CN112904169A - Universal single event effect test system for high-power diode and triode - Google Patents

Universal single event effect test system for high-power diode and triode Download PDF

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Publication number
CN112904169A
CN112904169A CN202110064653.6A CN202110064653A CN112904169A CN 112904169 A CN112904169 A CN 112904169A CN 202110064653 A CN202110064653 A CN 202110064653A CN 112904169 A CN112904169 A CN 112904169A
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module
remote
power supply
triode
single event
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王中旭
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Shaanxi Junpu Xinhang Technology Co ltd
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Shaanxi Junpu Xinhang Technology Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor

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  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention relates to a universal single event effect test system for high-power diodes and triodes, which comprises: the remote control system comprises a remote module, a control module and an instrument measuring module, wherein the remote module is respectively connected with the control module and the instrument measuring module; the control module is used for controlling the instrument measuring module to measure the electrical parameters of the component to be detected according to the remote control signal generated by the remote module; the remote module is used for receiving and storing the measurement data of the instrument measurement module. The universal test system for the high-power diode and the triode is provided with the switch array, realizes the switching of the measuring circuit by controlling the on-off of the switch array, greatly simplifies the circuit design of the instrument measuring module, and can realize the universal use of the diode and the triode.

Description

Universal single event effect test system for high-power diode and triode
Technical Field
The invention belongs to the technical field of integrated circuit chip detection, and particularly relates to a universal single event effect test system for high-power diodes and triodes.
Background
As satellites are increasingly complex, high-performance microelectronic devices are widely applied to satellite systems, and the single-particle radiation effect caused by high-energy particles such as protons, heavy ions and the like in a space environment can seriously threaten aerospace components, such as single-particle upset of a memory, single-particle functional interruption of a microprocessor, single-particle burnout and grid penetration of a field effect tube and the like.
When single event effects cause logic upsets in spacecraft control systems, catastrophic consequences may result. Therefore, the single event effect is another main space environment effect threatening the safety of the spacecraft after the plasma charging effect, and the damage of the single event effect is more serious as the system complexity and the device integration level of the spacecraft are higher and higher.
The diode and the triode device are used as important components of an electronic system of a spacecraft, and the single event effect of the diode and the triode device needs to be evaluated before aerospace application. At present, the single event effect detection test of the diode and the triode generally needs to use special experimental equipment and can not realize the universality of the diode and the triode.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a universal single event effect test system for high-power diodes and triodes. The technical problem to be solved by the invention is realized by the following technical scheme:
the invention provides a universal single event effect test system for high-power diodes and triodes, which comprises: a remote module, a control module and an instrument measurement module, wherein,
the remote module is respectively connected with the control module and the instrument measuring module, and the control module is connected with the instrument measuring module;
the control module is used for controlling the instrument measuring module to measure the electrical parameters of the component to be detected according to the remote control signal generated by the remote module;
the remote module is used for receiving and storing the measurement data of the instrument measuring module.
In an embodiment of the present invention, the testing system further includes a power module, and the power module is respectively connected to the remote module and the control module;
the power supply module is used for supplying power to the control module;
the remote module is also used for remotely adjusting the voltage of the power supply module.
In one embodiment of the invention, the control module comprises an upper computer communication unit, a control unit, a relay driving unit and a switch array which are connected in sequence, wherein,
the upper computer communication unit is connected with the remote module and is used for realizing signal transmission between the remote module and the control module;
the control unit is used for controlling the relay driving unit to realize the on-off of the switch array according to the remote control signal;
the switch array is connected with the instrument measuring module.
In an embodiment of the invention, the upper computer communication unit is an RS232 interface, and signal transmission with the remote module is realized through a UART.
In one embodiment of the invention, the control unit is an FPGA-based control unit.
In one embodiment of the present invention, the instrument measurement module comprises a first adjustable dc power supply, a second adjustable dc power supply, and an ammeter,
the first adjustable direct current power supply, the second adjustable direct current power supply and the ammeter are all connected with the switch array;
the first adjustable direct current power supply is used for providing reverse bias voltage for the diode to be tested;
the second adjustable direct current power supply is used for providing grid electrode breakover voltage for the triode to be tested;
the ammeter is used for measuring the current passing through the component to be detected.
In one embodiment of the present invention, the remote module is respectively connected to the first adjustable dc power supply, the second adjustable dc power supply and the ammeter;
the remote module is further configured to remotely adjust the voltage of the first adjustable dc power supply and the second adjustable dc power supply.
In an embodiment of the present invention, the testing system further includes a device carrying structure, the device carrying structure is used for placing a plurality of devices to be tested, and the devices to be tested are diodes or triodes.
Compared with the prior art, the invention has the beneficial effects that:
1. the universal test system for the high-power diode and the triode is provided with the switch array, and switching of the measuring circuit is realized by controlling on-off of the switch array, so that the circuit design of the instrument measuring module is greatly simplified, and the universal test system for the diode and the triode can be realized;
2. according to the universal test system for the high-power diode and the triode, the bearing structure of the device can be used for placing a plurality of components to be detected, and the on-off of the switch array can be controlled through the remote control signal sent by the remote module, so that the independent test of each component to be detected is realized;
3. the universal test system for the high-power diode and the triode can remotely adjust the voltage of the first adjustable direct-current power supply and the voltage of the second adjustable direct-current power supply through the remote module so as to adapt to the test requirements of components of different types;
4. the universal test system for the high-power diode and the triode can completely record and store test data of each component to be detected when the component to be detected is tested, and facilitates subsequent data analysis and use.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
FIG. 1 is a schematic structural diagram of a single event effect testing system for a high-power diode and a triode provided by an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a control module according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of another single event effect testing system for high-power diodes and triodes according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a measurement principle provided by an embodiment of the present invention.
Detailed Description
In order to further explain the technical means and effects of the present invention adopted to achieve the predetermined purpose, the following describes in detail a single event effect testing system for general purpose of high power diodes and triodes according to the present invention with reference to the accompanying drawings and the detailed embodiments.
The foregoing and other technical matters, features and effects of the present invention will be apparent from the following detailed description of the embodiments, which is to be read in connection with the accompanying drawings. The technical means and effects of the present invention adopted to achieve the predetermined purpose can be more deeply and specifically understood through the description of the specific embodiments, however, the attached drawings are provided for reference and description only and are not used for limiting the technical scheme of the present invention.
Example one
Referring to fig. 1, fig. 1 is a schematic structural diagram of a single event effect testing system for a high-power diode and a triode according to an embodiment of the present invention. As shown in the figure, the single event effect testing system for the high-power diode and the triode of the embodiment comprises: a remote module 1, a control module 2 and an instrument measurement module 3, wherein,
the remote module 1 is respectively connected with the control module 2 and the instrument measuring module 3, and the control module 2 is connected with the instrument measuring module 3;
the control module 2 is used for controlling the instrument measuring module 3 to measure the electrical parameters of the component to be detected according to the remote control signal generated by the remote module 1;
the remote module 1 is used for receiving and storing the measurement data of the instrument measuring module 3.
In this embodiment, the remote module 1 is a computer, different test schemes are preset in the computer, different test schemes can be selected according to different requirements, the computer control software generates and sends a remote control signal according to the selected test scheme, and the control module 2 controls the instrument measurement module 3 to measure the component to be detected according to the received remote control signal, so as to complete a single event effect test of the component to be detected.
Further, the universal single event effect test system for the high-power diode and the triode of the embodiment further comprises a power module 4, wherein the power module 4 is respectively connected with the remote module 1 and the control module 2; the power supply module 4 is used for supplying power to the control module 2; the remote module 1 is also used for remotely adjusting the voltage of the power supply module 4.
Further, the single event effect testing system for the high-power diode and the triode of the embodiment further comprises a device bearing structure 5, wherein the device bearing structure 5 is used for placing a plurality of components to be detected, and in the embodiment, the components to be detected are diodes or triodes. It should be noted that each test can only test the components of the same type. The test system of the embodiment can test 4 components to be tested in one test process.
The universal test system for the high-power diode and the triode can completely record and store test data of each component to be detected when the component to be detected is tested, and facilitates subsequent data analysis and use.
Further, please refer to fig. 2, wherein fig. 2 is a schematic structural diagram of a control module according to an embodiment of the present invention. As shown in the figure, in the control module 2 of this embodiment, the control module 2 includes an upper computer communication unit 201, a control unit 202, a relay driving unit 203, and a switch array 204, which are connected in sequence, where the upper computer communication unit 201 is connected with the remote module 1, and the upper computer communication unit 201 is used for implementing signal transmission between the remote module 1 and the control module 2; the control unit 202 is used for controlling the relay driving unit 203 to realize the on-off of the switch array 204 according to the remote control signal; the switch array 204 is connected to the instrumentation module 3.
In this embodiment, the power module 4 is a single-channel DC-DC switching regulator of model LMZ31710, and has an input voltage range of 2.95V-17V and an output voltage range of 0.6V-5.5V, which are adjustable and respectively supply power to the upper computer communication unit 201, the control unit 202, the relay driving unit 203, and the switch array 204.
Further, referring to fig. 3, fig. 3 is a schematic structural diagram of another single event effect testing system for a high-power diode and a triode according to an embodiment of the present invention. As shown in the figure, in the present embodiment, the upper computer communication unit 201 is an RS232 interface, and realizes signal transmission with the remote module 1 through UART. The UART is a mature serial bus communication technology, the protocol adopts TXD and RXD for communication, and the communication protocol is simpler and is easy to operate.
Specifically, the UART first converts received parallel data into serial data for transmission. The message frame starts with a low start bit followed by 5-8 data bits, an available parity bit and one or more high stop bits. When the receiver finds the start bit, the surface data is ready to be transmitted, at which point the receiver attempts to synchronize to the transmitter clock frequency. If parity is selected, the UART may add a parity bit to the data bits, which may be used to assist in error checking.
During reception, the UART removes the start and end bits from the message frame, performs a parity check on the incoming bytes, and converts the data bytes from serial to parallel. The UART also generates additional signals to indicate the status of transmission and reception. For example, if a parity error occurs, the UART may set a parity flag, which may be used to check that the transmission is correct.
In this embodiment, the control unit 202 is an FPGA-based control unit. In particular, an FPGA (field programmable gate array) is a digital logic circuit that can be customized, and by using a hardware description language, such as VHDL or Verilog, a logic circuit that implements a desired function can be generated on demand. The digital logic chip has better execution efficiency than a single chip microcomputer or a CPU, has great flexibility and integration advantages relative to various logic devices with solidified functions, and is very suitable for developing small-batch electronic control circuits.
In this embodiment, the FPGA serves as the core of the control module 2, and provides a bridge for the remote module 1 to communicate with other units in the control module 2. Specifically, a UART communication module is instantiated in the FPGA, the module interacts with the RS232 protocol through the MAX3223, and the FPGA controls the relay driving unit 203 according to a received remote control signal of the remote module 1, so as to achieve the purpose of controlling the on/off of the switch array 204.
Specifically, the relay driving unit 203 switches the switch array 204 on and off through the output signal of the FPGA, and the switch array 204 is a relay group. In the single event effect test process of the diode or the triode, due to the fact that a plurality of items to be measured of the element to be detected are needed, a plurality of different measuring circuits can be used, the relay which is a signal-friendly switch is used for switching the circuits, the design of the instrument measuring module 3 can be greatly simplified, and strong flexibility is provided for the instrument measuring module 3. In this embodiment, the relay driving unit 203 is a DRDNB21D driving chip, which has a very small SOT-363 package, can provide two independent relay drivers simultaneously, and the chip is controlled by a level, and the control method is simple and reliable.
Further, the instrument measurement module 3 includes a first adjustable dc power supply 301, a second adjustable dc power supply 302, and an ammeter 303. The first adjustable direct-current power supply 301, the second adjustable direct-current power supply 302 and the ammeter 303 are connected with the switch array 204; the first adjustable direct current power supply 301 is used for providing reverse bias voltage for the diode to be tested; the second adjustable direct current power supply 302 is used for providing grid conducting voltage for the triode to be tested; the ammeter 303 is used for measuring the current passing through the component to be detected, in this embodiment, the ammeter 303 is used for measuring the reverse current of the diode to be detected; the ammeter 303 is also used for measuring the source-drain current and the gate-source current of the triode to be measured.
In this embodiment, the remote module 1 is connected to the first adjustable dc power supply 301, the second adjustable dc power supply 302, and the ammeter 303 respectively; the remote module 1 is further configured to remotely adjust the voltage of the first adjustable dc power supply 301 and the second adjustable dc power supply 302.
Specifically, the first adjustable dc power supply 301 adopts a keithley instrument, the maximum voltage of which is 5KV, and the current of which is 1mA, and the remote adjustment of the voltage of which by the remote module 1 can be realized through a GPIB interface and an RS232 interface. The second adjustable dc power supply 302 is an agilent dc system power supply, the maximum voltage of which is 30V, and the current of which is 1A, and can remotely adjust the voltage of the remote module 1 through a GPIB interface and a USB interface. The ammeter 303 adopts keithley 6482, the measurement precision of which is 0.1 muA, the resolution is 1fA, the maximum measurement range is 20mA, and data transmission with the remote module 1 can be realized through an IEEE-488 interface and an RS232 interface.
Taking a diode test as an example to explain the measurement principle of the embodiment, please refer to fig. 4, where fig. 4 is a schematic diagram of the measurement principle provided by the embodiment of the present invention, as shown in the figure, the instrument measurement module 3 is connected to a plurality of diodes to be tested, and when measuring the diodes, the relay driving unit 203 controls the on/off of the switch array 204, so as to implement asynchronous power-up of the first adjustable dc power supply 301, to complete that the first adjustable dc power supply 301 sequentially applies reverse bias voltages to the plurality of diodes to be tested, and then sequentially obtains the reverse leakage currents of the diodes to be tested through the ammeter 303.
The measurement principle of the triode is similar to that of the triode, and the difference is that the on-off of the switch array 204 needs to be controlled through the relay driving unit 203 so as to realize that the second adjustable direct-current power supply 302 sequentially provides gate on-voltage for a plurality of triodes to be detected, and then sequentially obtains the gate source current of the triodes to be detected through the ammeter 303.
The specific working process of the universal single event effect test system for the high-power diode and the triode of the embodiment is as follows: 4 components and parts that will need to carry out the test are installed on device bearing structure 5, transfer the test scheme of predetermineeing in the remote module 1 according to actual demand, to the experimental parameter in the test scheme, for example, the voltage size of first adjustable DC power supply 301 or second adjustable DC power supply 302, can utilize remote module 1 to change the adjustment to it according to actual conditions. After the test is started, the remote control signal generated by the remote module 1 is transmitted to the control module 2 through the upper computer communication unit 201, and the control unit 202 controls the relay driving unit 203 to switch on and off the switch array 204 according to the received signal, so that the instrument measuring module 3 can sequentially and independently test 4 components. After the test is finished, the test data of each component to be detected can be recorded and stored in the database of the remote module 1, so that the subsequent data analysis and use are facilitated.
The universal test system for the high-power diode and the triode is provided with the switch array 204, switching of the measuring circuit is achieved by controlling on-off of the switch array 204, circuit design of the instrument measuring module 3 is greatly simplified, and the universal test system for the diode and the triode can be achieved. The device bearing structure 5 that sets up can place a plurality of components and parts of waiting to detect, can pass through the break-make of remote control signal control switch array 204 that remote module 1 sent to realize every independent test of waiting to detect components and parts, in addition, also can carry out remote adjustment in the voltage to first adjustable DC power supply 301 and second adjustable DC power supply 302 through remote module 1, with the experimental demand that adapts to different model components and parts.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of additional like elements in the article or device comprising the element. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.

Claims (8)

1. A kind of high-power diode, triode general single event effect test system, characterized by that, including: a remote module (1), a control module (2) and an instrument measurement module (3), wherein,
the remote module (1) is respectively connected with the control module (2) and the instrument measuring module (3), and the control module (2) is connected with the instrument measuring module (3);
the control module (2) is used for controlling the instrument measuring module (3) to measure the electrical parameters of the component to be detected according to the remote control signal generated by the remote module (1);
the remote module (1) is used for receiving and storing the measurement data of the instrument measuring module (3).
2. The universal single event effect test system for high-power diodes and triodes according to claim 1, characterized in that the test system further comprises a power module (4), wherein the power module (4) is respectively connected with the remote module (1) and the control module (2);
the power supply module (4) is used for supplying power to the control module (2);
the remote module (1) is also used for remotely adjusting the voltage of the power supply module (4).
3. The single event effect test system for the high-power diode and the triode of claim 1, wherein the control module (2) comprises an upper computer communication unit (201), a control unit (202), a relay driving unit (203) and a switch array (204) which are connected in sequence, wherein,
the upper computer communication unit (201) is connected with the remote module (1), and the upper computer communication unit (201) is used for realizing signal transmission between the remote module (1) and the control module (2);
the control unit (202) is used for controlling the relay driving unit (203) to realize the on-off of the switch array (204) according to the remote control signal;
the switch array (204) is connected with the instrument measuring module (3).
4. The single event effect test system for the universal use of the high-power diode and the triode according to claim 3, wherein the upper computer communication unit (201) is an RS232 interface and realizes signal transmission with the remote module (1) through UART.
5. The single event effect testing system for high power diodes and triodes in general according to claim 3, wherein the control unit (202) is an FPGA-based control unit.
6. The single event effect testing system for high power diode and triode of claim 3, wherein the instrument measurement module (3) comprises a first adjustable DC power supply (301), a second adjustable DC power supply (302) and an ammeter (303), wherein,
the first adjustable direct current power supply (301), the second adjustable direct current power supply (302) and the ammeter (303) are connected with the switch array (204);
the first adjustable direct current power supply (301) is used for providing reverse bias voltage for the diode to be tested;
the second adjustable direct current power supply (302) is used for providing grid conduction voltage for the triode to be tested;
the ammeter (303) is used for measuring the current passing through the component to be detected.
7. The single event effect test system for the high-power diode and the triode of claim 6, wherein the remote module (1) is respectively connected with the first adjustable direct current power supply (301), the second adjustable direct current power supply (302) and the ammeter (303);
the remote module (1) is further configured to remotely adjust the voltage of the first adjustable dc power supply (301) and the second adjustable dc power supply (302).
8. The system for testing the single event effect commonly used by the high-power diode and the triode according to claim 1, wherein the testing system further comprises a device bearing structure (5), the device bearing structure (5) is used for placing a plurality of components to be tested, and the components to be tested are diodes or triodes.
CN202110064653.6A 2021-01-18 2021-01-18 Universal single event effect test system for high-power diode and triode Pending CN112904169A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114295951A (en) * 2021-12-16 2022-04-08 扬州大学 Single-particle burnout test platform for power field effect transistor device

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CN106940422A (en) * 2016-11-29 2017-07-11 湘潭大学 A kind of radiation effect universal test system and method for testing
CN107356856A (en) * 2017-06-26 2017-11-17 中国空间技术研究院 A kind of triple channel voltage feedback VDMOS device single particle effect high-precision detection device
CN111812478A (en) * 2020-06-29 2020-10-23 格力电器(郑州)有限公司 Device for selecting rectifier bridge diode during rectifier bridge detection and rectifier bridge detection system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106940422A (en) * 2016-11-29 2017-07-11 湘潭大学 A kind of radiation effect universal test system and method for testing
CN107356856A (en) * 2017-06-26 2017-11-17 中国空间技术研究院 A kind of triple channel voltage feedback VDMOS device single particle effect high-precision detection device
CN111812478A (en) * 2020-06-29 2020-10-23 格力电器(郑州)有限公司 Device for selecting rectifier bridge diode during rectifier bridge detection and rectifier bridge detection system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114295951A (en) * 2021-12-16 2022-04-08 扬州大学 Single-particle burnout test platform for power field effect transistor device
CN114295951B (en) * 2021-12-16 2024-04-26 扬州大学 Single-particle burn-out test platform for power field effect transistor device

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