CN112905050A - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
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Abstract
The embodiment of the application discloses a display panel, a manufacturing method thereof and a display device. In one embodiment, the display panel includes a substrate, a display area and a non-display area are formed on the substrate, a detection line is disposed in the non-display area, and a lap joint portion connected with the detection line is formed at an edge of the substrate; a touch control structure layer comprising a touch control insulating layer and a touch control packaging layer is also formed on the substrate; the projection of the boundary of the touch insulating layer on the substrate is positioned between the projection of the boundary of the lapping part on the substrate and the projection of the boundary of the touch packaging layer on the substrate. This embodiment can effectively avoid the detection line short circuit to appear in overlap joint portion position, guarantees the normal realization of panel crack detection function.
Description
Technical Field
The present application relates to the field of display technology. And more particularly, to a display panel, a method of manufacturing the same, and a display device.
Background
In the manufacturing process of the display panel, after the related preparation process is generally performed in the form of a large plate, the large plate is divided into the required display panels along the cutting path of the display panel by a laser. The surface film layer structure cut in the display panel is SiNxInorganic layer, which is susceptible to SiN during laser cuttingxThe inorganic film layer is cracked and cracked, and the crack extends into the display panel, and then the display panel has a large number of Black dots (GDS), which seriously affects the image quality and yield of the display panel.
In the prior art, a PCD structure (Panel Crack detector) is disposed in a display Panel to monitor cracks in a film layer. For example, the PCD structure may include a first inspection line 100 for inspecting image quality and a second inspection line 110 for inspecting cracks. In the conventional manufacturing process of a TSP (Touch Screen Panel) package structure, a gap 130 is easily formed at the boundary of the Touch insulating layer 120 by an etching process of the Touch insulating layer 120, so that materials of the first and second detection lines 100 and 110 formed later may remain in the gap 130, as shown in fig. 1-2, and thus the first and second detection lines 100 and 110 may be electrically connected to each other to cause a short circuit, which may damage a PCD structure and may not monitor cracks of a display Panel.
Disclosure of Invention
An object of the present application is to provide a display panel, a manufacturing method thereof, and a display device, so as to solve at least one of the problems in the prior art.
In order to achieve the purpose, the following technical scheme is adopted in the application:
the application provides a display panel in a first aspect, which comprises a substrate, wherein a display area and a non-display area are formed on the substrate, a detection line is arranged in the non-display area, and a lap joint part connected with the detection line is formed at the edge of the substrate; a touch control structure layer comprising a touch control insulating layer and a touch control packaging layer is also formed on the substrate;
the projection of the boundary of the touch insulating layer on the substrate is positioned between the projection of the boundary of the lap joint part on the substrate and the projection of the boundary of the touch packaging layer on the substrate.
In the display panel provided by the first aspect of the present application, a projection of a boundary of the touch insulating layer on the substrate exceeds a projection of a detection line and a projection of a boundary of the lap joint part on the substrate, so that a phenomenon of over-etching and the like in an etching process of the touch insulating layer to form a gully can be prevented, and a problem of a short circuit of the detection line caused by a material of the detection line remaining in the gully can be prevented, thereby ensuring reliability of a Panel Crack Detection (PCD) structure and ensuring normal implementation of a panel crack detection function.
In one possible implementation manner, a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch encapsulating layer on the substrate is smaller than a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the lap joint on the substrate.
This implementation mode is through drawing the interval between the projection of the border of drawing close touch-control insulating layer and the border of touch-control encapsulating layer on the base plate to under the prerequisite of the risk of guaranteeing to avoid interconnect and then leading to the short circuit between the detection line, enlarge the crackle detection scope to display panel, improve accuracy and the comprehensiveness of the crackle detection to display panel.
In one possible implementation manner, a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch encapsulating layer on the substrate is 40-60 μm.
In one possible implementation, a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch encapsulating layer on the substrate is 50 μm.
In a possible implementation manner, the touch structure layer further includes a touch electrode layer, and the detection line and the touch electrode layer are disposed on the same layer.
This implementation is through setting up touch-control electrode layer and detection line with the layer, utilize original rete material in the display panel and preparation technology preparation detection line promptly, need not additionally to increase new rete material, the maximize utilizes current rete material, there is not any influence to current display panel's preparation technology, can not increase the complexity of technology, can not increase the transformation cost that the technology transformation brought more, simultaneously when realizing the detection function, can not increase display panel's whole thickness, effectively improve touch-control display panel's integrated level, be favorable to display panel's frivolousization.
In one possible implementation manner, the touch encapsulation layer is an optical adhesive layer.
This implementation mode is through adopting the optics glue film as the touch-control encapsulated layer to play the effect of planarization, the intraformational touch-control insulating layer of cladding touch-control structure and detection line are encapsulated simultaneously, protect touch-control insulating layer and detection line, prevent that external moisture and oxygen from getting into and leading to the intraformational rete of touch-control structure to damage.
In a possible implementation manner, the display panel further includes a detection chip, the detection chip leads out a signal line, and the signal line is connected with the detection line through a lap joint portion.
In one possible implementation manner, the display area of the substrate includes a driving circuit layer, the driving circuit layer includes a data line, and the signal line and the data line are disposed on the same layer.
The data lines and the signal lines are arranged on the same layer, namely the signal lines are prepared by utilizing the original data line layer material and the preparation process in the display panel, no new film layer material is required to be added, the preparation process of the existing display panel is not affected at all, the complexity of the process is not increased, and the modification cost caused by process modification is not increased; meanwhile, the signal line arranged on the same layer as the data line is connected with the detection line, so that the bending of the detection line can be avoided, and the reliability of the detection line is ensured.
A second aspect of the application provides a display device comprising a display panel as provided in the first aspect of the application.
A third aspect of the present application provides a method for manufacturing a display panel, including:
forming a touch insulating layer on a substrate;
forming a lapping part at the edge of the substrate and forming a detection line connected with the lapping part in a non-display area of the substrate, wherein the projection of the boundary of the lapping part on the substrate is positioned at the inner side of the projection of the boundary of the touch insulating layer on the substrate;
and forming a touch packaging layer, wherein the projection of the boundary of the touch packaging layer on the substrate is positioned outside the projection of the boundary of the touch insulating layer on the substrate.
The beneficial effect of this application is as follows:
aiming at the technical problems in the prior art, the application provides a display panel, a manufacturing method thereof and a display device, wherein the projection of the boundary of a touch insulating layer on a substrate exceeds the projection of a detection line and the projection of the boundary of a lap joint part on the substrate, so that the problems that the etching process of the touch insulating layer generates over etching and the like to form gully and further detection line materials are remained in the gully can be prevented, the detection line short circuit at the position of the lap joint part can be effectively avoided, the reliability of a Panel Crack Detection (PCD) structure is ensured, and the normal realization of the panel crack detection function is ensured.
Drawings
The following describes embodiments of the present application in further detail with reference to the accompanying drawings.
Fig. 1 is a top view of a partial structure of a display panel in the related art.
Fig. 2 is a sectional view showing a partial structure of a display panel in the related art.
Fig. 3 illustrates a top view of a display panel in one embodiment of the present application.
Fig. 4 shows an enlarged view at a in fig. 3.
Fig. 5 shows a cross-sectional view of the structure at AA' in fig. 4.
Fig. 6 shows a cross-sectional view of the structure at BB' in fig. 4.
Fig. 7 shows a flowchart of a method for manufacturing a display panel in an embodiment of the present application.
Fig. 8 to 9 are cross-sectional views of structures corresponding to main steps of a method for manufacturing a display panel according to an embodiment of the present application.
Detailed Description
In the description of the present application, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
It is further noted that, in the description of the present application, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The terms "on … …", "on … …" and "disposed on … …" as used herein may mean that one layer is formed or disposed directly on another layer or that one layer is formed or disposed indirectly on another layer, i.e., there is another layer between the two layers.
It should be noted that, although the terms "first", "second", etc. may be used herein to describe various elements, components, elements, regions, layers and/or sections, these elements, components, elements, regions, layers and/or sections should not be limited by these terms. Rather, these terms are used to distinguish one element, component, element, region, layer or section from another. Thus, for example, a first component, a first member, a first element, a first region, a first layer, and/or a first portion discussed below could be termed a second component, a second member, a second element, a second region, a second layer, and/or a second portion without departing from the teachings of the present application.
In this application, unless otherwise indicated, the term "disposed on the same layer" is used to indicate that two layers, components, members, elements or portions may be formed by the same fabrication process (e.g., patterning process, etc.), and the two layers, components, members, elements or portions are generally formed of the same material. For example, two or more functional layers are arranged in the same layer, which means that the functional layers arranged in the same layer can be formed by using the same material layer and using the same manufacturing process, so that the manufacturing process of the display substrate can be simplified.
In a specific example, a first detection line of the PCD structure for detecting image quality may be electrically connected to a data line in a display area of the display panel, and when detecting whether the display panel has a crack, a detection signal may be applied to the data line through the first detection line to detect whether the display panel displays a vertical bright line. It should be noted that, if the display panel has a crack, the first detection line is also broken, and further, the detection signal of the detection line cannot be transmitted to the data line connected to the first detection line, and at this time, the position of the data line displays a vertical bright line. Therefore, whether the display panel cracks can be judged by detecting whether the display panel can display the vertical bright lines.
In another specific example, the crack detection may be accomplished by a resistance on the second inspection line. For example, when the display panel cracks and the second detection line breaks, the resistance of the second detection line increases, and once the resistance of the second detection line is detected to be higher than a preset resistance value, it can be determined that the current second detection line breaks, and thus it is determined that the display panel breaks.
In addition, the black spot (GDS) defect is the first killer of the product post-stage process. The root cause of GDS is the occurrence of film cracking (Crack), leading to cracking of the encapsulation film. In the panel electrical (Cell ET) detection stage, if there is only a slight film crack, the TFE film may not have obvious crack, that is, no obvious defect occurs in the lighting stage, but in long-term use or high-temperature reliability test, the crack may be deteriorated, thereby causing the material failure of the EL layer (electroluminescent layer) in the later stage, and causing the risk of display panel rejection. If the products with film cracks cannot be screened out in time, the stage consumables of the display panel are wasted, and the customer sample sending is influenced, and the company and the product credit are influenced.
In the prior art, a manufacturing process of a TSP (Touch Screen Panel) package structure generally includes forming a planarization layer 150 on a substrate 140, forming an opening for forming a landing part 160 on the planarization layer 150, forming a Touch insulating layer 120 on the planarization layer 150, then forming the landing part 160 and a first sensing line 100 or a second sensing line 110 connected to the landing part 160, and finally forming a Touch encapsulation layer 170, as shown in fig. 1-2, a projection of a lower boundary of the Touch insulating layer 120 on the substrate 140 in the prior art is located on a projection of a boundary of the landing part 160 on the substrate 140, wherein, as shown in fig. 1, a dotted line region is a projection of the Touch insulating layer 120 on the substrate, and a diagonal line region is a projection of the Touch encapsulation layer 170 on the substrate. The planarization layer 150 under the touch insulating layer 120 is easily over-etched in the etching process for the touch insulating layer 120 to form the trenches 130 along the edges of the touch insulating layer 120, so that the materials of the first and second sensing lines 100 and 110 formed later may remain in the trenches 130, thereby forming an electrical connection between the first and second sensing lines 100 and 110 and causing a short circuit.
To solve the technical problems existing at present, an embodiment of the present application provides a display panel 200, as shown in fig. 3-6, the display panel 200 includes a substrate 210, a display Area and a non-display Area are formed on the substrate 210, the display Area is a dotted Area in fig. 3, the display Area is also called an Active Area (AA), and a data line 220 is disposed in the display Area; the non-display region may be located at the periphery of the display region, and the non-display region may be used to route various wires, bond the driving chip and/or the detecting chip, and achieve sealing of the display panel 200.
In this embodiment, the non-display area is provided with a detection line 230, in a specific example, the detection line 230 includes a first detection line 231 and a second detection line 232, the first detection line 231 and the second detection line 232 are located in the non-display area and are arranged around the display area, wherein the first detection line 231 is electrically connected with a plurality of data lines 220 in the display area of the display panel 200, when the display panel 200 is broken, the first detection line 231 is correspondingly broken, and at this time, a detection signal cannot be applied to the data lines 220 through the first detection line 231, and at this time, a vertical bright line is displayed at the position of the data lines 220 to prompt the display panel 200 to have a crack; in addition, the crack of the display panel 200 can be detected by detecting the resistance of the second detection line 232.
In one specific example, the first sensing line 231 and the second sensing line 232 include a serpentine structure (e.g., S-shaped, W-shaped, or Z-shaped traces, etc.). In another specific example, the projection of the first sensing line 231 on the substrate 210 may be located outside the projection of the second sensing line 232 on the substrate 210, for example, the first sensing line 231 may be located at a side of the second sensing line 232 away from the display area.
In addition, the edge of the substrate 210 in this embodiment is formed with a lap portion 240 connected to the sensing line 230; in a specific example, as shown in fig. 3, the non-display area on one side of the display panel 200 further includes a bonding area, which may be used for bonding a pad of a flexible circuit board, a sense chip, or a driving chip, for example. The bonding portion 240 is formed outside a side of the bonding region close to the display region, and the sensing line 230 is electrically connected to the sensing chip 250 located in the bonding region through the bonding portion 240 to transmit a sensing signal.
In this embodiment, a touch structure layer including a touch insulating layer 260 and a touch encapsulation layer 270 is further formed on the substrate 210; the touch insulating layer 260 is used for insulating the touch electrodes from each other, and the touch encapsulating layer 270 is used for protecting the touch insulating layer 260 and the touch electrode layer from being encapsulated. The projection of the boundary of the touch insulating layer 260 on the substrate 210 is located between the projection of the boundary of the bonding part 240 on the substrate 210 and the projection of the boundary of the touch encapsulating layer 270 on the substrate 210. In one specific example, as shown in fig. 3-5, the projection of the lower boundary of the touch insulating layer 260 on the substrate 210 is located between the projection of the lower boundary of the landing part 240 on the substrate 210 and the projection of the lower boundary of the touch encapsulation layer 270 on the substrate 210, wherein, the dotted area in fig. 4 is the projection of the touch insulating layer 260 on the substrate 210, the diagonal line area in fig. 4 is the projection of the touch encapsulation layer 270 on the substrate 210, that is, the projection of the touch insulation layer 260 on the substrate 210 covers the projection of the bonding part 240 on the substrate 210, so that, in the manufacturing process of the display panel, when the touch insulating layer is etched, no gully is formed between the openings of the corresponding overlapping portions in the planarization layer, and no material of the first and second sensing lines remains in the gully in the subsequent process of forming the first and second sensing lines.
It should be noted that the substrate 210 in fig. 2, 5 and 6 of the present application actually refers to a display substrate that has completed the front-end process of the Back Plane (BP), i.e., includes a substrate and other layers that need to be fabricated before fabricating the planarization layer, for example, may include a plurality of organic layers, inorganic layers, etc., and may further include driving circuit structures such as Thin Film Transistors (TFTs), which are not shown in the drawings for the convenience of viewing.
In one specific example, the Touch Interlayer Dielectric (TLD) 260 may include, for example, silicon oxide(SiOx) Silicon nitride (SiN)x) And/or silicon oxynitride (SiON), and may be formed as multiple layers or a single layer. Of course, the touch insulating layer 260 may also be made of an organic material. In another embodiment, the touch packaging layer 270 is an optical adhesive layer, such as an OC adhesive, which is stable and transparent. This specific example uses the optical adhesive layer as the touch encapsulation layer 270, so as to flatten the touch insulation layer 260, the touch electrode layer and the detection line 230, and at the same time, the optical adhesive layer covers and encapsulates the touch insulation layer 260, the touch electrode layer and the detection line 230 in the touch structure layer, so as to protect the touch insulation layer 260, the touch electrode layer and the detection line 230, and prevent the film layer in the touch structure layer from being damaged due to the entry of external moisture and oxygen.
In the display panel 200 provided in this embodiment, the projection of the boundary of the touch insulating layer 260 on the substrate 210 exceeds the projection of the detection line 230 and the projection of the boundary of the bridging portion 240 on the substrate 210, so that it is possible to prevent the occurrence of gaps due to over-etching in the etching process of the touch insulating layer 260 and the like, and further to prevent the material of the detection line 230 from remaining in the gaps, and to effectively prevent the detection line 230 from being short-circuited at the position of the bridging portion 240, thereby ensuring the reliability of the Panel Crack Detection (PCD) structure and ensuring the normal implementation of the panel crack detection function.
In a specific embodiment, a distance between a projection of the boundary of the touch insulating layer 260 on the substrate 210 and a projection of the boundary of the touch encapsulating layer 270 on the substrate 210 is smaller than a distance between a projection of the boundary of the touch insulating layer 260 on the substrate 210 and a projection of the boundary of the landing part 240 on the substrate 210, that is, a lower boundary of the touch insulating layer 260 is closer to the boundary of the touch encapsulating layer 270 than the boundary of the landing part 240, that is, the coverage area of the touch insulating layer 260 is further enlarged, so that on the premise of ensuring that the risk of short circuit caused by interconnection between the detection lines 230 is avoided, the crack detection range of the display panel 200 is enlarged, and the accuracy and the comprehensiveness of crack detection of the display panel 200 are improved. In another specific embodiment, the distance between the projection of the boundary of the touch insulating layer 260 on the substrate 210 and the projection of the boundary of the touch encapsulation layer 270 on the substrate 210 is 40-60 μm. In yet another specific example, a distance between a projection of the boundary of the touch insulating layer 260 on the substrate 210 and a projection of the boundary of the touch encapsulation layer 270 on the substrate 210 is 50 μm.
In one embodiment, the touch structure layer further includes a touch electrode layer (not shown) on the touch insulating layer 260, and the touch electrode layer (TSP Metal B, TMB) is used for sensing a touch signal to implement a touch operation; the material of the touch electrode layer may be molybdenum or aluminum, for example. The detection lines 230 and the touch electrode layer are disposed on the same layer, that is, the detection lines 230 and the touch electrode layer can be manufactured by the same film forming process, or even formed by the same composition process; it should be noted that the two patterns are located on the same film layer, and it is not limited that the two patterns are located at the same vertical distance from the substrate, or the thicknesses of the two patterns must be completely the same. In a specific example, the material of the detection line 230 is the same as that of the touch electrode layer, and is a metal or a metal alloy, and specifically, the metal or the metal alloy may be selected from any one or more of molybdenum or aluminum.
Through setting up touch-control electrode layer and detection line 230 with the layer in this embodiment, utilize original rete material in display panel 200 and preparation technology preparation detection line 230 promptly, need not additionally to increase new rete material, the maximize utilizes current rete material, there is not any influence to current display panel 200's preparation technology, can not increase the complexity of technology, can not increase the transformation cost that the technology transformation brought more, simultaneously when realizing the crack detection function, can not increase display panel 200's whole thickness, effectively improve display panel 200's integrated level, be favorable to display panel 200's frivolousization.
In a specific embodiment, the display panel 200 further includes a detection chip 250, in one example, the detection chip 250 is located in the bonding area, the detection chip 250 leads out a signal line 280, and the signal line 280 is connected to the detection line 230 through a lap 240, that is, connected to the detection line 230 through the signal line 280, so that the detection chip 250 outputs a detection signal to the detection line 230 to perform crack detection on the display panel 200.
In a specific embodiment, the display region of the substrate 210 includes a driving circuit layer, in a specific example, the driving circuit layer includes an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, a source drain metal layer, and a data line 220 disposed on the same layer as the source drain metal layer, wherein the signal line 280 is disposed on the same layer as the data line 220 (or the source drain metal layer), that is, the signal line 280 and the data line 220 (or the source drain metal layer) may be formed by the same film forming process, or even formed by the same composition process; in a specific example, the material of the signal line 280 is the same as the material of the data line 220, and is a metal or a metal alloy, and specifically, the metal or the metal alloy may be selected from any one or more of Al, Cu, Mo, and Ti.
In the embodiment, the data lines 220 and the signal lines 280 are arranged on the same layer, that is, the signal lines 280 are prepared by using the original data line 220 material and the preparation process in the display panel 200, no new film material is required to be added, the preparation process of the existing display panel 200 is not affected at all, the complexity of the process is not increased, and the modification cost caused by process modification is not increased; meanwhile, the signal line 280 disposed on the same layer as the data line 220 is connected to the sensing line 230, so that the bending of the sensing line 230 can be prevented, and the reliability of the sensing line 230 can be ensured. In yet another specific example, as shown in fig. 6, fig. 6 is a cross-sectional view at BB' of fig. 4, wherein a dotted line area in fig. 6 is a lap joint portion 240, and a cross section of the lap joint portion 240 perpendicular to the substrate 210 is stepped, so as to further avoid the wire breakage of the sensing wires 230 and the lap joint portion 240, and ensure the normal connection of the sensing wires 230 and the sensing chips 250.
It should be noted that the cross-sectional view of the display panel shown in fig. 6 is only a schematic illustration, and mainly illustrates how the detection lines 230 are connected to the signal lines 280 through the bridging portions 240 and the shape of the bridging portions 240.
Another embodiment of the present application provides a method for manufacturing a display panel 200, as shown in fig. 7, the method includes the following steps:
s101, a touch insulating layer 260 is formed on the substrate 210.
In a specific example, step S101 may include the steps of:
other film layers required to be formed before the formation of the planarization layer 290, that is, other film layers required to be formed before the formation of the Back Plane (BP) on the substrate 210, include a plurality of organic layers, inorganic layers, and the like, and may further include a driving circuit structure such as a Thin Film Transistor (TFT), and in a specific example, may include an active layer, a gate insulating layer, a gate metal layer, an interlayer insulating layer, a source/drain metal layer, and a data line 220 and a signal line 280 for connecting to the detection line 230, which are disposed on the same layer as the source/drain metal layer.
A planarization layer 290 is formed on the substrate 210 after the Back Plane (BP) front-end process is completed, and a first opening is formed on the planarization layer 290 through a patterning process to expose the signal line 280. In one embodiment, the material of the planarization layer 290 may be formed using an organic resin, and the organic resin may include an acrylic film-forming resin, a phenolic resin-based film-forming resin, a vinyl polymer film-forming resin, or a polyimide film-forming resin.
A touch insulating layer 260 is formed on the planarization layer 290, and a second opening is formed on the touch insulating layer 260 through a patterning process to expose the signal line 280, so as to form the structure shown in fig. 8.
S102, forming a bonding pad 240 at an edge of the substrate 210 and forming a detection line 230 connected to the bonding pad 240 in a non-display region of the substrate 210, wherein a projection of a boundary of the bonding pad 240 on the substrate 210 is located inside a projection of a boundary of the touch insulating layer 260 on the substrate 210.
Specifically, step S102 includes the steps of:
the sensing lines 230 covering the connection of the landing part 240 on the signal line 280 and the landing part 240 are formed, the sensing lines 230 and the touch electrode layer are disposed in the same layer to form a structure as shown in fig. 9, so that the connection of the signal line 280 and the first and second sensing lines 231 and 232 is achieved, the projection of the landing part 240 on the substrate 210 is located in the projection of the touch insulating layer 260 on the substrate 210, and the lower boundary of the touch insulating layer 260 is located below the lower boundary of the landing part 240.
S103, forming a touch encapsulation layer 270, wherein a projection of a boundary of the touch encapsulation layer 270 on the substrate 210 is located outside a projection of a boundary of the touch insulation layer 260 on the substrate 210.
Specifically, the touch encapsulation layer 260 covers the first sensing lines 231, the second sensing lines 232 and the touch insulation layer 260, and the lower boundary of the touch encapsulation layer 270 is located below the lower boundary of the touch insulation layer 260 to form the structure shown in fig. 6.
Another embodiment of the present application provides a display device including the display panel 200 as provided in the above embodiment. The display device may be any product or component having a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator, which is not limited in this embodiment.
It should be understood that the above-mentioned examples are given for the purpose of illustrating the present application clearly and not for the purpose of limiting the same, and that various other modifications and variations of the present invention may be made by those skilled in the art in light of the above teachings, and it is not intended to be exhaustive or to limit the invention to the precise form disclosed.
Claims (10)
1. A display panel comprises a substrate, wherein a display area and a non-display area are formed on the substrate, a detection line is arranged in the non-display area, and a lap joint part connected with the detection line is formed at the edge of the substrate; a touch control structure layer comprising a touch control insulating layer and a touch control packaging layer is also formed on the substrate; the projection of the boundary of the touch insulating layer on the substrate is positioned between the projection of the boundary of the lap joint part on the substrate and the projection of the boundary of the touch packaging layer on the substrate.
2. The display panel according to claim 1, wherein a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch encapsulating layer on the substrate is smaller than a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the landing part on the substrate.
3. The display panel according to claim 1, wherein a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch encapsulating layer on the substrate is 40-60 μm.
4. The display panel according to claim 3, wherein a distance between a projection of the boundary of the touch insulating layer on the substrate and a projection of the boundary of the touch encapsulating layer on the substrate is 50 μm.
5. The display panel of claim 1, wherein the touch structure layer further comprises a touch electrode layer, and the detection lines are disposed on the same layer as the touch electrode layer.
6. The display panel of claim 1, wherein the touch encapsulation layer is an optical glue layer.
7. The display panel according to claim 1, further comprising a detection chip, wherein the detection chip leads out a signal line, and the signal line is connected to the detection line through a lap joint portion.
8. The display panel according to claim 7, wherein the display region of the substrate includes a driving circuit layer including data lines, and the signal lines are disposed on the same layer as the data lines.
9. A display device characterized by comprising the display panel according to any one of claims 1 to 8.
10. A method for manufacturing a display panel is characterized by comprising the following steps:
forming a touch insulating layer on a substrate;
forming a lapping part at the edge of the substrate and forming a detection line connected with the lapping part in a non-display area of the substrate, wherein the projection of the boundary of the lapping part on the substrate is positioned at the inner side of the projection of the boundary of the touch insulating layer on the substrate;
and forming a touch packaging layer, wherein the projection of the boundary of the touch packaging layer on the substrate is positioned outside the projection of the boundary of the touch insulating layer on the substrate.
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