the original data line 220 material and the preparation process in the display panel 200 are used for preparing the signal line 280, no new film material is required to be added, no influence is caused on the preparation process of the existing display panel 200, the complexity of the process is not increased, and the modification cost caused by the process modification is not increased; meanwhile, the signal line 280 arranged on the same layer as the data line 220 is connected with the detection line 230, so that the detection line 230 can be prevented from being bent, and the reliability of the detection line 230 is ensured. In yet another specific example, as shown in fig. 6, fig. 6 is a cross-sectional view at BB' in fig. 4, wherein in the dashed line area in fig. 6, the overlapping portion 240 is a step-shaped cross section perpendicular to the substrate 210, so that the wire breakage caused by overlapping of the wire 230 and the overlapping portion 240 can be further avoided, and normal connection between the wire 230 and the wire 250 is ensured.
It should be noted that the cross-sectional view of the display panel shown in fig. 6 is only schematically illustrated, and is mainly for explaining how the detection line 230 is connected to the signal line 280 through the overlap portion 240 and the shape of the overlap portion 240.
Another embodiment of the present application provides a method for manufacturing a display panel 200, as shown in fig. 7, the method includes the following steps:
S101, a touch insulating layer 260 is formed on the substrate 210.
In a specific example, step S101 may include the steps of:
other film layers required for the back-plane (BP) front-end process, i.e., the fabrication before forming the planarization layer 290, include a plurality of organic layers, inorganic layers, etc., and possibly a driving circuit structure of a Thin Film Transistor (TFT), etc., and in a specific example, may include an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, and a source and drain metal layer, and a data line 220 and a signal line 280 for connection with the sensing line 230, which are disposed in the same layer as the source and drain metal layer.
A planarization layer 290 is formed on the substrate 210 where the back-plate (BP) front-end process is completed, and a first opening is formed on the planarization layer 290 through a patterning process to expose the signal line 280. In one embodiment, the material of the planarization layer 290 may be formed using an organic resin, including an acrylic film-forming resin, a phenolic resin-based film-forming resin, a vinyl polymer film-forming resin, or a polyimide film-forming resin.
A touch insulating layer 260 is formed on the planarization layer 290, and a second opening is formed on the touch insulating layer 260 through a patterning process to expose the signal line 280, so as to form a structure as shown in fig. 8.
S102, forming a lap joint part 240 at the edge of the substrate 210 and forming a detection line 230 connected with the lap joint part 240 in a non-display area of the substrate 210, wherein the projection of the boundary of the lap joint part 240 on the substrate 210 is positioned at the inner side of the projection of the boundary of the touch insulation layer 260 on the substrate 210.
Specifically, step S102 includes the steps of:
the sensing line 230 covering the overlap portion 240 on the signal line 280 and connected to the overlap portion 240 is formed, and the sensing line 230 and the touch electrode layer are arranged in the same layer to form a structure as shown in fig. 9, so that connection of the signal line 280 with the first sensing line 231 and the second sensing line 232 is achieved, the projection of the overlap portion 240 on the substrate 210 is located in the projection of the touch insulating layer 260 on the substrate 210, and the lower boundary of the touch insulating layer 260 is located below the lower boundary of the overlap portion 240.
S103, forming a touch packaging layer 270, wherein the projection of the boundary of the touch packaging layer 270 on the substrate 210 is located outside the projection of the boundary of the touch insulating layer 260 on the substrate 210.
Specifically, the touch packaging layer 260 covers the first detection line 231, the second detection line 232, and the touch insulating layer 260, and the lower boundary of the touch packaging layer 270 is located below the lower boundary of the touch insulating layer 260, so as to form the structure shown in fig. 6.
Another embodiment of the present application provides a display device including the display panel 200 provided in the above embodiment. The display device may be any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, etc., which is not limited in this embodiment.
It should be understood that the foregoing examples of the present application are provided merely for clearly illustrating the present application and are not intended to limit the embodiments of the present application, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present application as defined by the appended claims.

Claims (9)

1. A display panel comprises a substrate, wherein a display area and a non-display area are formed on the substrate, a detection line is arranged in the non-display area, and a lap joint part connected with the detection line is formed at the edge of the substrate; a touch control structure layer comprising a touch control insulating layer and a touch control packaging layer is formed on the substrate; the touch control packaging structure is characterized in that the projection of the touch control insulating layer on the substrate covers the projection of the lap joint part on the substrate, and the projection of the boundary of the touch control insulating layer on the substrate is positioned between the projection of the boundary of the lap joint part on the substrate and the projection of the boundary of the touch control packaging layer on the substrate;
The distance between the projection of the boundary of the touch insulating layer on the substrate and the projection of the boundary of the touch packaging layer on the substrate is smaller than the distance between the projection of the boundary of the touch insulating layer on the substrate and the projection of the boundary of the lap joint part on the substrate.
2. The display panel according to claim 1, wherein a distance between a projection of a boundary of the touch insulating layer on the substrate and a projection of a boundary of the touch packaging layer on the substrate is 40-60 μm.
3. The display panel according to claim 2, wherein a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch packaging layer on the substrate is 50 μm.
4. The display panel of claim 1, wherein the touch structure layer further comprises a touch electrode layer, and the detection line is disposed on the same layer as the touch electrode layer.
5. The display panel of claim 1, wherein the touch packaging layer is an optical adhesive layer.
6. The display panel according to claim 1, further comprising a detection chip, the detection chip leading out a signal line, the signal line being connected to the detection line through a lap joint portion.
7. The display panel according to claim 6, wherein the display region of the substrate includes a driving circuit layer including a data line, the signal line being disposed in the same layer as the data line.
8. A display device comprising the display panel according to any one of claims 1-7.
9. A method for manufacturing a display panel, comprising:
forming a touch insulating layer on a substrate;
Forming a lap joint part at the edge of the substrate and forming a detection line connected with the lap joint part in a non-display area of the substrate, wherein the projection of the boundary of the lap joint part on the substrate is positioned at the inner side of the projection of the boundary of the touch insulation layer on the substrate, and the projection of the touch insulation layer on the substrate covers the projection of the lap joint part on the substrate;
And forming a touch packaging layer, wherein the projection of the boundary of the touch packaging layer on the substrate is positioned at the outer side of the projection of the boundary of the touch insulating layer on the substrate, and the distance between the projection of the boundary of the touch insulating layer on the substrate and the projection of the boundary of the touch packaging layer on the substrate is smaller than the distance between the projection of the boundary of the touch insulating layer on the substrate and the projection of the boundary of the lap joint part on the substrate.
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