CN112829392A - High-temperature-resistant ultra-wideband wave-absorbing structure integrated material and preparation method thereof - Google Patents
High-temperature-resistant ultra-wideband wave-absorbing structure integrated material and preparation method thereof Download PDFInfo
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- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Abstract
The invention relates to a high-temperature-resistant ultra-wideband wave-absorbing structure integrated material, which solves the problems that the wave-absorbing frequency bandwidth and the thickness of the traditional wave-absorbing material cannot be compatible and cannot resist high temperature. The preparation method of the integrated material comprises the steps of coating carbon nanotube slurry on a polyimide film in a blade mode to form a carbon nanotube conductive coating film with certain impedance; etching a specific pattern on the carbon nano tube conductive coating to form a super surface with certain impedance; compounding graphene and polyamide acid resin to form graphene films with different graphene concentrations; compounding the metal micro powder with epoxy resin to form an electromagnetic film; the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel are compounded in a multi-layer mode and integrally formed, and the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is formed. The average reflectivity of the composite material is less than or equal to-5 dB at 1-2GHz, and the average reflectivity is less than or equal to-10 dB at 2-8 GHz.
Description
Technical Field
The invention relates to the technical field of high-temperature-resistant ultra-wideband wave-absorbing structure integrated materials, in particular to a high-temperature-resistant ultra-wideband wave-absorbing structure integrated material based on super-surface and graphene film and electromagnetic film compounding and a preparation method thereof.
Background
With the development of microwave technology, the system has higher and higher requirements on the high temperature resistance and the broadband wave absorbing performance of the microwave absorbing material. The traditional magnetic material has the defects of poor temperature resistance, narrow absorption band and large mass. The carbon black is compounded with the polymethacrylamide or the glass fiber reinforced plastic, and the broadband wave-absorbing performance can be formed only by the larger thickness, so that the actual requirement is difficult to meet. The glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel are compounded, so that the high-temperature resistance and the ultra-wideband wave-absorbing performance can be realized simultaneously, and the method has important significance.
Disclosure of Invention
Technical problem to be solved
The invention aims to solve the technical problems that the traditional magnetic coating material has narrow absorption frequency band, poor temperature resistance and large thickness of the traditional composite wave-absorbing material.
(II) technical scheme
In order to solve the technical problems, the invention provides, in a first aspect, a high-temperature-resistant ultra-wideband wave-absorbing structure integrated material, which includes or consists of the following layers: the electromagnetic wave-absorbing material comprises a glass fiber reinforced plastic layer, a super surface layer, at least one graphene film layer, at least one aerogel layer and an electromagnetic film layer, wherein the super surface layer is located between the glass fiber reinforced plastic layer and the electromagnetic film layer, and the at least one graphene film layer and the at least one aerogel layer are located between the super surface layer and the electromagnetic film layer.
The invention provides a preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material in the first aspect, which comprises the following steps:
(1) preparation of a Supersurface
Coating the carbon nanotube slurry on a polyimide film in a blade mode, and baking to obtain a carbon nanotube coating film; adsorbing the carbon nanotube coating film on an etching workbench by using vacuum, introducing a super-surface structure model into a laser etching instrument, and etching to obtain an impedance super-surface;
(2) preparation of graphene film
Mixing and stirring graphene and polyamide acid resin, and then carrying out high-temperature curing reaction to form a graphene film;
(3) preparation of electromagnetic films
Carrying out blade coating on the metal micro powder slurry to form a semi-solidified metal micro powder magnetic medium film; sequentially paving and sticking semi-solidified metal micro powder magnetic medium films to form an electromagnetic film;
(4) multi-layer material composite
And paving and pasting the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel in sequence, and carrying out curing reaction after the bonding is finished to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
(III) advantageous effects
The technical scheme of the invention has the following advantages:
according to the invention, glass fiber reinforced plastic, a super-surface, a graphene film, an electromagnetic film and aerogel are compounded, and the prepared high-temperature-resistant ultra-wideband wave-absorbing structure integrated material has an average reflectivity of less than or equal to-5 dB at 1-2GHz, an average reflectivity of less than or equal to-10 dB at 2-8GHz and an absorption bandwidth of 7 GHz; the integrated material has the excellent characteristics of thin thickness, wide absorption frequency band, high temperature resistance and insensitive polarization, and can simultaneously realize high temperature resistance and ultra-wideband wave absorption performance.
Drawings
FIG. 1 is a schematic structural diagram of a high-temperature-resistant ultra-wideband wave-absorbing structure integrated material of the invention;
FIG. 2 is a schematic diagram of a periodic structure unit and a periodic form of a super surface of the high temperature resistant ultra-wideband wave-absorbing structure integrated material of the present invention;
FIG. 3 is a reflectivity waveform diagram of the high temperature resistant ultra-wideband wave-absorbing structure integrated material in example 1 at 1-8 GHz;
FIG. 4 is a reflectivity waveform diagram of the high temperature resistant ultra-wideband wave-absorbing structure integrated material in example 2 at 1-8 GHz;
FIG. 5 is a reflectivity waveform diagram of the high temperature resistant ultra-wideband wave-absorbing structure integrated material in example 3 at 1-8 GHz;
FIG. 6 is a reflectivity waveform diagram of the high temperature resistant ultra-wideband wave-absorbing structure integrated material in example 4 at 1-8 GHz;
FIG. 7 is a reflectivity waveform diagram of the high temperature resistant ultra-wideband wave-absorbing structure integrated material in example 5 at 1-8 GHz.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The invention provides a high-temperature-resistant ultra-wideband wave-absorbing structure integrated material in a first aspect, which comprises or consists of the following layers: the electromagnetic wave-absorbing material comprises a glass fiber reinforced plastic layer, a super surface layer, at least one graphene film layer, at least one aerogel layer and an electromagnetic film layer, wherein the super surface layer is located between the glass fiber reinforced plastic layer and the electromagnetic film layer, and the at least one graphene film layer and the at least one aerogel layer are located between the super surface layer and the electromagnetic film layer.
According to some preferred embodiments, the integrated material has at least one graphene thin film layer adjacent to the super surface layer; and/or at least one of said aerogel layers is contiguous with said electromagnetic film layer;
preferably, the at least one graphene film layer and the at least one aerogel layer are each independently at least two-layer structures, more preferably 2 to 8-layer structures, and even more preferably 4-layer structures; it is further preferred that in the case where the graphene thin film layer and the aerogel layer are independently at least two-layer structures, the graphene thin film layer and the aerogel layer are alternately arranged.
According to some preferred embodiments, the glass fiber reinforced plastic has a thickness of 1-3mm, the super-surface has a thickness of 0.06-0.13mm, the graphene thin film has a thickness of 0.15-0.25mm, the aerogel has a thickness of 2-3mm, and the electromagnetic film has a thickness of 1.0-2.0 mm.
According to some preferred embodiments, the concentration of graphene in the graphene film in one layer of the integrated material is 4% to 6%, 6% to 8%, 8% to 10%, 10% to 12%.
According to some preferred embodiments, the super-surface is a periodic structure obtained by introducing a super-surface structure model on a carbon nanotube coating film and then etching, and the unit of the periodic structure is a regular hexagon, wherein the outer side length is 7.5mm, the inner side length is 7mm, and the distance between the center points of the two regular hexagons is 6 mm.
The second aspect of the invention provides a preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material in the first aspect of the invention, which comprises the following steps:
(1) preparation of a Supersurface
Coating the carbon nanotube slurry on a polyimide film in a blade mode, and baking to obtain a carbon nanotube coating film; adsorbing the carbon nanotube coating film on an etching workbench by using vacuum, introducing a super-surface structure model into a laser etching instrument, and etching to obtain an impedance super-surface;
(2) preparation of graphene film
Mixing and stirring graphene and polyamide acid resin, and then carrying out high-temperature curing reaction to form a graphene film;
(3) preparation of electromagnetic films
Carrying out blade coating on the metal micro powder slurry to form a semi-solidified metal micro powder magnetic medium film; sequentially paving and sticking semi-solidified metal micro powder magnetic medium films to form an electromagnetic film;
(4) multi-layer material composite
And paving and pasting the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel in sequence, and carrying out curing reaction after the bonding is finished to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
According to some preferred embodiments, in step (1), the carbon nanotubes are prepared by the following steps:
weighing 10-20g of carbon nanotube powder, putting into a mixing container, adding 100g of distilled water and 0.5g of dispersing agent, putting into a double-planet stirrer, and stirring for 10-30min to form carbon nanotube dispersion liquid; adding 80-90g of acrylic resin into the carbon nanotube dispersion liquid, stirring in a double-planet stirrer for 10-30min, putting into a ball mill for ball milling for 10-20min until the slurry is uniformly dispersed to form the carbon nanotube slurry;
the dispersant may be sodium dodecylbenzene sulfonate (SDBS).
According to some preferred embodiments, in step (1), a 150 μm scraper is used to uniformly scrape and coat the carbon nanotube slurry on the polyimide film, the thickness of the polyimide film is 500-1000 μm, and the amount of the carbon nanotube slurry is 10g-30 g;
the baking temperature is 130-150 ℃, the baking time is 5-20min, and the surface sheet resistance of the carbon nano tube coating film is 40-80 omega;
the vacuum adsorption is carried out on a workbench of the laser etching instrument, and the etching frequency is 10 cycles.
According to some preferred embodiments, in the step (2), the graphene and the polyamic acid resin are mixed according to a mass ratio of 4: 96 to 6: 94, and undergo a high-temperature curing reaction to form a graphene film with a graphene concentration of 4% to 6%;
mixing graphene and polyamide acid resin according to the mass ratio of 6: 94-8: 92, and carrying out high-temperature curing reaction to form a graphene film with the graphene concentration of 6-8%;
mixing graphene and polyamide acid resin according to the mass ratio of 8: 92-10: 90, and carrying out high-temperature curing reaction to form a graphene film with the graphene concentration of 8-10%;
mixing graphene and polyamide acid resin according to the mass ratio of 10: 90-12: 88, and carrying out high-temperature curing reaction to form a graphene film with the graphene concentration of 10% -12%;
the high-temperature curing reaction comprises the following steps: the reaction is carried out for 1h at 100 ℃, 2h at 150 ℃ and 1h at 200 ℃.
According to some preferred embodiments, in the step (3), the metal fine powder slurry is prepared as follows:
weighing 900g of 800-;
the dispersant may be a KH560 silane coupling agent.
Carrying out blade coating on the metal micro powder slurry on centrifugal paper by adopting a blade coating machine, wherein the thickness of the semi-solidified metal micro powder magnetic medium film is 0.2mm, and the thickness of the electromagnetic film is 1-2 mm;
according to some preferred embodiments, in the step (4), the curing reaction is performed in a high temperature furnace, the temperature of the curing reaction is 100 ℃ to 200 ℃, and the time of the curing reaction is 20min to 40 min.
Example 1
Structure of integrated material
The high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is composed of glass fiber reinforced plastic, a super surface, a graphene film, an electromagnetic film and aerogel and has a eleven-layer structure as shown in figure 1. The first layer is made of glass fiber reinforced plastic, the thickness d1 is 3mm, the second layer is a super-surface, the thickness d2 is 0.13mm, the third layer is a graphene film with a graphene concentration of 6%, the thickness d3 is 0.2mm, the fourth layer is aerogel, the thickness d4 is 3mm, the fifth layer is a graphene film with a graphene concentration of 8%, the thickness d5 is 0.2mm, the sixth layer is aerogel, the thickness d6 is 3mm, the seventh layer is a graphene film with a graphene concentration of 10%, the thickness d7 is 0.2mm, the eighth layer is aerogel, the thickness d8 is 3mm, the ninth layer is a graphene film with a graphene concentration of 12%, the thickness d9 is 0.2mm, the tenth layer is aerogel, the thickness d10 is 3mm, the tenth layer is an electromagnetic film, and the thickness d11 is 1.5 mm. The super surface is a periodic structure etched on the carbon nanotube coating film, the sheet resistance of the surface of the carbon nanotube coating film is 50 Ω, the periodic structural units are regular hexagons, the structural units and the periodic form are shown in fig. 2, wherein a is 7.5mm, b is 7mm, and c is 6 mm.
The preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material comprises the following steps:
(1) preparation of a Supersurface
Weighing 20g of purified carbon nanotube powder, putting into a 1000ml beaker, adding 100g of distilled water and 0.5g of dispersing agent (sodium dodecyl benzene sulfonate (SDBS)), and putting into a double-planet stirrer to stir for 10 min; adding 80g of acrylic resin into the uniformly stirred carbon nanotube dispersion liquid, stirring for 10min in a double-planet stirrer, and putting into a ball mill for ball milling for 10min until the slurry is uniformly dispersed to form carbon nanotube slurry;
weighing 20g of carbon nanotube slurry, uniformly coating the carbon nanotube slurry on a polyimide film with the thickness of 500 microns by using a scraper with the thickness of 150 microns, and placing the polyimide film in an oven for baking for 10min at the temperature of 140 ℃ to obtain a carbon nanotube coating film with the surface sheet resistance of 50 omega;
and placing the carbon nanotube film on a workbench of a laser etching instrument for vacuum adsorption, introducing into the designed super-surface structure model, and etching for 10 cycles to obtain the impedance super-surface.
(2) Preparation of graphene film
Stirring graphene and polyamide acid resin according to the mass ratio of 6: 94 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 6%; stirring graphene and polyamide acid resin according to the mass ratio of 8: 92 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 8%; stirring graphene and polyamide acid resin according to the mass ratio of 10: 90 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 10%; stirring graphene and polyamide acid resin according to the mass ratio of 12: 88 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 12%;
(3) preparation of electromagnetic films
Weighing 800g of metal micropowder, putting the metal micropowder into a mixing cup, adding 200g of epoxy resin and 5g of dispersing agent (KH560 silane coupling agent), putting the mixture into a double-planet stirrer, stirring for 10min, putting the mixture into a ball mill, and carrying out ball milling for 10min until the slurry is uniformly dispersed to form metal micropowder slurry; carrying out blade coating on the metal micro powder slurry on centrifugal paper by adopting a blade coating machine to form a 0.2mm semi-solidified metal micro powder magnetic medium film;
and sequentially paving 10 layers of 0.2mm semi-solidified metal micro powder magnetic medium films to form the electromagnetic film with the thickness of 2 mm.
(4) Multi-layer material composite
And sequentially paving the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel to the specified thickness according to the structure of the integrated material. And after the bonding is finished, putting the material into a high-temperature furnace for curing for 20min at the temperature of 150 ℃ to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
The reflectivity of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material at 1-8GHz is shown in figure 3. The average reflectivity of the composite material is less than or equal to-5 dB at 1-2GHz, and the average reflectivity is less than or equal to-10 dB at 2-8 GHz. The composite material has the excellent characteristics of thin thickness, wide absorption frequency band, high temperature resistance and insensitive polarization.
Example 2
Structure of integrated material
The high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is composed of glass fiber reinforced plastic, a super surface, a graphene film, an electromagnetic film and aerogel and has a eleven-layer structure as shown in figure 1. The first layer is made of glass fiber reinforced plastic, the thickness d1 is 3mm, the second layer is a super-surface, the thickness d2 is 0.13mm, the third layer is a graphene film with a graphene concentration of 4%, the thickness d3 is 0.2mm, the fourth layer is aerogel, the thickness d4 is 3mm, the fifth layer is a graphene film with a graphene concentration of 6%, the thickness d5 is 0.2mm, the sixth layer is aerogel, the thickness d6 is 3mm, the seventh layer is a graphene film with a graphene concentration of 8%, the thickness d7 is 0.2mm, the eighth layer is aerogel, the thickness d8 is 3mm, the ninth layer is a graphene film with a graphene concentration of 10%, the thickness d9 is 0.2mm, the tenth layer is aerogel, the thickness d10 is 3mm, the tenth layer is an electromagnetic film, and the thickness d11 is 1.5 mm. The super-surface is formed by etching a periodic structure on a carbon nanotube coating, the sheet resistance of the surface of the carbon nanotube coating is 45 Ω, the periodic structural units are regular hexagons, the structural units and the periodic form are shown in fig. 2, wherein a is 7.5mm, b is 7mm, and c is 6 mm.
The preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material comprises the following steps:
(1) preparation of a Supersurface
Weighing 20g of purified carbon nanotube powder, putting into a 1000ml beaker, adding 100g of distilled water and 0.5g of dispersing agent (sodium dodecyl benzene sulfonate (SDBS)), and putting into a double-planet stirrer to stir for 13 min; adding 80g of acrylic resin into the uniformly stirred carbon nanotube dispersion liquid, stirring for 13min in a double-planet stirrer, and putting into a ball mill for ball milling for 13min until the slurry is uniformly dispersed to form carbon nanotube slurry.
Weighing 20g of carbon nanotube slurry, uniformly coating the carbon nanotube slurry on a polyimide film with the thickness of 800 μm by using a scraper with the thickness of 150 μm, and placing the polyimide film in an oven for baking for 5min at the temperature of 140 ℃ to obtain a carbon nanotube coating film with the surface square resistance of 45 omega.
And placing the carbon nanotube film on a workbench of a laser etching instrument for vacuum adsorption, introducing into the designed super-surface structure model, and etching for 10 cycles to obtain the impedance super-surface.
(2) Preparation of graphene film
Stirring graphene and polyamide acid resin according to the ratio of 4: 96 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 4%; stirring graphene and polyamide acid resin according to the ratio of 6: 94 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 6%; stirring graphene and polyamide acid resin according to the ratio of 8: 92 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 8%; and stirring the graphene and the polyamide acid resin according to the ratio of 10: 90 until the graphene and the polyamide acid resin are uniformly dispersed, and carrying out high-temperature curing reaction to form the graphene film with the graphene concentration of 10%.
(3) Preparation of electromagnetic films
Weighing 800g of metal micropowder, putting the metal micropowder into a mixing cup, adding 200g of epoxy resin and 5g of dispersing agent (KH560 silane coupling agent), putting the mixture into a double-planet stirrer, stirring for 20min, putting the mixture into a ball mill, and carrying out ball milling for 15min until the slurry is uniformly dispersed to form metal micropowder slurry; and (3) carrying out blade coating on the metal micro powder slurry on centrifugal paper by adopting a blade coating machine to form a 0.2mm semi-solidified metal micro powder magnetic medium film.
And sequentially paving 10 layers of 0.2mm semi-solidified metal micro powder magnetic medium films to form the electromagnetic film with the thickness of 2 mm.
(4) Multi-layer material composite
And sequentially paving the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel to the specified thickness according to the structure of the integrated material. And after the bonding is finished, putting the material into a high-temperature furnace for curing for 30min at the temperature of 150 ℃ to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
The reflectivity of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material at 1-8GHz is shown in figure 4. The average reflectivity of the composite material is less than or equal to-5 dB at 1-2GHz, and the average reflectivity is less than or equal to-10 dB at 2-8 GHz. The composite material has the excellent characteristics of thin thickness, wide absorption frequency band, high temperature resistance and insensitive polarization.
Example 3
Structure of integrated material
The high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is composed of glass fiber reinforced plastic, a super surface, a graphene film, an electromagnetic film and aerogel and has a eleven-layer structure as shown in figure 1. The first layer is made of glass fiber reinforced plastic, the thickness d1 is 3mm, the second layer is a super-surface, the thickness d2 is 0.13mm, the third layer is a graphene film with a graphene concentration of 6%, the thickness d3 is 0.2mm, the fourth layer is aerogel, the thickness d4 is 3mm, the fifth layer is a graphene film with a graphene concentration of 8%, the thickness d5 is 0.2mm, the sixth layer is aerogel, the thickness d6 is 3mm, the seventh layer is a graphene film with a graphene concentration of 10%, the thickness d7 is 0.2mm, the eighth layer is aerogel, the thickness d8 is 3mm, the ninth layer is a graphene film with a graphene concentration of 12%, the thickness d9 is 0.2mm, the tenth layer is aerogel, the thickness d10 is 3mm, the tenth layer is an electromagnetic film, and the thickness d11 is 1.5 mm. The super-surface is formed by etching a periodic structure on a carbon nanotube coating, the sheet resistance of the surface of the carbon nanotube coating is 45 Ω, the periodic structural units are regular hexagons, the structural units and the periodic form are shown in fig. 2, wherein a is 7.5mm, b is 7mm, and c is 6 mm.
The preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material comprises the following steps:
(1) preparation of a Supersurface
Weighing 20g of purified carbon nanotube powder, putting into a 1000ml beaker, adding 100g of distilled water and 0.5g of dispersing agent (sodium dodecyl benzene sulfonate (SDBS)), and putting into a double-planet stirrer to stir for 10 min; adding 80g of acrylic resin into the uniformly stirred carbon nanotube dispersion liquid, stirring in a double-planet stirrer for 23min, and putting into a ball mill for ball milling for 17min until the slurry is uniformly dispersed to form carbon nanotube slurry.
Weighing 20g of carbon nanotube slurry, uniformly scraping and coating the carbon nanotube slurry on a polyimide film with the thickness of 600 μm by using a scraper with the thickness of 150 μm, and placing the polyimide film in an oven for baking for 10min at the temperature of 140 ℃ to obtain a carbon nanotube coating film with the surface sheet resistance of 45 omega.
And placing the carbon nanotube film on a workbench of a laser etching instrument for vacuum adsorption, introducing into the designed super-surface structure model, and etching for 10 cycles to obtain the impedance super-surface.
(2) Preparation of graphene film
Stirring graphene and polyamide acid resin according to the ratio of 6: 94 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 6%; stirring graphene and polyamide acid resin according to the ratio of 8: 92 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 8%; stirring graphene and polyamide acid resin according to the proportion of 10: 90 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 10%; and stirring the graphene and the polyamide acid resin according to the proportion of 12: 88 until the graphene and the polyamide acid resin are uniformly dispersed, and carrying out high-temperature curing reaction to form the graphene film with the graphene concentration of 12%.
(3) Preparation of electromagnetic films
Weighing 900g of metal micropowder, putting the metal micropowder into a mixing cup, adding 100g of epoxy resin and 5g of dispersing agent (KH560 silane coupling agent), putting the mixture into a double-planet stirrer, stirring for 10min, putting the mixture into a ball mill, and carrying out ball milling for 10min until the slurry is uniformly dispersed to form metal micropowder slurry. And (3) carrying out blade coating on the metal micro powder slurry on centrifugal paper by adopting a blade coating machine to form a 0.2mm semi-solidified metal micro powder magnetic medium film.
And sequentially paving 10 layers of 0.2mm semi-solidified metal micro powder magnetic medium films to form the electromagnetic film with the thickness of 2 mm.
(4) Multi-layer material composite
And sequentially paving the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel to the specified thickness according to the structure of the integrated material. And after the bonding is finished, putting the material into a high-temperature furnace for curing for 20min at the temperature of 150 ℃ to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
The reflectivity of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material at 1-8GHz is shown in figure 5. The average reflectivity of the composite material is less than or equal to-5 dB at 1-2GHz, and the average reflectivity is less than or equal to-10 dB at 2-8 GHz. The composite material has the excellent characteristics of thin thickness, wide absorption frequency band, high temperature resistance and insensitive polarization.
Example 4
Structure of integrated material
The high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is composed of glass fiber reinforced plastic, a graphene film, an electromagnetic film and aerogel and is of a ten-layer structure. The first layer is made of glass fiber reinforced plastic, the thickness d1 is 3mm, the second layer is a graphene film with a graphene concentration of 6%, the thickness d2 is 0.2mm, the third layer is made of aerogel, the thickness d3 is 3mm, the fourth layer is a graphene film with a graphene concentration of 8%, the thickness d4 is 0.2mm, the fifth layer is made of aerogel, the thickness d5 is 3mm, the sixth layer is a graphene film with a graphene concentration of 10%, the thickness d6 is 0.2mm, the seventh layer is made of aerogel, the thickness d7 is 3mm, the eighth layer is a graphene film with a graphene concentration of 12%, the thickness d8 is 0.2mm, the ninth layer is made of aerogel, the thickness d9 is 3mm, the tenth layer is an electromagnetic film, and the thickness d10 is 1.5 mm.
The preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material comprises the following steps:
(1) preparation of graphene film
Stirring graphene and polyamide acid resin according to the ratio of 6: 94 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 6%; stirring graphene and polyamide acid resin according to the ratio of 8: 92 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 8%; stirring graphene and polyamide acid resin according to the proportion of 10: 90 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 10%; and stirring the graphene and the polyamide acid resin according to the proportion of 12: 88 until the graphene and the polyamide acid resin are uniformly dispersed, and carrying out high-temperature curing reaction to form the graphene film with the graphene concentration of 12%.
(2) Preparation of electromagnetic films
Weighing 800g of metal micropowder, putting the metal micropowder into a mixing cup, adding 200g of epoxy resin and 5g of dispersing agent (KH560 silane coupling agent), putting the mixture into a double-planet stirrer, stirring for 10min, putting the mixture into a ball mill, and carrying out ball milling for 10min until the slurry is uniformly dispersed to form metal micropowder slurry. And (3) carrying out blade coating on the metal micro powder slurry on centrifugal paper by adopting a blade coating machine to form a 0.2mm semi-solidified metal micro powder magnetic medium film.
And sequentially paving 10 layers of 0.2mm semi-solidified metal micro powder magnetic medium films to form the electromagnetic film with the thickness of 2 mm.
(3) Multi-layer material composite
And sequentially paving and pasting the glass fiber reinforced plastic, the graphene film, the electromagnetic film and the aerogel to the specified thickness according to the structure of the integrated material. And after the bonding is finished, putting the material into a high-temperature furnace for curing for 20min at the temperature of 150 ℃ to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
The reflectivity of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material at 1-8GHz is shown in figure 6. The average reflectivity of the composite material is less than or equal to-5 dB at 1-2GHz, and is more than-10 dB at 2-8GHz, especially at 6-8 GHz. The composite material has obviously reduced high-frequency performance.
Example 5
Structure of integrated material
The high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is composed of glass fiber reinforced plastic, a super surface, a graphene film and aerogel and has a ten-layer structure. The first layer is made of glass fiber reinforced plastic, the thickness d1 is 3mm, the second layer is a super-surface, the thickness d2 is 0.13mm, the third layer is a graphene film with a graphene concentration of 6%, the thickness d3 is 0.2mm, the fourth layer is aerogel, the thickness d4 is 3mm, the fifth layer is a graphene film with a graphene concentration of 8%, the thickness d5 is 0.2mm, the sixth layer is aerogel, the thickness d6 is 3mm, the seventh layer is a graphene film with a graphene concentration of 10%, the thickness d7 is 0.2mm, the eighth layer is aerogel, the thickness d8 is 3mm, the ninth layer is a graphene film with a graphene concentration of 12%, the thickness d9 is 0.2mm, the tenth layer is aerogel, and the thickness d10 is 3 mm. The super-surface is formed by etching a periodic structure on a carbon nanotube coating, the sheet resistance of the surface of the carbon nanotube coating is 45 Ω, the periodic structural units are regular hexagons, the structural units and the periodic form are shown in fig. 2, wherein a is 7.5mm, b is 7mm, and c is 6 mm.
(1) Preparation of a Supersurface
Weighing 20g of purified carbon nanotube powder, putting into a 1000ml beaker, adding 100g of distilled water and 0.5g of dispersing agent (sodium dodecyl benzene sulfonate (SDBS)), and putting into a double-planet stirrer to stir for 30 min; adding 80g of acrylic resin into the uniformly stirred carbon nanotube dispersion liquid, stirring in a double-planet stirrer for 30min, and putting into a ball mill for ball milling for 20min until the slurry is uniformly dispersed to form carbon nanotube slurry.
Weighing 20g of carbon nanotube slurry, uniformly coating the carbon nanotube slurry on a polyimide film with the thickness of 1000 μm by using a scraper with the thickness of 150 μm, and placing the polyimide film in an oven for baking for 20min at the temperature of 140 ℃ to obtain a carbon nanotube coating film with the surface square resistance of 45 omega.
And placing the carbon nanotube film on a workbench of a laser etching instrument for vacuum adsorption, introducing into the designed super-surface structure model, and etching for 10 cycles to obtain the impedance super-surface.
(2) Preparation of graphene film
Stirring graphene and polyamide acid resin according to the ratio of 6: 94 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 6%; stirring graphene and polyamide acid resin according to the ratio of 8: 92 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 8%; stirring graphene and polyamide acid resin according to the proportion of 10: 90 until the graphene and the polyamide acid resin are uniformly dispersed, and performing high-temperature curing reaction to form a graphene film with the graphene concentration of 10%; and stirring the graphene and the polyamide acid resin according to the proportion of 12: 88 until the graphene and the polyamide acid resin are uniformly dispersed, and carrying out high-temperature curing reaction to form the graphene film with the graphene concentration of 12%.
(3) Multi-layer material composite
And sequentially paving the glass fiber reinforced plastic, the super-surface, the graphene film and the aerogel to the specified thickness according to the structure of the integrated material. And after the bonding is finished, putting the material into a high-temperature furnace for curing for 40min at the temperature of 150 ℃ to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
The reflectivity of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material at 1-8GHz is shown in figure 7. The average reflectivity of the composite material is less than or equal to-3 dB at 1-3GHz, and the average reflectivity is less than or equal to-10 dB at 4-8 GHz. The low-frequency performance of the composite material is obviously reduced.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. The high-temperature-resistant ultra-wideband wave-absorbing structure integrated material is characterized by comprising the following layers or consisting of the following layers: the electromagnetic wave-absorbing material comprises a glass fiber reinforced plastic layer, a super surface layer, at least one graphene film layer, at least one aerogel layer and an electromagnetic film layer, wherein the super surface layer is located between the glass fiber reinforced plastic layer and the electromagnetic film layer, and the at least one graphene film layer and the at least one aerogel layer are located between the super surface layer and the electromagnetic film layer.
2. The integrated material of claim 1, wherein:
at least one graphene thin film layer is adjacent to the super-surface layer; and/or at least one of said aerogel layers is contiguous with said electromagnetic film layer;
preferably, the at least one graphene film layer and the at least one aerogel layer are each independently at least two-layer structures, more preferably 2 to 8-layer structures, and even more preferably 4-layer structures; it is further preferred that in the case where the graphene thin film layer and the aerogel layer are independently at least two-layer structures, the graphene thin film layer and the aerogel layer are alternately arranged.
3. The integrated material of claim 2, wherein:
the thickness of the glass fiber reinforced plastic is 1-3mm, the thickness of the super surface is 0.06-0.13mm, the thickness of the graphene film is 0.15-0.25mm, the thickness of the aerogel is 2-3mm, and the thickness of the electromagnetic film is 1.0-2.0 mm.
4. The integrated material according to claim 2 or 3, characterized in that:
the concentration of graphene in the graphene film of one layer in the integrated material is 4% -6%, 6% -8%, 8% -10% and 10% -12%.
5. The integrated material according to any one of claims 1 to 4, characterized in that:
the super surface is a periodic structure obtained by introducing a super surface structure model on a carbon nano tube coating film and then etching, the unit of the periodic structure is a regular hexagon, wherein the length of the outer edge is 7.5mm, the length of the inner edge is 7mm, and the distance between the central points of the two regular hexagons is 6 mm.
6. A preparation method of the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material as claimed in any one of claims 1 to 5, characterized in that the preparation method comprises the following steps:
(1) preparation of a Supersurface
Coating the carbon nanotube slurry on a polyimide film in a blade mode, and baking to obtain a carbon nanotube coating film; adsorbing the carbon nanotube coating film on an etching workbench by using vacuum, introducing a super-surface structure model into a laser etching instrument, and etching to obtain an impedance super-surface;
(2) preparation of graphene film
Mixing and stirring graphene and polyamide acid resin, and then carrying out high-temperature curing reaction to form a graphene film;
(3) preparation of electromagnetic films
Carrying out blade coating on the metal micro powder slurry to form a semi-solidified metal micro powder magnetic medium film; sequentially paving and sticking semi-solidified metal micro powder magnetic medium films to form an electromagnetic film;
(4) multi-layer material composite
Paving and sticking the glass fiber reinforced plastic, the super-surface, the graphene film, the electromagnetic film and the aerogel, and carrying out curing reaction after the bonding is finished to obtain the high-temperature-resistant ultra-wideband wave-absorbing structure integrated material.
7. The method of claim 6, wherein:
in the step (1), the carbon nanotube is prepared as follows:
weighing 10-20g of carbon nanotube powder, putting into a mixing container, adding 100g of distilled water and 0.5g of dispersing agent, putting into a double-planet stirrer, and stirring for 10-30min to form carbon nanotube dispersion liquid; adding 80-90g of acrylic resin into the carbon nanotube dispersion liquid, stirring in a double-planet stirrer for 10-30min, putting into a ball mill for ball milling for 10-20min until the slurry is uniformly dispersed to form the carbon nanotube slurry.
8. The production method according to claim 6 or 7, characterized in that:
in the step (1), a 150-micron scraper is adopted to uniformly scrape and coat the carbon nanotube slurry on a polyimide film, the thickness of the polyimide film is 500-1000 microns, and the using amount of the carbon nanotube slurry is 10-30 g;
the baking temperature is 130-150 ℃, the baking time is 5-20min, and the surface square resistance of the carbon nano tube coating film is 40-80 omega;
the vacuum adsorption is carried out on a workbench of the laser etching instrument, and the etching frequency is 10 cycles.
9. The production method according to any one of claims 6 to 8, characterized in that:
in the step (2), the graphene and the polyamic acid resin are mixed according to the mass ratio of 4: 96-6: 94 to form a graphene film with the graphene concentration of 4% -6%;
mixing graphene and polyamide acid resin according to the mass ratio of 6: 94-8: 92 to form a graphene film with the graphene concentration of 6-8%;
mixing graphene and polyamide acid resin according to the mass ratio of 8: 92 to 10: 90 to form a graphene film with the graphene concentration of 8% -10%;
mixing graphene and polyamide acid resin according to the mass ratio of 10: 90-12: 88 to form the graphene film with the graphene concentration of 10% -12%.
10. The production method according to any one of claims 6 to 9, characterized in that:
in the step (3), the preparation method of the metal micropowder slurry is as follows:
weighing 900g of 800-;
carrying out blade coating on the metal micro powder slurry on centrifugal paper by adopting a blade coating machine, wherein the thickness of the semi-solidified metal micro powder magnetic medium film is 0.2mm, and the thickness of the electromagnetic film is 1-2 mm;
in the step (4), the curing reaction is carried out in a high-temperature furnace, the temperature of the curing reaction is 100-200 ℃, and the time of the curing reaction is 20-40 min.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105315613A (en) * | 2014-05-27 | 2016-02-10 | 深圳光启创新技术有限公司 | Material for preparing wave absorbing membrane, wave absorbing membrane and wave absorbing membrane preparation method |
| CN107804041A (en) * | 2017-09-27 | 2018-03-16 | 北京机电工程研究所 | A kind of heat-insulated stealthy high temperature resistant air intake duct and preparation method thereof |
| CN109228587A (en) * | 2018-09-30 | 2019-01-18 | 北京环境特性研究所 | A kind of absorbing material and preparation method thereof |
| CN109532143A (en) * | 2018-12-04 | 2019-03-29 | 北京机电工程研究所 | Anti-/heat-insulated stealthy integrated covering of one kind and preparation method thereof |
| CN110172170A (en) * | 2019-06-11 | 2019-08-27 | 慧迈材料科技(广东)有限公司 | A kind of manufacturing method of polyimides and graphene composite film |
| CN110385903A (en) * | 2019-08-23 | 2019-10-29 | 北京环境特性研究所 | A kind of lightweight broad-band absorbing material and preparation method thereof based on impedance Meta Materials |
-
2021
- 2021-01-04 CN CN202110002108.4A patent/CN112829392A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105315613A (en) * | 2014-05-27 | 2016-02-10 | 深圳光启创新技术有限公司 | Material for preparing wave absorbing membrane, wave absorbing membrane and wave absorbing membrane preparation method |
| CN107804041A (en) * | 2017-09-27 | 2018-03-16 | 北京机电工程研究所 | A kind of heat-insulated stealthy high temperature resistant air intake duct and preparation method thereof |
| CN109228587A (en) * | 2018-09-30 | 2019-01-18 | 北京环境特性研究所 | A kind of absorbing material and preparation method thereof |
| CN109532143A (en) * | 2018-12-04 | 2019-03-29 | 北京机电工程研究所 | Anti-/heat-insulated stealthy integrated covering of one kind and preparation method thereof |
| CN110172170A (en) * | 2019-06-11 | 2019-08-27 | 慧迈材料科技(广东)有限公司 | A kind of manufacturing method of polyimides and graphene composite film |
| CN110385903A (en) * | 2019-08-23 | 2019-10-29 | 北京环境特性研究所 | A kind of lightweight broad-band absorbing material and preparation method thereof based on impedance Meta Materials |
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