CN112896718A

CN112896718A - Packaging structure and packaging method thereof

Info

Publication number: CN112896718A
Application number: CN202110054914.6A
Authority: CN
Inventors: 薛凌霙
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Priority date: 2021-01-15
Filing date: 2021-01-15
Publication date: 2021-06-04
Also published as: TWI755258B; TW202229118A

Abstract

The invention provides a packaging structure and a packaging method thereof, which are used for accommodating a plurality of panel modules and comprise the following steps: a tray with a containing groove, a plurality of buffer materials and a plurality of anti-skid gaskets. Each buffer material is provided with a bearing surface and a covering surface, the bearing surface is used for bearing one of the panel modules, and the covering surface covers the other panel module. The plurality of anti-slip gaskets are respectively arranged between the panel module and the covering surfaces. When the tray moves, the periphery of the outer edge of the buffer material is abutted against the groove wall of the accommodating groove, so that the periphery of the outer edge of the panel module is protected.

Description

Packaging structure and packaging method thereof

Technical Field

The present invention relates to a panel package, and more particularly to a package structure of a panel module and a method for packaging the same.

Background

In order to increase the loading rate of the display panel package product and save the packaging cost in the current display panel package, gaskets with thinner thickness are adopted, and the gaskets can be displaced and wrinkled in use, so that the risk of the components of the display panel being damaged or the components of a circuit board (such as a printed circuit board) being damaged exists.

The existing display panel shipment packaging methods are developed, such as a four-corner positioning packaging method or a four-side positioning packaging method. However, according to the development of the display panel, when the display panel is advanced to have a plurality of functions, one side of the display panel is covered with the flexible circuit board, and a situation that there is no reliable positioning edge or positioning corner occurs.

When the display panel is shipped and packaged, the problem exists in that the pallet for shipping and packaging has the defects that when the packaged display panel is only provided with three edges for positioning products, the fourth edge extends out of a Flexible Printed Circuit (FPC) which is attached to a glass substrate, the edge distance between the pallet and the left side and the right side of the display panel is extremely small, but the size tolerance of the pallet is close to the edge distance, so that if the goods are packaged in a conventional mode, a space is not designed for positioning a retaining wall for a signal connection side during packaging of the display panel, the potential damage hazard of obstruction is formed on transportation of the high-resolution display panel, and the damage risk is huge.

Therefore, how to design the packaging box needs to design a new packaging mode to enhance the reliability and the stability, and becomes a target of the common efforts of the relevant manufacturers and the relevant developers.

Disclosure of Invention

The invention aims to design a packaging structure which can carry out alignment without using a positioning edge and can carry out display panel.

Another objective of the present invention is to design a packaging structure that does not rely on positioning, and to achieve the purpose of preventing the display panel from being collided and damaged or the circuit board assembly from being damaged due to external force or collision during the transportation or transportation process after the display panel product is packaged.

To achieve the above object, the present invention provides a package structure for accommodating a plurality of panel modules, wherein each panel module has a display panel and at least one Chip On Film (COF) wiring area disposed at one side of the display panel, the package structure comprising:

a tray having a receiving groove.

The plurality of buffer materials are arranged in the containing groove, wherein the buffer materials are provided with a bearing surface and a covering surface, the bearing surface is used for bearing one of the panel modules, and the covering surface covers the other panel module.

And the plurality of anti-slip gaskets are arranged between the panel modules and the covering surface.

Furthermore, the anti-skid gaskets are attached to the covering surfaces.

Furthermore, each anti-slip gasket is arranged on the display panel, and the area of each anti-slip gasket is smaller than that of the corresponding display panel.

Furthermore, the area of the buffer materials is larger than that of the display panels

Furthermore, the COF wiring region includes a plurality of flexible printed circuit boards.

According to an embodiment of the present invention, the package structure further comprises a cover plate sealing the top of the receiving groove, and one of the anti-slip gaskets is disposed between the cover plate and the facing panel module.

Furthermore, the thickness of each buffer material is smaller than that of the cover plate.

According to an embodiment of the present invention, the package structure further includes a bottom plate disposed at the bottom of the accommodating slot, and the bottom plate bears the panel modules.

Furthermore, the packaging structure further comprises a bottom plate arranged at the bottom of the accommodating groove, and the bottom plate bears the panel modules.

According to an embodiment of the present invention, each anti-slip pad includes a base layer and an adhesive layer, the base layer faces the corresponding panel module, and the adhesive layer faces the cover surface.

Further, a side of the base layer facing the corresponding panel module has an adhesion force of 2 g/per 0.05mm (gf/0.05mm) to 4 g/per 0.05mm (gf/0.05mm), and a side of the adhesive layer facing the cover surface has another adhesion force of at least 1000 g/per 0.05mm (gf/0.05 mm).

According to an embodiment of the present invention, the tray has four groove walls surrounding the outer edge of the receiving groove, and the groove walls are disposed with a plurality of positioning bumps, and the positioning bumps clamp the side of the display panel outside the COF wiring region.

According to an embodiment of the present invention, the buffer materials have a groove, and the groove is free from the COF wiring region.

According to an embodiment of the present invention, the package structure further includes a package cover and a concave portion on the bottom surface of the tray, the package cover includes a covering slot and a convex portion, the covering slot and the convex portion are respectively disposed on two opposite surfaces of the package cover, the covering slot covers the tray, and the convex portion and the concave portion of another tray are mutually embedded for stacking.

In addition, the present invention provides a packaging method, which comprises the following steps:

step S01: providing a tray, a cover plate, a plurality of buffer materials, a plurality of panel modules and a plurality of anti-skid gaskets, wherein the tray is provided with a containing groove, and the anti-skid gaskets respectively comprise a base layer, an adhesive layer and a liner in sequence;

step S02: placing one of the plurality of buffer materials in the containing groove;

step S03: placing one of the plurality of panel modules into the receiving groove and placing the panel module on the buffer material for stacking;

step S04: placing one of the plurality of anti-slip pads into the containing groove and placing the anti-slip pads on the panel module for stacking, and simultaneously, the base layer is attached to the panel module;

step S06: placing another of the plurality of buffer materials into the containing groove and placing the buffer materials on the anti-skid gasket for stacking, and simultaneously attaching another buffer material to the adhesive layer of the anti-skid gasket;

step S07: placing another of the plurality of panel modules into the receiving cavity and placing the other panel module on another buffer material for stacking;

step S08: placing another of the plurality of anti-slip pads into the receiving groove and placing the other anti-slip pad on the other panel module for stacking, and simultaneously placing the base layer of the other anti-slip pad against the other panel module;

step S10: judging whether another panel module is adjacent to the top of the containing groove, and if so, performing step S11; when the judgment result shows that the container is not adjacent to the top of the containing groove, the step S06 is repeated;

step S11: the cover plate is placed in the containing groove and placed on the other anti-slip gasket for stacking, the cover plate seals the top of the containing groove, and meanwhile the cover plate is attached to the adhesive layer of the other anti-slip gasket.

Step S12: the packaging method is completed.

Furthermore, each of the anti-slip pads further includes a pad, and when one of the plurality of anti-slip pads is placed in the receiving groove and stacked on the panel module, the base layer is attached to the panel module and then further includes the following steps:

step S05: removing the liner of the anti-slip pad.

When another of the plurality of anti-skid pads is placed in the containing groove and stacked on another panel module, the base layer of another anti-skid pad is attached to another panel module, and the method further comprises the following steps:

step S09: removing the liner of the other non-slip pad.

In addition, in an embodiment, the method further includes the following steps after the step S01:

step S011: providing a bottom plate;

step S012: the bottom plate is placed at the bottom of the containing groove.

In another embodiment, the step S11 further includes the following steps:

step S111: providing a packaging cover, wherein the packaging cover comprises a covering groove;

step S112: the tray is covered by the packaging cover, and meanwhile, the tray is accommodated in the covering groove.

In summary, the packaging structure and the packaging method thereof of the present invention have the following advantages:

the invention does not depend on the positioning edge to carry out the packaging structure, and after the panel module product is packaged, the display panel is prevented from being damaged after collision due to external force or collision or the flexible circuit board assembly is prevented from being damaged in the process of carrying or transporting. The packaging safety of the panel module without the positioning edge (comprising the flexible circuit board) can be improved, and meanwhile, the reliability of the packaging structure is improved by the anti-skid gasket.

Drawings

FIG. 1 is an exploded view of the packaging structure of the present invention.

FIG. 2 is an enlarged cross-sectional view AA of FIG. 1.

FIG. 3 is an enlarged view of the BB section of FIG. 1.

Fig. 4 is an exploded perspective view of another preferred embodiment of the present invention.

Fig. 5 is an exploded perspective view of another preferred embodiment of the present invention.

FIG. 6 is a schematic diagram of a stack according to another preferred embodiment of the present invention.

FIG. 7A is a flow chart of the steps of the packaging method of the present invention.

FIG. 7B is a flowchart illustrating steps of another embodiment of a packaging method according to the present invention.

FIG. 7C is a flowchart illustrating steps of a packaging method according to another embodiment of the present invention.

FIG. 8 is an exploded view of the present invention without the use of anti-slip pads.

FIG. 9 is a graph of the power spectral density of the present invention during truck delivery for a random vibration test.

FIG. 10 is a graph of power spectral density during transport for the random vibration test of the present invention.

FIG. 11 is a diagram illustrating the definition of each direction of the drop test according to the present invention.

FIG. 12 is a table showing the drop patterns and sequences used in the drop test of the present invention.

Reference numerals:

1 packaging structure

11 tray

111 accommodating groove

112 groove wall

113 positioning projection

114 recess

12 first cushion material

121 first bearing surface

122 first cover surface

123. 153 groove

13 first panel module

131 first display panel

132. 162 COF wiring region

133 first flexible printed circuit board

14 first anti-skid shim

141. 171 base layer

142. 172 adhesive layer

143. 173 pad

144 first surface

145 second surface

15 second cushion material

151 second bearing surface

152 second cover surface

16 second panel module

161 second display panel

163 second flexible printed circuit board

17 second anti-skid pad

174 third surface

175 fourth surface

18 cover plate

19 bottom plate

20 packaging cover

201 cover the trough

202 convex part

Cross hatching in the AA direction

Cross hatching in BB direction

T1 first thickness

T2 second thickness

T3 third thickness

T4 fourth thickness

T5 fifth thickness

S01-S12

S011 step S012 step S

S111 to S112 steps

Detailed Description

While the present invention will be described in conjunction with the following description, which is set forth to provide a thorough understanding of the present invention, it will be understood that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Referring to fig. 1 to 3, the present invention provides a package structure 1 for accommodating a plurality of panel modules (13, 16), in the preferred embodiment, the plurality of panel modules (13, 16) take two panel module stack packages as an example, which are a first panel module 13 and a second panel module 16, respectively, but not limited thereto, wherein each panel module (13, 16) has a display panel (131, 161) and at least one chip on film (132, 162), the chip on film (132, 162) is disposed at one side of the display panel (131, 161), and the chip on film (132, 162) includes a plurality of flexible circuit boards (133, 163). The packaging structure 1 comprises:

a tray 11 has a receiving slot 111, four slot walls 112 are formed around the outer edge of the receiving slot 111, preferably, a plurality of positioning bumps 113 are disposed on the slot walls 112, and the positioning bumps 113 clamp the display panel (131, 161) and are disposed on the sides other than the COF wiring regions (132, 162).

The plurality of buffer materials (12, 15) are arranged in the accommodating groove 111, wherein the buffer materials (12, 15) are provided with a bearing surface (121, 151) and a covering surface (122, 152), the bearing surface (121, 151) is used for bearing one of the panel modules (13, 16), the covering surface (122, 152) covers the other panel module (13, 16), and the area of the buffer materials (12, 15) is larger than that of the display panels (131, 161). In the preferred embodiment, the plurality of cushioning materials (12, 15) is a first cushioning material 12 and a second cushioning material 15. Preferably, the buffer materials (12, 15) have a groove (123, 153), and the groove (123, 153) is free from the COF wiring region (132, 162).

The plurality of anti-slip gaskets (14, 17) are disposed between the panel modules (13, 16) and the covering surfaces (122, 152), and the plurality of anti-slip gaskets (14, 17) are attached to the covering surfaces (122, 152), in the preferred embodiment, the plurality of anti-slip gaskets are a first anti-slip gasket 14 and a second anti-slip gasket 17. Each anti-slip mat (14, 17) comprises a base layer (141, 171) and an adhesive layer (142, 172), the base layer (141, 171) facing the corresponding panel module (13, 16), and the adhesive layer (142, 172) facing the cover surface (122, 152).

In addition, the package structure 1 further includes a cover 18 sealing the top of the receiving cavity 111 and a bottom plate 19 disposed at the bottom of the receiving cavity 111. One of the anti-slip pads (14, 17) is provided between the cover plate 18 and the facing panel module 19, and the thickness of each of the cushioning materials (12, 15) is smaller than that of the cover plate 18. The bottom plate 19 carries the panel modules (13, 16), and the thickness of each of the cushioning materials (12, 15) is smaller than the thickness of the bottom plate 19.

In the above description, a preferred embodiment is further described, the packaging structure 1 includes a tray 11, a first buffer material 12, a first panel module 13, a first anti-slip pad 14, a second buffer material 15, a second panel module 16, a second anti-slip pad 17, a cover 18 and a bottom plate 19.

The tray 11 has a receiving cavity 111, and four walls 112 are formed around the outer edge of the receiving cavity 111.

The first buffer material 12 is disposed in the receiving cavity 111, and has a first carrying surface 121 and a first covering surface 122, and the first buffer material 12 has a first thickness T1. In the embodiment, the first thickness T1 is at least 4 mm, and the first buffer material 12 can be, but not limited to, foamed polyethylene (EPE) or foamed ethylene/vinyl acetate copolymer (EVA), preferably, the first buffer material 12 has a groove 123 disposed on the first supporting surface 121 or the first covering surface 122, and the groove 123 is free of the flip-chip film wiring region (132, 162).

The first panel module 13 has a first display panel 131 and a plurality of first flexible printed circuit boards 133 extending from one side thereof, and the first panel module 13 is stacked on the first buffer material 12. Preferably, the first panel module 13 is disposed in a central region of the first carrying surface 121, but not limited thereto.

The first anti-slip gasket 14 has a first surface 144 and a second surface 145 opposite to each other, the first surface 144 has a first adhesion force, the second surface 145 has a second adhesion force, the first anti-slip gasket 14 is stacked on the first panel module 13, and the first surface 144 is attached to the first display panel 131. Preferably, the first anti-slip pad 14 is disposed in the central region of the first display panel 131, but not limited thereto.

In addition, the first anti-skid pad 14 has a fourth thickness T4, and the first anti-skid pad 14 includes a base layer 141 and an adhesive layer 142, one surface of the adhesive layer 142 is attached to one surface of the base layer 141, one surface of the base layer 141 facing the first panel module 13 is the first surface 144, and one surface of the adhesive layer 142 facing the first covering surface 122 is the second surface 145. In the embodiment, the fourth thickness T4 is between 0.09 mm and 0.12 mm, but not limited thereto.

Referring to fig. 8, before the first anti-skid pad 14 is not used, the first anti-skid pad further includes a pad 143, one surface of the pad is attached to the second surface 145, and after the first surface 144 is attached to the first display panel 131, the pad 143 is removed and then attached to the second surface 145.

The second buffer material 15 has a second carrying surface 151 and a second covering surface 152, the second buffer material 15 is stacked on the first anti-slip pad 14, the second covering surface 152 is attached to the second surface 145, and the second buffer material 15 has a second thickness T2. In the embodiment, the second thickness T2 is at least 4 mm, and the second buffer material 15 can be, but not limited to, foamed polyethylene (EPE) or foamed ethylene/vinyl acetate copolymer (EVA), preferably, the second buffer material 15 has a groove 153 disposed on the second supporting surface 151 or the second covering surface 152, and the groove 153 is located away from the second chip on film wiring region (132, 162) of the second panel module.

The second panel module 16 has a second display panel 161 and a plurality of second flexible printed circuits 163 extending from one side thereof, and the second panel module 16 is stacked on the second buffer material 15. Preferably, the second panel module 16 is placed in the central area of the second carrying surface 151, but not limited thereto.

The second anti-slip gasket 17 has a third surface 174 and a fourth surface 175 corresponding to each other, the third surface 174 has a third adhesion force, the fourth surface 175 has a fourth adhesion force, the second anti-slip gasket 17 is stacked on the second panel module 16, and the third surface 174 is adhered to the second display panel 161. Preferably, the second anti-slip pad 17 is disposed in a central region of the second display panel 161, but not limited thereto.

In addition, the second anti-skid pad 17 has a fifth thickness T5, and the second anti-skid pad 17 includes a base layer 171 and an adhesive layer 172, respectively, one surface of the adhesive layer 172 is attached to one surface of the base layer 171, one surface of the base layer 171 facing the second panel module 16 is the third surface 174, and one surface of the adhesive layer 172 facing the second cover surface 152 is the fourth surface 175. In the embodiment, the fifth thickness T5 is between 0.09 mm and 0.12 mm, but not limited thereto.

As shown in fig. 8, before the second anti-skid pad 17 is not used, a pad 173 is further included, one surface of the pad is attached to the fourth surface 175, and after the third surface 174 is attached to the second display panel 161, the pad 173 is firstly removed and then attached to the fourth surface 175.

The cover plate 18 is stacked on the second anti-slip pad 17 and attached to the fourth surface 175, and the cover plate 18 has a third thickness T3. In the embodiment, the third thickness T3 is at least 5mm, and the cover plate 18 can be a polyethylene foam (EPE) or an ethylene/vinyl acetate copolymer foam (EVA), but not limited thereto.

The bottom plate 19 is disposed at the bottom of the receiving cavity 111, and the bottom plate 19 carries a plurality of cushioning materials (12, 15), a plurality of anti-slip pads (14, 17) and a plurality of panel modules (13, 16). The thickness of the cushioning materials (12, 15) is smaller than the thickness of the bottom plate 19.

The first anti-skid pad 14 is attached between the second buffer material 15 and the first panel module 13, and achieves the anti-skid function between the second buffer material 15 and the first panel module 13 by the first adhesion force and the second adhesion force; the second anti-slip gasket 17 is adhered between the cover plate 18 and the second panel module 16, and achieves the anti-slip function between the cover plate 18 and the second panel module 16 by the third adhesion force and the fourth adhesion force.

In the above, the adhesion force of the first surface 144 is smaller than that of the second surface 145, and the adhesion force of the third surface 174 is smaller than that of the fourth surface 175. In the present embodiment, the adhesion force of the first surface 144 and the adhesion force of the third surface 174 are 2 gram force per 0.05 millimeter (gf/0.05mm) to 4 gram force per 0.05 millimeter (gf/0.05mm), respectively. The adhesion force of the second surface 145 and the adhesion force of the fourth surface 175 are at least 1000 gf/0.05mm (gf/0.05mm), respectively, but not limited thereto.

Meanwhile, the sizes of the first buffer material 12, the second buffer material 15, the cover plate 18 and the bottom plate 19 are all larger than the size of the first panel module 13, and the sizes of the first buffer material 12, the second buffer material 15, the cover plate 18 and the bottom plate 19 are all larger than the surface area of the second panel module 16, so that when the tray 11 performs a displacement motion, the peripheries of the first buffer material 12, the second buffer material 15 and the cover plate 18 abut against the slot wall 112, and the peripheries of the first display panel 131, the second display panel 161, the first flexible printed circuit boards 133 and the second flexible printed circuit boards 163 are protected from impacting against the slot wall.

That is, the first anti-slip pad 14 is attached to the middle of the second buffer material 15 and the first panel module 13, and the second anti-slip pad 17 is attached to the middle of the cover plate 18 and the second panel module 16, so as to achieve a fastening package structure, and at the same time, the anti-slip effect is provided between the second buffer material 15 and the first panel module 13, and the anti-slip effect is also provided between the cover plate 18 and the second panel module 16.

When the packaging structure 1 is subjected to external force or collision to generate displacement motion, the first panel module 13 displaces along with the second buffer material 15, and the second panel module 16 displaces along with the cover plate 18, i.e. the first panel module 13 and the second panel module 16 do not displace alone due to external force or collision, and any one of the first display panel 131, the second display panel 161, the plurality of first flexible circuit boards 133 and the plurality of second flexible circuit boards 163 is not damaged, thereby improving the packaging safety and reliability of the packaging structure 1.

Referring to fig. 4, in another preferred embodiment, the receiving cavity 111 includes a plurality of positioning bumps 113, the positioning bumps 113 clamp the sides of the display panel (131, 161) except the bond pads (132, 162), and preferably, the positioning bumps 113 enable the receiving cavity 111 to align and limit the first buffer material 12, the second buffer material 15 and the cover plate 18 respectively.

Referring to fig. 5, in another preferred embodiment, the package structure 1 further includes a package cover 20, the cover 20 has a covering slot 201, and the covering slot 201 is located on a surface of the package cover 20 and can receive the tray 11, such that the package cover 20 can cover the tray 11.

As shown in fig. 6, the bottom surface of the tray 11 has a concave portion 114 and the package cover 20 further has a convex portion 202, the covering groove 201 and the convex portion 202 are respectively disposed on two opposite sides of the package cover 20, the covering groove 201 covers the tray 11 and the convex portion 202 is engaged with the concave portion 114 of another tray 11, so that the plurality of package structures 1 can be stacked by engaging the concave portion 114 and the convex portion 202 with each other.

Referring to fig. 7, the present invention provides a packaging method for packaging a plurality of panel modules, which comprises the following steps:

step S01: a tray, a cover plate, a plurality of cushioning materials, a plurality of panel modules and a plurality of anti-skid pads are provided, the tray is provided with a containing groove, and the anti-skid pads respectively comprise a base layer, an adhesive layer and a liner in sequence.

Step S02: one of the plurality of buffer materials is placed in the containing groove.

Step S03: one of the plurality of panel modules is placed in the receiving groove and placed on the buffer material for stacking.

Step S04: one of the plurality of anti-slip pads is placed in the containing groove and stacked on the panel module, and the base layer is attached to the panel module.

Step S05: removing the liner of the anti-slip pad.

Step S06: placing another of the plurality of buffer materials into the receiving groove and placing the buffer materials on the anti-slip gasket for stacking, and simultaneously attaching another buffer material to the adhesive layer of the anti-slip gasket.

Step S07: placing another of the plurality of panel modules into the receiving cavity and placing the other panel module on another buffer material for stacking.

Step S08: placing another of the plurality of anti-slip pads into the receiving groove and placing the other anti-slip pad on the other panel module for stacking, and simultaneously, the base layer of the other anti-slip pad is attached to the other panel module.

Step S09: removing the liner of the other non-slip pad.

Step S10: judging whether another panel module is adjacent to the top of the containing groove, and if so, performing step S11; when it is determined that the container is not adjacent to the top of the container, the step S06 is repeated.

Step S12: the packaging method is completed.

It should be noted that, in the step S10, it is determined whether another panel module is adjacent to the top of the receiving cavity, and whether a distance between another display panel and the top of the receiving cavity is equal to a thickness of the cover plate, in this embodiment, the thickness of the cover plate is at least 5 mm.

It is also worth mentioning that, by the above-mentioned method, it is not dependent on the conventional positioning edge method, and further, the display panel product (flexible printed circuit board) without the positioning edge or positioning angle can be packaged, and by the application of the anti-slip pad and the buffer material, the packaging safety and reliability of the display panel (flexible printed circuit board) can be improved.

That is, compared with the packaging method of packaging the panel module with a plurality of flexible circuit boards by positioning edges, the packaging method provided by the invention can further achieve the purpose of protecting the safety and reliability of the plurality of flexible circuit boards.

In addition, in another preferred embodiment of the present invention, the step S01 further includes the following steps:

step S011: a base plate is provided.

Step S012: the bottom plate is placed at the bottom of the containing groove.

In this other preferred embodiment, by performing step S011 and step S012, the packaging structure is provided with a plurality of buffer materials, a plurality of anti-slip pads and a plurality of panel modules by the bottom plate, and the possibility of damage caused by placing the first display module when the thickness of the first buffer material is not enough is reduced.

Further, in another preferred embodiment, the step S11 further includes the following steps:

step S111: a package cover is provided, which includes a cover slot.

In this embodiment, the packaging structure can be stacked on another packaging structure by performing steps S111 and S112.

In addition, the packaging structure of the present invention is subjected to a drop test and a random vibration test, respectively. The Vibration test mainly simulates the external stress of a product in various transportation processes, and the test modes include Random Vibration (Random Vibration) and Sine Vibration (Sine Vibration). The random vibration simulation product has better structural quality and transportation resistance.

The package structure random vibration test requirements are as follows:

the unit under test package should withstand the following mechanical testing without degradation of the internal components. This includes all optical requirements. And the following package random vibration test, conducted according to the Apple company (Apple) test specification, should meet all the requirements specified herein. Where only zero functional and appearance failures are allowed:

1. and (3) testing and reducing pressure: none.

2. And (4) using a transport package.

3. Pressure grade: trucks and air.

4. The power spectral density test is started using truck-borne vector samples, and if no fault is found, the power spectral density test is started using the vector samples in the transport.

5. Test axis and sequence: x-axis, Y-axis, Z-axis.

6. Duration per axis: for 30 minutes.

7. Weight: 0.

8. reading points: behind each axis.

9. The operation state is as follows: and (4) non-operation.

Referring to fig. 9 and 10, it can be seen that the result is that the total root mean square acceleration (Grms) in truck delivery (as shown in fig. 9) is 1.49g, the test result values are all smaller than the predetermined value in comparison with the ISO-vibration tolerance table, and the positions of the cushioning material and the display panel are in the stable state.

And the total root mean square acceleration (Grms) during the transportation (as shown in fig. 10) is 0.73g, the test results are all less than the predetermined value in comparison with the ISO-vibration tolerance table, and the positions of the cushioning material and the display panel are all in a stable state.

In addition, the drop test requires the following:

1. the orientation of the package is defined by the orientation of the cells within the package, as shown in FIG. 11.

2. The drop height of the test was 91 cm, and the order of drop was tested, as shown in FIG. 12.

Through the above two tests, the positioning-free edge packaging structure of the display panel has passed the experiment, and the overall appearance of the display panel is inspected, and the inspection result is no abnormality, and the electrical function inspection of the display panel, the plurality of first flexible circuit boards and the plurality of second flexible circuit boards is also no abnormality.

1. the invention can pack the display panel product without depending on the traditional positioning edge way, and the external force or collision is generated in the process of carrying or transporting the display panel product after the display panel product is packed, thereby achieving the purpose of preventing the product from colliding and damaging or preventing the circuit board assembly from being damaged. The package safety of the display panel (including flexible circuit board) without positioning edge is improved, and the anti-slip pad can prevent the positions of the panel module and the buffer material from slipping, thereby improving the reliability.

2. The design of the tray accommodating groove can be suitable for more sizes to be utilized and achieve recycling, and the tray can not be used once or for a specific size.

3. The packaging process and the unpacking process of the display panel can be better packaged and unpacked directly, and more chances of damaging the display panel body or the flexible circuit board in the packaging process or the unpacking process are avoided.

While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.

Claims

1. The utility model provides a packaging structure for the holding plural panel module, its characterized in that, each panel module has display panel and at least one cover brilliant film wiring district, cover brilliant film wiring district set up in a side of display panel includes:

a tray having a receiving groove;

the buffer materials are arranged in the accommodating groove and provided with a bearing surface and a covering surface, the bearing surface is used for bearing one of the panel modules, and the covering surface covers the other panel module; and

and the plurality of anti-slip gaskets are arranged between the panel module and the covering surface.

2. The packaging structure of claim 1, wherein the non-slip gasket is affixed to the cover.

3. The packaging structure of claim 1, wherein each anti-slip pad is disposed on the display panel and has an area smaller than the corresponding display panel.

4. The packaging structure of claim 1, wherein the packaging structure further comprises a cover plate sealing the top of the receiving groove, and one of the anti-slip gaskets is provided between the cover plate and the facing panel module.

5. The packaging structure of claim 4, wherein the thickness of each cushioning material is less than the thickness of the cover sheet.

6. The packaging structure of claim 1, further comprising a bottom plate disposed at the bottom of the receiving slot, the bottom plate carrying the panel module.

7. The packaging structure of claim 6, wherein the thickness of each cushioning material is less than the thickness of the base sheet.

8. The packaging structure of claim 1, wherein each anti-slip gasket comprises a base layer and an adhesive layer, the base layer facing the corresponding panel module, and the adhesive layer facing the cover surface.

9. The package structure as claimed in claim 1, wherein the tray has four slot walls surrounding the outer edge of the receiving slot, and the slot walls are disposed with a plurality of positioning bumps, and the positioning bumps are clamped on the side of the display panel outside the COF wiring region.

10. The packaging structure of claim 1, wherein the cushioning material has an area larger than an area of the display panel.

11. The package structure of claim 1, wherein the buffer material has a recess that is recessed from the COF land.

12. The package structure of claim 1, wherein the COF bonding pad comprises a plurality of flexible printed circuit boards.

13. The packaging structure of claim 8, wherein the surface of the base layer facing the corresponding panel module has an adhesion of 2 gf per 0.05 to 4 gf per 0.05mm, and the surface of the adhesive layer facing the cover surface has another adhesion of at least 1000 gf per 0.05 mm.

14. The packaging structure of claim 1, wherein the bottom surface of the tray has a concave portion and the packaging structure further comprises a packaging cover, the packaging cover comprises a covering groove and a convex portion, the covering groove and the convex portion are respectively disposed on two opposite surfaces of the packaging cover, the covering groove covers the tray, and the convex portion and the concave portion of another tray are mutually embedded for stacking.

15. A packaging method is used for packaging a plurality of panel modules and is characterized by comprising the following steps:

providing a tray, a cover plate, a plurality of buffer materials and a plurality of anti-skid gaskets, wherein the tray is provided with a containing groove, and the anti-skid gaskets respectively comprise a base layer and an adhesion layer in sequence;

placing one of the plurality of buffer materials in the accommodating groove;

placing one of the plurality of panel modules into the containing groove and placing the panel module on the buffer material for stacking;

placing one of the plurality of anti-skid gaskets into the containing groove and placing the anti-skid gaskets on the panel module for stacking, and simultaneously, enabling the base layer to be attached to the panel module;

placing another plurality of buffer materials into the containing groove and placing the buffer materials on the anti-skid gasket for stacking, and simultaneously attaching another buffer material to the adhesive layer of the anti-skid gasket;

placing another plurality of panel modules into the accommodating groove and placing the panel modules on another buffer material for stacking;

placing another plurality of anti-skid gaskets into the containing groove and placing the anti-skid gaskets on another panel module for stacking, wherein the base layer of another anti-skid gasket is attached to another panel module;

judging whether another panel module is adjacent to the top of the containing groove, and performing the next step when the other panel module is adjacent to the top of the containing groove; when the buffer material is judged not to be adjacent to the top of the containing groove, the step of placing the plurality of buffer materials in the containing groove is repeated;

and placing the cover plate into the containing groove and placing the cover plate on the other anti-slip gasket for stacking, wherein the cover plate seals the top of the containing groove, and meanwhile, the cover plate is attached to the adhesive layer of the other anti-slip gasket.

The packaging method is completed.

16. The method of claim 15, wherein the step of placing one of the plurality of buffers in the receiving cavity further comprises the steps of:

providing a bottom plate;

and placing the bottom plate at the bottom of the accommodating groove.

17. The method of claim 15, wherein placing the cover into the receptacle further comprises:

providing a package cover comprising a cover slot;

and covering the tray with the packaging cover, and accommodating the tray in the covering groove.

18. The method of claim 15, wherein each of the anti-slip pads further comprises a liner, and the method further comprises the following steps after placing one of the plurality of anti-slip pads into the receiving cavity and onto the panel module for stacking while the substrate is against the panel module:

the liner of the non-slip mat is torn off.

19. The method of packaging as claimed in claim 18, wherein each of the anti-slip pads further comprises a liner, and further comprising the following steps after another of the plurality of anti-slip pads is placed in the receiving groove and stacked on another of the panel modules, and the substrate of another of the anti-slip pads is attached to another panel module:

and tearing off the liner of the other antiskid gasket.