CN112831212A - Nano waterproof coating with heat dissipation function and application method thereof - Google Patents
Nano waterproof coating with heat dissipation function and application method thereof Download PDFInfo
- Publication number
- CN112831212A CN112831212A CN202110062912.1A CN202110062912A CN112831212A CN 112831212 A CN112831212 A CN 112831212A CN 202110062912 A CN202110062912 A CN 202110062912A CN 112831212 A CN112831212 A CN 112831212A
- Authority
- CN
- China
- Prior art keywords
- nano
- waterproof coating
- nanometer
- heat dissipation
- dissipation function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 104
- 239000011248 coating agent Substances 0.000 title claims abstract description 103
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000007787 solid Substances 0.000 claims abstract description 45
- 239000000919 ceramic Substances 0.000 claims abstract description 35
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000010936 titanium Substances 0.000 claims abstract description 33
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 33
- 241000251468 Actinopterygii Species 0.000 claims abstract description 3
- 239000005543 nano-size silicon particle Substances 0.000 claims description 21
- 239000011858 nanopowder Substances 0.000 claims description 21
- 238000005507 spraying Methods 0.000 claims description 21
- 239000007788 liquid Substances 0.000 claims description 10
- 239000000725 suspension Substances 0.000 claims description 10
- 238000000889 atomisation Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 abstract description 14
- 229910052710 silicon Inorganic materials 0.000 abstract description 13
- 239000010703 silicon Substances 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 5
- 230000008719 thickening Effects 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 abstract description 2
- 239000000243 solution Substances 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 239000011889 copper foil Substances 0.000 description 13
- 239000002356 single layer Substances 0.000 description 13
- 238000000151 deposition Methods 0.000 description 7
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002103 nanocoating Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- DFUYAWQUODQGFF-UHFFFAOYSA-N 1-ethoxy-1,1,2,2,3,3,4,4,4-nonafluorobutane Chemical compound CCOC(F)(F)C(F)(F)C(F)(F)C(F)(F)F DFUYAWQUODQGFF-UHFFFAOYSA-N 0.000 description 1
- SQEGLLMNIBLLNQ-UHFFFAOYSA-N 1-ethoxy-1,1,2,3,3,3-hexafluoro-2-(trifluoromethyl)propane Chemical compound CCOC(F)(F)C(F)(C(F)(F)F)C(F)(F)F SQEGLLMNIBLLNQ-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a nano waterproof coating with a heat dissipation function and an application method thereof. The nanometer waterproof coating with the heat dissipation function and the application method thereof can be prepared into the nanometer waterproof coating with the heat dissipation function, nanometer solid components such as ceramic nanometer powder, nanometer silicon, nanometer titanium and the like are uniformly distributed in a nanometer waterproof coating film formed by curing, granular and/or fish scale-shaped bulges are formed on the surface, heat is quickly conducted from the surface of an electronic component to the vertical direction of the coating direction, meanwhile, the contact area of the coating and the outside can be increased, the heat dissipation effect is brought, the dual functions of waterproof protection and heat conduction and heat dissipation on the surface of the key part of the electronic component are further realized, the nanometer waterproof coating has no obvious thickening and small size, no extra occupation of the internal space of the electronic equipment is realized, and the nanometer waterproof coating is suitable for industrial popularization and use.
Description
Technical Field
The invention belongs to the technical field of nano waterproof coatings, and particularly relates to a nano waterproof coating with a heat dissipation function and an application method thereof.
Background
At present, with the rapid expansion of portable and wearable electronic product markets, electronic internal components and circuit board structures tend to be light, thin and small in size, wherein the critical design sizes of various ICs and chips are also rapidly reduced, so that heat dissipation becomes a difficult point while high-speed computing and communication capabilities are brought. Taking a mobile phone CPU as an example, the working temperature of a conventional mobile phone CPU chip in the market at present can reach more than 70 ℃, part of the capacitance can reach more than 60 ℃, and the working temperature of a mobile phone liquid crystal screen can also reach 50-70 ℃, in addition, in recent years, a wireless charging module which is gradually popular is also very easy to cause energy conversion into extra heat energy in transmission current, the internal temperature of an electronic product can actually reach a higher degree completely, and the upper limit of the temperature which can be borne by the performance of the mobile phone chip, the battery and the like is generally only about 50 ℃, therefore, if the chip, the capacitance, the circuit and the peripheral elements of a heating core cannot be cooled down quickly, the performance and the service life of the electronic element and the electronic product can be greatly damaged, and even potential safety hazards can be caused.
In the conventional design idea of electronic internal components, the most common solution in the aspect of heat dissipation is to add a graphite layer for heat dissipation in the plane direction, and use heat-conducting silicone grease or heat-conducting silicone pad for heat dissipation in a vertical defensive line together, because the heat-conducting silicone pad and the heat-conducting silicone grease layer are usually thicker (0.5-1mm), the problem that the heat dissipation assembly occupies more internal design space of an electronic product is caused, part of graphite heat-conducting sheets are directly used on a heat dissipation surface and fixed through a thinner 10-30 μm double-sided adhesive tape, such an application mode is common in a wireless charging module, and the conventional double-sided adhesive tape of a PET film has potential influence on heat conduction in the vertical direction and additionally occupies space.
Therefore, there is still a need for heat dissipation solutions with lower volume requirements, preferably with a certain heat transfer capability in the vertical direction.
Disclosure of Invention
In order to solve the problems in the prior art, the invention aims to provide a nano waterproof coating with a heat dissipation function and an application method thereof.
In order to achieve the purpose and achieve the technical effect, the invention adopts the technical scheme that:
the nanometer waterproof coating with the heat dissipation function is turbid liquid prepared by adding nanometer solid components into a nanometer waterproof coating solution.
Further, the weight ratio of the nano waterproof coating solution to the nano solid components is 1.5: 1-2: 1.
further, the nano solid components comprise the following components in percentage by weight:
10-30% of nano silicon
1-20% of nano titanium
The balance of ceramic nano powder
The sum of the weight percentages of the three components of the ceramic nano powder, the nano silicon and the nano titanium is one hundred percent.
Further, the grain diameters of the ceramic nanometer powder, the nanometer silicon and the nanometer titanium are respectively 2-3 nm.
Further, the nano waterproof coating solution is a fluorine-containing siloxane polymer solution.
The invention discloses a nano waterproof coating with a heat dissipation function, which is obtained by spraying a nano waterproof coating with the heat dissipation function on key positions of electronic components through a glue dispenser before nano solid components are deposited and then curing, wherein the nano solid components are uniformly distributed in the nano waterproof coating obtained by curing, granular and/or scaly bulges are formed on the surface of the nano waterproof coating, and the nano waterproof coating has heat conductivity in the vertical direction.
Further, the thickness of the nano waterproof coating is 1-3 μm.
Furthermore, the diameter of a nozzle of the glue dispenser is 0.1-1mm, the spraying atomization air pressure is 5-20psi, and the spraying height is 5-20 cm.
The invention discloses an application method of a nano waterproof coating with a heat dissipation function, which comprises the following steps:
in the nano waterproof coating solution sprayed on the key parts of the electronic components through a dispenser, the weight ratio of the nano waterproof coating solution to nano solid components is 1.5: 1-2: 1, adding nano solid components in proportion, and uniformly mixing to obtain a suspension;
before the ceramic nano powder, the nano silicon and the nano titanium nano solid components are deposited, spraying the suspension on key parts of the electronic component through a dispenser, and curing, wherein the diameter of a nozzle of the dispenser is 0.1-1mm, the spraying atomization air pressure is 5-20psi, and the spraying height is 5-20 cm.
Further, the nano solid comprises the following components in percentage by weight:
10-30% of nano silicon
1-20% of nano titanium
The balance of ceramic nano powder
The sum of the weight percentages of the three components of the ceramic nano powder, the nano silicon and the nano titanium is one hundred percent.
Compared with the prior art, the invention has the beneficial effects that:
the invention discloses a nano waterproof coating with a heat dissipation function and an application method thereof, wherein the nano waterproof coating with the heat dissipation function is a suspension prepared by adding ceramic nano powder, nano silicon and nano titanium into a nano waterproof coating solution, the nano waterproof coating with the heat dissipation function can be prepared into a nano waterproof coating with the heat dissipation function, nano particles in nano solid components such as the ceramic nano powder, the nano silicon and the nano titanium can be uniformly distributed in the nano waterproof coating formed by curing along with the evaporation of a solvent and the free deposition and precipitation of the solvent, granular and/or scaly bulges are formed on the surface, the nano waterproof coating has the heat conduction performance in the vertical direction, and the nano granular sediments extending out of the surface of the nano waterproof coating can be rapidly conducted from the surface of an electronic component to the vertical direction of the nano waterproof coating by the high heat conductivity of the ceramic nano powder, meanwhile, the contact area between the coating and the outside is increased, so that the heat dissipation effect is achieved, the surface waterproof protection effect is achieved at the key electronic component part, the dual functions of waterproof protection and heat conduction and heat dissipation at the surface of the key part of the electronic component are achieved, after the nano particles are added, the thickness of the nano waterproof coating is still kept at 1-3 mu m, obvious thickening is avoided, no extra occupation is caused to narrow space inside electronic equipment, and the nano waterproof coating is suitable for industrial popularization and use.
Drawings
FIG. 1 is an electron micrograph of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention is provided to enable those skilled in the art to more easily understand the advantages and features of the present invention, and to clearly and clearly define the scope of the present invention.
A nanometer waterproof coating with heat dissipation function is a turbid liquid prepared by adding nanometer solid components consisting of ceramic nanometer powder, nanometer silicon and nanometer titanium into a nanometer waterproof coating solution; wherein, the weight ratio of the nano waterproof coating solution to the nano solid components is 1.5: 1-2: 1; the nano solid comprises the following components in percentage by weight:
10-30% of nano silicon
1-20% of nano titanium
The balance of ceramic nano powder
The sum of the weight percentages of the three components of the ceramic nano powder, the nano silicon and the nano titanium is one hundred percent, and the grain diameters of the ceramic nano powder, the nano silicon and the nano titanium are respectively 2-3 nm.
The nano waterproof coating solution is a fluorine-containing siloxane polymer solution.
In a specific embodiment, the solvent in the nano waterproof coating solution is fluorine-containing ethyl nonafluorobutyl ether or fluorine-containing ethyl nonafluoroisobutyl ether, which is volatile and has a low boiling point (lower than 90 ℃).
A nanometer waterproof coating with a heat dissipation function is obtained by spraying nanometer waterproof coating with the heat dissipation function on key parts (usually, positions such as a chip, an IC and the like, and also a typical heat source) of an electronic component through a dispenser before depositing nanometer solid components such as ceramic nanometer powder, nanometer silicon, nanometer titanium and the like, and then curing, wherein the thickness of the nanometer waterproof coating is 1-3 mu m, and compared with a conventional coating, the nanometer waterproof coating has the advantages of no obvious increase in thickness, low cost and no extra occupation of narrow space inside electronic equipment; the ceramic nanometer powder, the nanometer silicon and the nanometer titanium are uniformly distributed in the nanometer waterproof coating obtained by curing, the balance between the ceramic nanometer powder, the nanometer silicon and the nanometer titanium is realized by means of the free deposition of nanometer solid components and the fixing effect brought by the drying and curing film forming of a nanometer waterproof coating solution, granular and/or fish scale-shaped bulges are formed on the surface of the nanometer waterproof coating, as shown in figure 1, the cured nanometer waterproof coating has thermal conductivity in the vertical direction due to the doped nanometer solid components (the ceramic nanometer powder, the nanometer silicon and the nanometer titanium), fluorine-containing functional groups have stable chemical structures, and meanwhile, due to the special electronegativity of fluorine, the nanometer waterproof coating has extremely low surface energy, so that the key parts of electronic components play a role in surface heat dissipation and surface waterproof protection. It should be noted that the nano waterproof coating solution volatilizes during the curing process, and the nano particles remain and form granular and/or scaly protrusions.
An application method of a nano waterproof coating with a heat dissipation function is a method for simultaneously achieving the functions of surface waterproofing and heat dissipation on the surface of an electronic component by applying a nano coating, and comprises the following steps:
in a nano waterproof coating solution for spraying and protecting the key parts of electronic components by a dispenser, the weight ratio of the nano waterproof coating solution to nano solid components is 1.5: 1-2: 1, adding nano solid components in proportion, and uniformly mixing to obtain a suspension; the nano solid comprises the following components in percentage by weight:
10-30% of nano silicon
1-20% of nano titanium
The balance of ceramic nanometer powder;
before the deposition of the ceramic nano powder, the nano silicon and the nano titanium, spraying the suspension on the key parts of the electronic components through a dispenser, and curing, wherein the diameter of a nozzle of the dispenser is 0.1-1mm, the spraying atomization air pressure is 5-20psi, and the spraying height is 5-20 cm.
The nano waterproof coating with the heat dissipation function, disclosed by the invention, is a nano waterproof coating with a heat conduction function and containing nano components, can be directly added with heat conduction ceramic nano powder, nano silicon powder, nano titanium powder and the like into a suspension or a mixed solution in a conventional waterproof solution, and then is sprayed to key parts of electronic components, and a nano waterproof coating can be formed after curing. It is noted that the cured nano waterproof coating can exhibit heat conductivity in the vertical direction due to the doped nano solid components such as ceramic nano powder, nano silicon and nano titanium, and further can perform efficient heat conduction in the vertical direction of the key part of the electronic component, so that the heat dissipation can be accelerated in the key part of the electronic component, and the requirements of heat dissipation and waterproof protection can be met at the key part at one time; the thickness of the nano waterproof coating is still kept within the range of 1-3 mu m, obvious thickening is avoided, the problem of extra space occupation is avoided, and a brand new solution for internal heat management and heat dissipation of electronic products is provided for designers.
Example 1
A nanometer waterproof coating with heat dissipation function is a turbid liquid prepared by adding nanometer solid components consisting of ceramic nanometer powder, nanometer silicon and nanometer titanium into a nanometer waterproof coating solution; wherein, the weight ratio of the nano waterproof coating solution to the nano solid components is 2: 1, the nanometer solid components comprise 30 percent of nanometer silicon, 1 percent of nanometer titanium and 69 percent of ceramic nanometer powder by weight percentage.
An application method of a nano waterproof coating with a heat dissipation function comprises the following steps:
in a nano waterproof coating solution which is purchased from the market and is sprayed and protected by a dispenser through a conventional single-layer copper foil, the weight ratio of the nano waterproof coating solution to nano solid components is 2: 1, adding nano solid components in proportion, and uniformly mixing to obtain a suspension;
before the deposition of the ceramic nano powder, the nano silicon and the nano titanium, the turbid liquid is sprayed onto a conventional single-layer copper foil purchased in the market through a dispenser and is solidified, the diameter of a nozzle of the dispenser is 1mm, the spraying atomization air pressure is 15si, and the spraying height is 20 cm.
Example 2
A nanometer waterproof coating with heat dissipation function is a turbid liquid prepared by adding nanometer solid components consisting of ceramic nanometer powder, nanometer silicon and nanometer titanium into a nanometer waterproof coating solution; wherein, the weight ratio of the nano waterproof coating solution to the nano solid components is 1.5: 1, the nanometer solid components comprise 10 percent of nanometer silicon, 20 percent of nanometer titanium and 70 percent of ceramic nanometer powder by weight percentage.
An application method of a nano waterproof coating with a heat dissipation function comprises the following steps:
in a nano waterproof coating solution which is purchased from the market and is sprayed and protected by a dispenser through a conventional single-layer copper foil, the weight ratio of the nano waterproof coating solution to nano solid components is 1.5: 1, adding nano solid components in proportion, and uniformly mixing to obtain a suspension;
before the deposition of the ceramic nano powder, the nano silicon and the nano titanium, the turbid liquid is sprayed onto a conventional single-layer copper foil purchased in the market through a dispenser and is solidified, the diameter of a nozzle of the dispenser is 1mm, the spraying atomization air pressure is 15si, and the spraying height is 20 cm.
The same as in example 1.
Example 3
A nanometer waterproof coating with heat dissipation function is a turbid liquid prepared by adding nanometer solid components consisting of ceramic nanometer powder, nanometer silicon and nanometer titanium into a nanometer waterproof coating solution; wherein, the weight ratio of the nano waterproof coating solution to the nano solid components is 1.8: 1, the nanometer solid components comprise 26 percent of nanometer silicon, 15 percent of nanometer titanium and 59 percent of ceramic nanometer powder by weight percentage.
An application method of a nano waterproof coating with a heat dissipation function comprises the following steps:
in a nano waterproof coating solution which is purchased from the market and is sprayed and protected by a dispenser through a conventional single-layer copper foil, the weight ratio of the nano waterproof coating solution to nano solid components is 1.8: 1, adding nano solid components in proportion, and uniformly mixing to obtain a suspension;
before the deposition of the ceramic nano powder, the nano silicon and the nano titanium, the turbid liquid is sprayed onto a conventional single-layer copper foil purchased in the market through a dispenser and is solidified, the diameter of a nozzle of the dispenser is 1mm, the spraying atomization air pressure is 15si, and the spraying height is 20 cm.
The same as in example 1.
Comparative example 1
Comparative example 1 a conventional single-layer copper foil purchased from the market was used without spraying any nano waterproof paint with a heat-dissipating function.
The single-layer copper foil sprayed with the nano waterproof coating obtained in the examples 1 to 3 and the single-layer copper foil of the comparative example 1 are subjected to a temperature change test on a flat heat source at 80 ℃, and by comparing the conventional single-layer copper foil of the comparative example 1 with the single-layer copper foil of the waterproof nano coating disclosed in the examples 1 to 3, the surface temperature change of which is on the flat heat source at 80 ℃ is visible, compared with the single-layer copper foil of the comparative example 1, the surface temperature rise of the single-layer copper foil of the examples 1 to 3 is obviously faster and can be as high as 6 to 10 ℃/min, and the final temperature is lower, so that the nano waterproof coating can be proved to have the heat conduction capability in the vertical direction and can play a certain surface heat dissipation function.
The parts of the invention not specifically described can be realized by adopting the prior art, and the details are not described herein.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The nanometer waterproof coating with the heat dissipation function is characterized in that the nanometer waterproof coating with the heat dissipation function is turbid liquid prepared by adding nanometer solid components into a nanometer waterproof coating solution.
2. The nano waterproof coating with the heat dissipation function as claimed in claim 1, wherein the weight ratio of the nano waterproof coating solution to the nano solid components is 1.5: 1-2: 1.
3. the nano waterproof coating with the heat dissipation function as recited in claim 1, wherein the nano solid components comprise the following components in percentage by weight:
10-30% of nano silicon
1-20% of nano titanium
The balance being ceramic nano powder.
4. The nano waterproof coating with the heat dissipation function as claimed in claim 3, wherein the particle sizes of the ceramic nano powder, the nano silicon and the nano titanium are respectively 2-3 nm.
5. The nano waterproof coating with the heat dissipation function as claimed in claim 1 or 2, wherein the nano waterproof coating solution is a fluorosilicone polymer solution.
6. A nanometer waterproof coating with a heat dissipation function is characterized in that the nanometer waterproof coating with the heat dissipation function is obtained by spraying the nanometer waterproof coating with the heat dissipation function to key parts of electronic components through a glue dispenser before the nanometer solid components are deposited and then curing, the nanometer solid components are uniformly distributed in the nanometer waterproof coating obtained by curing, granular and/or fish scale-shaped bulges are formed on the surface of the nanometer waterproof coating, and the nanometer waterproof coating has heat conductivity in the vertical direction.
7. The nano waterproof coating with the heat dissipation function as claimed in claim 6, wherein the thickness of the nano waterproof coating is 1-3 μm.
8. The nano waterproof coating with the heat dissipation function as claimed in claim 6, wherein the diameter of a nozzle of the dispenser is 0.1-1mm, the spraying atomization air pressure is 5-20psi, and the spraying height is 5-20 cm.
9. The application method of the nano waterproof coating with the heat dissipation function according to any one of claims 1 to 5, characterized by comprising the following steps:
in the nano waterproof coating solution sprayed on the key parts of the electronic components through a dispenser, the weight ratio of the nano waterproof coating solution to nano solid components is 1.5: 1-2: 1, adding nano solid components in proportion, and uniformly mixing to obtain a suspension;
before the ceramic nano powder, the nano silicon and the nano titanium nano solid components are deposited, the turbid liquid is sprayed to key parts of the electronic component through a dispenser and is solidified.
10. The application method of the nano waterproof coating with the heat dissipation function as recited in claim 9, wherein the nano solid components comprise the following components in percentage by weight:
10-30% of nano silicon
1-20% of nano titanium
The balance being ceramic nano powder.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110062912.1A CN112831212A (en) | 2021-01-18 | 2021-01-18 | Nano waterproof coating with heat dissipation function and application method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110062912.1A CN112831212A (en) | 2021-01-18 | 2021-01-18 | Nano waterproof coating with heat dissipation function and application method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112831212A true CN112831212A (en) | 2021-05-25 |
Family
ID=75928420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110062912.1A Pending CN112831212A (en) | 2021-01-18 | 2021-01-18 | Nano waterproof coating with heat dissipation function and application method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112831212A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101374151B1 (en) * | 2012-09-26 | 2014-03-14 | 한가람화학 주식회사 | Water-soluble nano-ceramic heat-resistant coating composition for heatsink coating |
CN104559792A (en) * | 2014-12-31 | 2015-04-29 | 东莞市赛威新能源科技有限公司 | Nano waterproof coating for electronic product and waterproof method thereof |
CN106928838A (en) * | 2017-03-30 | 2017-07-07 | 东莞市万丰纳米材料有限公司 | A kind of heat-dissipation paint |
CN111647354A (en) * | 2020-06-30 | 2020-09-11 | 广东工业大学 | Waterproof heat-conducting coating and preparation method thereof |
-
2021
- 2021-01-18 CN CN202110062912.1A patent/CN112831212A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101374151B1 (en) * | 2012-09-26 | 2014-03-14 | 한가람화학 주식회사 | Water-soluble nano-ceramic heat-resistant coating composition for heatsink coating |
CN104559792A (en) * | 2014-12-31 | 2015-04-29 | 东莞市赛威新能源科技有限公司 | Nano waterproof coating for electronic product and waterproof method thereof |
CN106928838A (en) * | 2017-03-30 | 2017-07-07 | 东莞市万丰纳米材料有限公司 | A kind of heat-dissipation paint |
CN111647354A (en) * | 2020-06-30 | 2020-09-11 | 广东工业大学 | Waterproof heat-conducting coating and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2201079B1 (en) | Thermally conductive composition | |
KR102032108B1 (en) | Metallic nanofiber ink, substantially transparent conductor, and fabrication method | |
CN104867540A (en) | Low-haze transparent conductive film and preparation method thereof | |
CN112409791A (en) | Heat-conducting composite material and preparation method thereof | |
WO2014082440A1 (en) | Hybrid particles, polymer matrix composite, preparation method therefor, and application thereof | |
JP2005538210A (en) | Thermal interface material | |
CN109852274B (en) | Graphene heat-conducting adhesive film and preparation process thereof | |
KR101859005B1 (en) | Multi-layered heat radiation film | |
CN110760233A (en) | Heat-conducting composite coating and heat-conducting coating prepared from same | |
US20220098738A1 (en) | Metallic Nanofiber Ink, Substantially Transparent Conductor, and Fabrication Method | |
KR101881436B1 (en) | manufacturing method for High-capacity heat sink coated with carbon nanotube and graphene mixture | |
CN112876757B (en) | Ultrathin double-sided adhesive tape with heat conduction function in vertical direction and application method | |
CN105657303B (en) | A kind of strong radiator structure and preparation method thereof for laser television heat dissipation | |
WO2019205010A1 (en) | Aqueous electromagnetic shielding coating, preparation method therefor and use thereof | |
CN110785074B (en) | Composite wave-absorbing material of wave-absorbing shielding film and wave-absorbing shielding film applied by composite wave-absorbing material | |
US20130075074A1 (en) | Thermal Dissipation Device | |
CN112831212A (en) | Nano waterproof coating with heat dissipation function and application method thereof | |
CN104774582A (en) | Pressure-sensitive adhesive with anti-dazzle function | |
KR20130106932A (en) | Heat-radiation composition and heat-radiation sheet | |
KR101361105B1 (en) | Heat radiation tape having excellent thermal conductivity | |
KR101508202B1 (en) | Fabrication method of thermal coating layer comprising vertical-aligned graphene | |
CN108948978A (en) | A kind of heat radiation coating and preparation method thereof being applied on power device | |
CN113292933B (en) | High-thermal-conductivity-coefficient pressure-sensitive adhesive and high-thermal-conductivity-coefficient pressure-sensitive adhesive tape | |
TWM564307U (en) | Waterproof functional pre-coating structure of electronic component | |
CN106928776A (en) | A kind of water base nano silver wire conductive ink containing luminescent quantum dot |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210525 |
|
RJ01 | Rejection of invention patent application after publication |