CN112864144A - Flexible LED packaging structure and manufacturing method thereof - Google Patents

Flexible LED packaging structure and manufacturing method thereof Download PDF

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Publication number
CN112864144A
CN112864144A CN202110244621.4A CN202110244621A CN112864144A CN 112864144 A CN112864144 A CN 112864144A CN 202110244621 A CN202110244621 A CN 202110244621A CN 112864144 A CN112864144 A CN 112864144A
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China
Prior art keywords
layer
flexible
led chips
grooves
polymer
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CN202110244621.4A
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Chinese (zh)
Inventor
孙德瑞
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Shandong Aotian Environmental Protection Technology Co ltd
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Shandong Aotian Environmental Protection Technology Co ltd
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Priority to CN202110244621.4A priority Critical patent/CN112864144A/en
Publication of CN112864144A publication Critical patent/CN112864144A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations

Abstract

The invention provides a flexible LED packaging structure and a manufacturing method thereof. The invention is additionally provided with the bottom filling layer or the filling layer, and the elastic modulus of the bottom filling layer or the filling layer is larger, so that the bonding reliability of the LED chip in bending is ensured.

Description

Flexible LED packaging structure and manufacturing method thereof
Technical Field
The invention relates to the field of integrated circuit packaging and manufacturing, in particular to a flexible LED packaging structure and a manufacturing method thereof.
Background
The conventional flexible LED package structure mostly adopts a COB structure (chip on board structure), referring to fig. 1, that is, a plurality of LED chips 4 are flip-mounted on a flexible circuit board by using solder balls 3, and then an encapsulation layer 4 is formed by injection molding, for such a line light source or a surface light source, when flexible bending is performed, joint portions (i.e., flip-mounted solder balls 3, etc.) of the plurality of LED chips may cause failure of electrical connection due to bending stress.
Disclosure of Invention
Based on solving the above problems, the present invention provides a flexible LED package structure, which includes:
a flexible wiring board including a wiring layer;
a reinforcement layer including a plurality of first polymer regions and a plurality of second polymer regions alternately arranged, the plurality of first polymer regions having a plurality of openings;
a plurality of LED chips electrically connected to the circuit layer through a plurality of solder balls disposed in the plurality of openings;
an underfill layer formed between the plurality of LED chips and the stiffener layer;
an encapsulation layer covering the plurality of LED chips and the reinforcement layer;
wherein the plurality of first polymeric regions comprise a first polymeric material and the plurality of second polymeric regions comprise a second polymeric material, the first polymeric material having a modulus of elasticity greater than the modulus of elasticity of the second polymeric material.
Further, the elastic modulus of the underfill layer is greater than the elastic modulus of the encapsulation layer.
Further, a light reflecting layer is arranged on the first polymer areas and is positioned under the LED chips.
According to the flexible LED package structure, the present invention further provides a method for manufacturing a flexible LED package structure, which includes:
(1) providing a flexible circuit board, wherein the flexible circuit board comprises a circuit layer; disposing a reinforcing layer on the flexible wiring board, the reinforcing layer including a plurality of first polymer regions and a plurality of second polymer regions alternately disposed, the plurality of first polymer regions having a plurality of openings; (ii) a
(2) Electrically connecting a plurality of LED chips to the circuit layer through a plurality of solder balls, wherein the plurality of solder balls are arranged in the plurality of openings; forming an underfill layer between the plurality of LED chips and a reinforcement layer;
(3) forming an encapsulation layer by injection molding, wherein the encapsulation layer covers the plurality of LED chips and the reinforcing layer;
wherein the plurality of first polymeric regions comprise a first polymeric material and the plurality of second polymeric regions comprise a second polymeric material, the first polymeric material having a modulus of elasticity greater than the modulus of elasticity of the second polymeric material.
Further, in step (1), a light reflecting layer is formed on the plurality of first polymer regions, the light reflecting layer is located right below the plurality of LED chips, and the light reflecting layer is a laminated aluminum foil layer.
Additionally, the present invention also provides another flexible LED package structure, which includes:
a flexible injection molded layer comprising a plurality of grooves in an upper surface thereof and a wiring layer within the plurality of grooves;
the reinforcing layer comprises a plurality of polymer areas which are arranged at intervals, and the polymer areas are embedded in the lower surface of the flexible injection molding layer and correspond to the upper positions and the lower positions of the grooves one by one;
a plurality of LED chips electrically connected to the wiring layer through a plurality of solder balls, and disposed in the plurality of grooves;
a filling layer formed in the plurality of grooves;
the projections of the LED chips on the reinforcing layer are all located in the reinforcing layer, and the elastic modulus of the reinforcing layer is larger than that of the flexible injection molding layer.
Further, the elastic modulus of the filling layer is larger than that of the flexible injection molding layer.
Further, a reflective layer is arranged on the plurality of polymer areas, and the reflective layer is a laminated aluminum foil layer.
According to the flexible LED package structure, the present invention further provides a method for manufacturing a flexible LED package structure, which includes:
(1) providing a temporary substrate, and pressing a reinforcing layer on the temporary substrate, wherein the reinforcing layer comprises a plurality of polymer areas which are arranged at intervals;
(2) injection molding a flexible injection molded layer on a temporary substrate, the flexible injection molded layer including a plurality of grooves on an upper surface thereof and a wiring layer within the plurality of grooves; the polymer areas are embedded in the lower surface of the flexible injection molding layer and correspond to the upper positions and the lower positions of the grooves one by one;
(3) fixing a plurality of LED chips in the grooves, wherein the LED chips are electrically connected to the circuit layer through a plurality of welding balls;
(4) forming a filling layer in the plurality of grooves, wherein the filling layer is formed in the plurality of grooves;
the projections of the LED chips on the reinforcing layer are all located in the reinforcing layer, and the elastic modulus of the reinforcing layer is larger than that of the flexible injection molding layer.
Further, the elastic modulus of the filling layer is larger than that of the flexible injection molding layer; and laminating an aluminum foil layer over the plurality of polymeric regions to form a retroreflective layer.
The invention has the following advantages:
the flexible LED packaging structure is provided with the reinforcing layer, and the elastic modulus of the reinforcing layer at the position of the LED chip is larger than the elastic modulus of the reinforcing layer at other positions, so that when the LED packaging structure is bent, the main bending position is not at the position of the LED chip. The invention is additionally provided with the bottom filling layer or the filling layer, and the elastic modulus of the bottom filling layer or the filling layer is larger, so that the bonding reliability of the LED chip in bending is ensured.
Drawings
FIG. 1 is a cross-sectional view of a prior art flexible LED package structure;
fig. 2 is a cross-sectional view of a flexible LED package structure according to a first embodiment of the present invention;
fig. 3-6 are schematic diagrams of a method for manufacturing a flexible LED package structure according to a first embodiment of the present invention;
fig. 7 is a cross-sectional view of a flexible LED package structure according to a second embodiment of the present invention;
fig. 8-12 are schematic diagrams of a method for manufacturing a flexible LED package structure according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
A flexible LED package structure according to the disclosed embodiments of the present invention will be described in detail with reference to the accompanying drawings.
First embodiment
Referring to fig. 2, the flexible LED package structure of this embodiment includes a flexible wiring board 11, and the flexible wiring board 11 has thereon a wiring layer for electrically connecting a plurality of LED chips 16. The flexible wiring board 11 may be in a strip shape or a plane shape to finally form a strip-shaped line light source or a plane to obtain a surface light source. The flexible wiring board 11 may be formed of a highly elastic material having a small elastic modulus, which may be the smallest in the package structure.
A reinforcing layer 12 is bonded to the flexible wiring board 11, and the thickness of the reinforcing layer 12 may be half the height of the solder balls 17. Wherein the reinforcing layer 12 includes a plurality of first polymer regions 13 and a plurality of second polymer regions 14 alternately arranged. The modulus of elasticity of the first polymer region 13 is large, but the first polymer region 13 is not a rigid material, and is a flexible and bendable material as is the flexible wiring board 11, the encapsulation layer 20, and the second polymer region 14.
In particular, the plurality of first polymeric regions 13 includes a first polymeric material and the plurality of second polymeric regions 14 includes a second polymeric material, the first polymeric material having a modulus of elasticity that is greater than a modulus of elasticity of the second polymeric material. Thus, the degree of bending of the second polymer region 14 is greater than that of the first polymer region 13 during bending, thereby protecting the bonding reliability of the bonding solder balls 17 of the plurality of LED chips 16.
The first polymer material and the second polymer material may be modified epoxy resin materials or rubber materials, for example, the elastic modulus of the first polymer material may be 2000-3000MPa, and the elastic modulus of the second polymer material may be 400-1000MPa, which may be achieved by adding additives such as plasticizers, curing agents or coupling agents to the annular resin material or rubber material.
Further, the first polymeric material and the second polymeric material may be selected from different matrix materials, for example the first polymeric material may be a modified epoxy material and the second polymeric material may be a modified rubber material.
A plurality of LED chips 16 are disposed directly above the plurality of first polymer regions 13, and the plurality of first polymer regions 13 have a plurality of openings 15. The LED chips 16 are respectively fixed directly above the first polymer regions 13 by a plurality of solder balls 17, wherein the solder balls 17 are respectively disposed in the openings 15. The plurality of openings 15 can ensure insulation between the solder balls 17.
A light-reflective layer 19 is also laminated to the first polymeric region 13, the light-reflective layer 19 being formed by laminating an aluminum foil layer to the first polymeric region 13. The aluminum foil layer can increase the tensile strength of the first polymer region 13 and further can also protect the bonding reliability of the solder ball 17. The light reflecting layer 19 is disposed right below the LED chip 16, and can improve the light extraction rate.
Further, an underfill layer 18 is disposed between the plurality of LED chips 16 and the plurality of first polymer regions 13. The elastic modulus of the underfill layer 18 may be greater than that of the encapsulation layer 20, thereby protecting the bonding reliability of the solder balls 17. The encapsulation layer 20 encapsulates the plurality of LED chips 16 and is also a polymeric, flexible material.
The host material of the encapsulation layer 20 and the underfill layer 18 may be the same, for example, both may be modified epoxy materials, but the modulus of elasticity of the first polymer regions 13 is greater than the modulus of elasticity of the encapsulation layer 20 and the underfill layer 18.
The manufacturing method of the flexible LED package structure can be seen in fig. 3 to 6, which includes:
referring to fig. 3, a flexible wiring board 11 is provided, the flexible wiring board 11 including a wiring layer (not shown). A reinforcing layer 12 is disposed on the flexible wiring board 11, and the reinforcing layer 12 includes a plurality of first polymer regions 13 and a plurality of second polymer regions 14 alternately disposed, and the plurality of first polymer regions 13 have a plurality of openings 15. The plurality of first polymeric regions 13 includes a first polymeric material and the plurality of second polymeric regions 14 includes a second polymeric material, the first polymeric material having a modulus of elasticity that is greater than the modulus of elasticity of the second polymeric material.
Referring to fig. 4, a light reflecting layer 19 is formed on the plurality of first polymer regions 13, the light reflecting layer 19 being directly under the plurality of LED chips 16, the light reflecting layer 19 being a laminated aluminum foil layer.
Referring to fig. 5, a plurality of LED chips 16 are electrically connected to the wiring layer through a plurality of solder balls 17, and the plurality of solder balls 17 are disposed in the plurality of openings 15; an underfill layer 18 is formed between the plurality of LED chips 16 and the stiffening layer 12.
Referring to fig. 6, an encapsulation layer 20 is injection molded, the encapsulation layer 20 covering the plurality of LED chips 16 and the reinforcement layer 12.
Second embodiment
Referring to fig. 7, the flexible LED package structure of this embodiment includes a flexible injection molding layer 21, the upper surface of the flexible injection molding layer 21 has a plurality of grooves 24, the plurality of grooves 24 have a circuit layer (not shown) therein, and the plurality of grooves 24 are bowl-shaped. The flexible injection molding layer 21 can be in a strip shape or a plane shape, so as to finally form a strip-shaped linear light source or a plane to obtain a surface light source. The flexible injection molded layer 21 may be formed of a highly elastic material having a small elastic modulus, which may be the smallest in the package structure.
A reinforcing layer 22 is embedded in the lower surface of the flexible injection molding layer 21, the reinforcing layer 22 comprises a plurality of polymer areas which are arranged at intervals, and the plurality of polymer areas are embedded in the lower surface of the flexible injection molding layer 21 and are in one-to-one correspondence with the plurality of grooves 24 in the vertical direction. The modulus of elasticity of the reinforcement layer 22 is relatively large, and similarly to the first embodiment, the reinforcement layer 22 is not a rigid material, but is a flexible and bendable material, as are the flexible injection molded layer 21 and the filler layer 27.
In particular, the reinforcing layer 22 has a modulus of elasticity greater than the modulus of elasticity of the flexible injection molded layer 21. Thus, the degree of bending of the flexible injection-molded layer 21 is greater than that of the reinforcing layer 22 during bending, thereby protecting the bonding reliability of the bonding solder balls 17 of the plurality of LED chips 26.
The material of the reinforcing layer 22 and the material of the flexible injection molding layer 21 may be modified epoxy resin material or rubber material, for example, the elastic modulus of the reinforcing layer 22 may be 2000-3000MPa, and the elastic modulus of the flexible injection molding layer may be 400-1000MPa, which may be realized by adding additives such as plasticizer, curing agent or coupling agent to the annular resin material or rubber material.
In addition, the material of the reinforcement layer 22 and the material of the flexible injection-molded layer 21 may be selected from different base materials, for example, the material of the reinforcement layer 22 may be a modified epoxy resin material, and the material of the flexible injection-molded layer 21 may be a modified polyethylene material.
The plurality of LED chips 25 are respectively fixed in the plurality of recesses 24 by a plurality of solder balls 26, wherein the plurality of solder balls 17 are electrically connected to the wiring layer in the plurality of recesses 24.
A retroreflective layer 23 is also laminated to the reinforcing layer 22, the retroreflective layer 23 being formed by laminating an aluminum foil layer to the reinforcing layer 22. The aluminum foil layer may increase the tensile strength of the reinforcement layer 22 and may further serve to protect the reliability of the bonding of the solder balls 26. The reflecting layer 23 is disposed right below the LED chip 25, and can improve the light extraction rate.
Further, a filling layer 27 sealing the plurality of LED chips 25 is also provided in the groove 24. The elastic modulus of the filling layer 27 may be greater than that of the flexible injection molding layer 21, so as to protect the bonding reliability of the solder balls 26. The host material of the filler layer 27 may be the same, for example, both may be modified epoxy materials.
The manufacturing method of the flexible LED package structure can be seen in fig. 8 to 12, which includes:
referring to fig. 8, a temporary substrate 30 is provided, and a reinforcing layer 22 is pressed on the temporary substrate 30, wherein the reinforcing layer 22 includes a plurality of polymer areas arranged at intervals; a layer of aluminum foil is laminated over the plurality of polymeric regions to form the retroreflective layer 23.
Referring to fig. 9, a flexible injection-molded layer 21 is injection-molded on a temporary substrate 30, the flexible injection-molded layer 21 including a plurality of grooves 24 on an upper surface thereof and a wiring layer in the plurality of grooves 24; the polymer areas are embedded in the lower surface of the flexible injection molding layer 21 and correspond to the upper positions and the lower positions of the grooves 24 in a one-to-one mode; wherein the elastic modulus of the reinforcing layer 22 is larger than that of the flexible injection molding layer 21.
Referring to fig. 10, a plurality of LED chips 25 are fixed in the plurality of grooves 24, and the plurality of LED chips 25 are electrically connected to the wiring layer through a plurality of solder balls 26; the plurality of LED chips 25 are positioned within the reinforcing layer 22 in projection on the reinforcing layer 22,
referring to fig. 11, a filling layer 27 is formed within the plurality of grooves 24, the filling layer 27 being formed in the plurality of grooves 24; the modulus of elasticity of the filler layer 27 is greater than the modulus of elasticity of the flexible injection molded layer 21.
The flexible LED packaging structure is provided with the reinforcing layer, and the elastic modulus of the reinforcing layer at the position of the LED chip is larger than the elastic modulus of the reinforcing layer at other positions, so that when the LED packaging structure is bent, the main bending position is not at the position of the LED chip. The invention is additionally provided with the bottom filling layer or the filling layer, and the elastic modulus of the bottom filling layer or the filling layer is larger, so that the bonding reliability of the LED chip in bending is ensured.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.

Claims (10)

1. A flexible LED package structure, comprising:
a flexible wiring board including a wiring layer;
a reinforcement layer including a plurality of first polymer regions and a plurality of second polymer regions alternately arranged, the plurality of first polymer regions having a plurality of openings;
a plurality of LED chips electrically connected to the circuit layer through a plurality of solder balls disposed in the plurality of openings;
an underfill layer formed between the plurality of LED chips and the stiffener layer;
an encapsulation layer covering the plurality of LED chips and the reinforcement layer;
wherein the plurality of first polymeric regions comprise a first polymeric material and the plurality of second polymeric regions comprise a second polymeric material, the first polymeric material having a modulus of elasticity greater than the modulus of elasticity of the second polymeric material.
2. The flexible LED package structure of claim 1, wherein: the elastic modulus of the underfill layer is greater than the elastic modulus of the encapsulation layer.
3. The flexible LED package structure of claim 1, wherein: and a light reflecting layer is also arranged on the first polymer areas and is positioned under the LED chips.
4. A method of manufacturing a flexible LED package structure, comprising:
(1) providing a flexible circuit board, wherein the flexible circuit board comprises a circuit layer; disposing a reinforcing layer on the flexible wiring board, the reinforcing layer including a plurality of first polymer regions and a plurality of second polymer regions alternately disposed, the plurality of first polymer regions having a plurality of openings; (ii) a
(2) Electrically connecting a plurality of LED chips to the circuit layer through a plurality of solder balls, wherein the plurality of solder balls are arranged in the plurality of openings; forming an underfill layer between the plurality of LED chips and a reinforcement layer;
(3) forming an encapsulation layer by injection molding, wherein the encapsulation layer covers the plurality of LED chips and the reinforcing layer;
wherein the plurality of first polymeric regions comprise a first polymeric material and the plurality of second polymeric regions comprise a second polymeric material, the first polymeric material having a modulus of elasticity greater than the modulus of elasticity of the second polymeric material.
5. The manufacturing method of the flexible LED packaging structure according to claim 4, wherein: in step (1), a light reflecting layer is formed on the first polymer regions, the light reflecting layer is located right below the LED chips, and the light reflecting layer is a laminated aluminum foil layer.
6. A flexible LED package structure, comprising:
a flexible injection molded layer comprising a plurality of grooves in an upper surface thereof and a wiring layer within the plurality of grooves;
the reinforcing layer comprises a plurality of polymer areas which are arranged at intervals, and the polymer areas are embedded in the lower surface of the flexible injection molding layer and correspond to the upper positions and the lower positions of the grooves one by one;
a plurality of LED chips electrically connected to the wiring layer through a plurality of solder balls, and disposed in the plurality of grooves;
a filling layer formed in the plurality of grooves;
the projections of the LED chips on the reinforcing layer are all located in the reinforcing layer, and the elastic modulus of the reinforcing layer is larger than that of the flexible injection molding layer.
7. The flexible LED package structure of claim 6, wherein: the elastic modulus of the filling layer is larger than that of the flexible injection molding layer.
8. The flexible LED package structure of claim 6, wherein: and a light reflecting layer is also arranged on the polymer areas and is a pressed aluminum foil layer.
9. A method of manufacturing a flexible LED package structure, comprising:
(1) providing a temporary substrate, and pressing a reinforcing layer on the temporary substrate, wherein the reinforcing layer comprises a plurality of polymer areas which are arranged at intervals;
(2) injection molding a flexible injection molded layer on a temporary substrate, the flexible injection molded layer including a plurality of grooves on an upper surface thereof and a wiring layer within the plurality of grooves; the polymer areas are embedded in the lower surface of the flexible injection molding layer and correspond to the upper positions and the lower positions of the grooves one by one;
(3) fixing a plurality of LED chips in the grooves, wherein the LED chips are electrically connected to the circuit layer through a plurality of welding balls;
(4) forming a filling layer in the plurality of grooves, wherein the filling layer is formed in the plurality of grooves;
the projections of the LED chips on the reinforcing layer are all located in the reinforcing layer, and the elastic modulus of the reinforcing layer is larger than that of the flexible injection molding layer.
10. The method of manufacturing a flexible LED package structure according to claim 9, wherein: the elastic modulus of the filling layer is greater than that of the flexible injection molding layer; and laminating an aluminum foil layer over the plurality of polymeric regions to form a retroreflective layer.
CN202110244621.4A 2021-03-05 2021-03-05 Flexible LED packaging structure and manufacturing method thereof Withdrawn CN112864144A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110244621.4A CN112864144A (en) 2021-03-05 2021-03-05 Flexible LED packaging structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110244621.4A CN112864144A (en) 2021-03-05 2021-03-05 Flexible LED packaging structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN112864144A true CN112864144A (en) 2021-05-28

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Country Status (1)

Country Link
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