CN112894169B - Laser cutting machine for two-dimensional semiconductor photoelectric device - Google Patents
Laser cutting machine for two-dimensional semiconductor photoelectric device Download PDFInfo
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- CN112894169B CN112894169B CN202110189248.7A CN202110189248A CN112894169B CN 112894169 B CN112894169 B CN 112894169B CN 202110189248 A CN202110189248 A CN 202110189248A CN 112894169 B CN112894169 B CN 112894169B
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 21
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000009434 installation Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 abstract description 11
- 239000002699 waste material Substances 0.000 abstract description 3
- 238000005520 cutting process Methods 0.000 description 11
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 206010028980 Neoplasm Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser cutting machine for a two-dimensional semiconductor photoelectric device, which comprises an operation table and a laser machine, wherein the outer side wall of the laser machine is fixedly connected with a mechanical arm, the end part of the mechanical arm is fixedly connected with a first rotating arm and a second rotating arm, the top part of the operation table is fixedly connected with an installation column, the outer side wall of the installation column is sleeved with a laser plate, the operation table is provided with an installation groove, the inner side wall of the installation groove is fixedly connected with an installation plate, a rotating groove is arranged on the installation plate, the inner side wall of the rotating groove is fixedly connected with a plurality of fixed rods, and the outer side wall of each fixed rod is rotatably sleeved with a first baffle and a second baffle which are symmetrically arranged. According to the invention, the collection of the finished products is realized, the finished products and the leftover materials are effectively classified, manual sorting is not needed, the collecting tank filled with the finished products is covered, so that the leftover materials fall into other collecting tanks, the finished products and the leftover materials are distinguished, and waste products divided by laser are dropped into the collecting tank.
Description
Technical Field
The invention relates to the field of laser cutting machines, in particular to a laser cutting machine for a two-dimensional semiconductor photoelectric device.
Background
The laser cutting machine focuses laser emitted from a laser into a laser beam with high power density through an optical path system. The laser beam irradiates the surface of a workpiece to enable the workpiece to reach a melting point or a boiling point, simultaneously, the high-pressure gas coaxial with the laser beam blows away the melted or gasified metal, and the material finally forms a kerf along with the movement of the relative position of the laser beam and the workpiece, so that the aim of cutting is fulfilled, the laser cutting processing is to replace the traditional mechanical knife by the invisible light beam, has the characteristics of high precision, high cutting speed, no limitation to cutting patterns, automatic typesetting, material saving, smooth cut, low processing cost and the like, is gradually improved or replaced by the traditional metal cutting process equipment, the mechanical part of a laser knife head is not in contact with the workpiece, and the surface of the workpiece cannot be scratched in the working process; the laser cutting speed is high, the cut is smooth and flat, and subsequent processing is generally not needed; the cutting heat affected zone is small, the deformation of the plate is small, and the cutting seam is narrow (0.1mm to 0.3mm); the notch has no mechanical stress and no shearing burr; the processing precision is high, the repeatability is good, and the surface of the material is not damaged; numerical control programming can be used for processing any plan, the whole board with large breadth can be cut, a die does not need to be opened, and the method is economical and time-saving.
Current laser cutting machine is when using, cut to the laser board, can produce a lot of pieces when cutting off the finished product, the piece also can be along with the cutting in the corresponding collecting vat, and the finished product that the cutting formed also can drop in the same collecting vat, need finished product just need to filter the finished product in the collecting vat, just need follow the piece in the finished product letter sorting and choose, the sweeps that wherein produce causes the injury to the hand, finished product and sweeps pile up to be difficult to distinguish together and lead to careful inadequately of screening, cause the waste of resource, consequently, a laser cutting machine for two-dimensional semiconductor photoelectric device is proposed.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides a laser cutting machine for a two-dimensional semiconductor photoelectric device.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a two-dimentional semiconductor laser cutting machine for photoelectric device, includes operation panel and laser machine, laser machine lateral wall fixedly connected with arm, first rotor arm and the second rotor arm of arm tip fixedly connected with, operation panel top fixedly connected with erection column, the laser board has been cup jointed to the erection column lateral wall, the operation panel is equipped with the mounting groove, mounting groove inside wall fixed connection mounting panel, be equipped with the rotation groove on the mounting panel, rotate a plurality of dead levers of inslot inside wall fixedly connected with, the dead lever lateral wall rotates first baffle and the second baffle that cup joints the symmetry and sets up, the operation panel is equipped with the swivelling chute, the swivelling chute passes through engagement mechanism and is connected with first rotor arm, first baffle passes through drive mechanism and is connected with the second baffle, the operation panel is equipped with a plurality of collecting troughs, the collecting vat top is connected with the second rotor arm through clamping mechanism and pushing mechanism.
Preferably, the meshing mechanism comprises a first meshing wheel fixedly connected to the side wall of the rotating groove, a second meshing wheel fixedly connected to the inner side wall of the rotating groove, a first rotating tooth is arranged on the outer side wall of the first meshing wheel, a second rotating tooth is arranged at the end part of the first rotating arm, and the first rotating tooth is meshed with the second rotating tooth.
Preferably, the traction mechanism comprises a plurality of first fixed blocks fixedly connected to the outer side wall of the first baffle, the outer side wall of the second baffle is fixedly connected with a second fixed block, the first fixed blocks are adjacent to each other and connected through a first traction wire, the second fixed blocks are connected through a second traction wire, and the end portions of the first traction wire and the second traction wire are fixedly connected with the side wall of the first meshing wheel respectively.
Preferably, the clamping mechanism comprises clamping blocks which are fixedly connected to the top of the operating platform and symmetrically arranged, a sliding cover plate is arranged at the top of the collecting tank, and a connecting rod is fixedly connected to the outer side wall of the sliding cover plate and is adjacent to the connecting rod through a pull rod.
Preferably, the pushing mechanism comprises a pushing plate, the end part of the pushing plate is rotatably connected with the end part of the second rotating arm, the pushing plate is fixedly connected with the pull rod, and the pushing plate is connected with the first rotating arm through a telescopic mechanism.
Preferably, telescopic machanism includes the telescopic link of fixed connection at the slurcam lateral wall, telescopic link tip and first rotation arm lateral wall fixed connection, the telescopic link lateral wall is equipped with expanding spring, the expanding spring tip respectively with slurcam lateral wall and first rotation arm lateral wall fixed connection.
Preferably, the clamping blocks are arranged in an L shape, the clamping blocks are arranged oppositely, and the thickness of the sliding cover plate is the same as the height of the clamping blocks.
Preferably, the outer side wall of the first baffle plate at the leftmost end is fixedly connected with a traction spring, and the end part of the traction spring is fixedly connected with the inner side wall of the rotating groove.
The beneficial effects of the invention are as follows:
1. according to the laser processing device, the laser plate is fixed on the mounting column, after the laser plate to be processed is fixed, the mechanical arm is started to move, the generated laser cuts the laser plate, a finished product can be generated during cutting, the generated finished product drops from a gap in the first baffle and falls into a collecting tank located right at the bottom of the first baffle, meanwhile, when the laser machine works, the pushing plate moves forwards to drive the sliding cover plate to be located at the top of the collecting tank at the bottom of the second baffle, the collecting tank is covered, meanwhile, the sliding cover plate is located in the clamping block, the clamping block limits movement of the sliding cover plate, the finished product drops into the collecting tank, collection of the finished product is achieved, the finished product and leftover materials are effectively classified, and manual sorting is not needed.
2. When a finished product falls and scattered corners need to be recovered, the laser machine stops operating, the mechanical arm rotates to drive the first rotating arm and the second rotating arm to rotate, the first rotating arm rotates around the second meshing wheel, the second meshing wheel rotates to drive the first meshing wheel to rotate, the first meshing wheel rotates to drive the wound traction line to rotate, the first traction line drives the first baffle plate to rotate, the second traction line drives the second baffle plate to rotate, the second baffle plate rotates to open, meanwhile, the pushing plate moves rightwards to drive the pull rod to move rightwards, the pull rod moves rightwards to drive the connecting rod to move rightwards, the sliding cover plate moves rightwards to the top of a collecting tank containing the finished product, the collecting tank containing the finished product is covered, so that the leftover materials fall into other collecting tanks, the finished product is distinguished from the leftover materials, and waste products divided by the laser are collected into the collecting tanks.
Drawings
Fig. 1 is a schematic structural view of a laser cutting machine for a two-dimensional semiconductor optoelectronic device according to the present invention.
Fig. 2 is an enlarged view of the invention at a in fig. 1.
Fig. 3 is an enlarged view of the invention at B in fig. 1.
Fig. 4 is a schematic structural connection diagram of a fixing rod, a first baffle, a traction mechanism, a first meshing wheel and a pushing plate of the laser cutting machine for the two-dimensional semiconductor photoelectric device of the invention.
Fig. 5 is a schematic structural connection diagram of a pushing mechanism of a laser cutting machine for a two-dimensional semiconductor optoelectronic device according to the present invention.
Fig. 6 is a schematic view of structural connection of the mounting plate, the fixing rod and the first baffle of the laser cutting machine for the two-dimensional semiconductor photoelectric device of the present invention.
FIG. 7 is a schematic view showing structural connection between a collecting tank, a clamping block and an operation table of a laser cutting machine for a two-dimensional semiconductor photoelectric device according to the present invention.
The reference numbers in the figures: 1. an operation table; 2. a laser machine; 3. a mechanical arm; 4. a second rotating arm; 5. a first rotation arm; 6. a push plate; 7. a second meshing wheel; 8. a first meshing wheel; 9. sliding the cover plate; 10. a pull rod; 11. a connecting rod; 12. mounting a column; 13. a laser plate; 14. a telescopic rod; 15. mounting a plate; 16. a traction spring; 17. a fixing rod; 18. a first baffle; 19. a second baffle; 20. a first fixed block; 21. a first traction wire; 22. a second traction wire; 23. collecting tank; 24. a clamping block; 25. a second fixed block; 26. a telescopic spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-7, a two-dimensional laser cutting machine for semiconductor photoelectric device, including operation panel 1 and laser machine 2, it should be noted that, the model specification of laser machine 2 needs to carry out the type selection according to the actual specification of the device etc. and confirms, concrete type selection calculation method adopts prior art in this field, so no longer detailed neoplasms, 2 lateral wall fixedly connected with arm 3 of laser machine, arm 3 tip fixedly connected with first rotor arm 5 and second rotor arm 4, operation panel 1 top fixedly connected with erection column 12, erection column 12 lateral wall cup joints laser board 13, erection column 12 fixes laser board 13, operation panel 1 is equipped with the mounting groove, mounting groove inside wall fixedly connected with mounting panel 15, be equipped with the rotation groove on mounting panel 15, rotation groove inside wall fixedly connected with a plurality of dead levers 17, installation dead lever 17 lateral wall rotates and cup joints first baffle 18 and the second baffle 19 that the symmetry set up.
Operation panel 1 is equipped with the swivelling chute, and the swivelling chute passes through engagement mechanism to be connected with first rotation arm 5, and engagement mechanism includes fixed connection at the first meshing wheel 8 of swivelling chute lateral wall, and swivelling chute inside wall fixedly connected with second meshing wheel 7, 8 lateral walls of first meshing wheel are equipped with first rotation tooth, and 5 tip of first rotation arm are equipped with the second and rotate the tooth, and first rotation tooth rotates the tooth with the second and meshes mutually.
The first baffle 18 is connected with the second baffle 19 through a traction mechanism, the traction mechanism comprises a plurality of first fixing blocks 20 fixedly connected to the outer side wall of the first baffle 18, the outer side wall of the second baffle 19 is fixedly connected with second fixing blocks 25, adjacent first fixing blocks 20 are connected through first traction lines 21, the second fixing blocks 25 are connected through second traction lines 22, the end portions of the first traction lines 21 and the second traction lines 22 are respectively fixedly connected with the side wall of the first meshing wheel 8, the outer side wall of the first baffle 18 located at the leftmost end is fixedly connected with a traction spring 16, and the end portion of the traction spring 16 is fixedly connected with the inner side wall of the rotating groove.
Operating platform 1 is equipped with a plurality of collecting vats 23, complete components and parts and leftover bits are collected respectively to collecting vat 23, collecting vat 23 top is passed through the clamping mechanism and is connected with pushing mechanism and second rotor arm 4, the clamping mechanism includes the joint piece 24 of the symmetry setting at 1 top of operating platform of fixed connection, joint piece 24 is L shape setting, joint piece 24 sets up relatively, sliding cover 9 thickness is the same with joint piece 24 height, make things convenient for sliding cover 9 to slide between joint piece 24, collecting vat 23 top is equipped with sliding cover 9, sliding cover 9 area just in time can cover the opening of collecting vat 23, sliding cover 9 lateral wall fixedly connected with connecting rod 11, adjacent connecting rod 11 passes through pull rod 10 fixed connection, pushing mechanism includes catch plate 6, catch plate 6 tip and the rotation of second rotor arm 4 tip are connected, catch plate 6 and pull rod 10 fixed connection, catch plate 6 is connected with first rotor arm 5 through telescopic mechanism, telescopic mechanism includes telescopic link 14 of fixed connection at the lateral wall of catch plate 6, the tip of telescopic link 14 is connected with first rotor arm 5 lateral wall fixed connection, the lateral wall 14 lateral wall is equipped with expanding spring 26, expanding spring 26 tip is connected with catch plate 6 and first rotor arm 6 respectively, the lateral wall fixed connection of telescopic arm 5 makes things convenient for the back-and-forth movement mechanism to move the back and-forth movement mechanism lateral wall.
The working principle is as follows: fix laser board 13 on erection column 12, need the laser board 13 of processing after fixed, laser machine 2 starts the removal, the laser of production cuts laser board 13, can produce the finished product in the cutting, the finished product that produces drops from the gap in first baffle 18, drop to the collecting vat 23 that is located first baffle 18 positive bottom, simultaneously laser machine 2 is in operation, slurcam 6 is to the forward movement, when driving collecting vat 23 top that sliding cover board 9 is located second baffle 19 bottom, cover collecting vat 23, sliding cover board 9 is located joint piece 24 simultaneously, joint piece 24 has restricted sliding cover board 9's removal, the finished product drops to in collecting vat 23.
When the finished product falls and scattered corners need to be recovered, the laser machine 2 stops operating, the mechanical arm 3 rotates to drive the first rotating arm 5 and the second rotating arm 4 to rotate, the first rotating arm 5 rotates around the second meshing wheel 7, the second meshing wheel 7 rotates to drive the first meshing wheel 8 to rotate, the first meshing wheel 8 rotates to drive the wound pull line to rotate, the first pull line 21 drives the first baffle 18 to rotate, the second pull line 22 drives the second baffle 19 to rotate, the second baffle 19 rotates to open, meanwhile, the push plate 6 moves rightwards to drive the pull rod 10 to move rightwards, the pull rod 10 moves rightwards to drive the connecting rod 11, the connecting rod 11 moves rightwards to drive the sliding cover plate 9 to move rightwards to the top of the collecting tank 23 containing the finished product, the collecting tank 23 containing the finished product is covered, and the leftover material falls into other collecting tanks 23, so that the finished product and the leftover material are distinguished.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (3)
1. The laser cutting machine for the two-dimensional semiconductor photoelectric device comprises an operation table (1) and a laser machine (2), and is characterized in that the outer side wall of the laser machine (2) is fixedly connected with a mechanical arm (3), the end part of the mechanical arm (3) is fixedly connected with a first rotating arm (5) and a second rotating arm (4), the top of the operation table (1) is fixedly connected with an installation column (12), the outer side wall of the installation column (12) is sleeved with a laser plate (13), the operation table (1) is provided with an installation groove, the inner side wall of the installation groove is fixedly connected with an installation plate (15), a rotating groove is arranged on the installation plate (15), the inner side wall of the rotating groove is fixedly connected with a plurality of fixing rods (17), the outer side wall of each fixing rod (17) is rotatably sleeved with a first baffle (18) and a second baffle (19) which are symmetrically arranged, the operation table (1) is provided with a rotating groove, the rotating groove is connected with the first rotating arm (5) through an engagement mechanism, the first baffle (18) is connected with the second baffle (19) through a traction mechanism, the operation table (1) is provided with a plurality of collecting grooves (23), and the top of the second rotating arm is connected with a second pushing mechanism (4); the clamping mechanism comprises symmetrically arranged clamping blocks (24) fixedly connected to the top of the operating platform (1), a sliding cover plate (9) is arranged at the top of the collecting tank (23), the outer side wall of the sliding cover plate (9) is fixedly connected with a connecting rod (11), and the adjacent connecting rods (11) are fixedly connected through a pull rod (10); the pushing mechanism comprises a pushing plate (6), the end part of the pushing plate (6) is rotatably connected with the end part of the second rotating arm (4), the pushing plate (6) is fixedly connected with a pull rod (10), and the pushing plate (6) is connected with the first rotating arm (5) through a telescopic mechanism; the telescopic mechanism comprises a telescopic rod (14) fixedly connected to the outer side wall of the pushing plate (6), the end part of the telescopic rod (14) is fixedly connected with the outer side wall of the first rotating arm (5), a telescopic spring (26) is arranged on the outer side wall of the telescopic rod (14), and the end part of the telescopic spring (26) is fixedly connected with the outer side wall of the pushing plate (6) and the outer side wall of the first rotating arm (5) respectively; the clamping blocks (24) are arranged in an L shape, the clamping blocks (24) are arranged oppositely, and the thickness of the sliding cover plate (9) is the same as the height of the clamping blocks (24); and the outer side wall of the first baffle (18) positioned at the leftmost end is fixedly connected with a traction spring (16), and the end part of the traction spring (16) is fixedly connected with the inner side wall of the rotating groove.
2. The laser cutting machine for the two-dimensional semiconductor photoelectric devices according to claim 1, wherein the meshing mechanism comprises a first meshing wheel (8) fixedly connected to the side wall of the rotating groove, a second meshing wheel (7) is fixedly connected to the inner side wall of the rotating groove, a first rotating tooth is arranged on the outer side wall of the first meshing wheel (8), a second rotating tooth is arranged at the end part of the first rotating arm (5), and the first rotating tooth is meshed with the second rotating tooth.
3. The laser cutting machine for the two-dimensional semiconductor photoelectric device according to claim 2, wherein the traction mechanism comprises a plurality of first fixing blocks (20) fixedly connected to the outer side wall of the first baffle (18), the outer side wall of the second baffle (19) is fixedly connected with a second fixing block (25), the adjacent first fixing blocks (20) are connected through a first traction wire (21), the second fixing blocks (25) are connected through a second traction wire (22), and the end parts of the first traction wire (21) and the second traction wire (22) are respectively fixedly connected with the side wall of the first meshing wheel (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110189248.7A CN112894169B (en) | 2021-02-19 | 2021-02-19 | Laser cutting machine for two-dimensional semiconductor photoelectric device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110189248.7A CN112894169B (en) | 2021-02-19 | 2021-02-19 | Laser cutting machine for two-dimensional semiconductor photoelectric device |
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| CN112894169A CN112894169A (en) | 2021-06-04 |
| CN112894169B true CN112894169B (en) | 2022-12-06 |
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| CN116638687A (en) * | 2023-06-08 | 2023-08-25 | 保定市高能电力成套设备有限公司 | Sizing material overlap excess material clearing device of arrester production |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101759843B1 (en) * | 2016-08-19 | 2017-07-19 | 강성광 | Automation System For Laser Cutting Machine |
| CN109366002B (en) * | 2018-12-25 | 2020-12-11 | 成都四吉达新材料科技有限公司 | Mechanism is collected to laser cutting machine's piece |
| CN209349689U (en) * | 2018-12-29 | 2019-09-06 | 天津宝骏科技股份有限公司 | A kind of laser cutting machine waste material collection device |
| CN110039191B (en) * | 2019-04-10 | 2021-06-15 | 济南金威刻科技发展有限公司 | Sheet-metal tube laser cutting debris collection device |
| CN110434480A (en) * | 2019-07-23 | 2019-11-12 | 佛山汇百盛激光科技有限公司 | A kind of laser Pipe Cutting equipment |
| CN110495429B (en) * | 2019-08-27 | 2021-05-18 | 西安理工大学 | Artificial substrate benthonic animal collection system |
| CN110756439B (en) * | 2019-11-07 | 2021-09-03 | 福建国为联华实业有限责任公司 | Municipal solid waste sorting equipment |
| CN212074439U (en) * | 2020-01-03 | 2020-12-04 | 湖南博瑞通航航空技术有限公司 | Convenient conveyer of unmanned aerial vehicle |
| CN212093095U (en) * | 2020-02-21 | 2020-12-08 | 刘璐芳 | Goods sorting device for logistics transportation |
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