CN112838451A - Low-resistivity composite bus copper bar and manufacturing method thereof - Google Patents
Low-resistivity composite bus copper bar and manufacturing method thereof Download PDFInfo
- Publication number
- CN112838451A CN112838451A CN202011624813.XA CN202011624813A CN112838451A CN 112838451 A CN112838451 A CN 112838451A CN 202011624813 A CN202011624813 A CN 202011624813A CN 112838451 A CN112838451 A CN 112838451A
- Authority
- CN
- China
- Prior art keywords
- copper bar
- resistivity
- alloy
- low
- composite bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R25/00—Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits
- H01R25/16—Rails or bus-bars provided with a plurality of discrete connecting locations for counterparts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/08—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartz; glass; glass wool; slag wool; vitreous enamels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2504/00—Epoxy polymers
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Conductive Materials (AREA)
- Continuous Casting (AREA)
Abstract
A compound bus copper bar with low resistivity and a manufacturing method thereof are disclosed, which are composed of a copper bar and an insulating layer integrally cast outside the copper bar; the copper bar comprises the following components in percentage by mass: 0.05-0.08% of silicon, 0.08-0.2% of iron, 0.1-0.3% of silver, 0.01-0.03% of lanthanum, 0.02-0.08% of cerium, 0.1-0.5% of manganese, 0.6-1.2% of zinc, 2-6% of aluminum, and the balance of Cu and non-removable impurities; the alloy copper bar has high strength and low resistivity, the rare earth elements lanthanum and cerium are added to act with the iron and aluminum elements, so that the alloy copper bar is beneficial to refining crystal grains, the strength, toughness, corrosion resistance and oxidation resistance of the alloy copper bar are improved, various metals are added to be reasonably matched, the resistivity can be reduced, the ductility of the alloy copper bar can be improved, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of metal composite materials, in particular to a low-resistivity composite bus copper bar and a manufacturing method thereof.
Background
The bus duct has the advantages of safety, reliability, large capacity, small volume, short design and construction period, series matching, convenient assembly and disassembly, long service life and the like, and is suitable for power supply in places such as superstores, exhibition halls, gymnasiums, airports, high-rise buildings and the like. The electrical conductivity and the thermal conductivity of the copper bar are only inferior to those of silver, and the copper bar is widely used for manufacturing electric conduction and heat conduction equipment, the copper bar is mainly used on a primary circuit (a phase line, a zero line and a ground line of large current can all be used on the copper bar), the connection of primary components of large current on an electric cabinet is realized by the copper bar, for example, a main bus bar is connected between the cabinet and a row of electric cabinets, and the main bus bar is divided into branch bus bars on the switch electric (an isolating switch, a circuit breaker and the like) of each electric cabinet;
however, in China, copper resources are scarce, aluminum is a good conductor, but the conductivity of aluminum is low, the contact resistance is high, and the aluminum is easy to oxidize in the air, so that the aluminum-containing formula needs to be improved to make up for the defects of aluminum-containing copper bars.
Disclosure of Invention
The invention aims to solve the defects of the prior art, and provides a low-resistivity composite bus copper bar which is composed of a copper bar and an insulating layer integrally cast outside the copper bar; the copper bar comprises the following components in percentage by mass: 0.05-0.08% of silicon, 0.08-0.2% of iron, 0.1-0.3% of silver, 0.01-0.03% of lanthanum, 0.02-0.08% of cerium, 0.1-0.5% of manganese, 0.6-1.2% of zinc, 2-6% of aluminum, and the balance of Cu and non-removable impurities.
Preferably, the copper bar comprises the following components in percentage by mass: 0.06-0.07% of silicon, 0.1-0.15% of iron, 0.15-0.2% of silver, 0.01-0.02% of lanthanum, 0.02-0.04% of cerium, 0.3-0.5% of manganese, 0.8-1.1% of zinc, 2-6% of aluminum, and the balance of Cu and non-removable impurities.
Preferably, the preparation method of the insulating layer of the composite bus copper bar with low resistivity comprises the following steps:
(1) mixing isopropanol and pure water to prepare a solvent, adding a small amount of ammonia water into the solvent, and then adding graphite particles and a surfactant; then adding ethyl orthosilicate into the suspension, and stirring for 2 hours at 60 ℃; filtering, separating and drying to obtain crystalline silicon coating graphite; wherein the mass ratio of the graphite particles to the surfactant is 1 (0.015-0.02);
(2) adding epoxy resin and crystalline silicon coated graphite into a planetary ball mill, wherein the rotating speed of the grinder is 400-600rpm/min, the grinding time is 1-3h, then adding a flame retardant, continuously grinding for 0.5-1.5h, and carrying out ultrasonic treatment on the ground material for 0.5-1h after grinding is finished to obtain an insulating layer material; wherein the mass ratio of the epoxy resin, the crystalline silicon coating graphite and the flame retardant is 1 (0.25-0.45) to 0.01-0.03.
Preferably, the surfactant is polyvinylpyrrolidone.
Preferably, the method for manufacturing the composite bus copper bar with low resistivity comprises the following steps:
(a) adding the raw materials into a smelting furnace according to the proportion for smelting, covering 150-plus-200 mm-thick calcined charcoal above the molten alloy at the smelting temperature of 1000-plus-1200 ℃, and flowing the molten alloy into a holding furnace after smelting;
(b) leading out an upper lead alloy copper rod by using an upper lead continuous casting machine, and extruding the alloy copper rod by using a continuous extruder to form an alloy copper bar blank;
(c) and extruding an insulating layer material by adopting a double-screw extruder, and closely extruding and wrapping the insulating layer material on the blank of the alloy copper bar by using a rectangular pipe drawing die to obtain the composite bus copper bar.
Preferably, in the step (b), the traction speed of the traction machine is 1000-.
Preferably, in step (b), the extruder extrusion speed is 4-8 r/min.
Has the advantages that:
(1) the alloy copper bar has high strength and low resistivity, the rare earth elements lanthanum and cerium are added to act with the iron and aluminum elements, so that the alloy copper bar is beneficial to refining crystal grains, the strength, toughness, corrosion resistance and oxidation resistance of the alloy copper bar are improved, various metals are added to be reasonably matched, the resistivity can be reduced, the ductility of the alloy copper bar can be improved, and the cost is reduced.
(2) The insulating layer is added with crystalline silicon coating graphite, the ethyl orthosilicate generates silicon dioxide under an alkaline condition, and the graphite surface shows a hydrophobic surface with low compatibility with the silicon dioxide, and the surfactant is added to assist the silicon dioxide to be better coated on the graphite surface, so that the insulating layer can be ensured to have better insulating property and heat dissipation property.
Detailed Description
For the purpose of enhancing understanding of the present invention, the present invention will be further described in detail with reference to the following examples, which are provided for illustration only and are not to be construed as limiting the scope of the present invention.
Example 1
A low-resistivity composite bus copper bar is composed of a copper bar and an insulating layer integrally cast outside the copper bar; the copper bar comprises the following components in percentage by mass: 0.06% of silicon, 0.12% of iron, 0.22% of silver, 0.03% of lanthanum, 0.03% of cerium, 0.38% of manganese, 0.83% of zinc, 3.5% of aluminum, the balance being Cu and non-removable impurities.
The preparation method of the insulating layer comprises the following steps:
(1) mixing isopropanol and pure water to prepare a solvent, adding a small amount of ammonia water into the solvent, and then adding graphite particles and polyvinylpyrrolidone; then adding ethyl orthosilicate into the suspension, and stirring for 2 hours at 60 ℃; filtering, separating and drying to obtain crystalline silicon coating graphite; wherein the mass ratio of the graphite particles to the surfactant is 1: 0.016;
(2) adding epoxy resin and crystalline silicon coated graphite into a planetary ball mill, wherein the rotating speed of the mill is 400-plus 600rpm/min, the milling time is 2.5h, then adding a flame retardant, continuing milling for 1.0h, and carrying out ultrasonic treatment on the milled material for 1h after the milling is finished to obtain an insulating layer material; wherein the mass ratio of the epoxy resin to the crystalline silicon coating graphite to the flame retardant is 1:0.32: 0.02.
A manufacturing method of a low-resistivity composite bus copper bar comprises the following steps:
(a) adding the raw materials into a smelting furnace according to the proportion for smelting, covering 150-plus-200 mm-thick calcined charcoal above the molten alloy at the smelting temperature of 1000-plus-1200 ℃, and flowing the molten alloy into a holding furnace after smelting;
(b) leading out an upper lead alloy copper rod by using an upper lead continuous casting machine, and extruding the alloy copper rod by using a continuous extruder to form an alloy copper bar blank; wherein the traction speed of the traction machine is 1000-2000mm/min, the diameter of the alloy copper rod is 5-20mm, and the extrusion speed of the extruder is 4-8 r/min;
(c) and extruding an insulating layer material by adopting a double-screw extruder, and closely extruding and wrapping the insulating layer material on the blank of the alloy copper bar by using a rectangular pipe drawing die to obtain the composite bus copper bar.
Tests show that the resistivity of the composite bus copper bar is 0.01812 omega m/m2(20℃)。
Example 2
The composite bus copper bar with low resistivity is characterized by comprising a copper bar and an insulating layer integrally cast outside the copper bar; the copper bar comprises the following components in percentage by mass: 0.08% of silicon, 0.16% of iron, 0.15% of silver, 0.02% of lanthanum, 0.05% of cerium, 0.45% of manganese, 1.15% of zinc, 2.8% of aluminum, the balance being Cu and non-removable impurities.
The preparation method of the insulating layer comprises the following steps:
(1) mixing isopropanol and pure water to prepare a solvent, adding a small amount of ammonia water into the solvent, and then adding graphite particles and polyvinylpyrrolidone; then adding ethyl orthosilicate into the suspension, and stirring for 2 hours at 60 ℃; filtering, separating and drying to obtain crystalline silicon coating graphite; wherein the mass ratio of the graphite particles to the surfactant is 1: 0.02;
(2) adding epoxy resin and crystalline silicon coated graphite into a planetary ball mill, wherein the rotating speed of the mill is 400-600rpm/min, the grinding time is 3h, then adding a flame retardant, continuously grinding for 1.5h, and carrying out ultrasonic treatment on the ground material for 0.8h after grinding is finished to obtain an insulating layer material; wherein the mass ratio of the epoxy resin to the crystalline silicon coating graphite to the flame retardant is 1:0.45: 0.03.
A manufacturing method of a low-resistivity composite bus copper bar comprises the following steps:
(a) adding the raw materials into a smelting furnace according to the proportion for smelting, covering 150-plus-200 mm-thick calcined charcoal above the molten alloy at the smelting temperature of 1000-plus-1200 ℃, and flowing the molten alloy into a holding furnace after smelting;
(b) leading out an upper lead alloy copper rod by using an upper lead continuous casting machine, and extruding the alloy copper rod by using a continuous extruder to form an alloy copper bar blank; wherein the traction speed of the traction machine is 1000-2000mm/min, the diameter of the alloy copper rod is 5-20mm, and the extrusion speed of the extruder is 4-8 r/min;
(c) and extruding an insulating layer material by adopting a double-screw extruder, and closely extruding and wrapping the insulating layer material on the blank of the alloy copper bar by using a rectangular pipe drawing die to obtain the composite bus copper bar.
Through tests, the resistivity of the obtained composite bus copper bar is 0.01956 omega m/m2(20℃)。
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. The composite bus copper bar with low resistivity is characterized by comprising a copper bar and an insulating layer integrally cast outside the copper bar; the copper bar comprises the following components in percentage by mass: 0.05-0.08% of silicon, 0.08-0.2% of iron, 0.1-0.3% of silver, 0.01-0.03% of lanthanum, 0.02-0.08% of cerium, 0.1-0.5% of manganese, 0.6-1.2% of zinc, 2-6% of aluminum, and the balance of Cu and non-removable impurities.
2. The low-resistivity composite bus copper bar as claimed in claim 1, wherein the copper bar comprises the following components in percentage by mass: 0.06-0.07% of silicon, 0.1-0.15% of iron, 0.15-0.2% of silver, 0.01-0.02% of lanthanum, 0.02-0.04% of cerium, 0.3-0.5% of manganese, 0.8-1.1% of zinc, 2-6% of aluminum, and the balance of Cu and non-removable impurities.
3. The compound type bus copper bar with low resistivity as claimed in claim 1, wherein the preparation method of the insulating layer comprises the following steps:
(1) mixing isopropanol and pure water to prepare a solvent, adding a small amount of ammonia water into the solvent, and then adding graphite particles and a surfactant; then adding ethyl orthosilicate into the suspension, and stirring for 2 hours at 60 ℃; filtering, separating and drying to obtain crystalline silicon coating graphite; wherein the mass ratio of the graphite particles to the surfactant is 1 (0.015-0.02);
(2) adding epoxy resin and crystalline silicon coated graphite into a planetary ball mill, wherein the rotating speed of the grinder is 400-600rpm/min, the grinding time is 1-3h, then adding a flame retardant, continuously grinding for 0.5-1.5h, and carrying out ultrasonic treatment on the ground material for 0.5-1h after grinding is finished to obtain an insulating layer material; wherein the mass ratio of the epoxy resin, the crystalline silicon coating graphite and the flame retardant is 1 (0.25-0.45) to 0.01-0.03.
4. The low-resistivity composite bus bar copper bar as claimed in claim 1, wherein the surfactant is polyvinylpyrrolidone.
5. The method for manufacturing the low-resistivity composite bus bar copper bar as claimed in claims 1 to 3, wherein the method comprises the following steps:
(a) adding the raw materials into a smelting furnace according to the proportion for smelting, covering 150-plus-200 mm-thick calcined charcoal above the molten alloy at the smelting temperature of 1000-plus-1200 ℃, and flowing the molten alloy into a holding furnace after smelting;
(b) leading out an upper lead alloy copper rod by using an upper lead continuous casting machine, and extruding the alloy copper rod by using a continuous extruder to form an alloy copper bar blank;
(c) and extruding an insulating layer material by adopting a double-screw extruder, and closely extruding and wrapping the insulating layer material on the blank of the alloy copper bar by using a rectangular pipe drawing die to obtain the composite bus copper bar.
6. The method for manufacturing the low-resistivity composite bus copper bar as claimed in claim 5, wherein in the step (b), the traction speed of the traction machine is 1000-2000mm/min, and the diameter of the alloy copper bar is 5-20 mm.
7. The method for manufacturing the low-resistivity composite bus bar copper bar as claimed in claim 5, wherein in the step (b), the extrusion speed of the extruder is 4-8 r/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011624813.XA CN112838451B (en) | 2020-12-31 | 2020-12-31 | Low-resistivity composite bus copper bar and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011624813.XA CN112838451B (en) | 2020-12-31 | 2020-12-31 | Low-resistivity composite bus copper bar and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112838451A true CN112838451A (en) | 2021-05-25 |
| CN112838451B CN112838451B (en) | 2022-12-23 |
Family
ID=75924321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011624813.XA Active CN112838451B (en) | 2020-12-31 | 2020-12-31 | Low-resistivity composite bus copper bar and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112838451B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151105A (en) * | 2013-03-12 | 2013-06-12 | 河北华通线缆集团有限公司 | Low smoke zero halogen (LSZH) insulation and extrusion soft copper bar and manufacturing method thereof |
| CN105551688A (en) * | 2016-02-16 | 2016-05-04 | 中天合金技术有限公司 | Preparation method of high-accuracy anaerobic bright copper bar |
| CN105705239A (en) * | 2013-08-29 | 2016-06-22 | 纳幕尔杜邦公司 | Making thermally conductive particles |
| CN107475628A (en) * | 2017-08-17 | 2017-12-15 | 苏州曼里尼斯金属科技有限公司 | A kind of osmotic-pressure-tolerant composite material |
-
2020
- 2020-12-31 CN CN202011624813.XA patent/CN112838451B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151105A (en) * | 2013-03-12 | 2013-06-12 | 河北华通线缆集团有限公司 | Low smoke zero halogen (LSZH) insulation and extrusion soft copper bar and manufacturing method thereof |
| CN105705239A (en) * | 2013-08-29 | 2016-06-22 | 纳幕尔杜邦公司 | Making thermally conductive particles |
| CN105551688A (en) * | 2016-02-16 | 2016-05-04 | 中天合金技术有限公司 | Preparation method of high-accuracy anaerobic bright copper bar |
| CN107475628A (en) * | 2017-08-17 | 2017-12-15 | 苏州曼里尼斯金属科技有限公司 | A kind of osmotic-pressure-tolerant composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112838451B (en) | 2022-12-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101948971B (en) | Heat-resistant aluminum-alloy conductor material for cables and manufacture method thereof | |
| CN102925746B (en) | High-performance Cu-Ni-Si system copper alloy, and preparation method and processing method thereof | |
| CN101525709B (en) | High-elongation aluminum alloy material and preparation method thereof | |
| CN101880799A (en) | Al-Fe-Zn-Mg rare earth alloy wire and preparation method thereof | |
| CN102978490A (en) | High-strength, high-conductivity and heat-resisting aluminum alloy bus and production method thereof | |
| CN102760508B (en) | High-conductivity creep-resistant aluminium alloy cable conductor containing Hf and Ce and preparation method thereof | |
| CN104946936A (en) | High-conductivity rare earth duralumin monofilament material for overhead conductors | |
| CN102534291A (en) | CuCrZr alloy with high strength and high conductivity, and preparation and processing method thereof | |
| CN103173649A (en) | Anti-stress relaxation beryllium free copper alloy with high strength and high elasticity as well as preparation and processing methods thereof | |
| CN103952605A (en) | Preparation method of intermediate strength aluminum alloy monofilament | |
| CN102912193A (en) | High-conductivity creep-resistant aluminum-alloy conductor and manufacturing method thereof | |
| CN101709401B (en) | Cu-Cr in-situ composite with boron, silver and rare earth elements added and preparation method thereof | |
| CN103882270A (en) | Aluminum alloy material for special-type high pressure oil pump cases and preparation method thereof | |
| CN106834820A (en) | Strong height leads aluminium alloy single line and preparation method thereof in one kind | |
| CN110616353A (en) | High-purity high-conductivity copper and preparation method thereof | |
| CN102044347B (en) | Preparation method and products of silver-copper-nickel-ceramic alloy contact material with high welding resistance | |
| CN111411267A (en) | Conductive monofilament material and preparation method thereof | |
| CN112838451B (en) | Low-resistivity composite bus copper bar and manufacturing method thereof | |
| CN111041282A (en) | Soft aluminum monofilament for overhead conductor and preparation method thereof | |
| CN112410597B (en) | Preparation method of nano WC dispersion strengthened copper | |
| CN103952601B (en) | A kind of high conductivity heat-resisting aluminium alloy of alkaline including earth metal | |
| CN102747247A (en) | Pt-containing slide contact material and layered composite material | |
| CN112662923A (en) | Aluminum alloy conductor and preparation method thereof | |
| CN101525731B (en) | Cu-Fe original-position compound copper base material and preparation method thereof | |
| CN102925733B (en) | Multifunctional covering agents of copper alloy suitable for lead frame |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 212211 No. 18 Xinba Village Port Southeast Road, Xinba Town, Yangzhong City, Jiangsu Province Applicant after: Jiangsu Huaxiong Electric Co.,Ltd. Address before: 212211 No. 18 Xinba Village Port Southeast Road, Xinba Town, Yangzhong City, Jiangsu Province Applicant before: YANGZHONG HUAYI ELECTRIC APPLIANCE CO.,LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |