CN112838434A

CN112838434A - Wafer connector and mating connector

Info

Publication number: CN112838434A
Application number: CN202011316968.7A
Authority: CN
Inventors: 林达也
Original assignee: 3M Innovative Properties Co
Current assignee: 3M Innovative Properties Co
Priority date: 2019-11-22
Filing date: 2020-11-20
Publication date: 2021-05-25

Abstract

The invention provides a wafer connector and a mating connector. The present disclosure provides a connector assembly and a mating connector capable of improving workability of insertion and removal. In a wafer connector (20) according to an embodiment, in a state where a first wafer connector (20) is stacked with a second wafer connector (20) including a second flexible arm (27), when the first flexible arm (27) is moved between a latch engagement position and a latch disengagement position in a state where a first engagement portion (49b) of the first wafer connector (20) is engaged with an engagement portion (49h) of the second wafer connector (20), the second flexible arm (27) is also moved between the latch engagement position and the latch disengagement position.

Description

Wafer connector and mating connector

Technical Field

One aspect of the present disclosure relates to wafer connectors and mating connectors.

Background

In the related art, there are known various types of stacked-type wafer connectors and mating connectors. Patent document 1 describes a multistage connector including a first housing, a second housing, and a cover. In the multi-stage connector, the first housing, the second housing, and the cover enter the box-like mating connector in a state where the first housing, the second housing, and the cover are stacked on each other. The cover includes a lock to be engaged with the mating connector, and the multi-stage connector is fitted to the mating connector by the engagement of the lock of the cover.

Reference toList of documents

Patent document

[ patent document 1] JP 10-79273A

Disclosure of Invention

Technical problem

Incidentally, with regard to a stacked-type wafer connector such as the above-described multi-stage connector, it is necessary to improve the operability of insertion and removal. However, in the above-described multi-stage connector, since it is the cover that is engaged with the mating connector, not the first and second housings, the mating connector cannot be assembled unless the cover is attached to the second housing. In the above-described multi-stage connector, the first housing and the second housing cannot be individually inserted into or removed from the mating connector, and a cover is always required to perform such insertion and removal. Also in this respect, the insertion and removal operations cannot be easily performed. Therefore, there is a need for a wafer connector and a mating connector that can improve the workability of insertion and removal.

Solution to the problem

A wafer connector according to one aspect of the present disclosure is a stack-type wafer connector configured to be electrically fitted to a mating connector and including: an electrically insulative wafer defining cavities configured to receive terminals in the wafer; a latch engagement member including an engagement portion integrally formed with the wafer and including a flexible arm configured to move between a latch engaged position where the wafer connector is latched engaged to the mating connector and a latch disengaged position where the wafer connector is unlatched from the mating connector. In the case where the first wafer connector is stacked with a second wafer connector including a second latch engaging member including a second flexible arm, the second flexible arm also moves between the latch engaging position and the latch disengaging position when the first flexible arm moves between the latch engaging position and the latch disengaging position in a state where the first engaging portion of the first wafer connector is engaged with the second engaging portion of the second wafer connector.

A mating connector according to one aspect of the present disclosure defines a plurality of receiving cavities configured to receive a plurality of wafer connectors and includes an engagement portion configured to engage a latch portion of a wafer connector received in each of the receiving cavities. The wafer connector is configured to be unlocked from the mating connector by moving the latch portion a disengagement distance, and for two wafer connectors received in each of at least a first receiving cavity and a second receiving cavity of the plurality of receiving cavities, a first disengagement distance when the latch portion of the first wafer connector is moved in the first receiving cavity is different than a second disengagement distance when the latch portion of the second wafer connector is moved in the second receiving cavity.

Advantageous effects of the invention

According to an aspect of the present disclosure, workability of insertion and removal may be improved.

Drawings

Fig. 1 is a perspective view showing an example of a state in which a plurality of mating connectors to which a plurality of wafer connectors according to an embodiment are mounted are arranged on a board.

Fig. 2 is a perspective view illustrating a stacked wafer connector and a mating connector according to an embodiment.

Fig. 3 is a perspective view of the stacked wafer connector and mating connector of fig. 2, viewed from a direction different from that of fig. 2.

Fig. 4 is a longitudinal cross-sectional view of the stacked wafer connector and mating connector of fig. 2.

Fig. 5 is a perspective view illustrating a mating connector according to an embodiment.

Fig. 6 is a perspective view illustrating a state in which a plurality of wafer connectors according to an embodiment are stacked.

Fig. 7 is a perspective view of a first wafer connector and a second wafer connector of the plurality of wafer connectors of fig. 6.

Fig. 8 is a perspective view illustrating a state in which the first and second wafer connectors of fig. 7 are stacked.

Fig. 9 is a cut-away perspective view of the engagement portion of the wafer connector of fig. 6.

Fig. 10 is a cross-sectional perspective view illustrating an inner terminal of the wafer connector of fig. 6.

Figure 11 is a cross-sectional view showing a latching portion of a wafer connector and an engagement portion of a receiving cavity received in the receiving cavity on an end side of a mating connector, according to an embodiment.

Figure 12 is a cross-sectional view showing a latching portion of a wafer connector and an engagement portion of a receiving cavity received in the receiving cavity on a center side of a mating connector according to an embodiment.

Fig. 13 is a perspective view showing a mating connector and a stacked wafer connector according to a modified example.

Detailed Description

Hereinafter, embodiments of a stacked wafer connector and a mating connector according to the present disclosure will be described with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are denoted by the same reference numerals, and redundant description will be omitted as appropriate. Some drawings may be simplified or enlarged for ease of understanding, and the size ratio and the like are not limited to those shown in the drawings.

First, a connector assembly 1 including a stacked-type wafer connector and a mating connector according to the present embodiment will be described with reference to fig. 1. As shown in fig. 1, for example, the connector assembly 1 is provided on a board B, and a plurality of connector assemblies 1 are provided on the board B so as to be arranged in one direction. The plurality of connector assemblies 1 may be provided in an arrangement, for example, in a lattice pattern, and the arrangement of the connector assemblies 1 is not particularly limited. The connector assembly 1 includes a mating connector 10 mounted on a board B and a plurality of stacked wafer connectors 20 accommodated in the mating connector 10. For example, the mating connector 10 is a board-mount connector to be mounted on board B, and the wafer connector 20 is a stack-type wire-mount wafer connector.

For example, the mating connector 10 has a box-like shape, and a plurality of stacked wafer connectors 20 can be fitted to the box-like mating connector 10 (inserted into and removed from the box-like mating connector 10). For example, the mating connector 10 has a bottom box shape including a bottom. Each wafer connector 20 has, for example, a flat plate shape, and is fitted to the mating connector 10 in a state where a plurality of stacked-type wafer connectors 20 are stacked in the thickness direction of the wafer connector 20.

In the following description, a fitting direction of the wafer connector 20 with the mating connector 10 may be referred to as a direction in which an X axis extends (X-axis direction), a direction in which a plurality of wafer connectors 20 are arranged in the mating connector 10 may be referred to as a direction in which a Z axis extends (Z-axis direction), and a lateral direction intersecting (e.g., orthogonal to) the X axis and the Z axis may be referred to as a direction in which a Y axis extends (Y-axis direction). Further, a direction in which the connector assembly 1 is viewed from the board B may be referred to as an upper direction, and a direction in which the board B is viewed from the connector assembly 1 may be referred to as a lower direction. For example, the X-axis direction coincides with the thickness direction of the board B and the direction in which the board B and the connector assembly 1 are arranged. The Y-axis direction coincides with a direction in which a passage 42 (to be described later) of each wafer connector 20 is arranged, for example. The Z-axis direction coincides with, for example, a direction in which a plurality of mating connectors 10 are arranged or a direction in which a plurality of wafer connectors 20 are stacked.

Fig. 2 is a perspective view of the connector assembly 1. Fig. 3 is a perspective view of the connector assembly 1 viewed from a direction different from that of fig. 2. Fig. 4 is a sectional view of the connector assembly 1 obtained by cutting the connector assembly 1 along a plane (XY plane) extending in both the X axis and the Y axis. As shown in fig. 2-4, a plurality of wafer connectors 20 are disposed inside mating connector 10 along the Z-axis, and each wafer connector 20 includes a plurality of terminals 30 and an electrically insulative wafer 40 including cavities 41 that receive terminals 30. Dividing the cavity 41 into a plurality of channels 42.

For example, a plurality of contacts 11 to be inserted into the board B extend from the mating connector 10, and each contact 11 has a bar shape extending in the X-axis direction. The mating connector 10 includes a concave portion 10B which is recessed downward (recessed toward the board B) in a bottom surface 18a of a bottom portion 18 of the mating connector 10 and into which an extended portion 11B of an insertion portion 11a penetrates, and a hole portion 10c through which the insertion portion 11a of the contact 11 penetrates along the X axis. The contact 11 is fixed to the mating connector 10 in a state where the insertion portion 11a is inserted into the hole portion 10c and the extension portion 11b enters the concave portion 10 b.

The mating connector 10 includes an open end 12 and a receiving area 13 for receiving a wafer connector 20. The mating connector 10 defines a receiving area 13 for receiving a plurality of wafer connectors 20. For example, the receiving area 13 is an area inside the box-shaped mating connector 10, and the open end 12 is a portion opened on the opposite side of the bottom portion 18 (plate B). In the receiving area 13, for example, a plurality of wafer connectors 20 are fitted to the mating connector 10 along the X-axis, and the terminals 30 within the wafer connectors 20 are connected to (contact) the contacts 11 extending from the mating connector 10.

For example, four wafer connectors 20 are assembled to the mating connector 10. Each of the plurality of wafer connectors 20 includes a latch engaging portion 25 that engages the mating connector 10. The mating connector 10 includes an engaging portion 10d that engages with the latch engaging portion 25. The wafer connector 20 is fitted to the mating connector 10 by engaging the latch engaging portions 25 with the engaging portions 10 d.

The engaging portion 10d of the mating connector 10 includes, for example, a hole portion 10f with which the latch engaging portion 25 is engaged and penetrates the engaging portion 10d in the Y-axis direction. For example, all of the plurality of wafer connectors 20 arranged in the Z-axis direction are engaged with the engaging portions 10 d. However, among the plurality of wafer connectors 20 arranged in the Z-axis direction, the engagement pattern of the latch engaging portions 25 of some of the wafer connectors 20 may be different from the engagement pattern of the latch engaging portions 25 of the remaining wafer connectors 20.

Fig. 5 is a perspective view of the mating connector 10. As shown in fig. 5, the contact 11 includes the above-described extending portion 11b and a rod-like terminal connection portion 11c that extends from the extending portion 11b to the opposite side of the insertion portion 11a and enters the terminal 30. Further, the mating connector 10 includes a first side wall 14 and a second side wall 15 arranged in the Z-axis direction, and a third side wall 16 and a fourth side wall 17 arranged in the Y-axis direction. The receiving area 13 is defined by the bottom portion 18, the first side wall 14, the second side wall 15, the third side wall 16 and the fourth side wall 17 of the above-described mating connector 10, and the open ends 12 are provided on opposite sides of the bottom portion 18.

For example, the receiving area 13 is divided for each wafer connector 20 to be fitted into the mating connector 10. The mating connector 10 includes a plurality of receiving cavities 13a for receiving the wafer connectors 20, and the plurality of receiving cavities 13a are separated from each other by the insertion protrusions 13 b. That is, the receiving cavity 13a is defined on each of one side and the other side of the protrusion 13b in the Z-axis direction. The protruding portion 13b is formed of, for example, a protruding surface 13c protruding from the inner surface of the fourth side wall 17, a linear top surface 13d extending in the X-axis direction at the protruding end of the protruding surface 13c, a tapered surface 13f inclined in the direction in which the width of the top surface 13d decreases at the end of the protruding surface 13c on the open end 12 side, and a top surface 13g on the open end 12 side of the tapered surface 13 f.

The bottom portion 18 includes, for example, a plurality of convex portions 18B protruding to the outside (lower side, plate B side) of the bottom portion 18 in the X-axis direction, and a plate insertion portion 18c inserted into the plate B. For example, the board insertion portion 18c is a metal portion different from a resin portion (e.g., a portion other than the board insertion portion 18 c) of the mating connector 10. The bottom portion 18 has, for example, a rectangular shape, and a convex portion 18b is provided at each of four corners of the bottom portion 18. For example, each of the plurality of convex portions 18B is in contact with the upper surface of the plate B, and a gap S1 (see fig. 1) is formed between the portion of the bottom portion 18 other than the convex portion 18B and the upper surface of the plate B. The bottom portion 18 includes a pair of board insertion portions 18c arranged, for example, in the Y-axis direction, and the mating connector 10 is fixed to the board B by inserting each of the board insertion portions 18c into the board B.

The third side wall 16 includes an outer surface 16a extending in both the X-axis direction and the Z-axis direction, an inclined surface 16b inclined outward in the Y-axis direction from an end of the outer surface 16a opposite to the bottom portion 18, and an outer surface 16c extending in both the X-axis direction and the Z-axis direction at an end of the outer surface 16b opposite to the outer surface 16 a. The outer surface 16a, the inclined surface 16b and the outer surface 16c are all flat, for example.

The above-described engaging portion 10d is formed on the inclined surface 16b and the outer surface 16 c. The engaging portion 10d is formed at a position recessed toward the center of the mating connector 10 from the inclined surface 16b and the outer surface 16c, for example. For example, the outer surface 16c and the inclined surface 16b are formed on both the left and right sides of the engaging portion 10d, and the inclined surface 16b is formed on the lower side of the engaging portion 10 d. The engaging portion 10d includes, for example, a wall portion 10g extending in the X-axis direction and the Z-axis direction, and a plurality of hole portions 10f penetrating the wall portion 10g in the Y-axis direction.

For example, the wall portion 10g includes a top surface 10h facing upward and an inclined surface 10j inclined from the top surface 10h toward the inside and the lower side of the mating connector 10. The top surfaces 10h of the engaging portions 10d are recessed from the upper ends 14a and 15a of the first and

second side walls

14 and 15, respectively, and at least a portion of the plurality of latch engaging portions 25 is exposed to the recessed portion. In this way, the top surfaces 10h of the engaging portions 10d are recessed from the upper ends 14a and 15a of the first and

second side walls

14 and 15, respectively, and at least a portion of the latch engaging portions 25 is exposed to the recessed portion, so that each latch engaging portion 25 can be easily gripped by a finger or the like.

The first side wall 14, the second side wall 15 and the fourth side wall 17 are each, for example, a flat plate. The height of the upper end 17a of the fourth side wall 17 is lower than the height of the upper end 14a of the first side wall 14 and the height of the upper end 15a of the second side wall 15. The height of the upper end 17a of the fourth sidewall 17 may be substantially the same as the height of the top surface 10h of the joining portion 10d of the third sidewall 16. A protruding portion 26 of the wafer connector 20, which will be described later, protrudes from the upper end 17a of the fourth sidewall 17.

Fig. 6 is a perspective view showing a plurality of stacked wafer connectors 20. Fig. 7 is a perspective view showing a state where two wafer connectors 20 are separated from each other. Fig. 8 is a perspective view showing a state in which two wafer connectors 20 are engaged with each other. As shown in fig. 6, 7 and 8, for example, a plurality of plate-shaped wafer connectors 20 are stacked in the Z-axis direction. As described above, each wafer connector 20 includes a terminal 30 and an electrically insulating wafer 40. The wafer 40 has, for example, a plate shape extending in the X-axis direction and the Y-axis direction, and has a thickness in the Z-axis direction.

Wafer 40 of wafer connector 20 includes first and second end surfaces 43 and 44 arranged in the X-axis direction, first and second side surfaces 45 and 46 arranged in the Y-axis direction, and first and

second base portions

47 and 48 arranged in the Z-axis direction. The first end surface 43 and the second end surface 44 face each other, and the first base portion 47 and the second base portion 48 extend between the first end surface 43 and the second end surface 44. The first side surface 45 and the second side surface 46 face each other, and the first base portion 47 and the second base portion 48 extend between the first side surface 45 and the second side surface 46. The cavity 41 is defined between a first base portion 47 and a second base portion 48.

The first end surface 43 is a portion that receives an external terminal to be inserted, and has, for example, a rectangular shape that faces the X-axis direction and is elongated in the Y-axis direction. That is, the first end surface 43 has a rectangular shape including a long side extending in the Y-axis direction and a short side extending in the Z-axis direction. For example, the first end surface 43 has a planar shape. For example, in the first end surface 43, openings 41a in the plurality of cavities 41 arranged in the Y-axis direction are formed. For example, each opening 41a has a rectangular shape.

The second end surface 44 faces, for example, the opposite side of the first end surface 43 and receives a plurality of contacts 11 extending from the mating connector 10. Similar to the first end surface 43, the second end surface 44 has, for example, a rectangular shape facing the X-axis direction and elongated in the Y-axis direction. One end of the first side surface 45 on the first end surface 43 side is provided with a protruding portion 26 protruding in the Y-axis direction. The first side surface 45 has, for example, a rectangular shape elongated in the X-axis direction. The protruding portion 26 includes an inclined surface 26a extending obliquely with respect to both the X-axis direction and the Y-axis direction, and a top surface 26b located between the inclined surface 26a and the first end surface 43 side.

For example, the second side surface 46 extends from the first end surface 43 in the X-axis direction. The second side surface 46 is provided with a protruding portion 46b protruding from the side opposite to the first end surface 43 (the second end surface 44 side), and a latch engaging portion 25 extending from the protruding portion 46b along the second side surface 46. The second side surface 46 has, for example, a rectangular shape including a long side in the X-axis direction and a short side in the Z-axis direction. The protruding portion 46b includes a side surface 46c extending from the second side surface 46 in the Y-axis direction and the Z-axis direction, and a top surface 46d extending in the X-axis direction and the Z-axis direction at an end of the side surface 46c opposite to the second side surface 46.

The latch engaging portion 25 is integrally formed with the wafer 40. The latch engaging portion 25 includes a plate-shaped flexible arm 27 continuous with the top surface 46d, a latch portion 28 projecting outward from the flexible arm 27 in the Y-axis direction, and a pressing portion 29 projecting outward from a distal end of the flexible arm 27 in the Y-axis direction and pressed by a finger or the like in the Y-axis direction. The flexible arm 27 extends from the side surface 46c of the protruding portion 46b toward the first end surface 43, and an inclined surface 27a inclined with respect to both the X-axis direction and the Y-axis direction is formed on the opposite side of the pressing portion 29 at the distal end of the flexible arm 27.

For example, a curved surface 27b connecting the flexible arm 27 and the side surface 46c to each other is formed between the flexible arm 27 and the side surface 46 c. A gap S2 is formed between the second side surface 46 and the latch engaging portion 25 (flexible arm 27). The pressing portion 29 is a portion that presses toward the second side surface 46. When the pressing portion 29 is pressed, the flexible arm 27 is bent in the Y-axis direction with the side surface 46c as a starting point, and the flexible arm 27 is bent in the Y-axis direction to engage and disengage the latch portion 28.

For example, the engagement and disengagement of the latch portions 28 occurs in connection with each other in the plurality of integrated wafer connectors 20. Fig. 6 shows the state of the latched engagement position, wherein the wafer connector 20 is latched engaged to the mating connector 10. For example, the latch engaging portions 25 of the plurality of wafer connectors 20 move between the latch engaging position and the latch disengaging position by flexing in conjunction with one another. The latch disengaged position indicates a state in which the plurality of latch engaging portions 25 are bent such that the plurality of latch engaging portions 25 are closer to the second side surface 46 than the state shown in fig. 6. Details of the latch engaging portion 25 to the latch engaging position and the latch disengaging position will be described below.

The latch portion 28 is disposed between the side surface 46c (the proximal end of the flexible arm 27) and the pressing portion 29 (the distal end of the flexible arm 27). The latch portion 28 includes a tapered surface 28a inclined from the flexible arm 27 in both the X-axis direction and the Y-axis direction, a top surface 28b extending in the X-axis direction and the Z-axis direction at an end portion of the tapered surface 28a on the outer side in the Y-axis direction, and a side surface 28c extending in the Y-axis direction and the Z-axis direction on the opposite side of the top surface 28b from the tapered surface 28 a. The side surface 28c is a portion facing the lower surface of the wall portion 10g of the engaging portion 10d, and the top surface 28b and the tapered surface 28a are portions which are in latching engagement with the engaging portion 10d and exposed from the hole portion 10 f.

The pressing portion 29 includes a curved surface 29a extending from the flexible arm 27, a first protruding surface 29b extending from the curved surface 29a, an inclined surface 29c extending from the first protruding surface 29b, a top surface 29d, and a second protruding surface 29e extending from the top surface 29d on the opposite side to the inclined surface 29 c. The curved surface 29a is inclined from the flexible arm 27 with respect to both the X-axis direction and the Y-axis direction. The first protrusion surface 29b extends from the opposite side of the curved surface 29a from the flexible arm 27 in the Y-axis direction and the Z-axis direction, and the inclined surface 29c is inclined from the opposite end of the first protrusion surface 29b from the curved surface 29a with respect to both the X-axis direction and the Y-axis direction. The top surface 29d is located on the opposite side of the inclined surface 29c from the first protrusion surface 29b, and the second protrusion surface 29e extends in the Y-axis direction and the Z-axis direction on the opposite side of the top surface 29d from the inclined surface 29 c. The top surface 29d is a portion to which a finger or the like is applied. When a finger or the like presses the top surface 29d, the flexible arm 27 is bent in the Y-axis direction toward the center of the wafer connector 20.

The first base portion 47 includes, for example, a surface 47a facing the other wafer connector 20 (wafer 40) in the Z-axis direction, and a projection 47b and an engagement portion 49b extending outward from the surface 47a in the thickness direction of the wafer 40 (in the Z-axis direction). The surface 47a is, for example, flat, and the protrusion 47b is cylindrical. The engaging portion 49b has, for example, a cylindrical shape similar to the projection 47 b. For example, the height of the engaging portion 49b is higher than the height of the protrusion 47 b. However, the shapes of the protruding portion 47b and the engaging portion 49b are not limited to the cylindrical shape, and may be, for example, a prismatic shape, an elliptical cylindrical shape, or the like, and may be appropriately changed.

The protrusion 47b and the engagement portion 49b of the wafer connector 20 (e.g., a first wafer connector) are, for example, portions to which another wafer connector 20 (e.g., a second wafer connector) is coupled. The first base portion 47 includes, for example, a plurality of protrusions 47b and an engagement portion 49 b. The plurality of protrusions 47b are provided at, for example, one end of the first base portion 47 in the Y-axis direction and the other end of the first base portion 47 in the Y-axis direction, respectively. In this way, since the protruding portions 47b are provided at one end of the first base portion 47 in the Y-axis direction and at the other end of the first base portion 47 in the Y-axis direction, respectively, they can be securely coupled with the other wafer connectors 20 at both ends in the Y-axis direction.

For example, in at least one end portion in the Y-axis direction (for example, an end portion on the projection portion 26 side), a plurality of projections 47b are provided at one end portion in the X-axis direction and the other end portion in the X-axis direction, respectively. Since the protrusions 47b are provided at one end portion in the X-axis direction and at the other end portion in the X-axis direction, respectively, it is possible to securely couple with the other wafer connector 20 at both ends in the X-axis direction. In the present embodiment, the set C of two protrusions 47b is provided at each of the two end portions in the X-axis direction at the end portion on the protrusion portion 26 side in the Y-axis direction (the opposite side of the latch engaging portion 25), and the set C of two protrusions 47b is provided at the end portion on the latch engaging portion 25 side in the Y-axis direction and at the end portion on the second end surface 44 side. In each group C, the two protrusions 47b are arranged side by side in the X-axis direction. Each protrusion 47b includes an outer circumferential surface 47c extending upward relative to the surface 47a, a tapered surface 47d at an upper end of the outer circumferential surface 47c, and a top surface 47e at an upper end of the tapered surface 47 d.

The engagement portion 49b is provided in the latch engagement portion 25. For example, the engagement portion 49b protrudes from the flexible arm 27 (e.g., the pressing portion 29) of the latch engagement portion 25 in the Z-axis direction. The engagement portion 49b is a portion for coupling the latch engagement portion 25 of a wafer connector 20 (e.g., a first wafer connector) to the latch engagement portion 25 of another wafer connector 20 (e.g., a second wafer connector).

The plurality of latch engaging portions 25 may interlock with the latch engaging position and the latch disengaging position through the engaging portion 49 b. The engaging portion 49b includes, for example, a first tapered surface 49c protruding from the side surface 27c of the flexible arm 27 facing the Z-axis direction, an outer circumferential surface 49d extending from the first tapered surface 49c in the Z-axis direction, a second tapered surface 49f having a reduced diameter at an end of the outer circumferential surface 49d on the side opposite to the first tapered surface 49c, and a top surface 49g facing the Z-axis direction on the side opposite to the outer circumferential surface 49d of the second tapered surface 49 f.

The second base portion 48 includes a surface 48a facing the other wafer connector 20 (e.g., the second wafer connector) in the Z-axis direction, an opening 48b recessed from the surface 48a in the thickness direction of the wafer 40 and into which the protrusion 47b is inserted, and terminal engaging

portions

48c and 48f engaging the terminal 30 inserted into the cavity 41. The

terminal engaging portions

48c and 48f are through holes that engage the terminals 30. For example, the

terminal engagement portions

48c and 48f have a rectangular shape.

Opening 48b is a portion for coupling wafer 40 of another wafer connector 20 to wafer 40. The second base portion 48 includes, for example, a plurality of openings 48 b. The plurality of openings 48b are provided at one end portion of the second base portion 48 in the Y-axis direction and at the other end portion of the second base portion 48 in the Y-axis direction, respectively. For example, in at least one end portion of the second base portion 48 in the Y-axis direction (for example, an end portion on the projection portion 26 side), an opening 48b is provided at each of one end portion of the second base portion 48 in the X-axis direction and the other end portion of the second base portion 48 in the X-axis direction.

In the present embodiment, the opening 48b is provided at each of both end portions in the X-axis direction and an end portion of the projection portion 26 side in the Y-axis direction. The openings 48b are provided at end portions on the latch engaging portion 25 side in the Y-axis direction and at end portions on the second end surface 44 side. The opening 48b has, for example, a rectangular shape including a long side in the X-axis direction and a short side in the Y-axis direction. The opening 48b includes an inner side surface 48e against which the outer circumferential surface 47c of the projection 47b abuts. For example, the inner side surfaces 48e are provided in pairs in the width direction (Y-axis direction) of the opening 48 b.

The width of the opening 48b (the distance between the pair of inside surfaces 48 e) is substantially the same as the diameter of the outer circumferential surface 47c of the projection 47 b. Therefore, when the projection 47b is pushed into the opening 48b, the outer circumferential surface 47c abuts each inner side surface 48e of the opening 48b, and the projection 47b is coupled to the opening 48 b. For example, two protrusions 47b forming the group C are inserted into one opening 48b, and the outer circumferential surfaces 47C of the two protrusions 47b abut the pair of inner side surfaces 48e, respectively. In this way, by including one opening 48b for the plurality of protrusions 47b, the number of openings 48b can be reduced.

As shown in fig. 9, the second base portion 48 includes an engaging portion 49h that engages with the engaging portion 49b of the first base portion 47. The engaging portion 49h is, for example, an engaging portion to be engaged with an engaging portion 49b formed in the first base portion 47. The engaging portion 49h is, for example, a hole into which the engaging portion 49b of the other wafer 40 is inserted, and is provided in the latch engaging portion 25. For example, the engaging portion 49h is formed on the side surface 27d facing opposite to the side surface 27c in the flexible arm 27 (e.g., the pressing portion 29) of the latch engaging portion 25. The engaging portion 49h includes, for example, an inner circumferential surface 49j abutting against an outer circumferential surface 49d of the engaging portion 49b, and a tapered surface 49k on the side surface 27d side of the inner circumferential surface 49 j. For example, the diameter of the inner circumferential surface 49j is substantially the same as the diameter of the outer circumferential surface 49 d. In this case, the engaging portion 49b is firmly engaged with the engaging portion 49 h.

Fig. 10 is a sectional perspective view showing the internal structure of the wafer 40. As shown in fig. 10, for example, on the second end surface 44 of the wafer 40, a plurality of hole portions 44b arranged in the Y-axis direction are formed, and each hole portion 44b penetrates in the X-axis direction in the second end surface 44 and communicates with the cavity 41. The cavity 41 includes a bottom surface 41b, which the fitting portion 32 of the terminal 30 faces in the X-axis direction.

A plurality of terminals 30 arranged at a distance from each other are accommodated in the cavity 41. Each terminal 30 includes a wire connecting portion 31 provided at a position adjacent to the first end surface 43 and a fitting portion 32 provided at a position adjacent to the second end surface 44. The wire connecting portion 31 includes a pressure contact portion 35 and a first support portion 36, and the fitting portion 32 includes a second support portion 37 and a contact arm portion 38.

The fitting portion 32 includes, for example, contact arm portions 38 facing each other and having flexibility, and when the fitting portion 32 receives the contact 11 of the mating connector 10, the contact 11 is received between the pair of contact arm portions 38 spread apart. The second support portion 37 is provided on the wire connecting portion 31 side of the contact arm portion 38. For example, the second support portion 37 includes a pair of arm portions 37a facing each other.

The first support portion 36 includes, for example, a pair of arm portions 36a that receive the wire inserted in the cavity 41 and extending in the X-axis direction. For example, the positions of the pair of arm portions 36a in the X-axis direction are offset from each other. That is, one arm portion of the pair of arm portions 36a is positioned closer to the end side than the other arm portion in the X-axis direction. The press-contact portion 35 is a portion that electrically connects the wire inserted into the cavity 41 to the terminal 30. For example, in a state where the pressure contact portion 35 supports the wire inserted into the cavity 41 from the outside of the wafer 40, the pressure contact portion 35 electrically connects the wire to the terminal 30.

Next, the fitting structure of the wafer connector 20 with respect to the mating connector 10 will be described. As shown in fig. 2, the respective latch engaging portions 25 of the plurality of wafer connectors 20 arranged in the Z-axis direction are engaged with the engaging portions 10d of the mating connector 10. For example, in the plurality of wafer connectors 20 arranged in the Z-axis direction, the latch engaging portions 25 of the wafer connectors 20 located on the center side in the Z-axis direction may be deeply engaged with the mating connector 10, and the latch engaging portions 25 of the wafer connectors 20 located on the end side in the Z-axis direction may be shallowly engaged with the mating connector 10. For example, among four wafer connectors 20 arranged in the Z-axis direction, the latch engaging portions 25 of two wafer connectors 20 located on the center side in the Z-axis direction may be deeply engaged with the mating connector 10, and the latch engaging portions 25 of two wafer connectors 20 located on the end side in the Z-axis direction may be shallowly engaged with the mating connector 10.

Fig. 11 is a sectional view showing an example of a latch engagement position where the first latch engagement portion 25 of the first wafer connector 20A (wafer 40A) on the end side in the Z-axis direction engages with the mating connector 10. Fig. 12 is a sectional view showing an example of a latch engagement position where the second latch engagement portion 25 of the second wafer connector 20B (wafer 40B) on the center side in the Z-axis direction engages with the mating connector 10. The configurations of the first wafer connector 20A and the second wafer connector 20B (the wafer 40A and the wafer 40B) are, for example, the same as those of the wafer connector 20 and the wafer 40 described above.

The latch engaging portion 25 of each of the first and

second wafer connectors

20A and 20B includes a flexible arm 27. The first flexible arm 27 of the first wafer connector 20A moves between a latch engaged position where the first wafer connector 20A is latched into the mating connector 10 and a latch disengaged position where the first wafer connector 20A is unlatched from the mating connector 10. The second flexible arm 27 of the second wafer connector 20B moves between a latch engaged position where the second wafer connector 20B is latched to the mating connector 10 and a latch disengaged position where the second wafer connector 20B is unlatched from the mating connector 10.

As described above, the first wafer connector 20A and the second wafer connector 20B are connected to each other through the bonding portion 49B and the bonding portion 49 h. For example, when the first flexible arm 27 is moved between the latch engaging position and the latch disengaging position in a state where the first engaging portion 49B of the first wafer connector 20A is engaged with the second engaging portion 49h of the second wafer connector 20B, the second flexible arm 27 is also moved between the latch engaging position and the latch disengaging position together with the first flexible arm 27.

For example, fig. 11 and 12 show the latched engagement state of each of the first and

second wafer connectors

20A and 20B, and when the flexible arms 27 are moved away from the centers of the mating connector 10 by the distances d1 and d2, a transition from the latched engagement state to the unlatched state occurs. For example, the disengagement distance d1 of the first wafer connector 20A is the distance between the outer surface (e.g., the top surface 28b) of the latching portion 28 of the first wafer connector 20A and the inner surface (e.g., the inner surface of the wall portion 10g) of the engagement portion 10 d.

When the flexible arm 27 is bent toward the center side of the mating connector 10 by the disengagement distance d1, the position of the flexible arm 27 is the latch disengagement position. Similar to the disengagement distance d1, the disengagement distance d2 of the second wafer connector 20B is the distance between the outer surface of the latch portion 28 of the second wafer connector 20B and the inner surface of the engagement portion 10 d. When the flexible arm 27 is bent toward the center side of the mating connector 10 by the disengagement distance d2, the position of the flexible arm 27 is the latch disengagement position.

When the first wafer connector 20A is pulled up from the mating connector 10 in a state where the first wafer connector 20A is in the latch disengaged position, the first wafer connector 20A can be pulled out from the mating connector 10. As described above, the flexible arms 27 of the second wafer connector 20B are connected to the flexible arms 27 of the first wafer connector 20A by inserting the engaging portions 49B and 49 h.

Therefore, when the first wafer connector 20A is in the latch engagement state, the second wafer connector 20B is also in the latch engagement state, and when the first wafer connector 20A is in the unlock state, the second wafer connector 20B is also in the unlock state. Therefore, since the second wafer connector 20B is also pulled up when the first wafer connector 20A is pulled up from the mating connector 10, the second wafer connector 20B can be pulled out at the same time as the first wafer connector 20A is pulled out. Therefore, all the wafer connectors 20 can be pulled out only by setting one wafer connector 20 to the unlocked state.

As described above, the release distance d1 of the first wafer connector 20A is different from the release distance d2 of the second wafer connector 20B, e.g., the release distance d1 is less than the release distance d 2. In the present disclosure, "disengagement distance" indicates the distance that the latch engaging portion 25 (flexible arm 27) moves when transitioning from the latch engaging state to the unlocked state, and may include the amount of engagement of the latch engaging portion 25. In the present embodiment, for example, the bonding amount is different for each wafer connector 20. An example of implementing this configuration will be described. As described above, the mating connector 10 defines the plurality of receiving cavities 13a (see fig. 5) that receive the first and

second wafer connectors

20A and 20B, respectively, and includes the engaging portions 10d that engage with the latch portions 28 of the first and

second wafer connectors

20A and 20B received in the respective receiving cavities 13 a.

The width p1 of the engagement portion 10d of the first receiving cavity 13a receiving the first wafer connector 20A may be different from the width p2 of the engagement portion 10d of the second receiving cavity 13a receiving the second wafer connector 20B. For example, the width p1 of the wall portion 10g constituting the engaging portion 10d of the first receiving chamber 13a may be narrower than the width p2 of the wall portion 10g constituting the engaging portion 10d of the second receiving chamber 13 a. Because width p1 is less than width p2, a configuration is achieved in which disengagement distance d1 is shorter than disengagement distance d 2. The first receiving cavity 13a indicates the receiving cavity 13a located on the end side of the mating connector 10 in the Z-axis direction, and the second receiving cavity 13a indicates the receiving cavity 13a located on the center side of the mating connector 10 in the Z-axis direction.

The interval t1 between the engagement portion 10d of the first receiving cavity 13a and the flexible arm 27 when the first wafer connector 20A is received in the first receiving cavity 13a may be different from the interval t2 between the engagement portion 10d of the second receiving cavity 13a and the flexible arm 27 when the second wafer connector 20B is received in the second receiving cavity 13 a. For example, interval t1 may be wider than interval t 2. Since interval t1 is wider than interval t2, a configuration is achieved in which disengagement distance d1 is shorter than disengagement distance d 2. Interval t2 may be 0. In this case, the flexible arms 27 and the engaging portions 10d of the second wafer connector 20B contact each other.

Next, the effects of the wafer connector 20 and the mating connector 10 according to the present embodiment will be described. For example, as shown in fig. 7 and 8, in the wafer connector 20 according to the present embodiment, when the first flexible arm 27 is moved between the latch engaging position and the latch disengaging position in a state where the first engaging portion 49b of the first wafer connector 20 is engaged with the second engaging portion 49h of the second wafer connector 20, the second flexible arm 27 is also moved between the latch engaging position and the latch disengaging position. Accordingly, since the plurality of flexible arms 27 may interlock with each other between the plurality of wafer connectors 20, all of the wafer connectors 20 may be transitioned to the unlocked state by pressing the flexible arms 27 of only one wafer connector 20. Therefore, a plurality of wafer connectors 20 can be easily pulled out together from the mating connector 10. Further, since the plurality of wafer connectors 20 can be integrated by engaging the first engaging portions 49b of the first wafer connectors 20 with the second engaging portions 49h of the second wafer connectors 20, the plurality of integrated wafer connectors 20 can be easily inserted into the mating connector 10. Accordingly, a plurality of wafer connectors 20 can be easily inserted into and removed from the mating connector 10.

The first engaging portion 49b may be a convex portion, and the second engaging portion 49h may be a concave portion. The first engaging portion may be a concave portion, and the second engaging portion may be a convex portion. In this case, the configuration of the first engaging portion and the second engaging portion can be simplified.

Wafer 40 may include at least one protrusion 47b extending outwardly from wafer 40. When the second wafer connector 20 is stacked on the second wafer connector 20, the at least one protrusion 47b may be inserted into the at least one opening 48b of the second wafer connector 20. By inserting the at least one projection 47b into the at least one opening 48b, relative rotation between the first and

second wafer connectors

20, 20 may be inhibited. In this case, by inserting the projection 47b into the opening 48b, the wafer connector 20 can be prevented from sliding in the fitting direction (X-axis direction). In addition, the engagement between the plurality of wafer connectors 20 may be enhanced.

The stacked first and

second wafer connectors

20 and 20 may be fitted to the mating connector 10, and the first and

second wafer connectors

20 and 20 may be latch-engaged to the mating connector 10. When one of the stacked first and

second wafer connectors

20, 20 is unlocked from the mating connector 10, the other of the stacked first and

second wafer connectors

20, 20 may also be unlocked from the mating connector 10. In this case, since the latching engagement of the plurality of wafer connectors 20 with the mating connector 10 and the unlocking of the plurality of wafer connectors 20 from the mating connector 10 are performed between the plurality of wafer connectors 20 together with each other, the insertion and removal can be performed more easily.

The wafer 40 may include a first base portion 47 and a second base portion 48 extending between the first side surface 45 and the second side surface 46 facing each other and between the first end surface 43 and the second end surface 44 facing each other. The latch engaging portion 25 may extend from the second side surface 46. Cavity 41 may be defined between first base portion 47, second base portion 48, first side surface 45, second side surface 46, first end surface 43, and second end surface 44. The wafer 40 may receive external terminals inserted into at least one opening 41a defined in the first end surface 43. The second end surface 44 defines at least one hole 44b to be fitted to the mating connector 10, and the contact 11 of the mating connector 10 can be received through the hole portion 44 b.

As shown in fig. 5, 11 and 12, the mating connector 10 according to the present embodiment defines a plurality of receiving cavities 13a for receiving a plurality of wafer connectors 20, and includes engaging portions 10d that engage with latch portions 28 of the wafer connectors 20 received in the respective receiving cavities 13 a. The wafer connector 20 is then unlocked from the mating connector 10 by moving the latch portion 28 the disengagement distances d1 and d 2.

For at least two wafer connectors 20 received in each of the first receiving cavity 13a and the second receiving cavity 13a among the plurality of receiving cavities 13a, the first disengagement distance d1 when the latch portion 28 of the first wafer connector 20A moves in the first receiving cavity 13a may be different from the second disengagement distance d2 when the latch portion 28 of the second wafer connector 20B moves in the second receiving cavity 13 a. As described above, even if the first and second disengagement distances d1 and d2 are different from each other among the plurality of wafer connectors 20, the plurality of latch portions 28 are engaged and disengaged with each other. Therefore, insertion and removal with respect to the mating connector 10 can be easily performed.

The shape of the engaging portion 10d of the first receiving cavity 13a may be different from the shape of the engaging portion 10d of the second receiving cavity 13a such that the first disengaging distance d1 is different from the second disengaging distance d 2. The expression "the engaging portions are different in shape" is not limited to the case where the above-described width p1 and width p2 are different from each other, and also includes, for example, the case where the engaging portions are partially tapered or the degree of taper is different, or the like. The wafer connector 20 may also be provided with a flexible arm 27 including a latch portion 28, and t2 may be different from t1, where t1 is the spacing between the flexible arm 27 and the engagement portion 10d of the first receiving cavity 13a when the first wafer connector 20A is received in the first receiving cavity 13a, and t2 is the spacing between the flexible arm 27 and the engagement portion 10d of the second receiving cavity 13a when the second wafer connector 20B is received in the second receiving cavity 13 a. Further, the value of t2 may be 0.

The mating connector 10 includes a plurality of contacts 11 abutting the terminals 30 of the wafer connector 20, and the plurality of contacts 11 may be disposed in the plurality of receiving cavities 13 a. Further, the above-described first receiving cavity 13a may be a receiving cavity 13a provided adjacent to the first side wall 14 of the mating connector 10 on the end side, and the second receiving cavity 13a may be a receiving cavity 13a spaced apart from the first side wall 14 and the second side wall 15 facing the first side wall 14 on the center side.

Further, the receiving cavity 13a may include end side receiving cavities 13a adjacent to side walls (e.g., a first side wall 14 and a second side wall 15) facing each other and a center side receiving cavity 13a disposed between a pair of the end side receiving cavities 13 a. Each receiving cavity 13a may include an engagement portion 10d that receives the wafer connector 20 and engages the latch portion 28 of the wafer connector 20. Further, the engaging portions 10d may also extend along the side walls facing each other, and the relationship between the width p1 of the engaging portion 10d (wall portion 10g) on each end side and the width p2 of the engaging portion 10d on each center side may satisfy p1 < p 2. In this case, the latching engagement of the latch portions 28 on the end side with the engaging portion 10d can be made shallower than the latching engagement of the latch portions 28 on the center side with the engaging portion 10 d. Further, since the amount of engagement of the latch engaging portions 25 on the center side is larger than the amount of engagement of the latch engaging portions 25 on the end sides, when the latch engaging portions 25 on the center side having a larger amount of engagement are operated, the latch engaging portions 25 on the end sides having a smaller amount of engagement can be easily disengaged. Further, by pressing the pressing portion 29, the latch engaging portion 25 can be easily disengaged. Therefore, by pressing the pressing portions 29 of the latch engaging portions 25 on the center side, all the wafer connectors 20 can be pulled out more easily.

Embodiments of wafer connectors and mating connectors according to the present disclosure have been described above. However, the shape, size, number, material, arrangement, engagement, and the like of each part of the wafer connector and the mating connector according to the present disclosure are not limited to the above-described embodiments, and may be appropriately changed. For example, the shape, size, number, material, and arrangement of each of the mating connector 10, the wafer connector 20, the terminal 30, and the wafer 40 are not limited to those in the above-described embodiments, and may be appropriately changed.

For example, as shown in fig. 13, the mating connector 10 of the connector assembly 51 according to the modified example may include a convex portion 19 protruding from the third side wall 16. In this case, for example, a convex portion 19 of the mating connector 10 that protrudes outward (outward in the Y-axis direction) is formed on the outer surface 16a of the third side wall 16. For example, the convex portion 19 protrudes in a rectangular shape in a region including the center of the outer surface 16 a. The convex portion 19 may be provided below the engaging portion 10d (latch engaging portion 25) of the mating connector 10.

Thus, by providing the convex portion 19, the convex portion 19 can be used as a mark when searching for the fitting position of the wafer connector 20 to be fitted to the mating connector 10 with a finger. That is, in the case of including the convex portion 19 disposed below the latch engaging portion 25, the target wafer connector 20 can be easily found by combing the convex portion 19. Further, the position of the connector assembly 1 on the board B can be easily recognized by the comb-convex portion 19, and the target wafer connector 20 can be easily found.

In the above-described embodiment, an example in which four wafer connectors 20 are fitted to one mating connector 10 has been described. However, the number of wafer connectors fitted to one mating connector may be two, three, or five or more, and may be changed as appropriate. Further, in the above-described embodiments, the example in which the mating connector 10 of the connector assembly 1 is a panel-mount connector has been described. However, the mating connector according to the present disclosure may be a connector other than the board mount connector, and may be, for example, a relay connector that connects one electrical connector and another electrical connector to each other.

List of reference marks

10: a mating connector; 10 b: a concave portion; 10c, 10f, 44 b: a hole portion; 10 d: an engaging portion; 11: a contact member; 12: an open end; 13 a: receiving cavities (first receiving cavity, second receiving cavity); 14: a first side wall; 15: a second side wall; 16: a third side wall; 17: a fourth side wall; 18b, 19: a convex portion; 20. 20A, 20B: chip connectors (first chip connector, second chip connector); 25: a latch engaging portion; 26: a protruding portion; 27: a flexible arm; 28: a latch portion; 29: a pressing portion; 30: a terminal; 40: a wafer; 41: a cavity; 41 a: an opening; 43: a first end surface; 44: a second end surface; 45: a first side surface; 46: a second side surface; 47: a first base portion; 47 b: a protrusion portion; 48: a second base portion; 48 b: an opening; 49b, 49 h: an engaging portion (first engaging portion, second engaging portion); d1, d 2: a disengagement distance; p1, p 2: a width; t1, t 2: spacer

Claims

1. A stacked wafer connector configured to electrically fit to a mating connector, the wafer connector comprising:

a wafer electrically insulated, the wafer defining a cavity configured to receive a terminal therein;

a latch engagement portion including an engagement portion integrally formed with the wafer and including a flexible arm configured to move between a latch engagement position in which the wafer connector is latched engaged to the mating connector and a latch disengagement position in which the wafer connector is unlatched from the mating connector,

wherein in the following cases: a first one of the wafer connectors is stacked with a second one of the wafer connectors, the second wafer connector including a second one of the latch engaging portions, the second latch engaging portion including a second one of the flexible arms,

when a first one of the flexible arms moves between the latch engaged position and the latch disengaged position in a state where a first one of the engagement portions of the first wafer connector of the wafer connector is engaged with a second one of the engagement portions of the second wafer connector of the wafer connector, the second one of the flexible arms also moves between the latch engaged position and the latch disengaged position.

2. The wafer connector according to claim 1,

wherein the first of the engaging portions is one of a convex portion and a concave portion, and

the second of the engaging portions is the other of the convex portion and the concave portion.

3. The wafer connector according to claim 1,

wherein the wafer includes at least one protrusion extending outwardly from the wafer,

the at least one protrusion is inserted into at least one opening of the second one of the wafer connectors when the second one of the wafer connectors is stacked on the first one of the wafer connectors, and relative rotation between the first one of the wafer connectors and the second one of the wafer connectors is inhibited by inserting the at least one protrusion into the at least one opening.

4. The wafer connector according to claim 1,

wherein the first one of the stacked wafer connectors and the second one of the wafer connectors are configured to be fitted to the mating connector, and the first one of the latch engagement portions and the second one of the latch engagement portions are configured to be in latching engagement with the mating connector, and

when one of the first one of the stacked wafer connectors and the second one of the wafer connectors is unlocked from the mating connector, the other one of the first one of the stacked wafer connectors and the second one of the wafer connectors is also unlocked from the mating connector.

5. The wafer connector according to claim 1,

wherein the wafer comprises a first base portion and a second base portion extending between first and second side surfaces facing each other and between first and second end surfaces facing each other,

the latch engaging portion extends from one of the first side surface and the second side surface,

the cavity is defined between the first base portion, the second base portion, the first side surface, the second side surface, the first end surface, and the second end surface.

The wafer is configured to:

receive an external terminal inserted into at least one opening defined in the first end surface, and

the second end surface defines at least one aperture portion configured to fit to the mating connector and receive a contact of the mating connector via the aperture portion.

6. A mating connector defining a plurality of receiving cavities configured to receive a plurality of wafer connectors, the mating connector comprising:

an engagement portion configured to engage with a latch portion of the wafer connector received in each of the receiving cavities,

wherein the wafer connectors are configured to be unlocked from the mating connector by moving the latch portions a disengagement distance, and for two of the wafer connectors received in each of at least a first one of the receiving cavities and a second one of the receiving cavities, a first one of the disengagement distances when the latch portion of a first one of the wafer connectors is moved in the first one of the receiving cavities is different than a second one of the disengagement distances when the latch portion of a second one of the wafer connectors is moved in the second one of the receiving cavities.

7. The mating connector of claim 6, wherein the first one of the disengagement distances is different than the second one of the disengagement distances by a shape of an engagement portion of the first one of the receiving cavities being different than a shape of an engagement portion of the second one of the receiving cavities.

8. The mating connector of claim 6,

wherein the wafer connector comprises a flexible arm comprising the latch portion, and

when the first one of the wafer connectors is received in the first one of the receiving cavities, a spacing between the engagement portion of the first one of the receiving cavities and the flexible arm is defined as t1, and

when the second one of the wafer connectors is received in the second one of the receiving cavities, a spacing between the engagement portion of the second one of the receiving cavities and the flexible arm is defined as t2,

t2 is different from t 1.

9. The mating connector of claim 8, wherein the value of t2 is 0.

10. The mating connector of claim 6, wherein the mating connector includes a plurality of contacts configured to abut terminals of the wafer connector and disposed within the plurality of receiving cavities.

11. The mating connector of claim 6,

wherein the first one of the receiving cavities is an end side receiving cavity disposed adjacent a first side wall of the mating connector, and

the second one of the receiving cavities is a central side receiving cavity distal from the first side wall and a second side wall facing the first side wall.

12. A mating connector defining a plurality of receiving cavities configured to receive a plurality of wafer connectors,

wherein the receiving cavity comprises:

a receiving cavity at the end side adjacent to the side walls facing each other, and

a receiving cavity located on a center side between the receiving cavities provided on a pair of the end sides.

Each of the receiving cavities is configured to receive the wafer connector and includes an engaging portion configured to engage with a latching portion of the wafer connector, and

the engaging portions extend along side walls facing each other, and a relationship between a width p1 of the engaging portion at each end side and a width p2 of the engaging portion at each center side satisfies p1 < p 2.