CN112847694B - Glue-free transverse splicing and compacting equipment and glue-free transverse splicing and compacting method - Google Patents
Glue-free transverse splicing and compacting equipment and glue-free transverse splicing and compacting method Download PDFInfo
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- CN112847694B CN112847694B CN201911193101.4A CN201911193101A CN112847694B CN 112847694 B CN112847694 B CN 112847694B CN 201911193101 A CN201911193101 A CN 201911193101A CN 112847694 B CN112847694 B CN 112847694B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/08—Manufacture of shaped articles; Presses specially designed therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/10—Butting blanks of veneer; Joining same along edges; Preparatory processing of edges, e.g. cutting
Abstract
The invention relates to a glue-free transverse splicing and compacting device and a glue-free transverse splicing and compacting method, which at least comprise the following steps: (1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate; (2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa; (3) heating the arrangement plate to 60-150 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min; (4) keeping F2 unchanged, increasing F1 to F3, wherein F3 is 2.5-4MPa, and keeping the pressure until the temperature of the alignment plate is lower than 40 ℃; the preparation method provided by the invention is simple and practical, the dipping stripping performance and the surface bonding strength of the prepared board can be obviously improved, and two adjacent boards of the board prepared by the method are not easy to separate or crack and are firmly spliced.
Description
Technical Field
The invention belongs to the technical field of wood board processing, and particularly relates to glue-free transverse splicing and compacting equipment and a glue-free transverse splicing and compacting method.
Background
The existing wood is usually needed to be spliced for use because of low density, for example, the conventional plywood is a three-layer or multi-layer plate-shaped material formed by rotary cutting or slicing wood segments into thin wood and then gluing the thin wood by using an adhesive, although the thickness of the plywood is increased, the density of the plywood is still not changed, the performance of each parameter is poorer, the large wood boards are compacted in the prior art to improve the density of the wood boards and the performance of each aspect of the wood boards, but the technology is more suitable for large complete wood boards, other small wood boards such as leftover materials and the like are difficult to utilize, the application range can be improved unless a plurality of small wood boards are compacted and then spliced, but the spliced wood boards are difficult to splice, two adjacent wood boards are separated or cracked after splicing, and the splicing is not firm, for example, the bamboo transverse splicing plate structure provided by the Chinese patent CN203331154U comprises an upper transverse splicing plate layer, Sandwich layer, lower horizontal makeup board layer, although this horizontal makeup board can utilize the horizontal makeup board of bamboo material, still need in the preparation process with the help of massive wooden veneer.
Disclosure of Invention
In order to solve the technical problems, the invention provides glue-free transverse splicing and compacting equipment and a glue-free transverse splicing and compacting method.
The specific technical scheme of the invention is as follows:
the invention provides a glue-free transverse splicing and compacting device and a glue-free transverse splicing and compacting method, wherein the method at least comprises the following steps:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa;
(3) heating the arrangement plate to 60-170 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min;
(4) f1 was increased to F3 with F3 at 2.5-4MPa and the pressure was maintained until the temperature of the alignment plate reached 40-70 ℃ while keeping F2 constant.
Wherein, the plane of the step (1) is the plane of the compaction equipment contacted with the transverse splicing plate; the heating in the invention refers to heating by high frequency, the transverse spliced board is preferably compacted wood, and the density of the compacted wood is 0.7g/cm3-1.25g/cm3The resin film comprises any one or a mixture of more of ethylene-vinyl acetate copolymer or polyolefin material, the polyolefin material is any one or a mixture of at least two of polyethylene, polypropylene, modified polyethylene, modified polypropylene or ethylene elastomer containing ethylene units, such as VYLON GM920 resin film with the thickness of 50 μ M, VYLON GM 420K 01 resin film with the thickness of 30 μ M and Toyo takku M310 resin film with the thickness of 100 μ M; f2 and F3 can apply pressure simultaneously or F2 is applied and then F3 is applied according to specific needs; according to the invention, the transverse splicing plates are arranged firstly, and then F1, heating, F2 and F3 are respectively applied, so that the dipping stripping performance and the surface bonding strength of the prepared board can be obviously improved, two adjacent wood plates are not easy to separate or crack, and the splicing is firm.
Further, the arrangement board is pre-pressed and preheated before being heated to 60-170 ℃, wherein the pre-pressing is to apply pre-pressing force F0 in the horizontal direction of the arrangement board, the F0 is 0.1-0.2MPa, then the pre-heating is carried out, the preheating temperature is 50-55 ℃, the holding temperature is 12-20min, the thickness of the resin film is 0.1-0.38mm, and the using amount of the resin film is 14-18g/m2。
Further, the side wall of the transverse spliced plate in contact with the resin film has a roughness of 0.2 to 0.5 μm.
The method limits the roughness of the side walls of two adjacent transverse jointed boards, fully contacts the resin film with the arrangement board during prepressing, keeps for 12-20 minutes after preheating, and further fully contacts the resin film which is just melted with the arrangement board, thereby reducing the dropping rate of the resin film and further improving the dipping stripping performance and the surface bonding strength of the prepared board.
Furthermore, all the transverse jointed boards in the arrangement boards are arranged in parallel, and the included angle alpha between the side wall of the transverse jointed board, which is contacted with the resin film, and the horizontal plane meets the condition that the angle alpha is more than 86 degrees and less than 90 degrees.
According to the invention, the included angle between the side wall of the horizontal jointed board in contact with the resin film and the horizontal plane is limited, so that an upward gap is formed between two adjacent horizontal jointed boards in the arrangement board, and when F3 is applied, because the bottoms of the two adjacent horizontal jointed boards are in contact, the melted resin film can be prevented from dripping from the bottom.
Furthermore, one end or two ends of the horizontal jointed board are also provided with a longitudinal jointed board, a resin film is arranged between the horizontal jointed board and the longitudinal jointed board, and the grain directions of the horizontal jointed board and the longitudinal jointed board are the same.
Because the line direction of horizontal makeup and vertical makeup is the same, but perpendicular setting, consequently the flexible direction looks of the two when being heated or weing is mutually perpendicular, can show the stability that improves monoblock panel.
Furthermore, the included angles theta between all the transverse jointed boards in the arrangement board and the horizontal plane all meet the conditions that the angle theta is more than 20 degrees and less than 70 degrees, the heating temperature of the arrangement board is 130 ℃ and 150 degrees, the temperature rising speed is 10-15 ℃/s, and the dosage of the resin film is 8-10g/m2。
Due to the diversity of the requirements of the spliced plates, the oblique splicing brings better mechanical effect, and the fixed blocks positioned on the left side and the right side can be spliced in two oblique directions (with an included angle of 90 degrees) under the condition of only applying a force without improving splicing equipment.
Further, all the transverse splicing plates in the arrangement plate are evenly divided into a plurality of groups, the angle between two adjacent groups of transverse splicing plates is 90 degrees, the heating temperature of the arrangement plate is 130-150 ℃, and the temperature rising speed is 150 DEG10-15 ℃/s, and the dosage of the resin film is 12-15g/m2。
The invention is defined above, and the prepared plates all have specific shapes.
Further, the alignment plate is pressed at 10-80 ° to the horizontal plane.
The invention can facilitate the discharge of moisture when the moisture content is higher and ensure that the resin adhesive is adhered to the inclined slope surface through the limitation, and the control device can be arranged at the rear part of the hot press, so that the machine saves more space and is convenient to arrange.
The invention also provides another glue-free transverse splicing and compacting device which comprises a first pressing device for applying a first acting force F1 in the horizontal direction of the arrangement plate, a high-frequency heating device and a second pressing device for applying a second acting force F2 in the vertical direction of the arrangement plate.
The preparation method provided by the invention is simple and practical, and can obviously improve the dipping stripping performance and the surface bonding strength of the prepared board.
Drawings
FIG. 1 is a schematic view of the structure of an alignment plate according to example 4;
FIG. 2 is a partial sectional view of an alignment plate according to example 7;
FIG. 3 is a sectional view of an alignment plate according to example 10;
FIG. 4 is a sectional view of an alignment plate of example 12;
FIG. 5 is a cross-sectional view of an alignment plate of example 13;
FIG. 6 is a cross-sectional view of an alignment plate of example 17
FIG. 7 is a sectional view of an alignment plate of example 18;
FIG. 8 is a schematic structural view of a glueless cross-sectional compaction apparatus according to example 19;
FIG. 9 is a schematic structural view of the glueless cross-sectional compaction apparatus of example 19;
FIG. 10 is a schematic view of the structure of the glueless cross-sectional compacting apparatus according to example 20.
The device comprises a lower pressing plate 1, an upper pressing plate 2, a lower backing plate 4, an upper backing plate 5, a hydraulic rod 6, a first electric telescopic rod 7, a second electric telescopic rod 8, a convex edge 9, a transverse splicing plate 30, a resin film 31, a longitudinal splicing plate 32, an upper pressing plate 33, a lower pressing plate 34, a left pressing plate 35 and a right pressing plate 36, wherein expansion multiples of all the drawings are different for convenience of viewing.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings.
Examples 1 to 3
Examples 1-3 provide a glueless cross-sectional compaction apparatus and a glueless cross-sectional compaction method comprising the steps of:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa;
(3) heating the arrangement plate to 60-170 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min;
(4) keeping F2 unchanged, increasing F1 to F3, wherein F3 is 2.5-4MPa, and keeping the pressure until the temperature of the alignment plate reaches 60 ℃;
the densified wood of examples 1 to 3 was densified with poplar, and the density after densification was 0.8g/cm3The specific parameters of the sheet preparation methods of examples 1-3 are shown in Table 1.
TABLE 1 specific parameters of examples 1-3
Wherein, the included angle 1(°) refers to the included angle between the contact surface of two adjacent horizontal jointed boards and the horizontal plane; the roughness refers to the roughness of the side wall of the transverse jointed board contacted with the resin film.
Examples 4 to 6
Examples 4-6 provide a glueless cross-sectional compaction apparatus and a glueless cross-sectional compaction method, the method comprising at least the steps of:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa;
(3) heating the arrangement plate to 60-170 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min;
(4) keeping F2 unchanged, increasing F1 to F3, wherein F3 is 2.5-4MPa, and keeping the pressure until the temperature of the alignment plate reaches 40 ℃;
wherein, the arranging plate is pre-pressed and preheated before being heated to 60-170 ℃, the pre-pressing is to apply pre-pressing force F0 in the horizontal direction of the arranging plate, the F0 is 0.1-0.2MPa, and then the preheating is carried out, the preheating temperature is 50-55 ℃, the holding temperature is 12-20min, the thickness of the resin film is 0.14-0.38mm, and the dosage of the resin film is 14-18g/m2；
Wherein the roughness of the side wall of the transverse splicing plate contacted with the resin film is 0.2-0.5 μm;
as shown in FIG. 1, the horizontal split plates are arranged in parallel;
examples 4 to 6 all used poplar for compacting, and the density after compacting was 0.8g/cm3The specific parameters of the sheet preparation methods of examples 4-6 are shown in Table 2.
TABLE 2 concrete parameters of examples 4 to 6
Wherein, the included angle 1(°) refers to the included angle between the contact surface of two adjacent horizontal jointed boards and the horizontal plane; the roughness refers to the roughness of the side wall of the transverse jointed board contacted with the resin film.
Examples 7 to 11
As shown in fig. 2-3, examples 7-11 provide a glueless cross-sectional compaction apparatus and a glueless cross-sectional compaction method, comprising at least the steps of:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa;
(3) heating the arrangement plate to 60-170 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min;
(4) keeping F2 unchanged, increasing F1 to F3, wherein F3 is 2.5-4MPa, and keeping the pressure until the temperature of the alignment plate reaches 70 ℃;
wherein, all the transverse jointed boards in the arrangement boards are arranged in parallel, and the included angle alpha between the side wall of the transverse jointed board, which is contacted with the resin film, and the horizontal plane meets the condition that the angle alpha is more than 86 degrees and less than 90 degrees;
wherein, one end or two ends of the horizontal jointed board are also provided with a longitudinal jointed board, a resin film is arranged between the horizontal jointed board and the longitudinal jointed board, and the grain directions of the horizontal jointed board and the longitudinal jointed board are the same;
examples 7 to 11 were all made by compacting poplar, the density after compacting being 0.8g/cm3The specific parameters of the methods for making the sheets of examples 7-11 are set forth in Table 3.
TABLE 3 concrete parameters of examples 7 to 11
Wherein, the included angle 1(°) refers to the included angle between the contact surface of two adjacent horizontal jointed boards and the horizontal plane; the grain direction of the horizontal jointed board is the same as that of the vertical jointed board.
Examples 12 to 16
As shown in fig. 4-6, examples 12-16 provide a glueless cross-sectional compaction apparatus and a glueless cross-sectional compaction method that includes at least the steps of:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa;
(3) heating the arrangement plate to 60-170 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min;
(4) keeping F2 unchanged, increasing F1 to F3, wherein F3 is 2.5-4MPa, and keeping the pressure until the temperature of the alignment plate reaches 60 ℃;
wherein the included angles theta between all the transverse jointed boards in the arrangement board and the horizontal plane all satisfy 20 degrees < theta < 70 degrees, the heating temperature of the arrangement board is 130-150 ℃, the temperature rising speed is 10-15 ℃/s, and the dosage of the resin film is 8-10g/m2；
Wherein the arrangement plate is pressed at an angle of 10-80 ° to the horizontal plane.
Examples 12 to 16 all used poplar for compacting, and the density after compacting was 0.8g/cm3The specific parameters of the methods for making the sheets of examples 12-16 are set forth in Table 4.
TABLE 4 concrete parameters of examples 12 to 16
Example 17
As shown in fig. 7, the present embodiment provides a glue-free cross-splicing and compacting apparatus and a glue-free cross-splicing and compacting method, the method at least includes the following steps:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5 MPa;
(3) heating the arrangement plate to 60 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is 0.7MPa, and keeping the pressure for 8 min;
(4) increasing the pressure of F1 to F3 with F3 at 2.5MPa, maintaining the pressure until the temperature of the alignment plate reaches 60 ℃ while keeping F2 unchanged;
wherein, all transverse splicing plates in the arrangement plate are equally divided into a plurality of groups, the angle between two adjacent groups of transverse splicing plates is 90 degrees, the heating temperature of the arrangement plate is 140 degrees, the heating rate is 12 degrees centigrade per second, the dosage of the resin film is 13g/m2。
Example 18
The embodiment provides a glue-free compacting device, as shown in fig. 8, the glue-free compacting device comprises a lower press plate 1, an upper press plate 2, a high-frequency heating device, a hydraulic device and a control device for controlling the upper press plate 2 to move repeatedly towards the lower press plate 1, wherein a lower backing plate 4 is arranged on the upper surface of the lower press plate 1, an upper backing plate 5 parallel to the lower backing plate 4 is arranged on the lower surface of the upper press plate 2, a baffle strip 10 is arranged on the upper surface of the lower press plate 1, and a hydraulic rod 6 of the hydraulic device moves repeatedly relative to the baffle strip 10;
the high-frequency heating device is used for heating, and is the prior art, the embodiment is not particularly limited, the control device is also the prior art, the barrier strip is fixedly connected with the lower pressing plate, and the hydraulic device is fixedly connected with the side wall of the lower pressing plate; according to the invention, through the arrangement, the horizontal direction pressure and the vertical direction pressure can be simultaneously applied to the transverse spliced plates to be processed, so that the prepared plates are more stable and are not easy to crack, and a resin film is required to be placed between two adjacent transverse spliced plates when the plate is used.
Example 19
As shown in fig. 9, the present embodiment provides a non-adhesive compacting apparatus, which is different from embodiment 1 in that the upper surface of the lower mat 4 is 30 ° from the horizontal plane, and the upper surface of the bottom end of the lower mat 4 is provided with a protruding ridge 9.
According to the invention, the upper surface of the lower backing plate is 30 degrees to the horizontal plane, and the convex edge is arranged, so that the equipment provided by the embodiment can omit a hydraulic device, simplify the equipment complexity, and has a better splicing effect compared with the conventional equipment.
Example 20
The embodiment provides a no glue compacting device, and the difference with embodiment 1 is that, as shown in fig. 10, an upper backing plate 4 is connected with one end shaft of an upper pressing plate 2, the other end is connected through a first electric telescopic rod 7, a lower backing plate 5 is connected with one end shaft of a lower pressing plate 1, and the other end is connected through a second electric telescopic rod 8.
This embodiment is through setting up first electric telescopic handle and second telescopic link, make this equipment can adjust the angle that is between lower bolster and upper bolster and the horizontal plane according to specific needs (like the thickness of violently piecing together), during the use, will keep away from the distance adjustment that shelves strip one end top board and lower press plate between to being less than and being close to the distance that shelves strip one end top board and lower press plate between, make violently piece together the board when receiving the power of upper and lower direction, can not disperse to left and right directions, the panel that the equipment that makes of embodiment 1 prepared is more firm, difficult fracture.
Comparative examples 1 to 3
Comparative examples 1 to 3 provide a non-adhesive cross-sectional compaction apparatus and a non-adhesive cross-sectional compaction method, and the following methods are different from examples 1 to 3 in the parameters, and specific parameters are shown in table 5.
TABLE 5 concrete parameters of comparative examples 1 to 3
Comparative examples 4 to 6
Comparative examples 4 to 6 provide a glueless cross-sectional compacting apparatus and a glueless cross-sectional compacting method, and the following methods are different from examples 4 to 6 in terms of parameters, and specific parameters are shown in table 6.
TABLE 6 concrete parameters of comparative examples 4 to 6
Comparative examples 7 to 9
Comparative examples 7 to 9 provide a glueless cross-sectional compacting apparatus and a glueless cross-sectional compacting method, and the following methods are different from examples 12 to 14 in the parameters, and specific parameters are shown in Table 7.
TABLE 7 concrete parameters of comparative examples 7 to 9
Test example 1 test of impregnation peeling property and surface adhesion Strength
The boards of examples 1-6 and comparative examples 1-6 and the control (bamboo crosscut board structure provided by chinese patent CN 203331154U) were tested for peel strength and surface bond strength using a UH4204 wood tester according to the requirements of the national standard GB/T5849-2006, and five replicates of each group were tested, and the results were averaged and are shown in table 8.
TABLE 8 test results of the peel strength and surface bond strength of each group of plates
As can be seen from Table 8, the sheets prepared by the methods provided in examples 1-3 of the present invention have good impregnation stripping performance, high surface bonding strength, and higher effect than the control group, comparative examples 1 to 3, in which a certain step in the method of the present invention was deleted or modified, respectively, the impregnation-peeling properties of the resulting board were all lowered, and the surface adhesive strength was all lowered, as can be seen from examples 4 to 6, when the arrangement board was pre-pressed and preheated, the impregnation peel property and the surface adhesion strength thereof were further increased, while comparative examples 4 to 6 respectively deleted a certain step in the method of the present invention or modified certain parameters, compared with the examples 4-6, the impregnation stripping performance and the surface bonding strength of the board are reduced, so that the impregnation stripping performance and the surface bonding strength of the board can be obviously improved by the method provided by the invention.
Test example 2 measurement of dropping Rate
Plates were prepared by the methods of examples 4 to 9 and comparative examples 4 to 6, the mass of the resin film dropped during the preparation of each group of plates was collected, and the dropping rate (%) of the resin film during the preparation of each group of plates, which is the dropping mass of the resin film/the amount of resin film used during the preparation of the plates × 100%, was calculated, and five replicates for each group were averaged, and the test results are shown in table 9.
TABLE 9 brittleness measurement test results for each set of sheets
| Group of | Percentage of dripping (%) |
| Example 4 | 2.6 |
| Example 5 | 3.1 |
| Example 6 | 2.4 |
| Example 7 | 0 |
| Example 8 | 0 |
| Example 9 | 0 |
| Comparative example 4 | 36.3 |
| Comparative example 5 | 29.6 |
| Comparative example 6 | 31.7 |
As can be seen from table 9, the dropping rate of the sheet prepared by the method provided by the present invention is lower than that of the control group, while the control example deletes or modifies some steps or parameters of the method provided by the present invention, respectively, and the dropping rate of the resin film is higher during the process of preparing the sheet, thereby causing the impregnation peeling performance and the surface bonding strength of the prepared sheet to be reduced.
Test example 3 dimensional stability test
The boards prepared by the methods of examples 7 to 11 were subjected to a heat-resistant and moisture-resistant dimensional stability test using GB/T35913-2018 requirements for solid wood flooring for floor heating, while measuring changes in length and width, with three parallel samples for each group, and the test results are shown in Table 10.
TABLE 10 results of dimensional stability test
As can be seen from Table 10, examples 10 to 11 of the present invention can significantly improve the dimensional stability of the boards by providing the longitudinal jointed boards, and examples 7 to 9, which do not provide the longitudinal jointed boards, show that the dimensional stability of the boards obtained is lower than that of examples 10 to 11.
The above examples are merely illustrative of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (7)
1. A glue-free transverse splicing and compacting method is characterized by at least comprising the following steps:
(1) arranging a plurality of transverse splicing plates on a plane in sequence, clamping a resin film between every two adjacent transverse splicing plates, and making the contact surfaces of the two adjacent transverse splicing plates form an angle of 45-135 degrees with the plane to obtain an arrangement plate;
(2) applying a first acting force F1 in the horizontal direction of the arrangement plate, wherein F1 is 1.5-2 MPa;
(3) heating the arrangement plate to 60-170 ℃, applying a second acting force F2 in the vertical direction of the arrangement plate, wherein F2 is not less than 0.7MPa, and keeping the pressure for 8-10 min;
(4) f1 was increased to F3 with F3 at 2.5-4MPa and the pressure was maintained until the temperature of the alignment plate reached 40-70 ℃ while keeping F2 constant.
2. The method of claim 1, wherein the arrangement board is pre-pressed and pre-heated before being heated to 60-170 ℃, the pre-pressing is performed by applying a pre-pressing force F0 in the horizontal direction of the arrangement board, the F0 is 0.1-0.2MPa, and then the arrangement board is pre-heated, the pre-heating temperature is 50-55 ℃, the holding temperature is 12-20min, the thickness of the resin film is 0.1-0.38mm, and the dosage of the resin film is 14-18g/m2。
3. The method of claim 2, wherein the roughness of the side wall of the horizontal split plate contacting the resin film is 0.2-0.5 μm.
4. The glueless cross-sectional packing method of claim 1, wherein all of said cross sectional boards in said aligned boards are juxtaposed, and an angle α between a side wall of said cross sectional board in contact with said resin film and a horizontal plane satisfies 86 ° < α < 90 °.
5. The method of claim 1, wherein a longitudinal panel is further provided at one or both ends of the transverse panel, a resin film is provided between the transverse panel and the longitudinal panel, and the transverse panel and the longitudinal panel have the same grain direction.
6. The glue-free transverse splicing and compacting method as claimed in claim 1, wherein the included angles θ between all the transverse splicing plates in the arrangement plate and the horizontal plane all satisfy 20 ° < θ < 70 °, the heating temperature of the arrangement plate is 130-2。
7. The glue-free cross-sectional packing method of claim 1, wherein the alignment plate is pressed at an angle of 10-80 ° to the horizontal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911193101.4A CN112847694B (en) | 2019-11-28 | 2019-11-28 | Glue-free transverse splicing and compacting equipment and glue-free transverse splicing and compacting method |
| JP2020002157A JP6928393B2 (en) | 2019-11-28 | 2020-01-09 | Adhesive-free horizontal joint consolidation equipment and non-adhesive horizontal joint consolidation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911193101.4A CN112847694B (en) | 2019-11-28 | 2019-11-28 | Glue-free transverse splicing and compacting equipment and glue-free transverse splicing and compacting method |
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| Publication Number | Publication Date |
|---|---|
| CN112847694A CN112847694A (en) | 2021-05-28 |
| CN112847694B true CN112847694B (en) | 2022-05-03 |
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| CN201911193101.4A Active CN112847694B (en) | 2019-11-28 | 2019-11-28 | Glue-free transverse splicing and compacting equipment and glue-free transverse splicing and compacting method |
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| CN114012843A (en) * | 2021-11-22 | 2022-02-08 | 怀化大隆农业科技有限公司 | Processing and forming method of bamboo jointed board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205272798U (en) * | 2015-12-30 | 2016-06-01 | 常成 | A high -frequency heating hydraulic press for wood wall body veneer |
| CN106891396A (en) * | 2017-04-24 | 2017-06-27 | 福州翰扬环保科技有限公司 | It is a kind of to use the technique for producing little compressible glued board without aldehyde hot melt adhesive film |
| JP2018149745A (en) * | 2017-03-13 | 2018-09-27 | 地方独立行政法人北海道立総合研究機構 | Manufacturing method of woody composite board |
| CN109454721A (en) * | 2018-12-21 | 2019-03-12 | 王凯 | Based on high frequency without the close equipment of glue laminated |
| CN109514659A (en) * | 2018-12-30 | 2019-03-26 | 南京林业大学 | A kind of short and small lath automatic ration gluing assembling unit and gluing board joint method |
| CN109834776A (en) * | 2019-03-11 | 2019-06-04 | 王凯 | A kind of wood fragments densification material and method based on high frequency without glue laminated secret skill art |
| CN109877929A (en) * | 2019-03-11 | 2019-06-14 | 王凯 | A kind of rotten wood densification material and method based on high frequency without glue laminated secret skill art |
-
2019
- 2019-11-28 CN CN201911193101.4A patent/CN112847694B/en active Active
-
2020
- 2020-01-09 JP JP2020002157A patent/JP6928393B2/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205272798U (en) * | 2015-12-30 | 2016-06-01 | 常成 | A high -frequency heating hydraulic press for wood wall body veneer |
| JP2018149745A (en) * | 2017-03-13 | 2018-09-27 | 地方独立行政法人北海道立総合研究機構 | Manufacturing method of woody composite board |
| CN106891396A (en) * | 2017-04-24 | 2017-06-27 | 福州翰扬环保科技有限公司 | It is a kind of to use the technique for producing little compressible glued board without aldehyde hot melt adhesive film |
| CN109454721A (en) * | 2018-12-21 | 2019-03-12 | 王凯 | Based on high frequency without the close equipment of glue laminated |
| CN109514659A (en) * | 2018-12-30 | 2019-03-26 | 南京林业大学 | A kind of short and small lath automatic ration gluing assembling unit and gluing board joint method |
| CN109834776A (en) * | 2019-03-11 | 2019-06-04 | 王凯 | A kind of wood fragments densification material and method based on high frequency without glue laminated secret skill art |
| CN109877929A (en) * | 2019-03-11 | 2019-06-14 | 王凯 | A kind of rotten wood densification material and method based on high frequency without glue laminated secret skill art |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2021084431A (en) | 2021-06-03 |
| JP6928393B2 (en) | 2021-09-01 |
| CN112847694A (en) | 2021-05-28 |
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