CN112829096A - Cutting steel wire without brass plating layer on surface and preparation method thereof - Google Patents
Cutting steel wire without brass plating layer on surface and preparation method thereof Download PDFInfo
- Publication number
- CN112829096A CN112829096A CN202011617273.2A CN202011617273A CN112829096A CN 112829096 A CN112829096 A CN 112829096A CN 202011617273 A CN202011617273 A CN 202011617273A CN 112829096 A CN112829096 A CN 112829096A
- Authority
- CN
- China
- Prior art keywords
- steel wire
- cutting steel
- brass
- coating
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/20—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/34—Alkaline compositions for etching copper or alloys thereof
Abstract
The invention discloses a cutting steel wire without a brass coating on the surface and a preparation method thereof, wherein a common cutting steel wire with a brass coating is deplated by a deplating solution, and the surface of the cutting steel wire is washed by clear water after the deplating treatment is finished; after the flushing is finished, coating an antirust agent on the surface of the cutting steel wire; and drying to obtain the cutting steel wire without the metal coating. The preparation method of the invention has good deplating treatment effect and no metal pollution residue; the subsequent treatment difficulty and cost are reduced; the cutting steel wire without the metal coating has mechanical properties equivalent to those of the cutting steel wire with the coating, but does not contain metals except Fe, so that the metals except Fe are prevented from being brought in the wafer slicing process, and the problem of metal pollution of Cu and Zn in wafer production can be thoroughly solved.
Description
Technical Field
The invention relates to the field of preparation methods of cutting steel wires, in particular to a cutting steel wire without a brass plating layer on the surface and a preparation method thereof.
Background
The semiconductor industry uses high purity single crystal silicon rods and slicing with cut steel wires to obtain wafers.The wafer's metal contamination requirements are very high, with typical 12 "silicon wafer polishing and epitaxial wafers requiring surface metal residues (Cu, Fe, Cr, Ni, Zn) below 1E10 atoms/cm2。
Therefore, to minimize the carry-in of metal in wafer processing, one metal carry-in would increase the subsequent removal. The existing cutting steel wire is a steel wire with a coating on the surface, a brass coating (brass is Cu/Zn alloy) is widely adopted, Cu and Zn metals are brought into the surface of a silicon wafer in the slicing process, and the treatment difficulty and cost are greatly increased.
How to treat the cutting steel wire with the metal coating to effectively remove the metal coating is worth researching.
Disclosure of Invention
The purpose of the invention is as follows: in order to overcome the defects in the prior art, the invention provides a cutting steel wire without a brass coating on the surface and a preparation method thereof, and the problem of metal pollution of Cu, Zn and the like caused in the slicing process is perfectly solved.
The technical scheme is as follows: in order to solve the technical problems, the technical scheme adopted by the invention is as follows:
a cutting steel wire without brass plating on the surface is a cutting steel wire without brass plating on the surface.
A preparation method of a cutting steel wire without a brass plating layer on the surface comprises the following steps:
s1: removing the plating solution from the common cutting steel wire with the metal coating, wherein the treatment temperature is room temperature, and the treatment time is more than 1 second;
s2: after the deplating treatment is finished, washing the surface of the cut steel wire for more than 1 time by using clear water;
s3: after the flushing is finished, coating an antirust agent on the surface of the cutting steel wire;
s4: and drying to obtain the cutting steel wire without the metal coating.
Furthermore, the preparation method of the deplating solution comprises the following steps: ammonium persulfate (NH4)2S2O8And 120mL of a density of 0.91g/cm3And uniformly mixing the ammonia NH3, and diluting to 1L of the required deplating solution.
Further, the antirust agent is specifically a water-based antirust agent.
Furthermore, the coating mode of the antirust agent is as follows: the cutting steel wire passes through the sponge soaked with the antirust agent, and the surface is completely covered.
Furthermore, the drying temperature in S4 is 100-500 ℃.
Has the advantages that: the invention has the following advantages:
(1) the preparation method is simple, the deplating treatment effect is good, and no metal pollution residue exists;
(2) the processed cutting steel wire has no metal coating residue, so that the subsequent processing difficulty and cost are reduced;
(3) the cutting steel wire without the metal coating has the mechanical property equivalent to that of the cutting steel wire with the coating, but does not contain metals except Fe, so that the metals except Fe are prevented from being brought in the wafer slicing process, and the problem of metal pollution of Cu and Zn in wafer production can be thoroughly solved.
Detailed Description
The present invention will be described in further detail with reference to the following examples:
the preparation method of the deplating solution of the embodiment 1-2 is as follows:
ammonium persulfate (NH4)2S2O8And 120mL of a density of 0.91g/cm3Ammonia NH of3After being mixed evenly, the mixed solution is diluted to 1L of required deplating solution.
Example 1:
a preparation method of a cutting steel wire without a brass plating layer on the surface comprises the following steps:
s1: removing the common cutting steel wire with the brass coating and the diameter of 0.130mm by a removing solution, wherein the treatment temperature is room temperature, and the treatment time is 5 seconds;
s2: after the deplating treatment is finished, washing the surface of the cut steel wire for 5 times by using clear water;
s3: after the flushing is finished, coating an antirust agent on the surface of the cutting steel wire, wherein the formula of the antirust agent is antirust oil; the coating mode of the antirust agent is as follows: the cutting steel wire passes through the sponge soaked with the antirust agent to realize complete surface coverage;
s4: drying at 200 ℃ on line to obtain a cutting steel wire without a brass coating; for wafer dicing in the semiconductor industry.
Example 2:
a preparation method of a cutting steel wire without a brass plating layer on the surface comprises the following steps:
s1: removing the common cutting steel wire with the brass plating layer and the diameter of 0.175mm by a removing solution, wherein the treatment temperature is room temperature, and the treatment time is 8 seconds;
s2: after the deplating treatment is finished, washing the surface of the cut steel wire for 4 times by using clear water;
s3: after the flushing is finished, coating an antirust agent on the surface of the cutting steel wire, wherein the antirust agent is a water-based antirust agent; the coating mode of the antirust agent is as follows: the cutting steel wire passes through the sponge soaked with the antirust agent to realize complete surface coverage;
s4: drying at 230 ℃ on line to obtain a cutting steel wire without a brass coating; for wafer dicing in the semiconductor industry.
The cut steel wires of examples 1-2 before and after treatment were tested for surface plating as shown in table 1 (test results are grams of weight of other metal plating per kilogram of surface of the steel wire, thus in g/kg, brass is an alloy of copper and zinc, thus the weight of copper and zinc per kilogram of surface of the steel wire, respectively):
TABLE 1 treatment Effect of examples 1-2
As can be seen from Table 1, after the treatment of the invention, the cutting steel wire containing the metal coating does not contain metals except Fe, thereby avoiding bringing metals except Fe in the wafer slicing process, and thoroughly solving the problem of Cu and Zn metal pollution in wafer production.
In addition, the cutting wires prepared in examples 1-2 were compared with those before treatment in terms of mechanical properties, as shown in Table 2:
TABLE 2 comparison of mechanical Properties before and after treatment of examples 1-2
As can be seen from Table 2, the mechanical properties of the cut steel wire treated by the method are equivalent to those of the cut steel wire treated by the method, and the problem of copper pollution of the semiconductor wafer caused by the cut steel wire is solved on the premise of ensuring the mechanical properties.
Claims (6)
1. A cutting steel wire having no brass-plated layer on the surface thereof, characterized in that the cutting steel wire has no brass-plated layer on the surface thereof.
2. A method for preparing a cutting wire having a brass-free plated surface according to claim 1, comprising the steps of:
s1: removing the plating solution from the common cutting steel wire with the metal coating, wherein the treatment temperature is room temperature, and the treatment time is more than 1 second;
s2: after the deplating treatment is finished, washing the surface of the cut steel wire for more than 1 time by using clear water;
s3: after the flushing is finished, coating an antirust agent on the surface of the cutting steel wire;
s4: and drying to obtain the cutting steel wire without the metal coating.
3. The method for producing a cutting wire having a brass-free plated surface according to claim 2, wherein: the preparation method of the deplating solution comprises the following steps: ammonium persulfate (NH4)2S2O8And 120mL of a density of 0.91g/cm3Ammonia NH of3And diluting to 1L after uniformly mixing to obtain the required deplating solution.
4. A method of producing a cutting wire having a surface free of brass plating according to claim 2 or 3, characterized in that: the antirust agent is specifically a water-based antirust agent.
5. The method for producing a cutting wire having a brass-free plated surface according to claim 2, wherein: the coating mode of the antirust agent is as follows: the cutting steel wire passes through the sponge soaked with the antirust agent, and the surface is completely covered.
6. The method for producing a cutting wire having a brass-free plated surface according to claim 2, wherein: the drying temperature in S4 is 100-500 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011617273.2A CN112829096A (en) | 2020-12-30 | 2020-12-30 | Cutting steel wire without brass plating layer on surface and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011617273.2A CN112829096A (en) | 2020-12-30 | 2020-12-30 | Cutting steel wire without brass plating layer on surface and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112829096A true CN112829096A (en) | 2021-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011617273.2A Pending CN112829096A (en) | 2020-12-30 | 2020-12-30 | Cutting steel wire without brass plating layer on surface and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112829096A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113696357A (en) * | 2021-08-19 | 2021-11-26 | 隆基绿能科技股份有限公司 | Cutting line and manufacturing method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141965A (en) * | 1995-08-03 | 1997-02-05 | 北京有色金属研究总院 | Decoppering technology of copper-stainless-steel fiber composite wire |
| US5927131A (en) * | 1996-03-26 | 1999-07-27 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw |
| CN101498669A (en) * | 2008-12-29 | 2009-08-05 | 山东胜通钢帘线有限公司 | Method for detecting coating gradient of brass plating steel wire |
| JP2010069607A (en) * | 2008-09-22 | 2010-04-02 | Kanai Hiroaki | Saw wire reproducing method |
| CN105849872A (en) * | 2013-12-26 | 2016-08-10 | 信越半导体株式会社 | Slicing method |
| CN106132631A (en) * | 2014-04-03 | 2016-11-16 | 信越半导体株式会社 | The cutting-off method of workpiece and working fluid |
| JP6063076B1 (en) * | 2016-03-02 | 2017-01-18 | ジャパンファインスチール株式会社 | Resin bond saw wire and manufacturing method thereof |
-
2020
- 2020-12-30 CN CN202011617273.2A patent/CN112829096A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141965A (en) * | 1995-08-03 | 1997-02-05 | 北京有色金属研究总院 | Decoppering technology of copper-stainless-steel fiber composite wire |
| US5927131A (en) * | 1996-03-26 | 1999-07-27 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw |
| JP2010069607A (en) * | 2008-09-22 | 2010-04-02 | Kanai Hiroaki | Saw wire reproducing method |
| CN101498669A (en) * | 2008-12-29 | 2009-08-05 | 山东胜通钢帘线有限公司 | Method for detecting coating gradient of brass plating steel wire |
| CN105849872A (en) * | 2013-12-26 | 2016-08-10 | 信越半导体株式会社 | Slicing method |
| CN106132631A (en) * | 2014-04-03 | 2016-11-16 | 信越半导体株式会社 | The cutting-off method of workpiece and working fluid |
| JP6063076B1 (en) * | 2016-03-02 | 2017-01-18 | ジャパンファインスチール株式会社 | Resin bond saw wire and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 程沪生;: "不良镀层的退除方法(一)", 电镀与涂饰 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113696357A (en) * | 2021-08-19 | 2021-11-26 | 隆基绿能科技股份有限公司 | Cutting line and manufacturing method thereof |
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