CN112877124B - Water-based cutting fluid for diamond wire cutting and preparation and use methods thereof - Google Patents
Water-based cutting fluid for diamond wire cutting and preparation and use methods thereof Download PDFInfo
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- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/32—Polymers modified by chemical after-treatment
- C08G65/329—Polymers modified by chemical after-treatment with organic compounds
- C08G65/336—Polymers modified by chemical after-treatment with organic compounds containing silicon
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- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M145/00—Lubricating compositions characterised by the additive being a macromolecular compound containing oxygen
- C10M145/18—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M145/24—Polyethers
- C10M145/26—Polyoxyalkylenes
- C10M145/36—Polyoxyalkylenes etherified
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/105—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing three carbon atoms only
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/108—Polyethers, i.e. containing di- or higher polyoxyalkylene groups etherified
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention relates to an aqueous cutting fluid for diamond wire cutting and a preparation method and a use method thereof, wherein the cutting fluid mainly comprises 8-33 parts by weight of silicon modified polyether; 3-7 parts by weight of a silane hydrolysis inhibiting stabilizer; the balance of water, and the total weight portion is 100. The embodiment of the invention has the following beneficial effects: the invention has the function of low-foam self-defoaming, and no additional defoaming agent component is needed; the silicon modified polyether can perform hydrolysis endothermic reaction on a cutting contact interface, so that the heat which cannot be taken away in time in the cutting process is balanced; meanwhile, the hydrolyzed silicon hydroxyl group has a strong adsorption effect, and can protect the diamond wire, enhance the lubricating property, reduce the cutting resistance and reduce the wire breakage probability; the dispersion of the silicon powder is enhanced, the silicon powder is not agglomerated, active sites on the surface of the silicon powder are adsorbed and combined in time, and the problem that the spontaneous combustion occurs due to high reaction activity of the filter-pressed silicon powder is avoided.
Description
Technical Field
The invention relates to an aqueous cutting fluid for linear cutting, in particular to an aqueous cutting fluid for diamond linear cutting of hard and brittle materials.
Background
The production process of the silicon wafer for the solar photovoltaic cell sequentially comprises the following stages: the method comprises an inner circle cutting process stage, a mortar straight steel wire multi-wire cutting process stage, a mortar structure wire multi-wire cutting process stage and a diamond wire multi-wire cutting process stage, a silicon wafer production enterprise carries out diamond wire multi-wire cutting test research after 2010, the enterprise starts to put diamond wire multi-wire cutting monocrystalline silicon wafers in batches after 2015, and the diamond wire cutting process is developed explosively due to the breakthrough of a diamond wire cutting polycrystalline silicon wafer texturing process (a wet black silicon texturing process) in 2016 and replaces the mortar multi-wire cutting process. The comprehensive popularization of the diamond wire multi-wire cutting process is due to the specific advantages: the cutting process time is short and is shortened by 3-7 times compared with the sand line cutting process time; secondly, the cutting line is thin, the number of silicon rods discharged per kilogram is high, and the loss of silicon materials is reduced; thirdly, the environment is protected, the water-based diamond wire cutting liquid is used for replacing polyether suspension, the concentration of the water-based diamond wire cutting liquid is only 0.1-0.5 percent of that of the sand wire cutting liquid, the waste liquid COD is low, and the recycled silicon powder can be used for recycling and manufacturing metallurgical-grade silicon; fourthly, the cutting cost is low; and fifthly, the cut silicon wafer surface quality is high.
Meanwhile, the multi-wire cutting of the diamond wire is not limited to the cutting of silicon materials for solar photovoltaic cells, and is also widely applied to the cutting of hard and brittle materials such as semiconductor wafers, sapphires, glass, magnetic materials and the like.
With the emergence of the diamond wire cutting process, the development of the diamond wire multi-wire cutting liquid is also inoculated. The early diamond wire cutting fluid is a surfactant compound system which adopts an organic silicon emulsion defoaming agent as a foam control system, and has the defects that a filter bag is blocked in the cutting process, the influence of wire mesh breakage is increased, dirt is caused, the service life of a filter cloth is influenced by waste water filter pressing and the like. The foaming surfactant is selected and developed towards low-foaming surfactants, and most of the foaming surfactants are ethylene oxide-propylene oxide block polyether, fatty alcohol ethylene oxide-propylene oxide block polyether, alkynol ethoxy compound, copolymer dispersant containing anionic chelating group and the like. But still has some disadvantages, such as excellent foam performance of the block polyether, weak surface activity at low concentration, poor wetting ability to silicon powder in cutting environment, and poor dispersibility; although fatty alcohol polyether has a low-foam type, micro bubbles in a solution system are difficult to eliminate, and silicon powder agglomeration and dirt and foam accumulation are easy to generate to overflow a cylinder; the alkynol ethoxy compound has great advantages in the aspects of dynamic surface tension and foam control, but the molecular weight is too low, the strength of the generated lubricating film is low, the auxiliary cutting capability is poor, the cutting line mark on the surface of the silicon wafer is aggravated, the TTV is increased, and the like; the copolymer dispersant containing the anionic chelating group is dissolved in water and ionized, so that the conductivity of the water solution in a cutting environment is increased, a closed current loop is easily generated due to the increase of the conductivity of cutting equipment, the false alarm of wire breakage is caused, the machine is stopped, and wire breakage or cutting line marks and color difference are caused.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is that aiming at the more rigorous cutting processes of the prior diamond wire with the advantages of small wire diameter, high cutting wire speed, large size of a silicon wafer and the like, the silicon powder has smaller particle size and is more difficult to disperse in the cutting process, so that the generation of dirt is more easily caused, and the yield indexes of wire marks, TTV, edge breakage and the like of the cut silicon wafer are increasingly poor.
The silicon modified polyether is prepared by the addition synthesis reaction of a silicon modifier and polyether, and the polyether can generate water desorption thermal reaction under the environment of cutting interface temperature and pressure, so that silicon hydroxyl groups with strong adsorbability are formed on the chain end of the silicon modified polyether. The heat of a cutting interface can be taken away by the hydrolysis endothermic reaction, so that the phenomenon that the diamond wire is broken due to overhigh friction heat caused by insufficient soaking of the circulating spray liquid in the cutting process is avoided; meanwhile, the strong-adsorbability silicon hydroxyl group after the hydrolysis of the silicon modified polyether chain end can have the following functions: firstly, adsorbing the diamond wire on the surface of the diamond wire to form a diamond wire protective film which plays a role in lubrication; secondly, the silicon powder is adsorbed on the surface of newly generated silicon powder on a cutting interface to form a space barrier film, so that the silicon powder is prevented from agglomerating, and an excellent dispersing effect is achieved; and thirdly, the silicon powder is adsorbed on the surface of the silicon wafer to form an adsorption film layer, so that the silicon powder on the surface of the silicon wafer is protected from being accumulated and causing the silicon wafer which is difficult to clean to be dirty. The stabilizer for inhibiting silane hydrolysis is polyalcohol or polysaccharide compound, which contains much hydroxyl and can inhibit hydrolysis of siloxane in water by hydrogen bonding with water.
Some specific descriptions are given to the silicon-modified polyether commonly used in the examples of the present invention: the silicon modified polyether is prepared by the following preparation method: adding polyether into a high-pressure reaction kettle with polytetrafluoroethylene as a lining, adding a catalyst chloroplatinic acid, wherein the dosage of the catalyst is 0.01-0.5 percent (weight percentage) of fatty acid, uniformly stirring, adding trialkoxysilane, closing a kettle cover of the reaction kettle and a pipeline communicated with the outside, keeping the reaction kettle in a closed state in the reaction process, and carrying out heat preservation stirring reaction for 1-4 hours at 10-80 ℃ to obtain the silicon modified polyether.
The embodiment of the invention provides an aqueous cutting fluid for diamond wire cutting, which comprises the following components in parts by weight: 8-33 parts of silicon modified polyether; 3-7 parts by weight of a silane hydrolysis inhibiting stabilizer; the balance of water; and the total weight portion is 100. Wherein the structural formula of the silicon modified polyether is as follows:
X＝CH3，CH2CH3；RI＝CH2,C2H4；R2＝CH2,C2H4；R3＝C2H4,C4H8
wherein m is an integer of 1 to 10, and n is an integer of 0 to 10.
The silicon modified polyether is prepared from a silicon modifier and polyether through an addition synthesis reaction, and the polyether can perform an endothermic hydrolysis reaction under the environment of cutting interface temperature and pressure, so that a silicon hydroxyl group with strong adsorbability is formed at a chain end of the silicon modified polyether.
Wherein the silane hydrolysis inhibiting stabilizer is a polyol or polysaccharide compound, specifically one or more of sorbitol, xylitol, glucitol, fructose, maltose, glucose and anhydroglucose.
Wherein the polyether is one or more of propenyl polyoxyethylene polyoxypropylene ether, butenyl polyoxyethylene polyoxypropylene ether, methyl allyl polyoxyethylene polyoxypropylene ether, vinyl glycol ether polyoxyethylene ether polyoxypropylene ether and vinyl butylene glycol ether polyoxyethylene ether polyoxypropylene ether; the specific structure of the polyether is as follows:
RI＝CH2,C2H4；R2＝CH2,C2H4；R3＝C2H4,C4H8
wherein m is an integer of 1 to 10, and n is an integer of 0 to 10.
Wherein the silicon modifier is one or more of trimethoxy silane and triethoxy silane. The structure of the silicon modifier is as follows:
wherein the preparation steps comprise: 1) adding water into a reaction kettle; 2) starting stirring, and adding polyalcohol or saccharide compounds in a room temperature environment to completely dissolve; 3) And adding polyether, stirring until the polyether is completely dissolved, keeping the reaction temperature at 20-60 ℃, stirring for 1-5 hours, stopping stirring, and aging for 0.5-4 hours to obtain the aqueous cutting fluid for diamond wire cutting.
Wherein the proportion of the aqueous cutting fluid and water for diamond wire cutting is 1: 200-1000 (weight ratio).
The embodiment of the invention has the following beneficial effects: the product of the invention contains silicon hydroxyl groups and micromolecular alcohol which can perform endothermic hydrolysis reaction under the environment of cutting interface temperature and pressure and are hydrolyzed to form strong adsorbability. The following advantages are achieved: 1) the heat of a cutting interface can be taken away by endothermic hydrolysis reaction, and the phenomenon that the diamond wire is broken due to overhigh friction heat caused by insufficient soaking of circulating spray liquid in the cutting process is avoided; 2) the strongly adsorptive silicon hydroxyl groups formed after hydrolysis may have the following effects: firstly, adsorbing the diamond wire on the surface of the diamond wire to form a diamond wire protective film which plays a role in lubrication; secondly, the silicon powder is adsorbed on the surface of newly generated silicon powder on a cutting interface to form a space barrier film, so that the silicon powder is prevented from agglomerating, and an excellent dispersing effect is achieved; adsorbing the silicon wafer surface to form an adsorption film layer, and protecting the silicon wafer surface from silicon powder dirt accumulation to cause silicon wafer dirt which is difficult to clean; 3) the small molecular alcohols have high migration speed due to small molecular weight, have high wetting effect and can quickly wet the solid surface of a cutting interface. The stabilizing agent for inhibiting the silane hydrolysis is a polyol or polysaccharide compound, the polyol or polysaccharide compound contains more hydroxyl groups, and can form hydrogen bond action with water, so that the hydrolysis of siloxane in water can be inhibited, and meanwhile, the polyol or polysaccharide compound rich in a large number of hydrogen bonds can form a hydrated lubricating film layer on a cutting interface to generate an interface lubricating film, assist in lubrication and timely take silicon powder and heat generated by cutting.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
The weight portions of the formula are as follows (the total weight portion is 100):
silicon-modified polyether: 22.5
Xylitol: 4.5
Water: balance of
The silicon modifier of the silicon modified polyether is triethoxysilane, and the polyether is propenyl polyoxyethylene polyoxypropylene ether (m is 4, n is 4).
Example 2
The weight portions of the formula are as follows (the total weight portion is 100):
silicon-modified polyether: 18
Sorbitol: 6
Water: allowance of
The silicon modifier of the silicon modified polyether is triethoxysilane, and the polyether is methyl allyl amyl polyoxyethylene polyoxypropylene ether (m is 4, n is 6).
Example 3
The weight portions of the formula are as follows (the total weight portion is 100):
silicon-modified polyether: 18.5
And (3) glucitol: 5.5
Water: balance of
The silicon modifier of the silicon modified polyether is triethoxysilane, and the polyether is vinyl butanediol ether polyoxyethylene ether polyoxypropylene ether (m is 8, n is 6).
Example 4
The weight parts of the formula are as follows (the total weight parts are 100):
silicon-modified polyether: 17
And (3) glucitol: 4
Water: balance of
The silicon modifier of the silicon modified polyether is trimethoxy silane, and the polyether is vinyl butanediol ether polyoxyethylene ether polyoxypropylene ether (m is 6, n is 8).
Example 5
The weight portions of the formula are as follows (the total weight portion is 100):
silicon-modified polyether: 27
And (3) glucitol: 7
Water: balance of
The silicon modifier of the silicon modified polyether is triethoxysilane, and the polyether is propenyl polyoxyethylene polyoxypropylene ether (m is 5, n is 5).
Respectively carrying out diamond wire cutting on the single crystal silicon rod and the polycrystalline silicon rod of the samples and the commercially available competitive products 1-3 in the embodiments 1-5, wherein each sample is cut by 100 knives, the multi-wire cutting machine selects the same manufacturer and the same model type, all auxiliary material manufacturers are the same, the cutting process is kept consistent, and the diamond wire cutting wire diameter is selected for cutting
(for cutting the silicon single crystal rod),
(for cutting polycrystalline silicon rods), the silicon rods have the same size and the same source manufacturer, and the statistics of the yield of the cut silicon wafers are shown in table 1.
TABLE 1 comparison of the yields of different cutting fluids
According to the data in table 1, compared with the cutting data of the diamond wires of the single crystal silicon rods and the polycrystalline silicon rods, the formula samples in examples 1 to 5 have obvious advantages in the yield of the product A, the wire mark B, the edge breakage B, BTTV, dirt and the like compared with the commercially available competitive products 1 to 3, and are superior to the commercially available competitive products, wherein the sample in example 3 is the optimal experimental formula of the cutting fluid of the single crystal silicon rods and the polycrystalline silicon rods.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Drawings
FIG. 1 is an infrared spectrum of a silicon-modified polyether.
Claims (6)
1. An aqueous cutting fluid for diamond wire cutting, the cutting fluid comprising: 8-33 parts of silicon modified polyether; 3-7 parts by weight of a silane hydrolysis inhibiting stabilizer; the balance of water; and the total weight portion is 100; the silane hydrolysis inhibiting stabilizer is a polyalcohol or polysaccharide compound, specifically one or more of sorbitol, xylitol, glucitol, fructose, maltose, glucose and anhydroglucose; wherein the structural formula of the silicon modified polyether is as follows:
wherein m is an integer of 1 to 10, and n is an integer of 0 to 10.
2. The aqueous cutting fluid for diamond wire cutting as claimed in claim 1, wherein the silicon modified polyether is prepared by addition synthesis reaction of silicon modifier and polyether, and the polyether can undergo hydrolysis reaction under cutting interface temperature and pressure environment, and silicon hydroxyl groups with strong adsorbability are formed on the chain end of the silicon modified polyether.
3. The aqueous cutting fluid for diamond wire cutting according to claim 2, wherein the polyether is one or more selected from the group consisting of propenyl polyoxyethylene polyoxypropylene ether, butenyl polyoxyethylene polyoxypropylene ether, methallyl polyoxyethylene polyoxypropylene ether, methyl allyl polyoxyethylene polyoxypropylene ether, vinyl amyl polyoxyethylene polyoxypropylene ether, vinyl glycol ether polyoxyethylene ether polyoxypropylene ether, vinyl butylene glycol ether polyoxyethylene ether polyoxypropylene ether; the specific structure of the polyether is as follows:
wherein m is an integer of 1 to 10, and n is an integer of 0 to 10.
4. The aqueous cutting fluid for diamond wire cutting according to claim 2, wherein the silicon modifier is one or more of trimethoxysilane and triethoxysilane; the structural formula of the silicon modifier is as follows:
5. the method for preparing the aqueous cutting fluid for diamond wire cutting according to any one of claims 1 to 4, wherein the method comprises the following steps: 1) adding water into a reaction kettle; 2) starting stirring, and adding a silane hydrolysis inhibiting stabilizer in a room temperature environment to completely dissolve the silane hydrolysis inhibiting stabilizer; 3) adding silicon modified polyether, stirring until the silicon modified polyether is completely dissolved, wherein the reaction temperature is 5-40 ℃, the stirring time is 1-5 hours, then stopping stirring, and aging for 0.5-4 hours to obtain the aqueous cutting fluid for diamond wire cutting.
6. The use method of the aqueous cutting fluid for diamond wire cutting according to any one of claims 1 to 4, wherein the weight ratio of the aqueous cutting fluid for diamond wire cutting to water is 1:200 to 1000.
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| US20100168309A1 (en) * | 2007-05-01 | 2010-07-01 | Mackinnon Iain A | Polymer And Polymer Compositions |
| CN101921648A (en) * | 2009-06-12 | 2010-12-22 | 日信化学工业株式会社 | Aqueous cutting fluid and aqueous cutting agent |
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