CN112898910A - Heat-conducting matte black adhesive tape and preparation method thereof - Google Patents
Heat-conducting matte black adhesive tape and preparation method thereof Download PDFInfo
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- CN112898910A CN112898910A CN202110105611.2A CN202110105611A CN112898910A CN 112898910 A CN112898910 A CN 112898910A CN 202110105611 A CN202110105611 A CN 202110105611A CN 112898910 A CN112898910 A CN 112898910A
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 70
- 238000002360 preparation method Methods 0.000 title abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 139
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 53
- 239000000945 filler Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims description 29
- 238000000576 coating method Methods 0.000 claims description 29
- 239000002994 raw material Substances 0.000 claims description 21
- 238000005096 rolling process Methods 0.000 claims description 18
- 239000004848 polyfunctional curative Substances 0.000 claims description 17
- 239000002904 solvent Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- 239000012948 isocyanate Substances 0.000 claims description 13
- 229920002545 silicone oil Polymers 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000011231 conductive filler Substances 0.000 claims description 5
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000002265 prevention Effects 0.000 abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 17
- 150000002513 isocyanates Chemical class 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 7
- 238000002156 mixing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
- C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
- C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/385—Acrylic polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a heat-conducting matte black adhesive tape and a preparation method thereof, wherein the heat-conducting matte black adhesive tape sequentially comprises a matte ink layer, a black ink layer, a PI base material layer, a pressure-sensitive adhesive layer added with heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 1-10 microns, 4.5-100 microns, 1-50 microns and 25-100 microns. The heat-conducting matte black adhesive tape can be quickly prepared, has the effects of shading, fingerprint prevention, scratch prevention and the like, can be viscous, can be used for improving the heat-conducting property of the adhesive tape, and effectively solves the problems that the prior art does not have a heat dissipation effect, is easy to damage components, is short in service life and the like.
Description
Technical Field
The invention belongs to the technical field of adhesive tape preparation, and particularly relates to a heat-conducting matte black adhesive tape and a preparation method thereof.
Background
In electronic terminal products, various materials are required to be shielded or beautified to a certain degree, and under the condition, the surface of the adhesive tape needs to be muted and blackened so as to achieve the effects of shading, preventing fingerprints, preventing scratching and the like. However, as is well known, most electronic product components generate heat in the operation process, and the heat is not led out in time, so that the service life of the components is influenced, and the repair probability of the product is increased. However, the conventional adhesive tape only has the functions of decoration and protection and does not have the function of heat dissipation, so that the load of components and parts can be increased by using the adhesive tape for a long time under the condition, certain damage is caused, the damage probability of the components and parts is increased, and the use cost is also increased.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides the heat-conducting matte black adhesive tape and the preparation method thereof, the heat-conducting matte black adhesive tape can be quickly prepared, has the functions of shading, fingerprint prevention, scratch prevention and the like, can increase the heat-conducting property while having viscosity, improves the heat conduction effect of the adhesive tape, and effectively solves the problems that the prior art does not have the heat dissipation function, is easy to damage components, has short service life and the like.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows: the heat-conducting matte black adhesive tape sequentially comprises a matte ink layer, a black ink layer, a PI base material layer, a pressure-sensitive adhesive layer added with heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 1-10 microns, 4.5-100 microns, 1-50 microns and 25-100 microns.
Further, the thicknesses of the matte ink layer, the black ink layer, the PI base material layer (polyimide), the pressure-sensitive adhesive layer added with the heat conductive filler, and the release film layer are 2 μm, 4 μm, 7.5 μm, 5 μm, and 25 μm, respectively.
Further, the PI base material layer is a tawny or black PI base material, and the release film layer is a silicone oil release film.
Further, the matte ink layer is prepared from the following raw materials: 90-110 parts of oily matte ink or water-based matte ink, 2-3 parts of hardener and 15-25 parts of solvent.
Further, the matte ink layer is prepared from the following raw materials: 100 parts of oily matte ink or water-based matte ink, 2 parts of hardener and 20 parts of solvent.
Further, the black ink layer is prepared from the following raw materials: 90-110 parts of oil-based black ink or water-based black ink, 1-2 parts of hardener and 10-20 parts of solvent.
Further, the black ink layer is prepared from the following raw materials: 100 parts of oil-based black ink or water-based black ink, 1.5 parts of a curing agent and 15 parts of a solvent.
Further, when the matte ink or the black ink is oily, the solvent is toluene and/or ethyl acetate; when the matte ink or the black ink is water-based, the solvent is deionized water.
Further, the hardener is an isocyanate hardener.
Furthermore, the matte ink layer and the black ink layer can be replaced by the matte black ink layer, the thickness is 2-10 mu m, and the optimal thickness is 4 mu m.
Further, the pressure-sensitive adhesive layer is prepared from the following raw materials: 90-110 parts of acrylic pressure-sensitive adhesive, 0.2-5 parts of curing agent, 1-150 parts of heat-conducting filler and 10-50 parts of solvent.
Further, the pressure-sensitive adhesive layer is prepared from the following raw materials: 100 parts of acrylic pressure-sensitive adhesive, 1 part of curing agent, 25 parts of heat-conducting filler and 25 parts of solvent.
Further, the curing agent is an epoxy type or isocyanate type curing agent.
Further, the heat conductive filler is at least one of alumina, zinc oxide, boron nitride and carbon nanotubes.
Furthermore, the size of the heat-conducting filler is 1-25 μm and is not more than the thickness of the pressure-sensitive adhesive layer.
Further, the heat conductive filler is spherical or spheroidal.
Further, the solvent is at least one of ethyl acetate, toluene, xylene, and methyl ethyl ketone.
The preparation method of the heat-conducting matte black adhesive tape comprises the following steps:
(1) coating black ink on a PI substrate, baking for 1-3min at the temperature of 90-110 ℃, and rolling to obtain an intermediate adhesive tape I;
(2) coating matte ink on the ink surface of the intermediate adhesive tape I obtained in the step (1), then baking for 1-3min at the temperature of 90-110 ℃, and rolling to obtain an intermediate adhesive tape II;
(3) and (3) coating a pressure-sensitive adhesive layer on the release coating surface of the silicone oil release film, wherein the release force is 5-30gf/25mm, then baking for 1-3min at the temperature of 110-plus-material 130 ℃, and then laminating and rolling the pressure-sensitive adhesive layer and the intermediate adhesive tape II obtained in the step (2) to obtain the heat-conducting matt black adhesive tape.
Further, in the step (3), the release force was 12gf/25 mm.
In summary, the invention has the following advantages:
1. the heat-conducting matte black adhesive tape can be quickly prepared, has the effects of shading, preventing fingerprints, preventing scraping and the like, can be viscous, and meanwhile can be increased in heat-conducting property, the heat conduction effect of the adhesive tape is improved, the adhesive tape can help components attached to the adhesive tape to better dissipate heat, the service life and the period of the components are prolonged, the use cost is reduced, and the problems that the prior art does not have the heat dissipation effect, is easy to damage the components, is short in service life and the like are effectively solved.
2. Chroma L of the heat-conductive matte black tape: 22.5 ± 2.5, a: 0. + -.1, b: -1 ± 1; the glossiness GU is 2 +/-1, the adhesive force of the adhesive tape to a steel plate is more than 500gf/25mm, the adhesive tape retaining force is more than 24h, and the adhesive tape has better heat conductivity which is more than 0.6W/mK (0.2W/mK of a common adhesive tape).
3. The pressure-sensitive adhesive layer consists of acrylic pressure-sensitive adhesive, a curing agent, a heat-conducting filler and a solvent, and the acrylic pressure-sensitive adhesive is used for generating viscosity and attaching to the surface of a component; the curing agent enables the glue to generate cross linking, and the cohesion and the adherence of the pressure-sensitive adhesive layer are increased; the heat-conducting filler is used for increasing the heat conductivity of the adhesive layer and enhancing the heat dissipation effect; the solvent is dissolved in the diluted adhesive and the heat-conducting filler, so that the prepared glue is easy to coat.
4. The black ink layer is mainly used for concealing flaws, the matte ink layer enables the adhesive tape to have a matte effect, the appearance is attractive, fingerprint resistance and alcohol resistance are achieved, and when certain dirt on the outer surface can be erased through alcohol, defects are avoided; pressure-sensitive adhesive layer can be with the sticky tape laminating on the quilt thing surface, and keeps apart pressure-sensitive adhesive layer and external world from the type rete, plays the effect of parcel protection, when the sticky tape used, tears off the type rete and can paste.
5. The matte ink mainly plays a black role, and the hardening agent can increase the crosslinking density of the main liquid and the adhesion of the ink layer, so that the ink is not easy to fall off from the PI substrate; the solvent mainly plays a role in diluting, so that the ink liquid is more suitable for coating, and a proper amount of solvent can be added according to the specific coating requirement; the water-based ink can be adjusted by adding water, the environment is protected, the coating adherence is better, the oily ink is added with an oily solvent, the curing is faster, the coating appearance is more beautiful, and the coating efficiency can be improved. The heat-conducting filler is fixed by acrylic acid pressure-sensitive adhesive, and the adhesive tape is stuck on the stuck object by the acrylic acid pressure-sensitive adhesive; the curing agent can be cured only by combining with the acrylic pressure-sensitive adhesive, has better viscosity and cohesion, and ensures that the heat-conducting filler is well fixed in the acrylic pressure-sensitive adhesive, so that the adhesive tape cannot be poor in adhesive residue, layering and the like, and each part plays a sub-role, but not all the parts.
Drawings
Fig. 1 is a schematic structural view of a heat-conductive matte black tape.
Detailed Description
Example 1
A heat-conducting matte black adhesive tape sequentially comprises a matte ink layer, a black ink layer, a PI base material layer, a pressure-sensitive adhesive layer added with a heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 1 micrometer, 4.5 micrometers, 1 micrometer and 25 micrometers.
Wherein, the matte ink layer is prepared by mixing the following raw materials: 90 parts of oily matte ink, 2 parts of isocyanate hardener and 15 parts of toluene. The black ink layer is prepared from the following raw materials: 90 parts of oil-based black ink, 1 part of isocyanate hardener and 10 parts of toluene. The pressure-sensitive adhesive layer is prepared from the following raw materials: 90 parts of acrylic pressure-sensitive adhesive, 0.2 part of isocyanate type curing agent, 1 part of zinc oxide and 10 parts of toluene. The PI substrate layer is a tawny PI substrate, and the release film layer is a silicone oil release film.
The preparation method of the heat-conducting matte black adhesive tape comprises the following steps:
(1) coating black ink on the tawny PI base, then baking for 1min at the temperature of 90 ℃, and rolling to obtain an intermediate adhesive tape I;
(2) coating matte ink on the ink surface of the intermediate adhesive tape I obtained in the step (1), then baking for 1min at the temperature of 90 ℃, and rolling to obtain an intermediate adhesive tape II;
(3) and (3) coating a pressure-sensitive adhesive layer on the release coating surface of the silicone oil release film, wherein the release force is 5gf/25mm, then baking for 1min at the temperature of 110 ℃, and then laminating and rolling the pressure-sensitive adhesive layer and the intermediate adhesive tape II obtained in the step (2) to obtain the heat-conducting matte black adhesive tape.
Example 2
A heat-conducting matte black adhesive tape sequentially comprises a matte ink layer, a black ink layer, a PI base material layer, a pressure-sensitive adhesive layer added with a heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 5 micrometers, 10 micrometers, 7 micrometers and 35 micrometers.
Wherein, the matte ink layer is prepared by mixing the following raw materials: 95 parts of water-based matte ink, 2 parts of isocyanate hardener and 18 parts of deionized water. The black ink layer is prepared from the following raw materials: 95 parts of water-based black ink, 1.5 parts of isocyanate hardener and 14 parts of deionized water. The pressure-sensitive adhesive layer is prepared from the following raw materials: 95 parts of acrylic pressure-sensitive adhesive, 1 part of epoxy curing agent, 12 parts of carbon nano tube and 20 parts of ethyl acetate. The PI substrate layer is a black PI substrate, and the release film layer is a silicone oil release film.
The preparation method of the heat-conducting matte black adhesive tape comprises the following steps:
(1) coating black ink on a black PI base material, then baking for 2min at the temperature of 95 ℃, and rolling to obtain an intermediate adhesive tape I;
(2) coating matte ink on the ink surface of the intermediate adhesive tape I obtained in the step (1), then baking for 2min at the temperature of 95 ℃, and rolling to obtain an intermediate adhesive tape II;
(3) and (3) coating a pressure-sensitive adhesive layer on the release coating surface of the silicone oil release film, wherein the release force is 10gf/25mm, then baking for 2min at the temperature of 115 ℃, and then laminating and rolling the pressure-sensitive adhesive layer and the intermediate adhesive tape II obtained in the step (2) to obtain the heat-conducting matte black adhesive tape.
Example 3
A heat-conducting matte black adhesive tape sequentially comprises a matte ink layer, a black ink layer, a PI base material layer, a pressure-sensitive adhesive layer added with a heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 2 micrometers, 4 micrometers, 7.5 micrometers, 5 micrometers and 25 micrometers.
Wherein, the matte ink layer is prepared by mixing the following raw materials: 100 parts of oily matte ink, 2 parts of isocyanate hardener and 20 parts of ethyl acetate. The black ink layer is prepared from the following raw materials: 100 parts of oil-based black ink, 1.5 parts of isocyanate hardener and 15 parts of toluene. The pressure-sensitive adhesive layer is prepared from the following raw materials: 100 parts of acrylic pressure-sensitive adhesive, 1 part of epoxy curing agent, 25 parts of spheroidal alumina and 25 parts of ethyl acetate. The PI substrate layer is a black PI substrate, and the release film layer is a silicone oil release film.
The preparation method of the heat-conducting matte black adhesive tape comprises the following steps:
(1) coating black ink on a black PI base material, then baking for 2min at the temperature of 100 ℃, and rolling to obtain an intermediate adhesive tape I;
(2) coating matte ink on the ink surface of the intermediate adhesive tape I obtained in the step (1), then baking for 2min at the temperature of 100 ℃, and rolling to obtain an intermediate adhesive tape II;
(3) and (3) coating a pressure-sensitive adhesive layer on the release coating surface of the silicone oil release film, wherein the release force is 12gf/25mm, then baking for 2min at the temperature of 120 ℃, and then laminating and rolling the pressure-sensitive adhesive layer and the intermediate adhesive tape II obtained in the step (2) to obtain the heat-conducting matte black adhesive tape.
Example 4
A heat-conducting matte black adhesive tape sequentially comprises a matte ink layer, a black ink layer, a PI base material layer, a pressure-sensitive adhesive layer added with a heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 10 micrometers, 100 micrometers, 50 micrometers and 100 micrometers.
Wherein, the matte ink layer is prepared by mixing the following raw materials: 110 parts of oily matte ink, 3 parts of isocyanate hardener and 25 parts of ethyl acetate. The black ink layer is prepared from the following raw materials: 110 parts of oil black ink, 2 parts of isocyanate hardener and 20 parts of ethyl acetate. The pressure-sensitive adhesive layer is prepared from the following raw materials: 110 parts of acrylic pressure-sensitive adhesive, 5 parts of isocyanate type curing agent, 150 parts of spherical boron nitride and 50 parts of ethyl acetate. The PI substrate layer is a black PI substrate, and the release film layer is a silicone oil release film.
The preparation method of the heat-conducting matte black adhesive tape comprises the following steps:
(1) coating black ink on a black PI base material, then baking for 3min at the temperature of 110 ℃, and rolling to obtain an intermediate adhesive tape I;
(2) coating matte ink on the ink surface of the intermediate adhesive tape I obtained in the step (1), then baking for 3min at the temperature of 110 ℃, and rolling to obtain an intermediate adhesive tape II;
(3) and (3) coating a pressure-sensitive adhesive layer on the release coating surface of the silicone oil release film, wherein the release force is 30gf/25mm, then baking for 3min at the temperature of 130 ℃, and then laminating and rolling the pressure-sensitive adhesive layer and the intermediate adhesive tape II obtained in the step (2) to obtain the heat-conducting matte black adhesive tape.
The heat conductivity, the tape adhesiveness to the steel sheet and the tape holding power of the heat conductive matte black tapes obtained in examples 1 to 4 were measured, respectively, and the results are shown in table 1. Wherein, the heat conduction is tested by a thermal conductivity meter QTM-500, and the viscosity and the retention force are tested; the adhesion test adopts the national standard GB/T2792-; the retention test adopts national standard GB/T4851-2014.
TABLE 1 statistical table for testing performance of the heat-conducting matte black adhesive tapes obtained in examples 1 to 4
| Thermal conductivity/(W/mK) | Adhesive tape viscosity/(gf/25 mm) | Adhesive tape holding force/h | |
| Example 1 | 0.6 | 700 | 45 |
| Example 2 | 0.8 | 600 | 35 |
| Example 3 | 0.7 | 650 | 32 |
| Example 4 | 0.9 | 550 | 25 |
As can be seen from Table 1, the heat-conducting matt black adhesive tape has good heat-conducting property, can better radiate heat to prolong the service life of components, and has good viscosity and retention.
While the present invention has been described in detail with reference to the illustrated embodiments, it should not be construed as limited to the scope of the present patent. Various modifications and changes may be made by those skilled in the art without inventive step within the scope of the appended claims.
Claims (10)
1. The heat-conducting matte black adhesive tape is characterized by sequentially comprising a matte ink layer, a black ink layer, a PI substrate layer, a pressure-sensitive adhesive layer added with a heat-conducting filler and a release film layer from outside to inside; the thicknesses of the matte ink layer, the black ink layer, the PI base material layer, the pressure-sensitive adhesive layer added with the heat-conducting filler and the release film layer are respectively 1-10 microns, 4.5-100 microns, 1-50 microns and 25-100 microns.
2. The heat-conductive matte black tape according to claim 1, wherein the thicknesses of the matte ink layer, the black ink layer, the PI substrate layer, the pressure-sensitive adhesive layer to which the heat-conductive filler is added, and the release film layer are 2 μm, 4 μm, 7.5 μm, 5 μm, and 25 μm, respectively.
3. The heat-conducting matte black tape of claim 1, wherein the PI substrate layer is a brown or black PI substrate, and the release film layer is a silicone oil release film.
4. The heat-conducting matte black tape according to claim 1, wherein the matte ink layer is made from the following raw materials: 90-110 parts of oily matte ink or water-based matte ink, 2-3 parts of hardener and 15-25 parts of solvent.
5. The thermally conductive matte black tape of claim 1, wherein the black ink layer is made from the following raw materials: 90-110 parts of oil-based black ink or water-based black ink, 1-2 parts of hardener and 10-20 parts of solvent.
6. The thermally conductive matte black tape of claim 4 or 5, wherein the hardener is an isocyanate hardener.
7. The thermally conductive matte black tape according to claim 1, wherein both the matte ink layer and the black ink layer can be replaced with a matte black ink layer having a thickness of 2-10 μm.
8. The thermally conductive matte black tape of claim 1, wherein the pressure sensitive adhesive layer is made from the following raw materials: 90-110 parts of acrylic pressure-sensitive adhesive, 0.2-5 parts of curing agent, 1-150 parts of heat-conducting filler and 10-50 parts of solvent.
9. The thermally conductive matte black tape of claim 8, wherein the thermally conductive filler is at least one of alumina, zinc oxide, boron nitride, and carbon nanotubes.
10. The method of preparing the thermally conductive matte black tape of any one of claims 1-9, comprising the steps of:
(1) coating black ink on a PI substrate, baking for 1-3min at the temperature of 90-110 ℃, and rolling to obtain an intermediate adhesive tape I;
(2) coating matte ink on the ink surface of the intermediate adhesive tape I obtained in the step (1), then baking for 1-3min at the temperature of 90-110 ℃, and rolling to obtain an intermediate adhesive tape II;
(3) and (3) coating a pressure-sensitive adhesive layer on the release coating surface of the silicone oil release film, wherein the release force is 5-30gf/25mm, then baking for 1-3min at the temperature of 110-plus-material 130 ℃, and then laminating and rolling the pressure-sensitive adhesive layer and the intermediate adhesive tape II obtained in the step (2) to obtain the heat-conducting matt black adhesive tape.
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| CN113913123A (en) * | 2021-11-12 | 2022-01-11 | 深圳宏瑞新材料股份有限公司 | Pressure-sensitive matte black PI (polyimide) adhesive tape and manufacturing method thereof |
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| CN114634771A (en) * | 2022-04-22 | 2022-06-17 | 惠州市新欣材料科技有限公司 | PI flame-retardant grid single-sided adhesive tape |
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Application publication date: 20210604 |