CN112872144A - Machining die for lead frame and machining method of machining die - Google Patents
Machining die for lead frame and machining method of machining die Download PDFInfo
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- CN112872144A CN112872144A CN202011564099.XA CN202011564099A CN112872144A CN 112872144 A CN112872144 A CN 112872144A CN 202011564099 A CN202011564099 A CN 202011564099A CN 112872144 A CN112872144 A CN 112872144A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
- B21D22/02—Stamping using rigid devices or tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/16—Heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D43/00—Feeding, positioning or storing devices combined with, or arranged in, or specially adapted for use in connection with, apparatus for working or processing sheet metal, metal tubes or metal profiles; Associations therewith of cutting devices
- B21D43/20—Storage arrangements; Piling or unpiling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a processing die for a lead frame and a processing method thereof, and the processing die comprises a stamping mechanism, a cooling mechanism and a waste recycling mechanism, wherein the waste recycling mechanism is arranged below the stamping mechanism, the cooling mechanism is communicated with the waste recycling mechanism through a water inlet pipeline, the cooling mechanism is communicated with the stamping mechanism through a water outlet pipeline, the waste recycling mechanism comprises a filtering structure and a recycling structure, the filtering structure comprises a filtering box, the top of the inner cavity of the filtering box is fixedly connected with a drainage plate, the inner cavity of the filtering box is fixedly connected with a filtering plate, the drainage plate is arranged above the filtering plate, the right side of the filtering box is provided with a waste opening, and the bottom of the inner cavity of the filtering box is paved with a sandstone layer. According to the processing die for the lead frame and the processing method thereof, the punched residues can be timely processed, and the water for washing the surface of the lead frame can be continuously practical after being recycled and cooled by the recycling mechanism, so that the operation safety is improved, and the resource waste is reduced.
Description
Technical Field
The invention relates to the technical field of dies, in particular to a processing die for a lead frame and a processing method thereof.
Background
With the development and progress of science and technology, the requirements of people for things are changed from old thinking that people can use things as things to be quite fine and smooth, and only with the continuous progress or innovation conception, a new form is generated to improve the added value of the product, so that people can live under the test of intense market competition. The semiconductor lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to use the lead frame in most semiconductor integrated blocks, and is an important basic material in the electronic information industry. At present, a lead frame is generally formed by arranging a plurality of identical copper-based units, each copper-based unit comprises a radiating fin, a carrier sheet, an inner lead and an outer lead which are sequentially connected into a whole, the carrier sheet is used for bearing a chip of an electronic component, the chip is packaged on the carrier sheet after being packaged by a plastic packaging component, stamping is a method for manufacturing the lead frame, and a blanking die is an important component.
The existing lead frame processing die has a surface flushing function after punching of a lead frame, but residues on the surface of the lead frame are directly flushed to the ground, and are relatively sharp, so that mistaken stepping is easily caused, and workers are easily injured.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a processing die for a lead frame and a processing method thereof, which solve the problems that residues on the surface of the lead frame are directly flushed to the ground, but the residues are sharp, so that mistaken stepping is easily caused, and workers are easily injured.
In order to achieve the purpose, the invention is realized by the following technical scheme: a processing die for a lead frame comprises a stamping mechanism, a cooling mechanism and a waste recovery mechanism, wherein the waste recovery mechanism is arranged below the stamping mechanism and is communicated with the waste recovery mechanism through a water inlet pipeline; the filter structure comprises a filter box, the top of the inner cavity of the filter box is fixedly connected with a drainage plate, the inner cavity of the filter box is fixedly connected with a filter plate, the drainage plate is arranged above the filter plate, the right side of the filter box is provided with a waste material port, the bottom of the inner cavity of the filter box is paved with a sandstone layer, the bottom of the left side of the filter box is provided with a first water outlet, and the inner cavity of the first water outlet is communicated with the surface of a water inlet pipeline; the recovery structure is communicated with the filtering structure through a waste material port, the recovery structure comprises a recovery box, the surface of the recovery box is movably connected with the surface of the filter box, the left side of the inner cavity of the recovery box is fixedly connected with a first blanking plate, a second blanking plate is fixedly connected to the right side of the inner cavity of the recovery box, the top of the second blanking plate is rotatably connected with a push plate through a hinge, the top of the push plate is movably connected with the inner cavity of the recycling box, the right side of the push plate is fixedly connected with a supporting spring, the right end of the supporting spring is fixedly connected with a trigger switch which is fixedly connected with the right side of the inner cavity of the recycling bin, the right side of the first blanking plate is fixedly connected with an electromagnetic valve, the right side of the electromagnetic valve is fixedly connected with the left side of the second blanking plate, the surface of the trigger switch is electrically connected with the surface of the electromagnetic valve through a lead, and the surface of the lead penetrates through the surface of the recycling box and extends to the inner cavity of the recycling box.
As a further scheme of the invention: the cooling mechanism comprises a cooling tank, a reservoir, a first base, a cooling structure and a second base; the bottom of the cooling box is fixedly connected with the top of the first base, a first water inlet is arranged on the surface of the cooling box, the inner cavity of the first water inlet is communicated with the surface of the water inlet pipeline, the inner cavity of the first water inlet is communicated with the surface of the reservoir through a pipeline, the bottom of the reservoir is fixedly connected with the bottom of the inner cavity of the cooling box, the surface of the reservoir is communicated with the water pumping end of the water pump through a water pipe, the water outlet end of the water pump is communicated with the cooling structure through a water pipe, the inner cavity of the cooling box is fixedly connected with a supporting plate, the surface of the water pipe penetrates through the surface of the support plate and extends to the top of the support plate, the top of the support plate is fixedly connected with the bottom of the second base, a second water outlet is formed in the top of the cooling box, an inner cavity of the second water outlet is communicated with a water outlet pipeline, and the supporting plate is arranged between the cooling structure and the water suction pump; the cooling structure comprises a cooling pool, a semiconductor refrigerator and a high-pressure water pump, the bottoms of the cooling pool and the semiconductor refrigerator are fixedly connected with the top of the second base, the right side of the cooling pool is communicated with the left side of the semiconductor refrigerator through a water pipe, the top of the cooling pool is communicated with the water pumping end of the high-pressure water pump through a water pipe, the water pipe on the surface of a water outlet of the high-pressure water pump is communicated with the top of the cooling pool through a water return pipe, and the water outlet end of the high-pressure water pump is communicated with the inner cavity of the second water outlet through a water pipe.
As a further scheme of the invention: the stamping mechanism comprises a stamping structure, a flushing structure, a cleaning structure and a drawing structure; the stamping structure includes support column, brace table, spacing platform and punching press platform, the top of support column and the bottom fixed connection of brace table, the top of brace table and the bottom fixed connection of spacing platform, the punching press hole has been seted up on the surface of spacing platform, logical groove has been seted up to the inner chamber of spacing platform, the surperficial swing joint of spacing platform has the stopper, the one end of stopper runs through the surface of spacing platform and extends to its inner chamber, the bottom fixedly connected with punching press post of punching press platform, the surface of punching press post and the inner chamber swing joint in punching press hole, the bottom of punching press platform and the top swing joint of spacing platform.
As a further scheme of the invention: the flushing structure comprises a second water inlet, and an inner cavity of the second water inlet is communicated with the surface of the water outlet pipeline.
As a further scheme of the invention: the cleaning structure comprises cleaning bristles, the tops of the cleaning bristles are fixedly connected with the tops of the through groove inner cavities, and the bottom ends of the cleaning bristles are abutted to the bottoms of the through groove inner cavities.
As a further scheme of the invention: the drawing structure comprises a fixing sleeve and a lead plate, the surface of the lead plate is fixedly connected with the inner cavity of the fixing sleeve through screws, the surface of the fixing sleeve is fixedly connected with a handle, and the surface of the lead plate is movably connected with the inner cavity of the through groove.
As a further scheme of the invention: the support column is provided with a plurality ofly, and is a plurality of the support column is at the bottom evenly distributed of brace table.
As a further scheme of the invention: the cleaning structure and the flushing structure are respectively arranged in the inner cavities of the through grooves at the left side and the right side of the limiting table.
As a further scheme of the invention: the bottom of rose box inner chamber is provided with the filter screen, the surface of filter screen and the surperficial swing joint on grit layer, iron wire fixed connection is passed through on the surface of surface and the first delivery port of filter screen.
The invention also discloses a processing method of the processing die for the lead frame, which comprises the following steps:
step one, preparation before use: fixing a punching mechanism, fixing a cooling mechanism at the left side position of the punching mechanism, fixing a waste recovery mechanism at the bottom of the punching mechanism, communicating a second water outlet at the top of the cooling mechanism with a water outlet pipeline, communicating the other end of the water outlet pipeline with a second water inlet of the punching mechanism, communicating a first water outlet at the left side bottom of the waste recovery mechanism with a water inlet pipeline, communicating the other end of the water inlet pipeline with a first water inlet at the bottom of the cooling mechanism, filling a reservoir of the cooling mechanism with water, and filling a water pump, the semiconductor refrigerator and the high-pressure water pump are both started, the water pump pumps water in the reservoir to the cooling tank through a water pipe, cold air produced in the semiconductor refrigerator is led to the cooling tank through a pipeline for water supply and temperature reduction, and the high-pressure water pump pumps water in the cooling tank to a second water outlet and then to a flushing structure through a water inlet pipeline and then to an inner cavity of the through groove;
step two, starting to punch the lead frame: the method comprises the following steps of fixing materials with an inner cavity of a fixing sleeve through screws, pushing the fixing sleeve into the inner cavity of a through groove through a handle fixedly connected with the surface of the fixing sleeve, pushing a limiting stopper into the through groove to fix a lead plate material, pressing down a stamping table, pressing a stamping column to the surface of the lead plate material, flushing stamped waste materials of the lead plate material to a waste material recovery mechanism fixed at the bottom of the stamping mechanism through stamping holes by water, opening a filter box of the waste material recovery mechanism, sliding the waste materials to a filter plate through the surface of a drainage plate, sliding the waste materials to a waste material port at the right end of the filter plate, then sliding the waste materials into the surfaces of a first blanking plate and a second blanking plate, pressing the waste materials to a push plate, pressing a supporting spring by the push plate, pushing a trigger switch to energize an electromagnetic valve electrically connected through a lead, opening the electromagnetic valve, and sliding the waste materials from;
step three, wastewater recovery: the waste water is filtered by the filter plate and then flows to the sand layer of the filter box, after the sand layer is filtered again, the water flows to the filter screen at the bottom of the left side of the sand layer, the water flows to the water inlet pipeline communicated with the water inlet pipeline through the first water outlet, the water flows to the first water inlet communicated with the water inlet pipeline through the water inlet pipeline, and the water flows into the reservoir through the pipeline communicated with the first water inlet, so that the water is recycled.
Advantageous effects
The invention provides a processing die for a lead frame and a processing method thereof. Compared with the prior art, the method has the following beneficial effects:
1. a processing die for lead frame and a processing method thereof, the processing die comprises a stamping mechanism, a cooling mechanism and a waste recovery mechanism, the waste recovery mechanism is arranged below the stamping mechanism, the cooling mechanism is communicated with the waste recovery mechanism through a water inlet pipeline, the cooling mechanism is communicated with the stamping mechanism through a water outlet pipeline, the waste recovery mechanism comprises a filtering structure and a recovery structure, the filtering structure comprises a filtering box, the top of the inner cavity of the filtering box is fixedly connected with a drainage plate, the inner cavity of the filtering box is fixedly connected with a filtering plate, the drainage plate is arranged above the filtering plate, the right side of the filtering box is provided with a waste port, the bottom of the inner cavity of the filtering box is laid with a sandstone layer, the left bottom of the filtering box is provided with a first water outlet, the recovery of waste is realized through the mutual cooperation of the three mechanisms, thus, the injury probability of operators can be reduced, and simultaneously, the surface of the blanking part can be rapidly cooled, and the production quality is improved.
2. The utility model provides a mold processing for lead frame and manufacturing method thereof, include the cooler bin through cooling body, the cistern, first base, cooling structure and second base, the bottom of cooler bin and the top fixed connection of first base, first water inlet has been seted up on the surface of cooler bin, the inner chamber of first water inlet and the surface intercommunication of inlet channel, the inner chamber of first water inlet passes through the surface intercommunication of pipeline with the cistern, the bottom of cistern and the bottom fixed connection of cooler bin inner chamber, cooling pressurization function through cooling system, make to wash more complete, and the water after the cooling can carry out rapid cooling for the high temperature metal face after the blanking, can reduce the time that operating personnel took out the lead frame, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic view of the external structural connection of the present invention;
FIG. 2 is a schematic structural diagram of a punching mechanism according to the present invention;
FIG. 3 is a schematic view of the cooling mechanism of the present invention;
FIG. 4 is a schematic view of the recycling mechanism of the present invention;
FIG. 5 is an enlarged view of a portion of the irrigation structure of the present invention;
FIG. 6 is an enlarged view of a portion of the cleaning structure of the present invention;
FIG. 7 is a drawing structure of the present invention
In the figure: 1. a stamping mechanism; 2. a cooling mechanism; 3. a recovery mechanism; 4. a water inlet pipe; 5. a water outlet pipeline; 11. stamping a structure; 12. flushing the structure; 13. cleaning the structure; 14. a pull structure; 111. a support pillar; 112. a support table; 113. a limiting table; 114. a punching stage; 115. punching a hole; 116. a through groove; 117. a stopper; 118. punching the column; 121. a second water inlet; 131. cleaning the hair; 141. fixing a sleeve; 142. a lead plate; 143. a handle; 21. a cooling tank; 22. a reservoir; 23. a first base; 24. a cooling structure; 25. a second base; 26. a first water inlet; 27. a water pump; 28. a support plate; 29. a second water outlet; 241. a cooling pool; 242. a semiconductor refrigerator; 243. a high pressure water pump; 244. a water return pipe; 31. a filter structure; 32. a recovery structure; 311. a filter box; 312. draining a plate; 313. a filter plate; 314. a waste material port; 315. a first water outlet; 316. a sandstone layer; 317. a filter screen; 321. a recycling bin; 322. a first blanking plate; 323. a second blanking plate; 324. a hinge; 325. pushing the plate; 326. a support spring; 327. a trigger switch; 328. an electromagnetic valve; 329. and (4) conducting wires.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a technical solution: a processing die for a lead frame comprises a stamping mechanism 1, a cooling mechanism 2 and a waste recovery mechanism 3, wherein the waste recovery mechanism 3 is arranged below the stamping mechanism 1, the cooling mechanism 2 is communicated with the waste recovery mechanism 3 through a water inlet pipeline 4, the cooling mechanism 2 is communicated with the stamping mechanism 1 through a water outlet pipeline 5, the waste recovery mechanism 3 comprises a filtering structure 31 and a recovery structure 32, the filtering structure 31 comprises a filtering box 311, the top of the inner cavity of the filtering box 311 is fixedly connected with a drainage plate 312, the inner cavity of the filtering box 311 is fixedly connected with a filtering plate 313, the drainage plate 312 is arranged above the filtering plate 313, a waste port 314 is arranged on the right side of the filtering box 311, a sandstone layer 316 is laid at the bottom of the inner cavity of the filtering box 311, a first water outlet 315 is arranged at the left bottom of the filtering box 311, the inner cavity of the first water outlet 315 is communicated with the surface of the water inlet pipeline 4, the recycling structure 32 comprises a recycling box 321, the surface of the recycling box 321 is movably connected with the surface of the filtering box 311, the left side of the cavity of the recycling box 321 is fixedly connected with a first blanking plate 322, the right side of the cavity of the recycling box 321 is fixedly connected with a second blanking plate 323, the top of the second blanking plate 323 is rotatably connected with a push plate 325 through a hinge 324, the top of the push plate 325 is movably connected with the cavity of the recycling box 321, the right side of the push plate 325 is fixedly connected with a supporting spring 326, the right end of the supporting spring 326 is fixedly connected with a trigger switch 327, the trigger switch 327 is fixedly connected with the right side of the cavity of the recycling box 321, the right side of the first blanking plate 322 is fixedly connected with an electromagnetic valve 328, the right side of the electromagnetic valve 328 is fixedly connected with the left side of the second blanking plate 323, the surface of the trigger switch 327 is electrically connected with the surface of the electromagnetic valve, the cooling mechanism 2 comprises a cooling box 21, a water storage tank 22, a first base 23, a cooling structure 24 and a second base 25, the bottom of the cooling box 21 is fixedly connected with the top of the first base 23, a first water inlet 26 is formed in the surface of the cooling box 21, the inner cavity of the first water inlet 26 is communicated with the surface of the water inlet pipeline 4, the inner cavity of the first water inlet 26 is communicated with the surface of the water storage tank 22 through a pipeline, the bottom of the water storage tank 22 is fixedly connected with the bottom of the inner cavity of the cooling box 21, the surface of the water storage tank 22 is communicated with the water pumping end of a water pump 27 through a water pipe, the water outlet end of the water pump 27 is communicated with the cooling structure 24 through a water pipe, the inner cavity of the cooling box 21 is fixedly connected with a support plate 28, the surface of the water pipe penetrates through the surface of the support plate 28 and extends to the top of the support plate, the top, the inner cavity of the second water outlet 29 is communicated with a water outlet pipe 5, the support plate 28 is arranged between the cooling structure 24 and the water suction pump, the cooling structure 24 comprises a cooling pool 241, a semiconductor refrigerator 242 and a high-pressure water pump 243, the bottoms of the cooling pool 241 and the semiconductor refrigerator 242 are fixedly connected with the top of the second base 25, the right side of the cooling pool 241 is communicated with the left side of the semiconductor refrigerator 242 through a water pipe, the top of the cooling pool 241 is communicated with the water suction end of the high-pressure water pump 243 through a water pipe, the water pipe on the surface of the water outlet of the high-pressure water pump 243 is communicated with the top of the cooling pool 241 through a water return pipe 244, the water outlet end of the high-pressure water pump 243 is communicated with the inner cavity of the second water outlet 29 through a water pipe, the stamping mechanism 1 comprises a stamping structure 11, a washing structure 12, a cleaning structure 13 and, the top of the supporting column 111 is fixedly connected with the bottom of the supporting table 112, the top of the supporting table 112 is fixedly connected with the bottom of the limiting table 113, the surface of the limiting table 113 is provided with a stamping hole 115, the inner cavity of the limiting table 113 is provided with a through groove 116, the surface of the limiting table 113 is movably connected with a limiter 117, one end of the limiter 117 penetrates through the surface of the limiting table 113 and extends to the inner cavity thereof, the bottom of the stamping table 114 is fixedly connected with a stamping column 118, the surface of the stamping column 118 is movably connected with the inner cavity of the stamping hole 115, the bottom of the stamping table 114 is movably connected with the top of the limiting table 113, the flushing structure 12 comprises a second water inlet 121, the inner cavity of the second water inlet 121 is communicated with the surface of the water outlet pipe 5, the cleaning structure 13 comprises cleaning bristles 131, the top of the cleaning bristles 131 is fixedly connected with the top of the inner cavity of the through groove 116, the bottom end of the cleaning, screw fixed connection is passed through to the surface of lead plate 142 and the inner chamber of fixed cover 141, the fixed surface of fixed cover 141 is connected with handle 143, the surface of lead plate 142 and the inner chamber swing joint who leads to groove 116, support column 111 is provided with a plurality ofly, a plurality of support columns 111 are in the bottom evenly distributed of brace table 112, clean structure 13 sets up the logical groove 116 inner chamber in spacing 113 left and right sides respectively with washing structure 12, the bottom in rose box 311 inner chamber is provided with filter screen 317, the surface of filter screen 317 and the surface swing joint of grit layer 316, iron wire fixed connection is passed through on the surface of filter screen 317 and the surface of first delivery port 315.
The invention also discloses a processing method of the processing die for the lead frame, which comprises the following steps:
step one, preparation before use: fixing a stamping mechanism 1, fixing a cooling mechanism 2 at the left side position of the stamping mechanism 1, fixing a waste recovery mechanism 3 at the bottom of the stamping mechanism 1, communicating a second water outlet 29 at the top of the cooling mechanism 2 with a water outlet pipeline 5, communicating the other end of the water outlet pipeline 5 with a second water inlet 121 of the stamping mechanism 1, communicating a first water outlet 315 at the left bottom of the waste recovery mechanism 3 with a water inlet pipeline 4, communicating the other end of the water inlet pipeline 4 with a first water inlet 26 at the bottom of the cooling mechanism 2, filling water into a reservoir 22 of the cooling mechanism 2, starting a water pump 27, a semiconductor refrigerator 242 and a high-pressure water pump 243, pumping water in the reservoir 22 to the cooling tank 21 by the water pump 27 through a water pipe, feeding water to cool the cooling tank 21 by cold air produced in the semiconductor refrigerator 242 through a pipeline, pumping water in the cooling tank 21 to the second water outlet 29 by the high-pressure water pump 243, towards the flushing structure 12 through the water inlet pipe 4 and then towards the inner cavity of the through groove 116;
step two, starting to punch the lead frame: the material is fixed with the inner cavity of the fixed sleeve 141 through screws, the fixed sleeve 141 is pushed into the inner cavity of the through groove 116 through the pull handle 143 fixedly connected with the surface of the fixed sleeve 141, the limiter 117 is pushed into the through groove 116 to fix the material of the lead plate 142, the punching table 114 is pressed down to press the punching column 118 to the surface of the material of the lead plate 142, the waste material punched by the material of the lead plate 142 is flushed to the waste material recovery mechanism 3 fixed at the bottom of the punching mechanism 1 by water through the punching hole 115, the filter box 311 of the waste material recovery mechanism 3 is opened, the waste material slides to the filter plate 313 through the surface of the drainage plate 312, the waste material slides to the waste material port 314 at the right end of the filter plate 313 and then slides to the surfaces of the first blanking plate 322 and the second blanking plate 323, the waste material presses to the push plate 325, the push plate 325 presses the support spring 326, the support spring 326 pushes the, the waste material slides from the surfaces of the first push plate 325 and the second push plate 325 to the bottom of the inner cavity of the recovery box 321;
step three, wastewater recovery: the waste water is filtered by the filter plate 313 and then flows to the sandstone layer 316 of the filter tank 311, the sandstone layer 316 is filtered again, the water flows to the filter screen 317 at the bottom of the left side of the sandstone layer 316, the water flows to the water inlet pipeline 4 communicated with the water inlet pipeline through the first water outlet 315, the water flows to the first water inlet 26 communicated with the water inlet pipeline 4 through the water inlet pipeline 4, and the water flows into the reservoir 22 through the pipeline communicated with the first water inlet 26, so that the water is recycled.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate member, or they may be connected through two or more elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. The utility model provides a mold processing for lead frame, includes punching press mechanism (1), cooling body (2) and waste recovery mechanism (3), its characterized in that: the waste recovery mechanism (3) is arranged below the stamping mechanism (1), the cooling mechanism (2) is communicated with the waste recovery mechanism (3) through a water inlet pipeline (4), the cooling mechanism (2) is communicated with the stamping mechanism (1) through a water outlet pipeline (5), and the waste recovery mechanism (3) comprises a filtering structure (31) and a recovery structure (32);
the filtering structure (31) comprises a filtering box (311), the top of an inner cavity of the filtering box (311) is fixedly connected with a drainage plate (312), the inner cavity of the filtering box (311) is fixedly connected with a filtering plate (313), the drainage plate (312) is arranged above the filtering plate (313), a waste port (314) is formed in the right side of the filtering box (311), a sandstone layer (316) is laid at the bottom of the inner cavity of the filtering box (311), a first water outlet (315) is formed in the bottom of the left side of the filtering box (311), and the inner cavity of the first water outlet (315) is communicated with the surface of a water inlet pipeline (4);
the recycling structure (32) is communicated with the filtering structure (31) through a waste port (314), the recycling structure (32) comprises a recycling box (321), the surface of the recycling box (321) is movably connected with the surface of the filtering box (311), the left side of the inner cavity of the recycling box (321) is fixedly connected with a first blanking plate (322), the right side of the inner cavity of the recycling box (321) is fixedly connected with a second blanking plate (323), the top of the second blanking plate (323) is rotatably connected with a push plate (325) through a hinge (324), the top of the push plate (325) is movably connected with the inner cavity of the recycling box (321), the right side of the push plate (325) is fixedly connected with a supporting spring (326), the right end of the supporting spring (326) is fixedly connected with a trigger switch (327), the trigger switch (327) is fixedly connected with the right side of the inner cavity of the recycling box (321), the right side of the first blanking plate (322) is fixedly connected with an electromagnetic valve (328), the right side of the electromagnetic valve (328) is fixedly connected with the left side of the second blanking plate (323), the surface of the trigger switch (327) is electrically connected with the surface of the electromagnetic valve (328) through a lead (329), and the surface of the lead (329) penetrates through the surface of the recovery box (321) and extends to the inner cavity of the recovery box.
2. The processing mold for lead frames according to claim 1, characterized in that: the cooling mechanism (2) comprises a cooling tank (21), a water reservoir (22), a first base (23), a cooling structure (24) and a second base (25);
the bottom of cooler bin (21) and the top fixed connection of first base (23), first water inlet (26) have been seted up on the surface of cooler bin (21), the inner chamber of first water inlet (26) and the surface intercommunication of inlet channel (4), the inner chamber of first water inlet (26) passes through the surface intercommunication of pipeline and cistern (22), the bottom of cistern (22) and the bottom fixed connection of cooler bin (21) inner chamber, the surface of cistern (22) passes through the water pipe and draws water end intercommunication of water pump (27), the play water end of water pump (27) leads to pipe and cooling structure (24) intercommunication, the inner chamber fixed connection of cooler bin (21) has backup pad (28), the surface of water pipe runs through the surface of backup pad (28) and extends to its top, the top of backup pad (28) and the bottom fixed connection of second base (25), a second water outlet (29) is formed in the top of the cooling box (21), an inner cavity of the second water outlet (29) is communicated with a water outlet pipeline (5), and a supporting plate (28) is arranged between the cooling structure (24) and the water suction pump;
the cooling structure (24) comprises a cooling pool (241), a semiconductor refrigerator (242) and a high-pressure water pump (243), the bottoms of the cooling pool (241) and the semiconductor refrigerator (242) are fixedly connected with the top of the second base (25), the right side of the cooling pool (241) is communicated with the left side of the semiconductor refrigerator (242) through a water pipe, the top of the cooling pool (241) is communicated with the water pumping end of the high-pressure water pump (243) through a water pipe, the water pipe on the surface of the water outlet of the high-pressure water pump (243) is communicated with the top of the cooling pool (241) through a water return pipe (244), and the water outlet end of the high-pressure water pump (243) is communicated with the inner cavity of the second water outlet (29) through a water pipe.
3. The processing mold for lead frames according to claim 1, characterized in that: the stamping mechanism (1) comprises a stamping structure (11), a washing structure (12), a cleaning structure (13) and a drawing structure (14);
the stamping structure (11) comprises a support column (111), a support table (112), a limit table (113) and a stamping table (114), the top of the supporting column (111) is fixedly connected with the bottom of the supporting table (112), the top of the supporting table (112) is fixedly connected with the bottom of the limiting table (113), the surface of the limiting table (113) is provided with a punching hole (115), the inner cavity of the limiting table (113) is provided with a through groove (116), the surface of the limiting table (113) is movably connected with a limiter (117), one end of the limiter (117) penetrates through the surface of the limiting table (113) and extends to the inner cavity of the limiting table, the bottom of the punching platform (114) is fixedly connected with a punching column (118), the surface of the punching column (118) is movably connected with the inner cavity of the punching hole (115), the bottom of the punching platform (114) is movably connected with the top of the limiting platform (113).
4. The processing mold for lead frames according to claim 3, characterized in that: the flushing structure (12) comprises a second water inlet (121), and the inner cavity of the second water inlet (121) is communicated with the surface of the water outlet pipeline (5).
5. The processing mold for lead frames according to claim 3, characterized in that: the cleaning structure (13) comprises cleaning bristles (131), the tops of the cleaning bristles (131) are fixedly connected with the top of the inner cavity of the through groove (116), and the bottom ends of the cleaning bristles (131) are abutted to the bottom of the inner cavity of the through groove (116).
6. The processing mold for lead frames according to claim 3, characterized in that: the drawing structure (14) comprises a fixing sleeve (141) and a lead plate (142), the surface of the lead plate (142) is fixedly connected with the inner cavity of the fixing sleeve (141) through screws, the surface of the fixing sleeve (141) is fixedly connected with a handle (143), and the surface of the lead plate (142) is movably connected with the inner cavity of the through groove (116).
7. The processing mold for lead frames according to claim 3, characterized in that: the supporting columns (111) are arranged in a plurality, and the supporting columns (111) are uniformly distributed at the bottom of the supporting platform (112).
8. The processing mold for lead frames according to claim 3, characterized in that: the cleaning structure (13) and the flushing structure (12) are respectively arranged in the inner cavities of the through grooves (116) at the left side and the right side of the limiting table (113).
9. The processing mold for lead frames according to claim 1, characterized in that: the bottom of rose box (311) inner chamber is provided with filter screen (317), the surface of filter screen (317) and the surface swing joint of gravel layer (316), the surface of filter screen (317) passes through iron wire fixed connection with the surface of first delivery port (315).
10. A processing method of a processing die for a lead frame is characterized in that: the method comprises the following steps:
step one, preparation before use: fixing a punching mechanism (1), fixing a cooling mechanism (2) at the left side position of the punching mechanism (1), fixing a waste recovery mechanism (3) at the bottom of the punching mechanism (1), communicating a second water outlet (29) at the top of the cooling mechanism (2) with a water outlet pipeline (5), communicating the other end of the water outlet pipeline (5) with a second water inlet (121) of the punching mechanism (1), communicating a first water outlet (315) at the left bottom of the waste recovery mechanism (3) with a water inlet pipeline (4), communicating the other end of the water inlet pipeline (4) with a first water inlet (26) at the bottom of the cooling mechanism (2), filling a reservoir (22) of the cooling mechanism (2) with water, starting a water pump (27), a semiconductor refrigerator (242) and a high-pressure water pump (243), pumping the water in the reservoir (22) to a cooling tank (21) by the water pump (27), cold air produced in the semiconductor refrigerator (242) is communicated to the cooling box (21) through a pipeline to supply water and cool, the high-pressure water pump (243) pumps water in the cooling box (21) to the second water outlet (29), and the water is flushed to the flushing structure (12) through the water inlet pipeline (4) and then flushed to the inner cavity of the through groove (116);
step two, starting to punch the lead frame: the material is fixed with the inner cavity of the fixed sleeve (141) through screws, the fixed sleeve (141) is pushed into the inner cavity of the through groove (116) through a handle (143) fixedly connected with the surface of the fixed sleeve (141), the stopper (117) is pushed into the through groove (116) to fix the lead plate (142) material, the punching table (114) is pressed down, the punching column (118) is pressed to the surface of the lead plate (142) material, the waste material punched by the lead plate (142) material is flushed to the waste material recovery mechanism (3) fixed at the bottom of the punching mechanism (1) through the punching hole (115), the filter box (311) of the waste material recovery mechanism (3) is opened, the waste material slides to the filter plate (313) through the surface of the drainage plate (312), the waste material slides to the waste material port (314) at the right end of the filter plate (313), then slides to the surfaces of the first blanking plate (322) and the second blanking plate (323), the waste material presses to the push plate (325), and the push plate (, the supporting spring (326) pushes a trigger switch (327), the switch energizes an electromagnetic valve (328) which is electrically connected through a lead (329), the electromagnetic valve (328) is opened, and the waste material slides to the bottom of the inner cavity of the recovery box (321) from the surfaces of the first push plate (325) and the second push plate (325);
step three, wastewater recovery: filter back sand and stone layer (316) of flow direction filter box (311) with waste water through filter (313), sand and stone layer (316) filter the back once more, water flows to filter screen (317) of sand and stone layer (316) left side bottom, water flows to inlet channel (4) rather than the intercommunication through first delivery port (315), water flows into first water inlet (26) rather than the intercommunication through inlet channel (4), water flows into cistern (22) through the pipeline with first water inlet (26) intercommunication, thereby carry out water cyclic treatment and utilize.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011564099.XA CN112872144B (en) | 2020-12-25 | 2020-12-25 | Processing die for lead frame and processing method thereof |
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| CN202011564099.XA CN112872144B (en) | 2020-12-25 | 2020-12-25 | Processing die for lead frame and processing method thereof |
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| CN112872144B CN112872144B (en) | 2023-07-07 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113385911A (en) * | 2021-06-17 | 2021-09-14 | 扬州市精诚电子有限公司 | Assembling equipment and assembling method of coaxial connector |
| CN114023674A (en) * | 2021-11-11 | 2022-02-08 | 天水华洋电子科技股份有限公司 | Lead frame surface treatment device based on integrated circuit |
| CN116603920A (en) * | 2023-07-20 | 2023-08-18 | 四川金湾电子有限责任公司 | Stamping and unhairing integrated equipment for semiconductor lead frame |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210045819U (en) * | 2019-06-19 | 2020-02-11 | 青岛众城精密模具有限公司 | Stamping equipment is with inhaling useless device |
| CN210648129U (en) * | 2019-08-21 | 2020-06-02 | 芜湖实泰机械制造有限公司 | Mold processing device with cooling liquid recovery device |
| CN211074785U (en) * | 2019-08-28 | 2020-07-24 | 辽宁新福源精密制造科技有限公司 | Numerical control hydraulic punching machine |
| CN111729969A (en) * | 2020-06-11 | 2020-10-02 | 陈亚秀 | Metal forming stamping die |
| CN111960587A (en) * | 2020-09-03 | 2020-11-20 | 杭州吉宝传动设备有限公司 | Intelligent self-cleaning center water outlet system and water outlet method thereof |
-
2020
- 2020-12-25 CN CN202011564099.XA patent/CN112872144B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210045819U (en) * | 2019-06-19 | 2020-02-11 | 青岛众城精密模具有限公司 | Stamping equipment is with inhaling useless device |
| CN210648129U (en) * | 2019-08-21 | 2020-06-02 | 芜湖实泰机械制造有限公司 | Mold processing device with cooling liquid recovery device |
| CN211074785U (en) * | 2019-08-28 | 2020-07-24 | 辽宁新福源精密制造科技有限公司 | Numerical control hydraulic punching machine |
| CN111729969A (en) * | 2020-06-11 | 2020-10-02 | 陈亚秀 | Metal forming stamping die |
| CN111960587A (en) * | 2020-09-03 | 2020-11-20 | 杭州吉宝传动设备有限公司 | Intelligent self-cleaning center water outlet system and water outlet method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113385911A (en) * | 2021-06-17 | 2021-09-14 | 扬州市精诚电子有限公司 | Assembling equipment and assembling method of coaxial connector |
| CN114023674A (en) * | 2021-11-11 | 2022-02-08 | 天水华洋电子科技股份有限公司 | Lead frame surface treatment device based on integrated circuit |
| CN116603920A (en) * | 2023-07-20 | 2023-08-18 | 四川金湾电子有限责任公司 | Stamping and unhairing integrated equipment for semiconductor lead frame |
| CN116603920B (en) * | 2023-07-20 | 2023-09-22 | 四川金湾电子有限责任公司 | Stamping and unhairing integrated equipment for semiconductor lead frame |
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| CN112872144B (en) | 2023-07-07 |
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