CN112812611B - Preparation method of conductive coating - Google Patents
Preparation method of conductive coating Download PDFInfo
- Publication number
- CN112812611B CN112812611B CN202011642929.6A CN202011642929A CN112812611B CN 112812611 B CN112812611 B CN 112812611B CN 202011642929 A CN202011642929 A CN 202011642929A CN 112812611 B CN112812611 B CN 112812611B
- Authority
- CN
- China
- Prior art keywords
- conductive coating
- coupling agent
- coating
- conductive
- silane coupling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
- B05D3/141—Plasma treatment
- B05D3/142—Pretreatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a preparation method of a conductive coating, and relates to the technical field of conductive materials. The preparation method of the conductive coating comprises the following steps: (1) uniformly mixing nano conductive particles, a dispersing agent, a coupling agent, water, a catalyst and an organic solvent to obtain the conductive coating; (2) and (2) coating the conductive coating prepared in the step (1) on the surface of the substrate subjected to plasma treatment, and drying to obtain the conductive coating. The conductive coating provided by the invention has the advantages of simple components and simple coating preparation process, the adhesion of the obtained conductive coating and the substrate is obviously improved, and the conductivity of the conductive layer is not damaged.
Description
Technical Field
The invention relates to the technical field of conductive materials, in particular to a preparation method of a conductive coating.
Background
Compared with the traditional nano metal conductive ink, the novel carbon-based conductive filler represented by the carbon nano tube and the graphene has similar conductivity, smaller mass, higher mechanical strength and lower cost, so that the novel carbon-based conductive filler has wide application and bright prospect when being used as a conductive coating.
Such conductive coatings are generally composed of carbon-based nano conductive particles, a solvent, a binder resin, a dispersant and other auxiliaries. Among them, the binding resins mainly serve to improve the adhesion of the coating to the surface of the substrate, but their adhesion to the substrate is mainly based on physical effects, and thus the adhesion tends to be poor, especially for substrates with low surface energy.
Disclosure of Invention
Based on the above, the invention aims to overcome the defects of the prior art and provide a preparation method of a conductive coating with simple preparation method and simple formula.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: a preparation method of a conductive coating comprises the following steps:
(1) uniformly mixing nano conductive particles, a dispersing agent, a coupling agent, water, a catalyst and an organic solvent to obtain the conductive coating;
(2) and (2) coating the conductive coating prepared in the step (1) on the surface of the substrate subjected to plasma treatment, and drying to obtain the conductive coating.
According to the preparation method of the conductive coating, a plasma treatment technology is utilized to introduce specific reactive groups (such as carboxyl, amino and the like) on the surface of a substrate, a silane coupling agent which can be chemically reacted with the introduced groups is selected according to the types of the introduced groups, and the pattern layer is more firmly fixed on the surface of the substrate through chemical bonds. Meanwhile, a specific catalyst is added to accelerate the reaction speed of the Y group, so that the conductive layer can be quickly and efficiently adhered to the surface of the substrate in the coating process.
Preferably, the conductive coating in step (1) comprises the following components in parts by weight: 5-30 parts of nano conductive particles, 5-30 parts of a dispersing agent, 2-5 parts of a silane coupling agent, 2-5 parts of water, 2-5 parts of a catalyst and 100 parts of an organic solvent;
the nano conductive particles are carbon nano tubes or graphene, the dispersing agent is a high-molecular dispersing agent, the silane coupling agent is an aminosilane coupling agent or an epoxy silane coupling agent, the catalyst is at least one of a Katt condensing agent, 2- (7-azabenzotriazole) -N, N, N '-tetramethylurea hexafluorophosphate, 4-dimethylaminopyridine, 1-hydroxybenzotriazole, triethylamine, triphenylphosphine, dimethylaniline, tetrabutylammonium bromide and dimethylimidazole, and the organic solvent is N, N' -dimethylformamide or N, N-dimethylacetamide.
The selected nano conductive particles are carbon nano particles containing hydroxyl groups, and X groups of the selected silane coupling agent can react with the hydroxyl groups to generate silicon-oxygen bonds, so that the nano particles are fixed. The catalyst selected by the invention can accelerate the reaction rate of the Y group in the silane coupling agent and the specific group on the surface of the substrate after plasma treatment, so that the coating can be quickly and efficiently adhered to the surface of the substrate.
Preferably, the aminosilane coupling agent is at least one of gamma-aminopropyltriethoxysilane, gamma-aminopropyltrimethoxysilane and N- (beta-aminoethyl) -gamma-aminopropyltriethoxysilane, and the epoxy silane coupling agent is gamma- (2, 3-glycidoxy) propyltrimethoxysilane or gamma- (2, 3-glycidoxy) propyltriethoxysilane; the dispersing agent is at least one of thermoplastic polyurethane, polyvinylpyrrolidone, polyacrylate, polyester and polyamide. The dispersing agent selected by the invention is a macromolecular dispersing agent, and two ends of the silane coupling agent selected by the invention respectively act with the nano-particles and the macromolecules to establish a relationship between the nano-particles and the macromolecules, so that the aggregation and sedimentation of the carbon nano-particles are better inhibited.
Preferably, in the step (1), the silane coupling agent is an aminosilane coupling agent, and the catalyst is at least one of a captan condensing agent, 2- (7-azabenzotriazole) -N, N, N' -tetramethylurea hexafluorophosphate, 4-dimethylaminopyridine and 1-hydroxybenzotriazole; in the step (2), the parameters of the plasma treatment are as follows: the gas source is carbon dioxide, the vacuum degree is 30-200 Pa, the reaction power is 200-300W, and the reaction time is 30-120 s; the drying temperature in the step (2) is 70-100 ℃, and the drying time is 5-20 min. The siloxy groups of the aminosilane coupling agent react with the hydroxyl groups on the conductive filler, while the amino groups on the other end react with the carboxyl groups on the substrate surface and are accelerated by the catalyst, thereby chemically bonding the conductive filler to the substrate surface.
Preferably, in the step (1), the silane coupling agent is an epoxy silane coupling agent, and the catalyst is at least one of triethylamine, triphenylphosphine, dimethylaniline and tetrabutylammonium bromide; in the step (2), the parameters of the plasma treatment are as follows: the gas source is carbon dioxide, the vacuum degree is 30-200 Pa, the reaction power is 200-300W, and the reaction time is 30-120 s; the drying temperature in the step (2) is 70-100 ℃, and the drying time is 5-20 min. The siloxy groups of the epoxy silane coupling agent react with the hydroxyl groups on the conductive filler, while the epoxy groups at the other end react with the carboxyl groups on the substrate surface and are accelerated by the catalyst, thereby chemically bonding the conductive filler to the substrate surface.
Preferably, in the step (1), the silane coupling agent is an epoxy silane coupling agent, and the catalyst is dimethyl imidazole; in the step (2), the parameters of the plasma treatment are as follows: the gas source is nitrogen, the vacuum degree is 30-200 Pa, the reaction power is 200-300W, and the reaction time is 30-120 s; the drying temperature in the step (2) is 70-100 ℃, and the drying time is 5-20 min. The siloxy groups of the epoxy silane coupling agent react with the hydroxyl groups on the conductive filler, while the epoxy groups on the other end react with the amino groups on the substrate surface and are accelerated by the catalyst, thereby chemically linking the conductive filler to the substrate surface.
The inventors have found through extensive research that under the plasma treatment condition, the carboxyl content of the surface is relatively high, and the coating adhesion can be better improved.
Preferably, in the step (2), the substrate is a polymer material or an inorganic material, and the coating manner is at least one of spray coating, drop coating and spin coating.
Further preferably, in the step (2), the substrate is at least one of polydimethylsiloxane, polyurethane, polyimide, polyethylene terephthalate, glass and ceramic.
In addition, the invention also provides the conductive coating prepared by the preparation method of the conductive coating.
Furthermore, the invention also provides the application of the conductive coating in printed circuits or electromagnetic shielding.
Compared with the prior art, the invention has the beneficial effects that: the conductive coating disclosed by the invention is simple in component and simple in coating preparation process, the adhesion of the obtained conductive coating and a substrate is obviously improved, and the conductivity of the conductive layer is not damaged. In addition, the lifting device has good lifting effect on various different types of substrates.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.
Examples 1-5 are provided herein, with specific examples 1-5 having components and parts by weight selected as shown in tables 1 and 2:
TABLE 1 selection of parts by weight of specific examples 1-5
| Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | |
| Nano conductive particles | 5 | 30 | 10 | 20 | 15 |
| Dispersing agent | 5 | 30 | 10 | 25 | 18 |
| Coupling agent | 2 | 5 | 3 | 5 | 4 |
| Water (W) | 2 | 5 | 3 | 5 | 4 |
| Catalyst and process for preparing same | 2 | 5 | 2 | 4 | 3 |
| Organic solvent | 100 | 100 | 100 | 100 | 100 |
TABLE 2 selection of Components for specific examples 1-5
Example 1
The method for preparing the conductive coating according to the example, after weighing the components according to tables 1 and 2, includes the following steps:
(1) uniformly mixing nano conductive particles, a dispersing agent, a coupling agent, water, a catalyst and an organic solvent to obtain the conductive coating;
(2) coating the conductive coating prepared in the step (1) on the surface of a substrate subjected to plasma treatment, wherein the parameters of the plasma treatment are as follows: the gas source is carbon dioxide, the vacuum degree is 30Pa, the reaction power is 200W, the reaction time is 120s, the drying temperature is 75 ℃, the drying time is 5min, and the conductive coating is obtained after drying.
Example 2
The method for preparing the conductive coating according to the example, after weighing the components according to tables 1 and 2, includes the following steps:
(1) uniformly mixing nano conductive particles, a dispersing agent, a coupling agent, water, a catalyst and an organic solvent to obtain the conductive coating;
(2) coating the conductive coating prepared in the step (1) on the surface of a substrate subjected to plasma treatment, wherein the parameters of the plasma treatment are as follows: the gas source is carbon dioxide, the vacuum degree is 200Pa, the reaction power is 300W, the reaction time is 30s, the drying temperature is 85 ℃, the drying time is 10min, and the conductive coating is obtained after drying.
Example 3
The method for preparing the conductive coating according to the example, after weighing the components according to tables 1 and 2, includes the following steps:
(1) uniformly mixing nano conductive particles, a dispersing agent, a coupling agent, water, a catalyst and an organic solvent to obtain the conductive coating;
(2) coating the conductive coating prepared in the step (1) on the surface of a substrate subjected to plasma treatment, wherein the parameters of the plasma treatment are as follows: the gas source is nitrogen, the vacuum degree is 60Pa, the reaction power is 200W, the reaction time is 60s, the drying temperature is 80 ℃, the drying time is 5min, and the conductive coating is obtained after drying.
The conductive coatings described in examples 4 and 5 were prepared exactly as in example 2.
Meanwhile, the application is provided with comparative examples, and the specific comparative examples are as follows:
comparative example 1 was not treated with a coupling agent, and the remaining components, parts by weight and preparation method were completely the same as in example 1;
comparative example 2 was treated with vinyltrimethoxysilane, and the remaining components, parts by weight and preparation method were completely the same as in example 1;
comparative example 3 no catalyst treatment was used, and the remaining components, parts by weight and preparation method were exactly the same as in example 1;
comparative example 4 was treated with dicyclohexylcarbodiimide catalyst, and the remaining components, parts by weight and preparation method were completely the same as in example 1;
the substrate of comparative example 5 was not subjected to plasma treatment, and the remaining components, parts by weight and preparation method were exactly the same as those of example 1.
Comparative example 6 adopts oxygen plasma treatment, and the rest components, parts by weight and preparation method are completely the same as example 1;
test examples Performance test
Test standards and procedures: the adhesion rating was tested according to the national standard GB/T9286-1998.
The resistance change rate after the tape peeling test is measured by testing the change of the sheet resistance of the conductive coating on the PDMS before and after the tape peeling, and the sheet resistance test is measured by a four-probe method, wherein the resistance change rate is 100% of the sheet resistance after the peeling/the sheet resistance before the peeling.
The resistance change rate after the cyclic compression test is tested by testing the change of the sheet resistance of the conductive coating on the PDMS after the conductive coating is subjected to pressure of 10MPa and is cycled for 10 times, the sheet resistance test is tested by a four-probe method, and the resistance change rate is 100% of the sheet resistance after the compression cycle/before the compression cycle.
After the cyclic bending test, the resistance change rate is tested by testing the change of the sheet resistance of the conductive coating on PDMS after the conductive coating undergoes a bending radius of 10mm and is cycled for 1000 times, and the sheet resistance test is tested by a four-probe method, wherein the resistance change rate is 100% of the sheet resistance after the bending cycle/before the bending cycle.
The performance test results are shown in table 3:
table 3 results of performance test of examples and comparative examples
As can be seen from table 3, for examples 1-5, the conductive coating had excellent adhesion to the substrate surface due to the successful chemical bonding of the conductive filler to the substrate surface, and almost no conductive coating was adhered by the tape in the adhesion rating test, which was rated 0. In contrast, in comparative examples 1 to 6, the conductive coating and the substrate surface were only physically bonded due to the absence of the key component, and the adhesive force was weak, and almost all was adhered by the tape in the adhesion rating test, which was rated 5. The conductive coatings were tested for sheet resistance after the tape stripping test with little change in examples 1-5, whereas comparative examples 1-6 were no longer conductive due to the coating being mostly tacky. After the cyclic compression test, the conductive coatings of examples 1 to 6 were not peeled off, and the sheet resistance was hardly changed. In comparative examples 1 to 5, the conductive layer was peeled off, so that the sheet resistance was largely changed. After the cyclic bending test, the conductive coatings of examples 1 to 5 were not peeled off, and the sheet resistance was hardly changed. In comparative examples 1 to 6, the conductive layer was peeled off, so that the sheet resistance was largely changed.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. A preparation method of a conductive coating is characterized by comprising the following steps:
(1) uniformly mixing nano conductive particles, a dispersing agent, a coupling agent, water, a catalyst and an organic solvent to obtain a conductive coating;
(2) coating the conductive coating prepared in the step (1) on the surface of the substrate subjected to plasma treatment, and drying to obtain the conductive coating;
the conductive coating in the step (1) comprises the following components in parts by weight: 5-30 parts of nano conductive particles, 5-30 parts of a dispersing agent, 2-5 parts of a silane coupling agent, 2-5 parts of water, 2-5 parts of a catalyst and 100 parts of an organic solvent; the nano conductive particles are carbon nano tubes or graphene, the dispersing agent is a high-molecular dispersing agent, the dispersing agent is at least one of thermoplastic polyurethane, polyvinylpyrrolidone, polyacrylate, polyester and polyamide, the silane coupling agent is an aminosilane coupling agent or an epoxy silane coupling agent, the catalyst is at least one of a Kate condensing agent, 2- (7-azabenzotriazole) -N, N, N ', N ' -tetramethylurea hexafluorophosphate, 4-dimethylaminopyridine, 1-hydroxybenzotriazole, triethylamine, triphenylphosphine, dimethylaniline, tetrabutylammonium bromide and dimethylimidazole, and the organic solvent is N, N ' -dimethylformamide or N, N-dimethylacetamide.
2. The method of claim 1, wherein the aminosilane coupling agent is at least one of γ -aminopropyltriethoxysilane, γ -aminopropyltrimethoxysilane, and N- (β -aminoethyl) - γ -aminopropyltriethoxysilane, and the epoxysilane coupling agent is γ - (2, 3-glycidoxy) propyltrimethoxysilane or γ - (2, 3-glycidoxy) propyltriethoxysilane.
3. The method for preparing the conductive coating according to claim 1, wherein in the step (1), the silane coupling agent is an aminosilane coupling agent, and the catalyst is at least one of a Kate condensing agent, 2- (7-azabenzotriazole) -N, N, N ', N' -tetramethylurea hexafluorophosphate, 4-dimethylaminopyridine and 1-hydroxybenzotriazole; in the step (2), the parameters of the plasma treatment are as follows: the gas source is carbon dioxide, the vacuum degree is 30-200 Pa, the reaction power is 200-; the drying temperature in the step (2) is 70-100 ℃, and the drying time is 5-20 min.
4. The method for preparing the conductive coating according to claim 1, wherein in the step (1), the silane coupling agent is an epoxy silane coupling agent, and the catalyst is at least one of triethylamine, triphenylphosphine, dimethylaniline and tetrabutylammonium bromide; in the step (2), the parameters of the plasma treatment are as follows: the gas source is carbon dioxide, the vacuum degree is 30-200 Pa, the reaction power is 200-; the drying temperature in the step (2) is 70-100 ℃, and the drying time is 5-20 min.
5. The method for preparing the conductive coating according to claim 1, wherein in the step (1), the silane coupling agent is an epoxy silane coupling agent, and the catalyst is dimethylimidazole; in the step (2), the parameters of the plasma treatment are as follows: the gas source is nitrogen, the vacuum degree is 30-200 Pa, the reaction power is 200-; the drying temperature in the step (2) is 70-100 ℃, and the drying time is 5-20 min.
6. The method for preparing the conductive coating according to claim 1, wherein in the step (2), the substrate is made of a polymer material or an inorganic material, and the coating manner is at least one of spray coating, drop coating and spin coating.
7. An electrically conductive coating produced by the method for producing an electrically conductive coating according to any one of claims 1 to 6.
8. Use of the conductive coating of claim 7 in printed wiring or electromagnetic shielding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642929.6A CN112812611B (en) | 2020-12-30 | 2020-12-30 | Preparation method of conductive coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011642929.6A CN112812611B (en) | 2020-12-30 | 2020-12-30 | Preparation method of conductive coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112812611A CN112812611A (en) | 2021-05-18 |
| CN112812611B true CN112812611B (en) | 2022-04-15 |
Family
ID=75856515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011642929.6A Active CN112812611B (en) | 2020-12-30 | 2020-12-30 | Preparation method of conductive coating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112812611B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115746365B (en) * | 2022-11-17 | 2023-08-01 | 深圳市睿华涂布科技有限公司 | Direct-pressure grid-shaped release film and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102445846A (en) * | 2010-09-30 | 2012-05-09 | 太阳控股株式会社 | Photosensitive conductive paste |
| CN107058981A (en) * | 2017-01-23 | 2017-08-18 | 无锡荣坚五金工具有限公司 | A kind of low adhesion, the preparation method of anti-corrosion coating |
| CN107760164A (en) * | 2017-11-07 | 2018-03-06 | 杭州五源科技实业有限公司 | Graphene conductive powdery paints and its preparation and application before woodwork application |
| CN108929453A (en) * | 2018-06-28 | 2018-12-04 | 浙江清华柔性电子技术研究院 | The preparation method of antistatic silicone rubber |
| CN110484097A (en) * | 2019-09-23 | 2019-11-22 | 西南交通大学 | A kind of composite electromagnetic screen conductive coating and preparation method thereof and application method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107254207B (en) * | 2017-06-19 | 2019-07-05 | 北京航空航天大学 | A kind of ultraviolet light solidification super-hydrophobic transparent wear-resistant coating and preparation method thereof |
| CN107151524A (en) * | 2017-07-12 | 2017-09-12 | 合肥展游软件开发有限公司 | A kind of preparation method of electrically-conducting paint for communication apparatus |
-
2020
- 2020-12-30 CN CN202011642929.6A patent/CN112812611B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102445846A (en) * | 2010-09-30 | 2012-05-09 | 太阳控股株式会社 | Photosensitive conductive paste |
| CN107058981A (en) * | 2017-01-23 | 2017-08-18 | 无锡荣坚五金工具有限公司 | A kind of low adhesion, the preparation method of anti-corrosion coating |
| CN107760164A (en) * | 2017-11-07 | 2018-03-06 | 杭州五源科技实业有限公司 | Graphene conductive powdery paints and its preparation and application before woodwork application |
| CN108929453A (en) * | 2018-06-28 | 2018-12-04 | 浙江清华柔性电子技术研究院 | The preparation method of antistatic silicone rubber |
| CN110484097A (en) * | 2019-09-23 | 2019-11-22 | 西南交通大学 | A kind of composite electromagnetic screen conductive coating and preparation method thereof and application method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112812611A (en) | 2021-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108189520B (en) | Manufacturing method of modified polytetrafluoroethylene copper-clad plate | |
| CN110713742B (en) | Preparation and application method of intelligent conductive paint based on liquid metal-polymer | |
| CN108395558B (en) | Preparation method of transparent conductive film of high-transmittance nano silver wire | |
| CN112812611B (en) | Preparation method of conductive coating | |
| CN103225210B (en) | Surface grafting modified aramid fiber and preparation method thereof | |
| CN115368607B (en) | Polyether sulfone-based composite dielectric film material and preparation method thereof | |
| CN114410046A (en) | Preparation method of hydrocarbon resin base plate material for high-frequency copper-clad plate | |
| CN111118896A (en) | Modified aramid fiber and modified aramid fiber composite material | |
| CN111876116A (en) | Polyimide modified epoxy resin composite conductive adhesive and preparation method thereof | |
| CN114103305B (en) | high-Tg high-heat-conductivity metal-based copper-clad plate and processing technology thereof | |
| CN110556216B (en) | Preparation method of conductive adhesive film | |
| CN109232957A (en) | A kind of PEDOT-PET/ graphene quantum dot composite construction conductive film and preparation method thereof | |
| CN114103306B (en) | Halogen-free lead-free high-Tg copper-clad plate and processing technology thereof | |
| CN111440590B (en) | Polyamide acid adhesive composition for chip packaging, and preparation method and application thereof | |
| CN115181340A (en) | Electromagnetic shielding natural rubber for effectively constructing three-dimensional conductive network structure and preparation thereof | |
| CN110580986B (en) | Silver nanowire conductive film and preparation method thereof | |
| CN1645986A (en) | Production for printing circuit basilar plate | |
| CN115926636B (en) | High-temperature-resistant UV adhesive and preparation method thereof | |
| CN117165034B (en) | Epoxy resin for high-frequency high-speed copper-clad plate and preparation method thereof | |
| CN113754823B (en) | Zirconium dioxide-based waterborne conductive acrylic emulsion and preparation method thereof | |
| CN114656865B (en) | Ultraviolet-curing fluorocarbon coating for photovoltaic back plate | |
| CN114702783B (en) | Transparent glass fiber mobile phone cover plate and preparation method thereof | |
| CN116528487B (en) | High-strength aluminum-based PCB and preparation method thereof | |
| CN111320752B (en) | Polyamide acid resin for chip packaging, and preparation method and application thereof | |
| CN114621451A (en) | Pure polyester resin modified epoxy resin and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No. 388, Lianyun Road, Huangpu District, Guangzhou, Guangdong 510530 Applicant after: Huangpu Material Research Institute Dawan District Guangdong Hong Kong and Macao Address before: No. 388, Lianyun Road, Huangpu District, Guangzhou, Guangdong 510530 Applicant before: Huangpu Institute of advanced materials, Changchun Institute of Applied Chemistry, Chinese Academy of Sciences |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220824 Address after: 510700 No. 388, Lianyun Road, Huangpu District, Guangzhou, Guangdong Patentee after: Huangpu Material Research Institute Dawan District Guangdong Hong Kong and Macao Patentee after: Zhang Tong Address before: No. 388, Lianyun Road, Huangpu District, Guangzhou, Guangdong 510530 Patentee before: Huangpu Material Research Institute Dawan District Guangdong Hong Kong and Macao |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221230 Address after: Room 403, Block H, Self numbered Creative Building, No. 2, Tengfei Second Street, Huangpu District (Zhongxin Knowledge City), Guangzhou, Guangdong, 510000 (office only) Patentee after: Guangzhou Puhui Technology Co.,Ltd. Address before: 510700 No. 388, Lianyun Road, Huangpu District, Guangzhou, Guangdong Patentee before: Huangpu Material Research Institute Dawan District Guangdong Hong Kong and Macao Patentee before: Zhang Tong |