CN112867293A - Pressing machine - Google Patents
Pressing machine Download PDFInfo
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- CN112867293A CN112867293A CN202110259730.3A CN202110259730A CN112867293A CN 112867293 A CN112867293 A CN 112867293A CN 202110259730 A CN202110259730 A CN 202110259730A CN 112867293 A CN112867293 A CN 112867293A
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- 238000003825 pressing Methods 0.000 title claims abstract description 95
- 238000010438 heat treatment Methods 0.000 claims abstract description 129
- 230000002093 peripheral effect Effects 0.000 claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000009826 distribution Methods 0.000 claims abstract description 10
- 238000010030 laminating Methods 0.000 claims description 33
- 230000001681 protective effect Effects 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
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- 230000020169 heat generation Effects 0.000 description 4
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
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- 238000009413 insulation Methods 0.000 description 3
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- 238000009825 accumulation Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
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- 229910000831 Steel Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
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- 229910052742 iron Inorganic materials 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Surface Heating Bodies (AREA)
Abstract
The application discloses pressfitting machine for the manufacturing of circuit board includes: a frame body having a press-fit chamber; the laminated plate comprises a support plate and a heating structure arranged on the support plate, wherein the heating structure comprises an auxiliary heating resistor strip which is used for being communicated with a power supply to generate heat by utilizing circulating current; the number of the pressing plates is at least two, the at least two pressing plates comprise an upper pressing plate positioned at the top of the pressing chamber and a lower pressing plate positioned at the bottom of the pressing chamber, the upper pressing plate and the lower pressing plate are parallel to each other and are arranged oppositely, and a pressing space for pressing the circuit board is formed between the upper pressing plate and the lower pressing plate; the auxiliary heating resistor strips are constructed into a preset shape and laid on the supporting plate, and the resistor distribution density of the auxiliary heating resistor strips positioned in the middle area of the supporting plate is smaller than that of the auxiliary heating resistor strips positioned in the peripheral area of the supporting plate. The application provides a pressfitting machine is high at the pressfitting in-process uniform consistency of heating temperature, improves the processingquality of circuit board.
Description
Technical Field
The application relates to the field of circuit board manufacturing, in particular to a laminating machine for manufacturing a circuit board.
Background
Printed circuit boards, generally composed of copper foil, prepreg, and inner layer, may also be called printed circuit boards (pcbs).
The manufacturing equipment of the printed circuit board is a circuit board laminating machine, and in the laminating process of the existing PCB, particularly for PCB products with 2 layers and more than 2 layers, hot pressing is mainly adopted in the laminating process. Hot pressing is performed by heating a prepreg (e.g., an epoxy resin material) and applying a pressure to cause the prepreg to undergo a solid-liquid-solid conversion process to bond the multilayer core board.
The main disadvantages of the existing PCB hot press are as follows: the problem is more obvious when the pressing layer number is more, the accumulated pressure and temperature errors are larger, and the problem is more obvious.
Disclosure of Invention
To the shortcoming that exists in the above-mentioned technique, the application provides a pressfitting machine that heats evenly.
The technical scheme adopted by the application for solving the technical problem is as follows:
a laminating machine for the manufacture of circuit boards, said laminating machine comprising:
a frame body having a press-fit chamber;
the laminated plate comprises a supporting plate and a heating structure arranged on the supporting plate, wherein the heating structure comprises an auxiliary heating resistor strip, and the auxiliary heating resistor strip is used for being communicated with a power supply to generate heat by utilizing circulating current;
the pressing plates comprise an upper pressing plate positioned at the top of the pressing chamber and a lower pressing plate positioned at the bottom of the pressing chamber, the upper pressing plate and the lower pressing plate are parallel to each other and are arranged oppositely, and a pressing space for pressing the circuit board is formed between the upper pressing plate and the lower pressing plate;
the auxiliary heating resistor strips are constructed into a preset shape and laid on the supporting plate, and the resistor distribution density of the auxiliary heating resistor strips in the middle area of the supporting plate is smaller than that of the auxiliary heating resistor strips in the peripheral area of the supporting plate.
In one embodiment, the number of the pressing plates is at least three, and the at least three pressing plates are respectively the upper pressing plate and the lower pressing plate and n middle pressing plates arranged between the upper pressing plate and the lower pressing plate, wherein n is a positive integer greater than or equal to 1;
n pressfitting board placed in the middle go up the pressfitting board with all set up at intervals each other between the pressfitting board down to form n +1 pressfitting chamber, every pressfitting chamber is used for pressfitting one or polylith circuit board.
In one embodiment, the number of the pressing plates is two, namely the upper pressing plate and the lower pressing plate;
the laminating machine further comprises a copper foil auxiliary heating sheet, the copper foil auxiliary heating sheet can be connected with a power supply to provide heating heat, the copper foil auxiliary heating sheet is arranged between the upper laminating plate and the lower laminating plate, the copper foil auxiliary heating sheet is constructed into a multi-folding structure and is provided with a plurality of folding sheets which are parallel to each other, and a space for accommodating the circuit board is formed between every two adjacent folding sheets.
In one embodiment, the heating structures in the upper pressing plate and the lower pressing plate are disposed on the plate surface of the supporting plate facing the pressing space.
In one embodiment, the middle pressing plate includes the heating structures respectively disposed on the upper and lower plate surfaces of the supporting plate.
In one embodiment, the auxiliary thermal resistance strips are coated with an insulating structure at the periphery.
In one embodiment, the laminated board further comprises a protective cover, wherein the protective cover covers the board surface of the support board paved with the heating structure, and the protective cover faces the board surface of the heating structure and is provided with an insulating coating.
In one embodiment, the cross-sectional area of the auxiliary thermal resistance strips in the central region of the support plate is larger than the cross-sectional area of the auxiliary thermal resistance strips in the peripheral region of the support plate.
In one embodiment, the auxiliary thermal resistance strips have a uniform size in the thickness direction of the laminated board, and the width of the auxiliary thermal resistance strips in the middle area of the support plate is greater than the width of the auxiliary thermal resistance strips in the peripheral area of the support plate.
In one embodiment, the distance between the auxiliary thermal resistance strips in the central region of the support plate is greater than the distance between the auxiliary thermal resistance strips in the peripheral region.
In one embodiment, the support plate is provided with an installation groove having a shape consistent with the preset shape of the auxiliary heating resistor strip, and the auxiliary heating resistor strip is embedded into the installation groove.
In one embodiment, the supporting plate is square, the auxiliary thermal resistance strips comprise a plurality of strip-shaped strips which are connected end to end and parallel to each other, the strip-shaped strips are arranged in parallel with one side edge of the supporting plate, and the distance between the strip-shaped strips in the middle area is larger than the distance between the strip-shaped strips in the peripheral area.
In one embodiment, the supporting plate has two adjacent sides parallel to each other and adjacent to the side edges, the supporting plate sequentially includes the peripheral region, the middle region and the peripheral region along the extending direction of the adjacent sides, the peripheral regions at two ends are symmetrical to each other, and the width of the middle region accounts for 30% -60% of the length of the adjacent sides in the extending direction of the length of the adjacent sides.
In one embodiment, along the length extending direction of the adjacent sides, the distance between the strip-shaped bands in the middle area changes in an increasing manner and then in a decreasing manner, and the increasing and decreasing changes are the same in amplitude.
In one embodiment, the support plate is square, the auxiliary heating resistor strips are laid in a coiled mode and comprise a plurality of circles of square annular strips which are connected end to end, and each square annular strip is in an unclosed square shape;
the middle area is a square-row area taking the geometric center of the support plate as the center, the outer contour of the square-row area is similar to that of the support plate, and the area of the middle area accounts for 30% -50% of that of the support plate.
In one embodiment, the distance between adjacent square annular bands is gradually decreased and the decreasing amplitude is gradually decreased when viewed from the geometric center of the support plate to the outer contour of the support plate.
In one embodiment, the decreasing amplitude of the distance between the square annular bands in the central region is 2mm to 10mm, and the decreasing amplitude of the distance between the square annular bands in the peripheral region is 0.1mm to 0.5 mm.
Compared with the prior art, the application has the beneficial effects that: the application provides a pressfitting machine, pressfitting board's heating structure has the supplementary thermal resistance strip of predetermineeing the shape trend, can arrange the supplementary thermal resistance strip trend according to pressfitting board's shape and adaptability, the resistance distribution density that is located the regional supplementary thermal resistance strip in backup pad middle part is less than the resistance distribution density that is located the supplementary thermal resistance strip in backup pad peripheral region, thereby compensate the inhomogeneous temperature that leads to of each regional thermal radiation of pressfitting board effectively inhomogeneous, improve the uniformity of each regional temperature of pressfitting board, guarantee the processingquality of circuit board.
Drawings
Fig. 1 is a schematic perspective view of a laminating machine according to an embodiment of the present application;
FIG. 2 is a schematic block diagram of the laminator of FIG. 1;
FIG. 3 is an exploded view of the center laminate of the laminator of FIG. 1;
FIG. 4 is a cross-sectional structural schematic view of the centered laminate panel shown in FIG. 1;
FIG. 5 is a schematic top view of a heating structure of a laminate panel in an embodiment of the present application;
FIG. 6 is a schematic structural view of a heating unit of a laminating machine according to another embodiment of the present application;
fig. 7 is a schematic top view of a heating structure of a laminate panel in another embodiment of the present application.
Fig. 8 is a nine-point temperature test chart of the laminate panel shown in fig. 5.
Fig. 9 is nine-point temperature test data of the laminate panel shown in fig. 8.
Fig. 10 is a graph plotted based on nine-point temperature data of the laminate panel shown in fig. 9.
Fig. 11 is nine-point temperature test data of the laminate panel of the prior art.
Fig. 12 is a graph plotted based on nine-point temperature data of the laminate panel shown in fig. 11.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and are not limiting of the application. It should be further noted that, for the convenience of description, only some of the structures related to the present application are shown in the drawings, not all of the structures. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "comprising" and "having," as well as any variations thereof, in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The present application will now be described in further detail with reference to the accompanying drawings, whereby one skilled in the art can, with reference to the description, make an implementation.
As shown in fig. 1 and fig. 2, the present application provides a laminating machine 500, which can be applied to produce printed circuit boards (pcb). In this embodiment, the laminating machine 500 includes a frame body 520, a hydraulic unit 200, a main control box 510, a main controller 300, and a plurality of laminated boards 100. The hydraulic unit 200 includes a hydraulic cylinder 210 and a hydraulic control device 220 for controlling the hydraulic cylinder 210, the main controller 300 is disposed in the main control box 510, and the main controller 300 is electrically connected to the hydraulic control device 220 and is configured to control a hydraulic pressure signal of the hydraulic control device 220, where the hydraulic pressure signal is used to control a pressurization process of the hydraulic cylinder 210 and adjust a pressurization force applied to the pressing plate 100 by the hydraulic cylinder 210 in the pressurization process. The main controller 300 is also electrically connected to the laminate panel 100, and outputs a heating control signal for controlling a heating temperature of the laminate panel 100 to the laminate panel 100.
The frame body 520 has a pressing chamber 521, and the plurality of pressing plates 100 are disposed in the pressing chamber 521. The pressing plate 100 comprises an upper pressing plate 101 and a lower pressing plate 102, wherein the upper pressing plate 101 is arranged at the top of the pressing chamber 521, the lower pressing plate 102 is arranged at the bottom of the pressing chamber 521, the upper pressing plate 101 and the lower pressing plate 102 are parallel to each other and are arranged just opposite to each other, and a pressing space for pressing the circuit board is formed between the upper pressing plate 101 and the lower pressing plate.
In one embodiment, the number of the pressing plates 100 is at least three, that is, an upper pressing plate 102 and a lower pressing plate 102, and a middle pressing plate 103 disposed between the upper pressing plate 101 and the lower pressing plate 102. The number of the press plates 100 is at least 3, and at least two press cavities are formed between the 3 press plates at intervals, so that a plurality of circuit boards can be processed by one-time pressing, and the processing efficiency is higher. Specifically, the sizes of the laminated plates 100 are the same, and the laminated plates 100 are parallel to each other in pairs and are disposed opposite to each other, in other words, the projections of the outer contours of the laminated plates 100 on the plane where the laminated plates are located overlap each other.
In another embodiment, the laminate panel 100 includes only two, an upper laminate panel 101 and a lower laminate panel 102, respectively. In this embodiment, a pressing space is formed between the upper pressing plate 101 and the lower pressing plate 102, which can be used for pressing one circuit board at a time. In order to improve the pressing efficiency, referring to fig. 6, the pressing machine 500 further includes a copper foil auxiliary heat sheet 30, and the copper foil auxiliary heat sheet 30 is disposed between the upper pressing plate 101 and the lower pressing plate 102. Wherein the copper foil auxiliary heating sheet 30 is substantially rectangular after being horizontally unfolded. In order to press a plurality of circuit boards at a time, the copper foil auxiliary heating sheet 30 is constructed in a multi-fold structure and has a plurality of folding sheets 31 parallel to each other, and a space for accommodating the circuit boards is formed between adjacent folding sheets 31. The copper foil auxiliary heating sheet 30 is connected with a power supply, can be powered on to provide heating heat, and further comprises a power controller connected with the power supply and used for controlling the heating power of the copper foil auxiliary heating sheet 30 so as to adjust the heating temperature. Before lamination, the multi-layer core board for manufacturing the circuit board is placed between the adjacent folding sheets 31, the folding sheets 31 separate a plurality of circuit boards, and then the pressed PCB board package and the copper foil auxiliary heating sheets 30 are placed in the lamination space.
The structure of the laminate panel 100 will be described in detail. In this embodiment, referring to fig. 1, the laminated plate 100 includes 4 middle laminated plates 103, an upper laminated plate 101, and a lower laminated plate 102. The structure of each middle pressing plate 103 is the same, and for the sake of brevity, only the structure of one middle pressing plate 103 will be described. Referring to fig. 3 and 4, the centrally laminated panel 100 includes protective covers (10, 14), heating structures (11, 13), and a support plate 12. Wherein, the heating structure (11, 13) is laid on the plate surface of the support plate, and the protective cover (10, 14) is arranged on the outermost layer of the laminated plate 100 and covers the surface of the support plate on which the heating structure (11, 13) is laid for protecting the heating structure (11, 13). After the laminate panel 100 is assembled, the heating structure (11, 13) is disposed between the support plate 12 and the protective layer 10. Wherein, heating structure (11, 13) are the electric conductor, are connected with the power, can utilize the heat effect of electric current to generate heat. Specifically, the center laminate 103 includes 2 heating structures, i.e., a first heating structure 11 and a second heating structure 13, respectively disposed on the upper and lower surfaces of the support plate 12, i.e., the support plate 12 is disposed between the two heating structures. Accordingly, the number of protective covers (10, 14) is also two, in particular a first protective cover 10 and a second protective cover 14. In this embodiment, the laminate panel 100 includes, in order, a first protection cover 10, a first heating structure 11, a support plate 12, a second heating structure 13, and a second protection cover 14.
Both the upper and lower surfaces of the middle laminate 103 can be used for heating, and as an intermediate plate, are disposed in the middle of the upper and lower laminates. Between adjacent pressfitting board 103 placed in the middle, and all have the clearance between pressfitting board 103 placed in the middle and last pressfitting board 101 and the pressfitting board 102 down, a pressfitting chamber for forming place PCB board package, the quantity of pressfitting board 103 placed in the middle can be 1, also can be a plurality of, the quantity of pressfitting board 103 placed in the middle is established and is n, wherein n more than or equal to 1, then the pressfitting board can form n +1 pressfitting chamber, a pressfitting process, can pressfitting polylith circuit board, every pressfitting chamber also can pressfitting one or polylith circuit board. In this embodiment, the pressfitting board placed in the middle has 4, forms 5 pressfitting chambeies with two upper and lower pressfitting boards.
Correspondingly, the upper pressing plate 101 and the lower pressing plate 102 have the same structure, and only the upper pressing plate 101 is taken as an example for description, and the structure of the lower pressing plate 102 is not described again. The number of heating structures in the upper laminate plate 101 is one, i.e., the upper laminate plate 101 includes a support plate 12, a shield case 10, and a heating structure 11 disposed between the support plate 12 and the shield case 10. In a specific implementation scenario, the support plate 12 of the upper laminate board 101 faces the outside, the protection cover 10 faces the laminating space, and the PCB package is heated by the heating structure 11. The lower pressing plate 102 and the upper pressing plate 101 are symmetrically arranged, the protective cover 10 also faces the pressing space, and the lower pressing plate 102 is connected with the hydraulic cylinder 210 and used for receiving the pressure of the hydraulic cylinder 210 and performing translational motion in the direction of the upper pressing plate 102 to press the PCB packages.
In order to improve the uniformity of the heating temperature of the laminate panel 100. Referring to fig. 3, the heating structure 11 includes an auxiliary thermal resistor strip 111, two ends of the auxiliary thermal resistor strip 111 are connected to a power supply, and after the power supply is turned on, a current flows in the auxiliary thermal resistor strip 111, and a current thermal effect causes the auxiliary thermal resistor strip 111 to generate heat, so as to raise the temperature of the laminated board 100. The auxiliary thermal resistance strip is continuous and long, after the power supply is switched on, the current of each part of the auxiliary thermal resistance strip 111 is the same, and the heating value is positively correlated with the resistance value. In this embodiment, the auxiliary thermal resistance strips 11 are configured to be laid on the support plate 12 in a preset shape, and the resistance distribution density of the auxiliary thermal resistance strips 11 located in the middle area of the support plate 12 is smaller than the resistance distribution density of the auxiliary thermal resistance strips 111 located in the peripheral area of the support plate 12. With the arrangement, under the condition that the current magnitude is consistent, the average heat generated by the auxiliary thermal resistance strips 111 in the middle area in the unit area is lower than the average heat generated by the auxiliary thermal resistance strips 111 in the peripheral area in the unit area, so that the condition that the heat loss of the peripheral area is more due to more heat exchange between the peripheral area of the laminated board and the surrounding environment is balanced, the temperature is reduced more quickly, and the uniformity of the temperature of the laminated board is improved. On the contrary, if the auxiliary thermal resistance strips are uniformly distributed on the supporting plate 12, under the condition of equal heating heat, the heat exchange between the peripheral area of the supporting plate 12 and the surrounding environment is more active, the heat dissipation of the supporting plate 12 in the central area is slower, the temperature is increased to the peripheral area, the temperature of the peripheral area is lower than that of the central area, the temperature of the laminated board 100 is not uniform, and the produced printed circuit board has poor quality and is even scrapped. It can be understood that the larger the resistance distribution density is, the larger the amount of heat generated by the thermal effect of the current is when the same current is applied. Here, the resistance distribution density is to be understood as the total resistance value per unit area of the support plate surface, i.e., the resistance distribution density is the resistance value of the corresponding region/the area of the corresponding region.
The first heating structure 11 and the second heating structure 13 described in this embodiment have the same structure, and the following description will only take the first heating structure 11 as an example. With continued reference to fig. 3, the first heating structure 11 includes a positive electrode 114 and a negative electrode 112, and the auxiliary thermal resistance strip 111 has one end connected to the positive electrode 114 and the other end connected to the negative electrode 112. In a specific application process, the positive electrode 114 and the negative electrode 112 are powered on, and current flows in the auxiliary thermal resistance strip 111 to generate heat due to resistance thermal effect to generate heat energy. The type of power supply may be a dc power supply or an ac power supply, preferably a dc power supply. When the auxiliary thermal resistance strip 111 is energized, thermal energy is generated. The energization control manner of the auxiliary thermal resistance strip 111 may specifically be to change the magnitude of the current value or the voltage value of the energization, or to control the on-off time period of the energization. The material of the auxiliary thermal resistance strip 111 may be a material with a high thermal resistance value, such as iron, steel, chromium, manganese, ceramic, etc.
In one embodiment, the resistance of the auxiliary thermal resistance strips 111 is not uniform, and the cross-sectional area of the auxiliary thermal resistance strips 111 located in the central region of the support plate 12 is larger than the cross-sectional area of the auxiliary thermal resistance strips 111 located in the peripheral region of the support plate 12. It can be understood that the thicker the auxiliary thermal resistance strips 111, the lower the resistance thereof, and the lower the thermal effect of the electric current, the thicker the middle region of the resistance strips 111 than the peripheral region of the auxiliary thermal resistance strips 111, so that the same electric current generates less heat per unit length of the auxiliary thermal resistance strips in the middle region, thereby balancing the uneven laminate temperature caused by the uneven heat radiation in the peripheral region and the middle region of the laminate 100.
In the exemplary embodiment shown in fig. 5, the spacing between the auxiliary heat resistance strips 111 of predetermined shape, which are laid in the central region of the support plate 12, is greater than the spacing between the auxiliary heat resistance strips 111 of predetermined shape, which are laid in the peripheral region of the support plate 12. In this embodiment, the auxiliary thermal resistor strips 111 may have uniformly distributed resistors, wherein the uniformly distributed resistors are understood to mean that the resistance values of the auxiliary thermal resistor strips 111 of any unit length are the same, for example, the cross-sectional areas of the auxiliary thermal resistor strips 111 are uniform everywhere, so that the heat generation amount of the auxiliary thermal resistor strips of unit length is the same, and the imbalance of heat dissipation is compensated by adjusting the intervals of the auxiliary thermal resistor strips. In the present embodiment, by arranging the auxiliary heat resistance strips 111 to have a larger pitch in the middle region, the amount of heat generated per unit area of the auxiliary heat resistance strips 111 in the middle region is reduced.
Considering that the distance between the auxiliary heating resistor strips in the middle area is large, and the blank is not provided with a heating structure, if the distance is too large, the temperature on the support plate is easily fluctuated along with the arrangement position of the auxiliary heating resistor strips 111. In order to suppress the wavy temperature condition, in another embodiment, the auxiliary thermal resistance strips 111 may also be provided in a shape of uneven thickness, and the cross-sectional area of the auxiliary thermal resistance strips 111 located in the central region of the support plate 12 is larger than that of the auxiliary thermal resistance strips 111 located in the peripheral region of the support plate 12. Preferably, the auxiliary heat resistor strips 111 have the same size in the thickness direction of the support plate 12, and the width of the auxiliary heat resistor strips 111 located in the central region of the support plate 12 is greater than the width of the auxiliary heat resistor strips 111 located in the peripheral region of the support plate 12, so that the auxiliary heat resistor strips 111 per unit length cover the plate surface of the support plate 12 in the central region of a larger area, the area of the support plate 12 heated by direct contact with the auxiliary heat resistor strips 111 is increased, and the fluctuation of temperature waves on the plate surface of the support plate 12 due to the pitch of the auxiliary heat resistor strips 111 is suppressed. Moreover, the resistance of the auxiliary thermal resistance strips 111 per unit length in the central region is smaller than the resistance of the auxiliary thermal resistance strips 111 per unit length in the peripheral region, so that the heat generation amount of the auxiliary thermal resistance strips 111 per unit length in the central region can be reduced, and the situation of less heat dissipation in the central region can be balanced.
In the heating process, since the support plate 12 is made of an aluminum plate and has good thermal conductivity, the heat generated in the peripheral region is necessarily radiated to the central region, and therefore, the temperature in the central region is also increased by the heat generated by the auxiliary thermal resistance strips 111 in the peripheral region, and therefore, not only the difference between the heat exchange between the peripheral region and the external environment in the central region, but also the mutual heat auxiliary influence between the peripheral region and the central region of the support plate 12 is considered. In view of the above, the present embodiment further sets the pitch between the auxiliary heat resistor strips 111 located in the central region of the support plate 12 to be larger than the pitch of the auxiliary heat resistor strips 111 located in the peripheral region of the substrate 12. The distance between the auxiliary thermal resistance strips 111 can be further increased on the basis that the auxiliary thermal resistance strips with the cross-sectional areas lower than those of the peripheral regions are adopted in the middle region. In this way, the distance between adjacent strips of the auxiliary heating resistor strips 111 in the central region is increased, and the influence of the peripheral region heat on the temperature of the support plate 12 in the central region can be balanced.
The supporting plate 12 is provided with an installation groove having the same direction as the preset shape of the auxiliary thermal resistance strip 111, and the auxiliary thermal resistance strip 111 is embedded into the installation groove and covered with the protection cover 10 (or 14). The cross-section of the auxiliary resistive heating strips 111 is square for easy manufacturing. The heating structure formed by laying the auxiliary heating resistor strips 111 is integrally flaky, the thickness is uniform and consistent, the contact area of the heating structure and the substrate 12 is used for direct conduction heating, and the uniformity of the heating temperature is further improved. In the embodiment in which the cross-sectional areas of the auxiliary resistor strips are not uniform, it is preferable that the auxiliary resistor strips 111 have a uniform size in the thickness direction of the laminate board 100, and the width of the auxiliary resistor strips 111 located in the central region of the support plate is greater than the width of the auxiliary resistor strips 111 located in the peripheral region of the support plate 12. Correspondingly, the mounting grooves have the same depth at all positions, and the width of the mounting groove in the middle area of the support plate 12 is larger than that of the mounting groove in the peripheral area of the support plate 12. Therefore, when the mounting groove is formed in the support plate 12, only the width of the mounting groove (the width of the auxiliary thermal resistance strip) needs to be controlled, and the processing and the manufacturing are convenient.
In this embodiment, the supporting plate 12 is square, for example, rectangular or square, the auxiliary thermal resistance strips 111 include a plurality of strip-shaped strips which are connected end to end and are parallel to each other, the plurality of strip-shaped strips are all arranged in parallel to one side of the supporting plate 12, and the distance between the strip-shaped strips in the middle area is greater than the distance between the strip-shaped strips in the peripheral area. The support plate 12 has two adjacent sides parallel to each other adjacent to the above-mentioned side edges, along the extending direction of the adjacent sides, the support plate 12 is sequentially a peripheral area, a middle area, and a peripheral area, the peripheral areas at the two ends are symmetrical to each other, and in the extending direction of the length of the adjacent sides, the width of the middle area accounts for 30% -60% of the length of the adjacent sides. The peripheral region and the central region are understood to be peripheral regions at both ends in the length direction (width) and central regions at a portion between the both ends along an extending direction of the support plate 12, such as the length (width) direction, the peripheral regions and the central regions being arranged in order along the length direction. If the entire area of the support plate 12 is set to 100%, the occupation ratio of the central area ranges from 30% to 60%, and the occupation ratio of each of the peripheral areas on the left and right sides of the central area ranges from 35% to 20%, respectively. In this embodiment, the predetermined shape of the auxiliary thermal resistance strips 111 is a serpentine shape, which may also be referred to as a "bow" shape. Further, referring to fig. 3, the connecting portion between the adjacent strip-shaped bands is in an arc shape, so that the temperature accumulation caused by the sharp transition of the strip-shaped bands is reduced.
The inventor of the application finds that if the auxiliary thermal resistance strips are uniformly arranged, the measured temperature on the surface of the support plate 12 is a hill-type netted temperature line with a high middle part and two low sides. And the temperature of the middle part is obviously higher than that of the periphery, and changes in a roughly parabolic manner. For more accurate realization each regional temperature uniformity of backup pad, further, along the length extending direction of adjacent limit, set the regional strip area in middle part into: the distance between the strip-shaped bands positioned in the middle area changes in an increasing mode and then in a decreasing mode, the increasing and decreasing change amplitude is the same, namely the strip-shaped bands presenting the increasing change and the strip-shaped bands presenting the decreasing change are mutually symmetrical, and the selectable increasing and decreasing amplitude is 0.2cm, 0.3cm, 0.4cm, 0.5cm and 0.8 cm. When the incremental distance is selected to be 0.5cm, the temperature change of each part of the laminated plate tends to be consistent, and the temperature of each area is more uniform.
For convenience of manufacturing and temperature control, in the present embodiment, the auxiliary thermal resistance strips 111 of the heating structure 11 are continuous strip conductors, two ends of the auxiliary thermal resistance strips 111 are used for connecting a power supply, and after the power supply is connected, the current at any position of the auxiliary thermal resistance strips 111 is the same.
Further, because the auxiliary heating resistor strips 111 are conductors, heat is generated by the aid of circulating current, and in order to avoid electric leakage, the insulating layer 22 is further arranged between the heating structure and the adjacent supporting plate and the adjacent protective cover, so that electric leakage or electric series between the heating structure and the adjacent layer is effectively avoided. Specifically, the first heating structure 11 is insulated from both the first protective cover 10 and the support plate 12, and the second heating structure 13 is insulated from both the support plate 12 and the second protective cover 14. The insulating layer 22 includes an insulating structure coated on the auxiliary resistor strip 111, that is, the surface of the auxiliary resistor strip 111 is covered with the insulating structure, so that the auxiliary resistor strip 111 is insulated from the outside. An alternative insulating structure is an insulating ceramic sintered at the outer periphery of the auxiliary resistive heating strips 111. In order to further enhance the reliability of the insulation, the protective cover is also insulating, in one embodiment, the protective cover itself may be made of an insulating material, and in another embodiment, the surfaces of the protective covers 10, 14 facing the heating structure are provided with an insulating coating, such as alumina, so as to form a two-layer insulation protection with the insulating layer 22, thereby improving the safety and reliability of the insulation protection. Since the first protective cover 10 and the second protective cover 14 can be made of the same material and structure, only one of them will be described in detail herein. Likewise, only one of the first heating structure 11 or the second heating structure 13 is described herein.
The laminated board 100 controls the heating quantity in different areas of the supporting board 12 through the auxiliary heating resistor strips 111 with preset shape trend, so that the temperature unevenness caused by the uneven heat radiation in different areas is balanced, the temperature uniformity of the laminated board can be improved, and the production quality and the yield of the printed circuit board are ensured.
To further illustrate the effect of the heating temperature of the laminate panel 100 of the present embodiment being more uniform, the present application also provides nine-point temperature test data of the laminate panel shown in fig. 5. Fig. 8 shows a nine-point temperature test chart of the laminated board. Specifically, the heating plate surface of the laminated plate is divided according to the nine-square grid by adopting 9 different points to detect temperature data, and the 9 temperature detection points are respectively and correspondingly arranged in each grid. The temperature during the heating process was collected, and the temperature data was shown in fig. 9 after experiments, and the data shown in fig. 9 was plotted graphically to obtain the temperature data curve shown in fig. 10. As can be seen from the temperature data curve fitted in fig. 10, the temperatures at 9 points at the same time are substantially the same, and the temperature curves at 9 points are almost overlapped, so that it can be intuitively understood that the temperatures of the respective areas of the laminate sheet during the heating process are uniform.
As a control group, fig. 11 to 12 show temperature data of the conventional laminate panel. As a control, the conventional laminate heating structure employs uniformly distributed heating rods, each of which has the same pitch and is substantially cylindrical. Similarly, the 9-point temperature test was used to obtain the temperature test data shown in fig. 11, and the data shown in fig. 11 was plotted graphically to obtain the temperature data curve shown in fig. 12. As can be seen from fig. 12, the greater the difference between the temperatures of the 9 temperature test points of the laminated board with the lapse of the heating time, the greater the degree of dispersion, and the less uniform the temperature.
After the heating and pressing are finished, the temperature is reduced as fast as possible, so that the printed circuit board is convenient to disassemble. In one embodiment, referring to fig. 3 and 4, the support plate 12 is further provided with a cooling structure for rapidly cooling the laminate board 100. The cooling structure includes a tube 122, and in particular, the tube 122 is formed in the support plate 12. In fig. 1 and 2, only one of the pipes is designated by reference numeral 122 for simplicity of illustration. The pipe 122 may contain cooling water or cooling oil, by which the adjacent first and second heating structures 11 and 13 are effectively cooled. Since the basic peripheral area is in contact with the external environment, the heat dissipation is fast and the temperature reduction is fast, while the central area is in weaker exchange with the external environment and the temperature reduction is slow, in order to balance the uneven heat dissipation. Preferably, the number of the pipes in the central area of the pipe 122 in the support plate 12 is greater than that in the peripheral area, so as to accelerate the heat dissipation of the laminated plate 100 in the central area, make the temperature of the laminated plate uniform during the cooling process, and prevent the quality problem of the printed circuit board caused by the uneven temperature of the support plate 12 during the cooling process. Preferably, the pipe 122 is formed in the support plate 12, and the pipe 122 may be separately provided. The support plate 12 is made of aluminum, and the aluminum material is effectively used to facilitate heat dissipation and to reduce the weight of the material.
In other embodiments, the predetermined shape of the auxiliary thermal resistance strip may also be a zigzag shape. In the embodiment shown in fig. 7, the support plate is a square, zigzag-shaped auxiliary thermal resistor strip 111', which may also be called a coiled auxiliary thermal resistor strip, and includes a plurality of turns of square annular strips connected end to end, each square annular strip being in a non-closed square shape. Specifically, the auxiliary thermal resistance strips 111' are laid in a first circle along a constant distance from the outer contour of the support plate 12, are laid in a second circle approximately around the first circle without closing, are laid in a second circle along a constant distance from the first circle, and are laid in the same way until reaching the middle of the support plate 12, a power supply can be directly led out from the middle, and the auxiliary thermal resistance strips can be laid in a third circle from the middle of the support plate 12 to the peripheral area in a continuous way until reaching the edge of the support plate, so that the power supply can be conveniently connected from the outer edge. The auxiliary thermal resistance strips 111 'of each circle are continuous, the distance between the adjacent auxiliary thermal resistance strips 111' is not completely consistent, and the distance between the auxiliary thermal resistance strips in the middle area is larger than that of the auxiliary thermal resistance strips in the peripheral area. In this embodiment, the central region refers to a region within a predetermined distance from the geometric center of the support plate, and the peripheral region refers to a substantially annular region at the peripheral edge of the support plate. Specifically, the middle region is a square-row region centered on the geometric center of the support plate 12, the outer contour of the square-row region is similar to the outer contour of the support plate 12, and the area of the middle region accounts for 30% -50% of the area of the support plate 12. Preferably, the distance between the auxiliary thermal resistance strips, viewed from the geometric center of the support plate to the outer contour of the support plate, between adjacent square annular strips is gradually decreased, and the decreasing amplitude is gradually decreased. The decreasing amplitude of the distance between the square annular bands located in the central region is 2mm to 10mm, and the decreasing amplitude of the distance between the square annular bands located in the peripheral region is 0.1mm to 0.5 mm. Furthermore, the intersection of the two edges of the auxiliary thermal resistance strip 111' adopts fillet transition, so that the temperature accumulation caused by right angles is avoided. The auxiliary heating resistor strip that returns font trend can lay the auxiliary heating resistor strip of different density according to the backup pad with the distance of all ring edge borders, and the more effectual compensation is because the backup pad middle part temperature that the peripheral region of pressed plate and the more temperature that leads to of environment heat exchange is high, the problem that peripheral temperature is low. In another embodiment, the auxiliary thermal resistance strips 111 may also be arranged in a zigzag shape.
With continued reference to fig. 5, the laminate panel 100 further includes a temperature measuring unit 113. The temperature measuring unit 113 is used to measure the temperature of the laminate board 100, thereby feeding back the temperature to the main controller 300 of the laminating machine 500, so that the main controller 300 can form closed-loop control of heating according to the temperature of the laminate board 100.
The laminating machine provided by the application can be used for manufacturing printed circuit boards, including flexible circuit boards and traditional rigid circuit boards. The total resistance value of the auxiliary thermal resistance strip 111 is 0.1 Ω -10 Ω, preferably 1.5 Ω, 2.5 Ω.
In a specific application scenario, the main controller 300 may be a conventional PC computer. The hydraulic control device 220 is used for receiving a hydraulic pressure signal of the main controller 300 and controlling the hydraulic cylinder 210 to move according to the hydraulic pressure signal. Wherein the hydraulic cylinder 210 is a hydraulic cylinder. The laminate board 100 is the laminate board described in any of the embodiments described herein above, and is configured to receive the heating signal from the main controller 300 and control the heating of the laminate board 100 according to the heating signal. Wherein the heating signal is a heating current.
The specific heating process of the laminator 500 is: the main line 400 supplies a reliable power signal to the transformer 403, and the transformer 403 converts the input voltage signal into a voltage signal required by the hydraulic unit 200 and supplies the voltage signal to the hydraulic control device 220. The main controller 300 may output a specific control pattern or control curve of heating to the laminate 100, and the laminate 100 may heat according to the control pattern or temperature curve according to a change in current or voltage. Preferably, the temperature measuring unit 113 can feed back the real-time temperature of the laminated board 100 to the main controller 300, and the main controller 300 adjusts the control manner or the control curve according to the real-time temperature, thereby forming a closed-loop control on the laminated board 100.
Since the resistance value of the auxiliary thermal resistor strip 111 is small, referring to the above embodiment, approximately between 0.1 Ω -10 Ω, in order to prevent short circuit caused by excessive voltage, the main controller 300 further includes a voltage regulating unit for reducing the voltage to a safe range and preventing short circuit caused by excessive current flowing through the auxiliary thermal resistor strip 111.
In one embodiment, the main controller 300 adjusts the temperature profile of the laminate board 100 by controlling the on/off of the current. The laminate panel 100 has a target temperature curve, the target temperature curve is first raised and then stabilized at a set temperature value, and includes a raised temperature section and a stabilized temperature section, the main controller 300 controls the temperature of the laminate panel 100 to rise along the target temperature curve by controlling the on/off of the current, when the temperature is higher than the target temperature curve, the current of the auxiliary heating resistor strip 111 is cut off, and when the detected temperature is lower than the target temperature curve, the auxiliary heating resistor strip 111 is switched on, so that the auxiliary heating resistor strip 111 is powered on, thereby heating and warming.
In another embodiment, the main controller 300 adjusts the temperature of the laminate board 100 by controlling the magnitude of the current. Specifically, when the temperature of the laminated board is higher than the optimal target temperature curve, the current of the auxiliary thermal resistance strip 111 is reduced, thereby reducing the heat generation amount of the auxiliary thermal resistance strip 111, and the heat dissipation of the laminated board is larger than the heat generation amount of the auxiliary thermal resistance strip 111, thereby decreasing the temperature and gradually approaching the target temperature curve. When the detected temperature is lower than the target temperature curve, the current flowing in the auxiliary heating resistor strip 111 is increased, so that heating is performed, the temperature of the laminated board is raised, and the temperature is gradually raised to the target temperature curve.
While the embodiments of the present application have been disclosed above, it is not limited to the applications listed in the description and the embodiments, which are fully applicable in a variety of fields suitable for this application, and further modifications will be readily apparent to those skilled in the art, and it is therefore not intended to be limited to the details shown and described herein without departing from the general concept defined by the appended claims and their equivalents.
Claims (10)
1. A laminating machine for the manufacture of circuit boards, said machine comprising:
a frame body having a press-fit chamber;
the laminated plate comprises a supporting plate and a heating structure arranged on the supporting plate, wherein the heating structure comprises an auxiliary heating resistor strip, and the auxiliary heating resistor strip is used for being communicated with a power supply to generate heat by utilizing circulating current;
the pressing plates comprise an upper pressing plate positioned at the top of the pressing chamber and a lower pressing plate positioned at the bottom of the pressing chamber, the upper pressing plate and the lower pressing plate are parallel to each other and are arranged oppositely, and a pressing space for pressing the circuit board is formed between the upper pressing plate and the lower pressing plate;
the auxiliary heating resistor strips are constructed into a preset shape and laid on the supporting plate, and the resistor distribution density of the auxiliary heating resistor strips in the middle area of the supporting plate is smaller than that of the auxiliary heating resistor strips in the peripheral area of the supporting plate.
2. A laminating machine as claimed in claim 1, wherein said laminate plates are two in number, being said upper laminate plate and said lower laminate plate, respectively;
the laminating machine further comprises a copper foil auxiliary heating sheet, the copper foil auxiliary heating sheet can be connected with a power supply to provide heating heat, the copper foil auxiliary heating sheet is arranged between the upper laminating plate and the lower laminating plate, the copper foil auxiliary heating sheet is constructed into a multi-folding structure and is provided with a plurality of folding sheets which are parallel to each other, and a space for accommodating the circuit board is formed between every two adjacent folding sheets.
3. A laminating machine as claimed in claim 1, wherein the number of said laminate panels is at least three, and at least three of said laminate panels are said upper laminate panel and said lower laminate panel, respectively, and n intermediate laminate panels disposed between said upper laminate panel and said lower laminate panel, where n is a positive integer greater than or equal to 1;
n pressfitting board placed in the middle go up the pressfitting board with all set up at intervals each other between the pressfitting board down to form n +1 pressfitting chamber, every pressfitting chamber is used for pressfitting one or polylith circuit board.
4. A laminating machine as claimed in claim 1, wherein said heating structures in said upper and lower laminating plates are provided on the plate surface of said support plate facing said laminating space.
5. A laminating machine as claimed in claim 3, wherein said centrally located laminating plate comprises said heating structures respectively provided on the upper and lower plate faces of said support plate.
6. A laminating machine as claimed in claim 1, characterised in that the auxiliary thermal resistance strips are peripherally coated with an insulating structure.
7. Laminating machine as claimed in claim 1 or 6, characterized in that the laminating board further comprises a protective cover covering the face of the support plate on which the heating structure is laid, the face of the protective cover facing the heating structure being provided with an insulating coating.
8. A laminating machine as claimed in claim 1, characterized in that the cross-sectional area of said auxiliary strips in the central region of said supporting plate is greater than the cross-sectional area of said auxiliary strips in the peripheral region of said supporting plate.
9. A laminating machine as claimed in claim 8, wherein said auxiliary strips are square in cross-section, said auxiliary strips being of uniform dimension in the thickness direction of said laminate, the width of said auxiliary strips in the central region of said support plate being greater than the width of said auxiliary strips in the peripheral region of said support plate.
10. A laminating machine as claimed in claim 9, characterized in that said supporting plate is provided with mounting slots running in line with said preset shape of said auxiliary thermal resistance strips, said auxiliary thermal resistance strips being embedded in said mounting slots.
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| CN202110259730.3A CN112867293A (en) | 2021-03-10 | 2021-03-10 | Pressing machine |
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| CN202110259730.3A CN112867293A (en) | 2021-03-10 | 2021-03-10 | Pressing machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114987031A (en) * | 2022-05-23 | 2022-09-02 | 广东骏亚电子科技股份有限公司 | Multilayer pressing manufacturing method |
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| CN208529912U (en) * | 2018-05-09 | 2019-02-22 | 秦皇岛可视自动化设备有限公司 | A kind of electric boiling plate being laminated host |
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