CN112881899A - Test point positioning method, device and equipment and readable storage medium - Google Patents
Test point positioning method, device and equipment and readable storage medium Download PDFInfo
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Abstract
The invention discloses a method, a device, equipment and a readable storage medium for positioning a test point, wherein the method comprises the following steps: acquiring an input signal and component number information on a circuit board, wherein the input signal corresponds to the component number information; based on the input signal, positioning all wiring points connected with the input signal; determining first position information representing the positions of the components and second position information representing the positions of the wiring points on the basis of the component number information and the wiring points; selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information; and determining the test points meeting the preset requirements based on the selected wiring point information. According to the scheme, the appropriate test points are automatically obtained through the component parameters on the circuit board, experiential testers are not needed in the process, and meanwhile, the finally selected test points are not influenced by the subjectiveness of different testers, so that the final test quality is stable, and the comparison of the later test results is not influenced.
Description
Technical Field
The present invention relates to the field of electronic circuit technologies, and in particular, to a test point positioning method, apparatus, device, and readable storage medium.
Background
The existing circuit board needs to be tested, the test comprises the voltage test of electrical components, in the prior art, the best test point is found through complex operation and abundant experience of testers, so that the technical level requirement on the testers is high, the test efficiency is low, the randomness of the test points selected by different testers is high, the test quality is unstable, and the comparison of the later test results is greatly influenced.
Disclosure of Invention
The embodiment of the invention provides a test point positioning method, a test point positioning device, test point positioning equipment and a readable storage medium, which are not influenced by subjectivity of different testers, so that the final test quality is stable, and the technical effect of comparison of the subsequent test results is not influenced.
One aspect of the present invention provides a test point positioning method, including: acquiring an input signal and component number information on a circuit board, wherein the input signal corresponds to the component number information; based on the input signal, positioning all wiring points connected with the input signal; determining first position information representing the positions of the components and second position information representing the positions of the wiring points on the basis of the component number information and the wiring points; selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information; and determining the test points meeting the preset requirements based on the selected wiring point information.
In an implementation manner, the acquiring the input signal and the component number information on the circuit board includes: acquiring parameter information corresponding to the circuit board; and acquiring input signals and component number information on the circuit board based on the parameter information.
In one embodiment, the preset conditions are: (X-X)2+(Y-y)2≤N2Wherein X is the abscissa position of the component, Y is the ordinate position of the component, X is the abscissa position of the wiring point, Y is the ordinate position of the wiring point, and N is a preset fixed value.
In an implementation manner, the determining, based on the selected junction point information, a test point meeting a preset requirement includes: calculating the distance difference between each piece of wiring point information and the first position information, and selecting the wiring point information with the shortest distance difference to be determined as a test point; or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as a test point; or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as the test point.
Another aspect of the present invention provides a test point positioning apparatus, including: the information acquisition module is used for acquiring an input signal and component number information on the circuit board, wherein the input signal corresponds to the component number information; the wiring point determining module is used for positioning all wiring points connected with the input signal based on the input signal; the position acquisition module is used for determining first position information representing the positions of the components and second position information representing the positions of the wiring points based on the component number information and the wiring points; the position calculation module is used for selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information; and the test point determining module is used for determining the test points meeting the preset requirements based on the selected wiring point information.
In an implementation manner, the information obtaining module is specifically configured to: acquiring parameter information corresponding to the circuit board; and acquiring input signals and component number information on the circuit board based on the parameter information.
In one embodiment, the preset conditions are: (X-X)2+(Y-y)2≤N2Wherein X is the abscissa position of the component, Y is the ordinate position of the component, X is the abscissa position of the wiring point, Y is the ordinate position of the wiring point, and N is a preset fixed value.
In an implementation manner, the test point determining module is specifically configured to: calculating the distance difference between each piece of wiring point information and the first position information, and selecting the wiring point information with the shortest distance difference to be determined as a test point; or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as a test point; or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as the test point.
Another aspect of the present invention provides an information interaction apparatus, which includes a memory and a processor; the memory is configured to store instructions configured to control the processor to operate so as to implement any one of the test point locating methods described above when executed.
In another aspect, the present invention provides a computer-readable storage medium comprising a set of computer-executable instructions, which when executed, perform any of the test point location methods described above.
In the embodiment of the invention, compared with the prior art that the proper test point is manually selected, the proper test point is automatically obtained through the parameters of the components on the circuit board, the process does not need experiential testers, and meanwhile, the finally selected test point is not influenced by the subjectivity of different testers, so that the final test quality is stable, and the comparison of the subsequent test results is not influenced.
Drawings
The above and other objects, features and advantages of exemplary embodiments of the present invention will become readily apparent from the following detailed description read in conjunction with the accompanying drawings. Several embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which:
in the drawings, the same or corresponding reference numerals indicate the same or corresponding parts.
Fig. 1 is a schematic diagram of an implementation flow of a test point positioning method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of calculating a distance position in a test point positioning method according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a test point positioning apparatus according to an embodiment of the invention.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, in one aspect, the present invention provides a test point positioning method, including:
102, positioning all wiring points connected with input signals based on the input signals;
103, determining first position information representing the positions of the components and second position information representing the positions of the wiring points based on the component number information and the wiring points;
104, selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information;
and 105, determining test points meeting preset requirements based on the selected wiring point information.
In this embodiment, in step 101, the input signal is specifically a net name, that is, a tested signal of a test item, where the test item is a component to be tested, such as a capacitor and a resistor, on a circuit board, and the tested signal is a signal applied to measure the component to be tested, such as a voltage signal and a current signal. The component number information is specifically a device bit number, namely the number of the same component on the circuit board, and is used for distinguishing the same component.
The input signal and the serial number information of the components are recorded in a test report of the circuit board in advance, wherein the test report comprises parameter information of all the components on the circuit board, including names, positions, models and the like.
The correspondence of the input signal and the component number information may refer to the test item being directly connected to the signal under test, for example, applying a 5v signal across the component resistance.
In step 102, based on the obtained input signal, a connection point directly connected with the input signal can be located according to a circuit connection relationship by some existing software such as software and Multisim, wherein the connection point is a pad point, namely a connection point between the component and the pcb.
In step 103, after the component number information and the wiring points are obtained, according to the component number information and the wiring points, first position information representing positions of the components and second position information representing positions of the wiring points can be inquired from the test report.
In step 104, after the first location information and the second location information are obtained, it is determined whether the first location information and the second location information satisfy a preset condition, where the preset condition may be that a distance between the first location information and the second location information is within a preset fixed value, and if it is determined that there is location information satisfying the preset condition in the second location information, the junction point information of the location is extracted.
In step 105, after obtaining the junction point information, a final test point may be determined according to a preset requirement of a tester, where the preset requirement may be to select a test point according to a test item, to select a test point according to a component type, or to select a test point according to a component size.
Therefore, in the prior art, a proper test point is selected manually, the proper test point is automatically obtained through the component parameters on the circuit board, experiential testers are not needed in the process, meanwhile, the finally selected test point is not influenced by the subjectiveness of different testers, the final test quality is stable, and the comparison of the later test results is not influenced.
In one implementation, acquiring input signals and component number information on a circuit board includes:
acquiring parameter information corresponding to the circuit board;
and acquiring input signals and component number information on the circuit board based on the parameter information.
In this embodiment, as mentioned above, the parameter information of the circuit board exists in the test report, and after the test report is obtained, the parameter information corresponding to the circuit board can be extracted from the test report, and the input signal and the component number information on the circuit board can be extracted from the parameter information.
In one embodiment, the preset conditions are:
(X-x)2+(Y-y)2≤N2wherein X is the abscissa position of the component, Y is the ordinate position of the component, X is the abscissa position of the wiring point, Y is the ordinate position of the wiring point, and N is a preset fixed value.
In this embodiment, referring to fig. 2, the formula represents a circle with (X, Y) as the center and N as the radius, where the second position information located inside the circle is the position of the connecting point that satisfies the preset condition, and the second position information located outside the circle is the position of the connecting point that does not satisfy the preset condition.
In an implementation manner, determining a test point meeting a preset requirement based on the selected junction point information includes:
calculating the distance difference between each piece of wiring point information and the first position information, and selecting the wiring point information with the shortest distance difference to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as the test point.
In this embodiment, the connection point information is information that satisfies a preset condition, an optimal test point is selected from the connection point information that satisfies the preset condition, and a selection manner of the optimal test point is according to a preset requirement.
Referring to fig. 2, the predetermined requirement includes a distance position, i.e., the nearest connection point to the Device coordinate (X, Y) can be selected as the best test point.
The preset requirements further include component types and component types, wherein the component types generally include capacitors, resistors, transistors and the like on the circuit board, and the component types are specifically multiple types in the same component, such as 0402 capacitors and 0201 capacitors.
During application, an optimal test point can be selected comprehensively according to the distance difference, the type of the component and the type of the component, for example, power ripple test, and firstly, 0402 capacitor pad which is closer to the distance is selected, secondly 0201 capacitor pad and finally resistor pad are selected; the pad point with the highest priority is the best test point we need.
As shown in fig. 3, another aspect of the present invention provides a test point positioning apparatus, including:
the information acquisition module 201 is configured to acquire an input signal and component number information on a circuit board, where the input signal corresponds to the component number information;
a terminal point determining module 202, configured to locate all terminal points connected to the input signal based on the input signal;
the position acquisition module 203 is configured to determine first position information representing positions of the components and second position information representing positions of the wiring points based on the component number information and the wiring points;
the position calculation module 204 is configured to select, based on the first position information and the second position information, wiring point information that meets a preset condition from the second position information;
a test point determining module 205, configured to determine, based on the selected junction point information, a test point that meets a preset requirement.
In this embodiment, in the information obtaining module 201, the input signal is specifically a net name, that is, a tested signal of a test item, where the test item is a device to be tested, such as a capacitor and a resistor, on a circuit board, and the tested signal is a signal applied to measure the tested device, such as a voltage signal and a current signal. The component number information is specifically a device bit number, namely the number of the same component on the circuit board, and is used for distinguishing the same component.
The input signal and the serial number information of the components are recorded in a test report of the circuit board in advance, wherein the test report comprises parameter information of all the components on the circuit board, including names, positions, models and the like. Thus, the information obtaining module 201 is specifically configured to export the net name in the test report to the junction point determining module 202, and export the device bit number to the position obtaining module 203.
The correspondence of the input signal and the component number information may refer to the test item being directly connected to the signal under test, for example, applying a 5v signal across the component resistance.
The connection point determining module 202 is specifically configured to receive the net name sent by the information obtaining module 201, based on the obtained net name, locate, according to the circuit connection relationship, a connection point directly connected to the input signal by using some existing software, such as software and Multisim, where the connection point is a pad point, that is, a connection point between the component and the pcb, and export the pad point to the position obtaining module 203.
In the position obtaining module 203, after the component number information and the wiring point are obtained, according to the component number information and the wiring point, first position information representing a position of the component and second position information representing a position of the wiring point may be queried in the test report, and the first position information and the second position information are exported to the position calculating module 204.
In the position calculating module 204, after the first position information and the second position information are obtained, it is determined whether the first position information and the second position information satisfy a preset condition, where the preset condition may be that a distance between the first position information and the second position information is within a preset fixed value, and if it is determined that information satisfying the preset condition exists in the second position information, the junction point information of the position is extracted and is exported to the test point determining module 205, where the junction point information includes a distance from a device bit number and a model.
In the test point determining module 205, after the terminal point information is obtained, a final test point may be determined according to a preset requirement of a tester, where the preset requirement may be to select a test point according to a test item, to select a test point according to a component type, or to select a test point according to a size of a component.
Therefore, in the prior art, a proper test point is selected manually, the proper test point is automatically obtained through the component parameters on the circuit board, experiential testers are not needed in the process, meanwhile, the finally selected test point is not influenced by the subjectiveness of different testers, the final test quality is stable, and the comparison of the later test results is not influenced.
In an implementation manner, the information obtaining module 201 is specifically configured to:
acquiring parameter information corresponding to the circuit board;
and acquiring input signals and component number information on the circuit board based on the parameter information.
In this embodiment, as mentioned above, the parameter information of the circuit board exists in the test report, and after the test report is obtained, the parameter information corresponding to the circuit board can be extracted from the test report, and the input signal and the component number information on the circuit board can be extracted from the parameter information.
In one embodiment, the preset conditions are:
(X-x)2+(Y-y)2≤N2wherein X is the abscissa position of the component, Y is the ordinate position of the component, X is the abscissa position of the wiring point, Y is the ordinate position of the wiring point, and N is a preset fixed value.
In this embodiment, referring to fig. 2, the formula represents a circle with (X, Y) as the center and N as the radius, where the second position information located inside the circle is the position of the connecting point that satisfies the preset condition, and the second position information located outside the circle is the position of the connecting point that does not satisfy the preset condition.
In an implementation manner, the test point determining module 205 is specifically configured to:
calculating the distance difference between each piece of wiring point information and the first position information, and selecting the wiring point information with the shortest distance difference to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as the test point.
In this embodiment, the connection point information is information that satisfies a preset condition, an optimal test point is selected from the connection point information that satisfies the preset condition, and a selection manner of the optimal test point is according to a preset requirement.
Referring to fig. 2, the predetermined requirement includes a distance position, i.e., the nearest connection point to the Device coordinate (X, Y) can be selected as the best test point.
The preset requirements further include component types and component types, wherein the component types generally include capacitors, resistors, transistors and the like on the circuit board, and the component types are specifically multiple types in the same component, such as 0402 capacitors and 0201 capacitors.
During application, an optimal test point can be selected comprehensively according to the distance difference, the type of the component and the type of the component, for example, power ripple test, and firstly, 0402 capacitor pad which is closer to the distance is selected, secondly 0201 capacitor pad and finally resistor pad are selected; the pad point with the highest priority is the best test point we need.
Another aspect of the present invention provides an information interaction device, including a memory and a processor;
the memory is used for storing instructions for controlling the processor to operate so as to realize the test point positioning method of any one of the above items when the instructions are executed.
In an embodiment of the present invention, a computer-readable storage medium includes a set of computer-executable instructions that, when executed, are configured to obtain an input signal and component number information on a circuit board, wherein the input signal corresponds to the component number information; based on the input signal, positioning all wiring points connected with the input signal; determining first position information representing the positions of the components and second position information representing the positions of the wiring points on the basis of the component number information and the wiring points; selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information; and determining the test points meeting the preset requirements based on the selected wiring point information.
Therefore, in the prior art, a proper test point is selected manually, the proper test point is automatically obtained through the component parameters on the circuit board, experiential testers are not needed in the process, meanwhile, the finally selected test point is not influenced by the subjectiveness of different testers, the final test quality is stable, and the comparison of the later test results is not influenced.
In another aspect, the present invention provides a computer-readable storage medium comprising a set of computer-executable instructions, which when executed, perform any one of the test point localization methods described above.
In an embodiment of the present invention, a computer-readable storage medium includes a set of computer-executable instructions that, when executed, are configured to obtain an input signal and component number information on a circuit board, wherein the input signal corresponds to the component number information; based on the input signal, positioning all wiring points connected with the input signal; determining first position information representing the positions of the components and second position information representing the positions of the wiring points on the basis of the component number information and the wiring points; selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information; and determining the test points meeting the preset requirements based on the selected wiring point information.
Therefore, in the prior art, a proper test point is selected manually, the proper test point is automatically obtained through the component parameters on the circuit board, experiential testers are not needed in the process, meanwhile, the finally selected test point is not influenced by the subjectiveness of different testers, the final test quality is stable, and the comparison of the later test results is not influenced.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method for locating a test point, the method comprising:
acquiring an input signal and component number information on a circuit board, wherein the input signal corresponds to the component number information;
based on the input signal, positioning all wiring points connected with the input signal;
determining first position information representing the positions of the components and second position information representing the positions of the wiring points on the basis of the component number information and the wiring points;
selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information;
and determining the test points meeting the preset requirements based on the selected wiring point information.
2. The method of claim 1, wherein the obtaining input signals and component number information on the circuit board comprises:
acquiring parameter information corresponding to the circuit board;
and acquiring input signals and component number information on the circuit board based on the parameter information.
3. The method according to claim 1, wherein the preset condition is:
(X-x)2+(Y-y)2≤N2wherein X is the abscissa position of the component, Y is the ordinate position of the component, X is the abscissa position of the wiring point, Y is the ordinate position of the wiring point, and N is a preset fixed value.
4. The method of claim 1, wherein determining test points meeting a preset requirement based on the selected junction point information comprises:
calculating the distance difference between each piece of wiring point information and the first position information, and selecting the wiring point information with the shortest distance difference to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as the test point.
5. A test point location apparatus, the apparatus comprising:
the information acquisition module is used for acquiring an input signal and component number information on the circuit board, wherein the input signal corresponds to the component number information;
the wiring point determining module is used for positioning all wiring points connected with the input signal based on the input signal;
the position acquisition module is used for determining first position information representing the positions of the components and second position information representing the positions of the wiring points based on the component number information and the wiring points;
the position calculation module is used for selecting wiring point information meeting preset conditions from the second position information based on the first position information and the second position information;
and the test point determining module is used for determining the test points meeting the preset requirements based on the selected wiring point information.
6. The apparatus of claim 5, wherein the information acquisition module is specifically configured to:
acquiring parameter information corresponding to the circuit board;
and acquiring input signals and component number information on the circuit board based on the parameter information.
7. The apparatus of claim 5, wherein the preset condition is:
(X-x)2+(Y-y)2≤N2wherein X is the abscissa position of the component, Y is the ordinate position of the component, X is the abscissa position of the wiring point, Y is the ordinate position of the wiring point, and N is a preset fixed value.
8. The apparatus of claim 5, wherein the test point determination module is specifically configured to:
calculating the distance difference between each piece of wiring point information and the first position information, and selecting the wiring point information with the shortest distance difference to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as a test point;
or determining the type of the component corresponding to the wiring point information, and selecting the wiring point information meeting the preset component type to be determined as the test point.
9. An information interaction device, characterized in that the device comprises a memory and a processor;
the memory is configured to store instructions for controlling the processor to operate so as to implement the test point localization method of any one of claims 1-4 when executed.
10. A readable storage medium comprising a set of computer-executable instructions that, when executed, perform the test point location method of any of claims 1-4.
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| CN111583222A (en) * | 2020-04-30 | 2020-08-25 | 广东正业科技股份有限公司 | Test point automatic positioning method, copper thickness automatic detection method and system |
| CN111880076A (en) * | 2020-07-14 | 2020-11-03 | 苏州浪潮智能科技有限公司 | Signal test point detection method, system and related assembly |
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| CN104345260A (en) * | 2013-08-01 | 2015-02-11 | 鸿富锦精密工业（深圳）有限公司 | Signal completeness automatic testing system and method |
| CN111583222A (en) * | 2020-04-30 | 2020-08-25 | 广东正业科技股份有限公司 | Test point automatic positioning method, copper thickness automatic detection method and system |
| CN111880076A (en) * | 2020-07-14 | 2020-11-03 | 苏州浪潮智能科技有限公司 | Signal test point detection method, system and related assembly |
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