CN112885939B - Packaging structure, electronic equipment and transmitting device thereof - Google Patents
Packaging structure, electronic equipment and transmitting device thereof Download PDFInfo
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- CN112885939B CN112885939B CN201911107967.9A CN201911107967A CN112885939B CN 112885939 B CN112885939 B CN 112885939B CN 201911107967 A CN201911107967 A CN 201911107967A CN 112885939 B CN112885939 B CN 112885939B
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- 238000004806 packaging method and process Methods 0.000 title claims description 18
- 238000012544 monitoring process Methods 0.000 claims abstract description 11
- 238000005538 encapsulation Methods 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims description 24
- 230000001681 protective effect Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 3
- 238000000638 solvent extraction Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 7
- 230000004308 accommodation Effects 0.000 abstract 4
- 238000004020 luminiscence type Methods 0.000 abstract 3
- 238000009792 diffusion process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The utility model relates to an encapsulation structure, electron device's emitter and electron device, encapsulation structure is used for encapsulating luminescence unit, encapsulation structure includes the body, the body forms the accommodation space, luminescence unit holding is in the accommodation space, encapsulation structure is still including setting up at least one temperature sensing unit in the accommodation space, the temperature sensing unit is arranged in monitoring the temperature in the accommodation space, so that adjust according to the operating temperature of luminescence unit who monitors, realize the temperature drift compensation, promote electron device's the effect of making a video recording, obtain better use and experience.
Description
Technical Field
The present disclosure relates to the field of electrical component installation, and in particular, to a package structure, an electronic device and an emission device for the electronic device.
Background
In the related art, electronic devices such as mobile phones have a 3D image capturing function, and the 3D image capturing function will become an important direction for developing the image capturing function of the electronic devices.
At present, known emitting devices based on 3D imaging technical principles such as structured light, flight time, binocular structured light and the like all need to use an infrared laser light emitting unit. In order to ensure the imaging effect and adapt to various complex imaging environments, the infrared laser light-emitting unit is required to meet various requirements of large power, long acting distance, long working time, small power consumption, high precision, safety, reliability and the like.
However, in the working process of the infrared laser light-emitting unit, as the temperature of the infrared laser light-emitting unit gradually rises, important performances such as optical power and the like of the infrared laser light-emitting unit are reduced, and the imaging effect is directly influenced.
Disclosure of Invention
To overcome the problems in the related art, the present disclosure provides a package structure, an electronic device and a transmitting device thereof.
According to a first aspect of the embodiments of the present disclosure, a package structure is provided, configured to package a light emitting unit, where the package structure includes a body, where the body forms an accommodating space, the light emitting unit is accommodated in the accommodating space, and the package structure further includes at least one temperature sensing unit disposed in the accommodating space, and the temperature sensing unit is configured to monitor a temperature in the accommodating space.
Optionally, the package structure further includes a temperature sensing electrical connection portion electrically connected to the temperature sensing unit, and the temperature sensing unit is disposed on a side of the light emitting unit away from the light emitting direction through the temperature sensing electrical connection portion.
Optionally, the temperature sensing unit includes an electrode and a temperature sensing portion, the temperature sensing unit is disposed in the accommodating space in an inverted state through the temperature sensing electrical connection portion, in the inverted state, the electrode is located on a side close to the light emitting unit, and the temperature sensing portion is located on a side far from the light emitting unit.
Optionally, the temperature sensing electrical connection portion includes a first temperature sensing electrical connection unit electrically connected to a first external circuit, and a second temperature sensing electrical connection unit electrically connected to the electrode, and the first temperature sensing electrical connection unit is electrically connected to the second temperature sensing electrical connection unit;
the first temperature-sensing electric connection unit is arranged on one side of the body, which is deviated from the light emitting direction, and the second temperature-sensing electric connection unit is positioned on one side of the first temperature-sensing electric connection unit, which is towards the light emitting unit;
the temperature sensing unit is arranged between the first temperature sensing electric connection unit and the second temperature sensing electric connection unit.
Optionally, the package structure includes one temperature sensing unit, and the temperature sensing unit is disposed corresponding to the light emitting unit.
Optionally, a distance between the temperature sensing unit and the light emitting unit is greater than a preset distance.
Optionally, the package structure further includes a protective sleeve sleeved outside the temperature sensing unit, the protective sleeve has an opening, and the electrode of the temperature sensing unit extends out of the opening.
Optionally, the body includes a partition portion, and the partition portion is configured to partition the accommodating space into a first accommodating cavity for accommodating the light emitting unit and a second accommodating cavity for accommodating the temperature sensing unit;
the partition part is provided with a communicating structure, and the first accommodating cavity is communicated with the second accommodating cavity through the communicating structure.
Optionally, the package structure further includes a light-emitting electrical connection portion, where the light-emitting electrical connection portion includes a first light-emitting electrical connection unit electrically connected to a second external circuit, and a second light-emitting electrical connection unit electrically connected to the light-emitting unit, and the first light-emitting electrical connection unit is electrically connected to the second light-emitting electrical connection unit;
the first light-emitting electric connection unit is arranged on one side, far away from the light-emitting unit, of the second accommodating cavity, and the second light-emitting electric connection unit is arranged on one side, close to the light-emitting unit, of the second accommodating cavity.
Optionally, the partition comprises a partition plate, and the communication structure comprises a through hole provided on the partition plate and penetrating through the partition plate.
According to a second aspect of the embodiments of the present disclosure, there is provided an emitting device of an electronic apparatus, the emitting device including a light emitting unit, the emitting device further including the encapsulation structure as described above.
According to a third aspect of the embodiments of the present disclosure, there is provided an electronic apparatus, on which the transmitting device of the electronic apparatus as described above is provided.
The technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: the working temperature of the light-emitting unit is rapidly and accurately monitored by the temperature sensing unit, so that the working temperature of the light-emitting unit can be adjusted according to the monitored working temperature, temperature drift compensation is realized, the camera shooting effect of the electronic equipment is improved, and better use experience is obtained.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic diagram of an internal structure of a related package structure.
Fig. 2 is an exploded view of an encapsulation structure shown in accordance with an exemplary embodiment.
Fig. 3 is a circuit state diagram illustrating a package structure in a first state according to an example embodiment.
Fig. 4 is a cross-sectional view taken in a vertical direction of a package structure in a first state, according to an exemplary embodiment.
Fig. 5 is a circuit state diagram illustrating a package structure in a second state according to an example embodiment.
Fig. 6 is a cross-sectional view taken in a vertical direction of a package structure in a second state, according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
Fig. 1 shows a related package structure, and as shown in fig. 1, the package structure of a light emitting unit of an emitting device of a current 3D camera includes a package substrate 1', a support 2', and a diffusion sheet 3'. The supporting member 2 'is cylindrical, for example, a cylinder or a square cylinder, one end of the supporting member 2' is perpendicular to the package substrate 1', a mounting ring groove 21' is formed on an inner side wall of the other end of the supporting member 2', and the diffusion sheet 3' is disposed in the mounting ring groove 21 'and contacts with a bottom wall of the mounting ring groove 21' (based on the orientation shown in fig. 1). The package substrate 1', the support 2' and the diffusion sheet 3' together form an accommodating cavity 4', the light emitting unit 5' is fixedly mounted on the package substrate 1' and is encapsulated in the accommodating cavity 4', and light emitted by the light emitting unit 5' is emitted through the diffusion sheet 3'.
The light emitting unit 5' in the package structure shown in fig. 1 continuously increases along with the operating time, the temperature in the light emitting unit 5' itself and the accommodating cavity 4' continuously increases, and important performance such as optical power of the light emitting unit 5' continuously decreases, for example, the temperature of the light emitting unit 5' is too high, which causes instability of a static operating point, seriously affects the imaging effect of the 3D camera, and seriously causes the 3D camera to be unusable. Since only the light emitting unit 5' is disposed in the package structure, and no temperature sensing unit for monitoring the temperature of the light emitting unit 5' is disposed, the operating state of the light emitting unit 5' cannot be adjusted according to the temperature of the light emitting unit 5' itself and the temperature in the accommodating chamber 4', and the temperature loss cannot be compensated.
The present disclosure proposes a package structure for packaging a light emitting unit of an electronic device, for example, a light emitting unit of an emitting device of a 3D camera of an electronic device. The packaging structure comprises a body with an accommodating space, and the light-emitting unit is accommodated in the accommodating space. The packaging structure further comprises at least one temperature sensing unit, the temperature sensing unit detects the temperature in the accommodating space to monitor the temperature of the light emitting unit, the working state of the light emitting unit is adjusted according to the monitored temperature of the light emitting unit, temperature drift of the light emitting unit caused by overhigh temperature is avoided, temperature drift compensation is effectively achieved, the working performance of the 3D camera emitting device is improved, and the use experience of a user is improved.
Fig. 2 is an illustration of a package structure, according to an example embodiment. Referring to fig. 2, the package structure includes a body 1, a receiving space 11 is formed inside the body 1, and a light emitting unit 2 is received in the receiving space 11, wherein the light emitting unit 2 is used for emitting light, for example, an infrared light emitting chip emits infrared light. The packaging structure further comprises at least one temperature sensing unit 3, the temperature sensing unit 3 is used for monitoring the temperature in the accommodating space 11, and the temperature sensing unit 3 can be a thermistor temperature sensor, a thermocouple temperature sensor, a platinum resistor temperature sensor and the like. On the one hand, because the temperature of the light-emitting unit 2 is higher in the working process, in order to avoid the damage of the temperature sensing unit 3 caused by high temperature, the temperature sensing unit 3 is not directly contacted with the light-emitting unit 2, the distance between the temperature sensing unit 3 and the light-emitting unit 2 is greater than the preset distance, and the preset distance is the safety distance for avoiding the damage of the light-emitting unit 2 to the temperature sensing unit 3. It should be noted that the distance between the temperature sensing unit 3 and the light emitting unit 2 should not be too large, so as to ensure that the temperature sensing unit 3 can accurately monitor the operating temperature of the light emitting unit 2. On the other hand, the temperature sensing unit 3 does not directly contact with the light emitting unit 2, and the temperature sensing unit 3 is prevented from affecting the light emitting unit 2. It should be noted that, the temperature of the light emitting unit 2 gradually rises during the operation process, and since the accommodating space 11 of the package structure is smaller, the temperature in the accommodating space 11 also rises quickly, so that the temperature in the accommodating space 11 can accurately reflect the operating temperature of the light emitting unit 2, and the temperature sensing unit 3 does not need to contact with the light emitting unit 2, and can accurately reflect the operating temperature of the light emitting unit 2 by monitoring the temperature in the accommodating space 11.
The number of the temperature sensing units 3 can be one or more, in an exemplary embodiment, since the volume of the accommodating space 11 is small, the working temperature of the light emitting unit 2 can be effectively monitored by arranging one temperature sensing unit 3 in the accommodating space 11, and the cost can be reduced while the monitoring effect is ensured. In an alternative exemplary embodiment (this embodiment is not shown in the drawings), the number of the temperature sensing units 3 may also be two or three, so as to monitor the temperatures of multiple positions in the accommodating space 11 simultaneously, for example, taking the light emitting unit 2 as a center, and multiple temperature sensing units 3 are distributed around the light emitting unit 2 according to a certain rule, so as to further improve the accuracy and reliability of temperature monitoring. In addition, when there are a plurality of temperature sensing units 3 and one temperature sensing unit 3 of the plurality of temperature sensing units 3 is in trouble, the rest of the temperature sensing units 3 can still monitor the temperature in the accommodating space 11 where the light emitting unit 2 is located, and the reliability is higher than that in the case where one temperature sensing unit 3 is provided.
The accommodating space 11 can be an integral space, the light-emitting unit 2 and the temperature sensing unit 3 can be respectively and fixedly arranged in the accommodating space 11 through respective fixing structures (not shown in the figure), the fixing positions can be selected according to requirements, for example, the fixing structures can be fixed at the top (the side where light is emitted is the top) and the bottom of the accommodating space, the fixing structures can be bracket structures, effective fixation is realized, and meanwhile, heat generated by the light-emitting unit 2 in the working process can uniformly flow in the whole accommodating space 11. Alternatively, the light emitting unit 2 is disposed at the middle upper portion of the accommodating space through a fixing structure, and the temperature sensing unit 3 is disposed on the inner sidewall of the body 1 forming the accommodating space 11.
Still referring to fig. 2, the package structure further includes a temperature sensing electrical connector 5 electrically connected to the temperature sensing unit 3, and the temperature sensing unit 3 is disposed on a side of the light emitting unit 2 away from the light emitting direction through the temperature sensing electrical connector 5. Referring to the position shown in fig. 2, the light emitting unit 2 is disposed at the middle upper portion of the accommodating space 11, and the temperature sensing unit 3 is disposed at the lower portion of the accommodating space 11, that is, the temperature sensing unit 3 is located at the side of the light emitting unit 2 departing from the light emitting direction, so that the temperature monitoring accuracy is ensured, and meanwhile, the light emitted by the light emitting unit 2 can be prevented from being affected by the temperature sensing unit 3. When one temperature sensing unit 3 is arranged in the accommodating space 11, the temperature sensing unit 3 and the light emitting unit 2 are correspondingly arranged, for example, on a path deviating from the light emitting direction, so that on the premise that the distance between the light emitting unit 2 and the temperature sensing unit 3 is greater than the preset distance, the path between the light emitting unit and the temperature sensing unit is shortest, the temperature monitoring is more accurate, and the speed of obtaining the monitored temperature is higher.
Referring to fig. 4 and 6, in an exemplary embodiment, the temperature sensing unit 3 may be, for example, a thermistor, the temperature sensing unit 3 includes an electrode and a temperature sensing part (not shown in the figure), and the electrode of the temperature sensing unit 3 is used for forming an electrical connection with a circuit of an electronic device to realize electrical signal transmission; the temperature sensing portion of the temperature sensing unit 3 is used for monitoring the temperature in the accommodating space 11, and the temperature sensing unit 3 is disposed in the accommodating space 11 in an inverted state through the temperature sensing electrical connection portion 5 (see fig. 2). In the flip-chip state, the electrode of the temperature sensing unit 3 is located on the side close to the light emitting unit 2, and the temperature sensing portion of the temperature sensing unit 3 is located on the side away from the light emitting unit 2. The temperature sensing unit 3 is packaged in an inverted state, so that the temperature sensing unit 3 is ensured to have a good temperature sensing effect, and circuit wiring is facilitated; in addition, the mounting reliability can be improved.
In an exemplary embodiment, with reference to fig. 2, 4 and 6 (the orientation in the following description is with reference to the orientation in fig. 4 and 6), the temperature sensitive electrical connection 5 comprises a first temperature sensitive electrical connection unit 51, a second temperature sensitive electrical connection unit 52 and a temperature sensitive conductive line 53. The first temperature sensing electric connection unit 51 is electrically connected to a first external circuit (not shown), the second temperature sensing electric connection unit 52 is electrically connected to the electrode of the temperature sensing unit 3, and the first temperature sensing electric connection unit 51 and the second temperature sensing electric connection unit 52 are electrically connected through a temperature sensing conductive path 53. The first external circuit may be, for example, a circuit of an electronic device provided with the package structure in the present disclosure. The first temperature sensing electrical connection unit 51 and the second temperature sensing electrical connection unit 52 are both disposed at the lower portion of the accommodating space 11, the first temperature sensing electrical connection unit 51 is disposed at the bottom of the accommodating space 11, and the second temperature sensing electrical connection unit 52 is located above the first temperature sensing electrical connection unit 51. That is, the second temperature-sensitive electrical connection unit 52 is closer to the light emitting unit 2 than the first temperature-sensitive electrical connection unit 51 in the light emission direction. In the vertical direction, the temperature sensing unit 3 is disposed between the first temperature sensing electrical connection unit 51 and the second temperature sensing electrical connection unit 52. The first temperature sensing electric connection unit 51 comprises a first temperature sensing positive pad 511 and a first temperature sensing negative pad 512 which are connected with a first external circuit, the second temperature sensing electric connection unit 52 comprises a second temperature sensing positive electrode 521 and a second temperature sensing negative electrode 522 which are respectively connected with the electrodes of the temperature sensing unit 3, and the temperature sensing conducting line 53 comprises a positive temperature sensing conducting line 531 and a negative temperature sensing conducting line 532. The first temperature sensing positive electrode pad 511 is electrically connected to the second temperature sensing positive electrode 521 through a positive temperature sensing conducting line 531, and the first temperature sensing negative electrode pad 512 is electrically connected to the second temperature sensing negative electrode 522 through a negative temperature sensing conducting line 532. Referring to fig. 2, the first temperature sensing electrical connection unit 51, the second temperature sensing electrical connection unit 52 and the temperature sensing conduction line 53 together enclose a receiving groove 54, and the temperature sensing unit 3 is disposed in the receiving groove 54. A gap is left between the second temperature sensing positive electrode 521 and the second temperature sensing negative electrode 522, and the gap is over against the light emitting unit 2, so that the temperature sensing unit 3 can be over against the lower part of the light emitting unit 2 in the accommodating groove 54, and the accuracy and the rapidity of temperature monitoring are improved.
Referring to fig. 2, in order to further improve the safety and reliability and prevent the temperature sensing part of the temperature sensing unit 3 from being affected by the working environment, the package structure further includes a protection sleeve 6 sleeved outside the temperature sensing unit 3, the protection sleeve has an opening 61, an electrode of the temperature sensing unit 3 extends from the opening 61, and the extended electrode is connected to the second temperature sensing positive electrode 521 and the second temperature sensing negative electrode 522. The opening 61 of the protective sleeve 6 is opposite to the gap, so that the temperature sensing part of the temperature sensing unit 3 can monitor the temperature in the accommodating space 11 conveniently. The protection sleeve 6 has insulation performance to improve the reliability of the temperature sensing unit 3. In addition, the space between the temperature sensing part of the temperature sensing unit 3 and the first temperature sensing electric connection unit 51, the second temperature sensing electric connection unit 52 and the temperature sensing conducting line 53 is filled by arranging the protective sleeve 6, so that the temperature sensing unit 3 is prevented from shaking, and the packaging reliability is better.
Still referring to fig. 2, 4 and 6, in an exemplary embodiment, the main body 1 is substantially a box structure, the inside of the box structure is the accommodating space 11, and the main body 1 may be an integral structure or a separate structure. The partition 12 is provided on the main body 1, and the partition 12 may be provided at a desired position of the main body 1 as needed, for example, at a middle position of the main body 1. The partition 12 partitions the accommodating space 11 into a first accommodating chamber 111 for accommodating the light emitting unit 2 and a second accommodating chamber 112 for accommodating the temperature sensing unit 3. The partition 12 is provided with a communicating structure 121, and the first accommodating cavity 111 and the second accommodating cavity 112 are communicated through the communicating structure 121 to jointly form an accommodating space 11. Wherein the partition 12 may be a partition plate, and the communicating structure 121 may be a through hole provided on the partition plate. The through holes are used for heat flux to flow between the first accommodating cavity 111 and the second accommodating cavity 112, and can also be used for wiring, so that the light emitting unit 2 can be electrically connected with a second external circuit (not shown) located outside the second accommodating cavity 112. In addition, the partition 12 is provided to facilitate fixing the light emitting unit 2 and a light emitting electrical connection portion 4 (described in detail later) for forming electrical connection with the light emitting unit 2, thereby improving packaging reliability and electrical performance.
Referring to fig. 2, 4 and 6, with the orientation shown in fig. 4 and 6 as a reference, the light emitting unit 2 is disposed at the bottom of the first accommodating cavity 111, the temperature sensing unit 3 is disposed at the bottom of the second accommodating cavity 112, the number of the temperature sensing units 3 is one, the temperature sensing units 3 are disposed corresponding to the light emitting unit 2, that is, the temperature sensing units 3 are disposed under the light emitting unit 2, and the temperature sensing units 3 can more quickly and accurately monitor the temperature of the light emitting unit 2 in a working state, thereby ensuring that the electronic device can quickly and accurately implement temperature drift compensation according to the monitored temperature. Because the separating part 12 is arranged between the temperature sensing unit 3 and the light emitting unit 2, the light emitting unit 2 is conveniently fixed, the circuit routing is convenient, the mutual influence between the light emitting unit 2 and the temperature sensing unit 3 is effectively avoided, and the safety and the reliability of the packaging structure are improved. The first temperature sensing electrical connection unit 51, the second temperature sensing electrical connection unit 52 and the temperature sensing conducting circuit 53 are all disposed in the second accommodating cavity 112, wherein the first temperature sensing electrical connection unit 51 is located at the bottom of the second accommodating cavity 112, the second temperature sensing electrical connection unit 52 is located above the first temperature sensing electrical connection unit 51, and the temperature sensing unit 3 is located between the first temperature sensing electrical connection unit 51 and the second temperature sensing electrical connection unit 52.
Referring to fig. 2, 4 and 6, with reference to the orientation shown in fig. 4 and 6, in an exemplary embodiment, the package structure further includes a light emitting electrical connection portion 4, and the light emitting unit 2 is in communication with a second external circuit (not shown) through the light emitting electrical connection portion 4 to supply power and transmit signals to the light emitting unit 2. Here, it should be noted that the first external circuit and the second external circuit may be two external circuits provided independently, may be two parts on one total circuit, may be two branch circuits connected in parallel separated from one circuit, and are not particularly limited herein. The light emitting electrical connection portion 4 includes a first light emitting electrical connection unit 41, a second light emitting electrical connection unit 42 and a light emitting conduction line 43, wherein the first light emitting electrical connection unit 41 is electrically connected to a second external circuit, the second light emitting electrical connection unit 42 is electrically connected to the light emitting unit 2, and the first light emitting electrical connection unit 41 is electrically connected to the second light emitting electrical connection unit 42 through the light emitting conduction line 43. The first light-emitting electric connection unit 41 and the second light-emitting electric connection unit 42 are both disposed in the second accommodating cavity 112, the first light-emitting electric connection unit 41 is located on one side of the second accommodating cavity 112 far away from the light-emitting unit 2, and the second light-emitting electric connection unit 42 is located on one side of the second accommodating cavity 112 close to the light-emitting unit 2. For example, the first light-emitting electrical connection unit 41 is disposed at the bottom of the second receiving cavity 112, and the second light-emitting electrical connection unit 42 is disposed at the top of the second receiving cavity 112, that is, on the wall surface of the partition 12 facing the second receiving cavity 112. The first light emitting electric connection unit 41 includes a first light emitting positive electrode pad 411 and a first light emitting negative electrode pad 412 connected to the second external circuit, the second light emitting electric connection unit 42 includes a second light emitting positive electrode 421 and a second light emitting negative electrode 422 connected to the light emitting unit 2, the light emitting conductive line 43 includes a positive light emitting conductive line 431 and a negative light emitting conductive line 432, the first light emitting positive electrode pad 411 is electrically connected to the second light emitting positive electrode 421 through the positive light emitting conductive line 431, and the first light emitting negative electrode pad 412 is electrically connected to the second light emitting negative electrode 422 through the negative light emitting conductive line 432. In order to facilitate the circuit routing, the second light emitting anode 421 and the second light emitting cathode 422 are fixedly disposed on one side of the partition 12 facing the second accommodating cavity 112 and respectively correspond to the anode and the cathode (not shown in the figure) of the light emitting unit 2. Referring to fig. 3 and 5, the first light-emitting positive pad 411 and the first light-emitting negative pad 412 are respectively disposed at two sides of the first temperature-sensing electrical connection unit 51, and the first light-emitting positive pad 411, the first light-emitting negative pad 412, the first temperature-sensing positive pad 511, and the first temperature-sensing negative pad 512 are located on the same plane, so as to be conveniently and fixedly mounted on the body 1, and improve the reliability and safety of packaging.
Referring to fig. 2, 4 and 6, the second light-emitting positive electrode 421 and the second light-emitting negative electrode 422 are made of copper-nickel alloy material, and are respectively fixed on the wall surface of the partition 12 facing the second accommodating cavity 112 by using silver adhesive in a pasting manner, and are respectively located below the positive electrode and the negative electrode of the light-emitting unit 2. The anode of the light emitting unit 2 passes through the connection structure 121 on the partition 12 by the gold wire 21 to be electrically connected to the second light emitting anode 421, and then is electrically connected to the first light emitting anode pad 411 by the anode light emitting conducting wire 431. The cathode of the light emitting unit 2 is electrically connected to the second light emitting cathode 422, and then electrically connected to the first light emitting cathode pad 412 through the cathode light emitting conducting line 432.
Referring to fig. 2, the package structure further includes a diffusion sheet 7, and the diffusion sheet 7 is installed in the first receiving cavity 111, and in an exemplary embodiment, the body 1 has a cubic structure, and the corresponding diffusion sheet 7 is required to be square. An abutting part 1111 is arranged on the side wall of the first accommodating cavity 111, and the diffusion sheet 7 is inserted into the first accommodating cavity, abuts against the abutting part 1111, and is connected with the side wall of the first accommodating cavity 111 in a bonding manner through glue 71. The diffusion sheet 7 closes the open end of the first accommodating cavity 111, and encapsulates the light emitting unit 2 in the first accommodating cavity 111. The four vertex angles of the opening end of the first accommodating cavity 111 are provided with arc chamfers 1112, so that the diffusion sheet 7 can be conveniently disassembled and assembled and the post-sale maintenance can be conveniently carried out. Of course, it is understood that the body 1 may be provided in other shapes, such as a cylinder, and the diffusion sheet 7 may be adjusted according to the shape of the body 1.
The present disclosure also provides an emitting device of an electronic device, such as an emitting device of a 3D camera of a mobile phone, such as an emitting device of a 3D camera of a cash register device. The emitting device comprises the light emitting unit, the emitting device further comprises the packaging structure, the packaging reliability and the packaging safety are improved, and meanwhile, due to the fact that the temperature sensing unit is arranged in the packaging structure, the temperature in the working environment of the light emitting unit can be monitored quickly, in real time and accurately, so that temperature drift compensation is conveniently carried out, and better use experience is realized.
In addition, this disclosure still provides an electronic equipment, is provided with above-mentioned emitter on the electronic equipment, for example the emitter of 3D camera. The electronic device can be a mobile phone, a tablet computer and a cash register. Thereby guarantee that electronic equipment can carry out 3D and make a video recording, promote electronic equipment's the experience of making a video recording. The electronic equipment is started, and the cash is checked by the 3D camera through face recognition in the cash registering process, so that the safety, convenience and intelligence of the electronic equipment and the cash registering process are improved.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (11)
1. A packaging structure is used for packaging a light-emitting unit and is characterized by comprising a body, wherein the body forms an accommodating space, the light-emitting unit is accommodated in the accommodating space, the packaging structure further comprises at least one temperature sensing unit arranged in the accommodating space, and the temperature sensing unit is used for monitoring the temperature in the accommodating space;
the packaging structure also comprises a temperature sensing electric connection part electrically connected with the temperature sensing unit, and the temperature sensing unit is arranged on one side of the light emitting unit, which is deviated from the light emitting direction, in an inverted state through the temperature sensing electric connection part;
the temperature sensing electric connection part comprises a first temperature sensing electric connection unit, a second temperature sensing electric connection unit and a temperature sensing conduction line, the first temperature sensing electric connection unit, the second temperature sensing electric connection unit and the temperature sensing conduction line jointly enclose a containing groove, and the temperature sensing unit is arranged in the containing groove.
2. The package structure of claim 1, wherein the temperature sensing unit comprises an electrode and a temperature sensing portion, the electrode is located on a side close to the light emitting unit in the flip-chip state, and the temperature sensing portion is located on a side far from the light emitting unit.
3. The package structure of claim 2, wherein the first temperature-sensing electrical connection unit is electrically connected to a first external circuit, the electrode is electrically connected to the second temperature-sensing electrical connection unit, and the first temperature-sensing electrical connection unit is electrically connected to the second temperature-sensing electrical connection unit;
the first temperature-sensing electric connection unit is arranged on one side of the body, which is deviated from the light emitting direction, and the second temperature-sensing electric connection unit is positioned on one side of the first temperature-sensing electric connection unit, which faces the light emitting unit;
the temperature sensing unit is arranged between the first temperature sensing electric connection unit and the second temperature sensing electric connection unit.
4. The package structure according to any one of claims 1 to 3, wherein the package structure comprises one of the temperature sensing units, and the temperature sensing unit is disposed corresponding to the light emitting unit.
5. The package structure of any one of claims 1 to 3, wherein a distance between the temperature sensing unit and the light emitting unit is greater than a predetermined distance.
6. The package structure according to any one of claims 1 to 3, further comprising a protective sleeve covering the temperature sensing unit, wherein the protective sleeve has an opening, and the electrode of the temperature sensing unit protrudes from the opening.
7. The package structure according to claim 1, wherein the body includes a partition portion for partitioning the accommodating space into a first accommodating cavity for accommodating the light emitting unit and a second accommodating cavity for accommodating the temperature sensing unit;
the partition part is provided with a communicating structure, and the first accommodating cavity is communicated with the second accommodating cavity through the communicating structure.
8. The package structure of claim 7, further comprising a light emitting electrical connection comprising a first light emitting electrical connection element electrically connected to a second external circuit, and a second light emitting electrical connection element electrically connected to the light emitting element, the first light emitting electrical connection element being electrically connected to the second light emitting electrical connection element;
the first light-emitting electric connection unit is arranged on one side, far away from the light-emitting unit, of the second accommodating cavity, and the second light-emitting electric connection unit is arranged on one side, close to the light-emitting unit, of the second accommodating cavity.
9. The package structure of claim 7, wherein the partition comprises a divider plate, and the communication structure comprises a through hole disposed on the divider plate through the divider plate.
10. An emitting device of an electronic apparatus, the emitting device comprising a light emitting unit, characterized in that the emitting device further comprises an encapsulation structure according to any one of claims 1 to 9.
11. An electronic device, characterized in that the electronic device is provided with the transmitting means of the electronic device as claimed in claim 10.
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| CN201911107967.9A CN112885939B (en) | 2019-11-13 | 2019-11-13 | Packaging structure, electronic equipment and transmitting device thereof |
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| CN201911107967.9A CN112885939B (en) | 2019-11-13 | 2019-11-13 | Packaging structure, electronic equipment and transmitting device thereof |
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| CN109149355A (en) * | 2018-09-12 | 2019-01-04 | Oppo广东移动通信有限公司 | Light emitting mould group and its control method, TOF depth camera and electronic equipment |
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| CN104734705A (en) * | 2013-12-20 | 2015-06-24 | 精工爱普生株式会社 | Light-emitting Element Module, Quantum Interference Apparatus, Atomic Oscillator, Electronic Apparatus And Moving Object |
| JP2017134218A (en) * | 2016-01-27 | 2017-08-03 | キヤノン株式会社 | Light emitting device and control method of the same |
| CN107155069A (en) * | 2016-03-03 | 2017-09-12 | 佳能株式会社 | Lighting device and its control method and picture pick-up device |
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