CN112872918A

CN112872918A - Grinding method for removing layers of chip sample

Info

Publication number: CN112872918A
Application number: CN202110065271.5A
Authority: CN
Inventors: 吴碧云
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-01-18
Filing date: 2021-01-18
Publication date: 2021-06-01

Abstract

The invention discloses a grinding method for removing layers of a chip sample, and belongs to the field of chip test analysis. A chip sample layering removing grinding method is realized based on chip sample grinding equipment, the chip sample grinding equipment comprises a base, a support frame is arranged above the base, a penetrating groove is formed in the middle of the top surface of the support frame and opposite to a chip groove, a fixing box is arranged on the right side of the top surface of the support frame, a threaded hole is formed in the middle of the top surface of the fixing box, a metal hose is connected to the upper end of the threaded hole, a collecting bottle is arranged inside the fixing box, external threads are formed in the outer wall of the opening end of the collecting bottle, a filter screen is embedded in the middle of the bottom surface of the. The invention improves the accuracy of grinding and sampling work of the chip fault area, avoids samples in other areas from being mixed in the samples, improves the effectiveness of the analysis result and provides great help for workers to analyze the reason of the chip fault.

Description

Grinding method for removing layers of chip sample

Technical Field

The invention relates to the field of chip test analysis, in particular to a grinding method for removing layers of a chip sample.

Background

With the development of the electronic industry, the use of chips is more and more extensive, and in chip test analysis, failure analysis is generally required to be performed on a sample chip with problems, wherein in the failure analysis, a chip sample is generally ground, layer-by-layer grinding and peeling are performed on a positioning point or a fault area, and a failure mechanism is observed to analyze a failure reason.

Through search, patent with publication number CN107738141A discloses a method for grinding a chip sample to remove layers, which increases the contact area during grinding by the combination of a dummy chip, a sample chip and a curing adhesive, and adopts the curing adhesive to fill the gap between the dummy chip and the sample chip to protect the sample corner, thereby improving the problem of over-fast grinding of the sample edge and improving the grinding uniformity.

However, the prior art still has at least the following technical problems that are not solved: 1) although the grinding sufficiency degree to the sample has been strengthened to current device, it can't reach accurate injecing to the grinding position of chip, just so cause to peel off the thing and mix in the grinding sample that has not the trouble region easily, this will produce great influence to subsequent analysis result, be unfavorable for staff's accurate judgement chip's fault reason, 2) and the collection of the powder of peeling off among the current device only relies on artifical manual collection, such mode not only has great operation degree of difficulty but also leads to impurity such as the dust of adhesion on the people hand to fall into the powder easily and causes the analysis mistake. In view of the above, we propose a method for polishing a chip sample to remove layers.

Disclosure of Invention

1. Technical problem to be solved

The invention aims to provide a grinding method for removing layers of a chip sample, so as to solve the problems in the background technology.

2. Technical scheme

The chip sample grinding device comprises a base, a chip groove is arranged in the middle of the top surface of the base, two clamping plates are symmetrically arranged on two sides of the chip groove, the outer side wall of the splint is provided with two sliding columns in a symmetrical structure, the inner wall of the chip groove is provided with a column groove relative to the position of the sliding column, a compression spring A is sleeved outside the sliding column, a supporting frame is arranged above the base, a penetrating groove is arranged at the position of the middle part of the top surface of the supporting frame, which is opposite to the chip groove, a fixing box is arranged on the right side of the top surface of the supporting frame, a threaded hole is arranged in the middle of the top surface of the fixing box, the upper end of the threaded hole is connected with a metal hose, a collecting bottle is arranged in the fixing box, the outer wall of the opening end of the collecting bottle is provided with external threads, the filter screen is embedded in the middle of the bottom surface of the collecting bottle, and a fixed-point sampling assembly aligned with the position of the chip to be ground is arranged below the left side of the metal hose.

Preferably, the sliding column is in sliding fit with the column groove, the supporting frame is of a U-shaped structure, the size of the through groove is the same as that of the chip groove, the fixing box is of a U-shaped structure, the external thread is in threaded connection with the threaded hole, and the inside of the collecting bottle is communicated with the inside of the metal hose through the threaded hole.

Preferably, the fixed point sampling subassembly is including removing the frame, it has two sliders to remove frame both ends symmetry and set firmly, run through the inslot wall and seted up the spout for the position of slider, slider and spout are trapezoidal column structure, slider and spout sliding fit, it has the movable plate to remove frame top surface rear side and set firmly through two pillars that the symmetry was equipped with, movable plate bottom surface and support frame top surface sliding fit.

Preferably, remove the inside solid fixed ring that is equipped with of frame, gu fixed ring bilateral symmetry has set firmly two stoppers, the stopper is U type structure, stopper inner wall and removal frame lateral wall sliding fit are located the screw has all been seted up with removal board top surface middle part to the stopper top surface, the screw interpolation is equipped with rather than threaded connection's screw rod, the screw rod lower extreme passes the screw and extends to the lower part and set firmly the rubber pad.

Preferably, solid fixed ring middle part is inserted and is equipped with hollow post, hollow post upside open end is connected fixedly and is linked together with metal collapsible tube left side open end, hollow post outer wall and solid fixed ring inner wall sliding contact, two recesses have been seted up to hollow post bilateral symmetry, the recess inner wall has set firmly the joint piece through compression spring B, joint piece bottom surface outside end is the fillet structure, gu fixed ring inner wall runs through for the position of joint piece and has seted up the joint groove, joint piece and joint groove joint cooperation.

Preferably, the coaxial turbofan that is equipped with in hollow post upper portion, the coaxial pivot that runs through in turbofan middle part, the coaxial fixedly connected with motor in pivot upper end, two connecting plates that the motor both sides outer wall set firmly through the symmetry are fixed with hollow post inner wall connection, the coaxial fixedly connected with footstock of pivot lower extreme, the footstock is the lid form cylinder structure.

Preferably, the outer upper end cover of footstock is equipped with the swivel becket, the annular has been seted up to the position of hollow post inner wall for the swivel becket, the swivel becket rotates with the annular and is connected, the swivel becket inner wall is fixed with the footstock outer wall through being the annular a plurality of connecting rods that equidistant set firmly, the footstock is inside to be inserted and is equipped with the grinding post, be connected with compression spring C between grinding post top surface and the inboard top surface of footstock, grinding post bottom is the square matrix and arranges and has set firmly a plurality of grinding pieces.

The invention also discloses a grinding method for removing layers of a chip sample, which comprises the following steps:

and S1, inserting the fault chip along the middle part of the chip groove, and clamping the fault chip by two clamping plates.

S2, transversely sliding the movable frame along the sliding groove through the sliding block, screwing the screw rod along the top surface of the movable block to extrude the rubber pad onto the top surface of the support frame after selecting a proper transverse position, fixing the position of the movable frame by increasing the friction force between the movable block and the support frame, then sliding the fixed ring along the inside of the fixed frame to select a proper longitudinal position, and fixing the position of the fixed ring through the screw rod on the top surface of the right side limiting block in the same mode to align the middle position of the fixed ring to a chip fault area.

S3, twist the receiving flask along the screw hole again, insert hollow post along solid fixed ring middle part, it is spacing with hollow post through the joint in joint piece and joint groove, trouble chip this moment will grind the post along compression spring C direction jack-up that makes progress, pass through the wire with the motor afterwards and be connected with external power supply, then driving motor drives turbofan and footstock and grinding post rotation.

S4, grinding the fault area of the chip when the grinding column rotates, sucking the ground powder into a metal hose along a hollow column by wind power driven by a turbofan, and finally dropping the metal hose into a collecting bottle through a threaded hole, intercepting the powder by a filter screen, stopping the operation of the device after a pressure value measured by a pressure sensor at the bottom of the filter screen reaches a first pressure threshold value, taking down the collecting bottle and then carrying out test analysis on the powder in the collecting bottle.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

1. the invention is provided with a fixed point sampling component, a worker can slide the movable frame along the sliding fit direction of the sliding block and the sliding groove to align the longitudinal position of the fault area of the chip, then the fixed ring is matched with the fault area transversely along the sliding fit of the limiting block and the movable frame along the middle part of the movable frame, then the screw rods are screwed downwards along the middle part of the top surface of the movable plate and the middle part of the top surface of the limiting block on the right side respectively, the friction force between the fixed ring and the sliding fit object is increased by using the rubber gasket to achieve the limiting effect, so that the grinding position can be accurately limited, then the fault area of the chip can be ground and sampled pertinently by inserting the hollow column along the middle part of the fixed ring, the precision of the grinding and sampling work of the fault area of the chip is improved, the samples in other areas are prevented from being mixed, and the, the method provides great help for workers to analyze the causes of the chip faults.

2. The fixed point sampling assembly is also provided with a hollow column, the hollow column can be installed by connecting a clamping block on the outer wall of the hollow column with a clamping groove on a fixing ring, then a worker only needs to drive a rotating shaft to rotate by using a motor, so that the rotating shaft simultaneously drives a turbofan and a top seat to rotate, the top seat can drive a grinding column fixedly arranged in the top seat to rotate through a compression spring C, a grinding block on the bottom surface of the grinding column can grind a chip fault area at the moment, meanwhile, the turbofan positioned at the upper side can form a low-air-pressure area at the upper end in the hollow column in the rotating process, so that air is sucked into the hollow column from the lower opening end of the hollow column, powder in the chip fault area ground by the grinding block can be driven into a metal hose and fall into a collecting bottle through a threaded hole while being sucked, and the air entering the collecting bottle can be blown out through a filter screen, it wraps up in and just can be intercepted the follow-up analysis of collecting of convenient staff in the receiving flask by some chip sample powder of holding by the hands to such structure can effectual improvement sample work's accuracy, has avoided the contact of staff's hand and sample, prevents that the impurity doping of staff on hand from leading to the analysis result to make mistakes in getting into the sample, has further improved the sample accuracy nature of this device, and the very big sampling operation who has made things convenient for the staff again, labour saving and time saving.

3. The compression spring C is fixedly arranged between the top surface of the grinding column and the top seat, and the elasticity of the compression spring C is utilized to enable the grinding column to have a gradual grinding process on a chip fault area along with the resilience force of the compression spring C during grinding and sampling, so that the ground sample is more delicate, the loss of a grinding block can be effectively reduced, the analysis difficulty is reduced, and the service life of the device is prolonged.

4. The grinding blocks are arranged in a square matrix, so that the contact surface between the grinding column and the chip can be reduced to improve the grinding efficiency, and the ground sample can be sucked into the hollow column through gaps among the grinding blocks.

5. According to the grinding column, the rotating ring is sleeved at the upper end outside the base and is rotationally connected with the annular groove in the inner wall of the hollow column, and the rotating ring is fixedly connected with the outer wall of the top seat through the connecting rod, so that the annular groove generates supporting force on the top seat, the burden of the connecting plate is reduced, and the grinding column can rotate more stably.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of a movable frame and a fixed ring according to the present invention;

FIG. 3 is a schematic view of the structure of the screw and the rubber pad of the present invention;

FIG. 4 is a schematic cross-sectional view of the base and the supporting frame of the present invention;

FIG. 5 is a schematic structural view of a fixing case according to the present invention;

fig. 6 is a schematic sectional view of the hollow column according to the present invention.

The reference numbers in the figures illustrate: 1. a base; 2. a chip slot; 3. a splint; 4. a traveler; 5. a column groove; 6. a support frame; 7. a through groove; 8. compressing the spring A; 9. a fixing box; 10. a threaded hole; 11. a metal hose; 12. a collection bottle; 1201. an external thread; 13. filtering with a screen; 14. a fixed point sampling assembly; 15. moving the frame; 16. a slider; 17. a chute; 18. a pillar; 19. moving the plate; 20. a fixing ring; 21. a limiting block; 22. a screw hole; 23. a screw; 24. a rubber pad; 25. a hollow column; 26. a groove; 27. a compression spring B; 28. a clamping block; 29. a clamping groove; 30. a turbo fan; 31. a rotating shaft; 32. an electric motor; 33. a connecting plate; 34. a top seat; 35. a rotating ring; 36. a ring groove; 37. a connecting rod; 38. grinding the column; 39. a compression spring C; 40. and (5) grinding the blocks.

Detailed Description

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-6, the present invention provides a technical solution:

a chip sample layer-removing grinding method is realized based on a chip sample grinding device, the chip sample grinding device comprises a base 1, a chip groove 2 is arranged in the middle of the top surface of the base 1, two clamping plates 3 are symmetrically arranged on two sides of the chip groove 2, two sliding columns 4 are symmetrically arranged on the outer side walls of the clamping plates 3, a column groove 5 is arranged on the inner wall of the chip groove 2 at a position corresponding to the sliding column 4, a compression spring A8 is sleeved on the outer side of the sliding column 4, a supporting frame 6 is arranged above the base 1, a penetrating groove 7 is arranged in the middle of the top surface of the supporting frame 6 at a position corresponding to the chip groove 2, a fixing box 9 is arranged on the right side of the top surface of the supporting frame 6, a threaded hole 10 is arranged in the middle of the top surface of the fixing box 9, a metal hose 11 is connected to the upper end of the threaded hole 10, a collecting bottle, the bottom of filter screen 13 is provided with pressure sensor, and pressure sensor is connected with the controller, and metal collapsible tube 11 left side below is equipped with fixed point sampling subassembly 14.

The method comprises the following steps:

s1, firstly, inserting the fault chip along the middle part of the chip groove 2, and clamping the fault chip by two clamping plates 3.

S2, the movable frame 15 slides transversely along the sliding groove 17 through the sliding block 16, the rubber pad 24 is extruded to the top surface of the support frame 6 by screwing the screw rod 23 along the top surface of the movable block after the proper transverse position is selected, the position of the movable frame 15 is fixed by increasing the friction force between the movable block and the support frame 6, the fixed ring 20 slides along the inside of the fixed frame to select the proper longitudinal position, and the position of the fixed ring 20 is fixed in the same way through the screw hole 22 on the top surface of the right side limiting block 21, so that the middle position of the fixed ring 20 is aligned with the fault area of the chip.

S3, screwing the collecting bottle 12 along the threaded hole 10, inserting the hollow column 25 along the middle of the fixing ring 20, limiting the hollow column 25 through clamping of the clamping block 28 and the clamping groove 29, jacking the grinding column 37 upwards along the direction of the compression spring C39 by the fault chip, connecting the motor 32 with an external power supply through a lead, connecting the motor 32 with a controller, and driving the motor 32 to drive the turbofan 30 to rotate with the top seat 34 and the grinding column 37.

S4, grinding the chip failure area when the grinding column 37 rotates, the ground powder is sucked into the metal hose 11 along the hollow column 25 by wind power driven by the turbofan 30 and finally falls into the collecting bottle 12 through the threaded hole 10, the powder is intercepted by the filter screen 13, when the pressure value measured by the pressure sensor at the bottom of the filter screen 13 reaches a first pressure threshold value, the powder enough for analysis is collected, the controller closes the motor 32, the operation device is stopped, the collecting bottle 12 is taken down, and then the powder in the collecting bottle 12 is analyzed.

Specifically, traveller 4 and post groove 5 sliding fit, support frame 6 are U type structure, and it is the same with 2 size dimensions in chip groove to run through 7 size dimensions in groove, and fixed box 9 is U type structure, and external screw thread 1201 and screw hole 10 threaded connection, the inside screw hole 10 and the 11 inside being linked together of metal collapsible tube that pass through of collecting bottle 12, the staff can twist collecting bottle 12 in screw hole 10 and accomodate the sample powder that fixed point sampling subassembly 14 inhaled through external screw thread 1201.

Further, fixed point sampling subassembly 14 is including removing frame 15, remove frame 15 both ends symmetry and set firmly two sliders 16, run through 7 inner walls of groove and seted up spout 17 for the position of slider 16, slider 16 is trapezoidal column structure with spout 17, slider 16 and spout 17 sliding fit, remove frame 15 top surface rear side and set firmly movable plate 19 through two pillars 18 that the symmetry was equipped with, movable plate 19 bottom surface and 6 top surfaces sliding fit of support frame, staff's accessible is along slider 16 and spout 17 sliding fit's direction sliding movement frame 15, aim at the longitudinal position in chip fault area with this.

Furthermore, a fixing ring 20 is arranged inside the moving frame 15, two limiting blocks 21 are symmetrically and fixedly arranged on two sides of the fixing ring 20, the limiting blocks 21 are of a U-shaped structure, the inner walls of the limiting blocks 21 are in sliding fit with the side walls of the moving frame 15, the fixing ring 20 is in sliding fit with the moving frame 15 along the limiting blocks 21, the middle of the fixing ring 20 is transversely corresponding to a fault area, screw holes 22 are formed in the top surfaces of the limiting blocks 21 and the top surface of the moving plate 19 on the right side, screw rods 23 in threaded connection with the screw holes 22 are inserted into the screw holes 22, the lower ends of the screw rods 23 penetrate through the screw holes 22 and extend to the lower portion, rubber pads 24 are fixedly arranged on the lower portion, finally the screw rods 23 are screwed downwards along the middle of the top surface of the moving plate 19 and the middle of the top surface of the limiting blocks 21.

Still further, gu fixed ring 20 middle part is inserted and is equipped with hollow post 25, hollow post 25 upside open end is connected fixedly and is linked together with metal collapsible tube 11 left side open end, hollow post 25 outer wall and the sliding contact of solid fixed ring 20 inner wall, hollow post 25 bilateral symmetry has seted up two recesses 26, recess 26 inner wall has set firmly joint piece 28 through compression spring B27, joint piece 28 bottom surface outside end is fillet structure, gu fixed ring 20 inner wall runs through for the position of joint piece 28 and has seted up joint groove 29, joint piece 28 and the cooperation of joint groove 29 joint, only need afterwards to insert hollow post 25 along solid fixed ring 20 middle part can carry out the pertinence grinding sample to the fault area of chip, hollow post 25 accessible its outer wall joint piece 28 reaches the installation with being connected of joint groove 29 on the fixed ring 20.

It is worth introducing, coaxial turbofan 30 that is equipped with in hollow post 25 upper portion, coaxial the running through in turbofan 30 middle part is equipped with pivot 31, the coaxial fixedly connected with motor 32 in pivot 31 upper end, motor 32 passes through the wire and is connected with external power source, motor 32 both sides outer wall is fixed with two connecting plates 33 and hollow post 25 inner wall connection through the symmetry, the coaxial fixedly connected with footstock 34 of pivot 31 lower extreme, footstock 34 is the cap form cylinder structure, the staff only needs to utilize motor 32 to drive pivot 31 and rotate and can make pivot 31 drive turbofan 30 and footstock 34 simultaneously and rotate.

It should be noted that, a rotating ring 35 is sleeved on the upper end of the outer portion of the top seat 34, a circular groove 36 is formed in the inner wall of the hollow column 25 corresponding to the rotating ring 35, the rotating ring 35 is rotatably connected with the circular groove 36, the inner wall of the rotating ring 35 is fixedly connected with the outer wall of the top seat 34 through a plurality of connecting rods 37 which are fixedly arranged at equal intervals in a ring shape, a grinding column 38 is inserted into the top seat 34, a compression spring C39 is connected between the top surface of the grinding column 37 and the inner top surface of the top seat 34, a plurality of grinding blocks 40 are fixedly arranged on the bottom surface of the grinding column 37 in a square array, the grinding column 38 fixedly arranged in the top seat 34 through the compression spring C39 is driven to rotate by the rotation of the top seat 34, the grinding block 40 on the bottom surface of the grinding column 38 can grind the fault area of the chip, a compression spring C39 is fixedly arranged between the top surface of the grinding column 38 and the top seat 34, and the resilience of the compression spring C39 can enable the grinding column 38, therefore, the ground sample is more delicate, and the wear of the grinding block 40 can be effectively reduced.

The working principle is as follows: the worker can slide the movable frame 15 along the sliding fit direction of the sliding block 16 and the sliding groove 17 to align the longitudinal position of the fault area of the chip, then the fixed ring 20 is in sliding fit with the movable frame 15 along the limiting block 21 along the middle of the movable frame 15 to transversely correspond the middle of the fixed ring 20 to the fault area, then the screw 23 is screwed downwards along the middle of the top surface of the movable plate 19 and the middle of the top surface of the right limiting block 21 respectively, the rubber pad 24 is used for increasing the friction force between the fixed ring and the sliding fit object of the fixed ring, so that the limiting effect is achieved, the grinding position can be accurately limited, then the fault area of the chip can be ground and sampled in a targeted manner only by inserting the hollow column 25 along the middle of the fixed ring 20, the hollow column 25 can be installed through connection of the clamping block 28 on the outer wall of the hollow column 25 and the clamping groove 29 on the fixed ring 20, and then the worker can drive the rotating shaft The top seat 34 rotates, the top seat 34 rotates to drive the grinding column 38 fixed therein through the compression spring C39 to rotate, the grinding block 40 on the bottom surface of the grinding column 38 grinds the chip failure area at this moment, the compression spring C39 is fixed between the top surface of the grinding column 38 and the top seat 34, the elasticity of the compression spring C39 is utilized to enable the grinding column 38 to have a progressive grinding process on the chip failure area along with the resilience of the compression spring C39 during grinding and sampling, so that the ground sample is more delicate and the loss of the grinding block 40 can be effectively reduced, the analysis difficulty is reduced, the service life of the device is also prolonged, the grinding block 40 is arranged in a square matrix, through the structure, the contact surface between the grinding column 38 and the chip can be reduced to improve the grinding efficiency, and the ground sample can be sucked into the hollow column 25 through the gap between the grinding blocks 40, the design is ingenious, double at a stroke, meanwhile, the turbofan 30 positioned on the upper side can form a low-pressure area at the inner upper end of the hollow column 25 in the rotating process, so that air is sucked into the hollow column 25 from the lower side opening end of the hollow column 25, the air can drive the chip failure area powder ground by the grinding block 40 to enter the metal hose 11 and fall into the collecting bottle 12 through the threaded hole 10 while being sucked, the air entering the collecting bottle 12 can be blown out through the filter screen 13, the chip sample powder wrapped in the chip failure area powder can be intercepted in the collecting bottle 12 so as to facilitate the subsequent collection and analysis of workers, when the pressure value measured by the pressure sensor at the bottom of the filter screen 13 reaches a first pressure threshold value, the powder enough for analysis is collected, the controller automatically turns off the motor 32, the waste caused by excessive grinding is avoided, and the accuracy of the sampling work can be effectively improved by the structure, the contact of staff's hand and sample has been avoided, prevent that the impurity doping of staff's hand from leading to the analysis result to make mistakes in going into the sample, the sampling accuracy nature of this device has further been improved, and the very big sampling operation who has made things convenient for the staff again, time saving and labor saving has improved the accuracy that chip trouble regional grinding sample work, it has mixed the sample in other regions to have avoided in the sample, the validity of analysis result has been improved, provide very big help for staff analysis chip trouble reason.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and the preferred embodiments of the present invention are described in the above embodiments and the description, and are not intended to limit the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A chip sample grinding apparatus, characterized by: the chip sample grinding equipment comprises a base (1), a chip groove (2) is formed in the middle of the top surface of the base (1), two clamping plates (3) are symmetrically arranged on two sides of the chip groove (2), the outer side wall of each clamping plate (3) is of a symmetrical structure and is provided with two sliding columns (4), a column groove (5) is formed in the inner wall of the chip groove (2) relative to the position of each sliding column (4), a compression spring A (8) is sleeved on the outer side of each sliding column (4), a support frame (6) is arranged above the base (1), a through groove (7) is formed in the middle of the top surface of the support frame (6) relative to the position of the chip groove (2), a fixing box (9) is arranged on the right side of the top surface of the support frame (6), a threaded hole (10) is formed in the middle of the top surface of the fixing box (9), a metal hose (11) is connected to the upper end, external screw thread (1201) have been seted up to collecting bottle (12) open end outer wall, collecting bottle (12) bottom surface middle part is inlayed and is equipped with filter screen (13), metal collapsible tube (11) left side below is equipped with and treats fixed point sampling subassembly (14) that the chip position of grinding aligns.

2. The apparatus of claim 1, wherein: the sliding column (4) is in sliding fit with the column groove (5), the supporting frame (6) is of a U-shaped structure, the size of the through groove (7) is the same as that of the chip groove (2), the fixing box (9) is of a U-shaped structure, the external thread (1201) is in threaded connection with the threaded hole (10), and the inside of the collecting bottle (12) is communicated with the inside of the metal hose (11) through the threaded hole (10).

3. The apparatus of claim 1, wherein: fixed point sampling subassembly (14) are including removing frame (15), remove frame (15) both ends symmetry and have set firmly two slider (16), run through groove (7) inner wall and seted up spout (17) for the position of slider (16), slider (16) are trapezoidal column structure with spout (17), slider (16) and spout (17) sliding fit, two pillars (18) that remove frame (15) top surface rear side and be equipped with through the symmetry have set firmly movable plate (19), movable plate (19) bottom surface and support frame (6) top surface sliding fit.

4. A chip sample grinding apparatus according to claim 3, wherein: remove frame (15) inside and be equipped with solid fixed ring (20), gu fixed ring (20) bilateral symmetry has set firmly two stopper (21), stopper (21) are U type structure, stopper (21) inner wall and removal frame (15) lateral wall sliding fit are located the right side stopper (21) top surface and movable plate (19) top surface middle part have all seted up screw (22), screw (22) interpolation is equipped with screw rod (23) rather than threaded connection, screw rod (23) lower extreme passes screw (22) and extends to the lower part and has set firmly rubber pad (24).

5. The apparatus of claim 4, wherein: it is equipped with hollow post (25) to gu fixed ring (20) middle part is inserted, hollow post (25) upside open end is connected fixedly and is linked together with metal collapsible tube (11) left side open end, hollow post (25) outer wall and solid fixed ring (20) inner wall sliding contact, two recess (26) have been seted up to hollow post (25) bilateral symmetry, recess (26) inner wall has set firmly joint piece (28) through compression spring B (27), joint piece (28) bottom surface outside end is the fillet structure, gu fixed ring (20) inner wall runs through for the position of joint piece (28) and has seted up joint groove (29), joint piece (28) and joint groove (29) joint cooperation.

6. The apparatus of claim 5, wherein: hollow post (25) upper portion is coaxial to be equipped with turbofan (30), the coaxial pivot (31) that runs through in turbofan (30) middle part, the coaxial fixedly connected with motor (32) in pivot (31) upper end, motor (32) both sides outer wall sets firmly two connecting plates (33) that are equipped with through the symmetry and is fixed with hollow post (25) inner wall connection, the coaxial fixedly connected with footstock (34) of pivot (31) lower extreme, footstock (34) are the lid form cylinder structure.

7. The apparatus of claim 6, wherein: the utility model discloses a grinding machine, including footstock (34), hollow column (25), top seat (34) outside upper end cover is equipped with swivel becket (35), annular (36) have been seted up for swivel becket (35) position to hollow column (25) inner wall, swivel becket (35) rotates with annular (36) to be connected, swivel becket (35) inner wall is fixed through being a plurality of connecting rods (37) that the annular equidistant set has and footstock (34) outer wall connection, footstock (34) inside is inserted and is equipped with grinding column (38), be connected with compression spring C (39) between grinding column (38) top surface and footstock (34) inboard top surface, grinding column (38) bottom surface is the square matrix and arranges and has set firmly a plurality of grinding pieces (40).

8. A grinding method for removing layers of a chip sample is characterized by comprising the following steps:

s1, inserting the fault chip along the middle part of the chip groove (2), and clamping the fault chip by two clamping plates (3);

s2, transversely sliding the movable frame (15) along the sliding groove (17) through the sliding block (16), screwing the screw rod (23) along the top surface of the movable block after selecting a proper transverse position to press the rubber gasket (24) onto the top surface of the support frame (6), so that the friction force between the movable block and the support frame (6) is increased to fix the position of the movable frame (15), then sliding the fixed ring (20) along the inside of the fixed frame to select a proper longitudinal position, and fixing the position of the fixed ring (20) through the screw rod (23) on the top surface of the right side limiting block (21) in the same way, so that the middle position of the fixed ring (20) is aligned with a chip fault area;

s3, screwing the collecting bottle (12) along the threaded hole (10), inserting the hollow column (25) along the middle of the fixing ring (20), limiting the hollow column (25) through clamping of the clamping block (28) and the clamping groove (29), jacking the grinding column (38) upwards along the direction of the compression spring C (39) by the fault chip, then connecting the motor (32) with an external power supply through a wire, and driving the motor (32) to drive the turbofan (30), the top seat (34) and the grinding column (38) to rotate;

s4, grinding the fault area of the chip when the grinding column (38) rotates, sucking the ground powder into the metal hose (11) along the hollow column (25) by wind power driven by the turbofan (30) and finally dropping into the collecting bottle (12) through the threaded hole (10), intercepting the powder by the filter screen (13), stopping the operation of the device when the pressure value measured by the pressure sensor at the bottom of the filter screen (13) reaches a first pressure threshold value, taking down the collecting bottle (12) and then carrying out test analysis on the powder in the collecting bottle.