CN112872144B

CN112872144B - Processing die for lead frame and processing method thereof

Info

Publication number: CN112872144B
Application number: CN202011564099.XA
Authority: CN
Inventors: 朱宝才; 周大跃; 徐文冬; 马春晖; 何黎; 操瑞林; 杨长斌; 窦坤; 陈亮; 陶国海; 刘和平
Original assignee: Tongling Landun Fengshan Microelectronic Co ltd
Current assignee: Tongling Landun Fengshan Microelectronic Co ltd
Priority date: 2020-12-25
Filing date: 2020-12-25
Publication date: 2023-07-07
Anticipated expiration: 2040-12-25
Also published as: CN112872144A

Abstract

The invention discloses a processing die for a lead frame and a processing method thereof, wherein the processing die comprises a stamping mechanism, a cooling mechanism and a waste recycling mechanism, the waste recycling mechanism is arranged below the stamping mechanism, the cooling mechanism is communicated with the waste recycling mechanism through a water inlet pipeline, the cooling mechanism is communicated with the stamping mechanism through a water outlet pipeline, the waste recycling mechanism comprises a filtering structure and a recycling structure, the filtering structure comprises a filtering box, the top of the inner cavity of the filtering box is fixedly connected with a drainage plate, the inner cavity of the filtering box is fixedly connected with a filtering plate, the drainage plate is arranged above the filtering plate, the right side of the filtering box is provided with a waste port, and the bottom of the inner cavity of the filtering box is paved with a sand stone layer. The processing die for the lead frame and the processing method thereof can timely treat the blanked residues, and water for flushing the surface of the lead frame can be continuously and practically used after being recovered and cooled by the recovery mechanism, so that the operation safety is improved, and meanwhile, the resource waste is reduced.

Description

Processing die for lead frame and processing method thereof

Technical Field

The invention relates to the technical field of dies, in particular to a processing die for a lead frame and a processing method thereof.

Background

With the development and progress of science and technology, the demands of people on things are changed from old thinking that people can use things, become quite fine and demanding, and only the continuous progress or innovative conception generates new forms to improve the added value of products, so that people can survive under the vigorous test of market competition. The semiconductor lead frame is used as a chip carrier of an integrated circuit, is a key structural member for forming an electric loop by electrically connecting an internal circuit leading-out end of the chip with an external lead through bonding materials (gold wires, aluminum wires and copper wires), plays a role of a bridge connected with an external lead, and most of semiconductor integrated blocks need to use the lead frame, so that the semiconductor lead frame is an important basic material in the electronic information industry. At present, a lead frame is generally formed by arranging a plurality of identical copper-based units, each copper-based unit comprises a radiating fin, a carrier, an inner lead and an outer lead which are sequentially connected into a whole, the carrier is used for carrying a chip of an electronic component, the chip is encapsulated on the carrier after being encapsulated by a plastic package body, stamping is one method for manufacturing the lead frame, and a blanking die is an important component.

The existing lead frame processing die has the surface flushing function after punching the lead frame, but residues on the surface of the lead frame are directly flushed to the ground, but the residues are relatively sharp, so that mistaken stepping is easily caused, and the injury of staff is easily caused.

Disclosure of Invention

Aiming at the defects of the prior art, the invention provides a processing die for a lead frame and a processing method thereof, which solve the problems that residues on the surface of the lead frame are directly flushed to the ground, but the residues are relatively sharp, are easy to step by mistake and are easy to cause injury of staff.

In order to achieve the above purpose, the invention is realized by the following technical scheme: the processing die for the lead frame comprises a stamping mechanism, a cooling mechanism and a waste recycling mechanism, wherein the waste recycling mechanism is arranged below the stamping mechanism, the cooling mechanism is communicated with the waste recycling mechanism through a water inlet pipeline, the cooling mechanism is communicated with the stamping mechanism through a water outlet pipeline, and the waste recycling mechanism comprises a filtering structure and a recycling structure; the filtering structure comprises a filtering box, the top of the inner cavity of the filtering box is fixedly connected with a drainage plate, the inner cavity of the filtering box is fixedly connected with a filter plate, the drainage plate is arranged above the filter plate, a waste material port is formed in the right side of the filtering box, a sand stone layer is paved at the bottom of the inner cavity of the filtering box, a first water outlet is formed in the left bottom of the filtering box, and the inner cavity of the first water outlet is communicated with the surface of a water inlet pipeline; the utility model provides a waste material mouth intercommunication is passed through to recovery structure and filtration, recovery structure includes the recovery case, the surface of recovery case and the surface swing joint of rose box, the first blanking board of left side fixedly connected with of recovery case inner chamber, the right side fixedly connected with second blanking board of recovery case inner chamber, the top of second blanking board is connected with the push pedal through the hinge rotation, the top of push pedal and the inner chamber swing joint of recovery case, the right side fixedly connected with supporting spring of push pedal, supporting spring's right-hand member fixedly connected with trigger switch, the right side fixedly connected with of trigger switch and recovery case inner chamber, the right side fixedly connected with solenoid valve of first blanking board, the right side of solenoid valve and the left side fixedly connected with of second blanking board, the surface electric connection of trigger switch passes through the surface of wire and solenoid valve, the surface of wire runs through the surface of recovery case and extends to its inner chamber.

As a further scheme of the invention: the cooling mechanism comprises a cooling box, a water reservoir, a first base, a cooling structure and a second base; the bottom of the cooling box is fixedly connected with the top of the first base, a first water inlet is formed in the surface of the cooling box, the inner cavity of the first water inlet is communicated with the surface of a water inlet pipe, the inner cavity of the first water inlet is communicated with the surface of a water storage tank through a pipeline, the bottom of the water storage tank is fixedly connected with the bottom of the inner cavity of the cooling box, the surface of the water storage tank is communicated with the water pumping end of a water pump through a water pipe, the water outlet end of the water pump is communicated with a cooling structure through the water pipe, the inner cavity of the cooling box is fixedly connected with a supporting plate, the surface of the water pipe penetrates through the surface of the supporting plate and extends to the top of the supporting plate, the top of the supporting plate is fixedly connected with the bottom of the second base, a second water outlet is formed in the top of the cooling box, the inner cavity of the second water outlet is communicated with a water outlet pipe, and the supporting plate is arranged between the cooling structure and the water pumping pump; the cooling structure comprises a cooling tank, a semiconductor refrigerator and a high-pressure water pump, wherein the bottoms of the cooling tank and the semiconductor refrigerator are fixedly connected with the top of the second base, the right side of the cooling tank is communicated with the left side of the semiconductor refrigerator through a water pipe, the top of the cooling tank is communicated with the water pumping end of the high-pressure water pump through a water pipe, the water pipe on the water outlet surface of the high-pressure water pump is communicated with the top of the cooling tank through a water return pipe, and the water outlet end of the high-pressure water pump is communicated with the inner cavity of the second water outlet through a water pipe.

As a further scheme of the invention: the stamping mechanism comprises a stamping structure, a flushing structure, a cleaning structure and a drawing structure; the stamping structure comprises a supporting column, a supporting table, a limiting table and a stamping table, wherein the top of the supporting column is fixedly connected with the bottom of the supporting table, the top of the supporting table is fixedly connected with the bottom of the limiting table, a stamping hole is formed in the surface of the limiting table, a through groove is formed in the inner cavity of the limiting table, a limiter is movably connected with the surface of the limiting table, one end of the limiter penetrates through the surface of the limiting table and extends to the inner cavity of the limiting table, a stamping column is fixedly connected with the bottom of the stamping table, the surface of the stamping column is movably connected with the inner cavity of the stamping hole, and the bottom of the stamping table is movably connected with the top of the limiting table.

As a further scheme of the invention: the flushing structure comprises a second water inlet, and the inner cavity of the second water inlet is communicated with the surface of the water outlet pipeline.

As a further scheme of the invention: the cleaning structure comprises cleaning hair, the top of the cleaning hair is fixedly connected with the top of the through groove inner cavity, and the bottom of the cleaning hair is in butt joint with the bottom of the through groove inner cavity.

As a further scheme of the invention: the drawing structure comprises a fixed sleeve and a lead plate, wherein the surface of the lead plate is fixedly connected with an inner cavity of the fixed sleeve through a screw, a handle is fixedly connected with the surface of the fixed sleeve, and the surface of the lead plate is movably connected with the inner cavity of the through groove.

As a further scheme of the invention: the support column is provided with a plurality of, and a plurality of the support column evenly distributed is in the bottom of brace table.

As a further scheme of the invention: the cleaning structure and the flushing structure are respectively arranged in the through groove inner cavities at the left side and the right side of the limiting table.

As a further scheme of the invention: the bottom of rose box inner chamber is provided with the filter screen, the surface swing joint of filter screen and grit layer, the surface of filter screen passes through iron wire fixed connection with the surface of first delivery port.

The invention also discloses a processing method of the processing die for the lead frame, which comprises the following steps:

step one, preparation before use: fixing a stamping mechanism, fixing a cooling mechanism at the left side of the stamping mechanism, fixing a waste recycling mechanism at the bottom of the stamping mechanism, communicating a second water outlet at the top of the cooling mechanism with a water outlet pipeline, communicating the other end of the water outlet pipeline with a second water inlet of the stamping mechanism, communicating a first water outlet at the left side bottom of the waste recycling mechanism with a water inlet pipeline, communicating the other end of the water inlet pipeline with the first water inlet at the bottom of the cooling mechanism, filling a reservoir of the cooling mechanism with water, starting a water pump, a semiconductor refrigerator and a high-pressure water pump, pumping water in the reservoir to a cooling tank through a water pipe, leading cold air produced in the semiconductor refrigerator to the cooling tank through a pipeline for water supply and cooling, and leading the water in the cooling tank to the second water outlet through the water outlet pipeline for flushing the flushing structure and then flushing the inner cavity of a through the water tank;

step two, starting to punch the lead frame: the method comprises the steps of fixing materials with an inner cavity of a fixing sleeve through screws, pushing the fixing sleeve into the inner cavity of a through groove through a handle fixedly connected with the surface of the fixing sleeve, pushing a limiter into the through groove to fix lead plate materials, pressing down a stamping table, pressing a stamping column towards the surface of the lead plate materials, punching waste punched by the lead plate materials to a waste recycling mechanism fixed at the bottom of a stamping mechanism through punching holes by water, opening a filter box of the waste recycling mechanism, sliding waste to a filter plate through the surface of the drainage plate, sliding the waste to a waste port at the right end of the filter plate, sliding the waste into the surfaces of a first blanking plate and a second blanking plate, pressing the waste to a push plate, pressing a supporting spring by the push plate, pushing a trigger switch by the supporting spring, electrifying an electromagnetic valve electrically connected with a wire through a switch, opening the electromagnetic valve, and sliding the waste from the surfaces of the first push plate and the second push plate to the bottom of the inner cavity of the recycling box;

step three, wastewater recovery: after filtering the wastewater through the filter plate, flowing to the sand layer of the filter box, filtering the sand layer again, flowing to the filter screen at the left bottom of the sand layer, flowing to the water inlet pipeline communicated with the water outlet through the first water outlet, flowing to the first water inlet communicated with the water inlet through the water inlet pipeline, and flowing to the reservoir through the pipeline communicated with the first water inlet, so that water is recycled.

Advantageous effects

The invention provides a processing die for a lead frame and a processing method thereof. Compared with the prior art, the method has the following beneficial effects:

1. the utility model provides a processing die for lead frame and processing method thereof, through including stamping mechanism, cooling body and waste recovery mechanism, waste recovery mechanism sets up in stamping mechanism's below, cooling body passes through inlet channel and waste recovery mechanism intercommunication, cooling body passes through outlet channel and stamping mechanism intercommunication, waste recovery mechanism includes filtration and recovery structure, filtration includes the rose box, the top fixedly connected with drainage plate of rose box inner chamber, the inner chamber fixedly connected with filter of rose box, the drainage plate sets up in the top of filter, the waste material mouth has been seted up on the right side of rose box, the sand stone layer has been laid to the bottom of rose box inner chamber, first delivery port has been seted up to the left bottom of rose box, through the mutually supporting of above-mentioned three mechanism, the recovery of waste material has been realized, like this can reduce operating personnel's injury probability, water cooling cyclic utilization system both can wash the blanking piece surface simultaneously, also can cool down fast, realize production quality's promotion.

2. The utility model provides a processing mold for lead frame and processing method thereof, including the cooling tank through cooling mechanism, the cistern, first base, cooling structure and second base, the top fixed connection of cooling tank's bottom and first base, first water inlet has been seted up on the surface of cooling tank, the inner chamber of first water inlet and the surface intercommunication of inlet channel, the inner chamber of first water inlet passes through the surface intercommunication of pipeline and cistern, the bottom of cistern and the bottom fixed connection of cooling tank inner chamber, through cooling system's cooling pressurization function, make the washing more complete, and the water after the cooling can carry out rapid cooling for the high temperature metal surface after the blanking, can reduce operating personnel and take out lead frame's time, improve production efficiency.

Drawings

FIG. 1 is a schematic diagram of an external structural connection of the present invention;

FIG. 2 is a schematic view of a stamping mechanism according to the present invention;

FIG. 3 is a schematic view of a cooling mechanism according to the present invention;

FIG. 4 is a schematic view of a recycling mechanism according to the present invention;

FIG. 5 is an enlarged view of a portion of the flushing structure of the present invention;

FIG. 6 is an enlarged view of a portion of a cleaning structure of the present invention;

FIG. 7 is a drawing illustrating a drawing structure according to the present invention

In the figure: 1. a punching mechanism; 2. a cooling mechanism; 3. a recovery mechanism; 4. a water outlet pipe; 5. a water inlet pipe; 11. stamping the structure; 12. a flushing structure; 13. a cleaning structure; 14. a drawing structure; 111. a support column; 112. a support table; 113. a limiting table; 114. a stamping table; 115. punching a hole; 116. a through groove; 117. a limiter; 118. stamping a column; 121. a second water inlet; 131. cleaning hair; 141. a fixed sleeve; 142. a lead plate; 143. a handle; 21. a cooling box; 22. a reservoir; 23. a first base; 24. a cooling structure; 25. a second base; 26. a first water inlet; 27. a water pump; 28. a support plate; 29. a second water outlet; 241. a cooling pool; 242. a semiconductor refrigerator; 243. a high pressure water pump; 244. a water return pipe; 31. a filtering structure; 32. a recovery structure; 311. a filter box; 312. a drainage plate; 313. a filter plate; 314. a waste port; 315. a first water outlet; 316. a sand layer; 317. a filter screen; 321. a recovery box; 322. a first blanking plate; 323. a second blanking plate; 324. a hinge; 325. a push plate; 326. a support spring; 327. triggering a switch; 328. an electromagnetic valve; 329. and (5) conducting wires.

Description of the embodiments

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

Referring to fig. 1-7, the present invention provides a technical solution: a processing mould for lead frames comprises a stamping mechanism 1, a cooling mechanism 2 and a waste recovery mechanism 3, wherein the waste recovery mechanism 3 is arranged below the stamping mechanism 1, the cooling mechanism 2 is communicated with the waste recovery mechanism 3 through a water inlet pipeline 5, the cooling mechanism 2 is communicated with the stamping mechanism 1 through a water outlet pipeline 4, the waste recovery mechanism 3 comprises a filtering structure 31 and a recovery structure 32, the filtering structure 31 comprises a filtering box 311, a drainage plate 312 is fixedly connected to the top of the inner cavity of the filtering box 311, a filtering plate 313 is fixedly connected to the inner cavity of the filtering box 311, the drainage plate 312 is arranged above the filtering plate 313, a waste port 314 is arranged on the right side of the filtering box 311, a sand stone layer 316 is paved at the bottom of the inner cavity of the filtering box 311, a first water outlet 315 is arranged at the bottom of the left side of the filtering box 311, the inner cavity of the first water outlet 315 is communicated with the surface of the water inlet pipeline 5, the recovery structure 32 is communicated with the filtering structure 31 through a waste port 314, the recovery structure 32 comprises a recovery box 321, the surface of the recovery box 321 is movably connected with the surface of the filtering box 311, the left side of the inner cavity of the recovery box 321 is fixedly connected with a first blanking plate 322, the right side of the inner cavity of the recovery box 321 is fixedly connected with a second blanking plate 323, the top of the second blanking plate 323 is rotatably connected with a push plate 325 through a hinge 324, the top of the push plate 325 is movably connected with the inner cavity of the recovery box 321, the right side of the push plate 325 is fixedly connected with a supporting spring 326, the right end of the supporting spring 326 is fixedly connected with a trigger switch 327, the trigger switch 327 is fixedly connected with the right side of the inner cavity of the recovery box 321, the right side of the first blanking plate 322 is fixedly connected with an electromagnetic valve 328, the right side of the electromagnetic valve 328 is fixedly connected with the left side of the second blanking plate 323, the surface of the trigger switch 327 is electrically connected with the surface of the electromagnetic valve 328 through a wire 329, the surface of the wire 329 penetrates through the surface of the recovery box 321 and extends to the inner cavity of the recovery box, the cooling mechanism 2 comprises a cooling box 21, a water storage tank 22, a first base 23, a cooling structure 24 and a second base 25, the bottom of the cooling box 21 is fixedly connected with the top of the first base 23, a first water inlet 26 is formed in the surface of the cooling box 21, the inner cavity of the first water inlet 26 is communicated with the surface of a water inlet pipeline 5, the inner cavity of the first water inlet 26 is communicated with the surface of the water storage tank 22 through a pipeline, the bottom of the water storage tank 22 is fixedly connected with the bottom of the inner cavity of the cooling box 21, the surface of the water storage tank 22 is communicated with a pumping end of a water pump 27 through a water pipe, the water outlet end of the water pump 27 is communicated with the cooling structure 24, the inner cavity of the cooling box 21 is fixedly connected with a supporting plate 28, the surface of the water pipe penetrates through the surface of the supporting plate 28 and extends to the top of the supporting plate, the top of the supporting plate 28 is fixedly connected with the bottom of the second base 25, the top of the cooling tank 21 is provided with a second water outlet 29, the inner cavity of the second water outlet 29 is communicated with a water outlet pipeline 4, a supporting plate 28 is arranged between the cooling structure 24 and a water suction pump, the cooling structure 24 comprises a cooling tank 241, a semiconductor refrigerator 242 and a high-pressure water pump 243, the bottoms of the cooling tank 241 and the semiconductor refrigerator 242 are fixedly connected with the top of the second base 25, the right side of the cooling tank 241 is communicated with the left side of the semiconductor refrigerator 242 through a water pipe, the top of the cooling tank 241 is communicated with the water suction end of the high-pressure water pump 243 through a water return pipe 244, the water outlet end of the high-pressure water pump 243 is communicated with the inner cavity of the second water outlet 29 through a water pipe, the stamping mechanism 1 comprises a stamping structure 11, a flushing structure 12, a cleaning structure 13 and a drawing structure 14, the stamping structure 11 comprises a support column 111, a support table 112, a limit table 113 and a stamping table 114, wherein the top of the support column 111 is fixedly connected with the bottom of the support table 112, the top of the support table 112 is fixedly connected with the bottom of the limit table 113, a stamping hole 115 is formed in the surface of the limit table 113, a through groove 116 is formed in the inner cavity of the limit table 113, a limiter 117 is movably connected to the surface of the limit table 113, one end of the limiter 117 penetrates through the surface of the limit table 113 and extends to the inner cavity of the limit table, a stamping column 118 is fixedly connected to the bottom of the stamping table 114, the surface of the stamping column 118 is movably connected with the inner cavity of the stamping hole 115, the bottom of the stamping table 114 is movably connected with the top of the limit table 113, the flushing structure 12 comprises a second water inlet 121, the inner cavity of the second water inlet 121 is communicated with the surface of the water outlet pipeline 4, the cleaning structure 13 comprises cleaning bristles 131, the top of cleaning hair 131 and the top fixed connection of logical groove 116 inner chamber, the bottom butt of cleaning hair 131 and the bottom in logical groove 116 inner chamber, pull structure 14 includes fixed cover 141 and lead plate 142, the surface of lead plate 142 passes through screw fixed connection with the inner chamber of fixed cover 141, the fixed surface of cover 141 is fixedly connected with handle 143, the surface of lead plate 142 and the inner chamber swing joint of logical groove 116, support column 111 is provided with a plurality ofly, a plurality of support columns 111 evenly distributed in the bottom of brace table 112, cleaning structure 13 and washing structure 12 set up respectively in the logical groove 116 inner chamber of limit table 113 left and right sides, the bottom in rose box 311 inner chamber is provided with filter screen 317, the surface of filter screen 317 and the surface swing joint of grit layer 316, the surface of filter screen 317 passes through iron wire fixed connection with the surface of first delivery port 315.

step one, preparation before use: fixing the stamping mechanism 1, fixing the cooling mechanism 2 at the left side of the stamping mechanism 1, fixing the waste recycling mechanism 3 at the bottom of the stamping mechanism 1, communicating a second water outlet 29 at the top of the cooling mechanism 2 with a water outlet pipeline 4, communicating the other end of the water outlet pipeline 4 with a second water inlet 121 of the stamping mechanism 1, communicating a first water outlet 315 at the left side bottom of the waste recycling mechanism 3 with a water inlet pipeline 5, communicating the other end of the water inlet pipeline 5 with a first water inlet 26 at the bottom of the cooling mechanism 2, filling a reservoir 22 of the cooling mechanism 2 with water, opening a water pump 27, a semiconductor refrigerator 242 and a high-pressure water pump 243, pumping water in the reservoir 22 to a cooling tank 21 through a water pipe, leading cold air produced in the semiconductor refrigerator 242 to the cooling tank 21 through a pipeline to cool water, pumping water in the cooling tank 21 to the second water outlet 29, flushing the water outlet pipeline 4 to the flushing structure 12, and then flushing the water to the inner cavity of the through tank 116;

step two, starting to punch the lead frame: fixing the materials with the inner cavity of the fixing sleeve 141 through screws, pushing the fixing sleeve 141 into the inner cavity of the through groove 116 through a handle 143 fixedly connected with the surface of the fixing sleeve 141, pushing the limiter 117 into the through groove 116 to fix the materials of the lead plate 142, pressing down the punching table 114, pressing the punching column 118 towards the surface of the materials of the lead plate 142, punching the punched waste materials of the lead plate 142 to the waste recycling mechanism 3 fixed at the bottom of the punching mechanism 1 through the punching hole 115 by water, opening the filter box 311 of the waste recycling mechanism 3, sliding the waste materials to the filter plate 313 through the surface of the drainage plate 312, sliding the waste materials to a waste material port 314 at the right end of the filter plate 313, sliding the waste materials into the surfaces of the first blanking plate 322 and the second blanking plate 323, pressing the waste materials to the push plate 325, pressing the supporting spring 326, pushing the trigger switch 327 through the supporting spring 326, electrifying the electromagnetic valve 328 electrically connected with the switch 329, opening the electromagnetic valve 328, and sliding the waste materials from the surfaces of the first push plate 325 and the second push plate 325 to the bottom of the inner cavity of the recycling box 321;

step three, wastewater recovery: the wastewater flows to the sand layer 316 of the filter box 311 after being filtered by the filter plate 313, the sand layer 316 is filtered again, the water flows to the filter screen 317 at the left bottom of the sand layer 316, the water flows to the water inlet pipeline 5 communicated with the water outlet pipeline 315, the water flows to the first water inlet 26 communicated with the water inlet pipeline 5, and the water flows to the reservoir 22 through the pipeline communicated with the first water inlet 26, so that the water is recycled.

In the description of the present invention, it should be understood that the terms "upper," "lower," "left," "right," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and for simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, as well as a specific orientation configuration and operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

The foregoing describes one embodiment of the present invention in detail, but the description is only a preferred embodiment of the present invention and should not be construed as limiting the scope of the invention. All equivalent changes and modifications within the scope of the present invention are intended to be covered by the present invention.

Claims

1. The utility model provides a mold processing for lead frame, includes stamping mechanism (1), cooling mechanism (2) and waste recovery mechanism (3), its characterized in that: the waste recycling mechanism (3) is arranged below the stamping mechanism (1), the cooling mechanism (2) is communicated with the waste recycling mechanism (3) through a water inlet pipeline (5), the cooling mechanism (2) is communicated with the stamping mechanism (1) through a water outlet pipeline (4), and the waste recycling mechanism (3) comprises a filtering structure (31) and a recycling structure (32);

the filtering structure (31) comprises a filtering box (311), a drainage plate (312) is fixedly connected to the top of the inner cavity of the filtering box (311), a filtering plate (313) is fixedly connected to the inner cavity of the filtering box (311), the drainage plate (312) is arranged above the filtering plate (313), a waste material port (314) is formed in the right side of the filtering box (311), a sand stone layer (316) is paved at the bottom of the inner cavity of the filtering box (311), a first water outlet (315) is formed in the left bottom of the filtering box (311), and the inner cavity of the first water outlet (315) is communicated with the surface of a water inlet pipeline (5);

the recovery structure (32) is communicated with the filtering structure (31) through a waste port (314), the recovery structure (32) comprises a recovery box (321), the surface of the recovery box (321) is movably connected with the surface of the filtering box (311), a first blanking plate (322) is fixedly connected to the left side of the inner cavity of the recovery box (321), a second blanking plate (323) is fixedly connected to the right side of the inner cavity of the recovery box (321), a push plate (325) is rotatably connected to the top of the second blanking plate (323) through a hinge (324), the top of the push plate (325) is movably connected with the inner cavity of the recovery box (321), a supporting spring (326) is fixedly connected to the right side of the push plate (325), a trigger switch (327) is fixedly connected to the right side of the inner cavity of the recovery box (321), an electromagnetic valve (328) is fixedly connected to the right side of the first blanking plate (322), the right side of the electromagnetic valve (328) is fixedly connected to the left side of the second blanking plate (323), and the guide wire (329) extends to the surface of the guide wire (329) through the surface of the guide wire (329);

the cooling mechanism (2) comprises a cooling box (21), a water reservoir (22), a first base (23), a cooling structure (24) and a second base (25);

the bottom of the cooling box (21) is fixedly connected with the top of the first base (23), a first water inlet (26) is formed in the surface of the cooling box (21), the inner cavity of the first water inlet (26) is communicated with the surface of a water inlet pipe (5), the inner cavity of the first water inlet (26) is communicated with the surface of a water storage tank (22) through a pipeline, the bottom of the water storage tank (22) is fixedly connected with the bottom of the inner cavity of the cooling box (21), the surface of the water storage tank (22) is communicated with the water pumping end of a water pump (27) through a water pipe, the water outlet end of the water pump (27) is communicated with a cooling structure (24) through a water pipe, a supporting plate (28) is fixedly connected to the inner cavity of the cooling box (21), the surface of the water pipe penetrates through the surface of the supporting plate (28) and extends to the top of the supporting plate, a second water outlet (29) is formed in the top of the cooling box (21), the inner cavity of the second water outlet (29) is communicated with a water outlet pipe (4), and the supporting plate (28) is arranged between the cooling structure (24) and the water pump.

The cooling structure (24) comprises a cooling tank (241), a semiconductor refrigerator (242) and a high-pressure water pump (243), wherein the right side of the cooling tank (241) is communicated with the left side of the semiconductor refrigerator (242) through a water pipe, the top of the cooling tank (241) is communicated with the water pumping end of the high-pressure water pump (243) through a water pipe, the water pipe on the water outlet surface of the high-pressure water pump (243) is communicated with the top of the cooling tank (241) through a water return pipe (244), and the water outlet end of the high-pressure water pump (243) is communicated with the inner cavity of the second water outlet (29) through a water pipe.

2. The processing die for a lead frame according to claim 1, wherein: the stamping mechanism (1) comprises a stamping structure (11), a flushing structure (12), a cleaning structure (13) and a drawing structure (14);

stamping structure (11) include support column (111), brace table (112), spacing platform (113) and punching press platform (114), the top of brace column (111) and the bottom fixed connection of brace table (112), the top of brace table (112) and the bottom fixed connection of spacing platform (113), punching press hole (115) have been seted up to the surface of spacing platform (113), logical groove (116) have been seted up to the inner chamber of spacing platform (113), the surface swing joint of spacing platform (113) has stopper (117), the one end of stopper (117) runs through the surface of spacing platform (113) and extends to its inner chamber, the bottom fixedly connected with punching press post (118) of punching press platform (114), the surface of punching press post (118) and the inner chamber swing joint of punching press hole (115), the bottom of punching press platform (114) and the top swing joint of spacing platform (113).

3. A processing die for a lead frame according to claim 2, wherein: the flushing structure (12) comprises a second water inlet (121), and the inner cavity of the second water inlet (121) is communicated with the surface of the water outlet pipeline (4).

4. A processing die for a lead frame according to claim 2, wherein: the cleaning structure (13) comprises cleaning hair (131), the top of the cleaning hair (131) is fixedly connected with the top of the inner cavity of the through groove (116), and the bottom of the cleaning hair (131) is abutted with the bottom of the inner cavity of the through groove (116).

5. A processing die for a lead frame according to claim 2, wherein: the drawing structure (14) comprises a fixed sleeve (141) and a lead plate (142), wherein the surface of the lead plate (142) is fixedly connected with the inner cavity of the fixed sleeve (141) through a screw, the surface of the fixed sleeve (141) is fixedly connected with a handle (143), and the surface of the lead plate (142) is movably connected with the inner cavity of the through groove (116).

6. A processing die for a lead frame according to claim 2, wherein: the support columns (111) are arranged in a plurality, and the support columns (111) are uniformly distributed at the bottom of the support table (112).

7. A processing die for a lead frame according to claim 2, wherein: the cleaning structure (13) and the flushing structure (12) are respectively arranged in the inner cavities of through grooves (116) at the left side and the right side of the limiting table (113).

8. The processing die for a lead frame according to claim 1, wherein: the bottom of rose box (311) inner chamber is provided with filter screen (317), the surface swing joint of surface and grit layer (316) of filter screen (317), the surface of filter screen (317) passes through iron wire fixed connection with the surface of first delivery port (315).

9. A method of processing the processing die for a lead frame according to claim 1, characterized in that: the method comprises the following steps:

step one, preparation before use: fixing a stamping mechanism (1), fixing a cooling mechanism (2) at the left side of the stamping mechanism (1), fixing a waste recycling mechanism (3) at the bottom of the stamping mechanism (1), communicating a second water outlet (29) at the top of the cooling mechanism (2) with a water outlet pipeline (4), communicating the other end of the water outlet pipeline (4) with a second water inlet (121) of the stamping mechanism (1), communicating a first water outlet (315) at the bottom of the left side of the waste recycling mechanism (3) with a water inlet pipeline (5), communicating the other end of the water inlet pipeline (5) with a first water inlet (26) at the bottom of the cooling mechanism (2), filling a water reservoir (22) of the cooling mechanism (2) with water, pumping water in the water reservoir (22) to a cooling box (21) through a water pipe, pumping cold air produced in the semiconductor refrigerator (242) to the cooling box (21) through a pipeline, cooling the water in the cooling box (21) through the water inlet pipeline, flushing water in the cooling box (21) to the water outlet (29) through the water pump (243), and flushing water in the cooling box (4) to the water outlet (12) through the water outlet pipeline (243);

step two, starting to punch the lead frame: fixing the material with the inner cavity of the fixing sleeve (141) through a screw, pushing the fixing sleeve (141) into the inner cavity of the through groove (116) through a handle (143) fixedly connected with the surface of the fixing sleeve, pushing the limiter (117) into the inner cavity of the through groove (116) to fix the material of the lead plate (142), pressing down the punching table (114), pressing the punching column (118) towards the surface of the material of the lead plate (142), punching the punched waste of the material of the lead plate (142) to the waste recovery mechanism (3) fixed at the bottom of the punching mechanism (1) through a punching hole (115) through water, opening a filter box (311) of the waste recovery mechanism (3), sliding the waste to a filter plate (313) through the surface of a drainage plate (312), sliding the waste to a waste port (314) at the right end of the filter plate (313), sliding into the surfaces of the first blanking plate (322) and the second blanking plate (323), pressing the waste to the push plate (325), pressing the push plate (325) to a supporting spring (326), pushing a trigger switch (327), and switching on the electromagnetic valve (328) to be electrically connected through a wire (328), and opening the electromagnetic valve (328) to the bottom of the first electromagnetic valve (325) and the second electromagnetic valve (325);

step three, wastewater recovery: the waste water flows to the sand layer (316) of the filter box (311) after being filtered by the filter plate (313), after being filtered again by the sand layer (316), the water flows to the filter screen (317) at the left bottom of the sand layer (316), the water flows to the water inlet pipeline (5) communicated with the water outlet pipeline (315), the water flows to the first water inlet (26) communicated with the water inlet pipeline (5), and the water flows to the reservoir (22) through the pipeline communicated with the first water inlet (26), so that water recycling treatment and utilization are performed.