CN112827943A - Laser cleaning method, system, equipment and storage medium - Google Patents
Laser cleaning method, system, equipment and storage medium Download PDFInfo
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- CN112827943A CN112827943A CN202011431576.5A CN202011431576A CN112827943A CN 112827943 A CN112827943 A CN 112827943A CN 202011431576 A CN202011431576 A CN 202011431576A CN 112827943 A CN112827943 A CN 112827943A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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Abstract
The invention discloses a laser cleaning method, a laser cleaning system, laser cleaning equipment and a storage medium, wherein the method comprises the following steps: dividing the surface of a cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N; matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies; generating a cleaning path and a cleaning parameter of each corresponding cleaning area according to each cleaning area; and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas. The invention solves the problem that the cleaning efficiency of the existing cleaning equipment with a single laser generator to a large area is low.
Description
Technical Field
The invention relates to the field of intelligent laser cleaning equipment, in particular to a laser cleaning method, a laser cleaning system, laser cleaning equipment and a computer readable storage medium.
Background
The laser cleaning is a novel cleaning technology which is rapidly developed in recent years, has the characteristics of no pollution, no contact, easy control and low heat effect, and can be suitable for various materials. The current cleaning control system is mainly a single-machine control system and is used for controlling a single laser single vibrating mirror, the requirement of large-breadth cleaning can be met by adopting a workbench or a manipulator for assistance, and the overall efficiency of the mode is lower than normal.
Disclosure of Invention
The invention mainly aims to provide a laser cleaning method, a laser cleaning system, laser cleaning equipment and a computer readable storage medium, and aims to solve the problem that the cleaning efficiency of the existing cleaning equipment with a single laser generator on a large area is low.
In order to achieve the above object, the present invention provides a laser cleaning method applied to a laser cleaning device, where the laser cleaning device includes N cleaning assemblies, N is greater than or equal to 2, the cleaning assemblies include a laser generator and a galvanometer adapted to the laser generator, and the laser cleaning method includes the steps of:
dividing the surface of a cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N;
matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies;
generating a cleaning path and a cleaning parameter of each corresponding cleaning area according to each cleaning area;
and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas.
Optionally, the step of dividing the surface of the cleaning workpiece into K cleaning regions, where K is greater than or equal to 2 and less than or equal to N includes:
dividing the cleaning surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N, and any two adjacent cleaning areas in the K cleaning areas are partially overlapped.
Optionally, the cleaning parameters include cleaning power, scanning line width, and scanning advance speed, and the step of generating the corresponding cleaning parameters of each cleaning region according to each cleaning region includes:
generating the average cleaning power, the scanning line width and the scanning advancing speed of each cleaning area according to each cleaning area;
taking the average cleaning power of each cleaning area as the cleaning power of the non-overlapped part in each cleaning area;
acquiring a boundary line between an overlapped part and a non-overlapped part in each cleaning area and the shortest distance between positions in the overlapped part;
obtaining the cleaning power of each position in the overlapped part in the cleaning area according to the shortest distance between the boundary line between the overlapped part and the non-overlapped part in each cleaning area and each position in the overlapped part, a preset cleaning power calculation formula and the average cleaning power of the cleaning area, wherein the preset cleaning power calculation formula is as follows: p ═ PFlat plate-kd, wherein PFlat plateThe average cleaning power of the cleaning area is P, the cleaning power of any position in the overlapping part of the cleaning area is P, d is the shortest distance between any position in the overlapping part and the boundary line between the overlapping part and the non-overlapping part, k is a preset slope, and k is more than 0;
the step of controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the cleaning path and the cleaning parameter of each cleaning area comprises the following steps:
and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths, the scanning advancing speed, the scanning line width, the cleaning power of the non-overlapped parts and the cleaning power of the overlapped parts of the cleaning areas.
Optionally, the step of generating an average cleaning power of each cleaning area according to each cleaning area includes:
carrying out surface scanning analysis on each cleaning area to obtain the average thickness of the cleaning layer of each cleaning area;
and generating the average cleaning power of each cleaning area according to the average thickness and material of the cleaning layer of each cleaning area and the mapping relation between the preset thickness and material of the cleaning layer and the cleaning power.
Optionally, the step of dividing the surface of the cleaning workpiece into K cleaning regions further includes, before the step of:
controlling the cleaning assembly to clean according to at least one preset standard cleaning path to form an actual cleaning path;
acquiring an actual cleaning path by adopting a visual camera;
and correcting the galvanometer in the cleaning assembly according to the actual cleaning path and the preset standard cleaning path.
Optionally, before the step of controlling the cleaning assembly corresponding to each cleaning region to perform laser cleaning on the cleaning region according to the cleaning path and the cleaning parameter of each cleaning region, the method further includes:
acquiring the actual position of a cleaning workpiece by adopting a vision camera;
correcting the cleaning path of each cleaning area according to the preset position and the actual position of the cleaning workpiece to obtain the corrected cleaning path of each cleaning area;
the step of controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the cleaning path and the cleaning parameter of each cleaning area comprises the following steps:
and controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the corrected cleaning path and cleaning parameter of each cleaning area.
Optionally, after the step of controlling the cleaning assembly corresponding to each cleaning region to perform laser cleaning on the cleaning region according to the cleaning path and the cleaning parameter of each cleaning region, the method further includes:
acquiring a surface image of a cleaned workpiece by using a vision camera;
and determining a cleaning result according to the cleaned surface image.
To achieve the above object, the present invention also provides a laser cleaning system, comprising:
the dividing module is used for dividing the surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N;
the matching module is used for matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies;
the generating module is used for generating corresponding cleaning paths and cleaning parameters of the cleaning areas according to the cleaning areas;
and the cleaning module is used for controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the cleaning path and the cleaning parameter of each cleaning area.
To achieve the above object, the present invention further provides a laser cleaning device, which includes at least two cleaning assemblies, a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the cleaning assemblies include a laser generator and a galvanometer adapted to the laser generator, and the computer program, when executed by the processor, implements the steps of the laser cleaning method as described above.
To achieve the above object, the present invention further provides a computer-readable storage medium having a computer program stored thereon, which, when being executed by a processor, implements the steps of the laser cleaning method as described above.
According to the laser cleaning method, the laser cleaning system, the laser cleaning equipment and the computer readable storage medium, the surface of a cleaning workpiece is divided into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N; matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies; generating a cleaning path and a cleaning parameter of each corresponding cleaning area according to each cleaning area; and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas. Because the laser cleaning equipment is provided with at least two cleaning assemblies, the surface of the workpiece to be cleaned is divided into a plurality of cleaning areas, and each cleaning area is independently distributed with one corresponding cleaning assembly, the cleaning assemblies corresponding to each cleaning area are simultaneously controlled to clean the corresponding cleaning areas in the cleaning process, and the surface cleaning speed of the whole workpiece to be cleaned is improved.
Drawings
FIG. 1 is a schematic diagram of a hardware operating environment according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a first embodiment of a laser cleaning method according to the present invention;
FIG. 3 is a schematic flow chart of a laser cleaning method according to a second embodiment of the present invention;
FIG. 4 is a schematic flow chart of a laser cleaning method according to a third embodiment of the present invention;
FIG. 5 is a schematic flow chart of a laser cleaning method according to a fourth embodiment of the present invention;
FIG. 6 is a schematic flow chart of a fifth embodiment of the laser cleaning method of the present invention;
FIG. 7 is a functional block diagram of the laser cleaning system of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1, fig. 1 is a schematic diagram of a hardware structure of a laser cleaning apparatus provided in various embodiments of the present invention. The laser cleaning equipment comprises a communication module 01, a memory 02, a processor 03, at least two cleaning assemblies 04, a vision camera 05 and the like. Those skilled in the art will appreciate that the laser cleaning apparatus shown in fig. 1 may also include more or fewer components than shown, or combine certain components, or a different arrangement of components. The processor 03 is connected to the memory 02 and the communication module 01, respectively, and the memory 02 stores a computer program, which is executed by the processor 03 at the same time.
The communication module 01 may be connected to an external device through a network. The communication module 01 may receive data sent by an external device, and may also send data, instructions, and information to the external device, where the external device may be an electronic device such as a mobile phone, a tablet computer, a notebook computer, and a desktop computer.
The memory 02 may be used to store software programs and various data. The memory 02 may mainly include a program storage area and a data storage area, where the program storage area may store an operating system, an application program required by at least one function (a cleaning path and a cleaning parameter of each cleaning area are generated according to each cleaning area), and the like; the storage data area may store data or information created according to the use of the laser cleaning apparatus, or the like. Further, the memory 02 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The processor 03, which is a control center of the laser cleaning apparatus, connects various parts of the entire laser cleaning apparatus by using various interfaces and lines, and executes various functions and processing data of the laser cleaning apparatus by running or executing software programs and/or modules stored in the memory 02 and calling data stored in the memory 02, thereby performing overall monitoring of the laser cleaning apparatus. Processor 03 may include one or more processing units; preferably, the processor 03 may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 03.
And the cleaning assembly 04 comprises a laser generator and a vibrating mirror matched with the laser generator. The laser generator emits laser light when turned on, and can be classified into CO according to the material of the laser generator 412Laser generator, semiconductor laser generator, YAG laser generator and fiber laser generator. The laser may be classified into an ultraviolet laser, a green laser, an infrared laser, etc. according to visibility of the laser. The galvanometer consists of an X-Y optical scanning head, an electronic driving amplifier and optical reflecting mirrors, and can drive the optical reflecting mirrors to respectively rotate along X, Y axes according to control signals so as to control the deflection of laser beams in an X-Y plane.
Optionally, the laser cleaning apparatus may further include an operation table for placing and cleaning the workpiece, and the material for placing and cleaning the workpiece may be metal, such as iron, copper, silver, etc., or non-metal, such as wood, paper, leather, plastic, etc.; an input unit such as a keyboard, a mouse, an output unit such as a display screen, etc. Wherein, the user inputs the control instruction through the input unit, for example, before the laser cleaning, the user needs to set the parameters of the image number, the output power, the scanning speed, etc. of the target graph, and the parameters are input through the input unit by the user. In addition, the user can check the cleaning progress and the cleaning result in real time through the output unit.
Although not shown in fig. 1, the laser cleaning apparatus may further include a circuit control module, where the circuit control module is used for being connected to a mains supply to implement power control and ensure normal operation of other components.
Those skilled in the art will appreciate that the laser cleaning apparatus configuration shown in fig. 1 is not intended to be limiting and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
Various embodiments of the method of the present invention are presented in terms of the above-described hardware architecture.
Referring to fig. 2, in a first embodiment of the laser cleaning method of the present invention, a laser cleaning apparatus includes N cleaning assemblies, N is greater than or equal to 2, the cleaning assemblies include a laser generator and a galvanometer adapted to the laser generator, and the laser cleaning method includes the steps of:
step S10, dividing the surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N;
step S20, matching K cleaning areas with K cleaning assemblies one by one according to the working areas of the cleaning assemblies;
in this scheme, laser cleaning equipment includes that N washs the subassembly, and wherein N is greater than or equal to 2, and every washs the subassembly and all includes a laser generator and with the mirror that shakes of this laser generator adaptation. The cleaning method comprises the steps of placing a cleaning workpiece at a preset position of an operation table, dividing the surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N, the K value depends on the area size and the dimension of the surface of the cleaning workpiece, the number of the divided areas is more if the area is larger, the number of the divided areas can be less if the area is smaller, but the surface of the cleaning workpiece is divided into N cleaning areas at most, and the cleaning area is divided into 2 cleaning areas at least.
After the K cleaning areas are divided, the K cleaning areas are matched with the K cleaning assemblies in the laser cleaning equipment one by one according to the respective working areas of all the cleaning assemblies in the laser cleaning equipment, so that each cleaning area corresponds to one unique cleaning assembly, and each cleaning assembly also corresponds to one unique cleaning area. One preferred way of matching is to determine within which cleaning assembly working range each cleaning zone is, and assign the cleaning zone to the cleaning assembly. For example, there are 5 cleaning regions, the total number of the laser cleaning apparatus is 6 cleaning assemblies, 5 cleaning assemblies are selected from the 6 cleaning assemblies, and then the 5 cleaning regions and the 5 cleaning assemblies form a one-to-one correspondence relationship.
Step S30, generating a cleaning path and a cleaning parameter of each corresponding cleaning area according to each cleaning area;
the laser cleaning equipment can generate a cleaning path and cleaning parameters corresponding to each cleaning area according to the cleaning area, the cleaning path can be from left to right or from right to left, and can also be from top to bottom or from bottom to top, so that line-by-line cleaning or line-by-line cleaning is realized, and each position in the cleaning area can be cleaned.
The process of generating the cleaning path and the cleaning parameters can be independently completed by the laser cleaning equipment or other independent computers, and then the cleaning control data is transmitted to the laser cleaning equipment through the communication interface.
And step S40, controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas.
After the laser cleaning equipment acquires the cleaning path and the cleaning parameters of each cleaning area, respectively controlling the vibration mirrors in the cleaning assembly corresponding to each cleaning area to deflect along the cleaning path and controlling the on/off of the laser generator, the energy of the laser emitted by the laser generator and the deflection speed of the vibration mirrors according to the cleaning parameters so as to enable the laser transmitter to emit the laser with high speed and stay for a certain position, and the like, thereby realizing cleaning. Specifically, the cleaning path is a laser beam scanning track, when a laser beam is incident on a reflecting mirror in the galvanometer, a controller is required to control the reflecting angle of the reflecting mirror, and the two reflecting mirrors can respectively scan along an X, Y axis, so that the deflection of the laser beam is achieved, and a laser focusing point with certain power density moves on the cleaning material according to the required requirement. That is, each location in the cleaning area needs to be scanned and a determination made from the binary data as to whether each image point needs cleaning, thereby leaving a permanent mark on the material surface.
The surface of a cleaning workpiece is divided into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N; matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies; generating a cleaning path and a cleaning parameter of each corresponding cleaning area according to each cleaning area; and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas. Because the laser cleaning equipment is provided with at least two cleaning assemblies, the surface of the workpiece to be cleaned is divided into a plurality of cleaning areas, and each cleaning area is independently distributed with one corresponding cleaning assembly, the cleaning assemblies corresponding to each cleaning area are simultaneously controlled to clean the corresponding cleaning areas in the cleaning process, and the surface cleaning speed of the whole workpiece to be cleaned is improved.
Further, referring to fig. 3, fig. 3 is a diagram illustrating a second embodiment of the laser cleaning method according to the first embodiment of the laser cleaning method, in which step S10 includes:
and step S11, dividing the cleaning surface on the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N, and any two adjacent cleaning areas in the K cleaning areas are partially overlapped.
In this embodiment, the surface of the workpiece to be cleaned is divided into K cleaning regions, where K is greater than or equal to 2 and less than or equal to N, but there is no boundary between any two adjacent cleaning regions in the K cleaning regions, but there is a partial overlap between two adjacent cleaning regions, and the area size and shape of the overlap portion may be determined according to preset parameters, or the area and shape of the overlap portion may be manually adjusted by a user. The overlapped part belongs to the two cleaning areas, so that the overlapped part can be cleaned by the cleaning components corresponding to the two cleaning areas.
According to the embodiment, the adjacent cleaning areas divided on the surface of the workpiece to be cleaned are partially overlapped, so that the display degree of the cleaning splicing seams formed after the cleaning of the cleaning areas on the surface of the workpiece is finished is reduced.
Further, referring to fig. 4, fig. 4 is a diagram illustrating a third embodiment of the laser cleaning method according to the first and second embodiments of the laser cleaning method of the present application, in which the cleaning parameters include cleaning power, scanning line width and scanning forward speed, and step S30 includes:
step S31, according to each cleaning area, generating average cleaning power, scanning line width and scanning advancing speed of each cleaning area;
in this embodiment, the cleaning parameters of the laser cleaning device include cleaning power, scanning line width, and scanning advance speed. The laser cleaning equipment can generate the average cleaning power, the scanning line width and the scanning advancing speed of each cleaning area according to the information of the surface appearance, the position, the size, the area and the like of each cleaning area.
Specifically, the step of generating the average cleaning power of each cleaning region according to each cleaning region includes:
step S311, performing surface scanning analysis on each cleaning area to obtain the average thickness of the cleaning layer of each cleaning area;
step S312, generating an average cleaning power of each cleaning region according to the average thickness and material of the cleaning layer of each cleaning region and a mapping relationship between the preset thickness and material of the cleaning layer and the cleaning power.
A user constructs a mapping relation among different cleaning materials, the thickness of the cleaning layer and the average power of laser cleaning in advance through a large amount of experimental data and experience, and stores the mapping relation in the laser cleaning equipment in advance. Before cleaning, the laser cleaning equipment utilizes the three-dimensional scanning component to carry out scanning analysis on the surface of the cleaning workpiece, so that the three-dimensional surface appearance information of the cleaning workpiece can be obtained, and the average thickness of the cleaning layer in each cleaning area can be obtained by analyzing and calculating the three-dimensional surface appearance information. And then according to the average thickness of the cleaning layer of each cleaning area and the material of the cleaning layer to be cleaned on the surface of the cleaning workpiece, inquiring and obtaining the average cleaning power corresponding to each cleaning area from the pre-stored mapping relation among the thickness of the cleaning layer, the material and the cleaning power.
Step S32, taking the average cleaning power of each cleaning area as the cleaning power of the non-overlapped part in each cleaning area;
step S33, obtaining the boundary line between the overlapped part and the non-overlapped part in each cleaning area and the shortest distance between each position in the overlapped part;
step S34, obtaining the cleaning power of each position in the overlapped portion in the cleaning region according to the shortest distance between the boundary line between the overlapped portion and the non-overlapped portion in each cleaning region and each position in the overlapped portion, a preset cleaning power calculation formula and the average cleaning power of the cleaning region, wherein the preset cleaning power calculation formula is: p ═ PFlat plate-kd, wherein PFlat plateThe average cleaning power of the cleaning area is P, the cleaning power of any position in the overlapping part of the cleaning area is P, d is the shortest distance between any position in the overlapping part and the boundary line between the overlapping part and the non-overlapping part, k is a preset slope, and k is more than 0;
in the cleaning areas, an overlapped part and a non-overlapped part exist, the overlapped part belongs to two cleaning areas, so that the overlapped part can be cleaned by the cleaning components corresponding to the two cleaning areas, and the non-overlapped part can be cleaned by only one cleaning component. After obtaining the average cleaning power corresponding to each cleaning region, the laser device will use the average cleaning power of the cleaning region as the cleaning power of each position in the non-overlapping part of the cleaning region. The overlapped part can be cleaned by two cleaning components, each position in the overlapped part belongs to two cleaning areas, corresponds to two cleaning components, and needs to be respectively provided with two cleaning componentsThe cleaning power of each cleaning assembly at the position is gradually reduced in the overlapped part in each cleaning area in a direction away from the boundary line between the overlapped part and the non-overlapped part in order to prevent the over-cleaning, for example two adjacent cleaning zones a and B, the overlapping part is c, the non-overlapping part of the cleaning zone a is a, the non-overlapping part of the cleaning zone B is B, the cleaning power in part a is the average power of the cleaning zone a, the cleaning power in part B is the average power of the cleaning zone B, in the overlapping part c, the power variation trend of the cleaning assembly corresponding to the cleaning area A at each position of the overlapping part B is gradually reduced along the direction far away from the intersection line of a and c, and the power variation trend of the cleaning assembly corresponding to the cleaning area B at each position of the overlapping part is gradually reduced along the direction far away from the intersection line of B and c. Specifically, the laser cleaning equipment acquires the shortest distance from each position in the overlapped part to the boundary line between the overlapped part and the non-overlapped part in the cleaning area; then, the shortest distance between each position in the overlapped part and the boundary line of the overlapped part and the non-overlapped part and the average cleaning power of the cleaning area are substituted into a preset cleaning power calculation formula PFlat plate-kd, calculating the cleaning power at each position in the overlap in the cleaning area, P in a formula for calculating the preset cleaning powerFlat plateThe average cleaning power of the cleaning area is set, P is the cleaning power of any position in the overlapping part of the cleaning area, d is the shortest distance between any position in the overlapping part and the boundary line between the overlapping part and the non-overlapping part, k is a preset slope, k is greater than 0, the value of k is preset by a user, the value of k is too large, the cleaning power calculated at a certain position is possibly less than 0, in this case, the cleaning power at the position is directly set to be 0, and in order to prevent the situation, the value range of k is generally set to be that k is less than or equal to PFlat plate/dmax，dmaxThe maximum value of the shortest distances from the boundary line between the overlapping portion and the non-overlapping portion at all positions in the overlapping portion is preferably k ═ PFlat plate/dmax. For example two adjacent cleaning zones a and B, the overlapping part being c, the non-overlapping part of the cleaning zone a being a, the non-overlapping part of the cleaning zone B being B, the cleaning power in part a being the average work of the cleaning zone aRate PFlat plateThe cleaning power of the part B is the average power P of the cleaning area BFlat plateAt a certain position O in the overlap portion c, the distance d from the boundary line between a and c1The distance between the b and c boundary is d2The cleaning power of the cleaning assembly corresponding to the cleaning area A at the position O is PFlat plate-kd1The cleaning power of the cleaning assembly corresponding to the cleaning area B at the position O is PFlat plate-kd2。
Step S40 includes:
and step S41, controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths, the scanning advancing speed, the scanning line width, the cleaning power of the non-overlapped parts and the cleaning power of the overlapped parts of the cleaning areas.
The laser cleaning equipment can respectively control the deflection and deflection speed of the galvanometer in the cleaning assembly corresponding to each cleaning area along the cleaning path according to the cleaning path, the scanning advancing speed, the scanning line width, the cleaning power of the non-overlapping part and the cleaning power of the overlapping part of each cleaning area, and control the energy of the corresponding laser emitted by the laser generator according to the cleaning power of the non-overlapping part and the cleaning power of the overlapping part, so that each cleaning area is cleaned.
In the embodiment, the cleaning power in the overlapped part of two adjacent cleaning areas is gradually reduced along the direction away from the boundary of the non-overlapped area, so that the overlapped part is prevented from being over-cleaned, and the damage to the base material for cleaning the workpiece is reduced.
Further, referring to fig. 5, fig. 5 is a diagram illustrating a fourth embodiment of the laser cleaning method according to the foregoing embodiment of the laser cleaning method of the present application, in which the laser cleaning apparatus further includes a vision camera, and step S10 is preceded by:
step S12, controlling the cleaning component to clean according to at least one preset standard cleaning path to form an actual cleaning path;
step S13, acquiring an actual cleaning path by using a visual camera;
and step S14, correcting the galvanometer in the cleaning assembly according to the actual cleaning path and the preset standard cleaning path.
Due to the fact that the environment temperature and humidity are interfered, a motor loses steps and the like, the vibrating mirror can deviate after being used for a certain time, and therefore the accuracy of a vibrating mirror control light path in the machining process is reduced.
In this embodiment, the laser cleaning apparatus further includes a vision camera. The laser cleaning equipment integrates the coordinate system of the vision camera, the coordinate system of the galvanometer and the coordinate system of the operating platform into a common coordinate system, and a mapping relation between the coordinate system of the vision camera and the common coordinate system, a mapping relation between the coordinate system of the galvanometer and the common coordinate system and a mapping relation between the coordinate system of the operating platform and the common coordinate system are established. The method comprises the steps of setting at least one preset standard cleaning path for each cleaning assembly, controlling the cleaning assemblies to clean according to the preset standard cleaning paths before cleaning to generate actual cleaning paths, measuring the actual cleaning paths by using a vision camera, comparing the actual cleaning paths with the preset standard cleaning paths, calculating deviation amount if deviation exists, and correcting a galvanometer in the cleaning assemblies according to the deviation amount.
This embodiment is through rectifying the galvanometer that washs the subassembly before wasing to improve the accuracy of wasing the route, improve the cleaning performance.
Further, referring to fig. 6, fig. 6 is a fifth embodiment of the laser cleaning method according to the foregoing embodiment of the laser cleaning method, in which step S40 is preceded by:
step S50, acquiring the actual position of the cleaning workpiece by using a vision camera;
step S60, correcting the cleaning path of each cleaning area according to the preset position and the actual position of the cleaning workpiece to obtain the corrected cleaning path of each cleaning area;
step S40 includes:
and step S42, controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the corrected cleaning paths and the cleaning parameters of the cleaning areas.
In this embodiment, after the cleaning workpiece is placed at the preset position of the operation table, since the placing is performed manually, a deviation may exist between the actual position of the workpiece and the preset position, for example, the workpiece is deflected by a certain angle. Before cleaning, the actual position of the cleaning workpiece is acquired by a vision camera, the actual position of the cleaning workpiece is compared with a preset position of the cleaning workpiece, if deviation exists, deviation amount is calculated, the generated cleaning path of the cleaning area is corrected according to the deviation amount, and the corrected cleaning path of each cleaning area is obtained. And then, according to the corrected cleaning path and the cleaning parameters of each cleaning area, controlling the cleaning assembly corresponding to each cleaning area to clean the cleaning area.
This embodiment can be through acquireing the actual locating position of wasing the work piece with the vision camera and the locating position who sets up in advance carries out the comparison before wasing, comes to rectify the washing route to eliminate artifical the putting and lead to the locating position deviation to appear, improve the accuracy of wasing the route, and then improve the cleaning performance.
Further, a sixth embodiment of the laser cleaning method according to the present application is provided according to the foregoing embodiment of the laser cleaning method, and in this embodiment, after step S40, the method further includes:
step S70, acquiring a surface image of the cleaned workpiece by using a vision camera;
in step S71, a cleaning result is determined from the cleaned surface image.
In this embodiment, a laser cleaning device is used to acquire a surface image of a cleaned workpiece by using a vision camera, and then the surface image is subjected to gray processing to obtain a gray value image. Then comparing the gray value image with the gray value image of the image when the surface of the workpiece is cleaned, and judging whether the conformity of the gray value image and the gray value image reaches a set value; if the set value is reached, the cleaning result is judged to be qualified, and if the set value is not reached, the cleaning result is judged to be unqualified, wherein the set value can be any one of 90-100%, and is preferably 95%.
When the cleaning result is qualified, an alarm in the laser cleaning equipment emits green light, and the cleaning of the workpiece is finished and is transmitted to the next procedure; and when the cleaning result is determined to be unqualified, the alarm emits red light, the conveyor belt is reversely rotated for a certain distance, the cleaning workpiece is cleaned again, and the laser cleaning parameters are adjusted to ensure the qualified rate of cleaning.
According to the embodiment, the surface of the cleaned workpiece is collected by the vision camera, and the cleaning result is automatically analyzed and judged by the computer, so that the labor cost consumed by manual judgment is reduced, and the judgment accuracy is improved.
Referring to fig. 7, the present invention also provides a laser cleaning system, comprising:
the dividing module 10 is used for dividing the surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and is less than or equal to N;
the matching module 20 is used for matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies;
a generating module 30, configured to generate a cleaning path and a cleaning parameter of each corresponding cleaning region according to each cleaning region;
and the cleaning module 40 is used for controlling the cleaning components corresponding to the cleaning areas to perform laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas.
Further, the dividing module 10 includes:
the dividing unit 11 is used for dividing the cleaning surface on the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N, and any two adjacent cleaning areas in the K cleaning areas are partially overlapped;
further, the cleaning surface on the cleaning workpiece is divided into K cleaning regions, where K is not less than 2 and not more than N, and any two adjacent cleaning regions in the K cleaning regions are partially overlapped, and the generating module 30 includes:
a generating unit 31 for generating an average cleaning power, a scanning line width, and a scanning forward speed of each cleaning region according to each cleaning region;
a unit 32 for setting the average cleaning power of each cleaning region as the cleaning power of the non-overlapping portion in each cleaning region;
an acquisition unit 33 for acquiring a boundary line between the overlapping portion and the non-overlapping portion in each cleaning region and a shortest distance between each position in the overlapping portion;
an obtaining unit, configured to obtain cleaning power at each position in the overlapping portion in each cleaning region according to a shortest distance between a boundary line between the overlapping portion and the non-overlapping portion in each cleaning region and each position in the overlapping portion, a preset cleaning power calculation formula, and an average cleaning power of the cleaning region, where the preset cleaning power calculation formula is: p ═ PFlat plate-kd, where P is the cleaning power at any one of the overlapping parts of the cleaning zone, d is the shortest distance between any one of the overlapping parts and the boundary line between the overlapping part and the non-overlapping part, k is a predetermined slope, k > 0;
the cleaning module 40 includes:
and the cleaning unit 41 is configured to control the cleaning assemblies corresponding to the cleaning areas to perform laser cleaning on the cleaning areas according to the cleaning paths, the scanning forward speed, the scanning line width, the cleaning power of the non-overlapping portions, and the cleaning power of the overlapping portions of the cleaning areas.
Further, the generating unit 31 includes:
an analysis subunit 311, configured to perform surface scanning analysis on each cleaning region to obtain an average thickness of the cleaning layer in each cleaning region;
the generating subunit 312 is configured to generate an average cleaning power of each cleaning region according to the average cleaning layer thickness and material of each cleaning region and a mapping relationship between the preset cleaning layer thickness and material and the cleaning power.
Further, the laser cleaning system further comprises:
the forming module 11 is used for controlling the cleaning assembly to clean according to at least one preset standard cleaning path to form an actual cleaning path;
a first obtaining module 12, configured to obtain an actual cleaning path by using a visual camera;
and the correcting module 13 is used for correcting the galvanometer in the cleaning assembly according to the actual cleaning path and the preset standard cleaning path.
Further, the laser cleaning system further comprises:
a second acquiring module 50 for acquiring an actual position of the cleaning workpiece using the vision camera;
an obtaining module 60, configured to correct the cleaning path of each cleaning region according to the preset position and the actual position of the cleaning workpiece, and obtain a corrected cleaning path of each cleaning region;
and the cleaning module 40 is further configured to control the cleaning assembly corresponding to each cleaning region to perform laser cleaning on the cleaning region according to the corrected cleaning path and cleaning parameter of each cleaning region.
Further, the laser cleaning system further comprises:
a third acquiring module 70, configured to acquire a surface image of the cleaned workpiece by using a vision camera;
a determining module 71, configured to determine a cleaning result according to the cleaned surface image.
The invention also proposes a computer-readable storage medium on which a computer program is stored. The computer-readable storage medium may be the Memory 02 of the laser cleaning device in fig. 1, and may also be at least one of a ROM (Read-Only Memory)/RAM (Random Access Memory), a magnetic disk, and an optical disk, and the computer-readable storage medium includes several pieces of information for enabling the laser cleaning device to perform the method according to the embodiments of the present invention.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The laser cleaning method is characterized by being applied to laser cleaning equipment, wherein the laser cleaning equipment comprises N cleaning components, N is more than or equal to 2, each cleaning component comprises a laser generator and a vibrating mirror matched with the laser generator, and the laser cleaning method comprises the following steps:
dividing the surface of a cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N;
matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies;
generating a cleaning path and a cleaning parameter of each corresponding cleaning area according to each cleaning area;
and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths and the cleaning parameters of the cleaning areas.
2. The laser cleaning method according to claim 1, wherein the step of dividing the surface of the workpiece to be cleaned into K cleaning regions, wherein K is greater than or equal to 2 and less than or equal to N comprises:
dividing the cleaning surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N, and any two adjacent cleaning areas in the K cleaning areas are partially overlapped.
3. The laser cleaning method according to claim 2, wherein the cleaning parameters include cleaning power, scanning line width, and scanning advance speed, and the step of generating the cleaning parameters of the respective cleaning regions according to the respective cleaning regions includes:
generating the average cleaning power, the scanning line width and the scanning advancing speed of each cleaning area according to each cleaning area;
taking the average cleaning power of each cleaning area as the cleaning power of the non-overlapped part in each cleaning area;
acquiring a boundary line between an overlapped part and a non-overlapped part in each cleaning area and the shortest distance between positions in the overlapped part;
obtaining the cleaning power of each position in the overlapped part in the cleaning area according to the shortest distance between the boundary line between the overlapped part and the non-overlapped part in each cleaning area and each position in the overlapped part, a preset cleaning power calculation formula and the average cleaning power of the cleaning area, wherein the preset cleaning power calculation formula is as follows: p ═ PFlat plate-kd, wherein PFlat plateThe average cleaning power of the cleaning area is P, the cleaning power of any position in the overlapping part of the cleaning area is P, d is the shortest distance between any position in the overlapping part and the boundary line between the overlapping part and the non-overlapping part, k is a preset slope, and k is more than 0;
the step of controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the cleaning path and the cleaning parameter of each cleaning area comprises the following steps:
and controlling the cleaning components corresponding to the cleaning areas to carry out laser cleaning on the cleaning areas according to the cleaning paths, the scanning advancing speed, the scanning line width, the cleaning power of the non-overlapped parts and the cleaning power of the overlapped parts of the cleaning areas.
4. The laser cleaning method according to claim 3, wherein the step of generating an average cleaning power for each cleaning region from each cleaning region comprises:
carrying out surface scanning analysis on each cleaning area to obtain the average thickness of the cleaning layer of each cleaning area;
and generating the average cleaning power of each cleaning area according to the average thickness and material of the cleaning layer of each cleaning area and the mapping relation between the preset thickness and material of the cleaning layer and the cleaning power.
5. The laser cleaning method according to any one of claims 1 to 4, wherein the step of dividing the cleaning workpiece surface into K cleaning zones further comprises, before the step of:
controlling the cleaning assembly to clean according to at least one preset standard cleaning path to form an actual cleaning path;
acquiring an actual cleaning path by adopting a visual camera;
and correcting the galvanometer in the cleaning assembly according to the actual cleaning path and the preset standard cleaning path.
6. The laser cleaning method according to claim 5, wherein the step of controlling the cleaning assembly corresponding to each cleaning region to perform laser cleaning on the cleaning region according to the cleaning path and the cleaning parameter of each cleaning region further comprises:
acquiring the actual position of a cleaning workpiece by adopting a vision camera;
correcting the cleaning path of each cleaning area according to the preset position and the actual position of the cleaning workpiece to obtain the corrected cleaning path of each cleaning area;
the step of controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the cleaning path and the cleaning parameter of each cleaning area comprises the following steps:
and controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the corrected cleaning path and cleaning parameter of each cleaning area.
7. The laser cleaning method according to claim 6, wherein the step of controlling the cleaning assembly corresponding to each cleaning region to perform laser cleaning on the cleaning region according to the cleaning path and the cleaning parameter of each cleaning region further comprises:
acquiring a surface image of a cleaned workpiece by using a vision camera;
and determining a cleaning result according to the cleaned surface image.
8. A laser cleaning system, comprising:
the dividing module is used for dividing the surface of the cleaning workpiece into K cleaning areas, wherein K is more than or equal to 2 and less than or equal to N;
the matching module is used for matching the K cleaning areas with the K cleaning assemblies one by one according to the working areas of the cleaning assemblies;
the generating module is used for generating corresponding cleaning paths and cleaning parameters of the cleaning areas according to the cleaning areas;
and the cleaning module is used for controlling the cleaning component corresponding to each cleaning area to carry out laser cleaning on the cleaning area according to the cleaning path and the cleaning parameter of each cleaning area.
9. Laser cleaning device, characterized in that it comprises at least two cleaning components, a memory, a processor and a computer program stored on the memory and executable on the processor, the cleaning components comprising a laser generator and a galvanometer adapted to the laser generator, the computer program when executed by the processor implementing the steps of the laser cleaning method according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that a computer program is stored thereon, which computer program, when being executed by a processor, realizes the steps of the laser cleaning method according to any one of claims 1 to 7.
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