CN112894487A - Broken cutter detection device and method of circuit board processing equipment - Google Patents
Broken cutter detection device and method of circuit board processing equipment Download PDFInfo
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- CN112894487A CN112894487A CN202110090474.XA CN202110090474A CN112894487A CN 112894487 A CN112894487 A CN 112894487A CN 202110090474 A CN202110090474 A CN 202110090474A CN 112894487 A CN112894487 A CN 112894487A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
- B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
- B23Q17/0957—Detection of tool breakage
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/0046—Devices for removing chips by sucking
Abstract
The invention discloses a broken cutter detection device and a method of circuit board processing equipment, wherein the circuit board processing equipment comprises a control module, a chip suction cover and a dust suction pipeline, and the broken cutter detection device comprises a dust sensing device and a single chip microcomputer; the dust sensing device comprises a sensing module and a signal processing module, the sensing module is arranged on the dust suction pipeline or the dust suction cover and used for detecting dust concentration and/or cutter breakage, and the signal processing module comprises a first sub-processing module used for processing a dust concentration signal and/or a second sub-processing module used for processing a cutter breakage signal; the single chip microcomputer is electrically connected with the dust sensing device and the control module respectively, and judges whether the cutter is broken or not according to the detection signal and feeds back the judgment information to the control module. The knife breakage detection device of the circuit board processing equipment provided by the invention has the advantages of simple structure, convenience in operation, difficulty in being interfered by external environment, capability of detecting the knife breakage condition of the circuit board processing equipment in real time during operation, and reduction of complexity and plate scrap in the processing process.
Description
Technical Field
The embodiment of the invention relates to the monitoring technology of an electric power system, in particular to a device and a method for detecting broken cutters of circuit board processing equipment.
Background
With the rapid development of the circuit board industry, the integration level of electronic components is higher and higher, and if a knife breaking phenomenon occurs in a circuit board processing device (such as a drilling machine, an edge milling machine, etc.) during the processing process, a leak hole is generated in the processed circuit board, which affects the processing flow at the later stage, so that the knife breaking phenomenon of the circuit board processing device during the processing process needs to be found in time.
The current methods for detecting the broken knife are mainly two types: firstly, whether the change of the waveform of the output signal is generated or not is judged by detecting whether the drill bit is in contact with the conductive medium on the surface of the circuit board through the CBD module. However, the ground wire of the spindle housing needs to be connected to the CBD module, so that the spindle housing loses the ground protection. And before the circuit board is processed, a potentiometer of the CBD module needs to be manually adjusted, and the integrity of the waveform of an output signal is ensured. And secondly, the correlation optical fiber module is arranged in the presser foot, whether the drill bit is in the sensing area or not is tested, and the optical fiber amplifier realizes the cutter breaking detection according to the condition of the output signal of the correlation optical fiber module.
At the present stage, the circuit board mainly depends on the fact that the CBD detection module and the pressure foot are internally provided with the correlation optical fiber module to achieve real-time broken cutter detection in the actual processing process, but the CBD detection module is grounded through a drill cutter, the impedance of a circuit is changed to achieve the change of signal waveforms, and the method is extremely easy to be interfered by external noise and can also cause the loss of signals. In addition, the CBD detection module needs to manually adjust a potentiometer of the detection module according to the processing mode of circuit board plates with different sizes, the optimal state of output signals of the CBD detection module is achieved through continuous testing, and therefore a good processing technology is achieved. And some special plates can not be provided with a conductive medium, so that the CBD detection module can not be applied. The implementation of the function of the correlation optical fiber module in the presser foot requires a specific presser foot device, and the fixed application mode has certain limitation, and the detection device and method are easy to interfere in the environment with more dust, so that the detection device and method are needed to be simpler and more convenient.
Disclosure of Invention
The invention provides a device and a method for detecting the broken cutter of circuit board processing equipment, which have the advantages of simple structure, easy operation, high accuracy and difficult interference from external environment, and can detect the broken cutter condition of the circuit board processing equipment in real time during operation.
In a first aspect, an embodiment of the present invention provides a broken tool detection device for a circuit board processing apparatus, where the circuit board processing apparatus includes a control module, a chip suction cover, and a dust suction duct, and is characterized in that,
the broken cutter detection device comprises a dust sensing device and a single chip microcomputer;
the dust sensing device comprises a sensing module and a signal processing module, the sensing module is arranged on the dust suction pipeline or the dust suction cover and used for detecting dust concentration and/or cutter breaking, the signal processing module comprises a first sub-processing module used for processing a dust concentration signal and/or a second sub-processing module used for processing a cutter breaking signal, and the first sub-processing module and/or the second sub-processing module output a detection signal to the single chip microcomputer according to a detection result of the sensing module;
the single chip microcomputer is electrically connected with the dust sensing device and the control module respectively, and judges whether the cutter is broken or not according to the detection signal and feeds back judgment information to the control module.
Optionally, when the sensing module detects that the dust concentration is continuously unchanged or increased, the voltage value output by the first sub-processing module keeps a preset value or is reduced; when the sensing module detects that the dust concentration is reduced, the voltage value output by the first sub-processing module is increased;
when the sensing module does not detect the cutter breaking, the voltage value output by the second sub-processing module is kept to be 0V; when the sensing module detects that the cutter is broken, the voltage value output by the second sub-processing module is increased.
Optionally, the single chip microcomputer includes a first comparison circuit and a second comparison circuit;
the first comparison circuit is electrically connected with the first sub-processing module and used for judging whether the voltage value output by the first sub-processing module is equal to a first potential signal or not;
the second comparison circuit is electrically connected with the second sub-processing module and used for judging whether the voltage value output by the second sub-processing module is higher than a second potential signal or not.
Optionally, the single chip microcomputer further comprises an or gate circuit;
the OR gate circuit is electrically connected with the first comparison circuit and the second comparison circuit respectively; when the first comparison circuit judges that the voltage value output by the first sub-processing module is equal to the first potential signal and/or the second comparison circuit judges that the voltage value output by the second sub-processing module is higher than the second potential signal, the OR gate circuit outputs a high level signal, and the singlechip judges that the circuit board processing equipment is broken.
Optionally, the control module triggers the single chip microcomputer to enter a detection state when controlling the circuit board processing equipment to operate, and the single chip microcomputer judges whether a knife break occurs or not according to the detection signal in the detection state.
Optionally, the single chip microcomputer includes a first analog signal receiving terminal and a second analog signal receiving terminal;
the first analog signal receiving end is electrically connected with the first sub-processing module and the first comparison circuit respectively;
the second analog signal receiving end is electrically connected with the second sub-processing module and the second comparison circuit respectively.
Optionally, the sensing module includes a light emitting unit and a light receiving unit, the dust suction duct includes a light transmitting section, and the light emitting unit and the light receiving unit are respectively disposed on two sides of the light transmitting section.
Optionally, the single chip microcomputer further comprises a metering module; the metering module comprises a timer and/or a counter;
the metering module is used for receiving the operation triggering information provided by the control module and generating metering information according to the operation triggering information;
and the single chip microcomputer judges whether the circuit board processing equipment is broken or not according to the detection signal in the metering period of the metering information and outputs the judgment information to the control module.
Optionally, the judgment information includes information of a broken tool and information of an unbroken tool, and the control module is configured to control a working state of the circuit board processing equipment according to the judgment information and the metering cycle;
the control module is used for controlling the circuit board processing equipment to stop running and controlling the circuit board processing equipment to change the cutter according to the cutter breaking information;
in the timing period, the control module controls the circuit board processing equipment to continue to operate according to the information of the uninterrupted cutter; and when the timing period is exceeded, the control module controls the circuit board processing equipment to stop running.
In a second aspect, the embodiment of the invention further provides a method for detecting a knife break of circuit board processing equipment, wherein the circuit board processing equipment comprises a control module, a chip suction cover and a dust suction pipeline, and the method is characterized by further comprising a knife break detection device, wherein the knife break detection device comprises a dust sensing device and a single chip microcomputer, the dust sensing device is arranged on the dust suction pipeline or the chip suction cover, and the single chip microcomputer is respectively and electrically connected with the dust sensing device and the control module;
the broken cutter detection method comprises the following steps:
when the control module controls the circuit board processing equipment to operate, a trigger signal is output to the single chip microcomputer, and the single chip microcomputer enters a detection state according to the trigger signal;
the dust sensing device outputs a detection signal to the single chip microcomputer according to dust concentration and/or cutter breakage;
the single chip microcomputer in the detection state judges whether the cutter is broken or not according to the detection signal and outputs judgment information to the control module, and the control module controls the working state of the circuit board processing equipment according to the judgment information.
The broken knife detection device of the circuit board processing equipment provided by the embodiment of the invention is provided with the dust sensing device for detecting dust particles and broken knives generated by the circuit board processing equipment in the circuit board processing process, the first sub-processing module for processing dust concentration signals and the second sub-processing module for processing broken knife signals are respectively arranged, signals based on dust and signals based on broken knife information are simultaneously collected and processed, and the processed signals are output to the single chip microcomputer for judgment.
Drawings
Fig. 1 is a schematic structural diagram of a broken blade detection device of a circuit board processing device according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a broken blade detection device of another circuit board processing device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a broken blade detection device of another circuit board processing apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a broken blade detection device of another circuit board processing device according to an embodiment of the present invention;
fig. 5 is a flowchart of a method for detecting a knife break of a circuit board processing device according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In order to facilitate understanding, an embodiment of the present invention provides a structure diagram of a circuit board processing apparatus, as shown in fig. 1, the circuit board processing apparatus includes a control module (not shown), a dust suction cover, and a dust suction pipe; referring to fig. 2, fig. 2 is a broken blade detection device of a circuit board processing apparatus according to an embodiment of the present invention, as shown in fig. 2, the broken blade detection device includes a dust sensing device 100 and a single chip microcomputer 200; the dust sensing device 100 comprises a sensing module 110 and a signal processing module 120, the sensing module 110 is arranged on a dust suction pipeline or a dust suction cover to be used for detecting dust concentration and/or cutter breaking, the signal processing module 120 comprises a first sub-processing module 121 used for processing a dust concentration signal and/or a second sub-processing module 122 used for processing a cutter breaking signal, and the first sub-processing module 121 and/or the second sub-processing module 122 output a detection signal to the single chip microcomputer 200 according to a detection result of the sensing module; the single chip microcomputer is electrically connected with the dust sensing device 100 and the control module 300 respectively, and the single chip microcomputer 200 judges whether a knife break occurs according to the detection signal and feeds back the judgment information to the control module 300.
Specifically, when the circuit board processing equipment starts to operate, the control module 300 sends an operation trigger signal to the single chip microcomputer 300 to enable the single chip microcomputer 300 to start to operate; when the dust in the dust suction pipe flows, the sensing module 110 detects the dust concentration or the cutter breaking (for example, a broken drill bit during drilling or a broken milling cutter during milling), and if no dust is detected in the dust suction pipe or the cutter breaking is detected, the cutter breaking is indicated. The sensing module 110 outputs the detected signal based on the dust concentration to the first sub-processing module 121 and outputs the detected signal based on the knife breaking to the second sub-processing module 122, and the first sub-processing module 121 and the second sub-processing module 122 process the received signals and then output the detected signals to the single chip microcomputer 200. For example, when the sensing module 110 detects that the dust concentration is continuously unchanged or increased, the voltage value output by the first sub-processing module 121 maintains a preset value or decreases, and when the sensing module 110 detects that the dust concentration decreases, the voltage value output by the first sub-processing module 121 increases; when the sensing module 110 does not detect the knife break, the voltage value output by the second sub-processing module 122 is kept at 0V; when the sensing module 110 detects a knife break, the voltage value output by the second sub-processing module 122 increases. The single chip microcomputer 200 can judge whether the PCB processing equipment is broken according to the received detection signal.
The broken knife detection device of the circuit board processing equipment provided by the embodiment of the invention is provided with the dust sensing device for detecting dust particles and broken knives generated by the circuit board processing equipment in the circuit board processing process, the first sub-processing module for processing dust concentration signals and the second sub-processing module for processing broken knife signals are respectively arranged, signals based on dust and signals based on broken knife information are simultaneously collected and processed, and the processed signals are output to the single chip microcomputer for judgment.
Optionally, fig. 3 is a schematic structural diagram of another broken blade detection device of circuit board processing equipment according to an embodiment of the present invention, as shown in fig. 3, the sensing module 110 includes a light emitting unit 111 and a light receiving unit 112, referring to fig. 1, the dust suction duct includes a light transmitting section, and the light emitting unit 111 and the light receiving unit 112 are respectively disposed on two sides of the light transmitting section. Illustratively, the light emitting unit 111 includes an infrared emitting unit and/or a laser emitting unit.
Specifically, the light emitting unit 111 and the light receiving unit 112 are respectively disposed at two sides of the light transmitting section of the dust absorption pipeline, dust particles are generated when the circuit board processing equipment performs processing operations such as drilling or milling on the circuit board, when dust airflow in the dust absorption pipeline flows through the light transmitting section, irradiation light emitted by the light emitting unit 111 is affected by scattering and absorption of the dust particles, light intensity is attenuated, and a light scattering phenomenon is generated, the light receiving unit 112 receives light signals scattered by the dust particles, and the higher the concentration of the dust particles is, the lower the intensity of the light signals received by the light receiving unit 112 is, if there is no dust particle in the dust absorption pipeline in the processing process of the circuit board, it is determined that the tool has been cut off; or the broken drill bit blocks light through the glass tube in the process of processing the circuit board, so that the light receiving unit 120 cannot receive the light signal, and the cutter breaking can be confirmed.
Optionally, referring to fig. 3, the single chip microcomputer 200 includes a first comparison circuit 210 and a second comparison circuit 220; the first comparing circuit 210 is electrically connected to the first sub-processing module 121 for determining whether the voltage value output by the first sub-processing module 121 is equal to the first potential signal; the second comparing circuit 220 is electrically connected to the second sub-processing module 122 for determining whether the voltage value output by the second sub-processing module 122 is higher than the second potential signal. The single chip microcomputer 200 further comprises an or gate circuit 230; the or gate circuit 230 is electrically connected to the first and second comparison circuits 210 and 220, respectively; when the first comparison circuit 210 determines that the voltage value output by the first sub-processing module 121 is equal to the first potential signal and/or the second comparison circuit 220 determines that the voltage value output by the second sub-processing module 122 is higher than the second potential signal, the or gate circuit 230 outputs a high level signal, and the single chip microcomputer 200 determines that the circuit board processing equipment is broken. Illustratively, the or gate 230 includes two signal receiving terminals, a first comparing circuit 210 electrically connected to a first receiving terminal c1 of the or gate 230, and a second comparing circuit 220 electrically connected to a second receiving terminal c2 of the or gate 230.
Specifically, the first sub-processing module 121 performs photoelectric conversion and amplification processing on the optical signal based on the dust concentration received by the light receiving unit 112, and outputs an analog electrical signal that continuously changes according to the continuous change of the dust concentration to the first comparison circuit 210, and the lower the dust concentration in the dust suction duct is, the stronger the optical signal received by the light receiving unit 112 is, the larger the electrical signal output by the first sub-processing module 121 is. When the circuit board processing equipment is broken, there is no dust in the dust suction pipe, and at this time, the electrical signal output by the first sub-processing module 121 reaches the maximum value, and the maximum value is equal to the first potential signal, so if the first comparing circuit 210 determines that the voltage value of the signal output by the first sub-processing module 121 is equal to the first potential signal, a high level signal is output to the or gate circuit 230 through the first receiving terminal c 1. In addition, the second sub-processing module 122 performs photoelectric conversion and amplification processing on the optical signal based on the broken knife received by the light receiving unit 112, and specifically, the electrical signal when the broken knife passes through the dust collection pipe is greater than the electrical signal when the broken knife does not pass through the dust collection pipe; preferably, the second sub-processing module 122 outputs a high level signal to the second comparing circuit 220, and when no broken blade passes through the dust suction pipe, the second sub-processing module 122 outputs a low level signal to the second comparing circuit 220, the low level signal is equal to the second potential signal, so that if the second comparing circuit 220 determines that the voltage value of the signal output by the second sub-processing module 122 is higher than the second potential signal, the second receiving terminal c2 outputs a high level signal to the or gate circuit 230. If the first receiving end c1 and/or the second receiving end c2 of the or gate circuit 230 receive the high level signal, the or gate circuit 230 outputs the high level signal, otherwise outputs the low level signal; when the or gate circuit 230 outputs a high level signal, the single chip microcomputer 200 judges that the circuit board processing equipment is broken; when the or gate circuit 230 outputs a low level signal, the single chip microcomputer 200 judges that the circuit board processing equipment is not broken. The first potential signal may be 5V, and the second potential signal may be 0V.
Optionally, fig. 4 is a schematic structural diagram of a knife breakage detection device of another circuit board processing device according to an embodiment of the present invention, and as shown in fig. 4, the single chip microcomputer 200 includes a first analog signal receiving terminal i1 and a second analog signal receiving terminal i 2; the first analog signal receiving terminal i1 is electrically connected to the first sub-processing module 121 and the first comparing circuit 210, respectively; the second analog signal receiving terminal i2 is electrically connected to the second sub-processing module 122 and the second comparing circuit 220, respectively.
Specifically, the electrical signals processed by the signal processing module 120 are analog voltage signals, and the electrical signals processed by the first sub-processing circuit 121 and the second sub-processing circuit 122 can be respectively transmitted to the first comparing circuit 210 and the second comparing circuit 220 of the single chip microcomputer 200 through the analog input end of the single chip microcomputer 200.
Optionally, referring to fig. 4, the single chip microcomputer 200 further includes a metering module 240; metering module 240 includes a timer 241 and/or a counter 242; the metering module 240 is configured to receive the operation trigger information provided by the control module 300, and generate metering information according to the operation trigger information; the single chip microcomputer 200 judges whether the circuit board processing equipment is broken according to the detection signal in the metering period of the metering information and outputs the judgment information to the control module 300. For example, when the control module 300 controls the circuit board processing equipment to perform work (when drilling is started and a tool tip contacts the circuit board), the single chip microcomputer 200 is triggered to enter a detection state, and the single chip microcomputer 200 judges whether tool breakage occurs or not according to a detection signal in the detection state.
Specifically, the control module 300 outputs the operation trigger information to the metering module 240 of the single chip microcomputer 200 when the circuit board processing equipment starts to work, a timer 241 of the metering module 240 starts to count time, and the counter 242 can count the detection times; the single chip microcomputer 200 judges whether the circuit board processing equipment is broken in a metering period according to the detection signal, the metering period can be set to be the time for completing one processing (drilling, milling and the like) of the circuit board processing equipment under the condition of not breaking the cutter, and the counter 242 can count once when the single chip microcomputer 200 completes one judgment.
The embodiment of the invention sets the detection period of the single chip microcomputer for detecting the broken cutter through the metering module of the single chip microcomputer, counts the detection period, can control the single chip microcomputer to stop detecting after the circuit board processing equipment completes processing under the condition of no broken cutter, and can count the broken cutter times, so that the subsequent work of the circuit board processing equipment can be optimized and adjusted, and the function of the broken cutter detection device of the circuit board processing equipment provided by the embodiment of the invention is optimized.
Optionally, with continued reference to fig. 4, the control module 300 is configured to control the working state of the circuit board processing equipment according to the determination information and the measurement period; the judging information comprises broken cutter information and unbroken cutter information, and the control module 300 is used for controlling the circuit board processing equipment to stop running and controlling the circuit board processing equipment to change the cutter according to the broken cutter information; in the timing period, the control module 300 controls the circuit board processing equipment to continue to operate according to the information of the uninterrupted cutter; when the timing period is exceeded, the control module 300 controls the circuit board processing equipment to stop running.
Specifically, the single chip microcomputer 200 judges whether the circuit board processing equipment is broken according to the received detection signals based on the dust particle concentration and the drill bit passing information, and generates judgment information; the judgment information comprises broken cutter information and non-broken cutter information, if the broken cutter is confirmed, the broken cutter information is generated and output to the control module 300, and at the moment, the control module 300 controls the circuit board processing equipment to stop processing according to the broken cutter information and controls the circuit board processing equipment to change the cutter. If the tool is not broken, generating information of the tool to be broken and outputting the information to the control module 300; in the timing period, the control module 300 controls the circuit board processing equipment to continue to operate according to the information of the uninterrupted cutter; when the timing period is exceeded, the control module 300 controls the circuit board processing equipment to stop running according to the information of the unbroken cutter, and the processing is finished.
According to the device for detecting the broken cutter of the circuit board processing equipment, provided by the embodiment of the invention, the broken cutter detection result of the single chip microcomputer, namely judgment information, is output to the control module, the control module controls the working state of the circuit board processing equipment according to the judgment information, if the broken cutter is detected, the circuit board processing equipment is controlled to stop running for cutter changing, and if the broken cutter is not detected, the circuit board processing equipment is controlled to continue running until the processing is completed according to the timing period, so that the automation degree of the device for detecting the broken cutter of the circuit board processing equipment provided by the embodiment of the invention is improved.
Optionally, an embodiment of the present invention provides a method for detecting a broken blade of a circuit board processing device, where the method for detecting a broken blade can achieve a function of detecting a broken blade of the circuit board processing device according to dust concentration or broken blade particles in a dust collection pipeline, and the method for detecting a broken blade is executed by the device for detecting a broken blade provided by the embodiment of the present invention. The circuit board processing equipment comprises a control module, a chip suction cover and a dust suction pipeline, the broken cutter detection device comprises a dust sensing device and a single chip microcomputer, the dust sensing device is arranged on the dust suction pipeline or the chip suction cover, and the single chip microcomputer is respectively and electrically connected with the dust sensing device and the control module; fig. 5 is a flowchart of a method for detecting a broken blade of a circuit board processing device according to an embodiment of the present invention, and as shown in fig. 5, the method for detecting a broken blade includes:
s110, when the control module controls the circuit board processing equipment to operate, a trigger signal is output to the single chip microcomputer, and the single chip microcomputer enters a detection state according to the trigger signal;
s120, outputting a detection signal to the single chip microcomputer by the dust sensing device according to the dust concentration and/or the cutter breakage;
s130, the single chip microcomputer in the detection state judges whether the cutter is broken or not according to the detection signal and outputs judgment information to the control module, and the control module controls the working state of the circuit board processing equipment according to the judgment information.
Specifically, control module outputs trigger signal to the singlechip when control circuit board processing equipment carries out the operation (begins drilling, when the knife tip contacts the circuit board), the singlechip receives to begin to move after trigger signal and gets into the detection state, circuit board processing equipment is to the dust that produces of circuit board processing man-hour, dust induction system generates the detection signal according to the dust concentration in the dust absorption pipeline and/or disconnected sword (the drill bit or the milling cutter that break), and export detection signal to the singlechip, the singlechip can judge whether the circuit board processing equipment breaks the sword according to detection signal, and judge the information output to control module promptly with the sword judgement result that breaks, control module is according to the operating condition of information control circuit board processing equipment. Illustratively, if the control module receives the cutter breaking information, the circuit board processing equipment is controlled to stop processing and is controlled to change the cutter; and if the control module receives the information of the non-broken cutter, controlling the circuit board processing equipment to continue to operate until the operation is finished.
According to the method for detecting the broken cutter of the circuit board processing equipment, provided by the embodiment of the invention, the signal based on dust and the signal based on the broken cutter information are collected and processed at the same time, and the processed signals are output to the single chip microcomputer for judgment, so that two judgment results can be verified mutually, the accuracy of broken cutter detection is improved, the method is simple in structure and convenient to operate, the real-time detection of the broken cutter condition is realized, the problems of errors, low production efficiency and the like caused by manual adjustment are solved, and the complexity and the scrap of plates in the processing process are reduced.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A broken cutter detection device of circuit board processing equipment, the circuit board processing equipment comprises a control module, a chip suction cover and a dust suction pipeline, and is characterized in that,
the broken cutter detection device comprises a dust sensing device and a single chip microcomputer;
the dust sensing device comprises a sensing module and a signal processing module, the sensing module is arranged on the dust suction pipeline or the dust suction cover and used for detecting dust concentration and/or cutter breaking, the signal processing module comprises a first sub-processing module used for processing a dust concentration signal and/or a second sub-processing module used for processing a cutter breaking signal, and the first sub-processing module and/or the second sub-processing module output a detection signal to the single chip microcomputer according to a detection result of the sensing module;
the single chip microcomputer is electrically connected with the dust sensing device and the control module respectively, and judges whether the cutter is broken or not according to the detection signal and feeds back judgment information to the control module.
2. The device for detecting the knife breakage of the circuit board processing equipment according to claim 1, wherein when the sensing module detects that the dust concentration is continuously unchanged or increased, the voltage value output by the first sub-processing module keeps a preset value or is reduced; when the sensing module detects that the dust concentration is reduced, the voltage value output by the first sub-processing module is increased;
when the sensing module does not detect the cutter breaking, the voltage value output by the second sub-processing module is kept to be 0V; when the sensing module detects that the cutter is broken, the voltage value output by the second sub-processing module is increased.
3. The broken knife detection device of the circuit board processing equipment according to claim 1, wherein the single chip microcomputer comprises a first comparison circuit and a second comparison circuit;
the first comparison circuit is electrically connected with the first sub-processing module and used for judging whether the voltage value output by the first sub-processing module is equal to a first potential signal or not;
the second comparison circuit is electrically connected with the second sub-processing module and used for judging whether the voltage value output by the second sub-processing module is higher than a second potential signal or not.
4. The broken knife detection device of the circuit board processing equipment according to claim 3, characterized in that the single chip microcomputer further comprises an OR gate circuit;
the OR gate circuit is electrically connected with the first comparison circuit and the second comparison circuit respectively; when the first comparison circuit judges that the voltage value output by the first sub-processing module is equal to the first potential signal and/or the second comparison circuit judges that the voltage value output by the second sub-processing module is higher than the second potential signal, the OR gate circuit outputs a high level signal, and the singlechip judges that the circuit board processing equipment is broken.
5. The device for detecting the knife breakage of the circuit board processing equipment according to claim 1, wherein the control module triggers the single chip microcomputer to enter a detection state when controlling the circuit board processing equipment to operate, and the single chip microcomputer judges whether the knife breakage occurs or not according to the detection signal in the detection state.
6. The broken knife detection device of the circuit board processing equipment according to claim 3, wherein the single chip microcomputer comprises a first analog signal receiving end and a second analog signal receiving end;
the first analog signal receiving end is electrically connected with the first sub-processing module and the first comparison circuit respectively;
the second analog signal receiving end is electrically connected with the second sub-processing module and the second comparison circuit respectively.
7. The device for detecting the knife breakage of the circuit board processing equipment according to claims 1 to 6, wherein the sensing module comprises a light emitting unit and a light receiving unit, the dust suction pipeline comprises a light transmitting section, and the light emitting unit and the light receiving unit are respectively arranged on two sides of the light transmitting section.
8. The broken knife detection device of the circuit board processing equipment according to claim 1, wherein the single chip microcomputer further comprises a metering module; the metering module comprises a timer and/or a counter;
the metering module is used for receiving the operation triggering information provided by the control module and generating metering information according to the operation triggering information;
and the single chip microcomputer judges whether the circuit board processing equipment is broken or not according to the detection signal in the metering period of the metering information and outputs the judgment information to the control module.
9. The device for detecting the knife breakage of the circuit board processing equipment according to claim 8, wherein the judgment information includes knife breakage information and knife non-breakage information, and the control module is configured to control the working state of the circuit board processing equipment according to the judgment information and the metering cycle;
the control module is used for controlling the circuit board processing equipment to stop running and controlling the circuit board processing equipment to change the cutter according to the cutter breaking information;
in the timing period, the control module controls the circuit board processing equipment to continue to operate according to the information of the uninterrupted cutter; and when the timing period is exceeded, the control module controls the circuit board processing equipment to stop running.
10. A method for detecting the broken cutter of a circuit board processing device comprises a control module, a chip suction cover and a dust suction pipeline, and is characterized by further comprising a broken cutter detection device, wherein the broken cutter detection device comprises a dust sensing device and a single chip microcomputer, the dust sensing device is arranged on the dust suction pipeline or the chip suction cover, and the single chip microcomputer is respectively and electrically connected with the dust sensing device and the control module;
the broken cutter detection method comprises the following steps:
when the control module controls the circuit board processing equipment to operate, a trigger signal is output to the single chip microcomputer, and the single chip microcomputer enters a detection state according to the trigger signal;
the dust sensing device outputs a detection signal to the single chip microcomputer according to dust concentration and/or cutter breakage;
the single chip microcomputer in the detection state judges whether the cutter is broken or not according to the detection signal and outputs judgment information to the control module, and the control module controls the working state of the circuit board processing equipment according to the judgment information.
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