CN112829093A - Upper pressing mechanism, cutting mechanism and cutting device for silicon crystal bar cutting device - Google Patents
Upper pressing mechanism, cutting mechanism and cutting device for silicon crystal bar cutting device Download PDFInfo
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- CN112829093A CN112829093A CN202011625085.4A CN202011625085A CN112829093A CN 112829093 A CN112829093 A CN 112829093A CN 202011625085 A CN202011625085 A CN 202011625085A CN 112829093 A CN112829093 A CN 112829093A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 127
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 118
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 118
- 239000010703 silicon Substances 0.000 title claims abstract description 118
- 238000005520 cutting process Methods 0.000 title claims abstract description 117
- 239000013078 crystal Substances 0.000 title claims abstract description 109
- 238000001514 detection method Methods 0.000 claims description 36
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 230000001174 ascending effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of cutting of hard and brittle bars, in particular to an upper pressing mechanism, a cutting mechanism and a cutting device for a silicon crystal bar cutting device, wherein the upper pressing mechanism comprises an elastic seat and a telescopic pressing piece; the elastic seat comprises an upper fixed plate, a lower movable plate, a mandrel and an elastic piece, the upper fixed plate is used for connecting and fixing the elastic seat, the upper fixed plate and the lower movable plate are arranged oppositely, the mandrel is connected with the upper fixed plate and the lower movable plate in a sliding mode, and the elastic piece is sleeved outside the mandrel; the flexible piece that compresses tightly sets up in the bottom of lower movable plate, and the tip of the flexible section of flexible piece that compresses tightly can support with the lateral wall of silicon crystal bar and lean on to compress tightly. The setting of hold-down mechanism on this scheme can guarantee that silicon crystal bar centre gripping is reliable and stable when using the ascending support of the supporting mechanism that floats, and positional deviation can not appear in silicon crystal bar centre gripping, and cutting accuracy is high, of high quality.
Description
Technical Field
The invention relates to the technical field of cutting of hard and brittle bars, in particular to an upper pressing mechanism, a cutting mechanism and a cutting device for a silicon crystal bar cutting device.
Background
In the existing single crystal silicon rod cutting device, a single crystal silicon rod is placed on a roller wheel support frame and is supported by a roller wheel group of the roller wheel support frame, so that the single crystal silicon rod is conveniently conveyed to a specified position. Before cutting, the silicon crystal bar is supported upwards through a floating support mechanism below the silicon crystal bar, clamping is achieved under the action of the self weight of the silicon crystal bar, then the roller support frame descends, and a cutting space is reserved for the wire saw cutting mechanism. The above scheme has the following disadvantages: (1) the ejection force of the floating support mechanism when the floating support mechanism is supported upwards is generally controlled to be small, mainly in order to avoid deflection of the single crystal silicon rod caused by excessive ejection force, so that the proper ejection force is particularly important, and meanwhile, the end contact block of the floating support after being ejected is ensured to be in complete contact with the single crystal silicon rod. (2) Because the cutting section of the silicon single crystal rod is not long, if the same ejection force is set, a plurality of floating support mechanisms are arranged on a longer rod, so that incomplete ejection contact is easily caused, and the cutting quality is poor due to the fact that the silicon single crystal rod is obliquely ejected on the shorter rod. Therefore, the most suitable ejection force should be adjusted along with the length of the rod, if the ejection force depends on manual operation, the operation process is complicated, the manual strength is high, and if the equipment is required to be automatically ensured, the automation degree of the equipment is higher, so that the equipment cost is increased. (3) The silicon single crystal rod cutting device is provided with a dynamic roller set, the whole roller set needs to be moved away from the position of a cutting line in the cutting process, and in the process that the roller set is separated from the silicon single crystal rod, if the floating support mechanism is unreliable in supporting, the silicon single crystal rod can be deflected, so that the cutting quality is reduced.
Disclosure of Invention
Therefore, the upper pressing mechanism, the cutting mechanism and the cutting device for the silicon crystal bar cutting device need to be provided to solve the problems that in the existing silicon crystal bar cutting device, a floating supporting mechanism is used for supporting upwards, the clamping of the silicon crystal bar is realized by the self-weight of the silicon crystal bar, the clamping of the silicon crystal bar is unstable, and the cutting quality is influenced.
In order to achieve the above object, the inventor provides an upper pressing mechanism for a silicon crystal bar cutting device, the upper pressing mechanism comprising an elastic seat and a telescopic pressing piece;
the elastic seat comprises an upper fixed plate, a lower movable plate, a mandrel and an elastic piece, the upper fixed plate is used for connecting and fixing the elastic seat, the upper fixed plate and the lower movable plate are arranged oppositely, the mandrel is connected with the upper fixed plate and the lower movable plate in a sliding mode, and the elastic piece is sleeved outside the mandrel;
the flexible piece that compresses tightly sets up in the bottom of lower movable plate, and the tip of the flexible section of flexible piece that compresses tightly can support with the lateral wall of silicon crystal bar and lean on to compress tightly.
As a preferred structure of the invention, the elastic seat further comprises a limiting sliding assembly, the limiting sliding assembly comprises a sliding shaft and a sliding sleeve, one end of the sliding shaft is fixed with the lower movable plate, the other end of the sliding shaft is connected with the upper fixed plate in a sliding manner, and the sliding sleeve is arranged between the upper fixed plate and the sliding shaft.
As a preferable structure of the invention, the four limiting sliding assemblies are uniformly distributed on the periphery of the mandrel.
As a preferred structure of the present invention, the upper pressing mechanism further includes an upper detection assembly, the upper detection assembly is configured to determine whether the silicon ingot is clamped reliably, the upper detection assembly includes an upper detection piece and an upper sensor, the upper detection piece is fixed to the lower movable plate, and the upper sensor is fixed to the upper fixing plate.
As a preferred structure of the present invention, the upper pressing mechanism further includes a lower detection assembly, the lower detection assembly is configured to determine whether the telescopic pressing member is lifted back to the proper position, the lower detection assembly includes a lower detection piece and a lower sensor, the lower detection piece is fixed to the telescopic section of the telescopic pressing member, and the lower sensor is configured to cooperate with the lower detection piece to perform detection.
As a preferred structure of the invention, the upper pressing mechanism further comprises a pressing head, the pressing head is arranged at the end of the telescopic section of the telescopic pressing piece, and the pressing head can be driven by the telescopic pressing piece to abut against and press the side wall of the silicon crystal bar.
As a preferable structure of the present invention, the telescopic pressing member is one of an electric cylinder, an air cylinder, a hydraulic cylinder, or an electric push rod.
In order to achieve the above object, the inventor also provides a cutting mechanism for silicon crystal bar cutting device, the cutting mechanism includes ring wire saw cutting unit and last hold-down mechanism, it is foretell hold-down mechanism to go up the hold-down mechanism, go up hold-down mechanism and be fixed in on the shell body of ring wire saw cutting unit, and go up hold-down mechanism and be located the intermediate position.
As a preferable structure of the invention, the cutting mechanism further comprises a sliding seat, the sliding seat is arranged on the outer shell of the circular wire saw cutting unit, and the telescopic pressing piece is slidably arranged in the sliding seat in a penetrating manner.
In order to realize the purpose, the inventor also provides a silicon crystal bar stock cutting device, which comprises a lifting roller supporting frame, a floating supporting mechanism and a cutting mechanism, wherein the cutting mechanism is the cutting mechanism.
Different from the prior art, the technical scheme has the following advantages: the invention relates to an upper pressing mechanism, a cutting mechanism and a cutting device for a silicon crystal bar cutting device, wherein the upper pressing mechanism comprises an elastic seat and a telescopic pressing piece, the silicon crystal bar is firstly placed on a roller supporting frame, the silicon crystal bar is conveyed to a designated position along a roller supporting piece, a lower movable plate is positioned at the lowest position under the action of the elastic piece in the elastic seat in an initial state, so that a telescopic pressing assembly is positioned at the lowest position, the telescopic pressing assembly is convenient to judge that the telescopic pressing piece is in a contraction state, interference on conveying and cutting of the silicon crystal bar is not caused, then the end part of a telescopic section downwards extended by the telescopic pressing piece is abutted against the silicon crystal bar, the lower movable plate and a mandrel of the elastic seat are pushed upwards along with the continuous ejection of the telescopic pressing piece, the elastic piece is compressed until the silicon crystal bar is reliably clamped, the extension is stopped, and then a floating supporting, all floating supporting mechanisms can be provided with one-level larger ejection pressure, so that reliable contact between the silicon crystal bar and the ejection supporting surface of the floating supporting mechanism is ensured, the silicon crystal bar cannot move under the jacking of the upper pressing mechanism, and reliable clamping and positioning are realized. And the silicon crystal bar stock is limited by the positions of the upper pressing mechanism and the lower floating support mechanism, and if the roller support frame needs to move downwards to avoid the position of the cutting line, the silicon crystal bar stock cannot be deflected in the downward movement process, so that the effective clamping of the silicon crystal bar stock is ensured. In this scheme, go up hold-down mechanism's setting and can guarantee that silicon crystal bar centre gripping is reliable and stable when using the ascending support of supporting mechanism that floats, position deviation can not appear in silicon crystal bar centre gripping, and cutting accuracy is high, of high quality.
Drawings
FIG. 1 is a schematic perspective view of an embodiment of an upper pressing mechanism for a silicon ingot cutting apparatus according to the present invention;
FIG. 2 is a second schematic perspective view of an embodiment of an upper pressing mechanism for a silicon ingot cutting device according to the present invention;
FIG. 3 is a schematic cross-sectional view of an embodiment of an elastic seat in an upper pressing mechanism for a silicon crystal bar cutting device according to the present invention;
FIG. 4 is a schematic cross-sectional view of an embodiment of an elastic seat in an upper pressing mechanism for a silicon crystal bar cutting device according to the present invention;
FIG. 5 is a schematic perspective view of a cutting mechanism for a silicon ingot cutting apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic perspective view of an embodiment of a silicon ingot cutting apparatus according to the present invention;
FIG. 7 is a schematic side view of an embodiment of a silicon ingot cutting apparatus according to the present invention;
fig. 8 is a schematic front view of the upper pressing mechanism of the silicon crystal bar cutting device according to the present invention abutting against the silicon crystal bar;
FIG. 9 is an enlarged view of area A of FIG. 8;
fig. 10 is a schematic front view of an embodiment of an upper pressing mechanism and a silicon crystal bar in an optimal abutting state in the silicon crystal bar cutting device according to the present invention;
FIG. 11 is an enlarged view of area B of FIG. 10;
description of reference numerals:
1. a cutting mechanism;
10. an upper pressing mechanism;
100. an elastic seat;
110. an upper fixing plate;
120. a movable plate is lowered;
130. a mandrel;
140. an elastic member;
150. a limiting sliding assembly; 151. a slide shaft; 152. a sliding sleeve;
200. a telescopic pressing member;
310. a detection sheet is arranged; 320. an upper sensor;
410. a lower detection sheet; 420. a lower sensor;
500. a pressure head;
600. a shield;
11. a wire saw cutting unit;
12. a slide base;
2. a roller supporting frame can be lifted;
3. a floating support mechanism.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 11 together, the upper pressing mechanism 10 is used for assisting the floating support mechanism 3 to clamp the silicon crystal bar when the floating support mechanism 3 is used to cut the silicon crystal bar to be cut, so as to prevent the silicon crystal bar from being unclamped or deviated due to the unmatched ejecting force of the floating support mechanism 3, and prevent the silicon crystal bar from being deviated when the roller set of the roller support frame moves down. Specifically, the upper pressing mechanism 10 includes an elastic seat 100 and a telescopic pressing member 200;
the elastic seat 100 is used for assembling and fixing the upper pressing mechanism 10 and other components of the cutting device, and also plays a role in positioning the telescopic pressing member 200. Specifically, the elastic seat 100 includes an upper fixing plate 110, a lower movable plate 120, a mandrel 130 and an elastic member 140, the upper fixing plate 110 is used for connecting and fixing the elastic seat 100, the upper fixing plate 110 and the lower movable plate 120 are oppositely disposed, the mandrel 130 is slidably connected to the upper fixing plate 110 and the lower movable plate 120, and the elastic member 140 is sleeved outside the mandrel 130; the upper fixed plate 110 is used for direct fixation with other components of the cutting device, the lower movable plate 120 is capable of performing an elevating movement together with the mandrel 130 when an external force is applied, and the mandrel 130 is used for connection of the lower movable plate 120 and positioning of the elastic member 140, so that the elastic member 140 is positioned between the upper fixed plate 110 and the lower movable plate 120. The elastic member 140 is mainly used for providing an elastic force, and on one hand, under the action of the elastic member, the telescopic pressing member 200 in the contracted state is at the lowest position in the initial state, so as to judge whether the telescopic pressing member 200 interferes with the conveying and cutting process of the silicon crystal bar; on the other hand, when the telescopic pressing member 200 is extended and ejected to the proper position, the elastic force provided by the elastic member 140 is used as a clamping supporting force, so as to ensure the stable clamping of the silicon crystal bar stock.
The flexible piece 200 that compresses tightly then is used for when carrying out the clamping to silicon crystal bar, and it is spacing to prop from the top, prevents that the floating support mechanism 3's of below from exerting oneself too big, causes silicon crystal bar beat, perhaps exerts oneself the undersize, causes the centre gripping not tight, and when the gyro wheel support frame descends or cuts, the silicon crystal bar condition such as rocks appears appearing. Specifically, the telescopic pressing member 200 is disposed at the bottom of the lower movable plate 120, and the end of the telescopic section of the telescopic pressing member 200 can abut against the side wall of the silicon crystal bar to be pressed.
The upper pressing mechanism for the silicon crystal bar cutting device comprises an elastic seat 100 and a telescopic pressing member 200, wherein a silicon crystal bar is firstly placed on a roller supporting frame, the silicon crystal bar is conveyed to a designated position along a roller supporting member, in an initial state, under the action of the elastic member 140 in the elastic seat 100, the lower movable plate 120 is located at the lowest position, and further the telescopic pressing assembly is located at the lowest position, so that when the telescopic pressing member 200 is judged to be in a contraction state, interference on conveying and cutting of the silicon crystal bar is avoided, then the end part of the telescopic section downwards extending out of the telescopic pressing member 200 abuts against the silicon crystal bar, as the telescopic pressing member 200 continues to eject, the lower movable plate 120 and the mandrel 130 of the elastic seat 100 are pushed upwards, the elastic member 140 is compressed until the silicon crystal bar is reliably clamped and stops extending, at the moment, the length of the telescopic pressing member 200 is unchanged, so that the clamping supporting force is provided by, and then the floating support mechanisms 3 in the cutting device are ejected upwards, all the floating support mechanisms 3 can be provided with ejection pressure of one level higher at the moment, so that the reliable contact between the silicon crystal bar and the ejection support surfaces of the floating support mechanisms 3 is ensured, the silicon crystal bar cannot move under the jacking of the upper pressing mechanism, and the reliable clamping and positioning are realized. And the silicon crystal bar stock is limited by the positions of the upper pressing mechanism 10 and the lower floating support mechanism 3, and if the roller support frame needs to move downwards to avoid the position of the cutting line, the silicon crystal bar stock cannot be deflected in the downward moving process, so that the silicon crystal bar stock is effectively clamped. In this scheme, go up hold-down mechanism 10's setting and can guarantee that silicon crystal bar centre gripping is reliable and stable when using the ascending support of supporting mechanism 3 that floats, position skew can not appear in silicon crystal bar centre gripping, and cutting accuracy is high, of high quality.
Referring to fig. 1 to 4, as a preferred embodiment of the present invention, the resilient base 100 further includes a limiting sliding assembly 150, and the limiting sliding assembly 150 is used for limiting a movement track of the lower movable plate 120, so as to ensure smooth movement of the lower movable plate 120 and enhance structural stability of the resilient base 100. Specifically, the limiting sliding assembly 150 includes a sliding shaft 151 and a sliding sleeve 152, one end of the sliding shaft 151 is fixed to the lower movable plate 120, the other end of the sliding shaft 151 is slidably connected to the upper fixing plate 110, and the sliding sleeve 152 is disposed between the upper fixing plate 110 and the sliding shaft 151. In the embodiment shown in fig. 1 and 2, the sliding assemblies 150 are four groups, and the four groups of sliding assemblies 150 are uniformly distributed on the periphery of the mandrel 130, so that the lower movable plate 120 has higher motion stability, and the elastic seat 100 has better structural strength.
As shown in fig. 6 to 11, as a preferred embodiment of the present invention, the upper pressing mechanism 10 further includes an upper detection assembly for determining whether the silicon ingot is clamped securely, the upper detection assembly includes an upper detection piece 310 and an upper sensor 320, the upper detection piece 310 is fixed to the lower movable plate 120, and the upper sensor 320 is fixed to the upper stationary plate 110. Referring to fig. 8 and 9, in a specific embodiment, after the silicon crystal ingot is conveyed to a designated position, the upper pressing mechanism 10 needs to be used for abutting and clamping, the end of the telescopic section, which extends downwards, of the telescopic pressing member 200 abuts against the silicon crystal ingot, and as the telescopic pressing member 200 continues to eject, the lower movable plate 120 and the mandrel 130 of the elastic seat 100 are pushed upwards, referring to fig. 10 and 11, the length of the upper detection piece 310 is selected and set according to data after multiple tests, so that when the upper detection piece 310 mounted on the lower movable plate 120 moves to the upper sensor 320, a stop signal is sent out, so that the telescopic pressing member 200 stops extending, at this time, the set elastic force of the elastic member 140 is optimal, and the clamping effect is optimal. At this time, the length of the telescopic pressing member 200 is not changed, and the clamping support force is provided by the elastic member 140.
Referring to fig. 1, 2 and 6 to 11, as a preferred embodiment of the present invention, the upper pressing mechanism 10 further includes a lower detection assembly, the lower detection assembly is used for determining whether the telescopic pressing member 200 is lifted to the right position, the lower detection assembly includes a lower detection piece 410 and a lower sensor 420, the lower detection piece 410 is fixed on the telescopic section of the telescopic pressing member 200, and the lower sensor 420 is used for matching with the lower detection piece 410 to perform detection. After the upper pressing mechanism 10 cooperates with the floating support mechanism 3 to clamp the silicon crystal bar, the cutting operation needs to be performed by using the circular wire saw cutting unit 11, and at this time, the position of the telescopic pressing member 200 needs to be lifted to prevent the interference with the cutting operation of the silicon crystal bar. At this moment, the flexible piece 200 that compresses tightly progressively contracts everywhere and is the state, and the elastic component 140 that compressed before is then because of the effect of restoring force down, make lower movable plate 120 and flexible piece 200 that compresses tightly move down, consequently in the in-service use, when guaranteeing that flexible piece 200 that compresses tightly is in the contraction state, the touching can not appear in silicon crystal bar cutting process, consequently need guarantee that flexible piece 200 that compresses tightly appears the condition of interfering when being in the lowest position, detection module under the event setting, detection module including down detect piece 410 and sensor 420's cooperation guarantee flexible piece 200 whole the rising back and target in place down through lower detection module. In a specific embodiment, the lower detecting piece 410 is fixed on the telescopic pressing member 200 near the lower end surface, and the lower detecting piece is mounted on the outer housing of the circular wire saw cutting unit 11 to facilitate the matching between the two.
In the embodiment shown in fig. 1 and 2, the upper pressing mechanism 10 further includes a pressing head 500, the pressing head 500 is disposed at an end of the telescopic section of the telescopic pressing member 200, and the pressing head 500 can be driven by the telescopic pressing member 200 to abut against the side wall of the silicon crystal ingot to be pressed. The pressing head 500 is used for abutting and contacting with the side wall of the silicon crystal bar stock, and the pressing effect is better. Meanwhile, the specific material of the pressing head 500 is selected to prevent the pressing head 500 from being damaged when the silicon crystal bar stock is pressed tightly. In a preferred embodiment, the telescopic compressing member 200 further includes a protecting cover 600, and the protecting cover 600 is sleeved on the telescopic section to achieve the waterproof and dustproof effects.
In a specific embodiment, the telescopic pressing member 200 is one of an electric cylinder, an air cylinder, a hydraulic cylinder or an electric push rod, the linear reciprocating device can realize the top tightening of the upper end of the silicon crystal bar, and a user can select the device according to needs. Preferably, the telescopic pressing member 200 is an electric cylinder, the electric cylinder is a modular product in which a servo motor and a lead screw are integrally designed, the rotary motion of the servo motor is converted into linear motion, and the control process is simple and the result is accurate.
In the preferred embodiment shown in fig. 5, the invention further provides a cutting mechanism for a silicon crystal bar cutting device, the cutting mechanism 1 includes a circular wire saw cutting unit 11 and an upper pressing mechanism 10, the upper pressing mechanism is the upper pressing mechanism 10, the upper pressing mechanism 10 is fixed on an outer shell of the circular wire saw cutting unit 11, and the upper pressing mechanism 10 is located at a middle position. Cutting mechanism 1 have silicon crystal bar cutting and top tight function concurrently, can effectively guarantee the cutting accuracy of silicon crystal bar, the product quality of processing is high. When annular scroll saw cutting unit 11 contacts with silicon crystal bar, the cutting of silicon crystal bar is carried out to high-speed diamond cutting line, will go up hold-down mechanism 10 and set up in annular scroll saw cutting unit 11, and it is more simple to set up, and the structure is more reasonable, is convenient for accomplish the counterpoint of hold-down mechanism 10 and silicon crystal bar. Of course, in some other embodiments, the upper pressing mechanism 10 may be disposed on the frame as long as the upper pressing of the silicon ingot is completed.
As shown in fig. 1 and 5, as a preferred embodiment of the present invention, the cutting mechanism 1 further includes a sliding base 12, the sliding base 12 is disposed on an outer housing of the circular wire saw cutting unit 11, and the telescopic pressing member 200 is slidably disposed in the sliding base 12. The slide 12 is arranged to limit the telescopic section of the telescopic pressing member 200, so that the telescopic pressing member 200 is prevented from shaking to affect the clamping of the silicon crystal bar.
In the preferred embodiment shown in fig. 6 to 11, the present invention further provides a silicon ingot cutting device, which includes a liftable roller support frame 2, a floating support mechanism 3, and a cutting mechanism, where the cutting mechanism is the cutting mechanism 1. The silicon crystal bar stock is firstly placed on the roller supporting frame, the silicon crystal bar stock is conveyed to a designated position along the roller supporting piece, then the silicon crystal bar stock is tightly pressed above the silicon crystal bar stock by the upper pressing mechanism 10 in the cutting mechanism 1, then the floating supporting mechanism 3 in the cutting device is upwards ejected, all the floating supporting mechanisms 3 can be set with larger ejection pressure at the moment, so that the reliable contact between the silicon crystal bar stock and the ejection supporting surfaces of the floating supporting mechanisms 3 is ensured, and the silicon crystal bar stock cannot move under the pressing mechanism above the silicon crystal bar stock, so that the reliable clamping and positioning are realized. And the silicon crystal bar stock is limited by the positions of the upper pressing mechanism 10 and the lower floating support mechanism 3, and if the roller support frame needs to move downwards to avoid the position of the cutting line, the silicon crystal bar stock cannot be deflected in the downward moving process, so that the silicon crystal bar stock is effectively clamped. Finally, the upper pressing mechanism 10 in the cutting mechanism 1 is retracted, and the cutting work is performed by the circular wire saw cutting unit 11, so that the processing of the silicon crystal bar stock is completed. In this scheme, go up hold-down mechanism 10's setting and can guarantee that silicon crystal bar centre gripping is reliable and stable when using the ascending support of supporting mechanism 3 that floats, position skew can not appear in silicon crystal bar centre gripping, and cutting accuracy is high, of high quality.
It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present invention.
Claims (10)
1. An upper pressing mechanism for a silicon crystal bar cutting device is characterized by comprising an elastic seat and a telescopic pressing piece;
the elastic seat comprises an upper fixed plate, a lower movable plate, a mandrel and an elastic piece, the upper fixed plate is used for connecting and fixing the elastic seat, the upper fixed plate and the lower movable plate are arranged oppositely, the mandrel is connected with the upper fixed plate and the lower movable plate in a sliding mode, and the elastic piece is sleeved outside the mandrel;
the flexible piece that compresses tightly sets up in the bottom of lower movable plate, and the tip of the flexible section of flexible piece that compresses tightly can support with the lateral wall of silicon crystal bar and lean on to compress tightly.
2. The upper pressing mechanism for silicon crystal bar cutting device according to claim 1, wherein said elastic seat further comprises a limiting sliding assembly, said limiting sliding assembly comprises a sliding shaft and a sliding sleeve, one end of said sliding shaft is fixed to said lower movable plate, the other end of said sliding shaft is slidably connected to said upper fixed plate, and said sliding sleeve is disposed between said upper fixed plate and said sliding shaft.
3. The upper pressing mechanism for silicon crystal bar cutting device according to claim 2, wherein said four sets of position-limiting sliding assemblies are evenly distributed around the periphery of the mandrel.
4. The upper pressing mechanism for silicon crystal ingot cutting apparatus as set forth in claim 1, further comprising an upper detecting unit for determining whether the silicon crystal ingot is clamped securely, the upper detecting unit comprising an upper detecting plate and an upper sensor, the upper detecting plate being fixed to the lower movable plate, the upper sensor being fixed to the upper fixed plate.
5. The upper pressing mechanism for the silicon crystal bar cutting device according to claim 1, wherein the upper pressing mechanism further comprises a lower detection assembly, the lower detection assembly is used for judging whether the telescopic pressing member is lifted back to the proper position, the lower detection assembly comprises a lower detection piece and a lower sensor, the lower detection piece is fixed on a telescopic section of the telescopic pressing member, and the lower sensor is used for being matched with the lower detection piece to detect.
6. The upper pressing mechanism for the silicon crystal ingot cutting device according to claim 1, further comprising a pressing head provided at an end of the telescopic section of the telescopic pressing member, wherein the pressing head is pressed against the side wall of the silicon crystal ingot by the driving of the telescopic pressing member.
7. The upper pressing mechanism for silicon crystal ingot cutting device according to claim 1, wherein the telescopic pressing member is one of an electric cylinder, an air cylinder, a hydraulic cylinder, or an electric push rod.
8. A cutting mechanism for a silicon crystal bar cutting device, the cutting mechanism comprises a circular wire saw cutting unit and an upper pressing mechanism, and is characterized in that the upper pressing mechanism is the upper pressing mechanism as claimed in any one of claims 1 to 8, the upper pressing mechanism is fixed on an outer shell of the circular wire saw cutting unit, and the upper pressing mechanism is located at a middle position.
9. The cutting mechanism for silicon crystal ingot cutting device according to claim 8, further comprising a slide base provided on an outer housing of the ring wire saw cutting unit, wherein the telescopic pressing member is slidably disposed in the slide base.
10. A silicon crystal bar cutting device, comprising a lifting roller support frame, a floating support mechanism and a cutting mechanism, wherein the cutting mechanism is the cutting mechanism of claim 8 or 9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011625085.4A CN112829093A (en) | 2020-12-31 | 2020-12-31 | Upper pressing mechanism, cutting mechanism and cutting device for silicon crystal bar cutting device |
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| CN202011625085.4A CN112829093A (en) | 2020-12-31 | 2020-12-31 | Upper pressing mechanism, cutting mechanism and cutting device for silicon crystal bar cutting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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