CN112831671A - Gold leaching agent for selectively leaching gold in gold-containing material, preparation method and application - Google Patents
Gold leaching agent for selectively leaching gold in gold-containing material, preparation method and application Download PDFInfo
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- CN112831671A CN112831671A CN202110186970.5A CN202110186970A CN112831671A CN 112831671 A CN112831671 A CN 112831671A CN 202110186970 A CN202110186970 A CN 202110186970A CN 112831671 A CN112831671 A CN 112831671A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B11/00—Obtaining noble metals
- C22B11/04—Obtaining noble metals by wet processes
- C22B11/042—Recovery of noble metals from waste materials
- C22B11/046—Recovery of noble metals from waste materials from manufactured products, e.g. from printed circuit boards, from photographic films, paper or baths
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/16—Extraction of metal compounds from ores or concentrates by wet processes by leaching in organic solutions
- C22B3/1666—Leaching with heterocyclic compounds
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses a gold leaching agent for selectively leaching gold in gold-containing materials, a preparation method and application thereof. The gold leaching agent is prepared by adding water-soluble halogen-containing organic matters into an aqueous solution, and stirring for dissolving. The gold leaching agent is used for selectively leaching and recovering gold in gold-containing materials. The gold leaching agent disclosed by the invention is low in toxicity, stable in chemical property, capable of rapidly, mildly and selectively leaching gold leaching substances, superior to most traditional leaching agents such as cyanide leaching agents in gold leaching rate, small in secondary pollution after leaching, low in treatment difficulty of the leaching solution, wide in raw material source, simple in preparation process, low in requirement on preparation equipment, and capable of being industrially popularized in a large range.
Description
Technical Field
The invention relates to a gold leaching agent, a preparation method and application thereof, in particular to a gold leaching agent for selectively leaching gold in a gold-containing material, a preparation method and application thereof.
Background
As a metal with high chemical stability, high catalytic activity, good ductility and high thermal stability, gold has been applied to important industrial and scientific technical fields of currency storage, jewelry, communication technology, chemical technology, medical technology and the like. The earliest gold comes from the exploitation of gold-bearing ores, but with the abundance of human social life and the innovation of technology, gold is increasingly applied to other fields, and a plurality of secondary sources of gold, such as electronic garbage, industrial waste and the like, are generated, the high gold content in the gold-bearing materials brings high potential recovery value, and huge commercial opportunities are brought to 'panning heat'. For example, the anode mud in waste printed circuit boards and industrial waste in electronic waste has the characteristics of high yield, high gold content and high recycling value, and if the anode mud is discarded at will, the anode mud can not only pollute the environment, but also can not utilize valuable resources such as gold and the like. Therefore, the development of a safe, efficient and environment-friendly gold extraction technology is very important.
The metallurgical technology mainly comprises pyrometallurgy, hydrometallurgy, biological metallurgy and the like, wherein the pyrometallurgy is a technology for pyrolyzing gold-containing materials at high temperature, can separate metals from other materials, simultaneously recovers part of heat energy, but generates toxic and harmful byproducts such as dioxin and the like, and needs to be combined with the hydrometallurgy technology if the later separation of gold from various metals is desired. The biological metallurgy mainly utilizes microorganisms to recover gold in gold-containing materials, and comprises technologies such as biological leaching and biological adsorption, the cost of the biological metallurgy technology is low, but the recovery rate of the biological metallurgy technology to the gold is low, the time for searching for suitable microorganisms is long, and the biological metallurgy technology cannot be applied in a large range at the present stage. The hydrometallurgy is more accurate and controllable, the result is more predictable, and the effect of metal recovery is better, so that the method is the technology which is most commonly used and has the most negative prospect at present.
The gold is recovered by utilizing the hydrometallurgy technology, the gold in a gold-containing material needs to be leached firstly, namely, the gold enters a leaching solution through a leaching reaction, and preconditions are provided for the next steps of solvent extraction, ion exchange, electrochemical recovery and the like. However, the traditional leaching agents such as cyanide, aqua regia, thiourea and the like have the problems of high corrosivity, low selectivity to gold, high toxicity, high cost, easy secondary pollution and the like. Among them, cyanide is the most common gold leaching agent, and although it has been used for hundreds of years in gold recovery in gold mine and some secondary resources, it causes many cases of pollution and serious river and underground water pollution, so it is urgently needed to develop a green and environment-friendly technology capable of leaching gold rapidly and selectively, and can achieve the goal of recycling and harmless treatment of gold-containing materials.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a gold leaching agent for selectively leaching gold in gold-containing materials.
The invention also aims to provide a preparation method of the gold leaching agent for selectively leaching gold in gold-containing materials.
Another object of the invention is to provide the use of said gold leaching agent for the selective leaching of gold from gold-containing materials.
The technical scheme is as follows: the invention provides a gold leaching agent for selectively leaching gold from gold-containing materials, which comprises water-soluble halogen-containing organic matters.
The water-soluble gold leaching agent has the advantages that halogen ions with strong coordination capacity with gold are formed in an aqueous solution, and after the halogen ions are combined with the surface of the gold, the oxidation-reduction potential of the gold can be reduced, so that the gold is easier to be oxidized; secondly, the water-soluble gold leaching agent can also form hypohalite ions, halide ions and halogen free radicals with strong oxidizing property in aqueous solution, so that the continuous and rapid leaching of gold can be promoted; and secondly, organic matters formed after dehalogenation of the water-soluble gold leaching agent can be combined with a gold-containing complex formed after gold is leached, so that the gold-containing complex is stabilized.
Further, the water-soluble halogen-containing organic compound includes a mixture of one or more of readily soluble, and slightly soluble in the water-containing organic compound.
Further, the halogen is one or a mixture of F, Cl, Br and l.
The preparation method of the gold leaching agent for selectively leaching gold in gold-containing materials comprises the steps of adding water-soluble halogen-containing organic matters into an aqueous solution, and stirring for dissolving.
Further, the concentration of the organic halogen-containing substance in the aqueous solution is 1 to 600mmol/L, preferably 10 to 300mmol/L, and more preferably 25 to 300 mmol/L.
The gold leaching agent for selectively leaching gold in the gold-containing material is used for selectively leaching and recovering gold in the gold-containing material.
Further, the temperature of the leaching reaction is 5 to 100 ℃, preferably 10 to 50 ℃, and more preferably 25 ℃.
Further, the gold-containing material is gold ore, gold-containing industrial waste and gold-containing electronic garbage.
Further, the solid-liquid ratio during leaching is 1: 3-1: 500, preferably 1: 300.
Has the advantages that: the non-cyanide gold leaching agent can replace cyanide to become a high-efficiency and low-price gold leaching agent, has no toxicity, does not generate secondary pollution, is environment-friendly and high-efficiency, and can ensure that the gold leaching becomes a green and environment-friendly process. The preparation method is simple. The raw materials have wide sources, the requirement on preparation equipment is low, and the method can be industrially popularized in a large range. The gold leaching agent has mild and rapid gold leaching conditions, can leach gold with high selectivity, has a leaching rate superior to that of most traditional leaching agents (including cyanide leaching agents), can obtain industrially acceptable high gold leaching rate under the conditions of lower concentration and liquid-solid ratio, has a low leaching rate on other main metals in gold-containing materials, can obtain high-selectivity recovery on gold, improves the leaching separation degree of gold and other metals, and has low reagent toxicity, small secondary pollution, low treatment difficulty on waste liquid and wide practical application prospect.
Drawings
FIG. 1 is a graph showing the leaching rate of gold and other main metals from the gold fingers of the printed circuit board by the bromine-chlorine hydantoin leaching agent in example 1 as a function of time;
FIG. 2 is a graph showing the relationship between gold leaching rates of trichloroisocyanuric acid leaching agent and gold and other main metals in a printed circuit board gold finger and time in example 2;
FIG. 3 is a graph showing the leaching rate of iodosuccinimide leaching agent in the gold finger of the printed circuit board and other main metals as a function of time in example 3;
FIG. 4 is a graph showing the leaching rates of gold and other main metals from the gold finger of the printed circuit board at low temperature by the bromine-chlorine-hydantoin leaching agent in example 4 as a function of time;
FIG. 5 is a graph showing the leaching rates of gold and other main metals from the printed circuit board gold finger of the low solid-to-liquid ratio leaching agent of bromochlorohydantoin in example 5 as a function of time;
FIG. 6 is a graph showing the leaching rate of gold and other main metals from the gold fingers of the printed circuit board at high temperature with respect to time in example 6;
FIG. 7 is a graph of leaching rates of the N-fluorobisbenzenesulfonamide gold leaching agent in example 7 versus gold and other major metals from printed wiring board gold fingers versus time.
Detailed Description
Example 1 gold leaching recovery of gold from printed circuit board gold finger by bromine-chlorine hydantoin leaching agent
1. Method for preparing the same
Adding bromochlorohydantoin into the aqueous solution, and stirring to dissolve to form gold leaching solution with the bromochlorohydantoin concentration of 300 mmol/Lol/L.
2. Leaching of gold and other main metals from printed circuit board gold finger by bromine-chlorine hydantoin leaching agent
Mixing the bromine-chlorine hydantoin gold leaching agent and ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1: 100 to form a leaching system, and performing leaching reaction at a speed of 200rpm at 25 ℃.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
Adding 1g of ground printed circuit board golden finger powder into the prepared bromochlorohydantoin immersion agent and the newly prepared aqua regia according to the solid-to-liquid ratio of 1: 100 and 1: 40 respectively, and reacting for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent react for a certain time according to the experimental setting of implementation, and the printed circuit board golden finger powder reacts with the newly prepared aqua regia for 6 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain a bromochlorohydantoin leachate of the printed circuit board golden finger and a aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the bromine-chlorine hydantoin leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger by using ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the clean and efficient non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
4. Relationship between leaching rate of bromine-chlorine hydantoin leaching agent for Au and other main metals in printed circuit board golden fingers and time
The leaching reaction temperature is 25 ℃, the solid-to-liquid ratio is 1: 100, and the result is shown in figure 1.
FIG. 1 shows the leaching rate of Au, Ni, Cu, Fe, Ca in the printed circuit board fingers by the bromine-chlorine hydantoin leaching agent with time.
It can be seen that after only 5 hours of leaching, 91.1% of Au in the printed circuit board gold finger is leached, the leaching time is shorter than that of the traditional leaching agent, the leaching rate of Au is also better than that of most traditional leaching agents, and under the same leaching practice, the leaching rate of Ni is 60.95%, the leaching rate of Fe is only 1.41%, the leaching rate of Ca is only 0.64%, and the leaching rate of Cu is only 18.13%. It can be seen that the bromine-chlorine hydantoin gold leaching agent can leach Au very quickly, has extremely high leaching selectivity to Au, and can be effectively separated from other metals in the printed circuit board golden fingers.
Example 2 gold leaching recovery from gold fingers on printed circuit boards with trichloroisocyanuric acid leaching agent
1. Preparation method
Dissolving trichloroisocyanuric acid in water solution to obtain trichloroisocyanuric acid with concentration of 25mmel/LoAnd (5) L/L of gold leaching solution.
2. Leaching of gold and other main metals from printed circuit board gold finger by using trichloroisocyanuric acid gold leaching agent
Mixing the trichloroisocyanuric acid gold leaching agent with ground printed circuit board gold finger powder at a solid-liquid ratio of 1: 300 to form a leaching system, and performing leaching reaction at a speed of 200rpm at 25 ℃.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
0.5g of ground printed circuit board golden finger powder is added into the prepared trichloroisocyanuric acid immersion agent and the newly prepared aqua regia according to the solid-to-liquid ratio of 1: 300 and 1: 40, and the reaction is carried out for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent react for a certain time according to the experimental setting, and the printed circuit board golden finger powder and the newly prepared aqua regia react for 24 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain trichloroisocyanuric acid leachate of the printed circuit board golden finger and aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the trichloroisocyanuric acid leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger by ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the environment-friendly high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
4. Relationship between leaching rate of trichloroisocyanuric acid leaching agent on Au and other main metals in printed circuit board gold fingers and time
The leaching reaction temperature is 25 ℃, the solid-to-liquid ratio is 1: 300, and the result is shown in figure 2.
FIG. 2 shows the leaching rate of trichloroisocyanuric acid leaching agent for Au, Fe, Ca, Mg, Al and Ag in printed circuit board fingers as a function of time.
It can be seen that the leaching rate of Au in the printed circuit board golden finger reaches 76.55% after only leaching for 5h, which is superior to most traditional gold leaching agents. Under the same leaching practice, the leaching rate of Cu is 48.98%, the leaching rate of Mg is only 7.11%, the leaching rate of Ca is only 5.38%, the leaching rate of Al is only 5.72%, the leaching rate of Fe is only 6.14%, and the leaching rate of Ag is only 5.48%. It can be seen that the trichloroisocyanuric acid gold leaching agent has high selective leaching advantage on Au, and can separate gold from other metals in the gold finger of the printed circuit board.
Example 3 gold leaching recovery from printed wiring board gold fingers with iodosuccinimide gold leaching agent
An environment-friendly high-efficiency non-cyanide gold leaching agent comprises iodosuccinimide.
1. Preparation method
And adding iodo-succinimide into the aqueous solution, and stirring to dissolve to form a gold leaching solution with the concentration of the iodo-succinimide of 300 mmol/Lol/L.
2. Leaching of gold and other main metals from printed circuit board gold finger by using iodosuccinimide gold leaching agent
Mixing the iodo-succinimide gold leaching agent with the ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1: 300 to form a leaching system, and performing leaching reaction at a speed of 200rpm at 25 ℃.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
Adding 1g of ground printed circuit board golden finger powder into the prepared iodo-succinimide immersion agent and fresh aqua regia according to the solid-to-liquid ratio of 1: 300 and 1: 40 respectively, and reacting for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent react for a certain time according to experimental setting, and the printed circuit board golden finger powder reacts with the fresh aqua regia for 6 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain the iodosuccinimide leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the iodosuccinimide leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger by ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the environment-friendly high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
4. Relationship between leaching rate of iodo-succinimide leaching agent on Au and other main metals in printed circuit board gold fingers and time
The leaching reaction temperature is 25 ℃, the solid-to-liquid ratio is 1: 300, and the result is shown in figure 3.
FIG. 3 is a graph showing the leaching rates of iodo-succinimide leaching agent for Au, Ni, Cu, Fe, Ca in printed wiring board fingers as a function of time.
It can be seen that after only 5 hours of leaching, 45.34% of Au in the printed circuit board gold finger is leached, the leaching rate of the Au is faster than that of the traditional leaching agent, and under the same leaching practice, the leaching rates of the iodosuccinimide leaching agent to other metals are lower than that of Au, at the moment, the leaching rate of Cu is 14.49%, the leaching rate of Fe is only 1.95%, the leaching rate of Ca is only 1.35%, and the leaching rate of Ni is only 30.58%. It can be seen that the iodo-succinimide gold leaching agent can leach Au very quickly, has high selectivity to Au, and can be effectively separated from other metals in the printed circuit board golden finger.
Example 4 gold leaching recovery of printed circuit board gold fingers by low-concentration bromochlorohydantoin leaching agent at low temperature
1. Method for preparing the same
Adding bromochlorohydantoin into the aqueous solution, and stirring to dissolve to form a gold leaching solution with the bromochlorohydantoin concentration of 1 mmol/Lol/L.
2. Leaching of gold and other main metals from printed circuit board gold finger by bromine-chlorine hydantoin leaching agent
Mixing the bromine-chlorine hydantoin gold leaching agent and ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1: 500 to form a leaching system, and performing leaching reaction at a speed of 200rpm at 5 ℃.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
0.5g of ground printed circuit board golden finger powder is added into the prepared bromochlorohydantoin immersion agent and the newly prepared aqua regia according to the solid-to-liquid ratio of 1: 500 and 1: 40 respectively, and the reaction is carried out for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent are set according to the implementation experiment to react for a certain time, and the printed circuit board golden finger powder and the newly prepared aqua regia react for 6 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain a bromochlorohydantoin leachate of the printed circuit board golden finger and a aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the bromine-chlorine hydantoin leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger by using ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the clean and efficient non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
4. Relationship between leaching rate of low-concentration bromine-chlorine-hydantoin leaching agent to Au and other main metals in printed circuit board gold fingers at low temperature and time
The leaching reaction temperature is 5 ℃, the solid-to-liquid ratio is 1: 500, and the result is shown in figure 4.
FIG. 4 shows the leaching rates of Au, Ni, Cu, Fe, Ca in printed circuit board fingers with low concentrations of bromochlorohydantoin leaching agents at low temperatures as a function of time.
It can be seen that after 5h of leaching, 1.94% of Au in the printed circuit board gold finger is leached, and under the same leaching practice, the leaching rate of Ni is 2.20%, the leaching rate of Fe is 0.56%, the leaching rate of Ca is 0.25%, and the leaching rate of Cu is 6.21%. It can be seen that the low-concentration bromochlorohydantoin gold leaching agent can leach a certain amount of Au under the low-temperature reaction condition.
Example 5 gold leaching recovery of gold from printed circuit board gold fingers by using bromine-chlorine hydantoin leaching agent at low liquid-solid ratio and low temperature
1. Method for preparing the same
Adding bromochlorohydantoin into the aqueous solution, and stirring to dissolve to form gold leaching solution with the bromochlorohydantoin concentration of 600 mmol/Lol/L.
2. Leaching of gold and other main metals from printed circuit board gold finger by bromine-chlorine hydantoin leaching agent
Mixing the bromine-chlorine hydantoin gold leaching agent and ground printed circuit board gold finger powder at a solid-to-liquid ratio of 1: 3 to form a leaching system, and performing leaching reaction at a speed of 200rpm at 5 ℃.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
Adding 1g of ground printed circuit board golden finger powder into the prepared bromochlorohydantoin immersion agent and the newly prepared aqua regia according to the solid-to-liquid ratio of 1: 3 and 1: 40 respectively, and reacting for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent react for a certain time according to the experimental setting of implementation, and the printed circuit board golden finger powder reacts with the newly prepared aqua regia for 6 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain a bromochlorohydantoin leachate of the printed circuit board golden finger and a aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the bromine-chlorine hydantoin leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger by using ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the clean and efficient non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
4. Relationship between leaching rate of bromine-chlorine hydantoin for leaching gold and other main metals in gold fingers of printed circuit boards at low liquid-solid ratio and low temperature and time
The leaching reaction temperature is 5 ℃, the solid-to-liquid ratio is 1: 3, and the result is shown in figure 5.
FIG. 5 shows the leaching rate of the bromochlorohydantoin for gold immersion agent at low liquid-solid ratio and low temperature for Au, Ni, Cu, Fe and Ca in the printed circuit board gold finger as a function of time.
It can be seen that 34.03% of Au in the printed circuit board gold finger is leached after 10 hours of leaching, and under the same leaching practice, the leaching rate of Ni is 45.96%, the leaching rate of Fe is 0.15%, the leaching rate of Ca is 0.70%, and the leaching rate of Cu is 10.97%. It can be seen that the bromochlorohydantoin gold leaching agent can leach a certain amount of Au under the reaction conditions of low temperature and low liquid-solid ratio, and the gold leaching agent has good selectivity on Au.
Example 6 gold leaching recovery of gold from printed circuit board gold fingers by trichloroisocyanuric acid gold leaching agent at high temperature
1. Preparation method
Dissolving trichloroisocyanuric acid in the water solution to form a gold leaching solution with the trichloroisocyanuric acid concentration of 25 mmol/Lol/L.
2. Leaching of gold and other main metals from printed circuit board gold finger by using trichloroisocyanuric acid gold leaching agent
The trichloroisocyanuric acid gold leaching agent and ground printed circuit board gold finger powder are mixed at a solid-liquid ratio of 1: 300 to form a leaching system, and leaching reaction is carried out at 100 ℃ and a speed of 200 rpm.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
0.5g of ground printed circuit board golden finger powder is added into the prepared trichloroisocyanuric acid immersion agent and the newly prepared aqua regia according to the solid-to-liquid ratio of 1: 300 and 1: 40, and the reaction is carried out for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent react for a certain time according to the experimental setting, and the printed circuit board golden finger powder and the newly prepared aqua regia react for 24 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain trichloroisocyanuric acid leachate of the printed circuit board golden finger and aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the trichloroisocyanuric acid leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger by ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the environment-friendly high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
4. Relationship between leaching rate of trichloroisocyanuric acid gold leaching agent to Au and other main metals in printed circuit board gold fingers at high temperature and time
The leaching reaction temperature was 100 ℃ and the solid-to-liquid ratio was 1: 300, and the results are shown in FIG. 6.
FIG. 6 shows the leaching rate of trichloroisocyanuric acid leaching agent under high temperature conditions for Au, Fe, Ni, Ca and Cu in printed circuit board fingers as a function of time.
It can be seen that the leaching rate of Au in the printed circuit board golden finger reaches 64.56% after only leaching for 5h, which is superior to most traditional gold leaching agents. Under the same leaching practice, the leaching rate of Cu is 49.17%, the leaching rate of Ni is only 39.59%, the leaching rate of Ca is only 16.34%, and the leaching rate of Fe is only 16.23%. It can be seen that the trichloroisocyanuric acid gold leaching agent can leach a large amount of Au in a short time under the high-temperature reaction condition, and the gold leaching agent has high selective leaching advantage on Au.
Example 7 gold leaching recovery from printed wiring board gold fingers with N-fluorobisphenylsulfonamide gold leaching agent
An environment-friendly high-efficiency non-cyanide gold leaching agent comprises N-fluoro-diphenyl sulfonamide.
1. Preparation method
Adding N-fluoro-diphenyl sulfonamide into the aqueous solution, stirring and dissolving to form gold leaching solution with the concentration of N-fluoro-diphenyl sulfonamide amine being 10 mmol/L.
Leaching of gold and other main metals from printed circuit board gold finger by N-fluoro-diphenyl sulfonamide gold leaching agent
Mixing the N-fluoro-diphenyl sulfonamide gold leaching agent and ground printed circuit board gold finger powder at a solid-liquid ratio of 1: 100 to form a leaching system, and performing leaching reaction at a speed of 200rpm at 25 ℃.
3. Measuring leaching rate of gold and other main metals in printed circuit board golden finger
Adding 1g of ground printed circuit board golden finger powder into the prepared N-fluoro-diphenyl sulfonamide immersion agent and the newly prepared aqua regia according to the solid-to-liquid ratio of 1: 100 and 1: 40 respectively, and reacting for a period of time at 200rpm, wherein the printed circuit board golden finger powder and the non-cyanide immersion agent react for a certain time according to the experimental setting, and the printed circuit board golden finger powder and the newly prepared aqua regia react for 6 hours. And after the leaching reaction is finished, carrying out suction filtration to obtain the N-fluoro-diphenyl sulfonamide leachate of the printed circuit board golden finger and the aqua regia leachate of the printed circuit board golden finger.
And (3) measuring the leaching rates of gold and other main metals in the printed circuit board golden finger: and respectively detecting the contents of gold and other main metals in the N-fluoro-diphenyl sulfonamide leachate of the printed circuit board gold finger and the aqua regia leachate of the printed circuit board gold finger by ICP-OES.
In the invention, the leaching rate is the ratio of the gold content in the environment-friendly high-efficiency non-cyanide gold leaching agent after leaching to the gold content in the aqua regia leaching solution. The leaching rates of other metals are the same as described above.
The relationship between the leaching rate of the N-fluoro-diphenyl sulfonamide gold leaching agent on Au and other main metals in the gold fingers of the printed circuit board and the time
The leaching reaction temperature was 25 ℃ and the solid-to-liquid ratio was 1: 100, and the results are shown in FIG. 7.
FIG. 7 is a graph showing the leaching rates of Au, Ni, Cu, Fe, Ca in printed wiring board fingers as a function of time for N-fluorobisphenylsulfonamide leaching agents.
It can be seen that after 10h of leaching, 1.67% of Au in the printed circuit board gold finger is leached, and under the same leaching practice, the leaching rate of Cu is 1.17%, the leaching rate of Fe is only 0.06%, the leaching rate of Ca is only 0.48%, and the leaching rate of Ni is only 0.82%. It can be seen that the N-fluoro-bis-benzenesulfonamide gold leaching agent can leach a certain amount of Au, and has high selectivity on Au.
Claims (9)
1. A gold leaching agent for selectively leaching gold in gold-containing materials is characterized in that: the components are water-soluble halogen-containing organic matters.
2. The gold leaching agent for the selective leaching of gold from gold-containing material according to claim 1, wherein: the water-soluble halogen-containing organic substance comprises one or more of a mixture of easily soluble, soluble and slightly soluble in the water-containing organic substance.
3. The gold leaching agent for the selective leaching of gold from gold-containing material according to claim 1, wherein: the halogen is one or a mixture of F, Cl, Br and l.
4. A method of preparing a gold leaching agent for the selective leaching of gold from a gold-containing material according to claim 1, characterized in that: adding water-soluble halogen-containing organic matters into the aqueous solution, and stirring for dissolving.
5. The method of preparing a gold leaching agent for the selective leaching of gold from gold-bearing materials according to claim 4, wherein: the concentration of the organic halogen-containing substances in the aqueous solution is 1-600 mmol/L.
6. Use of the gold leaching agent according to claim 1 for the selective leaching, recovery of gold from a gold-bearing material.
7. Use according to claim 6, characterized in that: the temperature of the leaching reaction is 5-100 ℃.
8. Use according to claim 6, characterized in that: the gold-containing material is gold ore, gold-containing industrial waste and gold-containing electronic garbage.
9. Use according to claim 6, characterized in that: the solid-liquid ratio during leaching is 1: 3-1: 500.
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| CN202010114620.3A CN111100998A (en) | 2020-02-25 | 2020-02-25 | Gold leaching agent for selectively leaching gold in gold-containing material, preparation method and application |
| CN2020101146203 | 2020-02-25 |
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| CN202110173241.6A Withdrawn CN112795789A (en) | 2020-02-25 | 2021-02-08 | Non-cyanogen gold leaching agent for efficiently and selectively leaching gold, preparation method and application |
| CN202110186970.5A Active CN112831671B (en) | 2020-02-25 | 2021-02-09 | Gold leaching agent for selectively leaching gold in gold-containing material, preparation method and application |
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| CN202110173241.6A Withdrawn CN112795789A (en) | 2020-02-25 | 2021-02-08 | Non-cyanogen gold leaching agent for efficiently and selectively leaching gold, preparation method and application |
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| CN103114202A (en) * | 2013-03-05 | 2013-05-22 | 吉林大学 | Comprehensive recovery process for environment-friendly type refractory gold-silver ore multi-metals |
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| US4925247A (en) * | 1988-12-27 | 1990-05-15 | The United States Of America As Represented By The Secretary Of The Interior | Method for particle stabilization by use of cationic polymers |
| US6551378B2 (en) * | 2001-02-20 | 2003-04-22 | Green Mineral Products Llc | Recovery of precious metals from low concentration sources |
| CN104388674A (en) * | 2014-10-29 | 2015-03-04 | 昆明理工大学 | Leaching method for recovering lead from lead oxide ore and leaching agent used in leaching method |
| US10604821B2 (en) * | 2017-01-05 | 2020-03-31 | Ethox Chemicals, Llc | Process for recovering precious metals from clay-containing ores |
| CN110129580B (en) * | 2019-05-16 | 2021-03-23 | 东北大学 | Method for enhancing normal-pressure organic halogenation leaching of chalcopyrite by grinding and leaching at same time |
| CN110607450B (en) * | 2019-10-29 | 2021-03-30 | 上海第二工业大学 | Method for recovering palladium in printed circuit board by selective leaching precipitation |
| CN111100998A (en) * | 2020-02-25 | 2020-05-05 | 东南大学 | Gold leaching agent for selectively leaching gold in gold-containing material, preparation method and application |
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- 2021-02-07 WO PCT/CN2021/075749 patent/WO2021169780A1/en active Application Filing
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| CN112831671B (en) | 2023-01-31 |
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