CN112844978A - Gluing template for wafer bar splicing and gluing method thereof - Google Patents

Gluing template for wafer bar splicing and gluing method thereof Download PDF

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Publication number
CN112844978A
CN112844978A CN201911183892.2A CN201911183892A CN112844978A CN 112844978 A CN112844978 A CN 112844978A CN 201911183892 A CN201911183892 A CN 201911183892A CN 112844978 A CN112844978 A CN 112844978A
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China
Prior art keywords
area
gluing
main
areas
auxiliary
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CN201911183892.2A
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Chinese (zh)
Inventor
白建军
张红霞
杨田磊
王倬
赵晓明
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Inner Mongolia Zhonghuan Solar Material Co Ltd
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Inner Mongolia Zhonghuan Solar Material Co Ltd
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Priority to CN201911183892.2A priority Critical patent/CN112844978A/en
Publication of CN112844978A publication Critical patent/CN112844978A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25H—WORKSHOP EQUIPMENT, e.g. FOR MARKING-OUT WORK; STORAGE MEANS FOR WORKSHOPS
    • B25H7/00—Marking-out or setting-out work
    • B25H7/02—Plates having a flat surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/06—Joining of crystals

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention provides a gluing template for splicing wafer rods and a gluing method thereof, wherein the gluing template comprises a body, wherein the body is matched with a wafer rod structure; the side surface of the body is provided with a cutting area, the cutting area divides the side surface of the body into a main area and an auxiliary area, the main area is positioned at the inner side of the cutting area, the auxiliary area is positioned at the outer side of the cutting area, and the cutting area and the main area are coaxially arranged with the body; the main area at least comprises a main glue coating area, and the sum of the areas of the main glue coating areas is smaller than that of the main area and larger than that of the non-main glue coating areas; the auxiliary area comprises a plurality of auxiliary gluing areas, and the sum of the areas of the auxiliary gluing areas is smaller than that of the auxiliary area; the main gluing area and the auxiliary gluing area are both of a closed structure, and the minimum distance between the main gluing area and the auxiliary gluing area close to the cutting area is not less than 10 mm. The gluing template can control the glue solution coating range, ensure that no glue solution is adhered to a diamond wire or a grinding wheel when cutting the silicon rod edge leather or grinding the silicon square rod, ensure the product quality and improve the production efficiency.

Description

Gluing template for wafer bar splicing and gluing method thereof
Technical Field
The invention belongs to the technical field of solar monocrystalline silicon rod production, and particularly relates to a gluing template for wafer rod splicing and a gluing method thereof.
Background
The reduction of the cutting cost is a great trend for the development of solar photovoltaic production technology, and the full-load capacity of single-blade cutting is one of the main ways for reducing the cutting cost, so that the rod length of the single-blade cutting of the whole rod of the wafer rod in the linear cutting equipment has standard requirements, and a plurality of non-standard wafer rods cannot be avoided under the condition that the standard whole rod is taken by directional scribing, and can be spliced together to form the standard length. After the wafer rods with the non-standard lengths are spliced, the silicon rods with the lengths the same as those of the standard whole rods are formed, the full-load capacity of equipment can be further improved, the inventory of the non-standard short wafer rods is reduced, and further the production cost is reduced.
At present, in the process of producing silicon wafers, edge skin materials of a wafer rod are removed by cutting with a diamond wire to form a silicon square rod, then the silicon square rod is ground by a grinding wheel, and a side plane and a chamfer of the silicon square rod are ground. The wafer rod is spliced by coating glue on the whole surface of the end face of the wafer rod, namely glue solution after splicing can fill the whole spliced gap, but when the edge leather of the wafer rod is removed and the wafer rod is subjected to subsequent grinding, the glue solution on the spliced surface can be attached to a diamond wire for wire cutting and a grinding wheel for grinding, so that the grinding speed of the diamond wire or the grinding wheel is influenced, the processing quality is seriously influenced, and the service lives of the diamond wire and the grinding wheel are greatly reduced.
Also there is at present when bonding, only coats the glue solution in the region that four crest lines and terminal surface intersect and enclose on the excellent terminal surface of wafer, but this kind of mode can make the boundary leather material contact surface not bond, separately the blanking separately when leading to the boundary leather material, and then can appear a lot of crushed aggregates, lead to follow-up collection boundary leather material than more difficult, and the crushed aggregates can introduce a lot of impurity moreover, and then increases the degree of difficulty of reclaimed materials, improves the processing cost.
Disclosure of Invention
The invention provides a gluing template for splicing wafer rods and a gluing method thereof, which are suitable for gluing various types of wafer rods, solve the technical problem that glue solution is attached to a diamond wire for wire cutting and a grinding wheel for grinding due to unreasonable gluing structures in the prior art to influence the plane flatness processing of silicon square rods, ensure the processing quality, improve the processing speed and reduce the production cost.
In order to solve the technical problems, the invention adopts the technical scheme that:
a gluing template for splicing wafer rods comprises a body, wherein the body is matched with a wafer rod structure; the side surface of the body is provided with a cutting area, the cutting area divides the side surface of the body into a main area and an auxiliary area, the main area is positioned at the inner side of the cutting area, the auxiliary area is positioned at the outer side of the cutting area, and the cutting area and the main area are coaxially arranged with the body; the main area at least comprises a main gluing area, and the sum of the areas of the main gluing areas is smaller than that of the main area and larger than that of the areas of the non-main gluing areas; the auxiliary area comprises a plurality of auxiliary gluing areas, and the sum of the areas of the auxiliary gluing areas is smaller than that of the auxiliary area; the minimum distance between the main gluing area and the auxiliary gluing area close to the cutting area is not less than 10 mm.
Further, the main glue coating areas are symmetrically arranged in the main area and are coaxial with the main area; the main gluing area arranged at the center of the main area is of a solid structure.
Further, main rubber coating district interval sets up in the main district, it is adjacent distance between the main rubber coating district is less than the width in main rubber coating district.
Further, the main gluing area is in a circular or square structure.
Furthermore, the auxiliary gluing area is symmetrically arranged relative to the axis of the auxiliary area and is uniformly arranged on the edge of the body.
Furthermore, the auxiliary gluing area is of an integrally arranged rectangular structure or an integrally arranged oval structure.
Furthermore, the auxiliary gluing areas are of square or circular structures arranged at intervals.
Further, the thickness of the body is 3-5 mm; the cutting area is of a square structure, and the cutting area is overlapped with the shape of head connection of four intersection points of the edge line of the outer wall of the wafer rod and the intersection of the end face of the wafer rod.
A gluing method of a gluing template for splicing wafer rods comprises the gluing template, wherein a base line of a cutting area is scribed on any side surface of the template, and a base line of a main gluing area and a base line of an auxiliary gluing area are scribed in a main area and an auxiliary area respectively; and glue solution is sequentially coated in the main gluing area and the auxiliary gluing area.
Further, when the main gluing area is coated, the inner main gluing area is coated firstly, and then other main gluing areas are sequentially coated outwards; and coating the auxiliary gluing area in the same direction when coating the auxiliary gluing area.
The gluing template for splicing the silicon round rods and the gluing method thereof are suitable for gluing silicon round rods of various types, have good universality and solve the technical problem that glue solution adheres to diamond wires for wire cutting and grinding wheels to influence the plane flatness processing of the silicon square rods due to unreasonable gluing structure in the prior art.
Drawings
Fig. 1 is a schematic structural view of a gluing template according to a first embodiment of the invention;
FIG. 2 is a schematic view of a second main glue application zone according to a first embodiment of the invention;
FIG. 3 is a schematic view of a second sub-glue-applying section according to a first embodiment of the invention;
FIG. 4 is a schematic view of a third secondary glue application zone according to a first embodiment of the invention;
FIG. 5 is a schematic view of a fourth secondary glue application zone according to a first embodiment of the invention;
FIG. 6 is a schematic view of a fifth sub-glue area according to a first embodiment of the invention;
fig. 7 is a schematic structural view of a gluing template according to a second embodiment of the invention;
fig. 8 is a schematic view of the structure of a second main glue-coated section according to a second embodiment of the invention.
In the figure:
10. body 20, cutting zone 30, main zone
31. Main glue coating area 40, auxiliary glue coating area 41 and auxiliary glue coating area
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments.
The first embodiment is as follows:
the present embodiment provides a glue-coating template for wafer bar splicing, as shown in fig. 1, which includes a body 10, wherein the body 10 is adapted to a wafer bar structure, that is, the body 10 has a circular structure and a diameter the same as that of the wafer bar. A cutting area 20 is arranged on any side face of the body 10, the cutting area 20 is of a square structure, and the cutting area is overlapped with the shape of head connection of four intersection points of the edge line of the outer wall of the wafer rod and the end face of the wafer rod. The edge lines of the wafer rod are crystal lines for the growth of the wafer rod, the crystal lines are uniformly distributed around the outer wall of the wafer rod, when the edge skin of the wafer rod is removed, the diamond lines are cut along the four edge lines of the outer wall of the wafer rod, the arc-shaped edge skin materials on the outer sides of the edge lines are removed, namely the square silicon rod with the end face being square is obtained, and the end face structure formed by the four edge lines is a square structure, namely the cutting area 20. The cutting area 20 divides the side of the body 10 into a main area 30 and a sub area 40, the main area 30 is located inside the cutting area 20, the sub area 40 is located outside the cutting area 20, and both the cutting area 20 and the main area 30 are coaxially arranged with the body 10.
The inside main rubber coating area 31 that is equipped with a square structure of main zone 30, the area of main rubber coating area 31 is less than the area of main zone 30 and is greater than the area of non-main rubber coating area 31, and this is in order to have sufficient bonding area to make adjacent wafer stick bonding firm in the assurance, and avoids fully being covered with whole main zone 30. The main glue-coated zone 31 is arranged symmetrically with respect to the axis of the body 10 and coaxially with the body 10 and the main zone 30. The main gluing area 31 with the square structure can ensure that the end faces of adjacent wafer rods are uniformly and symmetrically adhered by glue solution when being adhered and are distributed in most areas of the main area 30, so that the adhering effect of the wafer rods is ensured; the solid main glue coating area 31 is more beneficial to the bonding strength of the wafer rod. Further, the distance H1 between any side of the main gluing area 31 and the cutting area 20 is not less than 10mm, the coated glue solution can diffuse outwards when being extruded, enough space needs to flow out to avoid the glue solution from diffusing outwards to influence the cutting of the diamond wire, and the distance H1 between any side of the main gluing area 31 and the cutting area 20 is not less than 10mm, so that the machining of the diamond wire with the diameter of phi 37mm can be met. The restriction of this distance can further satisfy in the right angle department of cutting zone 20, when removing the chamfer to silicon square bar grinding, the emery wheel also can not contact with the glue solution, and then can guarantee the processing to the wafer stick, and the glue solution is attached to on the buddha's warrior attendant line when avoiding removing the limit cladding, also makes follow-up glue solution also can not appear attaching to the emery wheel when processing silicon square bar simultaneously.
Further, the main glue coating area 31 may also be a circular solid structure, as shown in fig. 2, the area of the circular main glue coating area 31 is smaller than the area of the main area 30 and larger than the area of the non-main glue coating area 31, which is to ensure that there is a sufficient bonding area to bond the adjacent wafer rods firmly, and avoid completely spreading the whole main area 30. Further, the distance H1 between the excircle of the circular main gluing area 31 and the cutting area 20 is not less than 10mm, the coated glue solution can diffuse outwards when being extruded, and enough space is required to flow out to avoid the glue solution from diffusing outwards to influence the cutting of the diamond wire. The limitation of the distance can further ensure the normal processing of the cutting area 20, and when the wafer rod is processed, the adhesive liquid can be prevented from being attached to a diamond wire when the edge skin material is removed, and meanwhile, the adhesive liquid can not be attached to a grinding wheel when the silicon square rod is processed subsequently; when the silicon square rod is ground and chamfered, the grinding wheel can not be contacted with the glue solution, and the processing quality is ensured.
The sub-area 40 comprises four surfaces with arc-shaped structures, the surfaces are uniformly dispersed around the cutting area 20, an auxiliary gluing area 41 is arranged on each sub-area 40, the sum of the areas of the four auxiliary gluing areas 41 is smaller than the area of the sub-area 40, excessive glue solution coating is not needed in the area of the sub-area 40, the bonding of wafer rod edge leather materials is only needed to be met, the wafer rod edge leather materials can fall down together after being cut, the risk of edge leather material fragmentation is reduced, and the efficiency of follow-up edge leather material collection is improved. The structure of vice rubber coating district 41 is the rectangle structure, and the length of vice rubber coating district 41 sets up along the length of side of cutting area 20, and vice rubber coating district 41 sets up parallel to the length of side of cutting area 20 promptly, and the scope that the multiplicable boundary fur material bonded guarantees the intensity that the boundary fur material bonded, further improves the bonding effect of wafer stick. Any one pair of glue coating areas 41 are located at a certain gap in the auxiliary area 40 where the glue coating areas are located, the minimum distance between the auxiliary glue coating areas 41 and the cutting area 20 is not less than 10m, the small distance between the gaps at other positions is not less than 5mm, the purpose is to prevent excessive glue coating liquid, prevent the glue liquid from being adhered to a diamond wire when the edge skin materials are removed or adhere to a grinding wheel when the plane of a silicon square rod is ground, and guarantee the cutting effect of the edge skin materials and the grinding effect of the grinding plane and the chamfer angle when the edge skin materials are removed by wire cutting. In this embodiment, the secondary glue application areas 41 are all closed structures, so that the bonding effect can be further improved.
Further, the structure of the secondary glue application area 41 may also be a group of square structures arranged in parallel at intervals, as shown in fig. 3; or a group of rectangular structures arranged in parallel at intervals, as shown in fig. 4; or a group of squares and rectangles arranged in parallel at intervals, as shown in fig. 5; or may be a separate oval structure as shown in fig. 6. No matter what kind of structure setting of vice rubber coating district 41, nevertheless must guarantee under the condition that the area sum of vice rubber coating district 41 is less than the total area of vice district 40, vice rubber coating district 41 sets up and also must set up symmetrically for the mid axis symmetry of its place arc surface and the arc surface that both sides counterpoint set up simultaneously, and all structures of vice rubber coating district 41 in vice district 40 are unified structure, and this structure can guarantee that the bonding atress of vice rubber coating district 41 is even and symmetrical arrangement.
Further, in the present embodiment, the thickness of the body 10 is 3-5mm, and preferably, the body 10 is made of a resin plate material. In the using process, firstly, gluing a main gluing area 31 and an auxiliary gluing area 41 in a main area 30 and an auxiliary area 40 on a body 10 of a resin plate in sequence, then aligning and contacting a template with a gluing surface with the upper end surface of any vertically placed section of a wafer rod, enabling a square surrounded by a cutting area 20 on the body 10 and four end-to-end connected edge points in the end surface of the wafer rod to be arranged in a vertically corresponding mode, and enabling glue coated on the template to be adhered to the end surface of the section of the wafer rod; and then aligning and bonding the lower end surface of the other section of the wafer rod with the section of the wafer rod bonded with the glue solution, fixing the bonding surfaces of the upper section and the lower section by using a curing device, and removing the curing device after curing for a certain time to complete the bonding work of the wafer rod.
The adhesive template can be used for coating the adhesive solution on the end face of the large-size wafer rod, is suitable for bonding various types of silicon round rods, has good universality, can effectively control the adhesive solution coating range, is easy to operate, has no carrying risk, and can be repeatedly used. Meanwhile, the area coated with the glue solution can avoid the situation that the glue solution is adhered to a diamond wire when the edge skin material is removed or the glue solution is adhered to a grinding wheel when the plane of the silicon square rod is ground, the cutting effect of removing the edge skin material and the grinding effect of the grinding plane and the chamfer angle through linear cutting are guaranteed, the bonding effect is good, and the bonding efficiency is high.
A gluing method of a gluing template for wafer bar splicing comprises the gluing template and comprises the following specific steps:
firstly: a base line of the cutting region 20 is drawn on a side surface of any one body 10 of the template such that an area inside the cutting region 20 is a main region 30 and an area outside the cutting region 20 is a sub region 40. And then a primary glue-coated area 31 baseline and a secondary glue-coated area 41 baseline are respectively marked in the primary area 30 and the secondary area 40. The structure of the main glue-coated section 31 is shown in figure 1 or figure 2, and the structure of the secondary glue-coated sections 41 can be any one of the structures shown in figure 1, figure 3, figure 4, figure 5 or figure 6, but it is necessary to ensure that the structures of all the secondary glue-coated sections 41 are uniform. In this embodiment, the scribing base line can be scribed by any automatic scribing machine on the market, and is omitted here.
Secondly, the method comprises the following steps: preparing a coating glue solution, specifically, mixing a type A, B glue in a ratio of 1: 1 to form a viscose liquid, and the viscose liquid is coated on a template within 15 minutes.
And finally: glue solution is coated in the main gluing area 31 and the auxiliary gluing area 41 in sequence.
Specifically, the glue solution is coated on the main glue coating area 31, and the glue solution is coated on the auxiliary glue coating area 41 after the coating is finished. When the auxiliary glue application areas 41 are coated, the auxiliary glue application areas 41 are sequentially coated in the same direction until the coating is complete.
And then finishing the gluing work of the gluing template, and then carrying out the next bonding work by using the gluing template after the gluing is finished.
Example two:
as shown in fig. 7, compared with the first embodiment, the biggest difference of this embodiment is that a plurality of main glue coating areas 31 which are coaxially arranged are arranged in the main area 30, each main glue coating area 31 is of a square structure, the central position of each main glue coating area 31 is of a solid structure, the main glue coating areas 31 which are arranged outside the central position are all square with a hollow structure and alternately arranged in a gap, that is, the side length of each main glue coating area 31 which is arranged outside the central position is gradually increased at equal intervals, the width of each main glue coating area 31 is the same, the gap distance between the adjacent main glue coating areas 31 is the same, the diameter of each main glue coating area 31 is gradually increased, and the distance between the adjacent main glue coating areas 31 is smaller than the width of the main glue coating area 31. The structure not only ensures that the sum of the areas of the main gluing areas 31 is larger than the sum of the areas of the non-main gluing areas 31, but also can ensure that the glue amount is saved under the condition of meeting the bonding strength, and meanwhile, the main gluing areas 31 alternately arranged at intervals can ensure that certain gap spaces exist for the glue to move when the wafer rods are bonded and extruded, thereby avoiding the occurrence of stacking during bonding.
In this embodiment, the main glue application areas 31 may also be circular structures, as shown in fig. 8, that is, the main glue application areas 31 of a plurality of circular structures are coaxially arranged alternately with gaps, that is, the central position of the main glue application area 31 is a circular structure arranged in a solid manner, and the main glue application areas 31 arranged outside the central position are all annular structures and arranged alternately with gaps; the diameter of the main glue coating area 31 arranged outside the central position is gradually increased at equal intervals, the width of the main glue coating area 31 on each layer is the same, the gap distance between the adjacent main glue coating areas 31 is the same, the diameter of the main glue coating areas 31 is gradually increased, and the distance between the adjacent main glue coating areas 31 is smaller than the width of the main glue coating areas 31.
In this embodiment, the minimum distance H1 between the outermost main glue coating area 31 and the edge of the cutting area 20 is not less than 10mm, so as to prevent the coating glue solution from being too much, avoid the glue solution from adhering to the diamond wire when the edge skin material is removed or adhering to the grinding wheel when the plane of the silicon square bar is ground, and ensure the cutting effect of the edge skin material and the grinding effect of the grinding plane and chamfer angle when the edge skin material is removed by wire cutting.
In this embodiment, the secondary glue application sections 41 in the secondary section 40 are all closed rectangular structures as shown in fig. 7, or closed oval structures as shown in fig. 8, and the specific contents are as described in the first embodiment, and are omitted here. Of course, the structure of the secondary glue application area 41 may be a group of square structures arranged in parallel at intervals as shown in fig. 3, a group of rectangular structures arranged in parallel at intervals as shown in fig. 4, or a group of square and rectangular structures arranged in parallel at intervals as shown in fig. 5, and the drawings are omitted and will not be described in detail.
The template designed by the embodiment can ensure the bonding strength of the end face of the wafer rod, can reduce the using amount of glue solution to the maximum extent, and avoids glue solution accumulation when the wafer rod is bonded. Meanwhile, the area coated with the glue solution can also avoid the glue solution from being adhered to the diamond wire when the edge skin material is removed or the glue solution is adhered to the grinding wheel when the plane of the silicon square rod is ground, so that the cutting effect of removing the edge skin material by wire cutting and the grinding effect of the grinding plane and the chamfer angle are ensured.
A gluing method of a gluing template for wafer bar splicing comprises the gluing template and comprises the following specific steps:
firstly: a base line of the cutting region 20 is drawn on a side surface of any one body 10 of the template such that an area inside the cutting region 20 is a main region 30 and an area outside the cutting region 20 is a sub region 40. And then a primary glue-coated area 31 baseline and a secondary glue-coated area 41 baseline are respectively marked in the primary area 30 and the secondary area 40. The structure of the main glue-coated section 31 is shown in fig. 7 or 8, and the structure of the secondary glue-coated sections 41 can be any one of those shown in fig. 7, 8, 3, 4 or 5, but it is necessary to ensure that the structures of all the secondary glue-coated sections 41 are uniform. In this embodiment, the scribing base line can be scribed by any automatic scribing machine on the market, and is omitted here.
Secondly, the method comprises the following steps: preparing a coating glue solution, specifically, mixing a type A, B glue in a ratio of 1: 1 to form a viscose liquid, and the viscose liquid is coated on a template within 15 minutes.
And finally: glue solution is coated in the main gluing area 31 and the auxiliary gluing area 41 in sequence.
Specifically, the glue solution is coated on the main gluing area 31, when the glue solution is coated on the main gluing area 31, the glue is sequentially coated from the main gluing area 31 at the central position to the outside, and the gluing directions of each layer are consistent, namely clockwise gluing or counterclockwise gluing is performed, so that the consistency of the gluing directions is ensured. And coating the glue solution on the auxiliary glue coating area 41 after the coating is finished, and coating the auxiliary glue coating area 41 in sequence in the same direction when the auxiliary glue coating area 41 is coated until the coating is complete.
And then finishing the gluing work of the gluing template, and then carrying out the next bonding work by using the gluing template after the gluing is finished.
1. The gluing template designed by the invention is suitable for gluing round silicon rods of various types, has good universality, can effectively control the glue solution coating range, is easy to operate, has no carrying risk, and can be reused.
2. By adopting the structure designed by the gluing template, the bonding strength of the end face of the wafer rod can be ensured, the using amount of glue solution can be reduced to the maximum extent, and the glue solution accumulation during the bonding of the wafer rod can be avoided.
3. Meanwhile, the area coated with the glue solution can prevent the glue solution from being adhered to the diamond wire when the edge skin material is removed or the glue solution from being adhered to the grinding wheel when the plane of the silicon square rod is ground, so that the cutting effect of removing the edge skin material by wire cutting and the grinding effect of the grinding plane and the chamfer are ensured, the bonding effect is good, and the bonding efficiency is high; and then can guarantee processingquality, improve process velocity, improve production efficiency.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.

Claims (10)

1. A gluing template for splicing wafer rods is characterized by comprising a body, wherein the body is matched with a wafer rod structure; the side surface of the body is provided with a cutting area, the cutting area divides the side surface of the body into a main area and an auxiliary area, the main area is positioned at the inner side of the cutting area, the auxiliary area is positioned at the outer side of the cutting area, and the cutting area and the main area are coaxially arranged with the body; the main area at least comprises a main gluing area, and the sum of the areas of the main gluing areas is smaller than that of the main area and larger than that of the areas of the non-main gluing areas; the auxiliary area comprises a plurality of auxiliary gluing areas, and the sum of the areas of the auxiliary gluing areas is smaller than that of the auxiliary area; the minimum distance between the main gluing area and the auxiliary gluing area close to the cutting area is not less than 10 mm.
2. The gluing template for splicing wafer rods according to claim 1, wherein the main gluing area is symmetrically arranged in the main area and is coaxial with the main area; the main gluing area arranged at the center of the main area is of a solid structure.
3. The gluing template for splicing the wafer rods as claimed in claim 2, wherein the main gluing areas are arranged in the main area at intervals, and the distance between the adjacent main gluing areas is smaller than the width of the main gluing areas.
4. The gluing template for splicing wafer rods according to any one of claims 1 to 3, wherein the main gluing area is in a circular or square structure.
5. The gluing template for splicing wafer rods according to claim 4, wherein the secondary gluing areas are symmetrically arranged relative to the axis of the secondary areas and are uniformly arranged on the edge of the body.
6. The gluing template for splicing wafer rods according to claim 5, wherein the secondary gluing area is of an integrally arranged rectangular structure or an integrally arranged oval structure.
7. The gluing template for splicing the wafer rods as claimed in claim 5, wherein the secondary gluing area is of a square or circular structure arranged at intervals.
8. The gluing template for splicing wafer bars according to any one of claims 1 to 3 and 5 to 7, wherein the thickness of the body is 3 to 5 mm; the cutting area is of a square structure, and the cutting area is overlapped with the shape of head connection of four intersection points of the edge line of the outer wall of the wafer rod and the intersection of the end face of the wafer rod.
9. A method of gluing a gummed template for splicing wafer bars, comprising the gummed template as in any one of claims 1 to 8, wherein the base lines of the cutting zones are scribed on either side of the template, and the base lines of the main gummed zone and the secondary gummed zone are scribed in the main zone and the secondary zone, respectively; and glue solution is sequentially coated in the main gluing area and the auxiliary gluing area.
10. The gluing method of the gluing template for splicing the wafer bars as claimed in claim 9, wherein when the main gluing area is coated, the inner main gluing area is coated, and then other main gluing areas are sequentially coated outwards; and coating the auxiliary gluing area in the same direction when coating the auxiliary gluing area.
CN201911183892.2A 2019-11-27 2019-11-27 Gluing template for wafer bar splicing and gluing method thereof Pending CN112844978A (en)

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US20170002479A1 (en) * 2008-05-07 2017-01-05 Silicon Genesis Corporation Method and device for slicing a shaped silicon ingot using layer transfer
CN102130209A (en) * 2010-12-27 2011-07-20 浙江昱辉阳光能源有限公司 Positioning device, sticking system and sticking method
CN103753715A (en) * 2014-01-23 2014-04-30 英利能源（中国）有限公司 Processing method for reusing unqualified chamfered silicon briquette
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